IEC - International Electrotechnical Commission - IEC TR 60068-3-12:2007
Environmental testing - Part 3-12: Supporting documentation and guidance - Method to evaluate a possible lead-free solder reflow temperature profile
revised
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| Organization: | IEC - International Electrotechnical Commission |
| Publication Date: | 12 March 2007 |
| Status: | revised |
| Page Count: | 16 |
| ICS Code (Environmental testing): | 19.040 |
abstract:
Presents two approaches to establish a possible temperature profile for a lead-free reflow soldering process using SnAgCu solder paste. The presented process window covers a great variety of... View More
Document History
October 14, 2022
Environmental testing - Part 3-12: Supporting documentation and guidance - Method to evaluate a possible lead-free solder reflow temperature profile
IEC TR 60068-3-12:2022(E) which is a Technical Report, describes the creation of temperature-time profiles (in specific envelope profiles) for reflow soldering of electronic assemblies, considering...
October 17, 2014
Environmental testing - Part 3-12: Supporting documentation and guidance - Method to evaluate a possible lead-free solder reflow temperature profile
IEC TR 60068-3-12:2014 presents two approaches for establishing a possible temperature profile for a lead-free reflow soldering process using SnAgCu solder paste. This process covers a great variety...
IEC TR 60068-3-12:2007
March 12, 2007
Environmental testing - Part 3-12: Supporting documentation and guidance - Method to evaluate a possible lead-free solder reflow temperature profile
Presents two approaches to establish a possible temperature profile for a lead-free reflow soldering process using SnAgCu solder paste. The presented process window covers a great variety of...