IEC - International Electrotechnical Commission - IEC 60191-6:1990/AMD1:1999
Amendment 1 - Mechanical standardization of semiconductor devices - Part 6: General rules for the preparation of outline drawings of surface mounted semiconductor device packages
revised
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| Organization: | IEC - International Electrotechnical Commission |
| Publication Date: | 22 December 1999 |
| Status: | revised |
| Page Count: | 20 |
| ICS Code (Semiconductor devices in general): | 31.080.01 |
Document History
November 26, 2009
Mechanical standardization of semiconductor devices - Part 6: General rules for the preparation of outline drawings of surface mounted semiconductor device packages
IEC 60191-6:2009 gives general rules for the preparation of outline drawings of surface-mounted semiconductor devices. It supplements IEC 60191-1 and IEC 60191-3. It covers all surface-mounted...
September 29, 2004
Mechanical standardization of semiconductor devices - Part 6: General rules for the preparation of outline drawings of surface mounted semiconductor device packages
Gives general rules for the preparation of outlines drawings of surface-mounted semiconductor devices. It supplements IEC 60191-1 and 60191-3. It covers all surface-mounted discrete semiconductors...
IEC 60191-6:1990/AMD1:1999
December 22, 1999
Amendment 1 - Mechanical standardization of semiconductor devices - Part 6: General rules for the preparation of outline drawings of surface mounted semiconductor device packages
A description is not available for this item.
December 21, 1990
Mechanical standardization of semiconductor devices. Part 6: General rules for the preparation of outline drawings of surface mounted semiconductor device packages
Gives general rules for the preparation of outline drawings of surface-mounted semiconductor devices. Supplements IEC 60191-1 and 60191-3. Covers all surface-mounted devices - discrete semiconductors...