IEC - International Electrotechnical Commission - IEC PAS 60191-6-19:2008
Mechanical standardization of semiconductor devices - Part 6-19: Measurement methods of package warpage at elevated temperature and the maximum permissible warpage
replaced
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| Organization: | IEC - International Electrotechnical Commission |
| Publication Date: | 22 January 2008 |
| Status: | replaced |
| Page Count: | 22 |
| ICS Code (Semiconductor devices in general): | 31.080.01 |
abstract:
This PAS stipulates the package warpage criteria and the package warpage measurement methods at elevated temperature for BGA, FBGA, and FLGA.
Document History
IEC PAS 60191-6-19:2008
January 22, 2008
Mechanical standardization of semiconductor devices - Part 6-19: Measurement methods of package warpage at elevated temperature and the maximum permissible warpage
This PAS stipulates the package warpage criteria and the package warpage measurement methods at elevated temperature for BGA, FBGA, and FLGA.