IEC - International Electrotechnical Commission - IEC PAS 60191-6-18:2008
Mechanical standardization of semiconductor devices - Part 6-18: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for ball grid array (BGA)
replaced
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| Organization: | IEC - International Electrotechnical Commission |
| Publication Date: | 22 January 2008 |
| Status: | replaced |
| Page Count: | 19 |
| ICS Code (Semiconductor devices in general): | 31.080.01 |
abstract:
This PAS provides common outline drawings and dimensions for all types of structures and composed materials of ball grid array (hereinafter called BGA), whose terminal pitch is one millimetre or... View More
Document History
IEC PAS 60191-6-18:2008
January 22, 2008
Mechanical standardization of semiconductor devices - Part 6-18: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for ball grid array (BGA)
This PAS provides common outline drawings and dimensions for all types of structures and composed materials of ball grid array (hereinafter called BGA), whose terminal pitch is one millimetre or...