IEC - International Electrotechnical Commission - IEC PAS 62170:2000
Bond wire modeling standard
withdrawn
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| Organization: | IEC - International Electrotechnical Commission |
| Publication Date: | 24 August 2000 |
| Status: | withdrawn |
| Page Count: | 12 |
| ICS Code (Semiconductor devices in general): | 31.080.01 |
abstract:
Standardizes the first order modeling of bond wires and the way bond wires are modeled in three dimensional electromagnetic field solvers.
Describes the modeling of a bond wire from an... View More
Document History
IEC PAS 62170:2000
August 24, 2000
Bond wire modeling standard
Standardizes the first order modeling of bond wires and the way bond wires are modeled in three dimensional electromagnetic field solvers. Describes the modeling of a bond wire from an integrated...