IEC - International Electrotechnical Commission - IEC PAS 62184:2000

Lead integrity test method

replaced
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Organization: IEC - International Electrotechnical Commission
Publication Date: 22 August 2000
Status: replaced
Page Count: 16
ICS Code (Semiconductor devices in general): 31.080.01
abstract:

Provides various tests for determining the integrity lead/package interface and the lead itself when the lead(s) are bent due to faulty board assembly followed by rework of the part for... View More

Document History

IEC PAS 62184:2000
August 22, 2000
Lead integrity test method
Provides various tests for determining the integrity lead/package interface and the lead itself when the lead(s) are bent due to faulty board assembly followed by rework of the part for reassembly.
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