IEC - International Electrotechnical Commission - IEC PAS 62137-3:2008
Electronics assembly technology - Selection guidance of environmental and endurance test methods for solder joints
replaced
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| Organization: | IEC - International Electrotechnical Commission |
| Publication Date: | 13 November 2008 |
| Status: | replaced |
| Page Count: | 41 |
| ICS Code (Electronic component assemblies): | 31.190 |
abstract:
IEC/PAS 62137-3:2008(E) describes the selection of an appropriate test method for reliability test of solder joints for various shapes and types of surface mount devices (SMD) and leaded devices,... View More
Document History
IEC PAS 62137-3:2008
November 13, 2008
Electronics assembly technology - Selection guidance of environmental and endurance test methods for solder joints
IEC/PAS 62137-3:2008(E) describes the selection of an appropriate test method for reliability test of solder joints for various shapes and types of surface mount devices (SMD) and leaded devices,...