IEC - International Electrotechnical Commission - IEC PAS 62203:2000
Guide for the standard probe pad sizes and layouts for wafer-level electrical testing
withdrawn
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| Organization: | IEC - International Electrotechnical Commission |
| Publication Date: | 28 November 2000 |
| Status: | withdrawn |
| Page Count: | 6 |
| ICS Code (Semiconductor devices in general): | 31.080.01 |
abstract:
Applies to double- and single-column arrays of metal probe pads, on a semiconductor wafer or chip, that are electrically connected to one or more test structures.
Document History
IEC PAS 62203:2000
November 28, 2000
Guide for the standard probe pad sizes and layouts for wafer-level electrical testing
Applies to double- and single-column arrays of metal probe pads, on a semiconductor wafer or chip, that are electrically connected to one or more test structures.