IEC - International Electrotechnical Commission - IEC 60749-4:2002
Semiconductor devices - Mechanical and climatic test methods - Part 4: Damp heat, steady state, highly accelerated stress test (HAST)
revised
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| Organization: | IEC - International Electrotechnical Commission |
| Publication Date: | 12 April 2002 |
| Status: | revised |
| Page Count: | 15 |
| ICS Code (Semiconductor devices in general): | 31.080.01 |
abstract:
Provides a highly accelerated temperature and humidity stress test (HAST) for the purpose of evaluating the reliability of non-hermetic packaged semiconductor devices in humid... View More
Document History
March 3, 2017
Semiconductor devices - Mechanical and climatic test methods - Part 4: Damp heat, steady state, highly accelerated stress test (HAST)
IEC 60749-4:2017 provides a highly accelerated temperature and humidity stress test (HAST) for the purpose of evaluating the reliability of non-hermetic packaged semiconductor devices in humid...
August 12, 2003
Corrigendum 1 - Semiconductor devices - Mechanical and climatic test methods - Part 4: Damp heat, steady state, highly accelerated stress test (HAST)
Modification of the validity date: now put at 2007.
IEC 60749-4:2002
April 12, 2002
Semiconductor devices - Mechanical and climatic test methods - Part 4: Damp heat, steady state, highly accelerated stress test (HAST)
Provides a highly accelerated temperature and humidity stress test (HAST) for the purpose of evaluating the reliability of non-hermetic packaged semiconductor devices in humid environments. The...