IEC - International Electrotechnical Commission - IEC 60749-3:2002
Semiconductor devices - Mechanical and climatic test methods - Part 3: External visual inspection
revised
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| Organization: | IEC - International Electrotechnical Commission |
| Publication Date: | 9 April 2002 |
| Status: | revised |
| Page Count: | 7 |
| ICS Code (Semiconductor devices in general): | 31.080.01 |
abstract:
Aims at verifying that the materials, design, construction, markings, and workmanship of a semiconductor device are in accordance with the applicable procurement document. External visual... View More
Document History
March 3, 2017
Semiconductor devices - Mechanical and climatic test methods - Part 3: External visual examination
IEC 60749-3:2017 is to verify that the materials, design, construction, markings, and workmanship of a semiconductor device are in accordance with the applicable procurement document. External visual...
August 12, 2003
Corrigendum 1 - Semiconductor devices - Mechanical and climatic test methods - Part 3: External visual examination
Modification of the validity date: now put at 2007.
IEC 60749-3:2002
April 9, 2002
Semiconductor devices - Mechanical and climatic test methods - Part 3: External visual inspection
Aims at verifying that the materials, design, construction, markings, and workmanship of a semiconductor device are in accordance with the applicable procurement document. External visual inspection...