IEC - International Electrotechnical Commission - IEC 60749-34:2004
Semiconductor devices - Mechanical and climatic test methods - Part 34: Power cycling
revised
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| Organization: | IEC - International Electrotechnical Commission |
| Publication Date: | 10 March 2004 |
| Status: | revised |
| Page Count: | 8 |
| ICS Code (Semiconductor devices in general): | 31.080.01 |
abstract:
Used to determine the resistance of a semiconductor device to thermal and mechanical stresses due to cycling the power dissipation of the internal semiconductor die and internal connectors. This... View More
Document History
October 28, 2010
Semiconductor devices - Mechanical and climatic test methods - Part 34: Power cycling
IEC 60749-34:2010 describes a test method used to determine the resistance of a semiconductor device to thermal and mechanical stresses due to cycling the power dissipation of the internal...
IEC 60749-34:2004
March 10, 2004
Semiconductor devices - Mechanical and climatic test methods - Part 34: Power cycling
Used to determine the resistance of a semiconductor device to thermal and mechanical stresses due to cycling the power dissipation of the internal semiconductor die and internal connectors. This...