ASTM International - ASTM B490-92(2008)e1

Standard Practice for Micrometer Bend Test for Ductility of Electrodeposits

historical
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Organization: ASTM International
Publication Date: 1 April 2008
Status: historical
Page Count: 2
significance And Use:

This practice is useful as one method of controlling some electroplating solutions. It serves to indicate the presence of contamination or some other adverse condition.

Ductility... View More

scope:

1.1 This practice describes a procedure for measuring the ductility of electrodeposited foils.

1.2 This practice is suitable only for the evaluation of electrodeposits having low ductility.

1.3 The obtained ductility values must only be considered semi-quantitative because this test has a significant operator dependence.

1.4 This practice is best used for in-house process control where measurements are always made by the same operator. A change in ductility value can be used as an indication of possible changes in the electroplating solution.

1.5 The values stated in SI units are to be regarded as standard. No other units of measurement are included in this standard.

1.6 This standard does not purport to address the safety problems, if any, associated with its use. It is the responsibility of the user of this standard to establish appropriate safety and health practices and determine the applicability of regulatory limitations prior to use.

Document History

May 1, 2014
Standard Practice for Micrometer Bend Test for Ductility of Electrodeposits
1.1 This practice describes a procedure for measuring the ductility of electrodeposited foils.2 1.2 This practice is suitable only for the evaluation of electrodeposits having low ductility....
April 15, 2009
Standard Practice for Micrometer Bend Test for Ductility of Electrodeposits
1.1 This practice describes a procedure for measuring the ductility of electrodeposited foils. 1.2 This practice is suitable only for the evaluation of electrodeposits having low ductility. 1.3 The...
ASTM B490-92(2008)e1
April 1, 2008
Standard Practice for Micrometer Bend Test for Ductility of Electrodeposits
1.1 This practice describes a procedure for measuring the ductility of electrodeposited foils. 1.2 This practice is suitable only for the evaluation of electrodeposits having low ductility. 1.3 The...
October 1, 2003
Standard Practice for Micrometer Bend Test for Ductility of Electrodeposits
This practice is useful as one method of controlling some electroplating solutions. It serves to indicate the presence of contamination or some other adverse condition. Ductility measurements are of...
November 10, 1998
Standard Practice for Micrometer Bend Test for Ductility of Electrodeposits
1.1 This practice describes a procedure for measuring the ductility of electrodeposited foils. 1.2 This practice is suitable only for the evaluation of electrodeposits having low ductility. 1.3 The...
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