ASTM International - ASTM F584-06

Standard Practice for Visual Inspection of Semiconductor Lead-Bonding Wire

historical
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Organization: ASTM International
Publication Date: 1 January 2006
Status: historical
Page Count: 7
ICS Code (Wires): 29.060.10
scope:

1.1 This practice covers conditions for nondestructive visual inspection of the surface finish of spooled aluminum and gold wire used for making internal semiconductor device connections and hybrid microelectronic connections.

1.2 This practice specifies the recommended lighting, magnification, and specimen positioning for inspecting spooled wire under an optical microscope.

1.3 Photographs ( ) are included in as guides to aid the inspector in identifying particular surface conditions. These photographs are not intended as standards for specifying wire surface quality.

1.4 The values stated in SI units are to be regarded as the standard. The values given in parentheses are for information only.

This standard does not purport to address all of the safety concerns, if any, associated with its use. It is the responsibility of the user of this standard to establish appropriate safety and health practices and determine the aplicability of regulatory limitations prior to use.

Document History

January 1, 2006
Standard Practice for Visual Inspection of Semiconductor Lead-Bonding Wire (Withdrawn 2015)
Spooled wire viewed under bright direct lighting or in deep shadow generally exhibits a flawless appearance. Proper arrangement of the viewing angle and illumination, however, permits accurate...
ASTM F584-06
January 1, 2006
Standard Practice for Visual Inspection of Semiconductor Lead-Bonding Wire
1.1 This practice covers conditions for nondestructive visual inspection of the surface finish of spooled aluminum and gold wire used for making internal semiconductor device connections and hybrid...
May 1, 2005
Standard Practice for Visual Inspection of Semiconductor Lead-Bonding Wire
1.1 This practice covers conditions for nondestructive visual inspection of the surface finish of spooled aluminum and gold wire used for making internal semiconductor device connections and hybrid...
June 10, 1999
Standard Practice for Visual Inspection of Semiconductor Lead-Bonding Wire
1.1 This practice covers conditions for nondestructive visual inspection of the surface finish of spooled aluminum and gold wire used for making internal semiconductor device connections and hybrid...
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