ASTM International - ASTM F1211-89(1994)e1

Standard Specification for Semiconductor Device Passivation Opening Layouts

historical
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Organization: ASTM International
Publication Date: 1 January 2001
Status: historical
Page Count: 3
scope:

1.1 This specification covers standard semiconductor device passivation opening layouts for various tape automated bonding interconnection technologies.

1.2 This specification establishes the nominal passivation opening dimensions, nominal passivation, opening spacing, nominal corner passivation opening offset, minimum scribe guard and minimum die size for the most common input/ output counts within each technology.

1.3 This specification is extendable to other interconnection technologies if the passivation opening and spacing are adjusted in such a way that the progression is not modified.

1.4 The values stated in SI units are to be regarded as the standard. The values given in parentheses are for information only.

Document History

ASTM F1211-89(1994)e1
January 1, 2001
Standard Specification for Semiconductor Device Passivation Opening Layouts
1.1 This specification covers standard semiconductor device passivation opening layouts for various tape automated bonding interconnection technologies. 1.2 This specification establishes the...
January 1, 2001
Standard Specification for Semiconductor Device Passivation Opening Layouts (Withdrawn 2007)
1.1 This specification covers standard semiconductor device passivation opening layouts for various tape automated bonding interconnection technologies. 1.2 This specification establishes the...
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