IEC - International Electrotechnical Commission - IEC 62047-35:2019
Semiconductor devices - Micro-electromechanical devices - Part 35: Test method of electrical characteristics under bending deformation for flexible electro-mechanical devices
published
Buy Now
| Organization: | IEC - International Electrotechnical Commission |
| Publication Date: | 22 November 2019 |
| Status: | published |
| Page Count: | 41 |
| ICS Code (Other semiconductor devices): | 31.080.99 |
abstract:
IEC 62047-35:2019 specifies the test method of electrical characteristics under bending deformation for flexible electromechanical devices. These devices include passive micro components and/or... View More
Document History
IEC 62047-35:2019
November 22, 2019
Semiconductor devices - Micro-electromechanical devices - Part 35: Test method of electrical characteristics under bending deformation for flexible electro-mechanical devices
IEC 62047-35:2019 specifies the test method of electrical characteristics under bending deformation for flexible electromechanical devices. These devices include passive micro components and/or...