IEC - International Electrotechnical Commission - IEC 60068-2-69:2017+AMD1:2019 CSV
Environmental testing - Part 2-69: Tests - Test Te/Tc: Solderability testing of electronic components and printed boards by the wetting balance (force measurement) method
|Organization:||IEC - International Electrotechnical Commission|
|Publication Date:||19 June 2019|
|ICS Code (Environmental testing):||19.040|
|ICS Code (Electronic component assemblies):||31.190|
- integration of IEC 60068-2-54;
- inclusion of tests of printed boards;
- inclusion of new component types, and updating test parameters for the whole component list;
- inclusion of a new gauge R & R test protocol to ensure that the respective wetting balance equipment is correctly calibrated.
The contents of the corrigendum of January 2018 have been included in this copy. This consolidated version consists of the third edition (2017) and its amendment 1 (2019). Therefore, no need to order amendment in addition to this publication.