IEC - International Electrotechnical Commission - IEC 62047-36:2019

Semiconductor devices – Micro-electromechanical devices – Part 36: Environmental and dielectric withstand test methods for MEMS piezoelectric thin films

published
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Organization: IEC - International Electrotechnical Commission
Publication Date: 5 April 2019
Status: published
Page Count: 16
ICS Code (Other semiconductor devices): 31.080.99
ICS Code (Piezoelectric devices): 31.140
abstract:

IEC 62047-36:2019 (E) specifies test methods for evaluating the durability of MEMS piezoelectric thin film materials under the environmental stress of temperature and humidity and under electrical... View More

Document History

IEC 62047-36:2019
April 5, 2019
Semiconductor devices – Micro-electromechanical devices – Part 36: Environmental and dielectric withstand test methods for MEMS piezoelectric thin films
IEC 62047-36:2019 (E) specifies test methods for evaluating the durability of MEMS piezoelectric thin film materials under the environmental stress of temperature and humidity and under electrical...
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