IEC - International Electrotechnical Commission - IEC 62047-31:2019

Semiconductor devices - Micro-electromechanical devices - Part 31: Four-point bending test method for interfacial adhesion energy of layered MEMS materials

published
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Organization: IEC - International Electrotechnical Commission
Publication Date: 5 April 2019
Status: published
Page Count: 12
ICS Code (Other semiconductor devices): 31.080.99
abstract:

IEC 62047-31:2019 (E) specifies a four-point bending test method for measuring interfacial adhesion energy of the weakest interface in the layered micro-electromechanical systems (MEMS)... View More

Document History

IEC 62047-31:2019
April 5, 2019
Semiconductor devices - Micro-electromechanical devices - Part 31: Four-point bending test method for interfacial adhesion energy of layered MEMS materials
IEC 62047-31:2019 (E) specifies a four-point bending test method for measuring interfacial adhesion energy of the weakest interface in the layered micro-electromechanical systems (MEMS) based on the...
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