IEC - International Electrotechnical Commission - IEC 61188-6-4:2019

Printed boards and printed board assemblies - Design and use - Part 6-4: Land pattern design - Generic requirements for dimensional drawings of surface mounted components (SMD) from the viewpoint of land pattern design

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Organization: IEC - International Electrotechnical Commission
Publication Date: 2 May 2019
Status: published
Page Count: 81
ICS Code (Printed circuits and boards): 31.180
abstract:

IEC 61188-6-4:2019 specifies generic requirements for dimensional drawings of SMD from the viewpoint of land pattern design.
The purpose of this document is to prevent land pattern design... View More

Document History

IEC 61188-6-4:2019
May 2, 2019
Printed boards and printed board assemblies - Design and use - Part 6-4: Land pattern design - Generic requirements for dimensional drawings of surface mounted components (SMD) from the viewpoint of land pattern design
IEC 61188-6-4:2019 specifies generic requirements for dimensional drawings of SMD from the viewpoint of land pattern design. The purpose of this document is to prevent land pattern design issues...
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