IEC - International Electrotechnical Commission - IEC 61188-6-4:2019
Printed boards and printed board assemblies - Design and use - Part 6-4: Land pattern design - Generic requirements for dimensional drawings of surface mounted components (SMD) from the viewpoint of land pattern design
published
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| Organization: | IEC - International Electrotechnical Commission |
| Publication Date: | 2 May 2019 |
| Status: | published |
| Page Count: | 81 |
| ICS Code (Printed circuits and boards): | 31.180 |
abstract:
IEC 61188-6-4:2019 specifies generic requirements for dimensional drawings of SMD from the viewpoint of land pattern design.
The purpose of this document is to prevent land pattern design... View More
Document History
IEC 61188-6-4:2019
May 2, 2019
Printed boards and printed board assemblies - Design and use - Part 6-4: Land pattern design - Generic requirements for dimensional drawings of surface mounted components (SMD) from the viewpoint of land pattern design
IEC 61188-6-4:2019 specifies generic requirements for dimensional drawings of SMD from the viewpoint of land pattern design. The purpose of this document is to prevent land pattern design issues...