IEC - International Electrotechnical Commission - IEC TR 62878-2-7:2019
Device embedding assembly technology - Part 2-7: Guidelines - Accelerated stress testing of passive embedded circuit boards
published
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Organization: | IEC - International Electrotechnical Commission |
Publication Date: | 20 March 2019 |
Status: | published |
Page Count: | 12 |
ICS Code (Printed circuits and boards): | 31.180 |
ICS Code (Electronic component assemblies): | 31.190 |
abstract:
IEC TR 62878-2-7:2019 (E) describes the accelerated stress testing of passive embedded circuit boards. It can be used for screening finished boards, including multilayer and high-density... View More
Document History

IEC TR 62878-2-7:2019
March 20, 2019
Device embedding assembly technology - Part 2-7: Guidelines - Accelerated stress testing of passive embedded circuit boards
IEC TR 62878-2-7:2019 (E) describes the accelerated stress testing of passive embedded circuit boards. It can be used for screening finished boards, including multilayer and high-density...