IEC - International Electrotechnical Commission - IEC TR 62878-2-7:2019

Device embedding assembly technology - Part 2-7: Guidelines - Accelerated stress testing of passive embedded circuit boards

published
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Organization: IEC - International Electrotechnical Commission
Publication Date: 20 March 2019
Status: published
Page Count: 12
ICS Code (Printed circuits and boards): 31.180
ICS Code (Electronic component assemblies): 31.190
abstract:

IEC TR 62878-2-7:2019 (E) describes the accelerated stress testing of passive embedded circuit boards. It can be used for screening finished boards, including multilayer and high-density... View More

Document History

IEC TR 62878-2-7:2019
March 20, 2019
Device embedding assembly technology - Part 2-7: Guidelines - Accelerated stress testing of passive embedded circuit boards
IEC TR 62878-2-7:2019 (E) describes the accelerated stress testing of passive embedded circuit boards. It can be used for screening finished boards, including multilayer and high-density...
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