IEC - International Electrotechnical Commission - IEC 63011-3:2018

Integrated circuits - Three dimensional integrated circuits - Part 3: Model and measurement conditions of through-silicon via

published
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Organization: IEC - International Electrotechnical Commission
Publication Date: 28 November 2018
Status: published
Page Count: 28
ICS Code (Integrated circuits. Microelectronics): 31.200
abstract:

IEC 63011-3:2018 specifies a reference model of through-silicon via (TSV) electrical characteristics required for an interface design in three dimensional integrated circuit (3-D IC) to transmit... View More

Document History

IEC 63011-3:2018
November 28, 2018
Integrated circuits - Three dimensional integrated circuits - Part 3: Model and measurement conditions of through-silicon via
IEC 63011-3:2018 specifies a reference model of through-silicon via (TSV) electrical characteristics required for an interface design in three dimensional integrated circuit (3-D IC) to transmit and...
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