IEC - International Electrotechnical Commission - IEC 63011-2:2018

Integrated circuits - Three dimensional integrated circuits - Part 2: Alignment of stacked dies having fine pitch interconnect

published
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Organization: IEC - International Electrotechnical Commission
Publication Date: 28 November 2018
Status: published
Page Count: 28
ICS Code (Integrated circuits. Microelectronics): 31.200
abstract:

IEC 63011-2:2018 provides specifications of initial alignment and alignment maintenance between multiple stacked integrated circuits during the die bonding process. These specifications... View More

Document History

IEC 63011-2:2018
November 28, 2018
Integrated circuits - Three dimensional integrated circuits - Part 2: Alignment of stacked dies having fine pitch interconnect
IEC 63011-2:2018 provides specifications of initial alignment and alignment maintenance between multiple stacked integrated circuits during the die bonding process. These specifications define the...
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