IEC - International Electrotechnical Commission - IEC 63011-1:2018

Integrated circuits - Three dimensional integrated circuits - Part 1: Terminology

published
Buy Now
Organization: IEC - International Electrotechnical Commission
Publication Date: 28 November 2018
Status: published
Page Count: 24
ICS Code (Integrated circuits. Microelectronics): 31.200
abstract:

IEC 63011-1:2018 provides definitions pertaining to multichip integrated circuits, as vertically stacked dies using through-silicon vias (TSVs) or micro bumps. Terms and definitions related to the... View More

Document History

IEC 63011-1:2018
November 28, 2018
Integrated circuits - Three dimensional integrated circuits - Part 1: Terminology
IEC 63011-1:2018 provides definitions pertaining to multichip integrated circuits, as vertically stacked dies using through-silicon vias (TSVs) or micro bumps. Terms and definitions related to the...
Advertisement