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Thermal behavior of 1.55 µm (100) InAs/InP-based quantum dot lasers
2010 Edition, September 1, 2010 - IEEE - Institute of Electrical and Electronics Engineers, Inc.

Unlike InAs/GaAs quantum dot lasers, in 1.55µm InAs/InP devices, non-radiative recombination dominates device behavior from very low temperature (∼40K) and accounts for ∼94% of J th at room temperature with a T o of ∼72K from 220K-290K.

Temperature sensitivity of 1.55μm (100) InAs/InP-based quantum dot lasers
2010 Edition, May 1, 2010 - IEEE - Institute of Electrical and Electronics Engineers, Inc.

Semiconductor lasers with quantum dot (QD) based active regions have generated a huge amount of interest for applications including communications networks due to their anticipated superior physical properties due to three dimensional carrier confinement. For...

Room-temperature operation of InP-based InAs quantum dot laser
2004 Edition, Volume 16, July 1, 2004 - IEEE - Institute of Electrical and Electronics Engineers, Inc.

A ridge waveguide quantum dot (QD) laser with a stripe width of 15 μm was fabricated by using the seven-stacked InAs QD layers based on the InAlGaAs-InAlAs material system on InP [001] substrate. Room-temperature lasing operation was observed at 1...

Battery emulation considering thermal behavior
2011 Edition, September 1, 2011 - IEEE - Institute of Electrical and Electronics Engineers, Inc.

Electric propulsion becomes more and more important. Despite the fact that appropriate design tools tailored for the use with electric propulsion systems have to be developed, test benches for verification and hardware-in-the-loop simulations are needed. The battery system, as it is a very...

Thermal behavior of energy-efficient substation connectors
2016 Edition, June 1, 2016 - IEEE - Institute of Electrical and Electronics Engineers, Inc.

The contact resistance is the key variable that characterizes the stable performance and long-term service of an electrical connection. It is worth noting that the contact resistance in substation connectors can be several times that of the connector's resistance. To reduce connection...

Thermal behavior of distribution MV underground cables
2015 Edition, October 1, 2015 - AEIT - Italian Association of Electrical, Electronics, Automation, Information and Communication Technology

The present paper reports an experimental investigation on the thermal behavior of medium voltage underground cables laid in different types of soils and under different conditions of the ambient temperatures. The same paper shows as thermal degradation...

Thermal behavior of stack-based 3D ICs
2012 Edition, September 1, 2012 - IEEE - Institute of Electrical and Electronics Engineers, Inc.

The 3D IC technology has attracted much interest in the recent past as a mean to efficiently improve performance and miniaturization of electronic integrated circuits (IC) [1]. The integration is based on three dimensional (3D) die stacking, connected thanks to Through Silicon...

Thermal behavior of millimeter wavelength radio telescopes
1992 Edition, Volume 40, November 1, 1992 - IEEE - Institute of Electrical and Electronics Engineers, Inc.

The passive and/or active thermal control of significant structural components, for instance the backstructure and the feed legs, of the IRAM 15-m MM and 30-m MM wavelengths telescopes is discussed, and their thermal behavior is illustrated. The design of...

Thermal behavior of silicon carbide valve blocks
1961 Edition, Volume 80, August 1, 1961 - IEEE - Institute of Electrical and Electronics Engineers, Inc.

BONDED resistors made of semiconducting silicon carbide are widely used as valve blocks in lightning arresters. During severe duty they may fall thermally; it is the purpose of this article to develop analytical means of studying the thermal behavior during...

Predicting thermal behavior of interconnects
1999 Edition, January 1, 1999 - IEEE - Institute of Electrical and Electronics Engineers, Inc.

Previous investigations into thermal characteristics of embedded interconnects produced a wafer level technique for measurement of the thermal conductance, as well as a quasi-analytical model for predicting the results (Harmon, Gill and Sullivan, IRW 1998). In this...

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