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The next generation advanced MEMS& sensor packaging
2010 Edition, August 1, 2010 - IEEE - Institute of Electrical and Electronics Engineers, Inc.

The needs of ambient intelligence and miniaturization of electronics require extensive integration of semiconductor components such as MEMS and sensor. A MEMS/sensor package needs access to environment via open windows, which is a challenge for MEMS...

Encapsulation of the next generation advanced mems& sensor microsystems
2009 Edition, June 1, 2009 - IEEE - Institute of Electrical and Electronics Engineers, Inc.

The needs of ambient intelligence and miniaturization of electronics require extensive integration of semiconductor components such as MEMS and Sensor packages. A MEMS/sensor package needs access to environment, which is a challenge for MEMS...

An overview of Sandia National Laboratories' MEMS activities
2002 Edition, Volume 4, January 1, 2002 - IEEE - Institute of Electrical and Electronics Engineers, Inc.

Sandia National Laboratories has a substantial effort in development of microelectromechanical system (MEMS) technologies. This miniaturization capability can lead to low-cost, small, high-performance, "systems-on-a-chip", and have many applications ranging from advanced military...

Fan-Out Wafer Level Packaging - A Platform for Advanced Sensor Packaging
2019 Edition, May 1, 2019 - IEEE - Institute of Electrical and Electronics Engineers, Inc.

As mobile devices have become ubiquitous, also a large number of integrated sensors have entered our daily life. And with every new generation of mobiles the number of sensors increases, forming a growing market. Applications range from consumer to automotive and...

Next generation low stress plastic cavity package for sensor applications
2005 Edition, Volume 1, January 1, 2005 - IEEE - Institute of Electrical and Electronics Engineers, Inc.

MEMS inertial sensors are widely used in automotive safety systems. For example, accelerometers are used to detect crashes and gyroscopes are used to detect roll over events. One of the principal performance issues for these inertial sensors is the stability of...

Advanced surface micromachining process — A first step towards 3D MEMS
2017 Edition, January 1, 2017 - IEEE - Institute of Electrical and Electronics Engineers, Inc.

An advanced micromachining process has been developed to further push the performance limits of mass-produced inertial MEMS. The main achievement of the new platform technology is the usage of two independent silicon layers instead of one to form, e.g.,...

Development of a curriculum in nano and MEMS packaging and manufacturing for integrated systems to prepare next generation workforce
2004 Edition, Volume 2, January 1, 2004 - IEEE - Institute of Electrical and Electronics Engineers, Inc.

In this narrative author has described background of nano and MEMS and related Microsystems packaging and manufacturing revolution and thus evolved educational framework that is essential to create desired workforce. This technology and market driven revolution is at the stem...

High performance, low pin count packaging
2010 Edition, December 1, 2010 - IEEE - Institute of Electrical and Electronics Engineers, Inc.

Advanced packaging conferences, technical articles, and editorials frequently focus on high pin count devices such as microprocessors and graphic processor devices. The substantial challenges incumbent on high I/O package designs warrant this attention. However, an...

NDT of electronic packages, MEMs, sensors and materials in 3D to submicron resolution
2012 Edition, March 1, 2012 - IEEE - Institute of Electrical and Electronics Engineers, Inc.

There is an explosive growth in advanced 3D stacked packages, MEMs and sensors driven by a variety of applications in consumer electronics, aerospace, automotive and medicine. Accurate 3D analysis of their micro and nanostructures, porosity, defects are crucial to...

Thermal and Mechanical Analysis of Imaging Ball Grid Array Image Sensor Package
2019 Edition, December 1, 2019 - IEEE - Institute of Electrical and Electronics Engineers, Inc.

The growing demand of mobile phone, cameras and automotive pushes development of image sensor packaging in a trend of shrank form factor and more complex substrate design. To cater to the demand, the next generation image sensor...

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