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Qualification & reliability monitoring for small quantity ASIC populations
2009 Edition, April 1, 2009 - IEEE - Institute of Electrical and Electronics Engineers, Inc.

The authors present a discussion of the issues and an approach for qualification and reliability monitoring for small quantity ASICs used in long lifetime applications. Special attention is given to issues associated with sub-100 nm...

Individual thermal control and in situ optical monitoring for optoelectronic component burn-in, qualification and reliability testing
2015 Edition, November 1, 2015 - IEEE - Institute of Electrical and Electronics Engineers, Inc.

We present a system burning-in, qualifying and reliability photonic components individual thermal control each device under and performs during We present the application of this to VCSEL-based parallel fiber for aerospace applications.

IEC 62343-2:2014 - Dynamic modules - Part 2: Reliability qualification
July 28, 2014 - IEC - International Electrotechnical Commission

IEC 62343-2:2014 applies to dynamic modules and devices (DMs) which are commercially available. Examples are tuneable chromatic dispersion compensators, wavelength selective switches and optical channel monitors. Optical amplifiers are not included in this list, but are treated in IEC...

A Conversion Methodology for 200 mm Bulk Acoustic Wave Filter Production Line at Qorvo
Volume PP - IEEE - Institute of Electrical and Electronics Engineers, Inc.

There are many different methodologies for a line startup, process transfer, line conversion, and process upgrade in semiconductor IC manufacturing. In our startup of a 200 mm Bulk Acoustic Wave filter line converted from an existing 150 mm production line, a methodology of Copy, Scale,...

A High-Resolution Opto-Electrophysiology System With a Miniature Integrated Headstage
Volume PP - IEEE - Institute of Electrical and Electronics Engineers, Inc.

This work presents a fully integrated neural interface system in a small form factor (1.9 g), consisting of a μLED silicon optoelectrode (12 μLEDs and 32 recording sites in a 4-shank configuration), an Intan 32-channel recording chip, and a custom optical stimulation chip for...

Integrating Social Homophily and Network Lasso for Personalized Sentiment Classification
Volume PP - IEEE - Institute of Electrical and Electronics Engineers, Inc.

People often have different opinions toward the same topic, posing challenges for traditional sentiment analysis systems that rely on statistical models estimated with population-level data. Personalization is a solution to the problem, but it suffers from data scarcity issue, as the...

The copy exactly! Evolution story: High reliability fungible output based solely upon matching
2017 Edition, April 1, 2017 - IEEE - Institute of Electrical and Electronics Engineers, Inc.

The Copy Exactly! methods have evolved throughout a twenty-five year journey from initial process tool configuration and bill of materials matching to include factory infrastructure, human factors, process controls, and process indicators matching. These methods have delivered high...

Impact of sodium-rich contaminant on wafer level chip scale package (WLCSP) devices during reliability package stress test
2017 Edition, July 1, 2017 - IEEE - Institute of Electrical and Electronics Engineers, Inc.

Wafer level chip scale package (WLCSP) devices have seen significant growth and demand in the recent years largely driven by the mobile consumer market. WLCSP offers significantly reduced package footprint, high electrical and thermal performance, and lower cost of manufacturing. After the initial...

Prognostics-based product qualification
2009 Edition, March 1, 2009 - IEEE - Institute of Electrical and Electronics Engineers, Inc.

Qualification is the process of demonstrating that a product is capable of meeting or exceeding specified requirements. The specified requirements are expected to depend on the final product and its specific life cycle application conditions. In this paper, a prognostics-based...

Semiconductor failure modes and mitigation for critical systems embedded tutorial
2013 Edition, May 1, 2013 - IEEE - Institute of Electrical and Electronics Engineers, Inc.

The mounting issues of decreased yield and reliability from nanoscale integrated circuit (IC) processes require advanced approaches to the measurement and mitigation of device degradation and variance. Shrinking process geometries, with their corresponding reduction in device lifetimes, have...

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