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On the Failure of R&D Projects
2015 Edition, Volume 62, November 1, 2015 - IEEE - Institute of Electrical and Electronics Engineers, Inc.

There is an extensive literature on the success/failure of firm-funded R&D projects, but growing policy interest focuses on publicly funded R&D projects. We discuss this literature, which builds on a long stream...

Research on the Failure Mechanism of High-Power GaAs PCSS
2015 Edition, Volume 30, May 1, 2015 - IEEE - Institute of Electrical and Electronics Engineers, Inc.

This paper presents an experimental study on the failure mechanism of high-power Gallium Arsenide (GaAs)-based photoconductive semiconductor switches (PCSS). Two of the typical failure scenarios of high-power GaAs PCSS are discussed: 1) a...

Studies on the failure of components due to electrostatic discharge
2002 Edition, January 1, 2002 - IEEE - Institute of Electrical and Electronics Engineers, Inc.

Electrostatic discharge (ESD) is a major cause of failure of semiconductor components. With the increasing complexity of devices, and higher component densities, device geometries have been shrinking and susceptibility to ESD damage has increased in the...

An analysis case on the failure of BGA solder joints
2017 Edition, August 1, 2017 - IEEE - Institute of Electrical and Electronics Engineers, Inc.

In this paper, a failure analysis on ball grid array (BGA) solder joints is revealed with the aid of scanning acoustic microscope (SAM), optical microscope (OM), scanning electron microscope (SEM) and strain tester. By employing both the nondestructive analysis...

On the failure mechanism of metallized polypropylene pulse capacitors
2000 Edition, Volume 2, January 1, 2000 - IEEE - Institute of Electrical and Electronics Engineers, Inc.

Metallized pulse capacitors has gained wider and wider usage because of their unique "self-healing" character. Their failure mechanism has many differences from film/foil capacitors. Experiments were carried out on a number of metallized polypropylene pulse capacitors in...

Analysis on the failure modes and mechanisms of LED packaging
2012 Edition, August 1, 2012 - IEEE - Institute of Electrical and Electronics Engineers, Inc.

In- and out-doors LED is a new device with excellent performance in power-saving, lighting efficiency, reaction time. Currently, it is widely used in communication, display, illumination. Reliability is a key point to promote its application. The most important reliability issue in LED...

Investigations on the failure modes of XLPE cables and joints
1998 Edition, Volume 13, July 1, 1998 - IEEE - Institute of Electrical and Electronics Engineers, Inc.

The work reported in this paper pertains to the investigations on the cross-linked polyethylene (XPLE) cable systems in the presence of water and other electrolytes in contact with the conductor. In this connection, several diagnostic test procedures...

Discussions on the Failure Mode and Criterion of Passivation Cracks
2006 Edition, November 1, 2006 - IEEE - Institute of Electrical and Electronics Engineers, Inc.

Passivation cracks are studied with experimental observation and finite element simulation. Corner cracks are first initiated, and then edge cracks are subsequently initiated along the edge from the corner to the center. The cracks show a good symmetric pattern over both...

On the Failure of Monte Carlo Simulation and "Catastrophe Insurance"
2011 Edition, August 1, 2011 - IEEE - Institute of Electrical and Electronics Engineers, Inc.

This paper argued with empirical evidences that insurance and reinsurance are never panacea in the realm of risk diversification in that the very tools based essentially on risk pooling which fails in the universe where occurrence of a single extreme event...

Building of trust evaluation model based on the failure prediction
2000 Edition, Volume 2, January 1, 2000 - IEEE - Institute of Electrical and Electronics Engineers, Inc.

The paper suggests an effective bankruptcy avoidance behavior by a creditor. Empirical work based on actual data found the risk factor effectively in the credit accommodation from bankruptcy enterprises. An extreme validity risk factor was obtained: Information of...

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