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Job attitude and adoption of Advanced Printing Technology in Modern & Outmoded printing presses in Bangladesh
2015 Edition, October 1, 2015 - IEEE - Institute of Electrical and Electronics Engineers, Inc.

The purposes of this study are to analyze - (1) the dissimilarities in job attitude of modern technology enabled (web-fed printing press) and outmoded (sheet-fed printing press) printing press...

Organizational Justice, Employment Relationship and Employee Job Attitudes
2010 Edition, November 1, 2010 - IEEE - Institute of Electrical and Electronics Engineers, Inc.

The study shows that the relationship between leader-member exchange and Employee job attitudes is significant and LMX plays a mediating role in the relationship between interpersonal justice, informational justice and the job attitudes;...

Advanced printing techniques for flexible device fabrication
2013 Edition, July 1, 2013 - Japan Society of Applied Physics - JSAP

In order to develop printing techniques for fabricating flexible devices with both high productivity and high performance, low temperature printing process and materials were investigated. Developed techniques were applied to the preparation of large scale...

Pattern of Employment and Job Attitudes - The Role of Employee's Locus of Control
2009 Edition, December 1, 2009 - IEEE - Institute of Electrical and Electronics Engineers, Inc.

This study is aimed at work attitudes of part-time employment and full-time employment of retail businesses. The result indicated that internals in part-time employment would be associated with higher job satisfaction and affective organizational...

Advanced screen printing for the fabrication of organic humidity sensors
2012 Edition, September 1, 2012 - IEEE - Institute of Electrical and Electronics Engineers, Inc.

This paper presents a research focused on development of an advanced screen printing technique for the fabrication of miniaturized, low-cost organic humidity sensors. According to the survey done by BCC Research the segment of temperature and humidity...

Advanced Screen Printing "Practical Approaches for Printable & Flexible Electronics"
2008 Edition, October 1, 2008 - IEEE - Institute of Electrical and Electronics Engineers, Inc.

Screen-printing is not a new technology in the printed circuit industry. However, the combinations of new paste materials and an advanced screen-printing process further increases the value of printable flexible electronics that cannot be made...

Identifying Optimal Jobs to Work On: The Role of Attitude in Job Selection
2007 Edition, November 1, 2007 - IEEE - Institute of Electrical and Electronics Engineers, Inc.

In this paper, the meaning of attitude and its role in an agent's job selection behavior is discussed. When agents build teams, a critical step in improving performance is choosing which jobs to work on in the context of both...

Implementation of advanced ball printing technology for high yield bumping of wafer chip scale packages
2005 Edition, Volume 1, January 1, 2005 - IEEE - Institute of Electrical and Electronics Engineers, Inc.

Solder bumping usually represents the final stage in the WLP assembly process prior to dicing. Standard solder paste print and reflow techniques can be utilized but the resultant bumps invariably fall below specifications due to process limitations. More commonly, dedicated equipment...

How knowledge employees' perception of organizational justice affects job performance: The mediating role of work attitude
2014 Edition, August 1, 2014 - IEEE - Institute of Electrical and Electronics Engineers, Inc.

This paper explores the impacts of knowledge employees' perception of organizational justice on job performance and the role of work attitude in the relationship between organizational justice and job performance. The findings show that...

ECPR (electrochemical pattern replication): metal printing for advanced packaging applications
2004 Edition, January 1, 2004 - IEEE - Institute of Electrical and Electronics Engineers, Inc.

ECPR (electrochemical pattern replication) is a new fabrication process for the production of microstructures in conducting materials. Using ECPR, the cost of metallization for advanced packaging solutions can be significantly reduced compared to using lithography based...

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