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Implementing Laser Scanned-MEMS Projection in Automotive Head-Up Displays
Renesas Electronics Corporation

Automotive HUDs are benefiting from big innovations in MEMS projection systems and are now central to ADAS and safety. The latest laser scanned-MEMS projection systems can provide higher resolution images and at a lower cost. Read this white paper to learn why the laser...

ASTM E2245-11(2018) - Standard Test Method for Residual Strain Measurements of Thin, Reflecting Films Using an Optical Interferometer
May 1, 2018 - ASTM International

1.1 This test method covers a procedure for measuring the compressive residual strain in thin films. It applies only to films, such as found in microelectromechanical systems (MEMS) materials, which can be imaged using an optical interferometer, also called an interferometric microscope....

IEC 62047-10:2011 - Semiconductor devices - Micro-electromechanical devices - Part 10: Micro-pillar compression test for MEMS materials
July 26, 2011 - IEC - International Electrotechnical Commission

IEC 62047-10:2011 specifies micro-pillar compression test method to measure compressive properties of MEMS materials with high accuracy, repeatability, and moderate effort of specimen fabrication. The uniaxial compressive stress-strain relationship of a specimen is measured, and the...

Explore Infineon's high performance XENSIV™ MEMS microphones (Part 3)
Infineon Technologies AG

In this demonstration video series, we will introduce our XENSIV™ Digital MEMS microphone, showing four different use case benefits. This time, we will see how far is the voice recognized with high performance microphone.Visit our website for more information: https://www...

JDI Digital MEMS Inclinometer Demonstration
Jewell Instruments, LLC

The JDI-100/200 series is a ruggedized inclinometer using digital output and full temperature compensation across all measuring ranges which enables the unit to perform to 0.005° accuracy. This means that engineers can rely on a high precision tilt sensor that will not be easily influenced...

IEC 62047-12:2011 - Semiconductor devices - Micro-electromechanical devices - Part 12: Bending fatigue testing method of thin film materials using resonant vibration of MEMS structures
September 13, 2011 - IEC - International Electrotechnical Commission

IEC 62047-12:2011 specifies a method for bending fatigue testing using resonant vibration of microscale mechanical structures of MEMS (micro-electromechanical systems) and micromachines. This standard applies to vibrating structures ranging in size from 10 μm to 1 000 μm in the plane...

Bridge Monitoring Based on a Network of High Performance Triaxial MEMS Accelerometers
MonoDAQ

An efficient MEMS transducer network has been developed specifically to check the structural health of bridges starting from the acceleration measurement to monitor the frequency and speed variations.

RDD 51:2020 - High Density Image Encoding for ARRIRAW Files
2020 Edition, May 12, 2020 - Society of Motion Picture and Television Engineers

This document describes the structure of data encoded with Codex High Density Image Encoding (HDE), along with algorithms for decoding the stored data. - It is the intent of this RDD to describe the structure and encoding of all fields in the HDE bitstream, such that users of the RDD can...

ASTM F404-18a - Standard Consumer Safety Specification for High Chairs
November 15, 2018 - ASTM International

1.1 This consumer safety specification covers the performance requirements and methods of test to ensure the satisfactory performance of the high chair and high chairs created by using a high chair conversion kit and component(s) from another product. 1.2 This...

IEC 62047-25:2016 - Semiconductor devices - Micro-electromechanical devices - Part 25: Silicon based MEMS fabrication technology - Measurement method of pull-press and shearing strength of micro bonding area
August 29, 2016 - IEC - International Electrotechnical Commission

IEC 62047-25:2016 specifies the in-situ testing method to measure the bonding strength of micro bonding area which is fabricated by micromachining technologies used in silicon-based micro-electromechanical system (MEMS). This document is applicable to the in-situ pull-press and shearing...

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