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Advanced R&D to volume production in 300 mm
1999 Edition, January 1, 1999 - IEEE - Institute of Electrical and Electronics Engineers, Inc.

The semiconductor industry is seeing a rapid increase in wafer fab requirements due to fast evolution of processes towards the 0.1 /spl mu/m technology node. Over the past few years, STMicroelectronics has developed the flexible pilot line concept, combining R&D...

R&D models for advanced development & corporate research: Understanding six models of advanced R&D
2015 Edition, June 1, 2015 - IEEE - Institute of Electrical and Electronics Engineers, Inc.

Our purpose is to develop new models that define the advanced development & corporate research approaches of modern global high tech firms. While the world has moved on from Bell Labs' famous advanced research model, visionary and farsighted technology-driven innovation is...

Touchless 300 mm fab production in the modern business environment
2004 Edition, January 1, 2004 - IEEE - Institute of Electrical and Electronics Engineers, Inc.

Fully automated, touchless fab production would not be possible without the new generation of factory control software designed to run factories without direct human intervention. These systems work especially well when running large volumes of fully qualified products on fully...

A study of advanced ALIVH(R) interconnection technology
2002 Edition, January 1, 2002 - IEEE - Institute of Electrical and Electronics Engineers, Inc.

We have developed the advanced ALIVH interconnection technology using the new functional materials. The ALIVH (Any Layer Interstitial Via Hole) substrate was developed and introduced into the market in 1996. The ALIVH substrate is a multi layered organic substrate with interstitial...

Lithography in a 300 mm pilot production line
1999 Edition, January 1, 1999 - IEEE - Institute of Electrical and Electronics Engineers, Inc.

This paper discusses the performance of the initial 300 mm lithography tool set installed in a pilot line in Dresden, Germany. The product used for evaluating and debugging the tool set is a 0.25-micron ground rule 64 M DRAM. This was chosen for the ability to...

Integration Technology for Advanced Manufacturing: R&D in China 863 Program
2007 Edition, March 1, 2007 - IEEE - Institute of Electrical and Electronics Engineers, Inc.

China is turning into a manufacturing center of the world in the process of relocation of manufacturing industry to developing countries. However, developing countries' proportion of the total manufacturing value added has not seen a notable increase along past 20 years according...

Leveraging high performance computing to drive advanced manufacturing R&D at the US department of energy
2016 Edition, December 1, 2016 - IEEE - Institute of Electrical and Electronics Engineers, Inc.

Manufacturing is a critical component of the U.S. economy, responsible for 12.5% of GDP, direct employment for over 12 million people, and close to 75% of U.S. exports of goods. The U.S. manufacturing sector, while it produces 17% of the world's manufacturing output, also represents a...

Single antenna receivers for advanced satellite T/R systems
1989 Edition, January 1, 1989 - IEEE - Institute of Electrical and Electronics Engineers, Inc.

Three active antenna systems have been synthesized for 14-spot European coverage in the down-link range 12.5-12.75 GHz: far-field multibeam antenna, a near-field multibeam antenna, and a direct radiating phased array. The block diagram for all the three antenna systems is shown, assuming...

300 mm evaluation activities in Selete
1998 Edition, January 1, 1998 - IEEE - Institute of Electrical and Electronics Engineers, Inc.

300 mm equipment and materials are being developed in order to start IC mass production with 300 mm wafers in the year 2000. Semiconductor Leading Edge Technologies (Selete) has been evaluating and improving these technologies to...

300 mm implant: pilot production at SEMICONDUCTOR300
2000 Edition, January 1, 2000 - IEEE - Institute of Electrical and Electronics Engineers, Inc.

This paper presents the history, key results, and current status of two 300 mm ion implant systems used in the pilot production of 64 M DRAM at SEMICONDUCTOR300 in Dresden, Germany. Data from the Axcelis (formerly Eaton SEO) HE-3 and the Varian VIISta 80 is...

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