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2N Wire for Ultra Fine Pitch Wire Bonding: Challenges & Solutions
2008 Edition, December 1, 2008 - IEEE - Institute of Electrical and Electronics Engineers, Inc.

Various Au bonding wires which have different diameters from 25 um to 12 um, and purity of 2N and 4N are used for studying possible problems in ultra fine wire bonding. As wire diameter gets finer, grain size gets finer...

The Solutions of Resistive Ball Bond Failure in Ultra Fine Pitch Wire Bonding
2006 Edition, November 1, 2006 - IEEE - Institute of Electrical and Electronics Engineers, Inc.

In an ultra fine pitch (UFP) wire bonding process, understanding inter-metallic growth and its effect on package reliability are challenging areas. In most cases, eventual resistive ball bond failure is a challenge to the ultra fine...

The challenge of testing ultra fine pitch wire bonds
2003 Edition, January 1, 2003 - IEEE - Institute of Electrical and Electronics Engineers, Inc.

History and industrial road maps clearly show an ever-decreasing pitch between wire bonds. Until recently, the challenges of meeting this demand have fallen on other processes more than the science of bond testing. With industrial bonding at 50 /spl mu/m becoming...

Significant reduction of wire sweep using Ni plating to realise ultra fine pitch wire bonding
2002 Edition, January 1, 2002 - IEEE - Institute of Electrical and Electronics Engineers, Inc.

Significant reduction of the wire sweep in molding is proposed because the wire sweep is considered to be the major problem to realise wire bonding with ultra fine pitches of under 30 micrometers. In the present proposal, Ni was plated for...

Analysis on interfacial failures of ultra-fine pitch wire with low inter-metallic coverage
2009 Edition, December 1, 2009 - IEEE - Institute of Electrical and Electronics Engineers, Inc.

Ultra-fine pitch Au wire has become inevitable in the electronic packaging industry due to decreasing electronic package dimension and increasing cost of gold. However, fine pitch Au wire with diameter less than 0.5 mil. (12 μm), bonded on Al pad,...

Ultra fine pitch Cu wire bonding on C45 ultra low k wafer technology
2010 Edition, December 1, 2010 - IEEE - Institute of Electrical and Electronics Engineers, Inc.

As gold price continues to move in an overall rising trend, conversion to Cu wire has been given great focus as the main effort for cost reduction. Cu is a good alternative due to 26% lower electrical resistivity than Au, hence much higher electrical conductivity. However, Cu...

Allocation analysis - challenges & solutions
2013 Edition, January 1, 2013 - IEEE - Institute of Electrical and Electronics Engineers, Inc.

This paper discusses the challenges and solutions for reliability allocation analysis. The sophistication of today's designs requires a re-evaluation of reliability allocation methodologies to account for complex system designs where a single board could have lots of...

Ultra fine pitch bare Cu wire bonding manufacturability control for plastic ball grid array device
2011 Edition, December 1, 2011 - IEEE - Institute of Electrical and Electronics Engineers, Inc.

Bare copper wire bond in ultra fine pitch application pose high challenge during reliability stress especially reliability test that involved high temperature and humidity stress such as Highly Accelerated Temperature/Humidity Stress Test (HAST). Electrical...

BYD EV charging challenges solutions
2011 Edition, June 1, 2011 - IEEE - Institute of Electrical and Electronics Engineers, Inc.

This paper introduces several charging topologies that adopted in EV charging. Integrated charging system solutions would be explained in terms of renewable energy, electrical energy storage station and EVs. Vehicle to grid (V-G) charging station which lately developed by the company will...

Effect of Pd addition on ultra-fine pitch Au wire/Al pad interface
2010 Edition, June 1, 2010 - IEEE - Institute of Electrical and Electronics Engineers, Inc.

Due to increasing cost of gold and technological demand for finer pitch application, Au bonding wires with finer diameter are needed. In such demands, Au bonding wire manufacturing companies produced ultra-fine Au wires...

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