8 filter design for a class of nonlinear time-delay Hamiltonian systems
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Hong Xiaofang; Wang Yuzhen; Jiang Ping
Year: 2014
Negative imaginariness for simplified descriptor systems
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Minsong Zhang; Yanqian Wang
Year: 2014
Seventh-degree spherical simplex-radial cubature Kalman filter
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Zhang Yonggang; Huang Yulong; Wu Zhemin; Li Ning
Year: 2014
A stability analysis approach for a class of interconnected system
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Yong Wang
Year: 2014
Stability of fractional-order population growth model based on distributed-order approach
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Li Yan; Chen YangQuan; Zhai Lun
Year: 2014
The extended state filter for a class of multi-input multi-output nonlinear uncertain hybrid systems
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Bai Wenyan; Xue Wenchao; Huang Yi; Fang Haitao
Year: 2014
Analysis of a two-unit standby redundant electronic equipment system under human failure
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Qiao Xing; Liu Guoqing; Zhao Guochuan; Ma Dan; Guo Rui
Year: 2014
Some results for exponential stability of singular distributed parameter systems
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Ge Zhaoqiang
Year: 2014
Finite element approximation of the nonlinear Kirchhoff string with boundary control
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Yuhu Wu; Tielong Shen
Year: 2014
Exact boundary controllability for the wave equation with time-dependent and variable coefficients
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Liu Yuxiang; Yao Pengfei
Year: 2014
On structural controllability of complex networks using polar placement
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Yao Peng; Li Xiang
Year: 2014
Transmission projective synchronization in an array of identical coupled chaotic systems
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Liyan Cheng; Xiangyong Chen; Jianlong Qiu; Chunhua Xu; Xiao Chen; Ziqiang Huang
Year: 2014
Passivity analysis of complex delayed dynamical networks with output coupling
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Fang Luxian; Zhao Yue-Hui
Year: 2014
Convergence in the boundary layer for nonhomogeneous linear singularly perturbed systems
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Zhibin Yan; Yanhua Yuan
Year: 2014
A study of MEWMA controller for drifted MIMO non-squared process
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Gong Qingsong; Yang Genke; Pan Changchun
Year: 2014
Design and application of automatic crude oil blending for refinery plants
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Cheng Xi-song; Yang Jun; Li Juan; Liu Gu-quan
Year: 2014
Design of Bao-steel coal moisture control system based on neural network method
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Jiang Wenping; Li Zhenyu; Chen Minfang; Xu Yiwen; Li Lianghua; Zhang Fuxing; Wang Jianhua; Xia Naijie
Year: 2014
A novel coupler automatic measurement system
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Huang Jin; Zhang Fenghua; Xia Liyue
Year: 2014
Multi-objective optimization of material delivery for mixed model automotive assembly line based on particle swarm algorithm
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Zhenxin Cao; Zhuliang Lin
Year: 2014
Analysis and diagnosis of broken rotor bars in induction motors based on maxwell
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Lv Yuegang; Zhang Wenyuan; Liu Juncheng
Year: 2014
Filtering based multiple-model control for satellites in the presence of actuation sign errors
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Ma Yajie; Jiang Bin; Tao Gang; Cheng Yuehua
Year: 2014
Finite element thermal analysis of localized heating in AlGaN/GaN HEMT based sensors
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Minmin Hou; Chi-Chun Pan; Mehdi Asheghi; Debbie G. Senesky
Year: 2014
Convolution based compact thermal model application to the evaluation of the thermal impact of die to die interface including interconnections
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Federica Maggioni; Herman Oprins; Eric Beyne; Ingrid De Wolf; Martine Baelmans
Year: 2014
Nanomechanical characterization of SAC305 solder joints - effects of aging
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Md Hasnine; Jeffrey C. Suhling; Barton C. Prorok; Michael J. Bozack; Pradeep Lall
Year: 2014
High strain rate mechanical properties of SAC105 leadfree alloy at high operating temperatures
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Pradeep Lall; Vikas Yadav; Di Zhang; Jeff Suhling; Sandeep Shantaram
Year: 2014
Phosphor temperature reduction by optimizing the phosphor configuration in white light-emitting diode package
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Run Hu; Jinyan Hu; Xiaobing Luo
Year: 2014
Two phase convective cooling for ultra-high power dissipation in microprocessors
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Peter A. Kottke; Thomas M. Yun; Craig E. Green; Yogendra K. Joshi; Andrei G. Fedorov
Year: 2014
Simulation and measurement of heat flow in recessed LED fixtures mounted in a UL box
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Thomas D. Dreeben; David Betts
Year: 2014
A semi-analytical approach for optimized design of microchannel liquid-cooled ICs
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Arvind Sridhar; Mohamed M. Sabry; David Atienza
Year: 2014
Phase-separation of wetting fluids using nanoporous alumina membranes and micro-glass capillaries
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Damena D. Agonafer; Ken Lopez; Yoonjin Won; James Palko; Mehdi Asheghi; Juan G. Santiago; Kenneth E. Goodson
Year: 2014
Characterization of cu free air ball constitutive behavior using microscale compression test
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Sai Sudharsanan Paranjothy; Yuvraj Singh; Allen Tippman; Hung-Yun Lin; Ganesh Subbarayan; Dae Young Jung; Bahgat Sammakia
Year: 2014
Capillary force-driven fluid flow of a wetting liquid in open grooves with different sizes
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Tailian Chen
Year: 2014
Thermal management of electronic components using Makrolon polycarbonate and Bayflex polyurethane
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Terry G. Davis; Dave Rocco; James Lorenzo
Year: 2014
Impact of surface enhancements upon boiling heat transfer in a liquid immersion cooled high performance small form factor server model
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Joshua Gess; Sushil Bhavnani; Bharath Ramakrishnan; R. Wayne Johnson; Daniel Harris; Roy W. Knight; Michael Hamilton; Charles Ellis
Year: 2014
Enhanced pool-boiling heat transfer and critical heat flux using femtosecond laser surface processing
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Corey M. Kruse; Troy Anderson; Chris Wilson; Craig Zuhlke; Dennis Alexander; George Gogos; Sidy Ndao
Year: 2014
Effects of droplet diameter on the Leidenfrost temperature of laser processed multiscale structured surfaces
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Anton Hassebrook; Corey Kruse; Chris Wilson; Troy Anderson; Craig Zuhlke; Dennis Alexander; George Gogos; Sidy Ndao
Year: 2014
Impact of replacing Sn-Ag bumps with Cu pillars on the BEoL Cu/Low-k fracture under reflow - a computational study
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Zaeem Baig; Tejas S. Shetty; A. R. Nazmus Sakib; Fahad Mirza; Dereje Agonafer
Year: 2014
Multi objective optimization of BEoL and fBEOL structure in flip chip package during die attach process
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Hardik Parekh; Fahad Mirza; Dereje Agonafer
Year: 2014
Global-local finite element optimization study to minimize BGA damage under thermal cycling
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Abhishek Deshpande; Hassan Khan; Fahad Mirza; Dereje Agonafer
Year: 2014
Characterization of moisture and thermally induced die stresses in flip chip on laminate assemblies
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Quang Nguyen; Jordan C. Roberts; Jeffrey C. Suhling; Richard C. Jaeger
Year: 2014
Increasing heat transfer during condensation on surfaces via lubricant impregnation
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Sushant Anand; Adam Paxson; Konrad Rykaczewski; Kripa K. Varanasi
Year: 2014
Fatigue life prediction for solder interconnects in IGBT modules by using the successive initiation method
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Nilesh Ghodke; Dipesh Kumbhakarna; Satej Nakanekar; Sandeep Tonapi
Year: 2014
Effect of underfill design parameters on die cracking in flip chip on flexible substrates
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Mayur Sabale; Kiran Vinerkar; Shiwani Thakur; Sandeep Tonapi
Year: 2014
Simulations of damage and fracture in ULK under pad structures during Cu wirebond process
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Kritika Upreti; Hung-Yun Lin; Ganesh Subbarayan; Dae Young Jung; Bahgat Sammakia
Year: 2014
Temperature cycling performance of ball grid array packages under thermal enabling load
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Guruprasad Arakere; Milena Vujosevic; Jeffrey Cook
Year: 2014
Flow Rate and inlet temperature considerations for direct immersion of a single server in mineral oil
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Richard Eiland; John Fernandes; Marianna Vallejo; Dereje Agonafer; Veerendra Mulay
Year: 2014
Inverse opals for fluid delivery in electronics cooling systems
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Thomas J. Dusseault; Julie Gires; Michael T. Barako; Yoonjin Won; Damena D. Agonafer; Mehdi Asheghi; Juan G. Santiago; Kenneth E. Goodson
Year: 2014
CHF enhancement of Al2O3, TiO2 and Ag nanofluids and effect of nucleate pool boiling time
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Mehmed Sitki Ulcay
Year: 2014
Thermo-mechanical behavior and reliability issues for high temperature interconnections
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Rainer Dudek; Peter Sommer; Ralf Doring; Timo Herberholz; Andreas Fix; Bettina Seiler; Sven Rzepka
Year: 2014
Reliability of flip chip on flexible substrates under drop impact
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Mohasin Mulla; Kalpesh Bonde; Mayur Sabale; Shiwani Thakur; Sandeep Tonapi
Year: 2014
Understanding parasitic effects to improve the “3ω” measurement of GaN HEMTs thermal impedance
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Avcu Mustafa; Sommet Raphael; Callet Guillaume; Jean-Pierre Teyssier; Quere Raymond
Year: 2014
Latest developments of compact thermal modeling of system-in-package devices by means of Genetic Algorithm
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Eric Monier-Vinard; Valentin Bissuel; Najib Laraqi; Cheikh Dia
Year: 2014
Effect of solder joint size on fatigue life of WL-CSP under accelerated thermal cycling using FEM
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Nupur Bajad; Harshada Kulkarni; Satish Dhole; Shiwani Thakur; Sandeep Tonapi
Year: 2014
Assessing solder interconnect reliability of control boards in power electronic systems using Physics-of-Failure models
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:David Squiller; Elena Mengotti; Patrick McCluskey
Year: 2014
Mass transport characteristics and theoretical performance limits of micropillar wicks
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Saitej Ravi; David Horner; Saeed Moghaddam
Year: 2014
Mechanism investigation on die tilt in die attach process based on minimal free energy theory
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Huai Zheng; Yiman Wang; Lan Li; Xiaobing Luo
Year: 2014
Analysis of asperity dominated contacts in nanoelectromechanical relays using thin films
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Kimberly L. Harrison; Chaitali Dalvi; Mehdi Asheghi; Roger T. Howe
Year: 2014
Reliability of MEMS devices under multiple environments
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Pradeep Lall; Amrit S. Abrol; Lee Simpson; Jessica Glover
Year: 2014
Investigation and characterization of a high performance, small form factor, modular liquid immersion cooled server model
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Joshua Gess; Sushil Bhavnani; Bharath Ramakrishnan; R. Wayne Johnson; Daniel Harris; Roy Knight; Michael Hamilton; Charles Ellis
Year: 2014
Direct actuation of small-scale motions for enhanced heat transfer in heated channels
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Pablo Hidalgo; Ari Glezer
Year: 2014
Effect of system and operational parameters on the performance of an immersion-cooled multichip module for high performance computing
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Bharath Ramakrishnan; Sushil H. Bhavnani; Joshua Gess; Roy W. Knight; Daniel Harris; R. Wayne Johnson
Year: 2014
ELDO-COMSOL based 3D electro-thermal simulations of power semiconductor devices
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:G. De Falco; M. Riccio; G. Romano; L. Maresca; A. Irace; G. Breglio
Year: 2014
Numerical simulation of fogging in a square duct — A data center perspective
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Ripan Vasani; Derege Agonafer
Year: 2014
Extracting TIM properties with localized transient pulses
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Cameron Nelson; Jesse Galloway; Phillip Fosnot
Year: 2014
Comparison of fourier and non-fourier heat transfer in nanoscale semiconductor structures
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:M. Janicki; G. De Mey; M. Zubert; A. Napieralski
Year: 2014
Characterization and mitigation of cooling fan installation penalties in 1U enterprise class servers
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Ralph Carl; Patrick Lawless; John Decker
Year: 2014
Development and application of copper-graphite composite thermal core materials for high reliability RF system PCBs
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:David L. Saums; Robert A. Hay
Year: 2014
Registration of multiple RGBD cameras via local rigid transformations
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Teng Deng; Jean-Charles Bazin; Tobias Martin; Claudia Kuster; Jianfei Cai; Tiberiu Popa; Markus Gross
Year: 2014
Multiple target tracking with structural inference
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Chenyuan Zhang; Ling Cai; Yinghua Zhang; Yuming Zhao
Year: 2014
Learning quality-aware filters for no-reference image quality assessment
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Zhongyi Gu; Lin Zhang; Xiaoxu Liu; Hongyu Li; Jianwei Lu
Year: 2014
Saliency preserving decolorization
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Mingqi Zhou; Bing Sheng; Lizhuang Ma
Year: 2014
Facial age estimation from web photos using multiple-instance learning
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Xi Yang; Jianyi Liu; Yao Ma; Jianru Xue
Year: 2014
Be natural: A saliency-guided deep framework for image quality
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Weilong Hou; Xinbo Gao
Year: 2014
Video Face Clustering via Constrained Sparse Representation
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Chengju Zhou; Changqing Zhang; Xuewei Li; Gaotao Shi; Xiaochun Cao
Year: 2014
Influence of compression artifacts on visual attention
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Xiongkuo Min; Guangtao Zhai; Zhongpai Gao; Chunjia Hu
Year: 2014
Delta interpolation for upsampling imaging solutions
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Jun Tian; Wenjun Zeng
Year: 2014
An improved vertex-clustering-based progressive mesh encoder
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Guoping Wang; Yongzhen Wu; Guojing Hu; Jingliang Peng
Year: 2014
Psychological stress detection from cross-media microblog data using Deep Sparse Neural Network
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Huijie Lin; Jia Jia; Quan Guo; Yuanyuan Xue; Jie Huang; Lianhong Cai; Ling Feng
Year: 2014
A recurrent neural network language modeling framework for extractive speech summarization
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Kuan-Yu Chen; Shih-Hung Liu; Berlin Chen; Hsin-Min Wang; Wen-Lion Hsu; Hsin-Hsi Chen
Year: 2014
Camera context based estimation of spatial and temporal activity parameters for video quality metrics in automotive applications
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Christian Lottermann; Alexander Machado; Damien Schroeder; Wolfgang Hintermaier; Eckehard Steinbach
Year: 2014
Partial contour matching for document pieces with content-based prior
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Fabian Richter; Christian X. Ries; Stefan Romberg; Rainer Lienhart
Year: 2014
Free-viewpoint AR human-motion reenactment based on a single RGB-D video stream
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Fabian Lorenzo Dayrit; Yuta Nakashima; Tomokazu Sato; Naokazu Yokoya
Year: 2014
Bagging based metric learning for person re-identification
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Bohuai Yao; Zhicheng Zhao; Kai Liu; Anni Cai
Year: 2014
Web topic detection using a ranked clustering-like pattern across similarity cascades
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Fei Jia; Junbiao Pang; Weigang Zhang; Guorong Li; Chunjie Zhang; Qingming Huang; Yugui Liu
Year: 2014
A scalable hash scheduler for decoding of multiple H.264/AVC streams on multi-core architecture
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Dung Vu; Jilong Kuang; Laxmi Bhuyan
Year: 2014
Outlier-attenuating summarization for user-generated-video
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Yulong Liu; Huaping Liu; Yunhui Liu; Fuchun Sun
Year: 2014
Compressing material and texture attributes for triangular meshes
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Guoping Wang; Yongzhen Wu; Guojing Hu; Jingliang Peng
Year: 2014
F-divergences driven video key frame extraction
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Xiaoxiao Luo; Qing Xu; Mateu Sbert; Klaus Schoeffmann
Year: 2014
Rank learning on training set selection and image quality assessment
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Long Xu; Weisi Lin; Jia Li; Xu Wang; Yihua Yan; Yuming Fang
Year: 2014
Towards virtualized welding: Visualization and monitoring of remote welding
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Bo Fu; Will Seidelman; Yukang Liu; Travis Kent; Melody Carswell; Yuming Zhang; Ruigang Yang
Year: 2014
Building geo-aware tag features for image classification
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Shuai Liao; Xirong Li; Xiaoxu Wang; Xiaoyong Du
Year: 2014
No-reference depth quality assessment for texture-plus-depth images
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Sen Xiang; Jingteng Xue; Li Yu; Chang Wen Chen
Year: 2014
Personalized image recommendation for web search engine users
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Yuncheng Li; Jiebo Luo; Tao Mei
Year: 2014
Advanced residual prediction enhancement for 3D-HEVC
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Li Zhang; Ying Chen
Year: 2014
Automatic segmentation of LiDAR point cloud data at different height levels for 3D building extraction
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:S. M. Abdullah; Mohammad Awrangjeb; Guojun Lu
Year: 2014
Efficient building identification using structural and spatial information on mobile devices
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Kai-Hsiang Chen; Chi-Ruo Wu; Yue-Lin Yang; Jen-Wei Huang; Tsung-Yi Ho
Year: 2014
Feature extraction of complex ocean flow field using the helmholtz-hodge decomposition
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Huan Wang; Junhui Deng
Year: 2014
Supporting binocular visual quality prediction using machine learning
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Shanshan Wang; Feng Shao; Gangyi Jiang
Year: 2014
How does the shape descriptor measure the perceptual quality of the retargeting image?
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Lin Ma; Long Xu; Huanqiang Zeng; King N. Ngan; Chenwei Deng
Year: 2014
A robust tracking algorithm for 3D hand gesture with rapid hand motion through deep learning
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Jordi Sanchez-Riera; Yuan-Sheng Hsiao; Tekoing Lim; Kai-Lung Hua; Wen-Huang Cheng
Year: 2014
Non-intrusive quality assessment for enhanced speech signals based on spectro-temporal features
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Qiaohong Li; Yuming Fang; Weisi Lin; Daniel Thalmann
Year: 2014
Comparative analysis of online 2-D and 3-D video sharing
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Soobeom Jang; Jong-Seok Lee
Year: 2014
Towards real-time modeling and haptic rendering of deformable objects for point cloud-based Model-Mediated Teleoperation
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Xiao Xu; Eckehard Steinbach
Year: 2014
Distributed compressed sensing for image signals
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Zongxin Yu; Rui Wang; Haiyan Zhang; Yanliang Jin; Yixing Fu
Year: 2014
Modeling a realistic 3D physiological tongue for visual speech synthesis
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Chen Jiang; Changwei Luo; Yu Jun; Rui Li; Zengfu Wang
Year: 2014
Cross-media relevance mining for evaluating text-based image search engine
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Zhongwen Xu; Yi Yang; Ashraf Kassim; Shuicheng Yan
Year: 2014
4K real time video streaming with SHVC decoder and GPAC player
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:W. Hamidouche; G. Cocherel; J. Le Feuvre; M. Raulet; O. Deforges
Year: 2014
Tell me what
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Xian-Sheng Hua; Jin Li
Year: 2014
Gesture viewport: Interacting with media content using finger gestures on any surface
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Hao Tang; Patrick Chiu; Qiong Liu
Year: 2014
Recognition of who is doing what from the stick model obtained from Kinect
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:V. Ramu Reddy; Kingshuk Chakravarty; T. Chattopadhyay; Aniruddha Sinha; Arpan Pal
Year: 2014
Cloud-based rehabilitation exergames system
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Mohamad Hoda; Haiwei Dong; Dewan Ahmed; Abdulmotaleb El Saddik
Year: 2014
QoS aware platform for dependable sensory environments
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Aitor Agirre; Jorge Parra; Elisabet Estevez; Marga Marcos
Year: 2014
On the way to ambient media for sheet music by techniques of information retrieval
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Fu-Hai Frank Wu; Jyh-Shing Roger Jang
Year: 2014
Equity crowdfunding -A finnish case study
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Lester Allan Lasrado; Artur Lugmayr
Year: 2014
CCNF for continuous emotion tracking in music: Comparison with CCRF and relative feature representation
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Vaiva Imbrasaite; Tadas Baltrusaitis; Peter Robinson
Year: 2014
Performance analysis of AVS2 for remote sensing image compression
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Zhenzhong Chen; Qisheng Li; Yatong Xia
Year: 2014
An image community detection method for hierarchical visualisation
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Ersin Esen; Savas Ozkan; Ilkay Atil; Mehmet Ali Arabaci; Seda Tankiz
Year: 2014
Interactive body part contrast mining for human interaction recognition
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Yanli Ji; Guo Ye; Hong Cheng
Year: 2014
Engineering privacy requirements valuable lessons from another realm
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Yod-Samuel Martin; Jose M. del Alamo; Juan C. Yelmo
Year: 2014
L-SQUARE: Preliminary extension of the SQUARE methodology to address legal compliance
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Aaron Alva; Lisa Young
Year: 2014
Determination of stakeholders' consensus over values of system of systems
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Mohammad Rajabalinejad; G. Maarten Bonnema
Year: 2014
A capability based approach to improve effectiveness of information and computer technologies
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Mikhail V. Belov
Year: 2014
Systems theory for a competency model framework
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Joseph M. Bradley; Charles B. Keating
Year: 2014
A ‘wicked problem’ — Predicting sos behaviour in tactical land combat with compromised C4ISR
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:David G. A. Ormrod
Year: 2014
Application of service-oriented architecture to equipment SoS joint simulation
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Li Ze-min; Zhang Jing; Liu Zhi-qiang; Chen Li-li; Xing Ji-juan
Year: 2014
SysML fault modelling in a traffic management system of systems
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Claire Ingram; Zoe Andrews; Richard Payne; Nico Plat
Year: 2014
A system of systems approach to defence experimentation: CAGE IIIA
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Andrew Flahive
Year: 2014
Efficacy comparison of clustering systems for limb detection
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:H. Haggag; M. Hossny; S. Haggag; S. Nahavandi; D. Creighton
Year: 2014
Methodologies for the identification and integration of emerging and disruptive technologies
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Colby D. Raley; Paul S. Gaertner
Year: 2014
Improving the design of a human-in-the-loop joint fires experiment
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Edward H. S. Lo; T. Andrew Au; Peter J. Hoek
Year: 2014
Success factors for urgent technology insertion into military systems of systems
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Sasa Baskarada; Tim McKay; Tim McKenna
Year: 2014
Defence and security implications of technology changes
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Harry J. Woodroof; Ase K. Jakobsson
Year: 2014
Collaborative planning — The connective tissue for enterprise systems engineering
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Richard J. Hodge; Aaron Young; Brian McBride
Year: 2014
Framing measures for accountability in complex enterprises
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Richard J. Hodge
Year: 2014
Assessing global change impacts on defence using a System-of-Systems perspective
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Jane Holloway
Year: 2014
Towards designing innovative SoSE approaches for the Australian defence force
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Stephen C. Cook; Jaci M. Pratt
Year: 2014
Security triage: A report of a lean security requirements methodology for cost-effective security analysis
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Matteo Giacalone; Rocco Mammoliti; Fabio Massacci; Federica Paci; Rodolfo Perugino; Claudio Selli
Year: 2014
An experiment design for validating a test case generation strategy from requirements models
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Maria Fernanda Granda
Year: 2014
User-oriented requirements engineering
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Alistair Sutcliffe
Year: 2014
Panel - The ethics of nuclear energy in the post- Fukushima Era
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Paolo Gardoni; Colleen Murphy; Rafaela Hillerbrand; Behnam Taebi
Year: 2014
The law and the loop
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Meg Leta Ambrose
Year: 2014
Thou shalt not…A look at the ethics of copying software code
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Sarah J. Duda; Vickie Peters
Year: 2014
Ethics, law and privacy: Disentangling law from ethics in privacy discourse
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Gloria Gonzalez Fuster; Serge Gutwirth
Year: 2014
Forensic metrology: when measurement science meets ethics
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Alessandro Ferrero; Veronica Scotti
Year: 2014
Ethics and patents
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Lisa M. Schoedel
Year: 2014
Ethics and military engineering operations
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Carlos Bertha
Year: 2014
‘The organization is what the leader is’: An ethical leadership framework for universities and research organizations
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Avantika Singh; Nisha Rathore
Year: 2014
The ethics of wearable cameras in the wild
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Victoria Shipp; Anya Skatova; Jesse Blum; Michael Brown
Year: 2014
Panel - How do practitioners become learned professionals on ethical issues?
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:William Marcy; Nael Barakat; Deborah Johnson; Steven Starrett
Year: 2014
Ethics of scientific peer review: Are we judging or helping the review recipients?
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Oluwabunmi Adewoyin; Julita Vassileva
Year: 2014
Plagiarism: It's not just for students
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Marilyn A. Dyrud
Year: 2014
Introducing graduate and undergraduate students to research and professional ethics at Columbia University
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Irving P. Herman
Year: 2014
Technology as moral proxy: Autonomy and paternalism by design
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Jason Millar
Year: 2014
Towards a philosophy of engineering
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Wade O. Troxell; Graeme W. Troxell
Year: 2014
Embedding philosophers in engineering research and development projects
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Vivian Weil
Year: 2014
Ethics in engineering
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Wade L. Robison
Year: 2014
Workshop - Assessing science and engineering ethics outcomes: An interactive review of tools
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Jason Borenstein; Brent K. Jesiek; Carla B. Zoltowski; Qin Zhu
Year: 2014
Panel - responsible innovation in research: A reflexive governance to scientific development
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Robert Gianni; Philippe Goujon; Veikko Ikonen; John Pearson
Year: 2014
Principles for the future development of artificial agents
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Deborah G. Johnson; Merel Noorman
Year: 2014
Acting vs. being moral: The limits of technological moral actors
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Aaron M. Johnson; Sidney Axinn
Year: 2014
Ethics and design of user-centered multi-agent systems
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Yves Demazeau
Year: 2014
AI safety engineering through introduction of self-reference into felicific calculus via artificial pain and pleasure
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Andrew M. Majot; Roman V. Yampolskiy
Year: 2014
Pseudonymity and structuration: Identity, interaction, and structure in online communities
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:L. M. Stuart; M. J. Dark
Year: 2014
Ethics and ICT: Beyond design
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Gerard van Oortmerssen
Year: 2014
Neither Pollyanna nor Chicken Little: Thoughts on the ethics of automation
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:C. Michael Holloway; John C. Knight; John A. McDermid
Year: 2014
Ethics behind Cyber Warfare: A study of Arab citizens awareness
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Nedaa Baker Al Barghuthi; Huwida Said
Year: 2014
Tutorial - Working with ethicists: A bestiary
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Kenneth D. Pimple
Year: 2014
Does “public” mean an engineer's nation?
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Michael Davis
Year: 2014
Codes of ethics move into the “third generation”
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Susan Zinner
Year: 2014
Towards a global Code of Ethics for engineers
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Saif alZahir; Laura Kombo
Year: 2014
Are science, technology, and engineering now the most important subjects for ethics? Our need to respond
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Brian Patrick Green
Year: 2014
Making sense of ethics in engineering education: A discursive examination of students' perceptions of work and ethics on multidisciplinary project teams
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Megan W. Kenny Feister; Carla B. Zoltowski; Patrice M. Buzzanell; Qin Zhu; William C. Oakes
Year: 2014
Measuring Team Ethical Climate: Development of the TECS
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:J. L. May; A. Mead; J. K. Ellington
Year: 2014
The role of motivation in engineering students': Ethical Decisions
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Diana Bairaktarova; Anna Woodcock
Year: 2014
Cross-cultural and cross-national impact of ethics education on engineering students
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Ruth I. Murrugarra; William A. Wallace
Year: 2014
Preserving dignity in patient caregiver relationships using moral emotions and robots
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Ronald C. Arkin; Matthias Scheutz; Linda Tickle-Degnen
Year: 2014
App stores for the brain: Privacy & security in Brain-Computer Interfaces
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Tamara Bonaci; Ryan Calo; Howard Jay Chizeck
Year: 2014
An ethical examination of the Internet Census 2012 dataset: A menlo report case study
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:David Dittrich; Manish Karir; Katherine Carpenter
Year: 2014
The ethics of coexistence: Can I learn to stop worrying and love the logic bomb?
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:John Aycock; Anil Somayaji; John Sullins
Year: 2014
Bound to be ‘normal’: Assistive technology, fair opportunity, and athletic excellence
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:D. A. Baker
Year: 2014
Augmented reality - Towards an ethical fantasy?
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Olli I. Heimo; Kai K. Kimppa; Seppo Helle; Timo Korkalainen; Teijo Lehtonen
Year: 2014
Ethical issues with use of Drone aircraft
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Richard L. Wilson
Year: 2014
Mechanizing modal psychology
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Paul F. Bello
Year: 2014
Ethical education of an engineer with responsibility for a sustainable world
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Thelma Virginia Rodrigues; Andre Luis Goncalves; Plinio Soares Paolinelli Maciel; Pedro Augusto Rodrigues de Paiva
Year: 2014
Bringing responsible research into engineering ethics: Responsible research in appropriate technology
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:William J. Frey; Cristina Rivera-Velez
Year: 2014
The ethics of curriculum development: Engineers and technicians in a context of development
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Chris Winberg; Penelope Engel-Hills; Simon Winberg; Arie Rip
Year: 2014
Mind the gap: Using lessons learned from practicing engineers to teach engineering ethics to undergraduates
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Christine G. Nicometo; Traci Nathans-Kelly; Bart Skarzynski
Year: 2014
A multi-disciplinary, multi-institutional approach to teaching Ethical, Social, Health, Safety, and Environmental Issues in Nanotechnology
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:J. Craig Hanks; Robert McLean; Jitendra Tate; Satyajit Dutta; Dominick Fazarro; Fritz Alhoff; Walt Trybula
Year: 2014
Ethics and the allocation of risk in engineering design
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:David L. Bodde
Year: 2014
Ethics as philosophical history for engineers
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Daniel J. Biezad
Year: 2014
A phenomenological approach to teaching engineering ethics
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Valorie Troesch
Year: 2014
Panel - Ethics and pervasive ICT
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Kenneth D. Pimple; Donald R. Searing; Cynthia Jones; Katherine D. Seelman; Keith W. Miller; Katie Shilton
Year: 2014
Akratic robots and the computational logic thereof
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Selmer Bringsjord; G. Naveen Sundar; Dan Thero; Mei Si
Year: 2014
Panel - Ethics in modern universities of technology: Challenges of the 21st century
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Penelope Engel-Hills; Behnam Taebi; Rafaela Hillerbrand; Claudia Werker; Arie Rip; Chris Wineberg; Mary Sunderland
Year: 2014
Panel - Ethics and emerging technology: Ethical concerns from a cognitive, media & technology focused psychology perspective concerning augmented reality, privacy, and sigularity
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Shane Pase; Sean Thoennes; Garry Hare; Crystal Connors; Jerri Lynn Hogg
Year: 2014
Lessons learned from a year in the trenches: Teaching engineering ethics for P.E. licensure requirements
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Laura Grossenbacher; Thomas D. McGlamery
Year: 2014
Ethics and competitive advantage in a fast-paced industry
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Pete Hylton
Year: 2014
Tribes, boundaries, and intellectual silos: Science, technology, and engineering ethics education in the departmentalized world of academia
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:David K. McGraw; Amanda G. Biesecker
Year: 2014
The technology of cheating
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Randy Kelley; Brandon Dooley
Year: 2014
The ethics of energy transitions
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Clark Miller
Year: 2014
Moral competence in social robots
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Bertram F. Malle; Matthias Scheutz
Year: 2014
Engineering for problems of excess
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Lav R. Varshney
Year: 2014
Development of socially sustainable traffic-control principles for self-driving vehicles: The ethics of anthropocentric design
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Milos N. Mladenovic; Montasir Abbas; Tristram McPherson
Year: 2014
Small Modular Reactors: The future of nuclear energy?
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Jennifer Richter
Year: 2014
Workshop - Ancient Rajayoga - The science of reviving ethical values
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:R. Radhakrishna Pillai
Year: 2014
Ethics of scientific publication: (Mal)-practices and Consequentialism
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Anupam Chattopadhyay
Year: 2014
Value justification and conscience in professional activities: A case study about scientists, technologists and engineers
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Zhaoming Gao; Meizhen Dong
Year: 2014
Global ethics and virtual worlds: Ensuring functional integrity in transnational research studies
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:John Murray; Joshua A. T. Fairfield
Year: 2014
Case study: Engineer discovers problem but supervisor wants to ignore
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Steven K. Starrett; Amy Lara
Year: 2014
Ethical challenges in reducing global greenhouse gas emission
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Inge Johansen; Petter Stoa
Year: 2014
Piracy in the digital age: Is ethical awareness turning into action?
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:A. G. Rekha; R. Radhakrishna Pillai
Year: 2014
“Think and do the right thing” — A Plea for morally competent autonomous robots
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Matthias Scheutz; Bertram F. Malle
Year: 2014
Ethical responsibilities: The smart card engineer
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Nsima Sylvanus Udoh; Opeoluwa Tosin Eluwole; Abidemi Olufisayo Ologunde
Year: 2014
Investigation of ethics in engineering design
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Abidemi Olufisayo Ologunde; Opeoluwa Tosin Eluwole; Nsima Sylvanus Udoh
Year: 2014
Ethics between the lines (of code)
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Jan Sliwa
Year: 2014
Interaction between ethics and technology
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Javad Shakib; David Layton
Year: 2014
Ethics and nanotechnology
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Ahmed S. Khan
Year: 2014
Ethics and the official reports about the destruction of the World Trade Center Twin Towers (WTC1 and WTC2) on 9/11: A case study
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:John D. Wyndham; Wayne H. Coste; Michael R. Smith
Year: 2014
An ethical framework for evaluating construction materials
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Alexandra Sibole
Year: 2014
Privacy-preserving mobility-casting in opportunistic networks
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Gianpiero Costantino; Fabio Martinelli; Paolo Santi
Year: 2014
Using biometric key commitments to prevent unauthorized lending of cryptographic credentials
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:David Bissessar; Carlisle Adams; Dong Liu
Year: 2014
Semi-synthetic data set generation for security software evaluation
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Florian Skopik; Giuseppe Settanni; Roman Fiedler; Ivo Friedberg
Year: 2014
Assessing cryptographic signature schemes from a legal perspective
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Dan T. F. Chan; Lucas C. K. Hui; S. M. Yiu
Year: 2014
Validating trust models against realworld data sets
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Noel Sardana; Robin Cohen
Year: 2014
Two trust networks in one: Using bipolar structures to fuse trust and distrust
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Stefano Bistarelli; Francesco Santini
Year: 2014
Integration study of die strength and various bumping volume and reliability performance on 2.5D silicon interposer assembly
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Shih-Liang Peng; Chen-Yu Huang; Ming-Hsien Yang; Stephen Tseng; J. Y. Lai; Terren Lu; Hsien-Wen Chen; Steve Chiu; Stephen Chen
Year: 2014
Mechanically flexible interconnects with highly scalable pitch and large stand-off height for silicon interposer tile and bridge interconnection
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Chaoqi Zhang; Hyung Suk Yang; Muhannad S. Bakir
Year: 2014
Advancements in fabrication of glass interposers
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Aric Shorey; Philippe Cochet; Alan Huffman; John Keech; Matt Lueck; Scott Pollard; Klaus Ruhmer
Year: 2014
Large area interposer lithography
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Warren Flack; Robert Hsieh; Gareth Kenyon; Manish Ranjan; John Slabbekoorn; Andy Miller; Eric Beyne; Medhat Toukhy; PingHung Lu; Yi Cao; Chunwei Chen
Year: 2014
Challenges and opportunities of chip package interaction with fine pitch Cu pillar for 28nm
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Andy Bao; Lily Zhao; Yangyang Sun; Michael Han; Geoffrey Yeap; Steve Bezuk; Pat Holmes; Cecille Alcira; Xuefeng Zhang; Kenny Lee
Year: 2014
Electromigration performance of Cu pillar bump for flip chip packaging with bump on trace by using thermal compression bonding
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Kuei Hsiao Kuo Frank; Jason Lee; F. L. Chien; Rick Lee; Cindy Mao; John Lau
Year: 2014
Flip-chip bonding alignment accuracy enhancement using self-aligned interconnection elements to realize low-temperature construction of ultrafine-pitch copper bump interconnections
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Bui Thanh Tung; Naoya Watanabe; Fumiki Kato; Katsuya Kikuchi; Masahiro Aoyagi
Year: 2014
Development fine pitch area array Cu pillar/lead free solder bumps for large 28nm die in large organic flip chip packages
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:John Osenbach; Sue Emerich; S. Cate; D. Brady; Seung Min Hwang; J. Dang; D. Crouthamel
Year: 2014
ELK delaminate improvement methodology on Cu pillar interconnect BOP structure
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Nistec Chang; Albert Lan; Mark Liao; Eason Chen
Year: 2014
Transient dynamics model and 3D-DIC analysis of new-candidate for JEDEC JESD22-B111 test board
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Pradeep Lall; Kalyan Dornala; Di Zhang; Dongji Xie; Andy Zhang
Year: 2014
Interconnect reliability prediction for wafer level packages (WLP) for temperature cycle and drop load conditions
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Tong Cui; Ahmer Syed; Beth Keser; Rey Alvarado; Steven Xu; Mark Schwarz
Year: 2014
A novel drop test methodology for highly stressed interconnects in automotive electronic control units
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:M. H. Shirangi; G. Tsebo Simo; Z. Wang; R. Unnikrishnan; T. Heinrich
Year: 2014
Accelerated vibration reliability testing of electronic assemblies using sine dwell with resonance tracking
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Quang Su; James Pitarresi; Mohammad Gharaibeh; Aaron Stewart; Gaurang Joshi; Martin Anselm
Year: 2014
MEMS-based implantable heart monitoring system with integrated pacing function
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Fjodors Tjulkins; Anh Tuan Thai Nguyen; Erik Andreassen; Nils Hoivik; Knut Aasmundtveit; Lars Hoff; Ole Johannes Grymyr; Per Steinar Halvorsen; Kristin Imenes
Year: 2014
Archipelago platform for skin-mounted wearable and stretchable electronics
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Yung-Yu Hsu; Cole Papakyrikos; Milan Raj; Mitul Dalal; Pinghung Wei; Xianyan Wang; Gil Huppert; Briana Morey; Roozbeh Ghaffari
Year: 2014
Ultra small hearing aid electronic packaging enabled by chip-in-flex
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:John Dzarnoski; Susie Johansson
Year: 2014
Fabrication of silicon based microfluidics device for cell sorting application
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Bivragh Majeed; Chengxun Liu; Lut Van Acker; Robert Daily; Tomokazu Miyazaki; Deniz Sabuncuoglu; Liesbet Lagae
Year: 2014
Assembly of mechanically compliant interfaces between optical fibers and nanophotonic chips
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Tymon Barwicz; Yoichi Taira; Hidetoshi Numata; Nicolas Boyer; Stephane Harel; Swetha Kamlapurkar; Shotaro Takenobu; Simon Laflamme; Sebastian Engelmann; Yurii Vlasov; Paul Fortier
Year: 2014
Study on isotropic electrically conductive adhesive for medical device applications
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Shawn Shi; Scott Sleeper; Chunho Kim
Year: 2014
Effect of aligned nanofiber in nanofiber solder anisotropic conductive films (ACFs) on the solder ball movement for flex-on-flex (FOF) assembly
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Tae-Wan Kim; Sang-Hoon Lee; Kyung-Wook Paik
Year: 2014
Modeling, design, and demonstration of low-temperature Cu interconnections to ultra-thin glass interposers at 20 μm pitch
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Tao Wang; Vanessa Smet; Makoto Kobayashi; Venky Sundaram; P. Markondeya Raj; Rao Tummala
Year: 2014
Cu pattern density impacts on 2.5D TSI warpage using experimental and FEM analysis
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:C. T. Yeh; C. Y. Wu; C. F. Lin; K. M. Chen; M. J. Lin; Y. C. Lin; C. L. Kuo
Year: 2014
TSV-less 3D stacking of MEMS and CMOS via low temperature Al-Au direct bonding with simultaneous formation of hermetic seal
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:S. L. Chua; A. Razzaq; K. H. Wee; K. H. Li; H. Yu; C. S. Tan
Year: 2014
Design and package technology development of Face-to-Face die stacking as a low cost alternative for 3D IC integration
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Zhe Li; Yuan Li; John Xie
Year: 2014
Development of new 2.5D package with novel integrated organic interposer substrate with ultra-fine wiring and high density bumps
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Kiyoshi Oi; Satoshi Otake; Noriyoshi Shimizu; Shoji Watanabe; Yuji Kunimoto; Takashi Kurihara; Toshinori Koyama; Masato Tanaka; Lavanya Aryasomayajula; Zafer Kutlu
Year: 2014
First demonstration of a surface mountable, ultra-thin glass BGA package for smart mobile logic devices
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Venky Sundaram; Yoichiro Sato; Toshitake Seki; Yutaka Takagi; Vanessa Smet; Makoto Kobayashi; Rao Tummala
Year: 2014
Towards a quantitative mechanistic understanding of the thermal cycling of SnAgCu solder joints
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:D. Schmitz; S. Shirazi; L. Wentlent; S. Hamasha; L. Yin; A. Qasaimeh; P. Borgesen
Year: 2014
Exploration of aging induced evolution of solder joints using nanoindentation and microdiffraction
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Mohammad Hasnine; Jeffrey C. Suhling; Barton C. Prorok; Michael J. Bozack; Pradeep Lall
Year: 2014
Accessing adhesive induced risk for BGAs in temperature cycling
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Guruprasad Arakere; Milena Vujosevic; Min Pei
Year: 2014
The corrosion performance of Cu alloy wire bond on Al pad in molding compounds of various chlorine contents under biased-HAST
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Ying-Ta Chiu; Tzu-Hsing Chiang; Yin-Fa Chen; Ping-Feng Yang; Louie Huang; Kwang-Lung Lin
Year: 2014
Flexible non-volatile Cu/CuxO/Ag ReRAM memory devices fabricated using ink-jet printing technology
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Simin Zou; C. Michael
Year: 2014
A novel methodology for wafer-specific feed-forward management of backside silicon removal by wafer grinding for optimized through silicon via reveal
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Tyson Alvanos; John Garant; Yu Iijima; Richard Indyk; Christopher Rosenthal; Osamu Sato; Naoki Sugase; Hideo Takizawa; Frank Wei
Year: 2014
A new era in manufacturable, low-temperature and ultra-fine pitch Cu interconnections and assembly without solders
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Vanessa Smet; Makoto Kobayashi; Tao Wang; Pulugurtha Markondeya Raj; Rao Tummala
Year: 2014
Enabling fine pitch Cu & Ag alloy wire bond assessment for 28nm ultra low-k structure
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:John D. Beleran; Ninoy Milanes; Gaurav Mehta; Nathapong Suthiwongsunthorn; Ranjan Rajoo; Chan Kai Chong
Year: 2014
Assembly of multiple chips on flexible substrate using anisotropie conductive film for medical imaging applications
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Hoang-Vu Nguyen; Trym Eggen; Bjornar Sten-Nilsen; Kristin Imenes; Knut E. Aasmundtveit
Year: 2014
High frequency high current point of load modules with integrated planar inductors
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Wenli Zhang; Yipeng Su; David Gilham; Mingkai Mu; Qiang Li; Fred C. Lee
Year: 2014
Lithography challenges for 2.5D interposer manufacturing
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Klaus Ruhmer Philippe Cochet; Roger McCleary; Rich Rogoff; Rajiv Roy
Year: 2014
Process development to enable 3D IC multi-tier die bond for 20μM pitch and beyond
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Y. H. Hu; C. S. Liu; M. T. Chen; M. D. Cheng; H. J. Kuo; M. J. Lii; A. La Manna; K. J. Rebibis; T. Wang; S. V. Huylenbroeck; R. Daily; G. Capuz; D. Velenis; G. Beyer; E. Beyne; Doug C. H. Yu
Year: 2014
Factors in the selection of temporary wafer handlers for 3D/2.5D integration
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Bing Dang; Bucknell Webb; Cornelia Tsang; Paul Andry; John Knickerbocker
Year: 2014
Optimization and challenges on TSV MEOL integration
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:DoHyeong Kim; DongHun Lee; YoungChul Seo; JungSoo Park; SeungChul Han; BoRa Jang; JooHyun Kim; YoungSuk Chung; SeongMin Seo; ChoonHeung Lee
Year: 2014
TSV integration on 20nm logic Si: 3D assembly and reliability results
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Rahul Agarwal; Dave Hiner; Sukeshwar Kannan; KiWook Lee; DoHyeong Kim; JongSik Paek; SungGeun Kang; Yong Song; Sebastian Dej; Dan Smith; Sara Thangaraju; Jens Paul
Year: 2014
TSV MEOL (Mid End of Line) and packaging technology of mobile 3D-IC stacking
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Duk Ju Na; Kyaw Oo Aung; Won Kyung Choi; Tsuyoshi Kida; Toshihiko Ochiai; Tomoaki Hashimoto; Michitaka Kimura; Keiichirou Kata; Seung Wook Yoon; Andy Chang Bum Yong
Year: 2014
Filler trap and solder extrusion in 3D IC thermo-compression bonded microbumps
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Yingxia Liu; Menglu Li; Dong Wook Kim; Sam Gu; Dilworth Y. Parkinson; Justin Blair; K. N. Tu
Year: 2014
Investigation of a TSV-RDL in-line fault-diagnosis system and test methodology for wafer-level commercial production
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Runiu Fang; Min Miao; Xin Sun; Yunhui Zhu; Guanjiang Wang; Yichao Xu; Minggang Sun; Yufeng Jin
Year: 2014
Bonding technologies for chip level and wafer level 3D integration
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Katsuyuki Sakuma; Spyridon Skordas; Jeffrey Zitz; Eric Perfecto; William Guthrie; Luc Guerin; Richard Langlois; Hsichang Liu; Koushik Ramachandran; Wei Lin; Kevin Winstel; Sayuri Kohara; Kuniaki Sueoka; Matthew Angyal; Troy Graves-Abe; Daniel Berger; John Knickerbocker; Subramanian Iyer
Year: 2014
Solder joint height impact on temperature cycle reliability of BGA components with thermal enabling load
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Yun Ge; Jeffrey Cook; Min Pei; Milena Vujosevic; Bite Zhou; Suddhasattwa Nad
Year: 2014
The impact of microstructure evolution, localized recrystallization and board thickness on Sn-Ag-Cu interconnect board level shock performance
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Tae-Kyu Lee; Weidong Xie; Thomas R. Bieler; Choong-Un Kim
Year: 2014
Thermal cycle fatigue life prediction for flip chip solder joints
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Robert Darveaux
Year: 2014
Modeling, design, fabrication and characterization of first large 2.5D glass interposer as a superior alternative to silicon and organic interposers at 50 micron bump pitch
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Brett Sawyer; Hao Lu; Yuya Suzuki; Yutaka Takagi; Makoto Kobayashi; Vanessa Smet; Taiji Sakai; Venky Sundaram; Rao Tummala
Year: 2014
Novel THz imaging array using high resistivity metasurfaces
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Kyoung Youl Park; Premjeet Chahal
Year: 2014
Wafer-level non conductive films for exascale servers
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:A. Horibe; S. Kohara; H. Mori; Y. Orii; S. Kawamoto; H. Sone; M. Hoshiyama
Year: 2014
Optimization of Compression Bonding processing temperature for fine pitch Cu-column flip chip devices
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Yonghyuk Jeong; Joonyoung Choi; Youjoung Choi; Nokibul Islam; Eric Ouyang
Year: 2014
Reliability improvement methods of solder anisotropic conductive film (ACF) joints using morphology control of solder ACF joints
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Yoo-Sun Kim; Seung-Ho Kim; Jiwon Shin; Kyung-Wook Paik
Year: 2014
Temporary spin-on glass bonding technologies for via-last/backside-via 3D integration using multichip self-assembly
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:H. Hashiguchi; T. Fukushima; A. Noriki; H. Kino; K.-W Lee; T. Tanaka; M. Koyanagi
Year: 2014
TSV module optimization for high performance silicon interposer
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Andrew Cao; Thomas Dinan; Zhuowen Sun; Guilian Gao; Cyprian Uzoh; Bong-Sub Lee; Liang Wang; Hong Shen; Sitaram Arkalgud
Year: 2014
Challenges in 3D die stacking
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Juergen Grafe; Wieland Wahrmund; Stephan Dobritz; Juergen Wolf; Klaus-Dieter Lang
Year: 2014
Wet silicon etch process for TSV reveal
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Laura B. Mauer; John Taddei; Ramey Youssef; Yongqiang Lu; Sian Collins; Kevin McLaughlin; Craig Allen
Year: 2014
Advanced wafer bonding and laser debonding
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:P. Andry; R. Budd; R. Polastre; C. Tsang; B. Dang; J. Knickerbocker; M. Glodde
Year: 2014
Versatile thin wafer stacking technology for monolithic integration of temporary bonded thin wafers
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Thomas Uhrmann; Jurgen Burggraf; Julian Bravin; Viorel Dragoi; Markus Wimplinger; Thorsten Matthias; Paul Lindner
Year: 2014
Temporary bonding for High-topography Applications: Spin-on Material Versus Dry Film
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Anne Jourdain; Alain Phommahaxay; Greet Verbinnen; Alice Guerrero; Susan Bailey; Mark Privett; Kim Arnold; Andy Miller; Kenneth Rebibis; Gerald Beyer; Eric Beyne
Year: 2014
Development of new concept thermoplastic temporary adhesive for 3D-IC integration
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:A. Kubo; K. Tamura; H. Imai; T. Yoshioka; S. Oya; S. Otaka
Year: 2014
Underfilling techniques comparison in 3D CtW stacking approach
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:A. Garnier; A. Jouve; R. Franiatte; S. Cheramy
Year: 2014
High throughput thermal compression NCF bonding
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Toshihisa Nonaka; Yuta Kobayashi; Noboru Asahi; Shoichi Niizeki; Koichi Fujimaru; Yoshiyuki Arai; Toshifumi Takegami; Yoshinori Miyamoto; Masatsugu Nimura; Hiroyuki Niwa
Year: 2014
Board level reliability and surface mount assembly of 0.35mm and 0.3mm pitch wafer level packages
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Beth Keser; Rey Alvarado; Alan Choi; Mark Schwarz; Steve Bezuk
Year: 2014
Encapsulated wafer level package technology (eWLCS)
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Tom Strothmann; Seung Wook Yoon; Yaojian Lin
Year: 2014
24"×18" Fan-out panel level packing
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:T. Braun; K.-F Becker; S. Voges; J. Bauer; R. Kahle; V. Bader; T. Thomas; R. Aschenbrenner; K.-D Lang
Year: 2014
Interplay and influence of thermomechanical stress in copper-filled TSV interposers
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Sheng-Tsai Wu; Cheng-fu Chen; Heng-Chieh Chien
Year: 2014
Cohesive zone experiments for copper/mold compound delamination
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:William E. R. Krieger; Sathyanarayanan Raghavan; Abhishek Kwatra; Suresh K. Sitaraman
Year: 2014
Damage pre-cursor based life prediction of the effect of mean temperature of thermal cycle on the SnAgCu solder joint reliability
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Pradeep Lall; Kazi Mirza; Jeff Suhling
Year: 2014
336-Channel electro-optical interconnect: Underfill process improvement, fiber bundle and reliability results
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Shuki Benjamin; Kobi Hasharoni; Avi Maman; Stanislav Stepanov; Michael Mesh; Helge Luesebrink; Roland Steffek; Wolfgang Pleyer; Christian Stommer
Year: 2014
Novel trace design for high data-rate multi-channel optical transceiver assembled using flip-chip bonding
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Takatoshi Yagisawa; Takashi Shiraishi; Mariko Sugawara; Kazuhiro Tanaka
Year: 2014
A study on nanofiber anisotropic conductive films (ACFs) for fine pitch chip-on-glass (COG) interconnections
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Sang Hoon Lee; Tae Wan Kim; Kyung-Wook Paik
Year: 2014
Study of fine pitch micro-interconnections formed by low temperature bonded copper nanowires based anisotropic conductive film
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Jing Tao; Alan Mathewson; Kafil M. Razeeb
Year: 2014
Carbon Nanofibers (CNF) for enhanced solder-based nano-scale integration and on-chip interconnect solutions
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:V. Desmaris; A. M. Saleem; S. Shafiee; J. Berg; M. S. Kabir; A. Johansson
Year: 2014
Pressure-less plasma sintering of Cu paste for SiC die-attach of high-temperature power device manufacturing
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:S. Nagao; K. Kodani; S. Sakamoto; S-W Park; T. Sugahara; K. Suganuma
Year: 2014
Flip chip based on compliant double helix interconnect for high frequency applications
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Pingye Xu; George A. Hernandez; Shiqiang Wang; Jie Zhong; Charles D. Ellis; Michael C. Hamilton
Year: 2014
First demonstration of reliable copper-plated 30μm diameter through-package-vias in ultra-thin bare glass interposers
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Kaya Demir; Andac Armutlulu; Jialing Tong; Raghuram Pucha; Venkatesh Sundaram; Rao Tummala
Year: 2014
A novel fine pitch TSV interconnection method using NCF with Zn nano-particles
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Ji-Won Shin; Yong-Won Choi; Young Soon Kim; Un Byung Kang; Sun Kyung Seo; Kyung-Wook Paik
Year: 2014
Formic acid treatment with Pt catalyst for Cu direct and hybrid bonding at low temperature
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Tadatomo Suga; Masakate Akaike; Wenhua Yang
Year: 2014
Direct multichip-to-wafer 3D integration technology using flip-chip self-assembly of NCF-covered known good dies
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Yuka Ito; Mariappan Murugesan; Takafumi Fukushima; Kang-Wook Lee; Koji Choki; Tetsu Tanaka; Mitsumasa Koyanagi
Year: 2014
Maskless screen printing technology for 20μm-pitch, 52InSn solder interconnections in display applications
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Kwang-Seong Choi; Haksun Lee; Hyun-Cheol Bae; Yong-Sung Eom
Year: 2014
Accelerated SLID bonding using thin multi-layer copper-solder stack for fine-pitch interconnections
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Chinmay Honrao; Ting-Chia Huang; Makoto Kobayashi; Vanessa Smet; P. Markondeya Raj; Rao Tummala
Year: 2014
Low-pressure sintering bonding with Cu and CuO flake paste for power devices
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:S. W. Park; R. Uwataki; S. Nagao; T. Sugahara; Y. Katoh; H. Ishino; K. Sugiura; K. Tsuruta; K. Suganuma
Year: 2014
Novel system-in-package design and packaging solution for solid state lighting systems
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Mingzhi Dong; Fabio Santagata; Jia Wei; Cadmus Yuan; Guoqi Zhang
Year: 2014
Implantable device including a MEMS accelerometer and an ASIC chip encapsulated in a hermetic silicon box for measurement of cardiac physiological parameter
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Jean-Charles Souriau; Laetitia Castagne; Guy Parat; Gilles Simon; Karima Amara; Philippe D'hiver; Renzo Dal Molin
Year: 2014
Capping technologies for wafer level MEMS packaging based on permanent and temporary wafer bonding
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:K. Zoschke; M. Wilke; M. Wegner; K. Kaletta; C.-A Manier; H. Oppermann; M. Wietstruck; B. Tillack; M. Kaynak; K.-D Lang
Year: 2014
SIMEIT-project: High precision inertial sensor integration on a modular 3D-Interposer platform
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Wolfram Steller; Christoph Meinecke; Knut Gottfried; Gregor Woldt; Wolfgang Günther; M. Juergen Wolf; K. Dieter Lang
Year: 2014
Cu Pillar flip chip assembly: Chip attach process failure mode study
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Shengmin Wen; Bora Baloglu; Guangfeng Li
Year: 2014
Modeling microstructure effects on electromigration in lead-free solder joints
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Jiamin Ni; Yong Liu; Jifa Hao; Antoinette Maniatty; Barry O'Connell
Year: 2014
Modeling, design and demonstration of multi-die embedded WLAN RF front-end module with ultra-miniaturized and high-performance passives
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Srikrishna Sitaraman; Yuya Suzuki; Christopher White; Vijay Nair; Telesphor Kamgaing; Frank Juskey; Sung Jin Kim; P. Markondeya Raj; Venky Sundaram; Rao Tummala
Year: 2014
Design of RF and thermal pads of CMOS PAs using copper to copper bonding technology
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Lih-Tyng Hwang; An-Yu Kuo
Year: 2014
A lead free joining technology for high temperature interconnects using Transient Liquid Phase Soldering (TLPS)
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Christian Ehrhardt; Matthias Hutter; Hermann Oppermann; Klaus-Dieter Lang
Year: 2014
The quantum theory of solid-state atomic bonding
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Chin C. Lee; Lianxi Cheng
Year: 2014
Effective method to disperse and incorporate Carbon nanotubes in electroless Ni-P deposits
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Sha Xu; Yan Cheong Chan; Xiaoxin Zhu; Hua Lu; Chris Bailey
Year: 2014
Electroless Ni-W-P alloy as a barrier layer between Zn-based high temperature solders and Cu substrates
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Li Liu; Longzao Zhou; Changqing Liu
Year: 2014
Cost and performance effective silicon interposer and Vertical Interconnect for 3D ASIC and memory integration
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Li Li; Mitsutoshi Higashi; Akihito Takano; Jie Xue; Gary Ikari
Year: 2014
Assembly and packaging of non-bumped 3D chip stacks on bumped substrates
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Bing Dang; Joana Maria; Qianwen Chen; Jae-Woong Nah; Paul Andry; Cornelia Tsang; Katsuyuki Sakuma; Christy Tyberg; Raphael Robertazzi; Michael Scheuermann; Michael Gaynes; John Knickerbocker
Year: 2014
The miniaturization of a micro-ball endoscope by SiP approach
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Xunxun Zhu; Jian Cai; Yu Chen; Yingke Gu; Xiang Xie; Qian Wang; Zhihua Wang; Xiaofeng Sun; Lixi Wan
Year: 2014
Design and demonstration of paper-thin and low-warpage single and 3D organic packages with chip-last embedding technology for smart mobile applications
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Sung Jin Kim; Zihan Wu; Makoto Kobayashi; Fuhan Liu; Vanessa Smet; P. Markondeya Raj; Venky Sundaram; Rao Tummala
Year: 2014
Manufacturing readiness of BVA technology for ultra-high bandwidth package-on-package
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Rajesh Katkar; Rey Co; Wael Zohni
Year: 2014
Improvement of substrate and package warpage by copper plating process optimization
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Omar Bchir; Houssam Jomaa; Chin Kwan Kim; Layal Rouhana; Kuiwon Kang; Milind Shah; Steve Bezuk
Year: 2014
Ultra low CTE (1.8 ppm/°C) core material for next generation thin CSP
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Tomohiko Kotake; Hikari Murai; Shin Takanezawa; Masato Miyatake; Masaaki Takekoshi; Masahisa Ose
Year: 2014
Demonstration of 3–5 μm RDL line lithography on panel-based glass interposers
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Hao Lu; Yutaka Takagi; Yuya Suzuki; Brett Sawyer; Robin Taylor; Venky Sundaram; Rao Tummala
Year: 2014
High acceleration board level reliability drop test using Dual Mass Shock Amplifier
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Andy Zhang
Year: 2014
Non-destructive crack and defect detection in SAC solder interconnects using cross-sectioning and X-ray micro-CT
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Pradeep Lall; Shantanu Deshpande; Junchao Wei; Jeff Suhling
Year: 2014
Reliability testing of wire bonds using pad resistance with van der Pauw method
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Michael Mayer; Samuel Kim
Year: 2014
Preparation of a Micro Rubidium vapor cell and its integration in a chip-scale atomic magnetometer
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Yu Ji; Jintang Shang; Youpeng Chen; Ching-Ping Wong
Year: 2014
Novel sealing technology for organic EL display and lighting by means of modified surface activated bonding method
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Takashi Matsumae; Masahisa Fujino; Tadatomo Suga
Year: 2014
Development of B-spline X-ray Diffraction Imaging techniques for die warpage and stress monitoring inside fully encapsulated packaged chips
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:C. S. Wong; A. Ivankovic; A. Cowley; N. S. Bennett; A. N. Danilewsky; M. Gonzalez; V. Cherman; B. Vandevelde; I. De Wolf; P. J. McNally
Year: 2014
Process optimization and reliability study for Cu wire bonding advanced nodes
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Ivy Qin; Hui Xu; Basil Milton; Nestor Mendoza; Horst Clauberg; Bob Chylak; Hidenori Abe; Dongchul Kang; Yoshinori Endo; Masahiko Osaka; Shinya Nakamura
Year: 2014
Silver-assisted copper wire bonding using solid-state processes
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Yi-Ling Chen; Yuan-Yun Wu; Chin C. Lee
Year: 2014
Ag alloy wire characteristic and benefits
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Jensen Tsai; Albert Lan; D. S. Jiang; Li Wei Wu; Joseph Huang; J. B. Hong
Year: 2014
Copper versus palladium coated copper wire process and reliability differences
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Chu-Chung Stephen Lee; TuAnh Tran; Dan Boyne; Leo Higgins; Andrew Mawer
Year: 2014
Improving the bond quality of copper wire bonds using a friction model approach
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Simon Althoff; Jan Neuhaus; Tobias Hemsel; Walter Sextro
Year: 2014
High aspect ratio lithography for litho-defined wire bonding
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Zahra Kolahdouz Esfahani; Henk van Zeijl; G. Q. Zhang
Year: 2014
Comprehensive intermetallic compound phase analysis and its thermal evolution at Cu wirebond interface
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:In-Tae Bae; Dae Young Jung; Jenny Chang; Scott Chen
Year: 2014
Removed organic solderability preservative (OSPs) by Ar/O2 microwave plasma to improve solder joint in thermal compression flip chip bonding
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Jr-Wei Peng; Yan-Siang Chen; Yi Chen; Jiang-Long Liang; Kwang-Lung Lin; Yuh-Lang Lee
Year: 2014
A PoP structure to support I/O over 2000
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Dyi-Chung Hu; Puru Lin; Yu Hua Chen; Chun-Ting Lin
Year: 2014
Parameter optimization in assembly manufacturing process for a power module
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Yumin Liu; Yong Liu
Year: 2014
Automated inspection and metrology for 2.5D and 3D/TSV process assurance
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:James Wood; Vilmarie Soler; Eric Perfecto; Thomas Luckenbach; Aki Shoukrun
Year: 2014
Design and fabrication of low-pressure piezoresistive MEMS sensor for fuel cell electric vehicles
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Minkyu Lee; Kiyoung Nam; Sengyong Lee; Hakgu Kim; Chimyung Kim; Yongsun Park; Byungki Ahn; Taewan Kim; Hochul Seo
Year: 2014
Demonstration of TCNCP flip chip reliability with 30μm pitch Cu bump and substrate with thin Ni and thick Au surface finish
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Weihong Zhang; Shengping Hong; Xiaolong Yan; Feng Zhou; Hailun Lu; Haijun Shen; Tonglong Zhang
Year: 2014
Integrated process characterization and fabrication challenges for 2.5D IC packaging utilizing silicon interposer with backside via reveal process
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Cheng-Hsiang Liu; Jyun-Ling Tsai; Hung-Hsien Chang; Chang-Lun Lu; Shih-Ching Chen
Year: 2014
Very thin POP and SIP packaging approaches to achieve functionality integration prior to TSV implementation
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Fernando Roa
Year: 2014
A study on the fine pitch chip interconnection using Cu/SnAg bumps and B-stage non-conductive films (NCFs) for 3D-TSV vertical interconnection
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Yongwon Choi; Jiwon Shin; Young Soon Kim; Kyung-lim Suk; Il Kim; Kyung-Wook Paik
Year: 2014
Novel TSV process technologies for 2.5D/3D packaging
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Y. Morikawa; T. Murayama; T. Sakuishi; A. Suzuki; Y. Nakamuta; K. Suu
Year: 2014
High vacuum wafer level packaging for high-value MEMS applications
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:S. Nicolas; F. Greco; S. Caplet; C. Coutier; C. Dressler; M. Audoin; X. Baillin; G. Dehag; F. Souchon; S. Fanget
Year: 2014
Effects of various environmental conditions on the electrical properties and interfacial reliability of printed Ag / polyimide system
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Byung-Hyun Bae; Min-Su Jeong; Byeong Rok Lee; Joung-Hoon Choo; Eun-Kuk Choi; Jong-Sun Yoon; Young-Bae Park
Year: 2014
Warpage characterization of panel Fan-out (P-FO) package
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Hung-Wen Liu; Yi-Wei Liu; Jason Ji; Jash Liao; Agassi Chen; Yan-Heng Chen; Nicholas Kao; Yi-Che Lai
Year: 2014
A novel double layer NCF for highly reliable micro-bump interconnection
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Ji-Won Shin; Yong-Won Choi; Young Soon Kim; Un Byung Kang; Sun Kyung Seo; Kyung-Wook Paik
Year: 2014
Effects of pad surface finish on interfacial reliabilities of Cu-pillar/Sn-Ag bumps of 2.5D TSV-enterposer on PCB applications
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Youngsoon Kim; Ji-won Shin; Young won Choi; Kyung-Wook Paik
Year: 2014
Novel low temperature curable photo-sensitive insulator
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Kenji Okamoto; Hikaru Mizuno; Tomohiko Sakurai; Katsumi Inomata
Year: 2014
3D and 2.5D packaging assembly with highly silica filled One Step Chip Attach Materials for both thermal compression bonding and mass reflow processes
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Daniel Duffy; Chris Gregory; Christopher Breach; Alan Huffman
Year: 2014
High throughput roller type nano-pattern transfer technique on both rigid flexible substrates and mold deformation analysis under atmospheric imprint environment
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Yinsheng Zhong; Matthew M. F. Yuen
Year: 2014
Wet etching of deep trenches on silicon with three-dimensional (3D) controllability
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Liyi Li; Ching-Ping Wong
Year: 2014
3D Integration and assembly of wireless sensor nodes for ‘green’ sensor networks
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Jian Lu; Hironao Okada; Toshihiro Itoh; Takeshi Harada; Ryutaro Maeda
Year: 2014
Transferrable fine pitch probe technology
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Y. Liu; S. L. Wright; B. Dang; P. Andry; R. Polastre; J. Knickerbocker
Year: 2014
Process, assembly and electromigration characteristics of glass interposer for 3D integration
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Chun-Hsien Chien; Ching-Kuan Lee; Chun-Te Lin; Yu-Min Lin; Chau-Jie Zhan; Hsiang-Hung Chang; Chao-Kai Hsu; Huan-Chun Fu; Wen-Wei Shen; Yu-Wei Huang; Cheng-Ta Ko; Wei-Chung Lo; Yung Jean Rachel Lu
Year: 2014
A wafer level through-stack-via integration process with one-time bottom-up copper filling
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Yunhui Zhu; Shenglin Ma; Xin Sun; Runiu Fang; Xiao Zhong; Yuan Bian; Yong Guan; Jing Chen; Min Miao; Yufeng Jin
Year: 2014
Effect of joint shape controlled by thermocompression bonding on the reliability performance of 60цm-pitch solder micro bump interconnections
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Yu-Wei Huang; Chau-Jie Zhan; Jing-Ye Juang; Lin Yu-Mn; Shin-Yi Huang; Su-Mei Chen; Chia-Wen Fan; Ren-Shin Cheng; Shu-Han Chao; Wan-Lin Hsieh; Chih Chen; John H. Lau
Year: 2014
Development of micro bump joints fabrication process using cone shape Au bumps for 3D LSI chip stacking
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Fumito Imura; Naoya Watanabe; Shunsuke Nemoto; Wei Feng; Katsuya Kikuchi; Hiroshi Nakagawa; Masashiro Aoyagi
Year: 2014
Investigation of low-temperature deposition high-uniformity coverage Parylene-HT as a dielectric layer for 3D interconnection
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Bui Thanh Tung; Xiaojin Cheng; Naoya Watanabe; Fumiki Kato; Katsuya Kikuchi; Masahiro Aoyagi
Year: 2014
Large low-CTE glass package-to-PCB interconnections with solder strain-relief using polymer collars
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Gary Menezes; Vanessa Smet; Makoto Kobayashi; Venky Sundaram; Pulugurtha Markondeya Raj; Rao Tummala
Year: 2014
The study of bare-die FCBGA die damage in response to applied mechanical stress during heat sink assembly
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Heidi S. Y. Ho; Daijiao Wang; Michael Johnson; C. J. Berry
Year: 2014
Prognostication of copper-aluminum wirebond reliability under high temperature storage and temperature-humidity
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Pradeep Lall; Shantanu Deshpande; Luu Nguyen; Masood Murtuza
Year: 2014
Bump pattern optimization and stress comparison study for DCA packages
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Akash Agrawal; Owen Fay; Mark Johnson
Year: 2014
Comprehensive design optimization for 2.133 Gbps LPDDR3 extension for mobile platform system
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Chanmin Jo; Jaemin Shin; BaekKyu Choi; Sangmin Lee; Seongjae Moon; Sungjoo Kim; Woong Hwan Ryu
Year: 2014
Embedded diodes for microwave and millimeter wave circuits
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Xianbo Yang; Amanpreet Kaur; Premjeet Chahal
Year: 2014
A low-cost PCB fabrication process
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Jack Ou; Alberto Maldonado; Chio Saephan; Farid Farahmand; Michael Caggiano
Year: 2014
Study of microwave circuits based on Metal-Insulator-Metal (MIM) diodes on flex substrates
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Amanpreet Kaur; Xianbo Yang; Premjeet Chahal
Year: 2014
Nanocomposite pastes for thermal and mechanical bonding
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Tingting Zhang; Bahgat Sammakia; Howard Wang
Year: 2014
Assembly and packaging technologies for high-temperature and high-power GaN HEMTs
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:A. A. Bajwa; Y. Qin; J. Wilde; R. Reiner; P. Waltereit; R. Quay
Year: 2014
Flip-chip on glass (FCOG) package for low warpage
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Scott R. McCann; Venkatesh Sundaram; Rao R. Tummala; Suresh K. Sitaraman
Year: 2014
Directed self-assembly of mesoscopic dies using magnetic force and shape recognition
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Anton Tkachenko; Robert F. Karlicek; James J.-Q Lu
Year: 2014
Controlled silicon IC thinning on individual die level for active implant integration using a purely mechanical process
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Vasiliki Giagka; Nooshin Saeidi; Andreas Demosthenous; Nick Donaldson
Year: 2014
Study of extreme low temperature and load solid-phase Sn-Ag system bonding mechanism for 3D ICs
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Kiyoto Yoneta; Ryohei Sato; Yoshiharu Iwata; Koichiro Atsumi; Kazuya Okamoto; Yukihiro Satio; Takumi Shigemoto
Year: 2014
Self-patterning, pre-applied underfilling technology for stack-die packaging
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Chia-Chi Tuan; Ziyin Lin; Yan Liu; Kyoung-Sik Moon; Ching-Ping Wong
Year: 2014
The effects of self-fluxing additives in solder anisotropic conductive films (ACFs) on solder wettability and joint reliability of flex-on-board (FOB) assemblies
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Seung-Ho Kim; Yongwon Choi; Yoosun Kim; Kyung-Wook Paik
Year: 2014
Adhesion and reliability of direct Cu metallization of through-package vias in glass interposers
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Timothy Huang; Venky Sundaram; P. Markondeya Raj; Himani Sharma; Rao Tummala
Year: 2014
Interfacial reactions between Cu and Sn, Sn-Ag, Sn-Bi, Sn-Zn solder under space confinement for 3D IC micro joint applications
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:T. L. Yang; W. L. Shih; J. J. Yu; C. R. Kao
Year: 2014
A novel molding process for wafer level LED packaging using uniform micro glass bubble arrays
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Yu Zou; Jintang Shang; Yu Ji; Li Zhang; Chiming Lai; Dong Chen; Kim-Hui Chen; Ching-Ping Wong
Year: 2014
Analysis of room-temperature bonded compliant bump with ultrasonic bonding
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Keiichiro Iwanabe; Takanori Shuto; Tanemasa Asano
Year: 2014
Nanostructured TiO2/HAp bioceramic coatings obtained by induction heat treatment of implants
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Aleksandr Fomin; Igor Rodionov; Marina Fomina; Aleksey Steinhauer; Natalia Petrova; Andrey Zakharevich; Aleksandr Scaptsov; Andrey Gribov
Year: 2014
Field emission properties of a blade cathode based on a carbon foil
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Oxana E. Makarova; Evgeny P. Sheshin
Year: 2014
Modeling methods of the test inputs for analysis the digital devices
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Vladimir I. Melnik; Alexander N. Mikhailov; Valery M. Grishkin; Dmitri A. Ovsyannikov; Yevgeny V. Yelaev
Year: 2014
An abnormal thermal field emission high brightness and stability point electron source
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Valery E. Ptitsin
Year: 2014
New approach to thermal-to-electrical energy conversion problem on the bases of the thermal field electron emission phenomenon
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Valery E. Ptitsin
Year: 2014
Stress distribution in the neighborhood of a corrosion pit on the outer surface of an elastic spherical shell
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Olga S. Sedova
Year: 2014
Nanooptics and electrons: From strong-field physics at needle tips to dielectric laser acceleration
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Michael Kruger; Sebastian Thomas; John Breuer; Michael Forster; Dominik Ehberger; Jakob Hammer; Takuya Higuchi; Anoush Aghajani-Talesh; Joshua McNeur; Philipp Weber; Peter Hommelhoff
Year: 2014
Field emission properties of vertically grown Carbon Nanotubes, Nanoflakes and mechanically exfoliated Highly Oriented Pyrolitic Graphite: A comparison
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:C. V. Dharmadhikari; S. K. Kolekar; Vishakha Kaushik; V. D. Vankar; S. P. Patole; J. B. Yoo
Year: 2014
Field emission characteristics of graphite field emitters
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Yusuke Iwai; Takayoshi Koike; Atsuo Jyouzuka; Tomonori Nakamura; Yoshihiro Onizuka; Yoichiro Neo; Hidenori Mimura
Year: 2014
Surface characterization of Zr/O/W Schottky emitter using AES and TOF-SIMS
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Soichiro Matsunaga; Souichi Katagiri
Year: 2014
Sub-nanosecond electrical gating for metal Field Emitter Arrays
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Martin Paraliev; Soichiro Tsujino; Christopher Gough
Year: 2014
Emission structure stability investigation in alternating and reverse polarity electrical fields
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:S. V. Filippov; A. G. Kolosko; E. O. Popov; P. A. Romanov
Year: 2014
Stable emission characteristics of nanometer-order size Transfer Mold field emitter arrays with in-situ radical treatment
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Masayuki Nakamoto; Jonghyun Moon
Year: 2014
Elementary framework for cold field emission: Extension to non-planar emitter tip geometries
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Alex Andrew Patterson; Akintunde Ibitayo Akinwande
Year: 2014
Mass-spectrum investigation of the phenomena accompanying the field electron emission
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:E. O. Popov; A. G. Kolosko; S. V. Filippov; I. L. Fedichkin; P. A. Romanov
Year: 2014
Growth of a single graphene sheet on a tungsten tip
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Shuai Tang; Yu Zhang; Shaozhi Deng; Jun Chen; Ningsheng Xu
Year: 2014
Field emission beam characteristics of a double-gate single nanoemitter
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Chiwon Lee; Pratyush Das Kanungo; Vitaliy Guzenko; Patrick Hefenstein; Soichiro Tsujino; Gunther Kassier; Albert Casandruc; R. J. Dwayne Miller
Year: 2014
Fabrication and simulation of silicon structures with high aspect ratio for field emission devices
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Robert Lawrowski; Christoph Langer; Christian Prommesberger; Florian Dams; Michael Bachmann; Rupert Schreiner
Year: 2014
Vertical MEMS-type field-emission electron source
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Tomasz Grzebyk; Anna Gorecka-Drzazga; Jan A. Dziuban
Year: 2014
Multi-electron-beam nanoelectronics
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:P. Kruit
Year: 2014
High aspect ratio silicon tip cathodes for application in field emission electron sources
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Christoph Langer; Robert Lawrowski; Christian Prommesberger; Florian Dams; Pavel Serbun; Michael Bachmann; Gunter Muller; Rupert Schreiner
Year: 2014
Current limitation in large-area self-aligned gated field emission arrays
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Arash A. Fomani; Michael E. Swanwick; Luis F. Velasquez-Garcia; Akintunde I. Akinwande
Year: 2014
Fabrication of spindt-type double-gated field-emitters using photoresist lift-off layer
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:M. Nagao; S. Yoshizawa
Year: 2014
Field emission applications of graphene
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Matthew T. Cole; William I. Milne; Chi Li; Wei Lei; Boaping Wang; Toby Hallam; Georg S. Duesberg
Year: 2014
Gaussian-based adaptive fuzzy control
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:A. Zelenak; M. Pryor
Year: 2014
A fuzzy logic system for evaluating financial profit ratios
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Carlos Cubaque-Zorro; Juan Carlos Figueroa-Garcia
Year: 2014
Fuzzy logic with evaluated syntax for sound geometric reasoning with geographic information
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Gwendolin Wilke
Year: 2014
New ways to calculate centers for interval data in fuzzy clustering algorithms
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Liliane Silva; Ronildo Moura; Anne Canuto; Regivan Santiago; Benjamin Bedregal
Year: 2014
Driving style imitation in simulated car racing using style evaluators and multi-objective evolution of a fuzzy logic controller
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Tsaipei Wang; Keng-Te Liaw
Year: 2014
A consensus reaching support system based on concepts of ideal and anti-ideal point
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Dominika Golunska; Janusz Kacprzyk; Slawomir Zadrozny
Year: 2014
An interval type-2 fuzzy logic system for dynamic parameter adaptation in particle swarm optimization
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Frumen Olivas; Fevrier Valdez; Oscar Castillo
Year: 2014
Wiener's conjecture about transformation groups helps predict which fuzzy techniques work better
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Francisco Zapata; Olga Kosheleva; Vladik Kreinovich
Year: 2014
Multi-central general fuzzy clustering model
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Samira Malek Mohamadi Golsefid; Mohammad Fazel Zarandi
Year: 2014
A proof of stability of model-free control
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Emmanuel Delaleau
Year: 2014
Discrete signals, feedback and oscillation
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Yoshifumi Okuyama
Year: 2014
Wiener's refiguring of a cybernetic design theor
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Thomas Fischer
Year: 2014
Behavior, organization, substance: Three gestalts of general systems theory
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Vincenzo De Florio
Year: 2014
Cybernetics and contemporary philosophies of technology
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Michael Arnold; Paul Siemers; Greg Adamson
Year: 2014
Norbert Wiener on technology and society
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Greg Adamson
Year: 2014
Was Norbert Wiener a metaphysician?
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Sara Touiza-Ambroggiani
Year: 2014
Reproducing our humanity: Cloud self
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Madhusudan Raman
Year: 2014
Modernist feedback loops: Norbert Wiener's cybernetics and the poetry of Ezra Pound
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Heather A. Love
Year: 2014
Self-organization and novelty: Pre-configurations of emergence in early British cybernetics
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Joan Soler-Adillon; Simon Penny
Year: 2014
It takes a polymath: Norbert Wiener's influence on the early internet
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Elizabeth Folan O'Connor
Year: 2014
Ultra thinning down to 4-µm using 300-mm wafer proven by 40-nm node 2Gb DRAM for 3D multi-stack WOW applications
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Y. S. Kim; S. Kodama; Y. Mizushima; N. Maeda; H. Kitada; K. Fujimoto; T. Nakamura; D. Suzuki; A. Kawai; K. Arai; T. Ohba
Year: 2014
Sub-100 nm regrown S/D Gate-Last In0.7Ga0.3As QW MOSFETs with μn,eff > 5,500 cm2/V-s
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:C-S Shin; W-K Park; S. H. Shin; Y. D. Cho; D. H. Ko; T-W Kim; D. H. Koh; H. M. Kwon; R. J. W. Hill; P. Kirsch; W. Maszara; D-H Kim
Year: 2014
Verification on the extreme scalability of STT-MRAM without loss of thermal stability below 15 nm MTJ cell
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Ju Hyun Kim; W. C. Lim; U. H. Pi; J. M. Lee; W. K. Kim; J. H. Kim; K. W. Kim; Y. S. Park; S. H. Park; M. A. Kang; Y. H. Kim; W. J. Kim; S. Y. Kim; J. H. Park; S. C. Lee; Y. J. Lee; J. M. Yoon; S. C. Oh; S. O. Park; S. Jeong; S. W. Nam; H. K. Kang; E. S. Jung
Year: 2014
Comprehensive statistical investigation of STT-MRAM thermal stability
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Karl Hofmann; Klaus Knobloch; Christian Peters; Robert Allinger
Year: 2014
Thermally robust CMOS-aware Ge MOSFETs with high mobility at high-carrier densities on a single orientation Ge substrate
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:C. H. Lee; C. Lu; T. Nishimura; K. Nagashio; A. Toriumi
Year: 2014
Utilizing Sub-5 nm sidewall electrode technology for atomic-scale resistive memory fabrication
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Kai-Shin Li; ChiaHua Ho; Ming-Taou Lee; Min-Cheng Chen; Cho-Lun Hsu; J. M. Lu; C. H. Lin; C. C. Chen; B. W. Wu; Y. F. Hou; C. Yi Lin; Y. J. Chen; T. Y. Lai; M. Y. Li; I. Yang; C. S. Wu; Fu-Liang Yang
Year: 2014
What can we do about barrier layer scaling to 5 nm node technology ?
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Junichi Koike
Year: 2014
3D CMOS-MEMS stacking with TSV-less and face-to-face direct metal bonding
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:S. L. Chua; A. Razzaq; K. H. Wee; K. H. Li; H. Yu; C. S. Tan
Year: 2014
IoT design space challenges: Circuits and systems
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:D. Blaauw; D. Sylvester; P. Dutta; Y. Lee; I. Lee; S. Bang; Y. Kim; G. Kim; P. Pannuto; Y.-S Kuo; D. Yoon; W. Jung; Z. Foo; Y.-P Chen; S. Oh; S. Jeong; M. Choi
Year: 2014
Chip Package Interaction with fine pitch Cu pillar bump using mass reflow and thermal compression bonding assembly process for 20nm/16nm and beyond
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Lily Zhao; Andy Bao; Yangyang Sun; Chun-Jen Chen; Scott Tsai; Kenny Lee; Xuefeng Zhang; Dan Perry; Tor Kalleberg; Michael Han; Steve Bezuk; Geoffrey Yeap
Year: 2014
Advanced 1.1um pixel CMOS image sensor with 3D stacked architecture
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:J. C. Liu; D. N. Yaung; J. J. Sze; C. C. Wang; Gene Hung; C. J. Wang; T. H. Hsu; R. J. Lin; T. J. Wang; W. D. Wang; H. Y. Cheng; J. S. Lin; S. J. Tsai; S. T. Tsai; C. C. Chuang; W. I. Hsu; S. Y. Chen; K. C. Huang; W. H. Wu; S. Takahashi; Y. L. Tu; C. S. Tsai; R. L. Lee; W. P. Mo; F. J. Shiu; Y. P. Chao; S. G. Wuu
Year: 2014
Lessons Learned from and for Requirements Engineering and Building Construction: A Case Study of Requirements Engineering for a Synagogue Kitchen with Use Cases and Scenarios
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Cyril Mauger; Daniel M. Berry
Year: 2014
Experiences from an industry-wide initiative for setting metadata for regulatory requirements in the nuclear domain
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Eero Uusitalo; Mikko Raatikainen; Mikko Ylikangas; Tomi Mannisto
Year: 2014
Current and necessary insights into SACM: An analysis based on past publications
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Jose Luis de la Vara
Year: 2014
A critical analysis of legal requirements engineering from the perspective of legal practice
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Guido Boella; Llio Humphreys; Robert Muthuri; Piercarlo Rossi; Leendert van der Torre
Year: 2014
The role of power in legal compliance
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Robert Muthuri; Sepideh Ghanavati; Andre Rifaut; Llio Humphreys; Guido Boella
Year: 2014
On lawful disclosure of personal user data: What should app developers do?
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Yung Shin Van Der Sype; Walid Maalej
Year: 2014
Usability issues for systems supporting requirements extraction from legal documents
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Nicola Zeni; Luisa Mich
Year: 2014
Towards a legal compliance verification approach on the procurement process of IT solutions for the Brazilian Federal Public Administration
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Lamartine da Silva Barboza; Gilberto A. de A Cysneiros Filho; Ricardo A. C. de Souza
Year: 2014
Modeling requirements: The customer communication
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Dan Matheson
Year: 2014
Semantic annotation of a formal grammar by SemanticPatterns
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Mathias Schraps; Maximilian Peters
Year: 2014
Threat and countermeasure patterns for cloud computing
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Takao Okubo; Yoshiro Wataguchi; Nobuyuki Kanaya
Year: 2014
Using non-functional requirements templates for elicitation: A case study
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Sylwia Kopczynska; Jerzy Nawrocki
Year: 2014
A/B testing: A promising tool for customer value evaluation
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Peitsa Hynninen; Marjo Kauppinen
Year: 2014
A model-based approach to innovation management of automotive control systems
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Mario Gleirscher; Andreas Vogelsang; Steffen Fuhrmann
Year: 2014
Derivation of different types of antenna reflectors from the principle of highly flexible structures
Publisher: European Association on Antennas and Propagation (EurAAP)
Authors:Leri Datashvili; Horst Baier
Year: 2014
A miniaturised dual band artificial magnetic conductor using interdigital capacitance
Publisher: European Association on Antennas and Propagation (EurAAP)
Authors:Rola Saad; Kenneth L. Ford
Year: 2014
Cost-efficient dual-stage Gaussian process modeling of antennas
Publisher: European Association on Antennas and Propagation (EurAAP)
Authors:J. Pieter Jacobs; Slawomir Koziel
Year: 2014
A review on the electromagnetic characterisation of building materials at micro- and millimetre wave frequencies
Publisher: European Association on Antennas and Propagation (EurAAP)
Authors:David Ferreira; Inigo Cuinas; Rafael F. S. Caldeirinha; Telmo R. Fernandes
Year: 2014
The many guises of HTS antennas
Publisher: European Association on Antennas and Propagation (EurAAP)
Authors:H. Fenech; S. Amos; A. Tomatis; J. Serrano Merino; V. Soumpholphakdy
Year: 2014
CNES and multibeam antennas, a decade of joint venture
Publisher: European Association on Antennas and Propagation (EurAAP)
Authors:H. Gonzalez-Perez; C. Laporte; B. Palacin
Year: 2014
Satellite multibeam antennas at airbus defence and space: State of the art and trends
Publisher: European Association on Antennas and Propagation (EurAAP)
Authors:Helmut Wolf; Michael Schneider; Simon Stirland; Didier Scouarnec
Year: 2014
Micromachined periodic surfaces for planar terahertz antennas
Publisher: European Association on Antennas and Propagation (EurAAP)
Authors:Konstantinos Konstantinidis; Alexandros P. Feresidis; Michael J. Lancaster
Year: 2014
Design of a circular antenna array for MIMO channel sounding application at 2.53 GHz
Publisher: European Association on Antennas and Propagation (EurAAP)
Authors:Robert Muller; Martin Kaske; Peter Rauschenbach; Gerd Sommerkorn; Christian Schneider; Frank Wollenschlager; Stephan Hafner; Reiner S. Thoma
Year: 2014
Exomars high gain TTC antenna overview
Publisher: European Association on Antennas and Propagation (EurAAP)
Authors:D. Dubruel; P. Y. Renaud; C. Dreyer; J. P. Langevin; T. Tralman; J. F. Durocher-de-Grandpre; S. Larouche; M. Lanuti; P. Noschese; M. Cova; A. Winton; E. Saenz; P. de Maagt
Year: 2014
Fundamental limitations on small multi-beam antennas for MIMO systems
Publisher: European Association on Antennas and Propagation (EurAAP)
Authors:Per-Simon Kildal; Xiaoming Chen
Year: 2014
Pulse shape optimization in time-modulated arrays for sideband radiation suppression
Publisher: European Association on Antennas and Propagation (EurAAP)
Authors:Lorenzo Poli; Ephrem T. Bekele; Michele D'Urso; Paolo Rocca; Andrea Massa
Year: 2014
Magneto-dielectric material characterization and antenna design for RF applications
Publisher: European Association on Antennas and Propagation (EurAAP)
Authors:Kyu Han; Madhavan Swaminathan; Raj Pulugurtha; Himani Sharma; Rao Tummala; Vijay Nair
Year: 2014
Novel method to measure the gain of UHF directional antennas using distance scan
Publisher: European Association on Antennas and Propagation (EurAAP)
Authors:Ben A. Witvliet; Erik van Maanen; Mark J. Bentum; Cornelis H. Slump; Roel Schiphorst
Year: 2014
Recent developments on multi-beam antennas at Boeing
Publisher: European Association on Antennas and Propagation (EurAAP)
Authors:Parthasarathy Ramanujam; Louis R. Fermelia
Year: 2014
Advancements in large mesh reflector technology for multi-beam antenna applications
Publisher: European Association on Antennas and Propagation (EurAAP)
Authors:David Alexander; Philip Henderson; Greg Turner
Year: 2014
Elements reduction using optimum size element of array-fed reflector antenna in 100-beam-class multi-beam communications satellite
Publisher: European Association on Antennas and Propagation (EurAAP)
Authors:Shin-ichi Yamamoto; Takashi Yanagi; Yoshio Inasawa; Hiroaki Miyashita; Teruaki Orikasa; Amane Miura
Year: 2014
Auto-correlation and cross-correlation analysis for sport arenas at 850 MHz and 2.1 GHz
Publisher: European Association on Antennas and Propagation (EurAAP)
Authors:Alejandro Aragon-Zavala; Vladan Jevremovic; Ali Jemmali
Year: 2014
Low-profile polarizing surface with dual-band operation in orthogonal polarizations for broadband satellite applications
Publisher: European Association on Antennas and Propagation (EurAAP)
Authors:Nelson J. G. Fonseca; Cyril Mangenot
Year: 2014
Evaluation of deep space Ka-band data transfer using radiometeorological forecast models
Publisher: European Association on Antennas and Propagation (EurAAP)
Authors:M. Biscarini; F. S. Marzano; L. Iess; M. Montopoli; K. De Sanctis; S. Di Fabio; L. Bernardini; M. Gregnanin; M. Parisi; M. Montagna; M. Mercolino; M. Lanucara
Year: 2014
Ka-band atmospheric phase stability measurements in Goldstone, CA; White Sands, NM; and Guam
Publisher: European Association on Antennas and Propagation (EurAAP)
Authors:Michael J. Zemba; Jacquelynne R. Morse; James A. Nessel
Year: 2014
Modeling of joint rainfall rate and rain attenuation statistics using Archimedean Copula functions
Publisher: European Association on Antennas and Propagation (EurAAP)
Authors:Charilaos I. Kourogiorgas; Spiros N. Livieratos; Athanasios D. Panagopoulos; George E. Chatzarakis
Year: 2014
Performance of SatCom systems implementing time diversity in equatorial Malaysia
Publisher: European Association on Antennas and Propagation (EurAAP)
Authors:H. Y. Lam; L. Luini; J. Din; C. Capsoni; A. D. Panagopoulos
Year: 2014
Comparison of image quality metrics for electromagnetic wave propagation speed estimation in Breast Microwave Radar imaging scenarios
Publisher: European Association on Antennas and Propagation (EurAAP)
Authors:D. Rodriguez-Herrera; D. Flores-Tapia; S. Pistorius
Year: 2014
Exploiting Proper Orthogonal Decomposition for the solution of forward and inverse ECG and EEG related biomedical problems
Publisher: European Association on Antennas and Propagation (EurAAP)
Authors:Ilias Aitidis; George Kyriacou; John Sahalos
Year: 2014
A tracking algorithm for the eigenvectors calculated with characteristic mode analysis
Publisher: European Association on Antennas and Propagation (EurAAP)
Authors:D. J. Ludick; U. Jakobus; M. Vogel
Year: 2014
Frequency selective building facades
Publisher: European Association on Antennas and Propagation (EurAAP)
Authors:Pavel Valtr; Tianyou Yu; Wenkang Zhao; Pavel Pechac; Hasim Altan; Lee Ford
Year: 2014
An Interval Arithmetic-based robustness evaluation of sub-arrayed linear array antenna architectures
Publisher: European Association on Antennas and Propagation (EurAAP)
Authors:Lorenzo Poli; Luca Manica; Paolo Rocca; Andrea Massa
Year: 2014
Design of thinned arrays with controlled sidelobes by ADS-CP strategy
Publisher: European Association on Antennas and Propagation (EurAAP)
Authors:Davide Sartori; Luca Manica; Giacomo Oliveri; Andrea Massa
Year: 2014
Rain attenuation variability calculated from a slant-path Ka-band experiment
Publisher: European Association on Antennas and Propagation (EurAAP)
Authors:Jose M. Garcia-Rubia; Jose M. Riera; Pedro Garcia-del-Pino; Gustavo A. Siles; Ana Benarroch
Year: 2014
On design of differentially driven on-chip antennas with harmonic filtering for silicon integrated mm-wave and THz N-push oscillators
Publisher: European Association on Antennas and Propagation (EurAAP)
Authors:Janusz Grzyb; Yan Zhao; Richard Al Hadi; Ullrich Pfeiffer
Year: 2014
S-band active array filtenna with enhanced X-band spurious interference suppression
Publisher: European Association on Antennas and Propagation (EurAAP)
Authors:Lorenzo Cifola; Giampiero Gerini; Simon van den Berg; Frank van de Water
Year: 2014
High order integral equation methods for the scattering of a superellipsoid
Publisher: European Association on Antennas and Propagation (EurAAP)
Authors:Felipe Vico; Miguel Ferrando-Bataller; Alejandro Valero-Nogueira; Antonio Berenguer
Year: 2014
What can integral equation do for array analysis ?
Publisher: European Association on Antennas and Propagation (EurAAP)
Authors:Anja K. Skrivervik
Year: 2014
Optimization of planar periodic leaky-wave antennas by selective surface-wave suppression
Publisher: European Association on Antennas and Propagation (EurAAP)
Authors:Symon K. Podilchak; Paolo Baccarelli; Paolo Burghignoli; Alois P. Freundorfer; Yahia M. M. Antar
Year: 2014
Inter-building propagation modelling for indoor wireless communications system deployment
Publisher: European Association on Antennas and Propagation (EurAAP)
Authors:Michael J. Neve; Martin Leung; John Cater
Year: 2014
Secure electromagnetic buildings
Publisher: European Association on Antennas and Propagation (EurAAP)
Authors:Jiayin Roberts; Kenneth L. Ford; Jonathon M. Rigelsford
Year: 2014
Propagation characterization of an office building in the 60 GHz band
Publisher: European Association on Antennas and Propagation (EurAAP)
Authors:Jonathan Lu; Daniel Steinbach; Patrick Cabrol; Phil Pietraski; Ravikumar V. Pragada
Year: 2014
Study of back-scattering from buildings using a 60 GHz scaled model
Publisher: European Association on Antennas and Propagation (EurAAP)
Authors:Jonathan S. Lu; Vittorio Degli-Esposti; Enrico Vitucci; Henry L. Bertoni
Year: 2014
Compact low-profile antenna for wireless medical vital sign monitors at 868 MHz
Publisher: European Association on Antennas and Propagation (EurAAP)
Authors:Gareth A. Conway; William G. Scanlon
Year: 2014
On-body channel correlation in various walking scenarios
Publisher: European Association on Antennas and Propagation (EurAAP)
Authors:Oudomsack Pierre Pasquero; Ramona Rosini; Raffaele D'Errico; Claude Oestges
Year: 2014
Analysis and design of microstrip antenna array using interdigital capacitor with CRLH-TL ground plane for multiband applications
Publisher: European Association on Antennas and Propagation (EurAAP)
Authors:Yasser M. Madany; Darwish A. Mohamed; Bishoy I. Halim
Year: 2014
Deciwavelength-scale fade mitigation
Publisher: European Association on Antennas and Propagation (EurAAP)
Authors:Jeff Frolik
Year: 2014


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