A relationship-based approach to model management
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Chechik, M.
Year: 2009
Applying software product line techniques in model-based embedded systems engineering
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Polzer, A.; Kowalewski, S.; Botterweck, G.
Year: 2009
A formal type-centric framework for verification and resource allocation in pervasive Sense-and-Respond systems
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Ocean, M.; Kfoury, A.; Bestavros, A.
Year: 2009
Verification of an abstract component using communication patterns
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Yunja Choi
Year: 2009
ArcheOpterix: An extendable tool for architecture optimization of AADL models
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Aleti, A.; Bjornander, S.; Grunske, L.; Meedeniya, I.
Year: 2009
Software development under bounded rationality and opportunism
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Erbas, C.; Erbas, B.C.
Year: 2009
End-to-end features as meta-entities for enabling coordination in geographically distributed software development
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Cataldo, M.; Herbsleb, J.D.
Year: 2009
Distributed Project Governance Assessment (DPGA): Contextual, hands-on analysis for project governance across sovereign boundaries
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Anderson, W.; Carney, D.
Year: 2009
Extending the boundary of spreadsheet programming: Lessons learned from Chinese governmental projects
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Xingliang Yu; Jing Li; Hua Zhong
Year: 2009
Autonomic virtual resource management for service hosting platforms
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Van, H.N.; Tran, F.D.; Menaud, J.-M.
Year: 2009
Network-aware migration control and scheduling of differentiated virtual machine workloads
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Stage, A.; Setzer, T.
Year: 2009
Virtualized recomposition: Cloudy or clear?
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Matthews, C.; Coady, Y.
Year: 2009
Taking account of privacy when designing cloud computing services
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Pearson, S.
Year: 2009
Experiencing with the Cloud over gLite
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Ragusa, C.; Longo, F.; Puliafito, A.
Year: 2009
Software deployment in a dynamic cloud: From device to service orientation in a hospital environment
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:van der Burg, S.; de Jonge, M.; Dolstra, E.; Visser, E.
Year: 2009
Model-Driven approach to Software Architecture design
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Perovich, D.; Bastarrica, M.C.; Rojas, C.
Year: 2009
Managing assumptions during agile development
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Ostacchini, I.; Wermelinger, M.
Year: 2009
An analysis of decision-centric architectural design approaches
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Wanfeng Bu; Tang, A.; Jun Han
Year: 2009
Making use of architecture throughout the software life cycle - How the build hierarchy can facilitate product line development
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Unphon, H.
Year: 2009
Towards an automated testing framework to manage variability using the UML Testing Profile
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Lamancha, B.P.; Usaola, M.P.; Velthius, M.P.
Year: 2009
An experimental study of methods for executing test suites in memory constrained environments
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Bhadra, S.; Conrad, A.; Hurkes, C.; Kirklin, B.; Kapfhammer, G.M.
Year: 2009
Security test generation using threat trees
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Marback, A.; Hyunsook Do; Ke He; Kondamarri, S.; Dianxiang Xu
Year: 2009
An effective method for keeping design artifacts up-to-date
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Ben-Chaim, Y.; Farchi, E.; Raz, O.
Year: 2009
Leveraging semantic data Wikis for distributed requirements elicitation
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Riechert, T.; Berger, T.
Year: 2009
Wiki-based requirements management for Business Process Reengineering
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Abeti, L.; Ciancarini, P.; Moretti, R.
Year: 2009
SmartWiki: Support for high-quality requirements engineering in a collaborative setting
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Knauss, E.; Brill, O.; Kitzmann, I.; Flohr, T.
Year: 2009
Investigating Wikis for software engineering - Results of two case studies
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Ras, E.
Year: 2009
Routing Metric Designs for Greedy, Face and Combined-Greedy-Face Routing
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Yujun Li; Yaling Yang; Xianliang Lu
Year: 2009
Monotonic Optimization for Non-Concave Power Control in Multiuser Multicarrier Network Systems
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Li Ping Qian; Ying Jun
Year: 2009
SEER: Metropolitan-Scale Traffic Perception Based on Lossy Sensory Data
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Zhu, H.; Zhu, Y.; Li, M.; Ni, L.M.
Year: 2009
On the Market Power of Network Coding in P2P Content Distribution Systems
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Xinyu Zhang; Baochun Li
Year: 2009
Accelerating Multi-Patterns Matching on Compressed HTTP Traffic
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Bremler-Barr, A.; Koral, Y.
Year: 2009
Traffic Engineering vs. Content Distribution: A Game Theoretic Perspective
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:DiPalantino, D.; Johari, R.
Year: 2009
Searching for Stability in Interdomain Routing
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Sami, R.; Schapira, M.; Zohar, A.
Year: 2009
BitTorrent: An Extensible Heterogeneous Model
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Chow, A.L.H.; Golubchik, L.; Misra, V.
Year: 2009
Minimizing Average Finish Time in P2P Networks
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Ezovski, G.M.; Ao Tang; Andrew, L.L.H.
Year: 2009
Packet Classification Algorithms: From Theory to Practice
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Yaxuan Qi; Lianghong Xu; Baohua Yang; Yibo Xue; Jun Li
Year: 2009
Controlling False Alarm/Discovery Rates in Online Internet Traffic Flow Classification
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Nechay, D.; Pointurier, Y.; Coates, M.
Year: 2009
Quantifying the Importance of Vantage Points Distribution in Internet Topology Measurements
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Shavitt, Y.; Weinsberg, U.
Year: 2009
Identifying High Cardinality Internet Hosts
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Cao, J.; Jin, Y.; Chen, A.; Bu, T.; Zhang, Z.-L.
Year: 2009
Minimum Maximum Degree Publish-Subscribe Overlay Network Design
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Onus, M.; Richa, A.W.
Year: 2009
Event Recognition in Sensor Networks by Means of Grammatical Inference
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Geyik, S.C.; Szymanski, B.K.
Year: 2009
On Mechanism Design without Payments for Throughput Maximization
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Moscibroda, T.; Schmid, S.
Year: 2009
Diverse Routing in Networks with Probabilistic Failures
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Hyang-Won Lee; Modiano, E.
Year: 2009
Computing the Capacity Region of a Wireless Network
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Gummadi, R.; Kyomin Jung; Shah, D.; Sreenivas, R.
Year: 2009
Failure Control in Multipath Route Tracing
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Veitch, D.; Augustin, B.; Teixeira, R.; Friedman, T.
Year: 2009
Optimal and scalable distribution of content updates over a mobile social network
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Ioannidis, S.; Chaintreau, A.; Massoulie, L.
Year: 2009
Exploiting Internet Delay Space Properties for Selecting Distinct Network Locations
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Bo Zhang; Ng, T.S.E.
Year: 2009
Economic Incentives to Increase Security in the Internet: The Case for Insurance
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Lelarge, M.; Bolot, J.
Year: 2009
EtherProxy: Scaling Ethernet By Suppressing Broadcast Traffic
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Elmeleegy, K.; Cox, A.L.
Year: 2009
A Measurement Based Rogue AP Detection Scheme
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Hao Han; Bo Sheng; Tan, C.C.; Qun Li; Sanglu Lu
Year: 2009
Joint Transport, Routing and Spectrum Sharing Optimization for Wireless Networks with Frequency-Agile Radios
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Zhenhua Feng; Yaling Yang
Year: 2009
Distributed Opportunistic Scheduling With Two-Level Channel Probing
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Chandrashekhar Thejaswi, P.S.; Junshan Zhang; Man-On Pun; Poor, H.V.
Year: 2009
Soft-TDMAC: A Software TDMA-Based MAC over Commodity 802.11 Hardware
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Djukic, P.; Mohapatra, P.
Year: 2009
Location Cloaking for Safety Protection of Ad Hoc Networks
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Xu, T.; Ying Cai
Year: 2009
ACTION: Breaking the Privacy Barrier for RFID Systems
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Li Lu; Jinsong Han; Renyi Xiao; Yunhao Liu
Year: 2009
Fundamental Limits on Secure Clock Synchronization and Man-In-The-Middle Detection in Fixed Wireless Networks
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Chiang, J.T.; Haas, J.J.; Yih-Chun Hu; Kumar, P.R.; Jihyuk Choi
Year: 2009
Towards Economically Viable Infrastructure-Based Overlay Multicast Networks
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Khare, V.; Zhang, B.
Year: 2009
Power-Aware Speed Scaling in Processor Sharing Systems
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Wierman, A.; Andrew, L.L.H.; Ao Tang
Year: 2009
Admissible Traces, Stability and Rate Management of Queueing / Switching Service Structures
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Mastroleon, L.
Year: 2009
The Impact of Mobility on Gossip Algorithms
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Sarwate, A.D.; Dimakis, A.G.
Year: 2009
On Video Multicast in Cognitive Radio Networks
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Donglin Hu; Shiwen Mao; Reed, J.H.
Year: 2009
Optimal Filtering of Source Address Prefixes: Models and Algorithms
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Soldo, F.; Markopoulou, A.; Argyraki, K.
Year: 2009
Optimal Fast Hashing
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Kanizo, Y.; Hay, D.; Keslassy, I.
Year: 2009
Using Three States for Binary Consensus on Complete Graphs
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Perron, E.; Vasudevan, D.; Vojnovic, M.
Year: 2009
AAA: Asynchronous, Adaptive, and Asymmetric Power Management for Mobile Ad Hoc Networks
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Shan-Hung Wu; Chung-Min Chen; Ming-Syan Chen
Year: 2009
CFP: Cooperative Fast Protection
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Wu, B.; Ho, P.-H.; Yeung, K.L.; Tapolcai, J.; Mouftah, H.T.
Year: 2009
"Not All At Once!" - A Generic Scheme for Estimating the Number of Affected Nodes While Avoiding Feedback Implosion
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Cohen, R.; Landau, A.
Year: 2009
Distributed Construction of Fault Resilient High Capacity Wireless Networks with Bounded Node Degree
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Bejerano, Y.; Qunfeng Dong
Year: 2009
Topology Formation for Wireless Mesh Network Planning
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Chun-cheng Chen; Chekuri, C.; Klabjan, D.
Year: 2009
Respondent-Driven Sampling for Characterizing Unstructured Overlays
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Rasti, A.H.; Torkjazi, M.; Rejaie, R.; Duffield, N.; Willinger, W.; Stutzbach, D.
Year: 2009
A Framework for Efficient Class-Based Scheduling
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Saxena, M.; Kompella, R.R.
Year: 2009
An Efficient Algorithm for Measuring Medium- to Large-Sized Flows in Network Traffic
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Lall, A.; Ogihara, M.; Jun Xu
Year: 2009
Efficient Geometric Routing in Three Dimensional Ad Hoc Networks
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Cong Liu; Jie Wu
Year: 2009
Alpha Coverage: Bounding the Interconnection Gap for Vehicular Internet Access
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Zheng, Z.; Sinha, P.; Kumar, S.
Year: 2009
CASE: Connectivity-Based Skeleton Extraction in Wireless Sensor Networks
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Hongbo Jiang; Wenping Liu; Dan Wang; Chen Tian; Xiang Bai; Xue Liu; Ying Wu; Wenyu Liu
Year: 2009
On Passive One-Way Loss Measurements Using Sampled Flow Statistics
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Yu Gu; Breslau, L.; Duffield, N.; Sen, S.
Year: 2009
HOLMES: Effective statistical debugging via efficient path profiling
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Chilimbi, T.M.; Liblit, B.; Mehra, K.; Nori, A.V.; Vaswani, K.
Year: 2009
Succession: Measuring transfer of code and developer productivity
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Mockus, A.
Year: 2009
Model evolution by run-time parameter adaptation
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Epifani, I.; Ghezzi, C.; Mirandola, R.; Tamburrelli, G.
Year: 2009
Accurate Interprocedural Null-Dereference Analysis for Java
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Nanda, M.G.; Sinha, S.
Year: 2009
License integration patterns: Addressing license mismatches in component-based development
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:German, D.M.; Hassan, A.E.
Year: 2009
Reasoning about edits to feature models
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Thum, T.; Batory, D.; Kastner, C.
Year: 2009
Learning operational requirements from goal models
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Alrajeh, D.; Kramer, J.; Russo, A.; Uchitel, S.
Year: 2009
Automatically finding patches using genetic programming
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Weimer, W.; Nguyen, T.V.; Le Goues, C.; Forrest, S.
Year: 2009
FlexSync: An aspect-oriented approach to Java synchronization
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Zhang, C.
Year: 2009
Maintaining and evolving GUI-directed test scripts
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Grechanik, M.; Qing Xie; Chen Fu
Year: 2009
Synthesizing intensional behavior models by graph transformation
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Ghezzi, C.; Mocci, A.; Monga, M.
Year: 2009
Analyzing critical process models through behavior model synthesis
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Damas, C.; Lambeau, B.; Roucoux, F.; van Lamsweerde, A.
Year: 2009
Taint-based directed whitebox fuzzing
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Ganesh, V.; Leek, T.; Rinard, M.
Year: 2009
How to avoid drastic software process change (using stochastic stability)
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Menzies, T.; Williams, S.; El-Rawas, O.; Boehm, B.; Hihn, J.
Year: 2009
A toolset for automated failure analysis
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Mariani, L.; Pastore, F.; Pezze, M.
Year: 2009
Save-IDE - A tool for design, analysis and implementation of component-based embedded systems
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Sentilles, S.; Pettersson, A.; Nystrom, D.; Nolte, T.; Pettersson, P.; Crnkovic, I.
Year: 2009
Extracting, specifying and predicting software system properties in component based real-time embedded software development
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Ji Eun Kim; Rogalla, O.; Kramer, S.; Hamann, A.
Year: 2009
Improving quality, one process change at a time
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Pinheiro, C.; Maurer, F.; Sillito, J.
Year: 2009
Using a validation model to measure the agility of software development in a large software development organization
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Ikoma, M.; Ooshima, M.; Tanida, T.; Oba, M.; Sakai, S.
Year: 2009
Improving software Risk Management in a Medical Device Company
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:McCaffery, F.; Burton, J.; Richardson, I.
Year: 2009
A sense of community: A research agenda for software ecosystems
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Jansen, S.; Finkelstein, A.; Brinkkemper, S.
Year: 2009
Selective backtracking of model changes
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Groher, I.; Egyed, A.
Year: 2009
A compositional approach to bidirectional model transformation
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Hidaka, S.; Hu, Z.; Kato, H.; Nakano, K.
Year: 2009
Genetics as a role model for software variability management
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Dhungana, D.; Groher, I.
Year: 2009
Towards a framework for law-compliant software requirements
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Siena, A.; Perini, A.; Susi, A.; Mylopoulos, J.
Year: 2009
The inference validity problem in legal discovery
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Stirewalt, R.E.K.; Dillon, L.K.; Kraemer, E.T.
Year: 2009
Multi-dimensional service compositions
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Baresi, L.; Di Nitto, E.; Guinea, S.; Dustdar, S.
Year: 2009
The marketplace of user interface real estate
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Troiano, L.; Canfora, G.
Year: 2009
Towards safety guarantees for service-oriented systems
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Becker, B.
Year: 2009
Early-stage software design for usability
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Golden, E.
Year: 2009
On the evaluation and improvement of feature-based configuration techniques in software product lines
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Hubaux, A.; Heymans, P.
Year: 2009
Configuration aware prioritization techniques in regression testing
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Xiao Qu
Year: 2009
Towards the use of dynamic workflows for coordinating self-adaptation of software systems
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:da Silva, C.E.; de Lemos, R.
Year: 2009
Models and algorithms for business value-driven adaptation of business processes and software infrastructure
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Suleiman, B.
Year: 2009
Tesseract: Interactive environment for exploration of project relationships
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Maccherone, L.; Sarma, A.; Wagstrom, P.; Herbsleb, J.
Year: 2009
DYVISE: Performance analysis of production systems research demonstration
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Reiss, S.P.
Year: 2009
VCC: Contract-based modular verification of concurrent C
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Dahlweid, M.; Moskal, M.; Santen, T.; Tobies, S.; Schulte, W.
Year: 2009
Goal and scenario modeling, analysis, and transformation with jUCMNav
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Mussbacher, G.; Amyot, D.
Year: 2009
A-SCORE: Automatic software component recommendation using coding context
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Shimada, R.; Hayase, Y.; Ichii, M.; Matsushita, M.; Inoue, K.
Year: 2009
Cooperative and human aspects of software engineering (CHASE 2009)
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:de Souza, Cleidson; Sharp, Helen; Dittrich, Yvonne; Singer, Janice
Year: 2009
Principles of engineering service oriented systems
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Di Nitto, Elisabetta; Dustdar, Schahram
Year: 2009
Leadership and management in software architecture
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Berenbach, Brian; Bass, Len
Year: 2009
Promoting the software evolution in AOSD with early aspects: Architecture-oriented model-based pointcuts
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Pinto, M.; Fuentes, L.; Valenzuela, J.A.; Pires, P.F.; Delicato, F.C.
Year: 2009
Support for aspectual modeling to Multiagent system architecture
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Silva, C.; Lucena, M.; Castro, J.; Araujo, J.; Moreira, A.; Alencar, F.
Year: 2009
Concern tracing and change impact analysis: An exploratory study
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Khan, S.S.; Lock, S.
Year: 2009
Building distributed web applications based on model versioning with CoObRa: An experience report
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Aschenbrenner, N.; Dreyer, J.; Hahn, M.; Jubeh, R.; Schneider, C.; Zundorf, A.
Year: 2009
Operation-based conflict detection and resolution
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Koegel, M.; Helming, J.; Seyboth, S.
Year: 2009
Keynote 2: Digital Identity Protection - Concepts and Issues
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Year: 2009
Keynote 3: Topological Analysis of Network Attack Vulnerability
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Year: 2009
Retaining Data Control to the Client in Infrastructure Clouds
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Descher, M.; Masser, P.; Feilhauer, T.; Tjoa, A.M.; Huemer, D.
Year: 2009
Web Service Trust: Towards a Dynamic Assessment Framework
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Spanoudakis, G.; LoPresti, S.
Year: 2009
Security Requirements Specification in Service-Oriented Business Process Management
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Menzel, M.; Thomas, I.; Meinel, C.
Year: 2009
Different Approaches to In-House Identity Management - Justification of an Assumption
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Fuchs, L.; Broser, C.; Pernul, G.
Year: 2009
An LPN-Problem-Based Lightweight Authentication Protocol for Wireless Communications
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Ya-Fen Chang; Yen-Cheng Lai
Year: 2009
Revealing the Calling History of SIP VoIP Systems by Timing Attacks
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Ge Zhang; Fischer-Huebner, S.; Martucci, L.A.; Ehlert, S.
Year: 2009
On Privacy Preserving Convex Hull
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Hans, S.; Addepalli, S.C.; Gupta, A.; Srinathan, K.
Year: 2009
Routing Protocol Security Using Symmetric Key Based Techniques
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Bruhadeshwar, B.; Kothapalli, K.; Poornima, M.; Divya, M.
Year: 2009
Automated Support for Security Requirements Engineering in Software Product Line Domain Engineering
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Mellado, D.; Rodriguez, J.; Fernandez-Medina, E.; Piattini, M.
Year: 2009
A Test Framework for Assessing Effectiveness of the Data Privacy Policy's Implementation into Relational Databases
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Canfora, G.; Visaggio, C.A.; Paradiso, V.
Year: 2009
Proactive Resource Management for Failure Resilient High Performance Computing Clusters
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Song Fu; Cheng-Zhong Xu
Year: 2009
An Automatic Privacy Policy Agreement Checker for E-services
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Yee, G.O.M.
Year: 2009
MixVM - An Approach to Service Isolation and Data Protection in Mobile Context-Sensitive Applications
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Butter, T.; Aleksy, M.
Year: 2009
Traffic Controller: A Practical Approach to Block Network Covert Timing Channel
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Yi Wang; Ping Chen; Yi Ge; Bing Mao; Li Xie
Year: 2009
Reusable Security Requirements for Healthcare Applications
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Jensen, J.; Tondel, I.A.; Jaatun, M.G.; Meland, P.H.; Andresen, H.
Year: 2009
Building a Responsibility Model Including Accountability, Capability and Commitment
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Feltus, C.; Petit, M.
Year: 2009
Algebraic Properties in Alice and Bob Notation
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Modersheim, S.
Year: 2009
Using XACML for Embedded and Fine-Grained Access Control Policy
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Hsieh, G.; Foster, K.; Emamali, G.; Patrick, G.; Marvel, L.
Year: 2009
Security in Quantum Networks as an Optimization Problem
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Rass, S.; Schartner, P.
Year: 2009
Generalized Robust Combiners for Oblivious Transfer
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Umadevi, G.; Addepalli, S.C.; Srinathan, K.
Year: 2009
Statistical Failure Analysis of a Web Server System
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Fujii, T.; Dohi, T.
Year: 2009
Position Paper: Secure Infrastructure for Scientific Data Life Cycle Management
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Descher, M.; Feilhauer, T.; Ludescher, T.; Masser, P.; Wenzel, B.; Brezany, P.; Elsayed, I.; Woehrer, A.; Tjoa, A.M.; Huemer, D.
Year: 2009
An Efficient Measurement of Object Oriented Design Vulnerability
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Agrawal, A.; Chandra, S.; Khan, R.A.
Year: 2009
An Inclusive Information Society Needs a Global Approach of Information Security
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Ghernaouti-Helie, S.
Year: 2009
Measuring Peer-to-Peer Botnets Using Control Flow Stability
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Binbin Wang; Zhitang Li; Hao Tu; Jie Ma
Year: 2009
Trusting User Defined Context in MANETs: Experience from the MIDAS Approach
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Westerlund, V.; Pronstad, T.; Tondel, I.A.; Wienhofen, L.
Year: 2009
Deconvolving Protected Signals
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Kafi, M.; Guilley, S.; Marcello, S.; Naccache, D.
Year: 2009
Estimating ToE Risk Level Using CVSS
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Houmb, S.H.; Franqueira, V.N.L.
Year: 2009
Comparison of Risk Analysis Methods: Mehari, Magerit, NIST800-30 and Microsoft's Security Management Guide
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Syalim, A.; Hori, Y.; Sakurai, K.
Year: 2009
Haste in Knowledge-Intensive Work: A Major Threat to Information Security Management in Business Environments
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Anttila, J.; Kajava, J.
Year: 2009
Standards-Based Cyber Exercises
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Dodge, R.C.; Hay, B.; Nance, K.
Year: 2009
Multidimensional Management of Information Security – A Metrics Based Approach Merging Business and Information Security Topics
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Sowa, S.; Gabriel, R.
Year: 2009
A Security Management Assurance Model to Holistically Assess the Information Security Posture
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Tashi, I.; Ghernaouti-Helie, S.
Year: 2009
Methodology to Align Business and IT Policies: Use Case from an IT Company
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Feltus, C.; Incoul, C.; Aubert, J.; Gateau, B.; Adelsbach, A.; Camy, M.
Year: 2009
A Practical Framework for the Dataflow Pointcut in AspectJ
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Boukhtouta, A.; Alhadidi, D.; Debbabi, M.
Year: 2009
Linking Privacy Solutions to Developer Goals
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Wuyts, K.; Scandariato, R.; De Decker, B.; Joosen, W.
Year: 2009
Software Inspections Using Guided Checklists to Ensure Security Goals
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Elberzhager, F.; Klaus, A.; Jawurek, M.
Year: 2009
Managing Rights and Value of Digital Media
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Chiariglione, F.; Cosenza, G.; Matone, S.
Year: 2009
A Criteria-Based Evaluation Framework for Authentication Schemes in IMS
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Eliasson, C.; Fiedler, M.; Jorstad, I.
Year: 2009
Rank Swapping for Partial Orders and Continuous Variables
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Torra, V.
Year: 2009
Enhancing Control of Service Compositions in Service-Oriented Architectures
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Schneider, C.; Stumpf, F.; Eckert, C.
Year: 2009
Truly Anonymous Paper Submission and Review Scheme
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Chun-I Fan; Ming-Te Chen; Lung-Hsien Chen
Year: 2009
Automated Instruction-Set Randomization for Web Applications in Diversified Redundant Systems
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Majorczyk, F.; Demay, J.-C.
Year: 2009
An Improvement to a Decentralized Management Method for Uniquely Accessible Attribute Information
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Yoshio, K.; Yoshiaki, Y.; Hidekazu, T.
Year: 2009
Improving Performance in Digital Forensics: A Case Using Pattern Matching Board
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Jooyoung Lee; Sungkyung Un; Dowon Hong
Year: 2009
Investigating the Implications of Virtual Machine Introspection for Digital Forensics
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Nance, K.; Hay, B.; Bishop, M.
Year: 2009
Keynote: Endurance Barriers and Solutions for Flash Memory
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Tei-Wei Kuo
Year: 2009
Efficient Model-Checking for Real-Time Task Networks
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Dierks, H.; Metzner, A.; Stierand, I.
Year: 2009
A Formal Model for Component-Based Embedded Software Development
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Changde Li; Xingshe Zhou; Yunwei Dong; Zhiwen Yu
Year: 2009
A Parallel Reconfigurable Architecture for Real-Time Stereo Vision
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Lei Chen; Yunde Jia
Year: 2009
A Scheduling Algorithm for Hybrid Distributed Real-Time Systems
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Ke Liang; Xingshe Zhou; Ruiqing Sheng; Kailong Zhang
Year: 2009
Earliest Deadline Scheduling for Continuous Queries over Data Streams
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Xin Li; Zhiping Jia; Li Ma; Ruihua Zhang; Haiyang Wang
Year: 2009
A Survey of WCET Analysis of Real-Time Operating Systems
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Mingsong Lv; Nan Guan; Yi Zhang; Qingxu Deng; Ge Yu; Jianming Zhang
Year: 2009
Statistical Estimation for Total Communication Load in Application-Specific Network-on-Chip
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Naifeng Jing; Zhigang Mao; Yongxin Zhu
Year: 2009
Component-Based Design of Software for Embedded Control Systems: The Medical Ventilator Case Study
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Feng Zhou; Wei Guan; Sierszecki, K.; Angelov, C.
Year: 2009
The Design and Implementation of Hardware Task Configuration Management Unit on Dynamically Reconfigurable SoC
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Xiao-Wei Wang; Wei-Nan Chen; Ying Wang; Hong-Jun You; Cheng-Lian Peng
Year: 2009
A Mixed Timing System-Level Embedded Software Modelling and Simulation Approach
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Ke Yu; Audsley, N.C.
Year: 2009
A Genetic Algorithm Based Approach for Event Synchronization Analysis in Real-Time Embedded Systems
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Yan Chen; Yann-Hang Lee; Xiaofeng Xu; Wong, W.E.; Donghui Guo
Year: 2009
A Lightweight Dynamic Performance Monitoring Framework for Embedded Systems
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Yao Guo; Ziwen Chen; Xiangqun Chen
Year: 2009
Analysis and Evaluation of the Scheduling Algorithms in Virtual Environment
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Xindong You; Xianghua Xu; Jian Wan; Congfeng Jiang
Year: 2009
Checkpoint Interval and System's Overall Quality for Message Logging-Based Rollback and Recovery in Distributed and Embedded Computing
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Nianen Chen; Yue Yu; Shangping Ren
Year: 2009
A Semantic Context Management Framework on Mobile Device
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Hu, D.H.; Fan Dong; Cho-Li Wang
Year: 2009
Tolerating Memory Latency Using a Hardware-Based Active-Pushing Technique
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Liwen Shi; Xiaoya Fan; Jie Chen; Xiaoping Huang; Hangpei Tian
Year: 2009
Design and Implementation of an Embedded Quality Control System
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Futian Yao; Xiaozhu Chen; Yuntao Qian; Jiming Li
Year: 2009
A Real-Time Task Scheduling Algorithm Based on Dynamic Priority
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Hui Chen; Jiali Xia
Year: 2009
A Code Generation Framework for Time-Triggered Real-Time Systems
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Pletzer, J.; Templ, J.; Pree, W.
Year: 2009
An Effective Reversible Debugger of Cross Platform Based on Virtualization
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Liming Wang; Xiyang Liu; Ailong Song; Lin Xu; Tao Liu
Year: 2009
Implementing Haptic Feedback Environments from High-Level Descriptions
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Zhu, A.Y.; Jun Inoue; Peralta, M.L.; Taha, W.; O'Malley, M.K.; Powell, D.
Year: 2009
Design Framework for Self-Stabilizing Real-Time Systems Based on Real-Time Objects and Prototype Implementation with Analysis
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Cheng, A.M.K.; Digewade, S.S.
Year: 2009
A Novel Reduction Algorithm Based on Expert Knowledge
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Junpeng Yuan; Jie Su; Cheng Su
Year: 2009
Design of Real-Time and Multi-task Control System for Semi-active Suspension Based on PICOS18
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Zhao Yu-zhuang; Chen Si-zhong; Yang Lin
Year: 2009
Research of Networked Control System Based on P2P Network
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Zhu Qiang; Chen Kai; Fei Minrui
Year: 2009
A Replica Placement Algorithm in Mobile Grid Environments
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Xiong Fu; Ruchuan Wang; Yang Wang; Song Deng
Year: 2009
Applying Decision Tree in Fault Pattern Analysis for HGA Manufacturing
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Taetragool, U.; Achalakul, T.
Year: 2009
XML-Based Knowledge Discovery for the Linguistic Atlas of Sicily (ALS) Project
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Pirrone, R.; Gentile, A.; Cannella, V.; Russo, G.
Year: 2009
An Ontology-Based Distributed Case-Based Reasoning for Virtual Enterprises
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Yuh-Jen Chen; Yuh-Min Chen; Yung-Sheng Su
Year: 2009
Development of a Distributed Product Knowledge Service System
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Yuh-Jen Chen; Yuh-Min Chen; Meng-Sheng Wu
Year: 2009
Reconstruction for Artificial Degraded Image Using Constructive Solid Geometry and Strongly Typed Genetic Programming
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Yamagiwa, M.; Kikuchi, E.; Uehara, M.; Murakami, M.; Yoneyama, M.
Year: 2009
Semi-Quantitative Modeling for the Effect of Oxygen Level on the Metabolism in Escherichia coli
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Matsuoka, Yu.; Shimizu, K.
Year: 2009
MAILComp - New Compression Method Designed for Electric Mail Transfer Protocols over TLS
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Kimura, S.; Kumagai, Y.; Manabe, D.; Ebihara, Y.
Year: 2009
A Disaster Information System by Ballooned Wireless Adhoc Network
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Shibata, Y.; Sato, Y.; Ogasawara, N.; Chiba, G.
Year: 2009
Management for Mobility-Aware Networks Based on Standardized Protocols
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Koide, K.; Maruyama, T.; Keeni, G.M.; Shiratori, N.
Year: 2009
MixMobGen - A Realistic Mixed Traffic Mobility Generator for ad hoc Network Simulations
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Doci, A.; Barolli, L.; Xhafa, F.
Year: 2009
Escrow Approaches for Global Consistency in Mobile Ad Hoc Networks
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Hara, T.
Year: 2009
Predicting Parameter Sweep Jobs: From Simulation to Grid Implementation
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Hellinckx, P.; Verboven, S.; Arickx, F.; Broeckhove, J.
Year: 2009
EPCIS-Based Supply Chain Event Management – A Quantitative Comparison of Candidate System Architectures
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Tribowski, C.; Goebel, C.; Gunther, O.
Year: 2009
Data Classification Based on the Class-Rooted FP-Tree Approach
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Ye-In Chang; Chen-Chang Wu; Jun-Hong Shen; Chien-Hung Chen
Year: 2009
A Highly Scalable Key-Value Storage System for Latency Sensitive Applications
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Qiang Wang; Feilong Tang
Year: 2009
A Secure RFID Authentication Protocol with Low Communication Cost
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Rahman, M.S.; Soshi, M.; Miyaji, A.
Year: 2009
Context Reflector for Proxy Mobile IPv6
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Kiriyama, S.; Wakikawa, R.; Xia, J.; Teraoka, F.
Year: 2009
Design a Virtual Object Representing Human-Machine Interaction for Music Playback Control in Smart Home
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Jenq-Muh Hsu; I-Ray Chang
Year: 2009
PaSTeL: Parallel Runtime and Algorithms for Small Datasets
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Videau, B.; Saule, E.; Mehaut, J.-F.
Year: 2009
Optimistic Parallel Discrete Event Simulation Based on Multi-core Platform and its Performance Analysis
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Nianle Su; Hongtao Hou; Feng Yang; Qun Li; Weiping Wang
Year: 2009
Creating Visualizations through Ontology Mapping
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Falconer, S.M.; Bull, R.I.; Grammel, L.; Storey, M.-A.
Year: 2009
Ontology Alignment in RFID Privacy Protection
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Kanbe, M.; Yamamoto, S.
Year: 2009
A User-Friendly Interface for Fingerprint Recognition Systems Based on Natural Language Processing
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Conti, V.; Militello, C.; Sorbello, F.; Vitabile, S.
Year: 2009
Modeling Explicit and Implicit Service Request for Intelligent Interface Design
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Chiung-Hon Leon Lee; Liu, A.
Year: 2009
Design and Prototyping of a Community Response Grid (CRG) for a University Campus
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Yan Qu; Wu, P.F.; Mahindrakar, S.
Year: 2009
GUI Usability in Medical Imaging
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Cannella, V.; Gambino, O.; Pirrone, R.; Vitabile, S.
Year: 2009
Collection of Disease Networks by Hybrid Curation Method and the Application for Pathway Analysis
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Kushida, T.; Asanuma, T.; Okuda, Y.; Shidahara, Y.; Takagi, T.
Year: 2009
A Three-Phase Adaptive Prediction System of the Run-Time of Jobs Based on User Behaviour
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Glasner, C.; Volkert, J.
Year: 2009
A DNA-Based Clustering Method Based on Statistics Adapted to Heterogeneous Coordinate Data
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Kim, I.; Watada, J.
Year: 2009
Application of a Critical Chain Project Management Based Framework on Max-Plus Linear Systems
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Takahashi, H.; Goto, H.; Kasahara, M.
Year: 2009
Self-Tuning Vision System for Monitoring Bioreactor Cell Populations
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Doncescu, A.; Kabbaj, N.
Year: 2009
A Proposal of Structured Learning Assistance Function in Lecture-Scene Playback System Using Digital Picture-Card Show
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Funabiki, N.; Mouri, A.; Uemura, K.; Nakanishi, T.
Year: 2009
A Parallelized Data Stream Processing System Using Dynamic Time Warping Distance
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Takahashi, N.; Yoshihisa, T.; Sakurai, Y.; Kanazawa, M.
Year: 2009
“Green” Supply Chains: Using Information Integration for Sustainable Development
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Schatten, A.
Year: 2009
An Ontology to Support Authoring Tools for Sustainable Energy Education
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Karetsos, S.; Haralambopoulos, D.
Year: 2009
Semantic Management of Multimedia Documents for E-Government Activity
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Amato, F.; Mazzeo, A.; Moscato, V.; Picariello, A.
Year: 2009
Towards a Validation Framework for Sub-ontology Extraction Workflows in a Semantic Grid
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Uchibayashi, T.; Apduhan, B.O.; Rahayu, W.J.; Taniar, D.; Shiratori, N.
Year: 2009
The Sampling-Based Sensitivity Analysis Model for Yield Improvement in HDD Manufacturing
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Yamwong, W.; Kaotien, J.; Achalakul, T.
Year: 2009
Application of Cylindrical Elastic Elements for Stiffness Control of Tendon-Driven Manipulator and Inverse Kinematics Evaluation
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Nakiri, D.; Kino, H.
Year: 2009
Estimating the Optimal Configuration of a Multi-Core Cluster: A Preliminary Study
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Ichikawa, S.; Takagi, S.
Year: 2009
Foreword
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Year: 2009
3D chip stack with integrated decoupling capacitors
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Bing Dang; Wright, S.L.; Andry, P.; Sprogis, E.; Ketkar, S.; Tsang, C.; Polastre, R.; Knickerbocker, J.
Year: 2009
Study of 15µm pitch solder microbumps for 3D IC integration
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Aibin Yu; Lau, J.H.; Soon Wee Ho; Kumar, A.; Wai Yin Hnin; Da-Quan Yu; Ming Ching Jong; Kripesh, V.; Pinjala, D.; Dim-Lee Kwong
Year: 2009
Electrically yielding Collective Hybrid Bonding for 3D stacking of ICs
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Jourdain, A.; Soussan, P.; Swinnen, B.; Beyne, E.
Year: 2009
Low temperature multi layer stack wafer bonding technology development
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Won Kyu Jeung; Chang Hyun Lim; Sung Yi
Year: 2009
Development of silicon module with TSVs and global wiring (L/S=0.8/0.8µm)
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Sunohara, M.; Shiraishi, A.; Taguchi, Y.; Murayama, K.; Higashi, M.; Shimizu, M.
Year: 2009
Routing optimization of multi-modal interconnects in 3D ICs
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Young-Joon Lee; Sung Kyu Lim
Year: 2009
Cold welding: A new factor governing the robustness of adhesively bonded flip-chip interconnects
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Farley, D.; Kahnert, T.; Sinha, K.; Solares, S.; Dasgupta, A.; Caers, J.F.J.; Zhao, X.J.
Year: 2009
A method of “chemical flip-chip bonding” without loading and heating for ultra-fine chip-to-substrate interconnects
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Yokoshima, T.; Yamaji, Y.; Kikuchi, K.; Nakagawa, H.; Aoyagi, M.
Year: 2009
Frequency dependent S-N curves for predicting drop impact robustness of Pb-free solder interconnects
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Zhao, X.J.; Caers, J.F.J.M.; Wong, E.H.; Seah, S.K.W.; Driel, W.D.v.; Owen, N.; Lai, Y.-S.
Year: 2009
On the nature of pad cratering
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Godbole, G.; Roggeman, B.; Borgesen, P.; Srihari, K.
Year: 2009
Reliability study of high-end Pb-free CBGA solder joint under various thermal cycling test conditions
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Dongji Xie; Gektin, V.; Geiger, D.
Year: 2009
In situ analysis of the stress development during fabrication processes of micro-assemblies
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Pustan, D.; Rastiagaev, E.; Wilde, J.
Year: 2009
The effects of the degree of cure of anisotropic conductive films (ACFs) on the contraction stress build-up of ACFs and ACF joints stability for chip-on-flex (COF) applications
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Chang-Kyu Chung; Kyung-Wook Paik
Year: 2009
Temperature dependency of coefficient of hygroscopic swelling of molding compound
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Seungbae Park; Haojun Zhang; Xin Zhang; Siu Lung Ng; Ho Chong Lee
Year: 2009
Epoxy flux technology - Tacky flux with value added benefits
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Chan, B.; Qing Ji; Currie, M.; Poole, N.; Tu, C.T.
Year: 2009
Impact of manufacturing variation on the reliability/quality of an Opto-BGA system in package
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Yong Liu; Qian, R.; Quinones, C.; Irving, S.; Luk, T.
Year: 2009
Establishing fracture properties of EMC-Copper interfaces in the visco-elastic temperature region
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Xiao, A.; de Vreugd, J.; Pape, H.; Wunderle, B.; Jansen, K.M.B.; Ernst, L.J.
Year: 2009
Principal component analysis based development of Norris-Landzberg acceleration factors and Goldmann Constants for leadfree electronics
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Lall, P.; Shirgaokar, A.; Arunachalam, D.
Year: 2009
Innovative approaches in flip chip packaging for mobile applications
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Pendse, R.; Joshi, M.; Kim, K.M.; Kim, P.; Kim, S.S.; Kim, Y.C.; Lee, H.T.; Lee, K.; Lee, S.Y.; Lee, T.K.; Murphy, A.
Year: 2009
Reliability of fine-pitch flip-chip packages
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Banijamali, B.; Mohammed, I.; Savalia, P.
Year: 2009
Development of through silicon via (TSV) interposer technology for large die (21×21mm) fine-pitch Cu/low-k FCBGA package
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Zhang, X.; Chai, T.C.; Lau, J.H.; Selvanayagam, C.S.; Biswas, K.; Shiguo Liu; Pinjala, D.; Tang, G.Y.; Ong, Y.Y.; Vempati, S.R.; Wai, E.; Li, H.Y.; Liao, E.B.; Ranganathan, N.; Kripesh, V.; Jiangyan Sun; Doricko, J.; Vath, C.J.
Year: 2009
Advanced Surface Laminar Circuit Packaging with low Coefficient of Thermal Expansion and high wiring density
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Yamanaka, K.; Kobayashi, K.; Hayashi, K.; Fukui, M.
Year: 2009
Development of novel intermetallic joints using thin film indium based solder by low temperature bonding technology for 3D IC stacking
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Won Kyoung Choi; Premachandran, C.S.; Ong Siong Chiew; Xie Ling; Liao Ebin; Khairyanto, A.; Ratmin, B.; Sheng, K.C.W.; Phyo Phyo Thaw; Lau, J.H.
Year: 2009
High density Cu-Sn TLP bonding for 3D integration
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Agarwal, R.; Zhang, W.; Limaye, P.; Ruythooren, W.
Year: 2009
Three dimensional interconnects with high aspect ratio TSVs and fine pitch solder microbumps
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Yu, A.; Lau, J.H.; Soon Wee Ho; Kumar, A.; Hnin Wai Yin; Jong Ming Ching; Kripesh, V.; Pinjala, D.; Chen, S.; Chien-Feng Chan; Chun-Chieh Chao; Chi-Hsin Chiu; Chih-Ming Huang; Chen, C.
Year: 2009
High density Cu-Cu interconnect bonding for 3-D integration
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Lannon, J.; Gregory, C.; Lueck, M.; Huffman, A.; Temple, D.
Year: 2009
Characterization of MOS transistor after through-hole electrode fabrication and 3D-assembly by mechanical caulking
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Kawashita, M.; Yoshimura, Y.; Tanaka, N.; Shimokawa, H.; Kinoshita, N.; Uematsu, T.; Fujisawa, M.; Naito, T.; Akazawa, T.
Year: 2009
The influence of the Pb-free solder alloy composition and processing parameters on thermal fatigue performance of a ceramic chip resistor
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Coyle, R.; Reid, M.; Ryan, C.; Popowich, R.; Read, P.; Fleming, D.; Collins, M.; Punch, J.; Chatterji, I.
Year: 2009
Vertically aligned carbon nanotubes on copper substrates for applications as thermal interface materials: From synthesis to assembly
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Wei Lin; Olivares, R.V.; Qizhen Liang; Zhang, R.; Kyoung-Sik Moon; Wong, C.P.
Year: 2009
Delamination mechanisms of thermal interface materials in organic packages during reflow and moisture soaking
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Jiantao Zheng; Jadhav, V.; Wakil, J.; Coffin, J.; Iruvanti, S.; Langlois, R.; Yarmchuk, E.; Gaynes, M.; Liu, H.; Sikka, K.; Brofman, P.
Year: 2009
Innovative approaches for realisation of embedded chip packages - Technological challenges and achievements
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Manessis, D.; Boettcher, L.; Ostmann, A.; Aschenbrenner, R.; Reichl, H.
Year: 2009
Electrical design and demonstration of an embedded high-pin-count LSI chip package
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Ohshima, D.; Sasaki, H.; Mori, K.; Fujimura, Y.; Kikuchi, K.; Nakashima, Y.; Funaya, T.; Nishiyama, T.; Murakami, T.; Yamamichi, S.
Year: 2009
Low-frequency test method for integrated RF substrates
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Goyal, A.; Swaminathan, M.; Chatterjee, A.
Year: 2009
A novel design of CNT-based embedded inductors
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Mousa, O.F.; Kim, B.C.; Flicker, J.; Ready, J.
Year: 2009
Design and modeling of planar transformer-based integrated passive devices for wireless applications
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Huang, C.-H.; Wei, T.-C.; Horng, T.-S.; Wu, S.-M.; Li, J.-Y.; Chen, C.-C.; Wang, C.-C.; Chiu, C.-T.; Hung, C.-P.
Year: 2009
A solder joint fatigue life model for combined vibration and temperature environments
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Eckert, T.; Muller, W.H.; Nissen, N.F.; Reichl, H.
Year: 2009
A novel method to predict die shift during compression molding in embedded wafer level package
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Chee Houe Khong; Kumar, A.; Xiaowu Zhang; Sharma, G.; Vempati, S.R.; Vaidyanathan, K.; Lau, J.H.-S.; Dim-Lee Kwong
Year: 2009
Explicit submodeling and digital image correlation based life-prediction of leadfree electronics under shock-impact
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Lall, P.; Shantaram, S.; Angral, A.; Kulkarni, M.
Year: 2009
Underfill optimization under accelerated temperature cycling and drop-impact loading for stacked packages using finite element modeling
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Schneck, N.; Johnson, Z.
Year: 2009
Ultra-thin flexible microcircuit assemblies using thinned die and multilayer thin-film substrates
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Francomacaro, A.S.; Charles, H.K.; Lehtonen, S.J.; Keeney, A.C.; Clatterbaugh, G.V.; Banda, C.V.
Year: 2009
Novel multi-layer wiring build-up using Electrochemical Pattern Replication (ECPR)
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Fredenberg, M.; Moller, P.; Topper, M.
Year: 2009
Resin coated copper capacitive (RC3) nanocomposites for system in a package (SiP): Development of 3-8-3 structure
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Das, R.N.; Papathomas, K.I.; Rosser, S.G.; Antesberger, T.; Lauffer, J.M.; Poliks, M.D.; Markovich, V.R.
Year: 2009
SMAFTI package with planarized multilayer interconnects
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Motohashi, N.; Kurita, Y.; Soejima, K.; Tsuchiya, Y.; Kawano, M.
Year: 2009
Ultra-thin, flexible electronics
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:McPherson, R.; Dean, R.; Johnson, R.W.; Del Castillo, L.
Year: 2009
Transfer-printed microscale integrated circuits
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Bower, C.A.; Menard, E.; Bonafede, S.; Burroughs, S.
Year: 2009
Thermo-mechanical reliability of 3-D ICs containing through silicon vias
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Lu, K.H.; Xuefeng Zhang; Suk-Kyu Ryu; Im, J.; Rui Huang; Ho, P.S.
Year: 2009
Vacuum ultraviolet (VUV) surface treatment process for flip chip and 3-D interconnections
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Sakuma, K.; Nagai, N.; Mizuno, J.; Shoji, S.
Year: 2009
Easy to fill sloped vias for interconnects applications improved control of silicon tapered etch profile
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Heraud, S.; Short, C.; Ashraf, H.
Year: 2009
Detection of solder joint failure precursors on tin-lead and lead-free assemblies using RF impedance analysis
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Daeil Kwon; Azarian, M.H.; Pecht, M.
Year: 2009
Parametric acceleration transforms for lead-free solder joint reliability under thermal cycling conditions
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Ahmad, M.; Weidong Xie; Kuo-Chuan Liu; Jie Xue; Towne, D.
Year: 2009
Interfacial stresses in a bi-material assembly subjected to external tensile forces and bending moments applied to the ends of one of its components
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Suhir, E.; Vujosevic, M.
Year: 2009
An integrated creep, crack growth and thermo-mechanical fatigue model for WLCSP assemblies soldered with SAC 405
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Limaye, P.; Vandevelde, B.; Vandepitte, D.; Verlinden, B.
Year: 2009
“Stretchable” electronics: Does one really need a good thermal expansion (contraction) match between the silicon die and the plastic carrier?
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Suhir, E.
Year: 2009
Study of interconnection process for fine pitch flip chip
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Minjae Lee; Min Yoo; Jihee Cho; Seungki Lee; Jaedong Kim; Choonheung Lee; Daebyoung Kang; Zwenger, C.; Lanzone, R.
Year: 2009
Module final test open yield optimization, of high lead flip chip on large organic package, using structured problem solving approach
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Oberson, V.; Ouimet, S.; Pharand, S.; Levesque, R.
Year: 2009
Flip-chip silver joints between Si chips and Cu zubstrates made at low temperature
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Wang, P.J.; Lee, C.C.
Year: 2009
Practical assessment of tin whisker growth risk due to environmental temperature variations
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Peng Su; Lee, C.J.; Li Li; Jie Xue; Boaz Khan; Moazeni, R.; Hartranft, M.
Year: 2009
A product feasibility study of assembling Pb-free BGAs in a eutectic Sn/Pb process
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Logterman, M.; Gopalakrishnan, L.
Year: 2009
Head in pillow (HIP) and yield study on SIP and PoP assembly
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Dongji Xie; Dongkai Shangguan; Geiger, D.; Gill, D.; Vellppan, V.; Chinniah, K.
Year: 2009
Analysis of the mechanical behavior, microstructure, and reliability of mixed formulation solder joints
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Yifei Zhang; Kurumaddali, K.; Suhling, J.C.; Lall, P.; Bozack, M.J.
Year: 2009
Broad-area InGaNAs/GaAs quantum-well lasers in the 1200 nm range
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Yang, H.-P.D.; Chih-Tsung Shih; Su-Mei Yang; Tsin-Dong Lee
Year: 2009
Study of the mechanism of “smile” in high power diode laser arrays and strategies in improving near-field linearity
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Jingwei Wang; Zhenbang Yuan; Lijun Kang; Kai Yang; Yanxin Zhang; Xingsheng Liu
Year: 2009
Design and optimization of horizontally-located plate fin heat sink for high power LED street lamps
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Xiaobing Luo; Wei Xiong; Ting Cheng; Sheng Liu
Year: 2009
Wet chemical method to etch sophisticated nanostructures into silicon wafers using sub-25nm feature sizes and high aspect ratios
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Hildreth, O.; Yonghao Xiu; Wong, C.P.
Year: 2009
A novel moiré fringe assisted method for nanoprecision alignment in wafer bonding
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Chenxi Wang; Suga, T.
Year: 2009
Development of a novel Wafer-Level-Packaging technology using laminating process
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Yoshio Okayama; Yanase, Y.; Saitou, K.; Kobayashi, H.; Nakasato, M.; Yamamoto, T.; Ryosuke Usui; Inoue, Y.
Year: 2009
Comparative electromigration performance of Pb Free flip chip joints with varying board surface condition
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Nicholls, L.; Darveaux, R.; Syed, A.; Loo, S.; Tong Yan Tee; Wassick, T.A.; Batchelor, B.
Year: 2009
The effects of Ag, Cu compositions and Zn doping on the electromigration performance of Pb-free solders
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Minhua Lu; Da-Yuan Shih; Lauro, P.; Sung Kang; Goldsmith, C.; Sun-Kyoung Seo
Year: 2009
Electromigration study of 50 µm pitch micro solder bumps using four-point Kelvin structure
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Da-Quan Yu; Tai Chong Chai; Meei Ling Thew; Yue Ying Ong; Rao, V.S.; Leong Ching Wai; Lau, J.H.
Year: 2009
Mechanism of electromigration in Au/Al wirebond and its effects
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Zin, E.; Michael, N.; Kang, S.H.; Oh, K.H.; Chul, U.; Cho, J.S.; Moon, J.T.; Kim, C.-U.
Year: 2009
Design, processing and reliability characterizations of a 3D-WLCSP packaged component
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Zhaozhi Li; Houston, P.N.; Baldwin, D.F.; Stout, E.A.; Tessier, T.G.; Evans, J.L.
Year: 2009
A new Cu-Zn solder wetting layer for improved impact reliability
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Young Min Kim; Chang-Yul Oh; Hee-Ra Roh; Young-Ho Kim
Year: 2009
Additives participation in Cu6Sn5 phase formed between Sn-3.5Ag solder and Cu by first-principle approach
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Feng Gao; Qu, J.; Takemoto, T.
Year: 2009
Large-area silicon electronics using stretchable metal interconnect
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Sosin, S.; Zoumpoulidis, T.; Bartek, M.; Dekker, R.
Year: 2009
Biocompatible Lab-On-Substrate technology platform
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Braun, T.; Bottcher, L.; Bauer, J.; Bocchi, M.; Faenza, A.; Guerrieri, R.; Gambari, R.; Becker, K.F.; Jung, E.; Ostmann, A.; Koch, M.; Kahle, R.; Aschenbrenner, R.; Reichl, H.
Year: 2009
The impacts of dimensions and return current path geometry on coupling in single ended Through Silicon Vias
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Curran, B.; Ndip, I.; Guttovski, S.; Reichl, H.
Year: 2009
Front end of line integration of high density, electrically isolated, metallized through silicon vias
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Bauer, T.M.; Shinde, S.L.; Massad, J.E.; Hetherington, D.L.
Year: 2009
Cost effective dry lithography solution for through silicon via technology
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Jacquet, F.; Henry, D.; Charbonnier, J.; Bouzaida, N.; Sillon, N.; Raine, J.S.
Year: 2009
3D stacked chip technology using bottom-up electroplated TSVs
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Chang, H.H.; Shih, Y.C.; Hsiao, Z.C.; Chiang, C.W.; Chen, Y.H.; Chiang, K.N.
Year: 2009
Field use environment for a FCBGA in a laptop computer application
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Darveaux, R.; Reichman, C.; Berry, C.J.
Year: 2009
Resistance spectroscopy-based condition monitoring for prognostication of high reliability electronics under shock-impact
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Lall, P.; Lowe, R.; Goebel, K.
Year: 2009
Effect of damping and air cushion on dynamic responses of PCB under product level free drop impact
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Seungbae Park; Da Yu; Al-Yafawi, A.; Jae Kwak; Lee, J.
Year: 2009
Diamond bit cutting as alternative to polymer patterning for 3D interconnections technologies
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Iker, F.; Funaya, T.; Teixeira, R.C.; Ruythooren, W.
Year: 2009
Front side protection layer for improved reliability of wafer-level packages
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Peddi, R.; Dutt, G.; Wyatt, D.; Hao Tang; Perez, A.; Frye, D.
Year: 2009
Intermetallic reaction between electroplated indium and silver layers
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Wang, P.J.; Kim, J.S.; Lee, C.C.
Year: 2009
Capability of inkjet technology in electronics manufacturing
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Mantysalo, M.; Pekkanen, V.; Kaija, K.; Niittynen, J.; Koskinen, S.; Halonen, E.; Mansikkamaki, P.; Hameenoja, O.
Year: 2009
Application of wide-band material parameter extraction techniques to printable electronics characterization
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Sillanpaa, H.; Lilja, J.; Makinen, R.; Ostman, K.; Palukuru, V.; Virtanen, J.; Pynttari, V.; Kanerva, T.; Hagberg, J.; Lepisto, T.; Jantunen, H.; Mansikkamaki, P.
Year: 2009
Transport processes associated with inkjet printing of colloidal drops for printable electronics fabrication
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Ying Sun; Bromberg, V.; Gawande, S.; Biswas, S.; Singler, T.
Year: 2009
Thermomechanical modeling of back-end-of-the-line 3D interconnects
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Massad, J.E.; Bauer, T.M.; Shinde, S.L.
Year: 2009
Thermo-mechanical characterization of copper filled and polymer filled tsvs considering nonlinear material behaviors
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Zhaohui Chen; Xiaohui Song; Sheng Liu
Year: 2009
Prognostication of latent damage and residual life in leadfree electronics subjected to multiple thermal-environments
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Lall, P.; More, V.; Vaidya, R.; Goebel, K.
Year: 2009
Design and characterization of wirebonds for use in high shock environments
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Marinis, T.F.; Soucy, J.W.
Year: 2009
Surface activated bonding of 8 in. Si wafers for MEMS and microfluidic packaging
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Howlader, M.; Suga, T.
Year: 2009
Chip ultra-thinning and embedding technology for autonomous sensors array applications
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Muller, P.; Iker, F.; Soussan, P.; Beyne, E.; Carchon, G.; De Raedt, W.
Year: 2009
Manufacturing and stacking of ultra-thin film packages
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Ying-Ching Shih; Tzu-Ying Kuo; Yin-Po Hung; Jing-Yao Chang; Chih-Yuan Cheng; Kuo-Chyuan Chen; Ching-Kuan Lee; Chao-Kai Hsu; Jui-Hsiung Huang; Zhi-Cheng Hsiao; Cheng-Ta Ko; Yu-Hua Chen
Year: 2009
Embedding technologies for an automotive radar system
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Becker, K.-F.; Koch, M.; Kahle, R.; Braun, T.; Bottcher, L.; Ostmann, A.; Kostelnik, J.; Ebling, F.; Noack, E.; Sommer, J.P.; Richter, M.; Schneider, M.; Reichl, H.
Year: 2009
Fabrication and characterization of horizontally aligned carbon nanotubes for interconnect application
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Yang Chai; Zhiyong Xiao; Chan, P.C.H.
Year: 2009
Micro-nano interconnect between gold bond pads and copper nano-wires embedded in a polymer template
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Stam, F.; Razeeb, K.M.; Salwa, S.; Mathewson, A.
Year: 2009
A new COF bonding technique using Sn bumps and a non-conductive adhesive (NCA) for image sensor packaging
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Kyoung-Moo Harr; Young-Min Kim; Dae Hwan Lim; Young-Ho Kim; Jin-Gu Kim; Sung Yi
Year: 2009
Highly-reliable, 30µm pitch copper interconnects using nano-ACF/NCF
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Kumbhat, N.; Choudhury, A.; Raine, M.; Mehrotra, G.; Raj, P.M.; Zhang, R.; Moon, K.S.; Chatterjee, R.; Sundaram, V.; Meyer-Berg, G.; Wong, C.P.; Tummala, R.R.
Year: 2009
Cu lateral interconnects formed between 100-µm-thick self-assembled chips on flexible substrates
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Murugesan, M.; Bea, J.-C.; Fukushima, T.; Konno, T.; Kiyoyama, K.; Jeong, W.-C.; Kino, H.; Noriki, A.; Lee, K.-W.; Tanaka, T.; Koyanagi, M.
Year: 2009
Water-based high-volume stress-free ultra-thin powder-chip method
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Noda, H.; Usami, M.; Sato, A.; Terasaki, S.; Ishizaka, H.
Year: 2009
Self-assembly of micro-parts using electrostatic forces and surface tension
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Dalin, J.; Wilde, J.
Year: 2009
Effects of epoxy and rubber addition on die attach films (DAFs) materials properties
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Yongwon Choi; Kyung-Woon Jang; Chang-Kyu Chung; Sangyong Lee; Kyung-Wook Paik
Year: 2009
A novel compliant-bump structure for ACA-bonded chip-on-flex (COF) interconnects with ultra-fine pitch
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Su-Tsai Lu; Yu-Min Lin; Chun-Chin Chuang; Tai-Hong Chen; Wen-Hwa Chen
Year: 2009
Bumpless Ball Grid Array (BBGA) package using a solder resist cavity
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Yong-Min Kwon; Joon-Suk Kang; Young-Do Kweon; Kyung-Wook Paik
Year: 2009
Properties of Ag nanoparticle paste for room temperature bonding
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Wakuda, D.; Keun-Soo Kim; Suganuma, K.
Year: 2009
Characterisation of metal coated polymer balls for BGA and CSP applications
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Kristiansen, H.; Whalley, D.; Tyldum, H.; Redford, K.
Year: 2009
Thermal reliability & IMC behavior of low cost alternative Au-Ag-Pd wire bonds to Al metallization
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Jong-Soo Cho; Hee-Suk Jeong; Jeong-Tak Moon; Se-Jin Yoo; Jae-Seok Seo; Seung-Mi Lee; Seung-Weon Ha; Eun-Kyu Her; Suk-Hoon Kang; Kyu-Hwan Oh
Year: 2009
Novel on-chip high performance slow wave structure using discontinuous microstrip lines and multi-layer ground for compact millimeter wave applications
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Guoan Wang; Woods, W.; Hanyi Ding; Mina, E.
Year: 2009
Chip-Package co-design of 10 GHz bandwidth low noise active front-end interface
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Fourquin, O.; Battista, M.; Cubillo, J.R.; Gaubert, J.; Bourdel, S.
Year: 2009
Electrical design and characterization of elevated antennas at PCB-level
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Ohnimus, F.; Podlasly, A.; Bauer, J.; Ostmann, A.; Ndip, I.; Guttowski, S.; Reichl, H.
Year: 2009
Extensions of the Latency Insertion Method (LIM) to DC analysis of power supply networks and modeling of circuit interconnects with frequency-dependent parameters
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Klokotov, D.; Schutt-Aine, J.
Year: 2009
Use of the finite element method for the modeling of multi-layered power/ground planes with small features
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Bharathy, K.; Jae Young Choi; Swaminathan, M.
Year: 2009
Return loss optimization of the microprocessor package vertical interconnect
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Sathanur, A.V.; Jandhyala, V.; Aygun, K.; Braunisch, H.; Zhang, Z.
Year: 2009
3D via belt technology
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Brun, J.; Boutry, H.; Franiatte, R.; Hilt, T.; Sillon, N.
Year: 2009
Application and evaluation of AL-X polymer dielectric for flip chip and wafer level package bumping
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Huffman, A.; Piascik, J.; Garrou, P.
Year: 2009
Application of Electroless Ni(P) Metallization to LCD Backlight Unit with Carbon Nanotube Field Emitters
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Yoon-Chul Sohn; Yong-Churl Kim; Ho-suk Kang; Jung-Na Heo; In-Taek Han
Year: 2009
Board level energy correlation and interconnect reliability modeling under drop impact
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Agrawal, A.; Levo, T.; Pitarresi, J.; Roggeman, B.
Year: 2009
Comparison of joint level impact fatigue resistance and board level drop test
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Guruprasad, P.; Pitarresi, J.
Year: 2009
Conformal polymer edge interconnect method for high capacity high performance packages for solid state storage applications
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Robinson, M.; Leal, J.
Year: 2009
Embedded chip-in-flex (CIF) packages using wafer level package (WLP) with pre-applied anisotropic conductive films (ACFs)
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Kyoung-Lim Suk; Ho-Young Son; Chang-Kyu Chung; Joong Do Kim; Jin-Woo Lee; Kyung-Wook Paik
Year: 2009
Integrated materials enabling TSV/3D-TSV
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Itabashi, T.
Year: 2009
Patterning of wafer level applied non-conductive adhesives (NCAs) for camera image sensor (CIS) modules
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Il Kim; Ho-Young Son; Kyung-Wook Paik
Year: 2009
Sacrificial removal of caps of aligned carbon nanotubes for interconnect application
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Zhiyong Xiao; Yang Chai; Chan, P.C.H.; Baoqin Chen; Min Zhao; Ming Liu
Year: 2009
Hydrophobic self assembly molecular layer for reliable Cu-epoxy interface
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Wong, C.K.Y.; Yuen, M.M.F.
Year: 2009
45 Degree polymer micro-mirror integration for board-level three-dimensional optical interconnects
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Fengtao Wang; Fuhan Liu; Adibi, A.
Year: 2009
Design of compact power divider using integrated passive device (IPD) technology
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Hyun-Tai Kim; Kai Liu; Frye, R.C.; Yong-Taek Lee; Gwang Kim; Ahn, B.
Year: 2009
Design of optimal coupled-resonator baluns in silicon IPD technology
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Frye, R.C.; Kai Liu; Badakere, G.; Yaojian Lin
Year: 2009
Interference investigation of entire power distribution system from chip, package to board for high speed IO design
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Hsu, J.; Lin, J.; Chin-Sung Lin; Wu, K.
Year: 2009
Micron level placement accuracy case studies for optoelectronic products
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Evans, D.D.; Bok, Z.
Year: 2009
Optoelectrical characteristics of conjugated polymer and functionalized multi-walled carbon tube composite
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Qiu Qunfeng; Ding Wen; Huang Chao; Shi Xingwu; Hou Xun; Liu Chunliang; Bie Guojun; Zhang Jingwen; Li Haoyu
Year: 2009
Parametrical modeling and design optimization of blood plasma separation device with microchannel mechanism
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Xiangdong Xue; Patel, M.K.; Kersaudy-Kerhoas, M.; Bailey, C.; Desmulliez, M.P.Y.
Year: 2009
Influence of reflow profile and Pb-free solder paste in minimizing voids for Quad Flat Pack No-lead (QFN) assembly
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Gadepalli, H.; Dhanasekaran, R.; Ramkumar, S.M.; Jensen, T.; Briggs, E.
Year: 2009
Influences of filler geometry and content on effective thermal conductivity of thermal conductive adhesive
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Cong Yue; Yan Zhang; Liu, J.; Inoue, M.; Sijia Jiang; Zhaonian Cheng
Year: 2009
Research on a method to derive an ideal 3DSiP
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Taya, A.; Iwata, Y.; Satoh, R.; Murata, H.; Morinaga, E.; Kudo, K.; Okamoto, K.
Year: 2009
New chip device with built-in optical outlet rod for easy assembly and high optical coupling in optical interconnection
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Kanda, M.; Ogawa, T.; Mikami, O.
Year: 2009
Hybrid optical interconnection module with built-in electrical power line for mobile phone using highly-flexible integrally-formed OE-FPC
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Uemura, H.; Hamasaki, H.; Furuyama, H.; Numata, H.; Takubo, C.; Shibata, H.
Year: 2009
Novel application-specific LED packaging with compact freeform lens
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Kai Wang; Sheng Liu; Fei Chen; Zongyuan Liu; Xiaobing Luo
Year: 2009
Process development and prototyping for the assembly of LED arrays on flexible printed circuit tape for general solid state lighting
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Lee, S.W.R.; Tong, Y.W.; Chan, Y.S.; Lo, J.C.C.; Zhang, R.
Year: 2009
HiRA: A methodology for deadlock free routing in hierarchical networks on chip
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Holsmark, R.; Kumar, S.; Palesi, M.; Mejia, A.
Year: 2009
Analytical modeling and evaluation of On-Chip Interconnects using Network Calculus
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Bakhouya, M.; Suboh, S.; Gaber, J.; El-Ghazawi, T.
Year: 2009
The design of a latency constrained, power optimized NoC for a 4G SoC
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Beraha, R.; Walter, I.; Cidon, I.; Kolodny, A.
Year: 2009
Packet-level static timing analysis for NoCs
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Krimer, E.; Erez, M.; Keslassy, I.; Kolodny, A.; Walter, I.
Year: 2009
Increasing NoC power estimation accuracy through a rate-based model
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Guindani, G.; Reinbrecht, C.; da Rosa, T.R.; Moraes, F.
Year: 2009
Performance and power efficient on-chip communication using adaptive virtual point-to-point connections
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Modarressi, M.; Sarbazi-Azad, H.; Tavakkol, A.
Year: 2009
Estimating reliability and throughput of source-synchronous wave-pipelined interconnect
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Teehan, P.; Lemieux, G.G.F.; Greenstreet, M.R.
Year: 2009
Comparing tightly and loosely coupled mesochronous synchronizers in a NoC switch architecture
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Ludovici, D.; Strano, A.; Bertozzi, D.; Benini, L.; Gaydadjiev, G.N.
Year: 2009
Smart metering tariff schemes combined with distributed energy resources
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Deconinck, G.; Decroix, B.
Year: 2009
Is secure telephony possible or even desirable?
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Prevelakis, V.
Year: 2009
Using UML to model dependencies in systems of systems
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Ligaarden, O.S.
Year: 2009
A new technique of cogging torque suppression in direct-drive permanent magnet brushless machines
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Fei, W.; Luk, P.C.K.
Year: 2009
Generation and harmonics in interior permanent magnet wind generator
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Khan, M.; Saleh, S.A.; Rahman, M.A.
Year: 2009
Online loss minimization based vector control of IPMSM drive
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Uddin, M.N.; Abera, F.
Year: 2009
A Comparison of direct and indirect measurement of induction motor efficiency
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Agamloh, E.B.
Year: 2009
Induction machine design methodology for self-sensing: Balancing saliencies and power conversion properties
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Brown, I.P.; Lorenz, R.D.
Year: 2009
Elimination of system induced torque pulsations in doubly fed induction generators via field reconstruction method
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Kiani, M.; Lee, W.-J.
Year: 2009
Nonlinear high-gain observer design for operation of SPM machine under saturation using back EMF method
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Jurkovic, S.; Starngas, E.G.
Year: 2009
EM-TFL identification for Particle Swarm Optimization of HEV powertrain
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Al-Aawar, N.; Hijazi, T.M.; Arkadan, A.A.
Year: 2009
An analytical model for an N-flux barrier per pole permanent magnet-assisted synchronous reluctance motor
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Nikbakhtian, B.; Talebi, S.; Niazi, P.; Toliyat, H.A.
Year: 2009
Generic electric machine thermal model development using an automated finite difference approach
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Mayor, J.R.; Semidey, S.A.
Year: 2009
Analytical modelling and finite element computation of radial vibration force in fractional-slot permanent magnet brushless machines
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Zhu, Z.Q.; Xia, Z.P.; Wu, L.J.; Jewell, G.W.
Year: 2009
Implementation and test of an Optimization-based Space-Vector Modulation method for the 3φ-3φ matrix converter
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Yuchen Lu; Hess, H.L.; Johnson, B.K.
Year: 2009
High-order sliding mode control of a DFIG-based Wind Turbine for power maximization and grid fault tolerance
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Beltran, B.; Benbouzid, M.E.H.; Ahmed-Ali, T.
Year: 2009
Effect of variable slip rotor impedance on the performance of singly excited three phase induction motor
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Abu-Elhaija, W.S.
Year: 2009
Phase shift method for radial magnetic force analysis in induction motors with non-skewed asymmetrical rotor slots
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Chitroju, R.; Sadarangani, C.
Year: 2009
The influence of wye and delta connection on induction motor losses taking slot opening and skew effect into account
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Zhao Haisen; Liu Xiaofang; Hu Jia; Luo Yingli
Year: 2009
Adjustable flux three phase a.c. machines with combined multiple-step star-delta winding connections
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Cistelecan, M.V.; Ferreira, F.; Popescu, M.
Year: 2009
A low-cost sensorless drive for slim motors with analog filter and shift circuit free
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Jhih-Yang Lin; Ren-Jhih Tseng; Liang-Yi Hsu; Mi-Ching Tsai
Year: 2009
Improved techniques of restrained search predictive control for multiphase drives
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:M.J. Duran; F. Barrero; S. Toral; M. Arahal; J. Prieto
Year: 2009
Model predictive speed control with optimal torque constraints handling of drive systems with elastic transmission
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Cychowski, M.; Szabat, K.
Year: 2009
Enhanced predictive current control method for the asymmetrical dual—three phase induction machine
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Gregor, R.; Barrero, F.; Toral, S.; Arahal, M.R.; Prieto, J.; Duran, M.J.
Year: 2009
Optimal speed control of an Interior Permanent Magnet Synchronous Motor including cross saturation
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Nino, C.E.; Tariq, A.R.; Jurkovic, S.; Strangas, E.G.
Year: 2009
Influence of skewed and segmented magnet rotor on IPM machine performance and ripple torque for electric traction
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Aimeng Wang; Heming Li; Weifu Lu; Haisen Zhao
Year: 2009
Power-factor and torque calculation with consideration of cross saturation of the interior permanent magnet synchronous motor with brushless field excitation
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Seong Taek Lee; Burress, T.A.; Tolbert, L.M.
Year: 2009
Method for multi-objective optimized designs of Surface Mount Permanent Magnet motors with concentrated or distributed stator windings
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Duan, Y.; Harley, R.G.; Habetler, T.G.
Year: 2009
Analysis of the air-gap asymmetry in axial-flux permanent magnet generators
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Andriollo, M.; De Bortoli, M.; Martinelli, G.; Morini, A.; Tortella, A.
Year: 2009
Single phase and three phase P+Resonant based grid connected inverters with reactive power and harmonic compensation capabilities
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Maknouninejad, A.; Simoes, M.G.; Zolot, M.
Year: 2009
Modeling and experimental verification of a tubular actuator for 20 g acceleration in a pick and place application
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Meessen, K.J.; Paulides, J.; Lomonova, E.A.
Year: 2009
Type testing a 2000 MW turbogenerator
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Sedlazeck, K.; Richter, C.; Strack, S.; Lindholm, S.; Pipkin, J.; Fu, F.; Humphries, B.; Montgomery, L.
Year: 2009
Heuristic optimization strategies for automated experimental control design in variable speed drives
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Okaeme, N.; Zanchetta, P.
Year: 2009
A novel dynamometer system for testing high power variable frequency drives
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Gjini, O.; Romenesko, C.; Newnam, T.; Godbersen, J.; Trolle, N.
Year: 2009
Vector control of a multiphase induction motor with open circuit phases
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Graham, A.D.
Year: 2009
Accurate and easy-to-implement rotor position estimation scheme for sensorless control of Interior Permanent Magnet Synchronous Motor drives at full speed range
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Yan Yang; Hongwei Gao
Year: 2009
Ultra-fast finite element analysis of brushless PM machines based on space-time transformations
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Ionel, D.M.; Popescu, M.
Year: 2009
High speed magnetic network solving
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Meyer, W.; Bucherl, D.; Herzog, H.-G.
Year: 2009
Investigation of the usability of 2D- and 3D-FEM for a hybrid stepper motor
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Oswald, A.; Herzog, H.G.
Year: 2009
Application of finite-element modeling tools for analysis and design of AC drive power bus structures
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Tallam, R.M.; Lukaszewski, R.A.; Solveson, M.
Year: 2009
Origins of stator current spectra in DFIGs with winding faults and excitation asymmetries
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Williamson, S.; Djurovic, S.
Year: 2009
Modeling of synchronous machines with damper windings for condition monitoring
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Rahimian, M.M.; Butler-Purry, K.
Year: 2009
Maximum force/ampere control of linear induction motor drives in field weakening region
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Haidong Yu; Fahimi, B.
Year: 2009
Energy transfer via linear doubly-fed motor in different operating modes
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Schneider, T.; Schulz, B.; Henke, C.; Witting, K.; Steenken, D.; Bocker, J.
Year: 2009
Sensorless position control of linear tubular motors with pulsating voltage injection and improved position observer
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Cupertino, F.; Giangrande, P.; Salvatore, L.; Pellegrino, G.
Year: 2009
Comparison of a solid and a laminated rotor for sensorless control of radial active magnetic bearings
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Hofer, M.; Schmidt, E.; Schrodl, M.
Year: 2009
A new method of fault detection and treatment in five phase permanent magnet synchronous machine using field reconstruction method
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Khoobroo, A.; Fahimi, B.
Year: 2009
Generation of on-line optimal current references for Multi-phase Permanent Magnet Machines with open-circuited phases
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Kestelyn, X.; Semail, E.; Crevits, Y.
Year: 2009
Analysis of winding failure of Switched Reluctance Motors
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Schinnerl, B.; Gerling, D.
Year: 2009
Design and performance evaluation of a novel 6/10 Switched Reluctance Machine
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Desai, P.C.; Krishnamurthy, M.; Schofield, N.; Emadi, A.
Year: 2009
High-voltage stator windings, comparison of factory measurements for quality control with measurements in lab scale
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Klamt, T.; Kunz, T.
Year: 2009
Scaling laws for direct drive generators in wind turbines
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Shrestha, G.; Polinder, H.; Ferreira, J.A.
Year: 2009
Energy Management Method for solar race car design and application
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Ustun, O.; Yilmaz, M.; Gokce, C.; Karakaya, U.; Tuncay, R.N.
Year: 2009
Some armature reaction compensation methods numerical design of experiments and optimization for a hybrid excitation machine
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Li Li; Foggia, A.; Kedous-Lebouc, A.; Mipo, J.-C.; Kobylansky, L.
Year: 2009
Modeling and control of ‘pseudo’ direct-drive brushless permanent magnet machines
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Jiabin Wang; Kais Atallah
Year: 2009
A simple and accurate method for the experimental performance evaluation of high speed sensorless brushless dc motors
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Nagorny, A.S.
Year: 2009
Design and performance of interior permanent magnet motors with saturating magnetic bridge
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Nagrial, M.H.; Rizk, J.; Hellany, A.
Year: 2009
Rotor flux-barrier geometry design to reduce iron losses in synchronous IPM motors under FW operations
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Barcaro, M.; Bianchi, N.; Magnussen, F.
Year: 2009
Configurations of fractional-slot IPM Motors with dual three-phase winding
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Barcaro, M.; Bianchi, N.; Magnussen, F.
Year: 2009
Comparison of outer rotor PMSM with different pitch factors of q=1/2 and q=1/4 at same rotor geometry
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Eilenberger, A.; Heissenberger, J.; Kogler, F.; Schroedl, M.
Year: 2009
Ironless permanent magnet motors: Three-dimensional analytical calculation
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Ravaud, R.; Lemarquand, G.; Lemarquand, V.
Year: 2009
New interior PM rotor design with high flux-weakening capability
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Pouramin, A.; Madani, S.M.
Year: 2009
Influence of filter parameters/topologies on stability of matrix converter-fed permanent magnet brushless motor drive systems
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Wang, J.; Bouazdia, M.
Year: 2009
Switched Reluctance Motor vibration prediction: From low frequency to high frequency
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Shen Lei; Wu Jianhua
Year: 2009
An automatic identification of phase inductance for operation of switched reluctance machines without position sensor
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:van Treek, D.; Matuschek, P.; Brauer, H.J.; Schoenen, T.; De Doncker, R.W.
Year: 2009
Performance comparisons among radial flux, multi-stage axial flux and three-phase transverse flux PM machines for downhole applications
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Chen, A.; Nilssen, R.; Nysveen, A.
Year: 2009
Mathematical model for parametric analysis of Axial Flux Disc Machines
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Boccaletti, C.; Di Felice, P.; Petrucci, L.; Santini, E.
Year: 2009
Design method of an innovative motor for an intra-aortic ventricular assist device
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Po-Lin Hsu; McMahon, R.
Year: 2009
A comparison of radial and axial flux structures in electrical machines
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Patterson, D.J.; Colton, J.L.; Mularcik, B.; Kennedy, B.J.; Camilleri, S.; Rohoza, R.
Year: 2009
Design issues of high-speed permanent magnet machines for high-temperature applications
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Gerada, D.; Mebarki, A.; Mokhadkar, R.P.; Brown, N.L.; Gerada, C.
Year: 2009
Design and optimization of a rotary actuator for a two degree-of-freedom zφ-module
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Overboom, T.T.; Jansen, J.W.; Lomonova, E.A.; Tacken, F.
Year: 2009
Design and finite element analysis of hybrid stepper motor for spacecraft applications
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Praveen, R.P.; Ravichandran, M.H.; Achari, V.T.S.; Jagathy Raj, V.P.; Madhu, G.; Bindu, G.R.
Year: 2009
Torque ripple reduction of the modular Interior Permanent Magnet machines using optimum current profiling technique
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Guo, L.; Parsa, L.
Year: 2009
Design and analysis of Halbach array permanent magnet motor for high acceleration applications
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Dwari, S.; Parsa, L.; Karimi, K.J.
Year: 2009
Qualitative analysis of force distribution in a 3-phase Permanent Magnet Synchronous Machine
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Krishnamurthy, M.; Fahimi, B.
Year: 2009
Comparison of numerical and analytical simulation of saturated zig-zag flux in induction machines
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Hagen, R.; Knopik, T.; Binder, A.
Year: 2009
The repeatability of IEEE standard 112B induction motor efficiency tests
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Agamloh, E.B.
Year: 2009
Influence of non-linear loads on the operation and power flow of induction generators
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Karugaba, S.; Ojo, O.; Balogun, A.
Year: 2009
Fault tolerant permanent magnet motor drives for electric vehicles
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Abolhassani, M.T.; Toliyat, H.A.
Year: 2009
Development and implementation of a 25 kW virtual induction machine test bed utilizing the power-hardware-in-the-loop concept
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Fleming, F.; Edrington, C.S.; Steurer, M.; Vodyakho, O.
Year: 2009
Optimal design of motor and gear for drives with high acceleration and load torque
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Grotstollen, H.
Year: 2009
Direct torque control of three-phase PM brushless AC motor with one phase open-circuit fault
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Zhu, Z.Q.; Utaikaifa, K.; Hoang, K.; Liu, Y.; Howe, D.
Year: 2009
Real time estimation of parameters for controlling and monitoring permanent magnet synchronous motors
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Ramakrishnan, R.; Islam, R.; Islam, M.; Sebastian, T.
Year: 2009
Analytical force calculation in brushless-DC motors I: An alternative approach
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Starschich, E.; Muetze, A.; Hameyer, K.
Year: 2009
Analytical force calculation in brushless-dc motors II: Mathematical details of the alternative approach
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Starschich, E.; Muetze, A.; Hameyer, K.
Year: 2009
Influence of rotor pole number on optimal parameters in flux-switching PM brushless AC machines by lumped parameter magnetic circuit model
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Chen, J.T.; Zhu, Z.Q.
Year: 2009
Gearing ratios of a magnetic gear for wind turbines
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Frank, N.W.; Toliyat, H.A.
Year: 2009
Sensorless explicit model predictive control of permanent magnet synchronous motors
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Mariethoz, S.; Domahidi, A.; Morari, M.
Year: 2009
An adaptive structure based sensorless position estimator for permanent magnet machines in aerospace applications
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Drury, W.D.; Holliday, D.; Drury, D.; Mellor, P.H.
Year: 2009
A novel wheelchair powered by dual rim motors
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Yee-Pien Yang; Zhou-Han Lee
Year: 2009
Impact of inverter faults in the overall performance of permanent magnet synchronous motor drives
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Estima, J.O.; Cardoso, A.J.M.
Year: 2009
Fault diagnosis technique of induction machines with ordered harmonic and noise cancellation
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Choi, S.D.; Akin, B.; Rahimian, M.M.; Toliyat, H.A.; Rayner, M.
Year: 2009
Space vector harmonic analysis of a five-phase PM motor including asymmetries
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Bianchi, N.; Fornasiero, E.
Year: 2009
Multi-objective design optimization of PMSM for PEM fuel cell air-circuit with PSO algorithms
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Sari, A.; Dubas, F.; Espanet, C.
Year: 2009
Small-scale urban Venturi wind turbine: Direct-drive generator
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Paulides, J.J.H.; Encica, L.; Jansen, J.W.; Lomonova, E.A.; van Wijck, D.
Year: 2009
The application of wavelets for the detection of inter-turn faults in induction machines
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Barendse, P.S.; Herndler, B.; Khan, M.A.; Pillay, P.
Year: 2009
Operation of an induction motor with an open circuit fault by controlling the zero sequence voltage
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Jasim, O.; Gerada, C.; Sumner, M.; Arellano-Padilla, J.
Year: 2009
Diagnosis of rotor bar breakages based on the Hilbert Transform of the current during the startup transient
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Puche-Panadero, R.; Pineda-Sanchez, M.; Riera-Guasp, M.; Roger-Folch, J.; Antonino-Daviu, J.A.; Perez-Cruz, J.
Year: 2009
Minimization of life cycle energy cost of a single-phase induction motor
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Debusschere, V.; Multon, B.; Ben Ahmed, H.; Cavarec, P.E.; Geriniere, P.
Year: 2009
Application of induction machine efficiency testing standards in South Africa
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Mzungu, H.M.; Manyage, M.J.; Khan, M.A.; Barendse, P.; Mthombeni, T.L.; Pillay, P.
Year: 2009
Rotor cage of single-phase induction motors - process analysis
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:da Silva, C.A.; Dietrich, A.B.; Lopes, R.; Carlson, R.
Year: 2009
Dynamic simulation of electric machines on FPGA boards
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Hao Chen; Song Sun; Aliprantis, D.C.; Zambreno, J.
Year: 2009
High-order sliding mode control of a Marine Current Turbine driven Permanent Magnet Synchronous Generator
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Ben Elghali, S.E.; Benbouzid, M.E.H.; Charpentier, J.F.; Ahmed-Ali, T.; Munteanu, I.
Year: 2009
Maximum DC-link voltage utilization for optimal operation of IPMSM
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Schoenen, T.; Krings, A.; van Treek, D.; De Doncker, R.W.
Year: 2009
Predicted and measured errors in estimating rotor position by signal injection for salient-pole PM synchronous motors
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Bianchi, N.; Bolognani, S.; Faggion, A.
Year: 2009
Development of analytical equations to calculate the cogging torque in transverse flux machines
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Ferreira da Luz, M.V.; Dular, P.; Sadowski, N.; Carlson, R.; Bastos, J.P.A.
Year: 2009
Design method for brush permanent magnet DC motors
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Cros, J.; Sincero, G.C.R.; Viarouge, P.
Year: 2009
Influence of the stator slot opening on the characteristics of windings with concentrated coils
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Gerling, D.
Year: 2009
Magnetic radial force density of the PM machine with 12-teeth/10-poles winding topology
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Dajaku, G.; Gerling, D.
Year: 2009
Optimal split ratio in fractional-slot interior permanent magnet machines with non-overlapping windings
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Wu, L.J.; Zhu, Z.Q.; Chen, J.T.; Xia, Z.P.; Jewell, G.W.
Year: 2009
Design and optimization of an IPMSM with fixed outer dimensions for application in HEVs
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Finken, T.; Hameyer, K.
Year: 2009
A control scheme with energy saving and dc-link disturbance rejection for electric vehicles
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Casadei, D.; Mengoni, M.; Rossi, C.; Serra, G.; Tani, A.; Zarri, L.
Year: 2009


Advertisement