Hdl-Models Verification Strategy
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:G. Krivulya; Y. Syrevitch; A. Karasev; A. Krasovskaya
Year: 2006
Usage of the Analytic Hierarchy Process for Production Optimization
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:V. Dubrovin; N. Mironova
Year: 2006
The analysis of noiseproof circuits of digital electronic equipment
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:V. Krischuk; R. Kudermetov; A. Pritula
Year: 2006
Diagnosing of Radio-Electronic Equipment With the Help of Traditional CAD Systems
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:K. Kasyan; N. Kasyan
Year: 2006
Electronic Devices Components Parameters Long-term Investigation Automation
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Y. Bobalo; V. Glemba; O. Lazko; L. Lazko; L. Nedostup
Year: 2006
Modeling Reliability of Unsymmetrical Ramified Systems
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:D. Marunchak; A. Sydor
Year: 2006
Research of Influencing of Alloying Additions on Heatproof, Heatt Ransfer and Welded of the Nickel Coat Corps IS
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:S.P. Novosjadly; R.M. Ivanjuk
Year: 2006
Interval Tolerances Assignment for Non-Monotone Output Functions
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:O. Voropay
Year: 2006
Design of Algorithms of Working of Information About the State of Objects
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:M. Medykovskiy; L. Sikora
Year: 2006
Using Derivative Free Approaches for Building Technological Process Optimization Software
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Leonid Nedostup; Myroslaw Kiselychnyk; Bohdan Mandziy; Andriy Bench
Year: 2006
The Effect of Structural Parameters on Electrical Resitance of Microcontact Connections in Integrated Circuits
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:L. Smerklo; D. Dyachok; M. Hladun
Year: 2006
Incomplete Medicobiologic Data Mathematical Treatment and Modeling
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:G. Glemba; O. Lazko
Year: 2006
Hardvare Design for Processing Medical Signals
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:V. Semenets; O. Kruk
Year: 2006
Method of Manufacturing Precision Diaphragmes Wave-Guide of HF-Devices of a Millimeter-Wave
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:N. Dorosh; G. Kuchmiy; L. Smerklo
Year: 2006
Application of CAD/CAE/CAM-Systems for Anticrisis Management of Industrial - Financial Groups
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:M. Kolisnyk; K. Kolesnyk
Year: 2006
Agent's Technologies of Automated System for Enterprise Management
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:A. Goretsky
Year: 2006
Management of Development of Computer and Telecommunication Maintenance of Services Sphere Enterpnses
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:I. Novakivsky; K. Protsak
Year: 2006
Solving the Problems of Modern Radoelectronic and Telecommunication Problems for a Sustainable and Balanced Regional Growth
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:H. Kopets; O. Semeniv; O. Shchur
Year: 2006
Economic Problems of Implementation and Application of Telecommunication and Computer Networks in Ukraine
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:B. Bohdana; D. Julia
Year: 2006
Research of the Distributed Infornation Systems Efficiency on the Basis of Prime Price Diagrams of Data Movement Cycles
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:N. Vozna
Year: 2006
Web Technologies In Management Of Small And Middle Size Firms
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:P. Sikorski; W. Zabierowski; A. Napieralski
Year: 2006
Ways of Creative Components Improvement in the Engineering Education
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:A. Petrenko
Year: 2006
First American-Ukrainian School of Computer Sciences and Technologies: Reality and Perspective
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:A. Sachenko; G. Markowsky; R. Pasichnyk
Year: 2006
A New Electrothermal Simulator in Analogue Integrated Circuit Design
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:M. Kaminski; M. Jankowski; M. Szermer
Year: 2006
A new single-feed proximity coupled circularly polarized square ring antenna
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Kin-Fai Tong
Year: 2006
Gain-enhanced slot antenna fed by conductor-backed coplanar waveguide
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:I-Ching Lan; Powen Hsu
Year: 2006
Synthesis and realization of novel ultra-wideband bandpass filters using 3/4 wavelength parallel-coupled line resonators
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Peng Cai; Zhewang Ma; Xuehui Guan; Y. Kobayashi; T. Anada; G. Hagiwara
Year: 2006
Hybrid CAD techniques for the efficient full-wave optimization of arbitrarily shaped waveguide components and large aperture antennas
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:F. Arndt; V. Catina; J. Brandt
Year: 2006
A consideration on a Beam Adjustable Microstrip Array Antenna
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:M. Yassir; Y. Kimura; M. Haneishi
Year: 2006
Design-for-manufacturability (DFM) methodology and yield analysis for embedded RF circuits for system-in-package (SiP) applications
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:S. Mukherjee; M. Swaminathan
Year: 2006
On-wafer level packaging of RF MEMS devices for Ka-band applications
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Qun Wu; Bo-Shi Jin; Xun-Jun He; Kai Tang; Fang Zhang; Jong-Chul Lee
Year: 2006
Quasi-invariant single-parameter criterion for unconditional stability: Review and application
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Eng Leong Tan
Year: 2006
Harmonic orthogonality condition in RF Class-E Power Amplifiers
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:M.A.Y. Medina; D. Schreurs; B. Nauwelaers
Year: 2006
A high power performance 60 GHz push-push oscillator MMIC in metamorphic HEMT technology
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:J.-W. Lee; S.-W. Kim; G.-S. Seol; K.-S. Seo
Year: 2006
Accurately measure phase-locked loop lock time in production
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:L. Zhang
Year: 2006
Residual and oscillator phase noise in GaAs metamorphic HEMTs
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Mattias Ferndahl; Herbert Zirath
Year: 2006
Sub milli-watt, 2.4 GHz, super-regenerative transceiver with ultra low duty cycle
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:I. McGregor; E. Wasige; I. Thayne
Year: 2006
A reconfigurable CMOS power amplifier with flexible matching network
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Seok-Oh Yun; Hyung-Joun Yoo
Year: 2006
High susceptibility of micro-phonic and phase-hit dual loop push-push synthesizer design for high modulation microwave digital radios
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Ying Shen; L. Villeneuve; N. Hassaine
Year: 2006
Analysis of electromagnetic noise suppression in microstrip lines with absorber sheets
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:V.B. Bregar; A. Znidarsic
Year: 2006
High-efficiency GaN/AlGaN HEMT oscillator operating at L-band
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Jae Shin Kim; Wenhsing Wu; Jenshan Lin; A. Verma; Soohwan Jang; F. Ren; S. Pearton; R. Fitch; J. Gillespie
Year: 2006
A compact rat race coupler design for dual-band applications
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Fai-Leung Wong; K.-K.M. Cheng
Year: 2006
Micromachined inset-fed patch antenna at Ka-band
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:P. Sharma; S.K. Koul; S. Chandra
Year: 2006
Ka-band flip-chip assembled power amplifier
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Chi-shien Lee; Wei-kuo Huang; Che-ming Wang; Yue-ming Hsin; Tsung-Jung Yeh
Year: 2006
Compact combline filter with improved cross coupling assembly and temperature compensation
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:M. Hoft; S. Burger; T. Magath; O. Bartz
Year: 2006
A 55GHz 5-pole NRD guide E-plane bandpass filter for millimeter wave OFDM applications
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Takashi Shimizu; Yuki Kawahara; Takayuki Nakagawa; Tsukasa Yoneyama
Year: 2006
High compactness / high isolation 3D-broadside couplers design methodology
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Minh-Nhut Do; D. Dubuc; K. Grenier; L. Bary; L. Mazenq; R. Plana
Year: 2006
Non-uniform tapered ultra wideband directional coupler design and modern ultra wideband balun integration
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:P. Salem; Chen Wu; M.C.E. Yagoub
Year: 2006
A CPW hybrid coupler with an enhanced coupling microstructure
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Y. Kitsukawa; M. Hangai; Sang-Seok Lee; T. Nishino; Y. Yoshida; M. Miyazaki
Year: 2006
Measurements of a Compact Surface Wave Launcher Array with Application to Single Frequency Beam Steering Leaky Wave Antennas
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:A.P. Freundorfer; M.Z.I. Bekheit; Y.M.M. Antar
Year: 2006
An UWB planar out-of-phase power divider employing microstrip-slot and parallel stripline-microstrip transitions
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:A.M. Abbosh; M.E. Bialkowski; J. Mazierska
Year: 2006
A design method of dual-frequency wilkinson power divider
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:T. Kawai; J. Yamasaki; Y. Kokubo; I. Ohta
Year: 2006
Effect of the conductivity profile on the stability of the ADI-FDTD method with split-field PML
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Jiunn-Nan Hwang; Fu-Chiarng Chen
Year: 2006
An efficient FDTD algorithm for computation of resonance frequencies of an inhomogeneous cylindrical structure
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:K.V. Srivastava; V.V. Mishra; A. Biswas
Year: 2006
A 2.14 GHz class-E LDMOS power amplifier
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Yong-Sub Lee; Kye-Ik Jeon; Yoon-Ha Jeong
Year: 2006
Prospective and issues for GaN microwave electronics into space satellites
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:J.-L. Cazaux; S. Forestier; J.-F. Villemazet; O. Vendier; C. Schaffauser; C. Drevon; J.-L. Muraro
Year: 2006
Development of an MCPA using digital pre-distortion for digital terrestrial TV broadcasting
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:K. Haeiwa; K. Kanamori; T. Abe
Year: 2006
Novel microstrip dual-band bandstop filter with controllable dual-stopband response
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Zhewang Ma; K. Kikuchi; Y. Kobayashi; T. Anada; G. Hagiwara
Year: 2006
Vibration modal analysis used finite element method of microwave amplitude equalizer
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Yang Mingshan; Du Xiaoyan; Zhang Dewei; Niu Zhongxia
Year: 2006
A new mathematical design method of microstrip tapped-line filters
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Il-Woo Lee; Seung-Hyun Han; Tae-Soon Yun; Ki-Cheol Yoon; Zhang Fang; Jong-Chul Lee
Year: 2006
A single matching network design for a double band PIFA antenna via simplified real frequency technique
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:B.S. Yarman; M. Sengul; P. Lindberg; A. Rydberg
Year: 2006
RF passives for a 0.25 μm digital CMOS process
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:J.R.E. Hizon; M.D. Rosales; H.L.B. Tan; L.P. Alarcon; D.J. Sabido
Year: 2006
A new type of multi-way microwave power divider based on Bagley Polygon power divider
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:I. Sakagami; T. Wuren; M. Fujii; Y. Tomoda
Year: 2006
Performances optimization of capacitive parallel MEMS switches
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:C. Bordas; K. Grenier; D. Dubuc; M. Paillard; J.-L. Cazaux; R. Plana
Year: 2006
A micromachined wide-band suspended-line coupler at 24GHz for vehicle radar applications
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:A. Corona-Chavez; I. Llamas-Garro; Jung-Mu Kim; Yong-Kweon Kim
Year: 2006
A single-diode frequency doubler using a feed-forward technique
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:P. Rajanaronk; A. Namahoot; P. Akkaraekthalin
Year: 2006
Temperature dependence of complex permittivity of planar microwave materials
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:M.V. Jacob; J. Krupka; J. Mazierska; M. Bialkowski
Year: 2006
Transmission performance of UWB-IR system using DLL timing synchronization
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:T. Wada; H. Okada
Year: 2006
Top vs. bottom charging of the dielectric in RF MEMS capacitive switches
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Zhen Peng; Xiaobin Yuan; J.C.M. Hwang; D. Forehand; C.L. Goldsmith
Year: 2006
Scalable nonlinear resistor model for GaAs MMIC
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Yu Zhu; Cejun Wei; O. Klimashov; C. Zhang; Y. Tkachenko
Year: 2006
Miniaturized dual-mode quasi-elliptic function bandpass filter with wide rejection bandwidth
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Yu-Zhen Wang; Chia-An Wang; Kun-Ying Lin
Year: 2006
A design of wide band small chip antenna using the branch structure for mobile phone
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:M. Kim; Sanguk Park; Nadan Kang; Hyeongdong Kim
Year: 2006
Multi-path design for stepped-impedance low-pass filter to create transmission zeros and wide rejection band
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Min-Chieh Kang; Jen-Tsai Kuo
Year: 2006
Digital signal processing of multi-reflection for short range detection using NRD guide pulse radar front- end at 60 GHz
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:F. Kuroki; T. Izuho; T. Yoneyama
Year: 2006
Compact multi-band antenna for mobile telephone applications
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Sheng-Yi Huang; Yeuh-Ta Chung; Jwo-Shiun Sun
Year: 2006
Micromachined GaN-based FBAR structures for microwave applications
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:K. Mutamba; D. Neculoiu; A. Muller; G. Konstantinidis; D. Vasilache; C. Sydlo; A. Kostopoulos; A. Adikimenakis; A. Georgakilas; H.L. Hartnagel
Year: 2006
Prediction of phase noise in 2.4GHz SAW oscillator with surface transverse wave resonator
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Jon-Hong Lin; Yao-Huang Kao
Year: 2006
Serial-parallel connection of direct sampling mixer
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Y. Morishita; K. Araki; Y. Hosokawa; K. Abe; N. Saito
Year: 2006
Novel compact dual-band bandpass filters using composite resonators to obtain separately controllable passbands
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Zhewang Ma; T. Shimizu; Y. Kobayashi; T. Anada; G. Hagiwara
Year: 2006
Novel design and implementation methods of high-performance RF/microwave planar filters using composite resonators
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Zhewang Ma; Y. Kobayashi
Year: 2006
Design of detector circuit for layer structured imaging module
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:K. Ohkawa; K. Sakakibara; Y. Aoki; N. Kikuma; H. Hirayama
Year: 2006
Measurements on UHF radio propagation over the Seto Inland Sea
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:M. Nishi; T. Iwami; S. Takahashi; T. Yoshida
Year: 2006
Low-loss LIGA-fabricated coplanar waveguide and filter
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:M.A. Forman
Year: 2006
A broadband, low-reflection H-plane waveguide corner with a dielectric circular post
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:K. Toda; I. Ohta; M. Kishihara
Year: 2006
Analysis of quadruple-ridged square waveguide by multilayer perceptron neural network model
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Yiming Tang; Jianzhong Zhao; Wen Wu
Year: 2006
Coupled computational intelligence and time-domain method for design of the microwave devices
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Hong-Son Chu; Er-Ping Li; Enxiao Liu; J.-L. Dubard
Year: 2006
Macro element methods in FEM for 3-D electromagnetic radiation problems
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Nian Feng; Dong Shuo; Zhou Lezhu; Xia Mingyao
Year: 2006
Unequal cross aperture coupled compact CP antenna with four Y-Shaped slits and normal slits
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Yong-an Lee; Ho-yong Kim; Byoung-in Mun; Hong-min Lee
Year: 2006
A novel wideband patch antenna for 2.4/5 GHz WLAN applications
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Ki Suk Yoon; Sung Min Kim; Woon Geun Yang
Year: 2006
CPW-fed ultra wideband (UWB) monopoles with band rejection characteristic on ultra thin organic substrate
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Symeon Nikolaou; Boyon Kim; Y.-S. Kim; John Papapolymerou; Manos M. Tentzeris
Year: 2006
Development of low-loss millimeter-wave antennas on fluorine substrate using electro-fine-forming fabrication
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:N. Ito; A. Mase; N. Seko; M. Tamada; E. Sakata; Y. Kogi
Year: 2006
Three-dimensional on-chip conical spiral antennas on video-monitored micromachined (100) silicon wafers
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:H. Sedaghat-Pisheh; S. Mohajerzadeh; M. Shahabadi
Year: 2006
Design of magnetic antenna with dual circular polarizations
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Wanchu Hong; Hung-Hsiang Wang; Yu-De Lin; T. Kitazawa
Year: 2006
Wide-band circular antenna arrays consisting of bicone, semi bicone or bowtie elements
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:R. Gunnarsson; T. Martin; A. Ouacha
Year: 2006
Carburisation layers for the growth of silicon carbide on silicon
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:G. Attolini; B. Watts; M. Bosi; C. Frigeri; C. Ferrari; G. Salviati; T. Besagni; S. Kaciulis; L. Pandolfi
Year: 2006
Fabrication of Photonic Crystal Structures by Electron Beam Lithography
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:G. Rosolen; A. Cola
Year: 2006
Direct measurement of the inter-diffusion in quantum wells enhanced by group V intermixing for InP- based structures
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:O. Hulko; D.A. Thompson; J.G. Simmons
Year: 2006
Electrical and Structural Studies of Laser-debonded GaN Light Emitting Diodes
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:K.K. Leung; C.P. Chan; T.M. Yue; C. Surya
Year: 2006
Boundary Trench Isolation Effects on a Stacked Gradient Homojunction Photodiode Architecture
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:P.V. Jansz; S. Hinckley
Year: 2006
Planar Microstructures in Surface Micromachining Process Using RF Sputtered ZnO as Sacrificial Layer
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:V. Bhatt; S. Chandra
Year: 2006
Optimised Two-Temperature Growth of GaAs Nanowires by Metalorganic Chemical Vapour Deposition
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:H.J. Joyce; Y. Kim; Q. Gao; H.H. Tan; C. Jagadish
Year: 2006
Top Emitting OLEDs with multi-layered Mirror Consisting of Metallic and Dielectric Layers
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:A.W. Lu; J. Chan; A.D. Rakic; A. Man Ching Ng; A.B. Djurisic
Year: 2006
Adhesion energy and shape of nanogap InP/InGaAs microcantilevers
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:J.D. Makowski; A.S. Gawarikar; J.J. Talghader
Year: 2006
Design and optimisation of a MEMS-based tunable Fabry-Pérot infrared filter
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:B.A. Walmsley; J.M. Dell; Yinong Liu; Xiao Zhi Hu; M.B. Bush; L. Faraone
Year: 2006
Elements of Nanophotonics: Photonic Crystals, Photonic Wires, Metamaterials and More
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:R.M. De La Rue; A.Z. Khokhar; B. Lahiri; M. Sorel; F. Rahman; M. Gnan; H.M.H. Chong; P. Pottier; A.R.M. Zain; C.N. Ironside; J.W. Ogungbenro; N.P. Johnson; S. McMeekin
Year: 2006
Highly sensitive single crystalline metal oxide nanowires gas sensors
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:E. Comini; C. Baratto; G. Faglia; M. Ferroni; A. Vomiero; G. Sberveglieri
Year: 2006
Prognostics and Health Monitoring of Electronics
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:M. Pecht
Year: 2006
Nano-structured Interconnects for System Integration
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:R. Aschenbrenner; S. Fiedler; T. Loher; B. Pahl; K.-F. Becker; H. Reichl
Year: 2006
Electromigration and thermomigration in flip chip solder joints
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:K.N. Tu; Annie Huang; Fan-Yi Ouyang
Year: 2006
RF Property Variations on Plastic Packaging Due to Molding Compound Effects
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Kun-Fu Tseng; Yi-Hsun Hsion; Ben-Je Lwo; Min-I Yang
Year: 2006
Comparison between Experimental Measurement and Numerical Analysis of Warpage in PBGA Package and Assembly with the Consideration of Residual Strain in the Molding Compound
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:M.Y. Tsai; Y.C. Chen; S.W.R. Lee
Year: 2006
Consideration of Mold Compound Cure Shrinkage in Finite Element Modeling
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Chua Li Yean; Mayhuan Lim; A. Yeo; C. Lee
Year: 2006
Novel Non-Conductive Films(NCFs) with Multi-Functional Epoxies and Silica Fillers for Reliable NCFs Flip-Chip-On-Organic Boards
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Chang-Kyu Chung; Hyoung-Joon Kim; Kyung-Wook Paik
Year: 2006
Process and Material Characterization of Die Attach Film (DAF) for Thin Die Applications
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:M. Teo; Soh Choew Kheng; C. Lee
Year: 2006
Influence of Material Combination on Package Stress and Verification of Numerical Model
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:S. Krishnan; A. Aripin; M.R. Muhamad
Year: 2006
Wirebond Bond Process Control and Monitoring System
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:A. Rogado
Year: 2006
Development of Flip Chip Die Bump Temperature Measurement Methodology Using a Computational Fluid Dynamics (CFD) Tool
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Chun Keang Ooi; Logendran Bharatham; Chia-Pin Chiu; David Chau; Ashish Gupta
Year: 2006
An inorganic approach to wet-chemical fabrication of 3rd generation tandem cells
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Meng Tao
Year: 2006
Decision Support Systems for Eco-friendly Electronic Products
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Y.K. Tang; S. Stoyanov; C. Bailey; H. Lu
Year: 2006
Thermal Resistance Analysis of a Multi-Stack Flip Chip 3-D Package
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Y.S. Chan; S.W.R. Lee
Year: 2006
A Study of Application Pressure on Thermal Interface Material Performance and Reliability on FCBGA Package
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:L. Bharatham; Wong Shaw Fong; Chan Joo Leong; Chia-Pin Chiu
Year: 2006
Solder Joint Reliability (SJR) Study of Integrated Heat Spreader (IHS) Packages
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Shaw Fong Wong; Wei Keat Loh; Kang Eu Ong; Yung Hsiang Lee; Huey Ling Lew; Seok Ling Lee
Year: 2006
Signal Integrity Analysis and Validation of GHz I/O Interface on Wire Bond Ball Grid Array Technology Package
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:H.J.H. Since; Lee Chan Kim; Kuan Chin Lee
Year: 2006
The squeezing process of complex epoxy patterns in the die-attaching of large IC-chip
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:M. Lee
Year: 2006
CPU Package Design Optimization for Performance Improvement and Package Cost reduction
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Howe Yin Loo; Boon Howe Oh; Poh Tat Oh; Eng Kwong Lee
Year: 2006
Package Routing and Thermal Analysis on a Multi-Chip Package (MCP)
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Boon Howe Oh; Eng Kwong Lee; Howe Yin Loo; Poh Tat Oh
Year: 2006
Residual Stress Distribution in Stacked LSI Chips Mounted by Flip Chip Technology
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:N. Ueta; H. Miura
Year: 2006
Mechanical Behaviour of Grains in SnAgCu Solder Joints
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Jicheng Gong; Changging Liu; P.P. Conway; V.V. Silberschmidt
Year: 2006
An Accurate Solution for Thermo-mechanical Stresses in Tri-Material Assembly in Electronic Packages
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:D. Sujan; T.S. Sridhar; K.N. Seetharamu; M.V.V. Murthy; A.Y. Hassan
Year: 2006
Printed polymer based RFID antenna on curvilinear surface
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:S.Y.Y. Leung; P.K. Tiu; D.C.C. Lam
Year: 2006
A Study of Nondestructive Inspection Method of Bump Connection in Three Dimensionally Stacked Chip Structures
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Y. Sato; H. Miura
Year: 2006
Singular Uniformity after Reflow of Varied-Shaped Flip Chip Solder Bump on Single Substrate
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Hou-Jun Hsu; Jung-Tang Huang; Pen-Shan Chao; Chan-Shoue Wu; Sheng-Hsiung Shih; Sen-Yeu Yang
Year: 2006
Challenges in Stacked CSP Packaging Technology
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Boon Howe Oh; Howe Yin Loo; Poh Tat Oh; Eng Kwong Lee
Year: 2006
Snap Cure Wafer Back Glue Coating as Die Attach Method for Transistor and Diode Dice
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:B.H.W. Lui; H. van Rijckevorsel; P.P.H. Tsang; M.M.P. Tsang; M.C.H. Leung; A.R. Bok; L. Mohamed; C.Y. Chan; M. Dirkzwager
Year: 2006
Influence of Package Assembly Process on Solder Joint Reliability - an Application of Component Level Shock Methodology
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Lee Yung Hsiang; Loh Wei Keat; Ee Boon Yee; Leong Jenn Seong; Lew Huey Ling
Year: 2006
Ag-Sn Fluxless Wafer Bonding Technology
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Xiao Gang li; Jian Cai; Yoon Chul Sohn; Qian Wang; Woonbae Kim
Year: 2006
Alternative Test Solution for Low Power, Small Footprint Leadless Package
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Ly Lim; D. Chong
Year: 2006
Electroless Plating Ni-based Barrier Layers for 3D Interconnection
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Jian Cai; Guoqiang Feng; Zhigang Yang; Shuidi Wang; Songliang Jia
Year: 2006
Optimization of Power Delivery Design and Methodologies
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Yee Hung See Tau
Year: 2006
Modeling of Three-Dimensional Geometry of Solder Joint in Fiber Attachment Soldering
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Wei Zhang; Chunqing Wang; Yanhong Tian
Year: 2006
2.0mil Copper Wire - Tail Short Improvement and Robustness Study
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Chew Yuen Bee
Year: 2006
Drop Test Simulation of Electronic Devices using Finite Element Method
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:David Cadge; Jason Wang H.J.; Rui Bai; Ping Gong
Year: 2006
Coupled Thermal-Moisture-Stress Analysis for Electronic Packages
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:David Cadge; Jason Wang H.J.; Junlong Bie; Xuewei Sun; Rui Bai; Ping Gong
Year: 2006
Assessment of MicroInductors for DC-DC Converters
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:D. Flynn; Hua Lu; C. Bailey; M. Desmulliez
Year: 2006
Comparison of Bond Interface Reaction in Al-Ni and Al-Au Systems Formed by Ultrasonic Wedge Bonding
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Mingyu Li; Hongjun Ji; Chunqing Wang
Year: 2006
A New Technique of Minute Birefringence Measurement by using Simple Polarimetry
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:K. Gomi; K. Ichinose; Y. Niitsu
Year: 2006
Using Micro-electroforming and Micro-assembly Technology to Fabricate Vertical Probe Card
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Jung-Tang Huang; Kou-Yu Lee; Chan-Shoue Wu; Chung-Yi Lin; Sheng-Hsiung Shih
Year: 2006
Test Yield Improvement of Class II Bluetooth Devices Through Power Output Optimization Via Circuit Element Tuning
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:J.C. Rabago; A.N. Quillosa
Year: 2006
Building-in Reliability for VLSI
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Zou Xin-yao; Yao Ruo-he
Year: 2006
Tin Whisker Accelerated Test Project
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Chieh-Ju Lee; H. Reynolds
Year: 2006
Advanced soldering paste suitable for Package-on-Package process
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:T. Maeda; T. Sakai; S. Sakemi; K. Ishibashi
Year: 2006
Integration of CNT with TIA into gas sensors
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Jung-Tang Huang; Yao-Yi Yang; Shey-Shi Lu; Cheng-Hung Tsai; Liang-Tse Lin; Chiu-Chin Yang
Year: 2006
Analysis of The Relationship Between Optical Property and Deformation Behavior of Polymeric Materials by Network Model
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:A. Shinozaki; K. Kishimoto; H. Inoue
Year: 2006
System-in-Package (SiP) Design: Issues, Approaches and Solutions
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:L.L.W. Leung; M.L. Sham; W. Ma; Y.C. Chen; J.R. Lin; T. Chung
Year: 2006
Substrate Design & Process Optimization of LGA (BT-based) Package
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:C. Chew; Chip King Tan
Year: 2006
Effects of Microstructure on Thermal and Mechanical Properties of PBGA Substrates
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:G.C. Tang; J.W.K. Shing; Haibin Chen; R. Lee; Jingshen Wu
Year: 2006
Frequency Domain Based Topology Optimization for DRR2-533 DRAM Interface in SFF Domain
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:L. Lakshman; P. Ramaswamy; Woong Hwan Ryu
Year: 2006
DRAM memory electrical yield improvement by backgrinding induced backside damage
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Kwei-Kuan Kuo; S. Emoto; T. Tabuchi; Y. Igami
Year: 2006
Charaterizing LEDs for Mixture of Colored LED light sources
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Shang Ping Ying; Chun-Wen Tang; Bin-Juine Huang
Year: 2006
Achieving Optimum Manufacturing Yield for RF System-in-Package (SiP) Devices Through Process Sensitivity Analysis
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:C.O. Romero; E.C. Baruelo
Year: 2006
New 3D Stacked Technology System for PoP/SiP & Electric Components
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Y. Hirai
Year: 2006
Improving RF Power Amplifier Performance Through Bond Wire Loop Height Optimization
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:S.L. Licuanan; L.T. Sison
Year: 2006
Capacity Improvement Through Cycle Time Reduction
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:B. Nirmala; M. Azmi
Year: 2006
Design of a More Robust QFN Package through Virtual Prototyping and Advanced Characterization
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:C. Hunat; C. Lagdameo; R. Galang; E.M. Benedicto
Year: 2006
Junction Capacitance Test-An INNOVATIVE Design of "Bond-off" Detection
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:B. Zhu
Year: 2006
Comparison of Two Advanced Substrate Technologies in a High End Networking Application
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:J. Priest; Li Li; Jie Xue
Year: 2006
Current Density Dependence of EM (Electromigration)-Induced Flip-Chip Cu Pad Consumption
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:P.L. Liao; C.Y. Liu
Year: 2006
The influence of reflow peak temperature on BGA solder joints' mechanical reliability in backside compatible soldering
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Limin Chen; Sang Liu; Yuming Ye; Yunhua Tu; Zhiwei Song; Zhao Xiang; Zhi Xu
Year: 2006
Assessment on Reliability of 1.0mm pitch BGA Package double-side assembly
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Yuming Ye; Sang Liu; Limin Chen; Jian Zhang; Zhao Xiang; Zhiwei Song
Year: 2006
Circulant graphs and spherical codes
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:S.I.R. Costa; J.E. Strapasson; R.M. Siqueira; M. Muniz
Year: 2006
Identification of nonlinear MIMO radio over fiber uplink channels
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:C.A.R. Fernandes; A. Kibangou; G. Favier; J.C.M. Mota
Year: 2006
Optimization of bragg grating in optical fiber using modified fitness function and an accelerated genetic algorithm
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Marco Jos de Sousa; Claudomiro Souza Sales; Joo Chamma C. Carvalho; Joo Crisstomo Weyl Albuquerque Costa; C. R. L. Francs; M. E. V. Segatto
Year: 2006
On efficient implementations of the set-membership NLMS algorithm for real-time applications
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:J.A. Apolinario; M.L.R. de Campos
Year: 2006
An implementation of an OSPF-TE to support GMPLS-controlled all-optical WDM networks
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:L.G. Zuliani; M. Savasini; G.S. Pavani; R. Pasquini; F.L. Verdi; M. Magalhaes
Year: 2006
Statistical analysis of the FXLMS algorithm about the steady-state solution
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:L.S. Resende; J.C.M. Bermudez
Year: 2006
Space-time blind decision feedback equalizer
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:J. Mendes Filho; M.T.M. Silva; M.D. Miranda
Year: 2006
A new quasi-Yagi bowtie type integrated antenna
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:F.C. Costa; G. Fontgalland; A.G. D'Assuncao; T.P. Vuong; L.M. Mendonca
Year: 2006
A three-dimensional microcellular propagation street model using vectorial analysis in UHF band
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:E. Silva; G.A. Carrijo
Year: 2006
Equalization of keystroke timing histograms for improved identification performance
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:J. Montalvao; C.A.S. Almeida; E.O. Freire
Year: 2006
Low cost eye diagram reconstruction and morphological analysis for optical network performance monitoring using digital signal processing techniques
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:E. Mobilon; M.R.X. de Barros; A. Lopes
Year: 2006
Adding diversity to multi-user downlink beamforming by using BER constraints
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:D.Zanatta Filho; L. Fety; J.M.T. Romano
Year: 2006
Accelerating the convergence of the widely linear LMS algorithm for channel equalization
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:F.J.A. de Aquino; C.A.F. da Rocha; L.S. Resende
Year: 2006
Hierarchical multiscale image segmentation
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:K.S. Silva; G.G. Lima; F.N.S. Medeiros
Year: 2006
Green VFBGA Package Development for PoP Technology Study
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:J.M. Liu; Yuan Yuan; Wei Gao; Y.Q. Su; R. Han; M.C. Han; Y.S. Lu
Year: 2006
Packaging Challenges for Miniaturized SOT Packages
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Zeng Dexin; H.J. Song; Yang Li; H.B. Tan; Pan Qianghua
Year: 2006
Overview and Emerging Challenges in Wafer Thinning Process for Handheld Applications
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:V.P. Ganesh; C. Lee
Year: 2006
Improved Reliability of Leadfree Flip Chip Assemblies Using Direct Underfilling by Transfer Molding
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:T. Braun; B. Wunderle; K.-F. Becker; M. Koch; V. Bader; R. Aschenbrenner; H. Reichl
Year: 2006
Wafer Bumping & Wafer Level Packaging for 300mm Wafer
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:T. Oppert; E. Zakel; T. Teutsch
Year: 2006
Reliability Performance of Stretch Solder Interconnections
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:S.S. Lim; R. Rajoo; E.H. Wong; W.Y. Hnin
Year: 2006
Thermal Performance Prediction of QFN Packages using Artificial Neural Network (ANN)
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:R.C. Law; Raymond Cheang; Y.W. Tan; I.A. Azid
Year: 2006
Thermal Management through In-Board Heat Pipes Manufactured using Printed Circuit Board Multilayer Technology
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:W. Wits; R. Legtenberg; J. Mannak; B. van Zalk
Year: 2006
Practical Considerations in High Power LED Junction Temperature Measurements
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:B. Siegal
Year: 2006
Thermal Analysis of Micro-Pipe Laden Substrate in Thermoelectric Micro-coolers
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:F.A. Abidi; S.H. Masood
Year: 2006
Considerations on Low Cost Placement Equipment for Board Assembly
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:G. Olson; Dongkai Shangguan
Year: 2006
Design, Process Development and Prototyping of 3D Packaging with Multi-Stacked Flip Chips and Peripheral Through Silicon Via Interconnection
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:R. Hon; S.W.R. Lee
Year: 2006
Laser assisted soldering and Flip-Chip attach for 3-D packaging
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:T. Oppert; G. Azdasht; E. Zakel; T. Teutsch
Year: 2006
High Speed I/O Design Optimization in FCMMAP Packaging
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Chee Hoo Lee; Eu Soon Lee; P. Victor; S.A. Udy; A.E. Anne
Year: 2006
Improving Solder Joint Reliability of WLP by Means of a Compliant Layer
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Lee Hun Kwang; Lee Sai Mun; Soo Yik Foong; Wong Seek Jiong
Year: 2006
Assessment of Solder Joint Fatigue Performance Using Cyclic Flexural Loading
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:M.N. Tamin; Y.B. Liew; A.N.R. Wagiman; W.K. Loh
Year: 2006
Solder Fatigue Modeling of Flip-Chip Bumps in Molded Packages
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Kar Wei Shim; Wai Yew Lo
Year: 2006
GA optimized Power MOSFET model
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:D. Isa; Low Iemt Mei Fong; L. Leong; Lau Yee Kuan
Year: 2006
Thermal Sensitivity of UBM Adhesion in WLCSP
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:J.C. Punzalan
Year: 2006
Board Level Reliability of Wafer Level Chip Scale Packages With Copper Post Technology
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:A.B. Jacobe; P.B. Lomibao; J. Jackson
Year: 2006
Temperature Cycling Failures of a FC/WB Stacked Die SiP with F2F Micro-bump Interconnections
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Ka Yau Lee; C. Ng; P. Lee; C. Lee
Year: 2006
Towards Higher Reliability Challenge of Au-Al intermetalic system
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Yong Cheng Choi; Siong Chin Teck; Low Teck Poh; Ho Poh Hoon; S. Diong
Year: 2006
Study of Dynamic Warpage of Flip Chip Packages under Temperature Reflow
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Chee Kan Lee; Wei Keat Loh; Kang Eu Ong; I. Chin
Year: 2006
Impact of Mold Compound Cure Shrinkage on Substrate Block Warpage Simulation
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Mayhuan Lim; Chua Li Yean; A. Yeo; C. Lee
Year: 2006
Clamp Placement Optimization in Full-Chip ESD (Electro-Static-Discharge) Design
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Chuah Cheow Theng; O. Sidek
Year: 2006
Study of QFN Pre-tape Material Characteristics & Impacts to Assembly Performance
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:C. Chew; L.Y. Lim
Year: 2006
Comprehensive Study of Epoxy Die Attach Process to Achieve Zero Reject Performance
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Lee Yee Sinn; Tan Chee Eng
Year: 2006
Leadframe Material, Design and Surface Treatment for MSL 1 260°C Package Robustness
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:S. Krishnan; S.W. Wang; M.R. Muhamad
Year: 2006
Discussions on the Failure Mode and Criterion of Passivation Cracks
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Xueren Zhang
Year: 2006
Different Storage Conditions have Different Whisker Growth Mechanisms-Can Bright Tin be an Alternative to Matt Tin ?
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:J. Barthelmes; F. Lagorce-Broc; P. Kuhlkamp; Sia-Wing Kok; Din-Ghee Neoh
Year: 2006
SAM interpretation of interfacial anomaly in flip-chip BGA package with 65 nm Cu/low-κ integrated circuits device
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Ka Yau Lee; P. Lee; Ai Min Tan; C. Lee
Year: 2006
Assessment of Die Attach Film for Thin Die and SiP Applications
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Soh Choew Kheng; M. Teo; C. Lee
Year: 2006
Cu/Low-k TBGA Glob Top Package Reliability Challenges
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Lau Teck Beng; Siong Chin Teck; Chu-Chung Lee
Year: 2006
QFN Miniaturization: Challenges and Solutions
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Tan Chee Eng; G. Fonseka
Year: 2006
Film Assisted Molding on MEMS Packages
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:F. Boschman
Year: 2006
Design and Fabrication of Microfluidic Devices: MOSFET & Capacitor
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:R.A. Osman; S.R. Esa; P. Poopalan
Year: 2006
A FPGA-Based Smell Sensing System for Micromachined Gas Sensor Application
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Z.A. Halim; O. Sidek
Year: 2006
Stiffness and Frequency Analysis of Microaccelerometer
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Wong Wai Chi; I.H. Hj Abdul Azid; B.Y. Majlis
Year: 2006
Copper wire reliability and bonding integrity robustness on cratering sensitive bond pad structure
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Lim Chee Chian; Ng Kock Chai; Lee Cher Chia; Chai Min King; Lim Ong Seng; Chua Kok Yau
Year: 2006
The Solutions of Resistive Ball Bond Failure in Ultra Fine Pitch Wire Bonding
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:M.R. Ibrahim; Siong Chin Teck; Yong Cheng Choi
Year: 2006
Die Attach Epoxy Delamination Study on Low RDs(on) Device
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Tan Chip King
Year: 2006
Leadframe Mold Lock Study and Optimization for Flag Size Reduction using Finite Element Analysis and Reliability Testing for 3L SOT223 Package
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:M.H.A. Fuad; A. Aripin; W.L. Chin
Year: 2006
The Characterization of KrF Photoresists and the Effect of Different Ultraviolet (UV) Absorption Rates on Line Edge Roughness (LER) for Submicron Technology
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:A.Y. bin Mohd Bakri; M.J. Manaf; K.I. Abdul Wahab; M.I. Bin Ahmad
Year: 2006
Contact Hole Process Printability Beyond 180nm On Binary Mask
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Cheong Yew Shun; Ko Bong Sang; M.J. Bin Manaf; K. Ibrahim; Z.A.Z. Jamal
Year: 2006
Effect of 3 wt.% Bi in Sn-Zn solder on the interfacial reactions with the Au/Ni metallization
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:A. Sharif; Y.C. Chan; B.Y. Wu
Year: 2006
Generic State Equation fro Dual Core Test Pattern
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Boey Huey Ling
Year: 2006
Enable Robustness of Data System for Intel Assembly/Test Manufacturing Factories with High Degree of Data Integrity
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Lim Yen Lin
Year: 2006
Automated Variant Test Program Generator (Manufacturing Technologies)
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Fong Chii Biao; Goh Huan Yong; Cham Khang Wey
Year: 2006
Design of Planar and 3-D Components using Photoimageable process
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:M.S. Aftanasar; C.Y. Ng; P.R. Young; I.D. Robertson
Year: 2006
Dry Self-Assembly & Gang bonding of micro-components from silicon carrier to substrate wafer
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Y.Y. Ong; Y.L. Lim; L.L. Yan; E.B. Liao; V. Kripesh
Year: 2006
Device Under Test (DUT) Socket Conversion to Improve Analog Loadboard Performance Efficiency
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Y.G. Yabut; F.F. Galauran; M.C. Dator; J.D. Encarnado
Year: 2006
Characterization of Robust Alignment Mark to Improve Alignment Performance
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:N. Ahmad; U. Hashim; M.J. Manaf; K. Ibrahim
Year: 2006
Debugging Expert system using Case-Based Reasoning in semiconductor industry
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Choo Choon Seong; I.A. Zolkifly
Year: 2006
Advantages & Challenges of Cold Ball Pull Test vs Conventional Ball Shear Test in the Assessment of Lead-free Solder Joint Performance
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Eu Poh Leng; Min Ding; Hoh Huey Jiun; I. Ahmad; K. Hazlinda
Year: 2006
Lead-free Flux Effect in Lead-free Solder Joint Improvement
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Eu Poh Leng; Min Ding; I. Ahmad; Hoh Huey Jiun; K. Hazlinda
Year: 2006
A New Burst Assembly Technique Supporting Fair QoS about the Number of Hops in OCBS Multi-hop Networks
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:M. Hayashitani; K. Okazaki; N. Yamanaka
Year: 2006
Accurate BER Estimation of Optical DPSK Systems using Sum of Gaussian Approximation
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:S. Gupta; R. Gangopadhyay; G. Prati
Year: 2006
What is Next for Ethernet PON?
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:G. Kramer
Year: 2006
A Novel Protection Architecture for WDM-PON
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Young-Min Kim; Tae-Hwa Kim; Jae-Hyung Bae; Byeong-Whi Kim; Hong-Shik Park
Year: 2006
A Semi-soft Handover Scheme for Reliable Downlink Service in Micro-domain
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Minsik Shim; Hwasung Kim; Ilkyeun Ra
Year: 2006
Measurements of a Utility Function for Video Download Service and its Application to Service Management
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:N. Shutto; Y. Handa; Y. Minoda; T. Higashino; K. Tsukamoto; S. Komaki
Year: 2006
Optical JPEG based Color Image Compression Algorithm: Performance Measurement
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:A. Alkholidi; A. Al Falou; H. Hamam
Year: 2006
A new application identification method using the hybrid mapping for Broadband Convergence Network (BcN)
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Young-Tae Han; In-Yong Hwang; Young-Min Kim; Sang-Yong Ha; Hong-Shik Park
Year: 2006
Performance Evaluation of Web Services-based Topology Management in Centralized Network
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:InSang Choi; TaeHyun Kwon; TaeMan Han; YoungWook Cha; YouHyeon Jeong
Year: 2006
Proposal for proactive quality of service provisioning method according to traffic volume
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:T. Miyamoto; M. Tsurusawa; H. Tanaka
Year: 2006
Congestion control algorithm based on prediction for OBS networks
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Junho Hwang; Myungsik Yoo
Year: 2006
Dispersion managed soliton transmission system with unsymmetrical unit cell
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Jeng-Cherng Dung
Year: 2006
The Impact of Burst-Switching Paradigm on Transport Protocols
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Min-Gon Kim; JungYul Choi; Hongkyu Jeong; Bokrae Jung; Minho Kang
Year: 2006
A Pseudo-Self-Imaging Phenomenon in Multimode Waveguides
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Jong-Kyun Hong; Sang-Sun Lee
Year: 2006
Two Dimensional 32×32 InGaAs/InP Photodiode Arrays and Dark Current Characteristics Limited by the Diffusion and Generation-Recombination
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Eun Soo Nam; M.S. Oh; S.E. Hong; H.S. Kim
Year: 2006
Integrated Management Architecture for FMC Based on IMS/NGN
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Duckey Lee; Junghee Bang; Young Ran Cho; Hanwook Jung
Year: 2006
Soft Vertical Handoff Scheme Based on Location Information in Heterogeneous Networks
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Yang Li; Kang-Won Lee; You-Ze Cho; Woo Young Jung
Year: 2006
Class based IPTV Admission Control in BcN
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Seong Bo Yang; Se Youn Ban; Seong Gon Choi; Hyoung Seop Lee; Jun Kyun Choi
Year: 2006
A Method for the Expandability in the P2P Overlay Network Management
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Chuanhui Cheng; Xuexian Cheng
Year: 2006
Carrier Ethernet System Supporting Flexible Media Management
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Dae Ub Kim; Bheom Soon Joo; Jung Sik Kim
Year: 2006
A Novel Burst Algorithm of OBS Metro Ring Networks
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Wen-Ping Chen; Ching-Tuey Sung; Ming-Yung Tsai; Chia-Ming Lu; Wen-Shyang Hwang
Year: 2006
A Self-Configured WBEM Architecture to Upgrade the Storage Resource Management
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Jui-Pin Yang
Year: 2006
RFID Personal Asset Finder (PAF): Design and Characterization
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Lei Wang; Shung-han Cho; R. Kamoua
Year: 2006
Performance Comparison on Location Management Schemes
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Myoung Ju Yu; Jong Min Lee; Seong Gon Choi
Year: 2006
P2MP Session Management Scheme using SIP in MPLS-based Next Generation Network
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:YoungHwan Kwon; Hyo Jin Park; Seong Gon Choi; Jun Kyun Choi; Hyoung Seop Lee
Year: 2006
Practical Implementation of Interactive Data Broadcasting Services in IPTV over the NGN
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Lark Kwon Choi; Sang Yong Seo; Dae-Gun Kim; Sang-Soo Lee
Year: 2006
The Changing Faces of Network Management for Next Generation Networks
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Gang Yu; Dan Cao
Year: 2006
Thermal Analysis and Performance in 1.55um Bottom-emitting InAlGaAs VCSELs with Dielectric Mirror, Flip-chip Bonded on Si-Substrate
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:J.D. Kim; H.-W. Song; W.-S. Han; B.Y. Yun
Year: 2006
FTTH-based IPTV testbed in Korea
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Ho Young Song; Byung Tak Lee; Jung-Sik Sung; Jae Chan Shim; Jung Kuk Kwon; Bongtae Kim
Year: 2006
Asynchronous optical sampler for monitoring of 40 Gbit/s signals in C-band
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:A. Bogoni; E. Lauri; G. Berrettini; M. Scaffardi; F. Fresi; P. Ghelfi; J.K. Bae; Sang Bae Lee; L. Poti
Year: 2006
Process Granularities in Cafeteria Operation Technology
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:M. Ohtani; T. Mukai; T. Kimura
Year: 2006
Reduced-Jitter Carrier Frequency Recovery
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Hyoungsoo Lim
Year: 2006
Pseudo-orthogonal Carrier Interference Orthogonal Frequency Division Multiplexing (PO-CI/OFDM) Revisited
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Yujun Kuang; Can Long; Keping Long; Jingsen Huang; Chaofeng Wu; Qianbin Chen
Year: 2006
Hard Decision Parallel Interference Cancellation for uplink OFDMA
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:R. Lakshmish
Year: 2006
The firm-level impacts of NGN regulatory changes: the Korean case
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Min-Ho Ryu; Seongcheol Kim; Hyunji Eun
Year: 2006
Next Generation Converged Connectivity Model for Rural Business Opportunities in Developing Countries
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:A.H.M. Islam; R.A. Shafik; I. Hassan; Ju Bin Song
Year: 2006
Triumphs and Challenges for Model-Oriented Formal Methods: The VDM++ Experience (Abstract)
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:J.S. Fitzgerald; P.G. Larsen
Year: 2006
Certificates of Resource Usage on Mobile Telephones
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:T. Jensen
Year: 2006
Program Safety via Programmer Safety
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:J. Kiniry
Year: 2006
The AUTOSAR Timing Model – Status and Challenges –
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:K. Richter
Year: 2006
Formal Modelling of Avionics Systems. An Approach Based on Category Theory and the EXPRESS Modelling Language
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Y. Ait-Ameur; R. Delmas; A. Cortier; V. Wiels
Year: 2006
Reasoning about Airport Security Regulations Using the Focal Environment
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:D. Delahaye; J.-F. Etienne; V.V. Donzeau-Gouge
Year: 2006
Concurrent Testing of Java Components Using Java PathFinder
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:V. Mutilin
Year: 2006
The UniTESK Approach to Specification-Based Validation of Hardware Designs
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:A. Kamkin
Year: 2006
Automatic Test Generation for Model-Based Code Generators
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:S.V. Zelenov; D.V. Silakov; A.K. Petrenko; M. Conrad; I. Fey
Year: 2006
CARVER: A Slicing Tool for Communicating Automata Specifications
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:S. Labbe; A. Lapitre
Year: 2006
A Formal Specification of a Programming Language: Design of Pit
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:L. Pedersen; H. Reza
Year: 2006
Extending Source Code Generators for Evidence-Based Software Certification
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:E. Denney; B. Fischer
Year: 2006
Safety and Dependability Analysis of Self-Adaptive Systems
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:M. Gudemann; F. Ortmeier; W. Reif
Year: 2006
Real-Time Property Verification in Organic Computing Systems
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:S. Stein; A. Hamann; R. Ernst
Year: 2006
Cost-Efficient Worst-Case Execution Time Analysis in Industrial Practice
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:J. Staschulat; J.C. Braam; R. Ernst; T. Rambow; R. Schlor; R. Busch
Year: 2006
Static WCET Analysis of Real-Time Task-Oriented Code in Vehicle Control Systems
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:D. Sehlberg; A. Ermedahl; J. Gustafsson; B. Lisper; S. Wiegratz
Year: 2006
Towards an Integration of Low-Level Timing Analysis and Model-Based Code Generation
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:C. Ferdinand; R. Heckmann; H.-J. Wolff; C. Renz; M. Gupta; O. Parshin
Year: 2006
Challenges of Timing Verification Tools in the Automotive Domain
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:P. Montag; S. Gorzig; P. Levi
Year: 2006
The Worst Case Execution Time Tool Challenge 2006
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:J. Gustafsson
Year: 2006
The Worst Case Execution Time Tool Challenge 2006: The External Test
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:L. Tan
Year: 2006
“Towards a Trusted Compiler for a Query Language for Wireless Sensor Networks.”
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:T.E. Daniel; S.N.I. Mount; R.M. Newman; E.I. Gaura
Year: 2006
Foundations for Web Services Orchestrations: Functional and QoS Aspects, Jointly
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:S. Rosario; A. Benveniste; S. Haar; C. Jard
Year: 2006
Semi-automated Workflow Synthesis
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:A. Fernandes; K.k. Breitman; T.A.S. Vieira; M.A. Casanova; A.L. Furtado
Year: 2006
REDLIB for the Formal Verification of Embedded Systems
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Farn Wang
Year: 2006
Synthesis and Traceability of Scenario-Based Executable Models
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:A. Goel; A. Roychoudhury
Year: 2006
Towards a Framework for Scalable Model Checking of Concurrent C Programs
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Ji Wang; Xiaodong Yi; Xuejun Yang
Year: 2006
Patterns with Algebraic Properties in BPEL0
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Geguang Pu; Huibiao Zhu; Jifeng He; Zongyan Qiu; Hongli Yang; Xiangpeng Zhao
Year: 2006
Connecting Algebraic and Logical Descriptions of Concurrent Systems
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Naijun Zhan
Year: 2006
Improve Model Checking Efficiency Using Specific Knowledge about the System
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Zhao Jianhua; Lei Bin; Li Xuandong; Zheng Guoliang
Year: 2006
Formal Verification of Consistency in Model-Driven Development of Distributed Communicating Systems and Communication Protocols
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:D. Ilic; E. Troubitsyna; L. Laibinis; S. Leppanen
Year: 2006
Noise Makers Need to Know Where to be Silent – Producing Schedules That Find Bugs
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Y. Ben-Asher; E. Farchi; Y. Eytani; S. Ur
Year: 2006
[mc]square: A Model Checker for Microcontroller Code
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:B. Schlich; S. Kowalewski
Year: 2006
An Overlay Framework for QoS Management in Mobile Ad Hoc Networks
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:P.B. Jeon; R.N. Rao; G. Kesidis
Year: 2006
UWB Configurable YRO
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:U.L. Rohde; A.K. Poddar
Year: 2006
Performance Measurements of IEEE 802.11a Wireless LANs in presence of Ultra Wideband Interference
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Jai C. Dialani; Anita Patel; R. P. Jindal
Year: 2006
A Level-Crossing Sampling Scheme for both Deterministic and Stochastic Non-Bandlimited Signals
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:K. Guan; A.C. Singer
Year: 2006
Optimal Farrow Coefficients For Timing Recovery In QAM Demodulation Receiver
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Han Li; Qin Wang; ChengYoun Lu
Year: 2006
A Baseband Transceiver for IEEE 802.16 OFDMA Downlink Communications
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Jung-Mao Lin; Hsi-Pin Ma
Year: 2006
Design of High-Speed Metal-Semiconductor-Metal Photodetectors by Finger Sizing Optimization
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Kan-Lin Hsiung
Year: 2006
A Performance Comparison of IrBurst and IrOBEX for High-Speed Exchange of Large Data Contents
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:S.S. Ara; A.M. Shah; M. Matsumoto
Year: 2006
IP Spoofing Detection Approach(ISDA) for Network Intrusion Detection System
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Sui Song; C.N. Manikopoulos
Year: 2006
A Control Theoretic Analysis of Arbitration and Matching Schemes for Packet Switches
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Zhen Guo; R. Rojas-Cessa
Year: 2006
Conquering Process Variability: A Key Enabler for Profitable Manufacturing in Advanced Technology Nodes
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:A.J. Strojwas
Year: 2006
Collaboration in the 21st Century: Driving-Innovation and Differentiation
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Song Hwee Chia
Year: 2006
The CASMAT Business Model for Semiconductor Materials
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Y. Kawamoto
Year: 2006
Toshiba's Strategy in Semiconductor Business and Production Technology
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Shozo Saito
Year: 2006
Future Lithography Challenges
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:K. Ushida
Year: 2006
The Strategy for Manufacturing Technology Advancement in Memory
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Young-Bum Koh
Year: 2006
Watermark induced High Density Via failures in sub micron CMOS fabrication
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Alex Chew; H.H. Au; S.H. Han; T.L. Neo; Jackson Tan; K.W. Chai; Samuel Chua
Year: 2006
Method of Minimizing Inspection Cost by Making Use of Programmed Defect Array
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:T. Hayano; A. Tu; B. Hance; S. Doan; S. Sakai; W. Shindo
Year: 2006
Failure Mode Detection and Process Optimization for 65 nm CMOS Technology
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:J.R.D. DeBord; L. Olsen; Jin Zhao; T. Bonifield; S. Lytle
Year: 2006
Electrical Defect Density Test Structures for DFM in the Sub-wavelength Lithography Regime with Copper Metallization
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:J. Segal; G. Nagatani; C. Tabery
Year: 2006
An Addressable Test Structure for Geometrical Design Rules Characterization
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Hung-Jen Lin; J. Segal; K. McGaughey
Year: 2006
Sample Efficient Regression Trees (SERT) for Yield Loss Analysis
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Argon Chen; Amos Hong; Odey Ho; Chao-Wen Liu; Yi-His Huang
Year: 2006
Analysis and Risk Communication of 20 Years of Exposure Monitoring of Photolithography Solvents from all Intel Fabs
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:H. Hunsaker
Year: 2006
Application of Atmospheric Plasma Abatement System for Exhausted Gas from MEMS Etching Process
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:K. Hattori; K. Sakurai; N. Watanabe; H. Mangyou; S. Hasaka; K. Shibuya
Year: 2006
Development of a Platform for Collaborative Engineering Data Flow between Design and Manufacturing
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:H. Morinaga; H. Kakinuma; T. Ito; T. Higashiki
Year: 2006
Risk Based Capacity Planning Method for Semiconductor Fab with Queue Time Constraints
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:A. Ono; S. Kitamura; K. Mori
Year: 2006
Priority X-Factor Modeling for Differentiated Manufacturing Service Planning
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Shi-Chung Chang; Ke-Ju Chen
Year: 2006
300mm Time Constrained Queue Loop Management
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:D.L. Van Sickle; E.F. Hertzler
Year: 2006
A Dynamic Method for Optimal WIP Allocation and Control in a Semiconductor Manufacturing System
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Chih-Ming Liu; Chung-Jen Kuo; Chih-Yang Chi
Year: 2006
Supply Chain Inventory Control in Semiconductor Manufacturing
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Ruey-Shan Guo; D. Chiang; Po-Chun Yang
Year: 2006
Cycle Time Reduction Through Preventive Maintenance De-clustering
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:M.T. Zhang; P.H. Tag
Year: 2006
Conveyer Belt Model to Analyze Cycle Time Conditions in a Semiconductor Manufacturing Line
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:T. Inoue; Y. Ishii; K. Igarashi; H. Takagi; T. Muneta; K. Imaoka
Year: 2006
Troubleshooting Tracks with Vibration Detection and Storage Technology
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:L.J. Wahner
Year: 2006
Increased Etch Chamber Productivity through the Reduction of Unscheduled Wet Cleans
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:B. Ames
Year: 2006
Wire Bonder Mis-Process Reduction and Productivity Improvement with Full Automation System by Cross Regional Team
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Tay Chai Theam; K. Miyake; K. Minor; M. Maruoka; S. Watanabe; E. Angeles; J.D. Micua; L. Lu
Year: 2006
The Future of CD Metrology
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:J. Allgair; B. Bunday
Year: 2006
Gate CD Control Considering Variation of Gate and STI Structure
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:M. Kurihara; J. Tanaka; M. Izawa; K. Kawai; N. Fujiwara
Year: 2006
Device-level APC in Ion Implantation for Analog Device
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:T. Kyuho; T. Tsukihara; Qianyi Wang; M. Yamaoka; T. Motosue; K. Kimura
Year: 2006
Fab-wide equipment monitoring and FDC system
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:S.-i. Imai; N. Sato; M. Kitabata; S. Yasuda
Year: 2006
Using a `Z' Tool Controller for APC Applications
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:E. Smith; R. Elias
Year: 2006
Improvement of photolithography process by 2nd Generation Data Mining
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:H. Tsuda; H. Shirai
Year: 2006
Enabling Double Patterning at the 32nm Node
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:K.M. Monahan
Year: 2006
Highly sensitive focus monitoring on production wafer by Scatterometry Measurements for 90/65nm node devices
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:T. Kawachi; H. Fudo; H. Tasaka; S. Matsumoto; H. Sasazawa; H. Nakamura
Year: 2006
Advanced CD Control Technology for 65-nm Node Dual Damascene Process
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:M. Nagase; T. Maruyama; M. Iguchi; M. Suzuki; M. Tominaga; M. Sekine
Year: 2006
Elimination of Vmin failures in 0.15um logic process
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Yee Ming Chan; Pik Yee Ng; Ling Yun Miao; Hyun Gu Yoon; Kin San Pey
Year: 2006
High Throughput AMHS Design with Dual Unified OHT System
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:ChungSoo Han; K. Pare; M. Tokumoto; A. Aoki
Year: 2006
Requirements for AMHS in 450 mm era
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:H. Kondo
Year: 2006
Design For Business: Advancing the Business Culture of Semiconductor Back-End Manufacturing
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:A. Carrasco; M. Kayama
Year: 2006
TFT-LCD Automated Guided Vehicle Systems Analysis Using Axiomatic Design Theory
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Young Jae Jang
Year: 2006
Increased Fab Efficiency through the use of Small Lot Size FOUPs
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:C.U. Buice; T. Bonora
Year: 2006
Development of Slow Start Safety Cylinder Valve to Inhibit Adiabatic Compression for Oxidized Gases
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:T. Orita; M. Yamaji; T. Shinohara; T. Nakata; M. Koizumi; S. Hasaka; H. Nakabayashi
Year: 2006
Reduce VOC Emissions from Manufacturing Processes
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Tan Lin Sheng; Mohd Zamri bin Shamsudin; Loh Chin Ling
Year: 2006
Development and Practical Application of High-efficiency Fire Control System for the Clean Room
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:S. Fukuda; T. Ohmi; S. Sugawa
Year: 2006
Distributive and Cooperative Scheduling Considering Multi-Attribute Product-Mix, Feedback Process, and the Dynamic Utility Control-in Resource Sharing
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:S. Arima; Y. Sato; T. Saitou; R. Perez; Y. Ishii; K. Yasuda
Year: 2006
Framework for Event Driven Sorter Operation
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:R. Tamehiro; B.M. Herbold; K.E. Gartland; F. Liang
Year: 2006
Productivity Improvement by Integrated Management of Wafer Map Data
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:N. Takesako; Y. Terada
Year: 2006
Support Vector based Demand Forecasting for Semiconductor Manufacturing
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:P. Chittari; S. Raghavan
Year: 2006
Segmented WIP Control for Cycle Time Reduction
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Chen-Fu Chien; Chih-Han Hu
Year: 2006
Priority Behavior Modeling of Fab for Supply Chain Management
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Shi-Chung Chang; Bo-Jiun Liao; Argon Chen
Year: 2006
Time Links Management Through Real-time Dispatch System
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Chan Chih Ming; M. Subramaniam; J. Tay; Lee Wei Hoe
Year: 2006
Integrated Production Control System in Managing Tool Uptime, Cycle-time and Capacity
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Chan Chih Ming; Tan Pei Ling; M. Subramaniam; Ong Soon Guan
Year: 2006
Manufacturing Challenges in Double Patterning Lithography
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:W. Arnold; M. Dusa; J. Finders
Year: 2006
Model Based Semiconductor Factory Automation for Rapid Factory Startup and Change
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:P. Hawkins
Year: 2006
Managing Process Constraing Effectively to Enable Fab Cycle Time Reduction
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:J.P. Hsu; J.C. Cheng; S. Yen
Year: 2006
Study of the relation between Loading ratio and X-Factor
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:S. Tsuruta; K. Kabata; H. Kawakami; M. Kishimura; S. Yamaguchi; T. Ogawa
Year: 2006
A Quadratic Goal Programming Model and Sensitivity Analysis for Semiconductor Supply Chain
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:D. Chiang; Ruey-Shan Guo; A. Chen; Cheng-Bang Chen
Year: 2006
Yield Methodology for Mixed Signal Process Development
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Jin Liu; I. Donnelly; Jianglin Wang; P. Jones-Williams
Year: 2006
A high resolution and early triggering on multi layer processing defects
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Seong Choong Chan; A. Chin; P. Liew; Xiang Wang; Eng Keong Ho
Year: 2006
Integrated ODP metrology as an APC enabler for complex high aspect ratio 3D deep trench device structures
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:B. Schmidt; P. Reinig; S. Komarov; D. Hetzer; D. Likhachev; M. Funk
Year: 2006
APC Methodology for Cpk improvement of HDP Deposition
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:K. Pathy; C. Bowles; K. Blancher; R. Rajagopal
Year: 2006
Utilization of Insitu Metrology Capability of ASML Lithography Scanner to Improve Overall Process Control
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:A. Chen; M. Dusa; J. van Schoot; T. Theeuwes; M. Janssen; K. van Ingen Schenau; H. van der Laan
Year: 2006
Challenges of Manufacturing Capacitor Oxide in Mixed Signal ASICS
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:J.M. Towner; J.J. Naughton
Year: 2006
Real-time Monitoring of Photoresist Thickness Contour in Microlithography
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Ho Weng Khuen; Chen Xiaoqi; Wu Xiaodong; A. Tay
Year: 2006
Using product test data for manufacturing process control
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:G. Spitzlsperger; M. Frick; D. Rathei
Year: 2006
Samsung Equivalence Test for Output Parameters in Semiconductor Manufacturing
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Ho Young Lee; Seung Hoon Tong; Chung-Koo Yoon; Hyun Cheol Lee; Sang Wook Choi; Hyung-Sun Kim
Year: 2006
ISMI Victory: Interface A Ready for Manufacturing
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:H. Wohlwend
Year: 2006
Yield enhancement/Productivity improvement for Sub-110nm Memory Lithography using new alignment strategy
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:C.I. Choi; Hans Sui; Rice Ma; T. Lu; J. Ji; F. Mieno
Year: 2006
A Technique for Co Target Discharge Stabilization Using an Ion Gauge in the Sputtering System
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:T. Muraoka; K. Kobayashi
Year: 2006
The ROI of Metrology
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:B. Bunday; J. Allgair; M. Caldwell; C. Archie; E. Solecky; B. Rice; B. Singh; I. Emami
Year: 2006
Improved CVD-Al Thin Film Using Superior Al Precursor
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Seung-Min Ryu; Jun-Hyun Cho; Youn-Jaung Cho; Jung-Ho Lee; Jung-Sik Choi; Dong-Jun Lee; Kyoo-Chul Cho; Tae-Sung Kim
Year: 2006
Reliable High Volt Mixed Signal IC Manufacturing
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:J.J. Naughton; M. Tyler; M. Anser
Year: 2006
New QCM Sensor for Real-time AMC Detection in SMIF Pods
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:R. Takasu; A. Akbar; Y. Takigawa; M. Miyajima; Y. Kataoka
Year: 2006
Inline VPD-TXRF for Contamination Control: Reality or Myth? Experience in a 300mm R&D MirrorBit Flash Memory Fab
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:E. Adem; P. Vemuri; S. Robie
Year: 2006
The wafer preparation technology with nano size particle contamination by using single spin processor
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:K. Matsuno; H. Mishima; M. Arimatsu; S. Kikuchi; S. Shikami
Year: 2006
Thin-Gate CMOS and Super-Thick Gate DECMOS Integration in 0° On-axis ≪100≫ Starting Wafer: Process Challenges and Solutions
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Xiaoju Wu; P. Mahalingam; R. Knerr; Y. Patton; Pinghai Hao; I. Khan; D. Hannaman
Year: 2006
Investigation on Metal Pillar Defect in sub-micron CMOS Technology
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Young Seon You; Nam Sung Kim; Wong Wing Yew; Eng Keong Ho; Chun Peng Chua; Yang Bum Lee; Kwang Leong Se; Dong Ju Son; D. Shukla; M. Mukhopadhyay; Kin San Pey
Year: 2006
Method for Fast and Accurate Calibration of Litho Simulator for Hot Spot Analysis
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:S. Jank; V. Temchenko; P.G. Karakatsanis; R. Veerasingam; R. Vallishayee; C. Dolainsky; Xiaojing Yang; Y. Nehmadi; M. Poyastro
Year: 2006
Recipe-independent Tool Health Indicator and Fault Prognosis
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Argon Chen; J. Blue; Tze-Chin Chou; Tsu-Kuang Yang
Year: 2006
Using `Locked Wafers' to Prioritize Factory Resources
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:J. Pollock; B. Richardson
Year: 2006
Evolutionary Engineering Collaboration for DFM/DFY Solutions between Foundry and EDA Tool Vendor
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Yea-Huey Su; Ruey-Shan Guo; Hsiao-Huan Chang
Year: 2006
DFM Challenges for 32nm Node with Double Dipole Lithography (DDL) and Double Patterning Technology (DPT)
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:J.F. Chen; W. Staud; B. Arnold
Year: 2006
Business Model Innovation with Effective Innovation: An Exploratory Study on TSMC
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Yea-Huey Su; Shih-Ting Huang
Year: 2006
Managing Dynamic Events in Full-Load States of Semiconductor Manufacturing Chains
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Hsin-Yi Huang; S. Chang; Jun-Wei Chen; Yon-Chun Chou
Year: 2006
Simultaneous recovery of three-dimensional myocardial conductivity and electrophysiological dynamics: A nonlinear system approach
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:L.W. Wang; H.Y. Zhang; P.C. Shi
Year: 2006
Respiratory Gated SPAMM Sequence for Magnetic Resonance Cardiac Tagging
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:C. Santa Marta; M.J. Ledesma-Carbayo; A. Bajo; E. Perez-David; A. Santos; M. Desco
Year: 2006
Activity index from continuous telemetry in a mouse model of voluntary wheel exercise training
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:P.E. McSharry; D. Adlam; J.P. de Bono; K.M. Channon
Year: 2006
Non-invasive assessment of atrioventricular conduction properties and their effects on ventricular response in atrial fibrillation
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:A. Climent; D. Husser; J. Millet; V. Corino; L. Mainardi; H. Klein; A. Bollmann
Year: 2006
A new generation image processing algorithm might enable Real-Time visualization of 3D Echocardiographic data on a multi-view auto stereoscopic LCD
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:G. Saracino; N. Greenberg; S. Fukuda; T. Shiota; J.D. Thomas
Year: 2006
Component selection for Principal Component Analysis-based extraction of atrial fibrillation
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:I.R. Legarreta
Year: 2006
Theoretical investigation of Ca2+ dynamics in normal and hypertensive vascular walls
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:A. Bezerianos; A. Kapela; N. Tsoukias
Year: 2006
Effect of lidocaine on reentrant ventricular circuits in acute ischemic situations. a computer modelling study
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:K. Cardona; J. Saiz; J. M. Ferrero; M. Martinez; G. Molto; V. Hernandez
Year: 2006
Re-entry by early afterdepolarisations in a computational model
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:S. Scarle; R.H. Clayton
Year: 2006
Wearable monitoring system for heart failure assessment in a mobile environment
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:E. Villalba; M. Ottaviano; M.T. Arredondo; A. Martinez; S. Guillen
Year: 2006
Development of a method for determining arterial pulse propagation times and influence of arterial compliance
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:D. Zheng; J. Allen; A. Murray
Year: 2006
Automated QT interval measurement from multilead ECG signals
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:D. Hayn; A. Kollmann; G. Schreier
Year: 2006
Ventricular tachyarrhythmia onset in patients with implantable cardioverter defibrillators
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:A. Casaleggio; P. Rossi; V. Malavasi; G. Musso; L. Oltrona
Year: 2006
Enhanced integrated format and content checking for processing of SCP ECG records
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:R. Fischer; F. Chiarugi; T.K. Zywietz
Year: 2006
Prediction of the supraventricular arrhythmias in hypertensive patients with different forms of the left ventricular geometry
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:A. Oreziak; E. Piatkowska-Janko; Z. Lewandowski; G. Opolski
Year: 2006
Prediction error filtering for the extraction of abnormal intra-QRS potentials in signal-averaged electrocardiogram
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:C.C. Lin
Year: 2006
Effect of electrocardiogram signal quality on T-wave alternans measurements: A simulation study
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:D. Janusek; M. Kania; R. Maniewski
Year: 2006
Detection of temporal motion velocity and acceleration of omnidirectional M-mode echocardiography
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Q. Lin; Y. Lin; H.Y. Wang; H.G. McAllister; H. Zheng
Year: 2006
ECG Estimation using a saw-tooth pattern in remote environments
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:M.M. Elena; A. Martin; J.M. Quero
Year: 2006
A fast and simple CCU complication risk registration module for the Local Cardiology Information System (LCIS)
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:C.I. Buddelmeijer; J.B.A. Habraken; R. Adams; J.J. Piek
Year: 2006
Real-time classification of heartbeats using least square acceleration filter for ambulatory monitoring
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:M.H. Song; K.J. Lee
Year: 2006
Improved BRS assessment using the global approach in the sequences technique
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:S. Gouveia; A.P. Rocha; P. Laguna; P. van de Borne; P. Lago
Year: 2006
Toward provably correct models of ventricular cell function
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:R.L. Owen; S. McKeever; J. Davies; A. Garfinkel
Year: 2006
The QRS-integral of an electrogram as an indicator of the subsequent local activation duration
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:A. van Oosterom; V. Jacquemet
Year: 2006
Reducing cardiac motion in IVUS sequences
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:A.H. Hernandez; D.G. Gil; J.M. Mauri; P.R. Radeva
Year: 2006
T wave width alterations during Valsalva Maneuver in diabetic patients
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:A. Minchole; J.P. Martinez; P. Arini; M. Risk; P. Laguna
Year: 2006
Quantification of phase recurrences in atrioventricular (AV) conduction during atrial arrhythmias
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:M. Mase; L. Glass; F. Ravelli
Year: 2006
Multivariate analysis of follow-up physiological data recorded by cardiac implantable devices
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:E. Roux; A. Hernandez; L. Graindorge; G. Carrault; P. Mabo
Year: 2006
A three-dimensional model of canine cardiac ventricular wall electrophysiology
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:A.P. Benson; O.V. Aslanidi; H. Zhang; A.V. Holden
Year: 2006
Modeling human ventricular geometry and fiber orientation based on diffusion tensor MRI
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:G. Seemann; D.U.J. Keller; D.L. Weiss; O. Dossel
Year: 2006
Remote monitoring and automatic analysis of phonocardiographic signals in climbing of high mountains
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:F.C. de Leon e Hijes; J.M. Alajarin; J.L. Candel; R.R. Merino; R.L.M. Morales
Year: 2006
Changes in cardiac indices from implanted defibrillator-stored electrograms due to acquisition and preprocessing conditions
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:J. Requena-Carrion; J.L. Rojo-Alvarez; E. Everss; F. Alonso-Atienza; J.J. Sanchez-Munoz; M. Ortiz; A. Garcia-Alberola
Year: 2006
System-identification noise suppression for intra-partum cardiotocography to discriminate normal and hypoxic fetuses
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:P.A. Warrick; R.E. Kearney; D. Precup; E.F. Hamilton
Year: 2006
Fibre Bragg grating sensor for respiratory monitoring
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Y. Liang; A.P. Mazzolini; P.R. Stoddart
Year: 2006
Randomly microstructured polymer optical fibre
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:G.E. Town; R.M. Chaplin; M.J. Withford; D. Baer
Year: 2006
Performance evaluation of poly-sige alloy growth with gold induced lateral crystallization for infrared photo-sensor applications
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Chin-Ying Chen; Jyh-Jier Ho; R.Y. Hsiao
Year: 2006
Nonlinear material diagnostics using filled nanostructured fibres
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:K.J. Rowland; V.S. Afshar; T.M. Monro
Year: 2006
Nanostructured optical fibre for chemical sensing using surface-enhanced Raman scattering
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:D.J. White; A.P. Mazzolini; P.R. Stoddart
Year: 2006
Fiber evanescent field power maximization via refractive index design
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:B.C. Gibson; P.M. Dower
Year: 2006
Photonic crystal optical fibers for dispersion compensation and Raman amplification: Design and preliminary experimental results
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:C.A. De Francisco; K. Digweed-Lyytikainen; D. Spadoti; A.A. Juriollo; J.B. Rosolem; J.B.M. Ayres Neto; B.V. Borges; J. Canning; M.A. Romero
Year: 2006
Angular momentum in tightly focused beams with circular polarization
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Z. Bomzon; J. Shamir
Year: 2006
Infiltration of quantum dots into 3D photonic crystals fabricated by the two-photon polymerisation technique
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Jiafang Li; J. Serbin; C. Bullen; Min Gu
Year: 2006
Second order interference - from nonlinear optics to GPS
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:M. Hamilton
Year: 2006
Fabrication of sampled Bragg gratings in highly nonlinear integrated chalcogenide (As2S3) waveguides
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:N.J. Baker; H.W. Lee; I.C.M. Littler; Duk Choi; S. Madden; B. Luther-Davies; C.M. de Sterke; B.J. Eggleton
Year: 2006
Monitoring of chromatic dispersion for 10 Gbit/s RZ modulation using asynchronous sampling
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:K. Clarke; T. Anderson; S. Dods
Year: 2006
Spectrum compression of a short pulse from a slit with a central obstruction in the far-field
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Pin Han; Jhong-Sian Li; Hone-Ene Hwang
Year: 2006
Precision corner cubes for NASA’s Space Interferometer Mission
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:J. Burke; B. Oreb; R. Netterfield; J. Seckold; A. Leistner; M. Gross; S. Dligatch
Year: 2006
Research and analysis of non-coaxial x-ray microscopy working at grazing incidence
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Jiasheng Hu; Yuhong Bai
Year: 2006
The Basis of Magnetized Target Fusion - A Fusion Primer
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Irvin R. Lindemuth; Richard E. Siemon
Year: 2006
The Quest for the Wholly Stable Liner
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:W.L. Atchison; P.J. Turchi; D.S. Lemons
Year: 2006
Analysis of the Liner Stability in Various Experiments
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:A.M. Buyko; S.F. Garanin; D.V. Karmishin; V.N. Mokhov; N.V. Sokolova; V.B. Yakubov; V.V. Zmushko
Year: 2006
Power System Basedon the Mago System with Fissile Materials - MAGO/FISSION
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:V. N. Mokhov
Year: 2006
Progress on Liner Implosions for Compression of FRC's
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:J.H. Degnan; C. Grabowski; T.P. Intrator; R. Kirkpatrick; G.F. Kiuttu; F.M. Lehr; J.V. Parker; R.E. Peterkin; N.F. Roderick; E.L. Ruden; R.E. Siemon; A.N. Brown; W. Sommars; W. Tucker; P.J. Turchi; G.A. Wurden; Y C.F. Thio; T. Cavazos; S.K. Coffey; M. Domonkos; M.H. Frese; S.D. Frese; D. Gale; C. Gilman
Year: 2006
Stability of Plasma Configurations During Compression
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:E.L. Ruden; J.H. Hammer
Year: 2006
Modeling Liner Compression of FRCs: Obstacles and Advances
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:M.H. Frese; S.D. Frese; D.J. Amdahl; J.H. Degnan; N.F. Roderick
Year: 2006
Modeling of Plasma Formation and Evolution on the Surface of Ohmically Heated Conductors
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:V. Makhin; M. Angelova; T.J. Awe; B.S. Bauer; S. Fuelling; I.R. Lindemuth; R.E. Siemon
Year: 2006
Real Time Feedback Control System for an Electromagnetic Launcher
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:R.W. Karhi; J.J. Mankowski; D.J. Hemmert; S.L. Holt
Year: 2006
Recent Developments at the Dresden High Magnetic Field Laboratory
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:J. Wosnitza; A.D. Bianchi; T. Herrmannsdorfer; S. Zherlitsyn; S. Zvyagin
Year: 2006
Performance of First 90 T Insert Magnet for US-DOE 100 T Multi-Shot Pulsed Magnet Program
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:C.A. Swenson; J.R. Sims; D.G. Rickel
Year: 2006
Investigation of Reinforced, Magnet-Coil Support Shells for the NHMFL 100 Tesla Non-Destructive Magnet
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:J.R. Sims; J.B. Schillig; H. Coe; C.N. Ammerman
Year: 2006
Development of a Pulsed High Magnetic Field Laboratory at Huazhong University of Science and Technology
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Cheng Wang; Xian Zhong Duan; Ke Xun Yu; Tao Peng; Zheng Cai Xia; Hong Fa Ding; Liang Li; F. Herlach; J. Vanacken
Year: 2006
A Fabrication Method for a Mid-Sized, High-Energy-Density, Flux Compression Generator
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:T.A. Holt; A.J. Young; A.A. Neuber; M. Kristiansen
Year: 2006
Characterization of Explosively Driven Ferroelectric Generator Material
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:S.L. Holt; D.J. Hemmert; J.W. Walter; J.J. Mankowski; J.C. Dickens; M. Kristiansen; L.L. Altgilbers
Year: 2006
Powerful Pulsed Source with Adjustable Time of Current Rise on the Basis of Helical EMG and Explosive Opening Switch to Drive Solid Liners
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:P. Duday; A.M. Glybin; B.T. Egorichev; V.A. Ivanov; A.I. Krayev; V.B. Kudel'kin; S.M. Polyushko; I.V. Morozov; S.V. Pak; A.N. Skobelev; G.I. Volkov
Year: 2006
Time Dependent Inductance Calculation of Magneto-Cumulative Generator During Explosion Using Finite Element Method
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:In-Mo Sung; Byung-Kyu Joe; Chun-Yeol You; Oh-Kyu Kwon; Cheon Lee
Year: 2006
Pulsed Power Hydrodynamics: An Application of Pulsed Power and High Magnetic Fields to the Exploration of Material Properties and Problems in Experimental Hydrodynamics
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:R. E. Reinovsky; W. L. Atchison; G. Dimonte; A. Kaul; G. Rodriguez; C. Rousculp; P. T. Reardon
Year: 2006
Dynamic Friction Experiments at the Atlas Pulsed Power Facility
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:C. L. Rousculp; J. E. Hammerberg; D. M. Oro; G. Rodriguez; P. M. Goodwin; M. A. Salazar; R. E. Reinovsky; R. J. Faehl; J. R. Becker; R. A. Berglin; K. W. Delzer; G. H. Gomez; R. M. Malone; D. V. Morgan; T. V. Pate; K. E. Theuer
Year: 2006
Spall and Damage in Convergent Geometry Using Pulsed Power
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Ann M. Kaul; George Rodriguez
Year: 2006
Experimental Test Bench on the Basis of Helical EMG to Study Spallation Mechanisms in Cylindrical Geometry
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:S.V. Balashov; P.V. Duday; B.T. Egorychev; A.M. Glybin; Yu.N. Gorbachev; V.A. Ivanov; A.V. Ivanovsky; N.Yu. Ilyushkina; G.V. Karpov; V.E. Kolomyitsev; A.I. Krayev; V.B. Kudel'kin; A.I. Kuzyayev; I.V. Morozov; S.S. Nadezhin; S.V. Pak; A.A. Petrukhin; Yu.V. Savtsova; N.I. Sitnikova; A.N. Skobelev; O.A. Tyupanova; V.A. Vasyukov; G.I. Volkov; R.R. Zubayerova; B.G. Anderson; W.L. Atchison; A.M. Kaul; M. Salazar; G. Rodriguez; R.E. Reinovsky; L. Tabaka; D.T. Westley
Year: 2006
Cooling and Condensation of Hydrogen Isotopes in Isentropic Compression Device
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Gennady V. Boriskov; Alexander I. Bykov; Nicholas I. Egorov; Valeriy N. Pavlov
Year: 2006
Use of Radiography to Study EOS of Condensed Hydrogen Isotopes Within Megabar Pressure Range
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Alexander I. Bykov; Nikolay I. Egorov; Yuriy P. Kuropatkin; Nikolay B. Lukianov; Victor D. Mironenko; Valeriy N. Pavlov
Year: 2006
High Current Wire Array and Gas Puff Implosions on the Z Accelerator to Produce Intense K-Shell X-Ray Emissions
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:C.A. Coverdale; C. Deeney; B. Jones; P.D. LePell; A.L. Velikovich; J.W. Thornhill; J.P. Apruzese; K.G. Whitney; R.W. Clark; J. Davis; J.S. Levine; H.M. Sze; J.W. Banister; B.H. Failor; N. Qi; Y. Maron
Year: 2006
Equilibrium Ignition, a Minimum Energy Route to Fusion Via Multiple Mass Shell Collisions
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Stirling A. Colgate
Year: 2006
A Generalized Poisson Model to Estimate Inter-plant Competition for Light
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Paul-Henry Cournède; Philippe de Reffye
Year: 2006
Conditions for the Generation of Rhythms in a Discrete Dynamic System
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Amélie Mathieu; Paul-Henry Cournède; Daniel Barthélémy; Philippe de Reffye
Year: 2006
A Stochastic Language for Plant Topology
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:MengZhen Kang; Paul-Henry Cournède; Jean-Pierre Quadrat; Philippe de Reffye
Year: 2006
Stochastic Simulation of Fruit Set in Sweet Pepper
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:A.M. Wubs; M.J. Bakker; E. Heuvelink; L. Hemerik; L.F.M. Marcelis
Year: 2006
Long Shoots in the Crowns of Maturing Silver Birch
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:A. Vehanen; P. Kaitaniemi
Year: 2006
Effect of Topological and Phenological Changes on Biomass Partitioning in Arabidopsis thaliana Inflorescence: A Preliminary Model-Based Study
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:V. Letort; P.-H. Cournede; J. Lecoeur; I. Hummel; P. De Reffye; A. Christophe
Year: 2006
Architectural and Geometrical Representations of Cotton Plants to Simulate Their Light Interception at Low Density
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:P. Martin; P. Clouvel; D. Luquet; J. Dauzat
Year: 2006
A Functional Landscape Prototype to Simulate Water Resource Competition between Plants
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Marc Jaeger; Xing Mei; Aurelien Lesluye; Paul-Henry Cournède
Year: 2006
Plant Modeling and Its Applications to Agriculture
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Yan Guo
Year: 2006
Parameter Stability of the Structural-Functional Model GREENLAB-Tomato as Affected by Plant Density and Biomass Data Acquisition
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:G. Louarn; Q.X. Dong; Y.M. Wang; J.F. Barczi; P. de Reffye
Year: 2006
Towards an Architectural Approach to Direct Maize Breeding for Cold Tolerance
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:K. Chenu; C. Fournier; C. Giauffret; B. Andrieu
Year: 2006
A Universal Web-Based Simulation System for Greenhouse Crops
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Jin-Xiang Chu; Zhong-Fu Sun; Ke-Ming Du; Qian Jia; Ying-Chun Wang; Shuang Liu
Year: 2006
Study on the Effects of Defoliation on the Growth of Cotton Plant Using the Functional Structural Model GREENLAB
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Zhigang Zhan; H. Rey; Dong Li; Yan Guo; P.-H. Cournede; P. de Reffye
Year: 2006
The Study of Digital Dynamic Information Management System for Maize Based on GPS, GIS
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Guifen-chen; Yueling-Zhao; Shengsheng-Wang; Guowei-Wang; Helong-yu
Year: 2006
Integrated Stand Growth Model (ISGM) and Its Application
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Lingxia Hong; Shouzheng Tang; Haikui Li; Yongci Li; François de Coligny
Year: 2006
An Interactive System of Modeling 3D Trees with Ball B-Spline Curves
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Zhongke Wu; Mingquan Zhou; Xingce Wang; Xuefeng Ao; Rongqing Song
Year: 2006
Generation of 3D Representations of Maize Canopies from Simple Measurements: A Tool for Visualization or Use with Models Involving Plant Architecture
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:J.-F. Ledent
Year: 2006
Realistic Simulation of Seasonal Variant Maples
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Ning Zhou; Weiming Dong; Xing Mei
Year: 2006
Efficient Multiresolution of Foliage for Real-Time Rendering
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Qingqiong Deng; Xiaopeng Zhang; M. Jaeger
Year: 2006
View-Dependent Conifer LOD Models
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Qingqiong Deng; Xiaopeng Zhang; S. Gay; Xiangdong Lei
Year: 2006
Fast Tree Ambient Occlusion Approximation
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Jun Teng; Baogang Hu; M. Jaeger
Year: 2006
Image Based Real-Time and Realistic Forest Rendering and Forest Growth Simulation
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Yi-Kuan Zhang; O. Teboul; Xiao-Peng Zhang; Qing-Qiong Deng
Year: 2006
Recent status on Nano CMOS and future direction
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:H. Iwai
Year: 2006
CMOS scaling and non-silicon opportunities
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Y. Nishi
Year: 2006
Hard and soft X-ray excited photoelectron spectroscopy study on high-κ gate insulators
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:H. Nohira; T. Hattori
Year: 2006
Hf-based high-k gate dielectrics - Scalability for hp45 node and beyond -
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Yasuo Nara; Seiji Inumiya; S. Kamiyama; Kunio Nakamura
Year: 2006
Evaluation of phosphorus diffusion in the confined nano-wire under the influence of Si/SiO2 interface
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:A. Seike; I. Sano; K. Yamada; I. Ohdomari
Year: 2006
Narrowing the field of high-k gate dielectrics: intrinsic electronically-active bonding defects in nanocrystalline transition metal oxides
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:G. Lucovsky
Year: 2006


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