Technique of operating time enumeration in the agile-projects
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:G. Tabunshchik; S. Malyuk
Year: 2008
Concept of the strategic decision-making support system at the commercial enterprise using the OLAP technology
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:V. Moskalenko; V. Moskalenko
Year: 2008
Multiservice telecommunication systems design with network's incoming self-similarity flow
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:A. Dmytro; E. Dmytro
Year: 2008
The application of topological methods during symbol analysis of linear parametric circles
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Y. Shapovalov; S. Mankovskyy
Year: 2008
Research of influencing of areas of frenel at the different heights of aerials
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:L. Ozirkovskyy; M. Pelishok; V. Pelishok
Year: 2008
Accuracy improvement of the wigner distribution estimate in non-Gaussian noise environment by means of clipping technique application
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:A. Roenko; I. Djurovic; V. Lukin; A. Zelensky
Year: 2008
Detection of 4-positional phase shift signal at low signal to noise ratio
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:A. Bondarev; B. Mandziy
Year: 2008
Surface feature extraction based on shape and texture analysis
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:O. Lutsyk; Yu. Obukh; V. Korniy; B. Rusyn
Year: 2008
Method of analysis of irregularly spaced 3D point set
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:V. Yarema
Year: 2008
The fluxgate transducer wide-band response detection using correlation processing
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:S.B. Ubizskii; L.P. Pavlyk
Year: 2008
Parallel computing process algorithm
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:L.S. Globa; K. Iermakova; T. Kot
Year: 2008
The model of a small corporate network, protected from insiders
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:A. Govorov; G. Nikulischev; Y. Grosfeld
Year: 2008
Particularities of the amplitude shift keying signal spectrum calculation
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:I. Gorbatyy
Year: 2008
Processing of signals by wavelet and Fourier transformations
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:V. Kychak; O. Stalchenko; S. Bortnyk
Year: 2008
Products parametric reliability estimation and insurance on base of individual prediction
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Y. Bobalo; L. Nedostup; M. Kiselychnyk; O. Lazko
Year: 2008
The logical model of product assembly technological process design
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:I. Nevlyudov; O. Tsymbal; S. Milyutina
Year: 2008
Software for modeling, analysis and optimization of electronic devices process improvement
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Y. Bobalo; L. Nedostup; O. Nadobko; M. Kiselychnyk; O. Lazko
Year: 2008
Analysis of bifurcational properties of the mechanism RED
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:O.V. Lemeshko; O.V. Starkova; M.V. Merkulov
Year: 2008
Electronic and telecommunication devices quality analysis methods
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:O. Lazko
Year: 2008
Statistical methods of missed data restoration and estimation
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Y. Bobalo; O. Lazko
Year: 2008
Research of the indexes of reliability of telecommunications system with including of control means, diagnostics and maintenance works
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:L. Ozirkovskyy; I. Kulyk
Year: 2008
Thermodynamic model for process of expense resource electronic devices
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:V. Nevlyudova
Year: 2008
Optimization of mass and size of heat sinks with finned surfaces
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:N. Gaponenko; E. Ogrenich
Year: 2008
The research of the informative resources and instruments of their production
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:P. Lissov
Year: 2008
Modelling of data coding-decoding algorithms with the use of ANSI II code table of symbols
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:N. Dorosh; H. Kuchmiy; V. Grohola
Year: 2008
Building computer system for musical school with CSM Plone
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:K. Gajdka; W. Zabierowski; A. Napieralski
Year: 2008
Utilization of web technology on the example of portal starosty district in Plock
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:A. Kosinski; W. Zabierowski; A. Napieralski
Year: 2008
Ugrid- national Grid infrastructure for scientific research and education
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:A. Petrenko
Year: 2008
Results of implementation of software “Energyplan” in energy management system of Lviv
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:H. Kopets; T. Kopets
Year: 2008
Structural organisation, functional possibilities and work organization of Moodle open internet-oriented education system
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:O. Gotra; O. Dorosh; N. Kuchmiy
Year: 2008
Type of migrations of individuals in parallel genetic algorithms
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:M. Lobur; S. Tkatchenko; A. Kernytskyy; R. Kryvyy
Year: 2008
The problem of grammar choice for verification of harmonisation process in tonal harmony
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:W. Zabierowski; A. Napieralski
Year: 2008
Indentifying of condition of the corporative ecological system (Ces)
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:T.V. Kozulia; N.V. Sharonova
Year: 2008
Intellectual control systems fuzzy knowledgebase-building technique
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:M. Ternovoy
Year: 2008
Sparse antenna array geometry synthesis for remote sensing systems
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:I. Prudyus; L. Lazko
Year: 2008
Application of theory of stationary stochastic process for modeling of chemiluminescent signal
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:A. Lyapandra
Year: 2008
Application of wavelet-transformation to the analysis of detection signals of railway way
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:B. Rusyn; A. Chorniy
Year: 2008
Induced interference modelling
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:V.M. Kuklin; A.S. Petrenko
Year: 2008
Clustering of visual pattern keys by cascading decomposition
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:R. Melnyk; R. Tushnytskyy
Year: 2008
Analysis of the modulation instability model
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:E.V. Belkin; V.M. Kuklin
Year: 2008
Experimental investigation of former of SHF short pulses with heightened power
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:G. Lukyanchuk
Year: 2008
Functional possibilities of integrated SHF Antennas-oscillators
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:I. Prudyus; E. Grudzinski; V. Golynskyy
Year: 2008
Design of cyclic periodic processes of bakery products realization based on the non-autonomous interval model
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:M. Dyvak; P. Stakhiv; Y. Martsenyuk; L. Honchar
Year: 2008
Prototyping tool development
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:L.S. Globa; T. Kot; V. Olenyuk
Year: 2008
Modelling of resilient deformation influence on cohesion of film surface coatings
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:M. Matviykiv; A. Stashko
Year: 2008
Analysis of resilient deformation influence on cohesion of surface coatings
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:A. Stashko
Year: 2008
The Shape of Things to Come: Future Potential of "Heavy Node" Multi-Core HPC Architectures
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Peter M Kogge
Year: 2008
Acceleration for MPI Derived Datatypes Using an Enhancer of Memory and Network
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Noboru Tanabe; Hironori Nakajo
Year: 2008
Design and Power Performance Evaluation of On-Chip Memory Processor with Arithmetic Accelerators
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Chikafumi Takahashi; Mitsuhisa Sato; Daisuke Takahashi; Taisuke Boku; Akira Ukawa; Hiroshi Nakamura; Hidetaka Aoki; Hideo Sawamoto; Naonobu Sukegawa
Year: 2008
Automatic Application of Last-Touch Instructions for Leakage Energy Reduction
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Kiyofumi Tanaka; Junji Yamano
Year: 2008
Register File Reliability Analysis Through Cycle-Accurate Thermal Emulation
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Jose L Ayala; Pablo G Del Valle; David Atienza
Year: 2008
Introspection-Based Fault Tolerance for COTS-Based High-Capability Computation in Space
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Mark L James; Andrew A Shapiro; Paul L Springer; Hans P Zima
Year: 2008
Modified brown oxide treatment as an adhesion promoter for copper lead frame in plastic integrated-circuit packages
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Lewis Chan; Kwan Yiu Fai; Yau Chun Ho
Year: 2008
Super heavy 6.0 mils Cu wire ball bonding
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Tan Poh Chai; Joe Tan; M Sivakumar; J Premkumar; James Song; Y M Wong
Year: 2008
The superior drop test performance of SAC-Ti solders and its mechanism
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Weiping Liu; Paul Bachorik; Ning-Cheng Lee
Year: 2008
Optimized conditions to make stable free air ball(FAB) for copper bonding wire
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:S H Kim; H W Park; J T Moon
Year: 2008
Intermetallic growth of Sn-Ag-Sb/Ni plated Cu in power packaging subject to thermal aging
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Wedianti Shualdi; Ibrahim Ahmad; Ghazali Omar; Aishah Isnin
Year: 2008
Wafer Level Packaging by residual stress evaluation using piezoresistive stress sensors for the enhancement of reliability
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Seung Seoup Lee; Jong Whan Baik; Jin Soo Kim; Hyung Jin Jeon; Sung Yi
Year: 2008
Process development of fast-cure low stress lid adhesive for microprocessors
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Kee-Hean Keok; Sean Too; Jacquana Diep; Quah Hong Tat; Arai Fumihiro; Kim Le
Year: 2008
Reduction of warpage occurrence on stack-die QFN using FEA and statistical method
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:I Abdullah; I Ahmad; M Z M Talib; M N B C Kamarudin
Year: 2008
Solder void reduction on solder die attach for SIP-LGA
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Ho Tuck Ming; Lily Khor
Year: 2008
An introduction of QFN-SIP package: Process challenges and technical issues
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Lee Chee How; Thong Kai Choh; Lim Ken Guan; Lily Khor
Year: 2008
Challenges & solutions in the die attach process for micro thin die
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Siew Han Looe; Soon Wei Wang
Year: 2008
Ink-jet printing process modeling using neural networks
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Pyung Moon; Chang Eun Kim; Dongjo Kim; Jooho Moon; Ilgu Yun
Year: 2008
Viscoelastic properties of solder pastes and isotropic conductive adhesives used for flip-chip assembly
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:R Durairaj; S Mallik; A Seman; A Marks; N N Ekere
Year: 2008
A novel push-pull sampling methodology for test production in semiconductor manufacturing industries
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Chow Leng Kwang; Ong Eu Chin
Year: 2008
A study of Ag micro-particle reinforced Sn-Zn matrix composite solder
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Sazol Kumar Das; Ahmed Sharif
Year: 2008
Stress evaluations in Micro Bump structures of FCBGA
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Wan Yu Huang; Eason Chen; Jeng Yuan Lai; Yu Po Wang
Year: 2008
Achieving full fungibility and Quick Changeover by turning knobs in tape and Reel machine by applying SMED theory
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Supramaniam Tharisheneprem
Year: 2008
A knowledge based approach for MEMS fabrication process design automation
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Thilo Schmidt; Kai Hahn; Rainer Brück
Year: 2008
Root cause study on lid adhesion failure
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:M C Ong; X L Zhao; B Zee; P P Joman; J M Chin; Raj N Master
Year: 2008
Ultrasonic and thermo-compression gold-to-gold bonding of narrow frames for hermetic cavity sealing and electrical interconnect
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:T Zoumpoulidis; J van Delft; M de Wild; P E M Kuijpers; P de Graaf; R Mauczok; K Biju; M Bartek; M Klee; R Dekker
Year: 2008
Optimizing the cleaning process through cleaning efficiency examination
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Vladimír Sítko; Michal Šaffer; Ivan Szendiuch; Martin Buršik
Year: 2008
Improvement on coined solder surface on organic substrate for flip chip attach yield improvement
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:W S Ooi; Azlina Nayan; D H Ding; Robert Newman; X Zhao; Srinivasan Parthasarathy
Year: 2008
Electrical characterization of through silicon via (TSV) for high-speed memory application
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Terry Hsu; Kevin Chiang; Jeng-Yuan Lai; Yu-Po Wang
Year: 2008
The challenges in automotive Low-k fine pitch bonding
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Rusli Ibrahim; Au Yin Kheng; Yong Cheng Choi
Year: 2008
Interconnection via technology and wafer level package for crystal unit device
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Tae Hoon Kim; Jong Yeol Jeon; Yun Pyo Kwak; Tae Ho Kim; Yun Jung Lim; Jang Ho Park; Seog Moon Choi; Sung Yi
Year: 2008
Crosstalk and switching noise mechanism study in high density wire-bond FPGA device
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Siow Chek Tan; Yee Huan Yew; Hong Shi
Year: 2008
Warpage measurements of laminate based BGA packages at elevated temperatures and comparison with real board assembly behaviour
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Christian Birzer; Markus Graml; Marc Dittes; Walter Mack
Year: 2008
The next generation of quick turn method for interfacial strength testing: High Speed Ball Shear
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Chee Kan Lee; Rebsom Derek; Wei Keat Loh; Hui Ping Ng; Kam Wah Lau
Year: 2008
The future of jet printing
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:William Holm
Year: 2008
Six sigma methodology in improving assembly yield of high-power and high-brightness ligth-emitting diodes packages for automotive application
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:R C Law; Li Zhang; H Y Beh; J Kmetec; Frank Wall; C E Chan; H K Koay
Year: 2008
Nondestructive method of TIM bondline measurement in Flip Chips package
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:H C Heng; V S Ben; K H Keok; Riemer Jay
Year: 2008
Nanowire conductance biosensor by spacer patterning lithography technique for DNA hybridization detection: Design and fabrication method
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Uda Hashim; Shahrir Salleh; Emi Azri Shohini; Siti Fatimah Abd Rahman
Year: 2008
A study of lead-free BGA backward compatibility through solderability testing at component level
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Eu Poh Leng; Wong Tzu Ling; Nowshad Amin; Ibrahim Ahmad
Year: 2008
A novel CMOS-compatible fabrication method for development of an electrostatically actuated micropump
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Hing Wah Lee; Muhamad Ramdzan Buyong; Mohd Ismahadi Syono; Ishak Azid
Year: 2008
Lead-free solder ball attach improvement on FCPBGA with SOP pad finishing
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Wong Tzu Ling; Eu Poh Leng; Nowshad Amin; Ibrahim Ahmad
Year: 2008
Cu wire bond reliability improvement through focused heat treatment after bonding
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Yow Kai Yun; Eu Poh Leng
Year: 2008
Modeling and process development of Die Edge Protection to alleviate thermo-mechanical stresses on silicon dies in PBGA packages
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:C S Foong; K W Shim; Min Ding
Year: 2008
Characterization of copper etching process on micro leadless land grid array (ゼLLGA) via design of experiments approach
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Bih Wen Fon; Hou Boon Tan; Kok Kee Yang
Year: 2008
Application Of Ultra Low Loop gold wire bonding technique in Super Thin (Jedec Package Profile Height Sub Code “X2”) Quad Flat No Lead Package (QFN)
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Tan Boo Wei; Wang Lei; Ken Niu; Lu Hai Long
Year: 2008
TRIZ: Systematic innovation towards factory operational efficiency
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Yeoh Tay Jin; Yeoh Teong San; Song Chia Li
Year: 2008
Wire strength of Cu wire on al metallization after high temperature reliability
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Law Chee Soon; Venkata Krishna
Year: 2008
An analysis on the properties of epoxy based die attach material and the effect to delamination and wire bondability
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:H T Wang; Y C Poh
Year: 2008
NGSHBI throughput optimization through innovative solution
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Nagappan Annamalai; Choo Pak Kee; K S Yeoh; Wan Asmadi Wan Ismail
Year: 2008
Process development, repair and reliability study with Anisotropic Conductive Film bonding as a replacement for surface mount connectors and hotbar soldering
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Manickavasagar Minor; Jonas Sjoberg; Jenson Lee; Dongkai Shangguan
Year: 2008
Process development and reliability evaluation of Electrically conductive adhesives (ECA) for low temperature SMT assembly
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Jenson Lee; Jonas Sjoberg; Daniel T Rooney; David A Geiger; Dongkai Shangguan
Year: 2008
Process development, repair and reliability evaluation for inline Package on Package (PoP) assembly
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Naidu Apparavu; Jonas Sjoberg; David A Geiger; Dongkai Shangguan
Year: 2008
Unique high density leadframe development for SOT23
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Zhang Jingyuan; Ruan Jianhua
Year: 2008
Ultra low loop development
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Song HuaJun
Year: 2008
Characterization of Electro-chemical Deflash and High Pressure Water Jet through MPCpS
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Marvin Picardal; Gavino Coronel
Year: 2008
Screen and stencil printing processes for wafer backside coating
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Mark Whitmore; Jeff Schake
Year: 2008
Mechanics of Sn-4Ag-0.5Cu solder joints in a ball grid array assembly during reflow and temperature cycles
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Lai Zheng Bo; Nazri Kamsah; Loh Wei Keat; Mohd Nasir Tamin
Year: 2008
Chip-free singulation for medical application
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Annette Teng
Year: 2008
Important qualification process to wafer probing
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Yoon-Peng Yee
Year: 2008
Achieving high speed RFID die pick and place operation
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Ron Koepp; Terry Allen; Jay Fassett; Annette Teng
Year: 2008
High power multi-chip system integration in package
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Hubert Wieser; Shim Kar Wei; Anton Kolbeck
Year: 2008
Failure analysis for Copper Wire Bonding process from machine perspective
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Hasnida Abdul Samat; Shahrul Kamaruddin; Ishak Abd Azid
Year: 2008
An experimental study on the application of Carbon nanotubes (CNTs) as thermal interfacial material in processor chip testing
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Lee Yuan Thing; D Mutharasu
Year: 2008
Thermal cycling fatigue model development for FBGA assembly with Sn-Ag-based lead-free solder
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Fa-Xing Che; Jing-En Luan; Daniel Yap; Kim-Yong Goh; Xavier Baraton
Year: 2008
Latest developments in bumping technologies for flip chip and WLCSP packaging
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Dionysios Manessis; Rolf Aschenbrenner; Andreas Ostmann; Herbert Reichl
Year: 2008
Observation of solder fillers coalescence in resin for development of self-organization assembly process
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Koushi Ohta; Masao Toya; Kiyokazu Yasuda; Michiya Matsushima; Kozo Fujimoto
Year: 2008
A new concept of self-aligned contact implantation for power devices
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Banu Poobalan; Kuan Yew Cheong; Ung Boon Hoe; Resch Roland
Year: 2008
Highly efficient corrosion protection for plated pure tin surfaces
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Jürgen Barthelmes; Sia-Wing Kok; Din-Ghee Neoh; Olaf Kurtz
Year: 2008
Radical breakthrough innovative solution in SHBI PM optimization using TRIZ
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Nagappan Annamalai; Ninad K Patel; Subramaniam Muthukarapan
Year: 2008
An approach for exhaustive self testing of LUTs in an FPGA using Walsh configurations
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:New Chin-Ee; T Nandha Kumar
Year: 2008
Critical assessment of die level predictor models
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Melanie Po-Leen Ooi; Chris Chan; Su-Lyn Lee; Wai Loon Chin; Ling Ying Goh; Ye Chow Kuang; Serge Demidenko
Year: 2008
Nonlinear modeling of a capacitive MEMS accelerometer using neural network
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:A R Bahadorimehr; M Hamidon; Y Hezarjaribi
Year: 2008
Fabrication of nanoporous polyimide of low dielectric constant
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Mohd Bisyrul Hafi Othman; Zulkifli Ahmad; Hazizan Md Akil
Year: 2008
Optimization of hot carrier resistance for 0.18µm CMOS technology
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Sim Poh Ching; Yook Hyung Sun; Chu Tsui Ping
Year: 2008
Variability modeling of RF characteristics for multi-finger MOSFETs using statistical methods
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Hyuck Sang Yim; Jung Han Kang; Ilgu Yun
Year: 2008
Comparison of the performances of micropump with active type diaphragm actuated by several approaches
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Wong Wai Chi; Ishak Hj Abdul Azid
Year: 2008
Precise control of 8 terminal capacitor placement on fully populated PGA singulated substrate
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Hafiz Habib; Ow Yong Soon Tatt
Year: 2008
Half cut stress concentration (HCSC) region design on MEMS piezoresistive cantilever for sensitivity enhancement
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:S M Firdaus; Ishak Abd Azid; O Sidek; K Ibrahim; Magdy Hussien
Year: 2008
Effects of Sb on SnAgCu lead-free solder
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Kuan Yew Cheong; Mei Chan Ng; Ahmad Badri Ismail; Luay Bakir Hussain
Year: 2008
Penalty for power reduction -: performance or schedule or yield?
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Bodhisatya Sarker; Jaswinder Ahuja; Arijit Dutta; Srinath D.; Kaip Sridhar; Radhakrishnan Nair; Jayant Lahiri
Year: 2008
A 1.8/2.4-ghz dualband cmos low noise amplifier using miller capacitance tuning
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Depak Balemarthy; Roy Paily
Year: 2008
A framework for energy consumption based design space exploration for wireless sensor nodes
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:S Chouhan; M Balakrishnan; R Bose
Year: 2008
Advances in low power verification
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Janick Bergeron
Year: 2008
Clock gating for power optimization in ASIC design cycle theory & practice
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:S Jairam; Madhusudan Rao; Jithendra Srinivas; Parimala Vishwanath; H Udayakumar; Jagdish Rao
Year: 2008
A probabilistic technique for full-chip leakage estimation
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Shaobo Liu; Qinru Qiu; Qing Wu
Year: 2008
Power reduction in on-chip interconnection network by serialization
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:M Arvind; B Amrutur
Year: 2008
Design of dual threshold voltages asynchronous circuits
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:B Ghavami; H Pedram
Year: 2008
Analytical results for design space exploration of multi-core processors employing thread migration
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Ravishankar Rao; Sarma Vrudhula; Krzysztof Berezowski
Year: 2008
A physical level study and optimization of CAM-based checkpointed register alias table
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Elham Safi; Andreas Moshovos; Andreas Veneris
Year: 2008
Variability of flip-flop timing at sub-threshold voltages
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Niklas Lotze; Maurits Ortmanns; Yiannos Manoli
Year: 2008
Power management solutions for computer systems and datacenters
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:K Rajamani; C Lefurgy; S Ghiasi; J Rubio; H Hanson; T Keller
Year: 2008
Reducing leakage power by accounting for temperature inversion dependence in dual-Vt synthesized circuits
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Andrea Calimera; R Iris Bahar; Enrico Macii; Massimo Poncino
Year: 2008
Error-resilient low-power Viterbi decoders
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:R A Abdallah; N R Shanbhag
Year: 2008
Reliability-centric gate sizing with simultaneous optimization of soft error rate, delay and power
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Koustav Bhattacharya; Nagarajan Ranganathan
Year: 2008
Variation-aware gate sizing and clustering for post-silicon optimized circuits
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Cheng Zhuo; David Blaauw; Dennis Sylvester
Year: 2008
SRAM methodology for yield and power efficiency: per-element selectable supplies and memory reconfiguration schemes
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Rouwaida Kanj; Rajiv V Joshi; Zhuo Li; J B Kuang; Hung Ngo; Ying Zhou; Weiping Shi; Sani Nassif
Year: 2008
Row/column redundancy to reduce SRAM leakage in presence of random within-die delay variation
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Maziar Goudarzi; Tohru Ishihara
Year: 2008
Multiple power-gating domain (multi-VGND) architecture for improved leakage power reduction
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Ashoka Sathanur; Luca Benini; Alberto Macii; Enrico Macii; Massimo Poncino
Year: 2008
Low power design under parameter variations
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Swarup Bhunia; Kaushik Roy
Year: 2008
A parallel and randomized algorithm for large-scale discrete dual-Vt assignment and continuous gate sizing
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Tai-Hsuan Wu; Lin Xie; A Davoodi
Year: 2008
Dynamic virtual ground voltage estimation for power gating
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Hao Xu; R Vemuri; Wen-Ben Jone
Year: 2008
A mathematical solution to power optimal pipeline design by utilizing soft edge flip-flops
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Mohammad Ghasemazar; Behnam Amelifard; Massoud Pedram
Year: 2008
Enhancing beneficial jitter using phase-shifted clock distribution
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Dong Jiao; Jie Gu; Pulkit Jain; Chris Kim
Year: 2008
Correlation verification between transistor variability model with body biasing and ring oscillation frequency in 90nm subthreshold circuits
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Hiroshi Fuketa; Masanori Hashimoto; Yukio Mitsuyama; Takao Onoye
Year: 2008
Towards a green electronic world: a collaborative approach
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Jaswinder Ahuja
Year: 2008
Low-power high-accuracy timing systems for efficient duty cycling
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:T Schmid; J Friedman; Z Charbiwala; Y H Cho; M B Srivastava
Year: 2008
Low power chips: a fabless asic perspective
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Shashank Bhonge; Vamsi Boppana
Year: 2008
On leakage currents: sources and reduction for transistors, gates, memories and digital systems
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Wolfgang Nebel; Domenik Helms
Year: 2008
Lazy instruction scheduling: keeping performance, reducing power
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:A Mahjur; M Taghizadeh; A H Jahangir
Year: 2008
On the rules of low-power design (and how to break them)
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Todd M Austin
Year: 2008
Utilizing HDL simulation engines for accelerating design and test processes
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Najmeh Farajipour; S Behdad Hosseini; Zainalabedin Navabi
Year: 2008
Diagnosis of SoC faulty memory cells for embedded repair
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:V Hahanov; E Litvinova; K Krasnoyaruzhskaya; S Galagan
Year: 2008
Parity prediction method for on-line testing of a Barrel-shifter
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:A Drozd; S Antoshchuk; A Rucinski; A Martinuk
Year: 2008
Message from ISSM 2008 Executive Committee chair
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Michihiro Inoue
Year: 2008
Welcome to ISSM 2008
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Satoru Ito
Year: 2008
Robust design with direct product of the L18 orthogonal arrays
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:N. Kuramochi; Y. Oomuro
Year: 2008
Going green with on-site generated fluorine: Sustainable cleaning agent for CVD processes
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Paul Stockman; Greg Shuttleworth
Year: 2008
A safer alternative to hydrofluoric acid for Cleaning epitaxial silicon reactor exhaust parts
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Tamir F. Ayad
Year: 2008
Impacts of small lot manufacturing on AMHS
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Hiroshi Kondo
Year: 2008
Think outside of the Integrated Circuit Fabricator box
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Bevan Wu
Year: 2008
TLS-Dicing - the way to higher yield and throughput
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:H.-U. Zuehlke; Gabriele Eberhardt; Patrick Mende
Year: 2008
Effect of type of foil and blade type to backside chipping in wafer level packages
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Peh Kok Hua; Low Chen Chuan; See Beng Keh
Year: 2008
Invisible Ejector Characteristic
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Chandrasagaran Moganasundaram
Year: 2008
ISSM 2008 Committee
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Year: 2008
Fully automation control system for golden super hot lot in 300mm Fab
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:De-Lung Wu; Hsi-Lo Lo; Cheng-Chung Pan
Year: 2008
Throughput improvement with setup reduction focusing on process identification
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Yoshiaki Kobayashi; Taichi Hayamizu; Katsuhisa Sakai
Year: 2008
Win-win approach between Tool productivity and delivery fulfillment by Carpool execution
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Yih-Yi Lee; Jun-Nan Chen; CJ Hsiao
Year: 2008
In-line inspection impact on Cycle Time and Yield
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Israel Tirkel; Noam Reshef; Gad Rabinowitz
Year: 2008
Optimization of diffusion furnace loading based on substrate and recipe selection
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Ketan Khowala; Ravi Vancheeswaran
Year: 2008
TAT cost calculation of a wafer in a lot
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Hiroyuki Okumura
Year: 2008
Manual Material Handling System
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Wen Cheng Chen; Noah Chiou; J.Y. Lu; Jonathan Yeh; Jessica Kuan
Year: 2008
A Scanner Throughput Monitoring System (STMS) for continuously improving litho-cluster productivity
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Wei Tai Chen; Pin Chun Lin; Ta Wei Wu
Year: 2008
Optimal load allocation method for keeping target TAT - application of Nonlinear Programming -
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Akira Ono; Shoichi Kitamura; Kazuyuki Mori
Year: 2008
A study of multiple objectives real-time dispatcher for wafer fabrication
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Yen-Fei Lee; Zhibin Jiang; Zhang Huai; Chen-Pin Ko; Mohamad Zambri; Deer Yi; Asok Kumar
Year: 2008
Highly accurate management in dynamically changing fab
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:K. Imaoka; Y. Ishii; T. Kikuchi; S. Sugawa; A. Nagahira
Year: 2008
Advanced quality control of quartz parts for semiconductor equipment based on the food industry's well-established QC methodology (HACCP)
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Kazuya Dobashi; Misako Saito; Teruyuki Hayashi
Year: 2008
Exploratory study on emerging integrator business model in engineering chain of the semiconductor industry: Re-integration of vertical disintegration
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Yea-Husy Su; Ruey-Shan Guo; Chia-Wen Lo; Dain-Xuan Kao
Year: 2008
System perspective on the business model structures of TSMC and UMC: Foundations of business model design for a company
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Yea-Huey Su; Po-Min Chang
Year: 2008
Method and system for determining optimal wafer sampling in real-time inline monitoring and experimental design
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Susan Sun; Kari Johnson
Year: 2008
Accelerating R&D learning: Cycle time reduction of a Technology Development (TD) fab
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Mike Zhang; Dylan Howard
Year: 2008
Using DEA for relative efficiency analysis of wafer fabrication facilities
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Wan-Ling Lin; Chen-Fu Chien; Wen-Chih Chen; Wen-Chin Wu; Hsin-Yin Wang; Ren-Tsun Kuo; Ming-Hsuan Chou
Year: 2008
Knowledge sharing and creation in the semiconductor equipment industry
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Tsuyoshi Moriya; Caroline Benton
Year: 2008
Improving customer responsiveness at assembly test operations with the application of manufacturing science
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Joan Tafoya; Diana Rojas Gonzalez
Year: 2008
Overall Equipment Efficiency (OEE) improvements for lithographic tools in wafer fab
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Lee Yen-Fei; Ko Chen-Pin; Chang Hsu-Sheng; Muhammad Shariff; Ng Kok Hooi; Chandra Segar; Surein Gopal
Year: 2008
Focus and CD control by scatterometry measurements for 65/45nm node devices
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Toshihide Kawachi; Hidekimi Fudo; Shigenori Yamashita; Keizo Yamamoto; Kazunori Morinaga; Shunichi Matsumoto; Toshiharu Miwa
Year: 2008
Approach of continuous device reliability improvement activity in manufacturing stage
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Akira Inoue; Tomoya Omata
Year: 2008
Interconnection failure caused by bath degradation in copper electroplating and its VM-FDC using mathematical model
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Shin-ichi Imai; Masaki Kitabata; Tomoya Tanaka
Year: 2008
An algorithm to visualize tool difference transitions in semiconductor fabrications
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Tomoaki Kubo; Masateru Minami; Tetsuya Homma
Year: 2008
A cost-effective alternative to moisture monitoring in epitaxial silicon processing
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Theodore F. Alfonso; Cary Branecky; Tamir F. Ayad
Year: 2008
APC - The consequent next step
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Michael Bruggemann; Gerhard Lippl
Year: 2008
Photolithography run-to-run metrology control using multiple algorithms for mass production enhancement
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Yung-Yao Lee; Han-Wei Chu; Chia-Jen Tung; Pei-Wei Lin; Jin-Shing Luo
Year: 2008
FDC-methods as trigger for predective maintenance for hot- and wet-process equipment
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Fritz Lindner
Year: 2008
Lithography hotspot discovery at 70nm DRAM 300mm fab: Process Window Qualification using Design Base Binning
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Ray Yen; Daniel Chen; Mingjen Cheng; Andy Lan; Damian Chen; Rajesh Ghaskadvi; Ellis Chang
Year: 2008
Phenomenology of ArF photoresist shrinkage trends
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Benjamin Bunday; Aaron Cordes; John Allgair; Emil Piscani; Bryan J. Rice; Yohanan Avitan; Ram Peltinov; Ofer Adan
Year: 2008
Novel single-wafer, single-chamber combined dry and wet system for stripping and in-situ cleaning of high-dose ion-implanted photoresists
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Y. J. Kim; C.R. Yoon; E.S. Roh; J.K. Cho; T. Hattori
Year: 2008
In-line metrology for the 45 nm and 32 nm nodes
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:John Allgair; Benjamin Bunday; Aaron Cordes; Pete Lipscomb; Milt Godwin; Victor Vartanian; Michael Bishop; Doron Arazi; Kye-Weon Kim
Year: 2008
Monitoring and managing system of equipment operation status by using detailed event log data extracted from exposure tool
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Masatoshi Ikeda; Hidetaka Nishimura; Ichiro Takahashi; Yukio Ibe
Year: 2008
Defect reduction in ArF immersion lithography, using particle trap wafers with CVD thin films
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Yoshinori Matsui; Naka Onoda; Seiji Nagahara; Takayuki Uchiyama
Year: 2008
Design optimization of lateral DMOS using Genetic Algorithm
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Hideto Mitsuhashi; Akio Mouraguchi; Youhei Sudou; Masaaki Sato
Year: 2008
Start contents
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Year: 2008
Defect reduction in advanced lithography processes using a new dual functionality filter
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Aiwen Wu; Wailup Chow
Year: 2008
Detection of non visible Poly leakage defect by e-beam inspection
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Shinya Ito; Yana Matsushita; Go Nagatani
Year: 2008
Reducing contamination of particles reflected in turbo molecular pump
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Hiroyuki Kobayashi; Kenji Maeda; Masaru Izawa
Year: 2008
EES data analysis of lithography trouble detected by MapSSA
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:H. Matsushita; A. Iyama; H. Miyashige; S. Nakagawa; M. Hatano; H. Kakinuma
Year: 2008
Qualification of inline FIB for production — A comprehensive “BEOL” contamination study
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Michael Sledz; Burchell Baptiste; Haim Pearl; Ronnie Porat; Jacob Levin
Year: 2008
Integrated defect sampling method by using design attribute for high sensitivity inspection in 45nm production environment
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Yasuhiro Kaga; Yoshiyuki Sato; Yasuyuki Yamada; Yuuichiro Yamazaki; Masami Aoki; Ryota Harukawa; Ellis Chang
Year: 2008
A trend mining method for yield improvement based on trend in time series
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Hidetaka Tsuda; Hidehiro Shirai; Masahiro Terabe; Kazuo Hashimoto; Ayumi Shinohara
Year: 2008
Knowledge engineering of analysis tool application processes for yield symptom identification
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Fang-Hsiang Su; Shi-Chung Chang; Ya-Jung Tsai; Chun-Yao Lu; Chih-Min Fan
Year: 2008
Message from ISSM 2008 Japan Program Committee chair
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Nobuhiro Otsuka
Year: 2008
A self-checking scheme to mitigate single event upset effects in SRAM-based FPAAs
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:T R Balen; F Leite; F G L Kastensmidt; M Lubaszewski
Year: 2008
Characterization of the ANITA neutron source for accelerated SEE testing at The Svedberg laboratory
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:A V Prokofiev; J Blomgren; R Nolte; S P Platt; S Rottger; A N Smirnov
Year: 2008
Altitude and underground real-time SER characterization of CMOS 65nm SRAM
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:J L Autran; P Roche; S Sauze; G Gasiot; D Munteanu; P Loaiza; M Zampaolo; J Borel
Year: 2008
Objects classification based on their physical sizes for detection of events in camera images
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:G. Szwoch; P. Dalka; A. CzySewski
Year: 2008
Evaluation of existing Harmonic-to-Noise Ratio methods for voice assessment
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:R. Sousa; A. Ferreira
Year: 2008
Network of synchronized oscillators - digital approach
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:P. Brylski; M. Strzelecki
Year: 2008
Automatic system for audio-video material reconstruction and archiving
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:K. Adam; C. Andrzej
Year: 2008
Macroblock-level rate control based on the linear RD model for H.264/AVC
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:G. Pastuszak; A. Pietrasiewicz
Year: 2008
Recent advances in radiographic X-ray source development at Sandia
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:B. V. Oliver; K. Hahn; M. D. Johnston; J. Leckbee; S. Portillo; D. R. Welch
Year: 2008
High power particle beams researches in IFP
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Zhang Linwen
Year: 2008
Cost optimization of HPM systems
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:J. Benford; D. Benford
Year: 2008
Analysis of the PTS vacuum insulator stack
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Meng Wang; Wenkang Zou; Yongchao Guan; Shenyi Song; Minghe Xia; Ce Ji; Qineng Liu; Weiping Xie; Jianjun Deng
Year: 2008
Prospects of pulsed high-current dischargein nitrogen-filled-capillary for lasing at 13.4 nm
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:K. Kolacek; O. Frolov; V. Prukner; J. Schmidt; J. Straus
Year: 2008
Advances in cherenkov relativistic backward-wave oscillators
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:V. V. Rostov; E. M. Tot'meninov; M. I. Yalandin
Year: 2008
A repetitive high-current pulsed accelerator—TPG700
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Song Xiao-xin; Liu Guo-zhi; Peng Jian-chang; Su Jian-cang; Wang Li-min; Zhu Xiao-xin; Pan Ya-feng; Zhang Xi-bo; Guo Wen-hui; Qiu Shi; Huang wenhua
Year: 2008
Sharp electron density for laser wakefield accelerator
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Jaehoon Kim; Seung Hoon Yoo; Jong Uk Kim
Year: 2008
240keV double-pulse LIA device
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Jing Xiaobing; Mu Fan; Pang Haifeng; Zhang Kaizhi; Shi Jinshui; Deng Jianjun; Cheng Cheng; Liao Shu-qing; Lin Yu-zheng; Tang Chuan-xiang; Zheng Shu-xin
Year: 2008
Investigations of cold cathode emission in gas and vacuum with picosecond resolution
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:G. Mesyats; S. Shunaylov; K. Sharypov; V. Shpak; M. Yalandin
Year: 2008
Research on large emission area thermionic cathode
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Liansheng Xia; Anming Yang; Huang Zhang; Kaizhi Zhang; Jinshui Shi; Linwen Zhang; Jianjun Deng
Year: 2008
Acceleration of macroscopic particle to hypervelocity by high intensity beams
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Y. A. Lei; J. Liu
Year: 2008
Surface modification of TiC-NiCrAl hard alloy by pulse electron beam
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:N. N. Koval; Y. F. Ivanov; V. E. Ovcharenko; Y. A. Kolubaeva; S. V. Grigoryev
Year: 2008
20-MW desktop free-electron laser at THz frequencies
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Yen-Chieh Huang; Cheng-Ying Tsai; Chia-Hsian Chen; Wai-Keung Lau; Gwo-Huei Luo
Year: 2008
An inward-emitting magnetically insulated line oscillator
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Xiao Renzhen; Zhang Yongpeng; Shao Hao; Sun Jun
Year: 2008
Repetition rate operation of an improved magnetically insulated transmission line oscillator
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Yu-Wei Fan; Hui-Huang Zhong; Zhi-Qiang Li; Heng Zhou; Cheng-Wei Yuan; Wei-Hong Zhou; Jun Zhu; Ling Luo
Year: 2008
Experimental research on the voltage distribution of tesla transformer's taper windings
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Li Mingjia; Kang Qiang; Xin Jiaqi
Year: 2008
The study of the framing technology on Z-Pinch plasma imaging diagnosticate
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Shaotong Zhou; Xianbin Huang; Libing Yang; Rongguo Zhou; Wenda Peng; Jinyuan Liu; Lihong Niu
Year: 2008
A high power 390 GHz harmonic gyrotron based on cusp electron gun
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:F. Li; W. He; A. D. R. Phelps; A. W. Cross; C. R. Donaldson; K. Ronald
Year: 2008
The design and optimization of a C-band integrated mode converter and horn antenna
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Zhang Zhiqiang; Huang Wenhua; Qiu Shi; Zhang Qingyuan; Hao Wenxi; Liang Tiezhu
Year: 2008
Towards a self-consistent LSP model of an electron beam diode
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:D. Swatton
Year: 2008
Parallel electromagnetic FDTD program design and implementation on JASMIN
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Li Hanyu; Zhou Haijing; Dong Zhiwei
Year: 2008
Beam characterizations of the Mini-LIA
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Shu-Qing Liao; Cheng Cheng; Shu-Xin Zheng; Chuan-Xiang Tang; Yu-Zheng Lin; Xiao-Bing Jing; Fan Mu; Hai-Feng Pang
Year: 2008
High power microwave generation by a novel vircator with coaxial waveguide
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Liu Jing; Li Zhiqiang
Year: 2008
Development of nanosecond pulsed high-power amorphous cores
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Fa-Hou Wang; Jin-Shui Shi; Si-Fu Chen; Qing-Hua Chen; Chun-Tai Zhang; Bin-Feng Yang; Xi Lin
Year: 2008
Investigation of anode foil stability at high-current electron accelerator
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:V. V. Ezhov; E. G. Krastelev; G. E. Remnev
Year: 2008
The magnetic field distribution in acceleration gap of magneticaly insulated ion diode
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:A. V. Stepanov; G. E. Remnev
Year: 2008
DC emitting characteristics of a single crystal LaB6 thermionic cathode
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Wang Han-bin; Li Ming; Liu Xi-san
Year: 2008
Analysis of complex cathode material emission characters
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Zhang Yong-hui; Song Fa-lun; Xiang Fei
Year: 2008
Design of a high-power linear induction prototype cell at megahertz repetition rate burst mode
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Sifu Chen; Xin Li; Ziping Huang; Hengsong Ding; Wenwei Zhang; Long Wen; Huang Zhang; Huacen Wang; Jinshui Shi; Linwen Zhang; Jianjun Deng
Year: 2008
Investigation of 4 MV coaxial-triplate water self-breaking switch
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Xia Minghe; Li Hongtao; Feng Shuping; Xie Weiping; Den Jianjun
Year: 2008
Microsecond plasma opening switches operation scenario
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:S. V. Loginov
Year: 2008
W-band Gyro-BWO using a helically corrugated waveguide
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:C. R. Donaldson; W. He; A. D. R. Phelps; F. Li; A. W. Cross; K. Ronald; A. R. Young; C. G. Whyte
Year: 2008
Simulation study of a novel all solid, long pulse, high power pulse modulator
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Yang Shi; Zhong Hui-huang
Year: 2008
A study on frequency stabilities of microwave emission from a reflex triode vircator
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Limin Li; Lie Liu; Jianchun Wen; Jun Zhan; Yonggui Liu; Jing Liu
Year: 2008
Status of high power ion beams research at Northwest Institute of Nuclear Technology
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Yang Hai-liang; Qiu Ai-ci; Sun Jian-feng; Su Zhao-feng; Gao Yi; Li Jing-ya; Huang Jian-jun; Ren Shu-qing; He Xiao-ping; Tang Jun-ping; Wang Hai-yang; Liang Tian-xue; Yin Jia-hui; Zhang Yong-min; Ouyang Xiao-ping
Year: 2008
Design of an energy recovery system for a Gyrotron backward wave oscillator
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:L. Zhang; W. He; A. W. Cross; A. D. R. Phelps; K. Ronald; C. G. Whyte
Year: 2008
Particle simulation of X-band dual frequency coaxial relativistic backward wave oscillator
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Song Gangyong; Meng Lin; Yu Xinhua; Gu Xiaowei; Yang Jiao
Year: 2008
Design of a transition section for 94GHz gyrotron oscillator
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Yu Xinhua; Meng Lin; Yu Zhiming; Niu Xinjian; Song Gangyong; Gu Xiaowei
Year: 2008
A magnetically insulated transmission line oscillator working at HEM11 mode
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Dong Wang; Dai-bing Chen; Zhi-kai Fan
Year: 2008
Governing lethal behavior: Embedding ethics in a hybrid deliberative/reactive robot architecture part I: Motivation and philosophy
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:R. C. Arkin
Year: 2008
Housewives or technophiles?: Understanding domestic robot owners
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Ja-Young Sung; R. E. Grinter; H. I. Christensen; Lan Guo
Year: 2008
How quickly should communication robots respond?
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:T. Shiwa; T. Kanda; M. Imai; H. Ishiguro; N. Hagita
Year: 2008
How training and experience affect the benefits of autonomy in a dirty-bomb experiment
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:D. J. Bruemmer; C. W. Nielsen; D. I. Gertman
Year: 2008
Human to robot demonstrations of routine home tasks: Exploring the role of the robot's feedback
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:N. Otero; A. Alissandrakis; K. Dautenhahn; C. Nehaniv; D. S. Syrdal; K. L. Koay
Year: 2008
The roles of haptic-ostensive referring expressions in cooperative, task-based human-robot dialogue
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:M. E. Foster; E. G. Bard; M. Guhe; R. L. Hill; J. Oberlander; A. Knoll
Year: 2008
Simultaneous teleoperation of multiple social robots
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:D. F. Glas; T. Kanda; H. Ishiguro; N. Hagita
Year: 2008
Spiral response-cascade hypothesis — Intrapersonal responding-cascade in gaze interaction
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Y. Yoshikawa; S. Yamamoto; H. Sumioka; H. Ishiguro; M. Asada
Year: 2008
Supervision and motion planning for a mobile manipulator interacting with humans
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:E. A. Sisbot; A. Clodic; R. Alami; M. Ransan
Year: 2008
Combining Dynamical Systems control and programming by demonstration for teaching discrete bimanual coordination tasks to a humanoid robot
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:E. Gribovskaya; A. Billard
Year: 2008
Keynote talk: Joint action in man and autonomous systems
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:H. Bekkering; E. Bicho; R. G. J. Meulenbroek; W. Erlhagen
Year: 2008
Crew roles and operational protocols for rotary-wing micro-UAVs in close urban environments
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:R. R. Murphy; K. S. Pratt; J. L. Burke
Year: 2008
Inpainting using geometrical grouplets
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Aldo Maalouf; Philippe Carre; Bertrand Augereau; Christine Fernandez-Maloigne
Year: 2008
Bandelet-based video inpainting
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Aldo Maalouf; Philippe Carre; Bertrand Augereau; Christine Fernandez-Maloigne
Year: 2008
A variational approach for image fusion visualization
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Gemma Piella
Year: 2008
Relaxing the half-wavelength condition for estimating signal AOA at a line of sensors
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Mohamed H. El-Shafey; Tareq Abdul-Rahman; Yasser H. Dakroury
Year: 2008
Classification of linear and nonlinear modulations using the Baum-Welch algorithm
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Anchalee Puengnim; Nathalie Thomas; Jean-Yves Tourneret; Josep Vidal
Year: 2008
Combining one-class support vector machines and hysteresis thresholding: Application to burnt area mapping
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Olivier Zammit; Xavier Descombes; Josiane Zerubia
Year: 2008
Binaural sound localization for untrained directions based on a Gaussian mixture model
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Takanori Nishino; Kazuya Takeda
Year: 2008
Design of IIR filters using new three allpass filters structure
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Alfonso Fernandez-Vazquez; Gordana Jovanovic-Dolecek; Xue Mei Xie
Year: 2008
Jointly optimized error-feedback and realization for roundoff noise minimization in state-estimate feedback digital controllers
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Takao Hinamoto; Keijiro Kawai; Masayoshi Nakamoto; Wu-Sheng Lu
Year: 2008
Perceptually relevant ringing region detection method
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Hantao Liu; Nick Klomp; Ingrid Heynderickx
Year: 2008
Separation of periodic and aperiodic sound components by employing frequency estimation
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Kristof Aczel; Istvan Vajk
Year: 2008
Filter design for the detection of compact sources embedded in non-stationary noise plus a deterministic background
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:F. Argueso; J. L. Sanz
Year: 2008
Functional semi-automated segmentation of renal DCE-MRI sequences using a Growing Neural Gas algorithm
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:B. Chevaillier; D. Mandry; Y. Ponvianne; J. L. Collette; M. Claudon; O. Pietquin
Year: 2008
Estimation of the instantaneous harmonic parameters of speech
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Elias Azarov; Alexander Petrovsky; Marek Parfieniuk
Year: 2008
Effect of an additional sensor on AOA localization performance
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Kutluyil Dogancay
Year: 2008
Data-aided time-domain synchronization for filter bank multicarrier systems
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Tilde Fusco; Angelo Petrella; Mario Tanda
Year: 2008
Acoustic source localization by fusing distributed microphone arrays measurements
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:G. Prandi; G. Valenzise; M. Tagliasacchi; F. Antonacci; A. Sarti; S. Tubaro
Year: 2008
Multi-label classification algorithm derived from K-nearest neighbor rule with label dependencies
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Zoulficar Younes; Fahed Abdallah; Thierry Denoeux
Year: 2008
Multilevel block matching technique with the use of generalized partial volume interpolation for nonlinear intersubject registration of MRI brain images
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Daniel Schwarz; Tomas Kasparek
Year: 2008
Forward/Backward Algorithms for joint multi pattern speech recognition
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Nishanth Ulhas Nair; T. V. Sreenivas
Year: 2008
Automatic transcription of piano music based on HMM tracking of jointly-estimated pitches
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Valentin Emiya; Roland Badeau; Bertrand David
Year: 2008
Broadband superdirective beamforming using multipole superposition
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Martin Eichler; Arild Lacroix
Year: 2008
A comparative study on the processing of ultrasonic arc maps
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Billur Barshan
Year: 2008
Shape from texture for omnidirectional images
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:L. Jacques; E. De Vito; L. Bagnato; P. Vandergheynst
Year: 2008
Objective measures for real-time evaluation of adaptive feedback cancellation algorithms in hearing aids
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Ann Spriet; Koen Eneman; Marc Moonen; Jan Wouters
Year: 2008
Bilateral human motion filtering
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Nicolas Courty
Year: 2008
Two new gradient based non-unitary joint block-diagonalization algorithms
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:H. Ghennioui; N. Thirion-Moreau; E. Moreau; D. Aboutajdine; A. Adib
Year: 2008
A novel approach based on non-unitary joint block-diagonalization for the blind MIMO equalization of cyclo-stationary signals
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:H. Ghennioui; N. Thirion-Moreau; E. Moreau; D. Aboutajdine; A. Adib
Year: 2008
A new feature analysis method for robust ASR in reverberant environments based on the harmonic structure of speech
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Rico Petrick; Kevin Lohde; Mike Lorenz; Ruediger Hoffmann
Year: 2008
Application of the fan-chirp transform to hybrid sinusoidal+noise modeling of polyphonic audio
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Maciej Bartkowiak
Year: 2008
Calibration and 3D geometry estimation of a pan-tilt-zoom camera network
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Imran N. Junejo
Year: 2008
Gradient based Approximate Joint Diagonalization by orthogonal transforms
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Mikael Sorensen; Sylvie Icart; Pierre Comon; Luc Deneire
Year: 2008
Improving the detection efficiency of the VMR-WB VAD algorithm on music signals
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Vladimir Malenovsky; Milan Jelinek
Year: 2008
A subspace method for detection and classification of rail defects
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Zineb Mehel-Saidi; Gerard Bloch; Patrice Aknin
Year: 2008
The spherical approach to omnidirectional visual attention
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Iva Bogdanova; Alexandre Bur; Heinz Hugli
Year: 2008
Projective-space colour filters using quaternion algebra
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Todd A. Ell; Stephen J. Sangwine
Year: 2008
Joint security and channel coding for OFDM communications
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Alessandro Neri; Daniele Blasi; Luca Gizzi; Patrizio Campisi
Year: 2008
Detection of high-frequency steady state visual evoked potentials using phase rectified reconstruction
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Gary Garcia Molina
Year: 2008
Extension of score function difference for frequency domain blind source separation
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Jani Even; Hiroshi Saruwatari; Kiyohiro Shikano
Year: 2008
Word descriptors of image quality based on local dispersion-versus-location distributions
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Alfredo Restrepo; Giovanni Ramponi
Year: 2008
Joint deblurring and demosaicing of Poissonian Bayer-data based on local adaptivity
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Dmytro Paliy; Alessandro Foi; Radu Bilcu; Vladimir Katkovnik; Karen Egiazarian
Year: 2008
Improved coding of tonal components in MPEG-4 AAC with SBR
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Tomasz Zernicki; Marek Domanski
Year: 2008
Modeling and analysis of chaos-modulated dual oscillator-based random number generators
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Salih Ergun
Year: 2008
Harmonic extension of an adaptive notch filter for frequency tracking
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Yann Prudat; Jerome Van Zaen; Jean-Marc Vesin
Year: 2008
Contact-free hand biometric system for real environments
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Aythami Morales; Miguel A. Ferrer; Francisco Diaz; Jesus B. Alonso; Carlos M. Travieso
Year: 2008
Supervised strategies for cracks detection in images of road pavement flexible surfaces
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Henrique Oliveira; Paulo Lobato Correia
Year: 2008
Statistical image modeling using distribution of relative phase in the complex wavelet domain
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:An Vo; Soontorn Oraintara; Truong T. Nguyen
Year: 2008
Joint source/channel decoding of scalefactors in MPEG-AAC encoded bitstreams
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Olivier Derrien; Michel Kieffer; Pierre Duhamel
Year: 2008
Analysis of error propagation due to frame losses in a distributed video coding system
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Thomas Maugey; Thomas Andre; Beatrice Pesquet-Popescu; Joumana Farah
Year: 2008
Blind source separation based on cyclic spectra: Application to biomechanical signals
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:K. Sabri; M. El Badaoui; F. Guillet; A. Belli; G. Millet
Year: 2008
Non-parallel hierarchical training for voice conversion
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Larbi Mesbahi; Vincent Barreaud; Olivier Boeffard
Year: 2008
Deterministic dictionaries for sparsity: A group representation approach
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Shamgar Gurevich; Ronny Hadani; Nir Sochen
Year: 2008
Steady-state performance of multichannel affine projection algorithms for active noise control
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Miguel Ferrer; Alberto Gonzalez; Maria de Diego; Gema Pinero
Year: 2008
Sparsity from binary hypothesis testing and application to non-parametric estimation
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Dominique Pastor; Abdourrahmane M. Atto
Year: 2008
Asynchronous detection and classification of oscillatory brain activity
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Ricardo Chavarriaga; Ferran Galan; Jose del R Millan
Year: 2008
A new Bayesian lower bound on the mean square error of estimators
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Koby Todros; Joseph Tabrikian
Year: 2008
Speech classification for enhancing single channel blind dereverberation
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Steven A. Fortune; James R. Hopgood
Year: 2008
Computer aided peripheral arterial disease diagnosis and blood pressure estimation via pulse oscillation
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:P. J. Elbischger; M. Mischitz; K. Sander
Year: 2008
On wide-sense Markov random fields and their application to improved texture interpolation
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Shira Nemirovsky; Moshe Porat
Year: 2008
Separation of a monaural audio signal into harmonic/percussive components by complementary diffusion on spectrogram
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Nobutaka Ono; Kenichi Miyamoto; Jonathan Le Roux; Hirokazu Kameoka; Shigeki Sagayama
Year: 2008
Accurate 3D face registration based on the symmetry plane analysis on nose regions
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:X. M. Tang; J. S. Chen; Y. S. Moon
Year: 2008
Productivity in collaboration-intensive knowledge work: The collaboration management imperative
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Kjetil Kristensen; Bjorn Kijl
Year: 2008
Supporting mobile workers in car production by wearable computing — Applied context detection
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Carsten Matysczok; Inaki Maurtua
Year: 2008
Exploiting research results in practice
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Daniele Tondini; Michael Lawo
Year: 2008
Performance indication system supporting transition of networked industrial service business
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Vesa Salminen; Jari Tammela
Year: 2008
Ambient intelligence technologies for industrial working environments in manufacturing SMEs
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Sebastian Scholze; Harald Sundmaeker; Uwe Kirchhoff
Year: 2008
Collaborative environment for virtual collaborative networks of ELV recycling SMEs
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Gunnar Grose Hovest; Cristina Grama; Ljubisa Urosevic; Dragan Stokic
Year: 2008
Addressing data security issues in digital collaborations with a Combined Authentication Scheme Encapsulation (CASE)
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Geoff Skinner
Year: 2008
The effects of various forms of inter-organizational trust on competitiveness
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Lucio Biggiero; Enrico Sevi
Year: 2008
Adopting synchronous collaboration services within multidisciplinary organisations
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Marek Suchocki
Year: 2008
Strengthening the collaboration among Eastern European SME clusters by implementing an open-source based tool and support platform
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Ali Imtiaz; Oliver Budde; Jannicke Baalsrud Hauge
Year: 2008
Sustainability in food networks — The challenge of concurrent multi-dimensionality
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Melanie Fritz; Gerhard Schiefer
Year: 2008
Innovation in the Dutch food processing industry
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Frances T. J. M. Fortuin; S. W. F. Onno Omta
Year: 2008
Product — Service transition: Research questions
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Ahmad Beltagui; Johann C. K. H. Riedel; Kulwant S. Pawar
Year: 2008
A framework for an integrated management of After Sales service
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Giuditta Pezzotta; Sergio Cavalieri; Paolo Gaiardelli
Year: 2008
Integrated engineering: The case of sustainable development of packaging in the food industry
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Darli Rodrigues Vieira; Helio Alves da Silva; Amaro dos Santos
Year: 2008
Enhancing co-design reliability by inter-organizational learning and loose coupling concepts
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Colin Lalouette
Year: 2008
The CoSpaces training system
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Pedro Malo; Joao Sarraipa; Ricardo Jardim-Goncalves; Adolfo Steiger-Garcao
Year: 2008
Digital cooperative studio 07-08
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Sylvain Kubicki; Jean-Claude Bignon; Catherine Elsen; Jerome Lotz; Gilles Halin; Pierre Leclercq
Year: 2008
University-industry collaboration in engineering systems research: The case of cost modeling
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Frank Field; Randolph Kirchain; Rich Roth
Year: 2008
Industry-university co-operation in the product and process development: Experiences with Portuguese SMEs
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Antonio Mourao; Antonio Goncalves-Coelho
Year: 2008
Concurrent engineering — A case study involving university and industry
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Elsa Henriques; Paulo Pecas; Arlindo Silva; Ines Ribeiro
Year: 2008
A quantitative competence model for e-recruiting and team building in safety critical domains
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Franz Nirschl; Manfred Fuchs; Jurgen Dorn
Year: 2008
A virtual and augmented reality approach to collaborative product design and demonstration
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Konstantinos Smparounis; Dimitris Mavrikios; Menelaos Pappas; Vagelis Xanthakis; Giovanni Paolo Vigano; Katharina Pentenrieder
Year: 2008
Innovative VR environment for factory and process planning: DiFac
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Carmen Constantinescu; Mark Durr; Marco Sacco
Year: 2008
Approach and development of an innovative tool for integration of immersive devices in virtual manufacturing environments: Immersive Integrator
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Mark Durr; Hanno Eichelberger; Carmen Constantinescu
Year: 2008
The contributions of presence and ergonomics to the digital factory
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Claudia Redaelli; Matteo Santopietro; Marco Sacco; Glyn Lawson; Mirabelle D'Cruz
Year: 2008
Collaborative virtual engineering for SMEs: Technical architecture
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Jerzy Dryndos; Abdul Samad Sami Kazi; Dirk Langenberg; Herrmann Loh; Rainer Stark
Year: 2008
Collaborative virtual engineering for SMEs: Technical architecture
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Jerzy Dryndos; Abdul Samad Sami Kazi; Dirk Langenberg; Herrmann Loh; Rainer Stark
Year: 2008
Collaborative virtual engineering for SMEs: Technical architecture
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Jerzy Dryndos; Abdul Samad Sami Kazi; Dirk Langenberg; Herrmann Loh; Rainer Stark
Year: 2008
From machine drawings to model-based collaborative virtual engineering
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Abdul Samad Sami Kazi; Tapio Ristimaki; Osman Balkan; Mehmet Kurumluoglu; Jochen Eichert; Judith Finger
Year: 2008
How to drive innovation in collaborative engineering work and working environments — A living lab approach
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Hermann Loeh
Year: 2008
Towards an ontology-based approach for formalisation of expert knowledge in conformity checking model in construction
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Anastasiya Yurchyshyna; Catherine Faron-Zucker; Nhan Le Thanh; Alain Zarli
Year: 2008
Collaborative environment for intelligent monitoring in manufacturing industry
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Ana Correia; Dragan Stokic; Rui Neves-Silva; Ana Rita Campos; Jon Agirre
Year: 2008
Knowledge-based activities in industry: A decision-support approach
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Rui Neves-Silva; Maria Marques; Ana Campos
Year: 2008
A contribution for the development of performance indicators of the organization intangible assets
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:D. Claudelino Martins; Osmar Possamai; Ricardo Goncalves; Celson Lima
Year: 2008
Remarks about the use of symbol indicators for logistics and manufacturing process evaluation
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Fiorenzo Franceschini; Maurizio Galetto
Year: 2008
Understanding concerns with ontologies
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Crenguta Bogdan; Luca Dan Serbanati; Dana Shishmanian
Year: 2008
Defining performance indicators for industrial and logistic cross-enterprise processes: Theoretical and empirical considerations
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Dana Shishmanian; Crenguta Bogdan
Year: 2008
Performance indication system supporting transition of networked industrial service business
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Vesa Salminen; Jari Tammela
Year: 2008
The AKM approach to product family design
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Frank Lillehagen; Dag R. Karlsen; Havard D. Jorgensen
Year: 2008
IFC and PMO for estimating building environmental effects
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Pekka Siltanen; Sirje Vares; Markus Ylikerala; Abdul Samad Sami Kazi
Year: 2008
E-traceability for ISO STEP CAD/CAM/CNC supply chains
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Julio Garrido Campos; Ricardo Marin Martin; Juan Saez Lopez; Jose Ignacio Armesto Quiroga
Year: 2008
Seamless automation engineering with AutomationML®
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Lorenz Hundt; Rainer Drath; Arndt Luder; Jorn Peschke
Year: 2008
Structure and functionality of a PABADIS'PROMISE agent system
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Michael Heinze; Arndt Luder; Wilhelm Gantner; Hermann Kuhnle; Jorn Peschke
Year: 2008
Development of a software platform for collaborative MCAD based shoe design
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Monica Carfagni; Lapo Governi; Yary Volpe
Year: 2008
Ontology mining for platform extraction in product development
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Nitesh Khilwani; J. A. Harding; M. K. Tiwari
Year: 2008
Product development guided by value analysis through collaborative R&D
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Carlos Bento; Paulo Pecas; Elsa Henriques; Arlindo Silva
Year: 2008
Enabling innovative concurrent engineering and collaborative manufacturing in extended enterprises
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Antonio Estruch; Carlos Vila; Hector R. Siller; Fernando Romero; Jose Vicente Abellan
Year: 2008
Towards a facilitation tool for steering design processes: A case study in architecture
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Ahmed Laaroussi; Alain Zarli
Year: 2008
Collaborative engineering issues and challenges: Insights from a reconstruction project case
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Burak Sari; Bernhard R. Katzy
Year: 2008
Design scoreboard: Capturing design spending in firms
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Ahmad Beltagui; Johann C. K. H. Riedel; Kulwant S. Pawar; James Moultrie; Cecilia Malvido de Rodriguez; Finbarr Livesey
Year: 2008
Enterprise interoperability value proposition: A practical case analysis
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Dorina Kabakchieva; Kamelia Stefanova; Roumen Nikolov
Year: 2008
The semantic enterprise — Bringing meaning to business processes
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Jasmin Franz; Andreas Gaag; Mohammad Abuosba
Year: 2008
Living labs: New ways to enhance innovativeness in public sector services
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Suvi Konsti-Laakso; Lea Hennala; Tuomo Uotila
Year: 2008
New business opportunities with ubiquitous computing: Finnish Ubiquitous Computing Cluster programme
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Karen Thorburn; Juha Miettinen; Markku Paukkunen
Year: 2008
City of Oulu as an innovative service platform
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Olli Lukkari; Janne Mustonen; Tuomo Tuikka
Year: 2008
Tourism — Led development of Himos in Jämsä region
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Hannu Pelkonen
Year: 2008
Anthropocentric approach in the design of Virtual Environments for SMEs
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Emilie Loup-Escande; Simon Richir; Herve Christofol
Year: 2008
Living labs fostering open innovation and rural development: Methodology and results
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Javier Garcia Guzman; Hans Schaffers; Vilmos Bilicki; Christian Merz; Monica Valenzuela
Year: 2008
Creation of the first Living Lab in Poland: How geographical information can support governance of outlying regions
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Adam Turowiec; Anna Zajac
Year: 2008
The QFP packet processing chip set
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Will Eatherton; Don Steiss; James Markevitch
Year: 2008
Multitasking workload scheduling on flexible-core chip multiprocessors
Publisher: Association for Computing Machinery (ACM)
Authors:Divya P. Gulati; Changkyu Kim; Simha Sethumadhavan; Stephen W. Keckler; Doug Burger
Year: 2008
A tuning framework for software-managed memory hierarchies
Publisher: Association for Computing Machinery (ACM)
Authors:Manman Ren; Ji Young Park; Mike Houston; Alex Aiken; William J. Dally
Year: 2008
Design optimization of front and rear aerodynamic wings of a high performance race car with modified airfoil structure
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Vivek Muralidharan; Abhijith Balakrishnan; Suresh Y. Kumar
Year: 2015
Review of accuracy improvement techniques in high speed 5 axis machining
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Sachin M. Shinde; Kiran S. Bhole
Year: 2015
Design & development of microcontroller based programmable ramp generator for AC-DC converter for simulating decay power transient in experimental facility for nuclear power plants
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Gaurava Deep Srivastava; R.D. Kulkarni
Year: 2015
Improving the performance of assembly line: Review with case study
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Arun.B. Rane; D.S.S. Sudhakar; Vivek k. Sunnapwar; Santosh Rane
Year: 2015
3D polymer microneedle array: Fabrication and analysis
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Jitesh J. Shewale; Kiran S. Bhole
Year: 2015
Enhancement of online web recommendation system using a hybrid clustering and pattern matching approach
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Hiral Y. Modi; Meera Narvekar
Year: 2015
Fabrication of microchannel using sequential micromilling and micromoulding
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Amol Jayram Ghude; Kiran S. Bhole
Year: 2015
System identification and PID implementation on Double Flexural Manipulator
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Suhas P. Deshmukh; Hrishikesh Zambare; Kavidas Mate; Mahesh S. Shewale; Zeba Khan
Year: 2015
FEA analysis and experimental investigation of building blocks for flexural mechanism
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Rachel Patil; Suhas Deshmukh; Y.P. Reddy; Kavidas Mate
Year: 2015
Optimal reactive power dispatch by furnishing UPFC using multi-objective hybrid GAPSO approach for transmission loss minimisation and voltage stability
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Shilpa S. Shrawane; Manoj Diagavane; Narendra Bawane
Year: 2015
Level shifted SPWM of a seven level cascaded multilevel inverter for STATCOM applications
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Suruchi Agarwal; S. R. Deore
Year: 2015
Review of Maharashtra's regulatory framework in electricity distribution CAPEX regulation
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Raviraj V. Kadam; Siddharth B. Rokade; Pravin Y. Ganvir
Year: 2015
Modeling and Verifying the Ballooning in Xen with CSP
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Luyao Wang; Fengwei Sui; Yanhong Huang; Huibiao Zhu
Year: 2015
Formal Foundations for Hierarchical Safety Cases
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Ewen Denney; Ganesh Pai; Iain Whiteside
Year: 2015
Extending Contract theory with Safety Integrity Levels
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Jonas Westman; Mattias Nyberg
Year: 2015
Adaptive Failure Prediction for Computer Systems: A Framework and a Case Study
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Ivano Irrera; Marco Vieira; Joao Duraes
Year: 2015
Introducing Meta-Requirements for Describing System of Systems
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Andrea Ceccarelli; Marco Mori; Paolo Lollini; Andrea Bondavalli
Year: 2015
Executable Models to Support Automated Software FMEA
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Valentina Bonfiglio; Leonardo Montecchi; Francesco Rossi; Paolo Lollini; Andras Pataricza; Andrea Bondavalli
Year: 2015
A Diversity-Based Approach for Communication Integrity in Critical Embedded Systems
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Amira Zammali; Agnan de Bonneval; Yves Crouzet
Year: 2015
There is a Will, There is a Way: A New Mechanism for Traffic Control Based on VTL and VANET
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Jingmin Shi; Chao Peng; Qin Zhu; Pengfei Duan; Yu Bao; Mengjun Xie
Year: 2015
Applying Safety Case Pattern to Generate Assurance Cases for Safety-Critical Systems
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Chung-Ling Lin; Wuwei Shen
Year: 2015
HCPN Modeling for ERTMS Requirements Specification
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Zakaryae Boudi; El Miloudi El Koursi; Simon Collart-Dutilleul
Year: 2015
The Need for a Confidence View of CPS Support Environments (Fast Abstract)
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Fredrik Asplund; Martin Torngren; Richard Hawkins; John A. McDermid
Year: 2015
Using Pairwise Testing to Verify Automatically-Generated Formal Specifications
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Salamah Salamah; Omar Ochoa; Yadira Jacquez
Year: 2015
Using Bayesian statistics and Gabor Wavelets for recognition of human faces
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Mukundhan Srinivasan
Year: 2015
Motion-based segmentation of chest and abdomen region of neonates from videos
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Arun Venkitaraman; Vishnu Vardhan Makkapati
Year: 2015
Building facade detection via plane support points clustering
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:V. Sai Sindhu; Abhishek Kumar Tripathi; Shanti Swarup
Year: 2015
Continuous Authentication in a real world settings
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Soumik Mondal; Patrick Bours
Year: 2015
A scalable model for knowledge sharing based supervised learning using AdaBoost
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Avisek Lahiri; Prabir Kumar Biswas
Year: 2015
Slap fingerprint segmentation using symmetric filters based quality
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Puneet Gupta; Phalguni Gupta
Year: 2015
Recommender system algorithms: A comparative analysis based on monotonicity
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Tadiparthi V. R. Himabindu; Vineet Padmanabhan; Venkateswara Rao Kagita; Arun K. Pujari
Year: 2015
Human action recognition based on motion capture information using fuzzy convolution neural networks
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Earnest Paul Ijjina; C. Krishna Mohan
Year: 2015
Effect of cirrus cloud on normalized difference Vegetation Index (NDVI) and Aerosol Free Vegetation Index (AFRI): A study based on LANDSAT 8 images
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:K. Rajitha; M. M. Prakash Mohan; Murari R. R. Varma
Year: 2015
Computation of tortuosity of two dimensional vessels
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Vishnu Vardhan Makkapati; Vishnu Vardhan Chetlur Ravi
Year: 2015
Handwritten words recognition for legal amounts of bank cheques in English script
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Sneha Singh; Tharun Kariveda; Jija Das Gupta; Kallol Bhattacharya
Year: 2015
Tutorial T2: Validation and Debug of Security and Trust Issues in Embedded Systems
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Prabhat Mishra; Swarup Bhunia; Srivaths Ravi
Year: 2015
A multi-step approach for RSSi-based distance estimation using smartphones
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:T. I. Chowdhury; M. M. Rahman; Sadre-Ala Parvez; A. K. M. M. Alam; Abul Basher; Abusayeed Alam; Shahriar Rizwan
Year: 2015
Test implementation of a sensor device for measuring soil macronutrients
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Tamal Adhikary; Amit Kumar Das; Md Abdur Razzaque; Muhammad Enamul Hoque Chowdhury; Shohana Parvin
Year: 2015
User identification through usage analysis of electronic devices
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Shamir Ahmed; A. S. M. Rizvi; Rifat Sabbir Mansur; Md Rafatul Amin; A. B. M. Alim Al Islam
Year: 2015
Sign of life: A system for escalating post-disaster rescue missions in ready-made garment factories
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Taslim Arefin Khan; Mainuddin Ahmad Jonas; S. M. Hasanur Rashid; Mushfequr Rahman; Mohammad Saifur Rahman; A. B. M. Alim Al Islam
Year: 2015
Towards empirical study based mathematical modeling for throughput of MANETs
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Novia Nurain; Moin Mostakim; A. B. M. Alim Al Islam
Year: 2015
A gm/ID based design of high PSR low dropout regulator for SoC applications
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Gundabathina Prakash; K. J. Dhanaraj
Year: 2015
Towards the performance measurements of private cloud
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Akshay R. Rele; Sudhir N. Dhage
Year: 2015
Performance and area scaling of 6T SRAM using SOI MOSFET at 32nm node
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Rajni Sharma; S. S. Chopade
Year: 2015
Performance comparison of different operating systems in the private cloud with KVM hypervisor using SIGAR framework
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:P. Vijaya Vardhan Reddy; Lakshmi Rajamani
Year: 2015
Fraud detection in health insurance using data mining techniques
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Vipula Rawte; G. Anuradha
Year: 2015
Applying human computer interaction to individual security using mobile application
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Shraddha Save; Mansi Gala; Surabhi Patil; Dhananjay R. Kalbande
Year: 2015
Double Current Controlled Differential Voltage Dual Output Current Conveyor and its applications
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:R V Yenkar; R S Pande; S S Limaye
Year: 2015
Congestion aware load balancing for multiradio Wireless Mesh Network
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Kruti N. Kapadia; Dayanand D. Ambawade
Year: 2015
Raising interest in STEM education: A research-based learning framework
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Daniel Christe; Arpit Shah; Jay Bhatt; Linda Powell; Antonios Kontsos
Year: 2015
Characterizing and enhancing global memory data coalescing on GPUs
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Naznin Fauzia; Louis-Noel Pouchet; P. Sadayappan
Year: 2015
Data provenance tracking for concurrent programs
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Brandon Lucia; Luis Ceze
Year: 2015
Checking correctness of code generator architecture specifications
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Niranjan Hasabnis; Rui Qiao; R. Sekar
Year: 2015
Snapshot-based loading-time acceleration for web applications
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:JinSeok Oh; Soo-Mook Moon
Year: 2015
PSLP: Padded SLP automatic vectorization
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Vasileios Porpodas; Alberto Magni; Timothy M. Jones
Year: 2015
HELIX-UP: Relaxing program semantics to unleash parallelization
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Simone Campanoni; Glenn Holloway; Gu-Yeon Wei; David Brooks
Year: 2015
The long path from MEMS resonators to timing products
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:E. Ng; Y. Yang; V. A. Hong; C. H. Ahn; D. B. Heinz; I. Flader; Y. Chen; C. L. M. Everhart; B. Kim; R. Melamud; R. N. Candler; M. A. Hopcroft; J. C. Salvia; S. Yoneoka; A. B. Graham; M. Agarwal; M. W. Messana; K. L. Chen; H. K. Lee; S. Wang; G. Bahl; V. Qu; C. F. Chiang; T. W. Kenny; A. Partridge; M. Lutz; G. Yama; G. J. O'Brien
Year: 2015
Structure-based superhydrophobicity for serum droplets
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Tingyi Liu; Chang-Jin Kim
Year: 2015
Synthetic microfluidic paper
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Jonas Hansson; Hiroki Yasuga; Tommy Haraldsson; Wouter van der Wijngaart
Year: 2015
Self-lifting artificial insect wings via electrostatic flapping actuators
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Xiaojun Yan; Mingjing Qi; Liwei Lin
Year: 2015
A 7ppm, 6°/hr frequency-output MEMS gyroscope
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Igor I. Izyumin; Mitchell H. Kline; Yu-Ching Yeh; Burak Eminoglu; Chae Hyuck Ahn; Vu A. Hong; Yushi Yang; Eldwin J. Ng; Thomas W. Kenny; Bernhard E. Boser
Year: 2015
Large full scale, linearity and cross-axis rejection in low-power 3-axis gyroscopes based on nanoscale piezoresistors
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Stefano Dellea; Federico Giacci; Antonio Longoni; Patrice Rey; Audrey Berthelot; Giacomo Langfelder
Year: 2015
The electromechanical response of a self-excited MEMS Franklin oscillator
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Shai Shmulevich; Inbar Hotzen; David Elata
Year: 2015
A nanomachined tunable oscillator controlled by electrostatic and optical force
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:J. G. Huang; B. Dong; H. Cai; Y. D. Gu; J. H. Wu; T. N. Chen; Z. C. Yang; Y. F. Jin; Y. L. Hao; D. L. Kwong; A. Q. Liu
Year: 2015
NEMS optical cross connect (OXC) driven by opticl force
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:H. Cai; J. X. Lin; J. H. Wu; B. Dong; Y. D. Gu; Z. C. Yang; Y. F. Jin; Y. L. Hao; D. L. Kwong; A. Q. Liu
Year: 2015
Implementation of nanoporous anodic aluminum oxide layer with different porosities for interferometric RGB color pixels as handheld display application
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:P.-H Lo; G.-L Luo; W. Fang
Year: 2015
Hard mask free DRIE of crystalline Si nanobarrel with 6.7nm wall thickness and 50∶1 aspect ratio
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Peng Liu; Fang Yang; Wei Wang; Wei Wang; Kui Luo; Ying Wang; Dacheng Zhang
Year: 2015
Self-healing metal wire using an electric field trapping of gold nanoparticles for flexible devices
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Tomoya Koshi; Eiji Iwase
Year: 2015
Controlled fabrication of nanoscale gaps using stiction
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Farnaz Niroui; Ellen M. Sletten; Parag B. Deotare; Annie I. Wang; Timothy M. Swager; Jeffrey H. Lang; Vladimir Bulovic
Year: 2015
Triboelectrification based active sensor for polymer distinguishing
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:B. Meng; X. L. Cheng; M. D. Han; H. T. Chen; F. Y. Zhu; H. X. Zhang
Year: 2015
Flexible triboelectric and piezoelectric coupling nanogenerator based on electrospinning P(VDF-TRFE) nanowires
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Xingzhao Wang; Bin Yang; Jingquan Liu; Qing He; Honglei Guo; Chunsheng Yang; Xiang Chen
Year: 2015
Solidified ionic liquid for high power-output vibrational energy harvesters
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:S. Yamada; H. Mitsuya; S. Ono; K. Miwa; H. Fujita
Year: 2015
Ferrofluid liquid spring for vibration energy harvesting
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Yufeng Wang; Qian Zhang; Lurui Zhao; Eun Sok Kim
Year: 2015
An electrostatic energy harvester exploiting variable-area water electrode by respiration
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Min-Ho Seo; Dong-Hoon Choi; Chang-Hoon Han; Jae-Young Yoo; Jun-Bo Yoon
Year: 2015
When capacitive transduction meets the thermomechanical limit: Towards femto-newton force sensors at very high frequency
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:S. Houmadi; B. Legrand; J. P. Salvetat; B. Walter; E. Mairiaux; J. P. Aime; D. Ducatteau; P. Merzeau; L. Buisson; J. Elezgaray; D. Theron; M. Faucher
Year: 2015
A viscometer based on vibration of droplets on a piezoresistive cantilever array
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Nguyen Thanh-Vinh; Kiyoshi Matsumoto; Isao Shimoyama
Year: 2015
Development of microfluidic resonators via silicon-on-nothing technique
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Joohyun Kim; Jungchul Lee
Year: 2015
A microfabricated, flow driven mill for the mechanical lysis of algae
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Justin Millis; Laurie Connell; Scott D. Collins; Rosemary L. Smith
Year: 2015
Membrane-based chemomechanical transducer for the detection of aptamer-protein binding
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Jun-Kyu Choi; Junghoon Lee
Year: 2015
A novel configuration of tactile sensor to acquire the correlation between surface roughness and frictional force
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Ryogo Kozai; Kyohei Terao; Takaaki Suzuki; Fusao Shimokawa; Hidekuni Takao
Year: 2015
A tactile sensor with the reference plane for detection abilities of frictional force and human body hardness aimed to medical applications
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Yusaku Maeda; Kyohei Terao; Takaaki Suzuki; Fusao Shimokawa; Hidekuni Takao
Year: 2015
6-Axis force/torque sensor for spike pins of sports shoes
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:H. Ishido; H. Takahashi; A. Nakai; T. Takahata; K. Matsumoto; I. Shimoyama
Year: 2015
A convenient method to fabricate multilayer interconnections for microdevices
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Jia Li; Supin Chen; Chang-Jin Kim
Year: 2015
Electroplated stencil reinforced with arch structures for printing fine and long conductive paste
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Pi-Hsun Chen; Che-Hsin Lin
Year: 2015
Integration of distributed Ge islands onto Si wafers by adhesive wafer bonding and low-temperature Ge exfoliation
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:F. Forsberg; N. Roxhed; C. Colinge; G. Stemme; F. Niklaus
Year: 2015
NEMS by multilayer sidewall transfer lithography
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Dixi Liu; Richard R. A. Syms; Munir M. Ahmad
Year: 2015
New scalable microfabrication method for surface ion traps and experimental results with trapped ions
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:S. Hong; M. Lee; H. Cheon; J. Ahn; M. Kim; T. Kim; D. D. Cho
Year: 2015
Post-release stress-engineering of surface-micromachined MEMS structures using evaporated Chromium and in-situ fabricated reconfigurable shadow masks
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Ratul Majumdar; Vahid Foroutan; Igor Paprotny
Year: 2015
Self-assembly of microcomponents using the entropic effect
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:U. Okabe; T. Okano; H. Suzuki
Year: 2015
Three-dimensional integration of suspended single-crystalline silicon MEMS arrays with CMOS
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Zhen Song; Yuxin Du; Miao Liu; Shujie Yang; Dong Wu; Zheyao Wang
Year: 2015
Wafer-scale integration of carbon nanotube transistors as process monitors for sensing applications
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Kiran Chikkadi; Wei Liu; Cosmin Roman; Miroslav Haluska; Christofer Hierold
Year: 2015
Fabrication of a monolithic carbon mold for producing a mixed-scale PDMS channel network using a single molding process
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Yunjeong Lee; Yeongjin Lim; Heungjoo Shin
Year: 2015
Fabrication of patternable nanopillars for microfluidic SERS devices based on gap-induced uneven etching
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Y. Wang; L. C. Tang; H. Y. Mao; C. Lei; W. Ou; J. J. Xiong; Y. Ou; A. J. Ming; D. Li; D. P. Chen
Year: 2015
High-topography surface functionalization based on parylene-C peel-off for patterned cell growth
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Florian Larramendy; Daniela Serien; Shotaro Yoshida; Laurent Jalabert; Shoji Takeuchi; Oliver Paul
Year: 2015
Magnesium-embedded live cell filter for CTC isolation
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Yang Liu; Jungwook Park; Tong Xu; Yucheng Xu; Jay Han-Chieh Chang; Dongyang Kang; Xiaoxiao Zhang; Amir Goldkorn; Yu-Chong Tai
Year: 2015
Micro fluidic chamber with thin Si windows for observation of biological samples in vacuum
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Hideki Hayashi; Masaya Toda; Takahito Ono
Year: 2015
Rapid, low cost fabrication of circular cross-section microchannels by thermal air molding
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Thanh-Qua Nguyen; Woo-Tae Park
Year: 2015
3D morphology reconstruction of high aspect ratio MEMS structure by using autofluorescence of Parylene C
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Lingqian Zhang; Yaoping Liu; Fang Yang; Wei Wang; Dacheng Zhang; Zhihong Li
Year: 2015
Anomalous resistance change of ultrastrained individual MWCNT using MEMS-based strain engineering
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:K. Yamauchi; T. Kuno; K. Sugano; Y. Isono
Year: 2015
Fabrication of tetrapod-shaped Al/Ni microparticles with tunable self-propagating exothermic function
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Keita Inoue; Toshihisa Fujito; Kazuhiro Fujita; Yoshikazu Kuroda; Katsuhisa Takane; Takahiro Namazu
Year: 2015
High-productive fabrication method of flexible piezoelectric substrate
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Hirotaka Hida; Shun Yagami; Akira Sakurai; Isaku Kanno
Year: 2015


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