Optimization of Peano-Gosper fractile arrays using genetic algorithms to reduce grating lobes during scanning
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:J.N. Bogard; D.H. Werner
Year: 2005
The autopolyploidy enhanced evolution of large-N fractal-random arrays
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:J.S. Petko; D.H. Werner
Year: 2005
Generation of raw stepped-frequency waveform echoes using RCS chamber measurements
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:J.E. Luminati; T.B. Hale; M.A. Temple; M.J. Harvrilla; M.E. Oxley
Year: 2005
A microstrip-fed modified printed bow-tie antenna for simultaneous operation in the C and X-bands
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:A.A. Eldek; A.Z. Elsherbeni; C.E. Smith
Year: 2005
A smoothing Rao-Blackwellized particle filter for tracking a highly-maneuverable target
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:H. Kamel; W. Badawy
Year: 2005
Analytical model for optical burst switching (OBS) networks with linear transmission impairments
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:I. Karamitsos
Year: 2005
Analysis of optical performance monitoring methods based on Q factor and bit error rate estimation
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:C.B. Yahya
Year: 2005
Reference region group mobility model for ad hoc networks
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:J.M. Ng; Yan Zhang
Year: 2005
Optimizing the beacon exchange rate for proactive autonomic configuration in ubiquitous MANETs
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:M.M. Iqbal; I. Gondal; L. Dooley
Year: 2005
The H-ternary line code power spectral density modelling investigation
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:A. Glass; N. Abdulaziz; E. Bastaki
Year: 2005
BER reduction in asynchronous DS-CDMA using blind VSLMS algorithm
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:H.K. Bizaki; M.H. Kahaei
Year: 2005
Variable yield for adaptive EY-NPMA
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:G. Dimitriadis; F.-N. Pavlidou
Year: 2005
Integrating reliability into distribution planning
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:M.W. Marshall; D.M. Farmer
Year: 2005
GIS and joint use management - a productive combination
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:J.L. McCoy
Year: 2005
Reactive power compensation for voltage control at resistance welders
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:T. Baldwin; T. Hogans; S. Henry; F. Renovich; P. Latkovic
Year: 2005
ARC flash hazard: the simplified model of ARC current
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:G. Parise; L. Martirano
Year: 2005
The lightning protection of a complex of structures (LPCS)
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:G. Parise; L. Martirano
Year: 2005
Analytical modelling of hvdc transmission system converter using matlab/simulink
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:R. Kumar; T. Leibfried
Year: 2005
A programmable language for clearing procedures
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:G. Parise
Year: 2005
Dalziel revisited: a study of the electrical parameters affecting ventricular fibrillation
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:R.E. Nabours
Year: 2005
Protective bonding conductors: an IEC point of view.
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:M. Mitolo
Year: 2005
EPEAT: Electronic Product Environmental Tool - development of an environmental rating system of electronic products for governmental/institutional procurement
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:J. Katz; W. Rifer; A.R. Wilson
Year: 2005
Results from the 2004 iNEMI Environmentally Conscious Electronics (ECE) roadmap
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:M. Newton; J. Johnson; R.C. Pfahl, Jr.
Year: 2005
Green MST design from a designer's perspective: how to base decisions on environmental issues
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:K. Schischke; A. Middendorf; H. Reichl; H. Griese; M. Kasper; K. Ong
Year: 2005
Cycle evaluation of combined heat and power alternatives in data centers
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:A. Shah; N. Krishnan
Year: 2005
Analyzing and modeling of uncertainty factors influencing product recyclability
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Qi Yunhui; Liu Guangfu; Liu Zhifeng; Wang Shuwang
Year: 2005
Directly addressing uncertainty in ESH evaluation
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Yue Chen; G.J. McRae; K.K. Gleason
Year: 2005
Information architecture for electronics recycling National Coordinating Entity
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:J. Linnell; J. Tucker; T. Linger; S. Smith; W. Alcorn
Year: 2005
Competitors together in PRO (Producers Responsibility Organisation) - a case study of the PRO-system in Norway
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:B. Renningen
Year: 2005
Exploring options for individual producer responsibility for waste from private households for the Waste Electrical and Electronic Equipment Directive
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:L. Hicks
Year: 2005
Sony's Green Partner program
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:K. Hirai; J. Mabee; D. Smith; M. Small
Year: 2005
Business approaches to environmental policies
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:J.M. Dietrich
Year: 2005
Networked RFID systems in product recovery management
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:A.G. Kulkarni; A.K.N. Parlikad; D.C. McFarlane; M. Harrison
Year: 2005
Mixing entropy and product recycling
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:T.G. Gutowski; J.B. Dahmus
Year: 2005
Packaging in the IT environment: competing challenges in the design of packaging for electronic products
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:J. Horbal; M. Schaffer
Year: 2005
Life-cycle impacts of lead and lead-free solder used in wave soldering of electronics
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:M.L. Socolof; J.R. Geibig
Year: 2005
Case study for high volume lead-free wave soldering process with environmental benefits
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:I. Baylakoglu; S. Hamarat; H. Gokmen; E. Meric
Year: 2005
The fundamental study on the reutilization of electronic scrap by passive pulsed air classifiers
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Chenlong Duan; Yaqun He; Yuemin Zhao; Xuefeng Wen; Haifeng Wang; Shulei Song
Year: 2005
Design for active disassembly (DfAD): an outline for future research
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:B. Willems; W. Dewulf; J. Duflou
Year: 2005
Opportunities and recommendations for reducing the energy consumption of consumer electronics products
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:N. Horowitz; C. Calwell; S. Foster
Year: 2005
New microprocessor features for lower power and increased performance: doing "Moore's" with less
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:D. Sadowy
Year: 2005
80 plus: a strategy for reducing the inherent environmental impacts of computers
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:C. Calwell; P. Ostendorp
Year: 2005
Residential computer usage patterns in Japan and associated life cycle energy use
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:E. Williams; T. Hatanaka
Year: 2005
Information and energy substitution in the digital economy: an empirical investigation using the input-output approach for Texas
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Wei Tu; D.Z. Sui
Year: 2005
Case study: multi life cycle center for electronic products
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:R. Knoth; B. Kopacek; P. Kopacek
Year: 2005
Evaluation of product reusability based on a technical and economic model: a case study of televisions
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:M. Anityasari; H. Bao; H. Kaebernick
Year: 2005
A framework for environmental impact assessment tools: comparison validation and application using case study of electronic products
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:R. Kulkarni; H.C. Zhang; Jianzhi Li; Junning Sun
Year: 2005
Environmental indicators for ICT products - a practical approach based on four steps
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:N. Warburg; A. Braune; P. Eyerer; C. Herrmann; N. Gallon
Year: 2005
E-waste and the consumer: improving options to reduce, reuse and recycle
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:C.N. Cairns
Year: 2005
Effective assessment of Japanese recycling law for electrical home appliances: four years after the full enforcement of the law
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:T. Tasaki; A. Terazono; Y. Moriguchi
Year: 2005
Analysis of an adaptive fuzzy system for disassembly process planning
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:M. Turowski; Ying Tang; M. Morgan
Year: 2005
Intelligent disassembly sequence planning for EOL recycling based on hierarchical fuzzy cognitive map
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Pan Xiaoyong; Duan Guanghong; Xiang Dong; Mou Peng
Year: 2005
Distributed Computation in the Physical World
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:D.E. Culler
Year: 2005
Exploring the Energy-Latency Trade-Off for Broadcasts in Energy-Saving Sensor Networks
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:M.J. Miller; C. Sengul; Indranil Gupta
Year: 2005
The Impossibility of Boosting Distributed Service Resilience
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:P. Attie; R. Guerraoui; P. Kouznetsov; N. Lynch; S. Rajsbaum
Year: 2005
Systems Support for Pervasive Query Processing
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Wenwei Xue; Qiong Luo; L.M. Ni
Year: 2005
Application-Driven Coordination-Free Distributed Checkpointing
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:A. Agbaria; W.H. Sanders
Year: 2005
Efficient Power Management Based on Application Timing Semantics for Wireless Sensor Networks
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:O. Chipara; Chenyang Lu; G.-C. Roman
Year: 2005
An In-Depth, Analytical Study of Sampling Techniques for Self-Similar Internet Traffic
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Guanghui He; J.C. Hou
Year: 2005
Characterizing and Predicting TCP Throughput on the Wide Area Network
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Dong Lu; Yi Qiao; P.A. Dinda; F.E. Bustamante
Year: 2005
A Unified Approach to Routing, Covering and Merging in Publish/Subscribe Systems Based on Modified Binary Decision Diagrams
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Guoli Li; Shuang Hou; H.-A. Jacobsen
Year: 2005
Supporting Live Development of SOAP and CORBA Servers
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:S.L. Pallemulle; K.J. Goldman; B.E. Morgan
Year: 2005
Resilient Capacity-Aware Multicast Based on Overlay Networks
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Zhan Zhang; Shigang Chen; Yibei Ling; R. Chow
Year: 2005
Detecting Malicious Beacon Nodes for Secure Location Discovery in Wireless Sensor Networks
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Donggang Liu; Peng Ning; Wenliang Du
Year: 2005
Resource-Aware Distributed Stream Management Using Dynamic Overlays
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:V. Kumar; B.F. Cooper; Zhongtang Cai; G. Eisenhauer; K. Schwan
Year: 2005
State checksum and its role in system stabilization
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:C.-T. Huang; M.G. Gouda
Year: 2005
An optimal snap-stabilizing multi-wave algorithm
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:D. Bein; A.K. Datta; M.H. Karaata; S. Zaman
Year: 2005
Reconciling the theory and practice of (un)reliable wireless broadcast
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:G. Chockler; M. Demirbas; S. Gilbert; N. Lynch; C. Newport; T. Nolte
Year: 2005
A new TCP congestion control method considering adaptability over satellite Internet
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:H. Obata; S. Takeuchi; K. Ishida
Year: 2005
Active timing-based correlation of perturbed traffic flows with chaff packets
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Pai Peng; Peng Ning; D.S. Reeves; Xinyuan Wang
Year: 2005
Specifying information-flow controls
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:H. Chivers; J. Jacob
Year: 2005
A simple framework for distributed forensics
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Y. Tang; T.E. Daniels
Year: 2005
Service description for pervasive service discovery
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:M.S. Thompson; S.F. Midkiff
Year: 2005
Using a fairness monitoring service to improve load-balancing in DSR
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:H. Miranda; L. Rodrigues
Year: 2005
A user-driven adaptation strategy for mobile video streaming applications
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:D. Cotroneo; G. Paolillo; C. Pirro; S. Russo
Year: 2005
Framework and rule-based language for facilitating context-aware computing using information appliances
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:K. Nishigaki; K. Yasumoto; N. Shibata; M. Ito; T. Higashino
Year: 2005
CHR: a distributed hash table for wireless ad hoc networks
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:F. Araujo; L. Rodrigues; J. Kaiser; C. Liu; C. Mitidieri
Year: 2005
A self configurable topology-aware network for smart materials
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:T. Yanagihara; H. Sakakibara; R. Ohsawa; M. Ideuchi; N. Kohtake; I. Masayuki; K. Takashio; H. Tokuda
Year: 2005
High immersive system aiming at the collaboration working over the Japan Gigabit Network II (JGNII)
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:T. Ishida; A. Miyakawa; Y. Shibata
Year: 2005
Optimized geographical routing protocol for inter-vehicle communications
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:M. Durresi; A. Durresi; L. Barolli
Year: 2005
Control theory optimization of MECN in satellite networks
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:A. Durresi; M. Sridharan; S. Chellappan; R. Jain; H. Ozbai; L. Barolli
Year: 2005
PChord: improvement on chord to achieve better routing efficiency by exploiting proximity
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Feng Hong; Minglu Li; Jiadi Yu; Yi Wang
Year: 2005
The wandering nodes: key management for low-power mobile ad hoc networks
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:S. Seys; B. Preneel
Year: 2005
Soft real-time acquisition in Windows XP
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:J. Cinkelj; M. Mihelj; M. Munih
Year: 2005
Periodic real-time scheduling for FPGA computers
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:K. Danne; M. Platzner
Year: 2005
Evaluation of message delay correlation in distributed systems
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:D. Albeseder
Year: 2005
Non-damaging chemical photoresist strip process for copper/low-k interconnects
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:P.G. Clark; K.K. Christenson
Year: 2005
Adaptive sampling methodology for in-line defect inspection
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:A. Bousetta; A.J. Cross
Year: 2005
Impact of back side defects on feol processes and yield
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:L. Pressley; S. Hardin; K. Harper; B. Dunham; D. Sutton; T. Kirsch; M. Allen; B. Klingemann; T. Mathews; L. Kohler; C. Lansford; T. Couteau; B. Hance; J. Darilek; C. Cariss; E. Apelgren; R. Stanley; J. Witowski; L. Cheung
Year: 2005
Effective wafer inspection strategy for memory manufacturing foundries with inspiring HARI results
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:L. Lin; S. Chen; T. Han; Y.H. Kim
Year: 2005
Edge and bevel automated defect inspection for 300mm production wafers in manufacturing
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:J.D. Morillo; T. Houghton; J.M. Bauer; R. Smith; R. Shay
Year: 2005
Exposure tool for immersion lithography
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:S. Owa; Y. Ishii; K. Shiraishi
Year: 2005
Exploring the capabilities of immersion lithography
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:C.A. Mack
Year: 2005
Process-window sensitive full-chip inspection for design-tosilicon optimization in the sub-wavelength era
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:M.J. Brodsky; S. Halle; V. Jophlin-Gut; L. Liebmann; D. Samuels; G. Crispo; K. Nafisi; V. Ramani; I. Peterson
Year: 2005
2004 - the year of 90-nm: a review of 90 nm devices
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:D. James
Year: 2005
Next generation manufacturing execution system (mes) enabling fully integrated fab automation in 300mm technology development and manufacturing
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:C. Mouli
Year: 2005
Interface a prototyping experiences paving the way to e-manufacturing
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:H. Wohlwend; S. Fulton
Year: 2005
Single wafer management systems and bare wafer storage as key to increased yield and productivity
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:H. Ritzmann
Year: 2005
A progressive strategy to achieving automated lot processing
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:M. Krishna; M. Baker; R. Giddings; C. Hunter
Year: 2005
An advanced methodology for the reporting of original adders for process tool defect monitoring
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:T.J. Zazado; J.R. Bottin
Year: 2005
The case for near real-time production scheduling in a highly automated semiconductor manufacturing environment
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:N. Govind; B. lyer
Year: 2005
Comparison of three different methods to model the semiconductor manufacturing yield
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Y. Dupret; E. Perrin; J.-L. Grolier; R. Kielbasa
Year: 2005
Effects of wafer bow and warpage on performance of electrostatic chucks in high volume manufacturing
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:P. Kurkowski; S. Drizlikh; R. Sarver; H. Angis; P. Loisel
Year: 2005
EQ integrated pprocess trending with tfm monitoring for backend equipments
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:T. Rathgeber; N. Haueis
Year: 2005
Low-yield flier wafer analysis strategies
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:B.A. Dunham; T.D. Kirsch; S. Litwin; M. Covert; A. Bierwag; D. Garcia; K. Holt
Year: 2005
A reticle quality management strategy in wafer fabs addressing progressive mask defect growth problem at low k1 lithography
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:K. Bhattacharyya; M. Eickhoff; M. Lang; M. Ma; S. Pas
Year: 2005
Scanner influences on resolution capabilities
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:H.H. Magoon
Year: 2005
Silicon carbide: barriers to manufacturable devices
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:J. Shovlin; R. Woodin; T. Witt; G. Dolny; P. Shenoy
Year: 2005
SPC based in-line reticle monitoring on product wafers
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:K. Mai; M. Tuckermann
Year: 2005
Thoughts on an automation concept for complex production processes within a learning organization
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:G. Luhn; H.-J. Schmidt; M. Peiter; F. Boelstler; T. Lang
Year: 2005
Using TCAD for fast analysis of misprocessed wafers and yield excursions
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:R. Minixhofer; D. Rathei
Year: 2005
A novel high speed and high voltage complementary bipolar process using 1st base-poly silicon collector and soi technique
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:J.H. Kim; S.H. Lee; H.J. Park; M.H. Choi; D. Wedel; J.J. Kim
Year: 2005
Critical challenges in packaging MEMS devices
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:R. Darveaux; L. Munukutla
Year: 2005
"Stretching factory performance beyond world class, an organizational approach"
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:S. Lantz
Year: 2005
Integrating operations and product development methodologies for improved product success using advanced product quality planning
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:T.A. Carbone
Year: 2005
Hybrid manufacturing - lower cost access to DSM technology
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:B.N. Williams; M.M. Nelson
Year: 2005
Yield management practice by user designable YMS
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:M. Inokuchi
Year: 2005
Enabling remote operations and cycle time reduction via automated lot-equipment assignments
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:B. Iyer; J.J. Concelman; T. Jefferson; R.A. Madson; J.M. Trujillo
Year: 2005
Integration of lot dispatching and AMHS control in a 300mm wafer FAB
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Dong-Seok Sun; No-Sik Park; Young-Joong Lee; Young-Chul Jang; Chung-Sam Ahn; Tae-Eog Lee
Year: 2005
Lot identification, lot location and information distribution using radio frequency and ultrasonic signals
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:M. Dierkes; S. Eisen; H. Fischer; R. Schrodel
Year: 2005
Preface
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:A. Clemm; O. Festor; A. Pras
Year: 2005
Data-driven monitoring design of service level and resource utilization
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Chang-shing Perng; Sheng Ma; S. Lin; D. Thoenen
Year: 2005
Data mining techniques for effective and scalable traffic analysis
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:M. Baldi; E. Baralis; F. Risso
Year: 2005
Redesigning network topology with technology considerations
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:S.J. Habib
Year: 2005
Reducing the complexity of application deployment in large data centers
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:T. Eilam; M.H. Kalantar; A.V. Konstantinou; G. Pacifici
Year: 2005
Quartermaster - a resource utility system
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:S. Singhal; M. Arlitt; D. Beyer; S. Graupner; V. Machiraju; J. Pruyne; J. Rolia; A. Sahai; C. Santos; J. Ward; X. Zhu
Year: 2005
Cooperation of control and management plane for provisioning in MPLS networks
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:E. Grampin; J. Serrat
Year: 2005
On the management of aggregation networks with rapidly moving traffic demands
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:F. Van Quickenborne; F. De Greve; I. Moerman; F. De Turck; P. Demeester
Year: 2005
A tariff model to charge IP services with guaranteed quality: effect of users' demand in a case study
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:N. Blefari-Melazzi; D. Di Sorte; M. Femminella; G. Reali
Year: 2005
Policy management for networked systems and applications
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:D. Agrawal; S. Calo; J. Giles; Kang-Won Lee; D. Verma
Year: 2005
Packet marking for integrated load control
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:M. Karsten; J. Schmitt
Year: 2005
Efficient transmission of periodic that follows a consistent daily pattern
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:M. Albaghdadi; K. Razvi
Year: 2005
An integrated security framework for XML based management
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:V. Cridlig; R. State; O. Festor
Year: 2005
Comparing Web services with SNMP in a management by delegation environment
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:T. Fioreze; L.Z. Granville; M.J. Almeida; L.R. Tarouco
Year: 2005
Characterization of SNMP MIB modules
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:J. Schonwalder
Year: 2005
A model-driven approach to rapid service introduction
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:M. Cochinwala; H.S. Shim; J.R. Wullert, II
Year: 2005
Moving from data modeling to process modeling in CIM
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:A. Kumar; N. Karnik; C.K. Ravindranath
Year: 2005
Introduction to control theory for computer scientists
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:J.L. Hellerstein
Year: 2005
Peer-to-peer networking and management
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:R. Boutaba
Year: 2005
Internet management: status and challenges
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:J. Schonwalder
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Management of wireless sensor networks
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:A.A.F. Loureiro; J.M.S. Nogueira; L.B. Ruiz
Year: 2005
Building up to macroprogramming: an intermediate language for sensor networks
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:R. Newton; Arvind; M. Welsh
Year: 2005
A robust architecture for distributed inference in sensor networks
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:M. Paskin; C. Guestrin; J. McFadden
Year: 2005
The effects of ranging noise on multihop localization: an empirical study
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:K. Whitehouse; C. Karlof; A. Woo; F. Jiang; D. Culler
Year: 2005
Statistical model of lossy links in wireless sensor networks
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:A. Cerpa; J.L. Wong; L. Kuang; M. Potkonjak; D. Estrin
Year: 2005
Sensing capacity for discrete sensor network applications
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Y. Rachlin; R. Negi; P. Khosla
Year: 2005
Approximate distributed Kalman filtering in sensor networks with quantifiable performance
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:D.P. Spanos; R. Olfati-Saber; R.M. Murray
Year: 2005
Adaptive statistical sampling methods for decentralized estimation and detection of localized phenomena
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:E.B. Ermis; Venkatesh Saligrama
Year: 2005
The sensor selection problem for bounded uncertainty sensing models
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:V. Isler; R. Bajcsy
Year: 2005
Lifetime-aware intrusion detection under safeguarding constraints
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:A. Iranli; H. Fatemi; M. Pedram
Year: 2005
Detecting cuts in sensor networks
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Nisheeth Shrivastava; Subhash Suri; C.D. Toth
Year: 2005
Quantizer design and distributed encoding algorithm for source localization in sensor networks
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Y.H. Kim; A. Ortega
Year: 2005
Coverage and hole-detection in sensor networks via homology
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:R. Ghrist; A. Muhammad
Year: 2005
Networked infomechanical systems: a mobile embedded networked sensor platform
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:R. Pon; M.A. Batalin; J. Gordon; A. Kansal; D. Liu; M. Rahimi; L. Shirachi; Y. Yu; M. Hansen; W.J. Kaiser; M. Srivastava; G. Sukhatme; D. Estrin
Year: 2005
Mobile agent middleware for sensor networks: an application case study
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:C.-L. Fok; G.-C. Roman; C. Lu
Year: 2005
Robomote: enabling mobility in sensor networks
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:K. Dantu; M. Rahimi; H. Shah; S. Babel; A. Dhariwal; G.S. Sukhatme
Year: 2005
eBlocks - an enabling technology for basic sensor based systems
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:S. Cotterell; R. Mannion; F. Vahid; H. Hsieh
Year: 2005
Global scale sensor networks - opportunities and challenges
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:J. Orcutt
Year: 2005
Avrora: scalable sensor network simulation with precise timing
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:B.L. Titzer; D.K. Lee; J. Palsberg
Year: 2005
The design and evaluation of a hybrid sensor network for cane-toad monitoring
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:W. Hu; Van Nghia Tran; N. Bulusu; C.T. Chou; S. Jha; A. Taylor
Year: 2005
Realization of Pb-Free FC-BGA Technology on Low-k Device
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:E. Hayashi; S. Baba; S. Idaka; A. Maeda; M. Satoh; M. Kimura
Year: 2005
Chip Scale Packaging Solution with the Flip-Chip Technologies for CMOS Image Sensor
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Gi-Jo Jung; Young-Woon Yeo; Yun-Mook Park; In-Soo Kang; Jong-Heon Kim; J. Choi
Year: 2005
High I/O Glass Ceramic Package Pb-Free BGA Interconnect Reliability
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Xiang Dai; Ning Pan; A. Castro; J. Culler; M. Hussain; R. Lewis; T. Michalka
Year: 2005
Comparison of substrate finishes for flip chip packages
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:A. Bansal; S. Yoon; J. Xie; Yuan Li; V. Mahadev
Year: 2005
Integrated nanotube microcooler for microelectronics applications
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Zhimin Mo; R. Morjan; J. Anderson; E.E.B. Campbell; J. Liu
Year: 2005
High Thermal Efficiency Carbon Nanotube-Resin Matrix for Thermal Interface Materials
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Tzong-Ming Lee; Kuo-Chan Chiou; Feng-Po Tseng; Chia-Chi Hung
Year: 2005
Study on Thermal Interface Material with Carbon Nanotubes and Carbon Black in High-Brightness LED Packaging with Flip-Chip
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Kai Zhang; Guo-Wei Xiao; C.K.Y. Wong; Hong-Wei Gu; M.M.F. Yuen; P.C.H. Chan; Bing Xu
Year: 2005
Fabrication of Nanowire Anisotropic Conductive Film for Ultra-Fine Pitch Flip Chip Interconnection
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Ren-Jen Lin; Yung-Yu Hsu; Yu-Chih Chen; Syh-Yuh Cheng; R.-H. Uang
Year: 2005
Nanoindentation of single crystal and polycrystalline copper nanowires
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:S. Bansal; E. Toimil-Molares; A. Saxena; R.R. Tummala
Year: 2005
Optimization of Copper Column Based Solder Bump Design for High Reliability Flip-Chip Interconnections
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:H. Yamada; T. Togasaki
Year: 2005
Composition control for lead-free alloy electroplating on flip chip bumping
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:R. Kiumi; S. Takeda; J. Yoshioka; F. Kuriyama; N. Saito
Year: 2005
Decision-Support Models for Thermo-Mechanical Reliability of Leadfree Flip-Chip Electronics in Extreme Environments
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:P. Lall; N. Singh; M. Strickland; J. Blanche; J. Suhling
Year: 2005
Combined thermal, thermodynamic and kinetic simulations of the solidification of SnAgCu interconnections
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Hao Yu; J. Kivilahti
Year: 2005
Multi-Physics Based Structural Similarity Rules for the BGA Package Family
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:W.D. van Driel; A. Mavinkurve; M.A.J. van Gils; G.Q. Zhang; D.G. Yang; L.J. Ernst
Year: 2005
Development of Low Stress No-Flow Underfill for Flip-Chip Application
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:O. Suzuki; S. Kawamoto
Year: 2005
Comprehensive hygro-thermo-mechanical modeling and testing of stacked die BGA module with molded underfill
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:X. Zhang; Tong Yan Tee; Hun Shen Ng; J. Teysseyre; S. Loo; S. Mhaisalkar; Fong Kuan Ng; Chwee Teck Lim; Xinyu Du; E. Bool; Wenhui Zhu; S. Chew
Year: 2005
Characterization of the floating phenomena for flip chip processing with no flow underfills
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Chunho Kim; D.F. Baldwin
Year: 2005
Wafer bonding of damascene-patterned metal/adhesive redistribution layers for via-first three-dimensional (3D) interconnect
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:J.J. McMahon; J.-Q. Lu; R.J. Gutmann
Year: 2005
Development and characterization of low cost ultrathin 3D interconnect
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Wei-Chung Lo; Yu-Hua Chen; Jeng-Dar Ko; Tzu-Ying Kuo; Chien-Wei Chien; Yu-Chih Chen; Wun-Yan Chen; Fang-Jun Leu; Hsu-Tien Hu
Year: 2005
Ultra-High Reliability Flip Chip on Laminate For Harsh Environments
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:D.S. Copeland; M.K. Rahim; J.C. Suhling; Guoyun Tian; P. Lall; R.C. Jaeger; K. Vasoya
Year: 2005
High temperature potential of flip chip assemblies for automotive applications
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:T. Braun; K.-F. Becker; J.-P. Sommer; T. Loher; K. Schottenloher; R. Kohl; R. Pufall; V. Bader; M. Koch; R. Aschenbrenner; H. Reichl
Year: 2005
Failure-Envelope Approach to Modeling Shock and Vibration Survivability of Electronic and MEMS Packaging
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:P. Lall; D. Panchagade; P. Choudhary; J. Suhling; S. Gupte
Year: 2005
Parametric Investigation of Dynamic Behavior of FBGA Solder Joints in Board-Level Drop Simulation
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:S. Groothuis; Changming Chen; R. Kovacevic
Year: 2005
Microsystem packaging of an RF SAW correlator
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:R.W. Brocato; G.F. Studor; D.W. Palmer
Year: 2005
A Stacked-Chip Package Optimized Design for a High Sensitivity GPS Application
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Hanyi Ding; J. Koeller; J.J. Maloney
Year: 2005
Assembly and Reliability Assessment of Lithography-Based Wafer-Level Compliant Chip-to-Substrate Interconnects
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:K. Kacker; G. Lo; S.K. Sitaraman
Year: 2005
Wafer Process Chip Size Package Consisting of Double-Bump Structure for Small-Pin-Count Packages
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:K. Mitsuka; H. Kurata; Jun Furukawa; M. Takahashi
Year: 2005
Design and Development of True-CSP
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:K.R. Kanth; F.K.S. Poh; B.K. Lim; D.Y.R. Chong; A. Sun; H.B. Tan
Year: 2005
A novel strategy for the integration of PDMS membranes into thermoplastic microfluidic packages
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:P. Miller; M. Schueneman; I. Sbarski; T. Gengenbach; T. Spurling
Year: 2005
Fabrication of multilayered microfluidic 3D polymer packages
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:S. Garst; M. Schuenemann; M. Solomon; M. Atkin; E. Harvey
Year: 2005
Disposable Polydimethylsioxane Package for 'Bio~Microfluidic System'
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Ser Choong Chong; Ling Xie; L. Yobas; Hong Miao Ji; Jing Li; Yu Chen; P. Damaruganath; Wing Cheong Hui; M.K. Iyer
Year: 2005
Drop Impact Reliability Testing for Lead-Free and Leaded Soldered IC Packages
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:D.Y.R. Chong; Kellin Ng; J.Y.N. Tan; P.T.H. Low; J.H.L. Pang; F.X. Che; B.S. Xiong; L.H. Xu
Year: 2005
Board level drop test reliability of IC packages
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:T.C. Chai; S. Quek; W.Y. Hnin; E.H. Wong; J. Chia; Y.Y. Wang; Y.M. Tan; C.T. Lim
Year: 2005
Modal and impact analysis of modern portable electronic products
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:L.B. Tan; C.W. Ang; C.T. Lim; V.B.C. Tan; Xiaowu Zhang
Year: 2005
Dynamic test and modeling methodology for BGA solder joint shock reliability evaluation
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:P. Geng
Year: 2005
Wafer level package solder joint reliability study for portable electronic devices
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Se-Young Jang; Tae-Sang Park; Yeon-Sung Kim; Jae-Woo Jeong; Jung-Je Ban; Dong-Ki Kang
Year: 2005
Effect of impact pulse parameters on consistency of board level drop test and dynamic responses
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Jing-en Luan; Tong Yan Tee
Year: 2005
Microstructure and Damage Evolution in Sn-Ag-Cu Solder Joints
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:L.P. Lehman; R.K. Kinyanjui; J. Wang; Y. Xing; L. Zavalij; P. Borgesen; E.J. Cotts
Year: 2005
The Bonding of Sn-Zn-Ag-Al-Ga Lead-Free Solder Balls on Cu/Ni-P/Au BGA Substrate
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Kwang-Lung Lin; Ying-Ta Chiu
Year: 2005
Application of Gold-Tin Solder Paste for Fine Parts and Devices
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:M. Ishikawa; H. Sasaki; S. Ogawa; M. Kohinata; A. Mishima; H. Yoshida
Year: 2005
Development of Flux-Free Reflow Soldering Process Using Hydrogen Radicals
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:M. Suenaga; T. Nakamori; D. Hirakawa; Y. Ohno; T. Hagihara; J. Kagami; T. Takeuchi
Year: 2005
Compact harmonic filter design and fabrication using IPD technology
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Lianjun Liu; Shun-Meen Kuo; J. Abrokwah; M. Ray; D. Maurer; M. Miller
Year: 2005
Ultra-Thin 3D-Stacked SIP Formed using Room-Temperature Bonding between Stacked Chips
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:N. Tanaka; Y. Yoshimira; T. Naito; C. Miyazaki; Y. Nemoto; M. Nakanishi; T. Akazawa
Year: 2005
3D stacked flip chip packaging with through silicon vias and copper plating or conductive adhesive filling
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:S.W.R. Lee; R. Hon; S.X.D. Zhang; C.K. Wong
Year: 2005
Technology Requirements for Chip-On-Chip Packaging Solutions
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:M. Topper; Th. Fritzsch; V. Glaw; R. Jordan; C. Lopper; J. Roder; L. Dietrich; M. Lutz; H. Oppermann; O. Ehrmann; H. Reichl
Year: 2005
The design of miniature 3D RF module
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:J. Lahteenmaki; J. Miettinen; P. Heino
Year: 2005
Wetting Dynamics of Eutectic and Lead-Free Solders with Various Reflow Conditions and Surface Finish Metallizations
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Suk Chae Kang; Chunho Kim; J. Muncy; M. Schmidt; Sangil Lee; D. Baldwin
Year: 2005
Enhancing fine pitch, high I/O devices with copper ball bonding
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Inderjit Singh; J.Y. On; L. Levine
Year: 2005
Nano-Composite Lead-Free Interconnect and Reliability
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:R. Doraiswami; R. Tummala
Year: 2005
Shear deformation of lead free solder joints
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:R. Darveaux
Year: 2005
Investigation of phase change of flip chip solders during the second level interconnect reflow
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Soonwan Chung; Zhenming Tang; Seungbae Park
Year: 2005
Powercycling Reliability, Failure Analysis and Acceleration Factors of Pb-Free Solder Joints
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:K. Setty; G. Subbarayan; Luu Nguyen
Year: 2005
Lead free solder joint reliability characterization for PBGA, PQFP and TSSOP assemblies
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:F.X. Che; J.H.L. Pang; B.S. Xiong; Luhua Xu; T.H. Low
Year: 2005
The effects of Cu doping in eutectic PbSn solder balls on ENIG substrates
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:M. Nguyen
Year: 2005
The implementation of ASIC packaging design and manufacturing technologies on high performance networking products
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:S. Camerlo; Jie Xue; Wheling Cheng; R. Duong; B.J. Shanker; Yida Zou; M. Ahmad; M. Brillhart; K. Hubbard; S. Priore
Year: 2005
The development and deployment of a quality forecasting system for surface mount assembly of portable wireless products
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:S. Potter
Year: 2005
Flip chip ball grid array component testing under board flexure
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:G. Hsieh; A. Mcallister
Year: 2005
Effect of Reflow Profiles on the Board Level Drop Reliability of Pb-Free (SnAgCu) BGA Assemblies
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:A. Lal; E. Bradley; J. Sharda
Year: 2005
Pb-free Assembly, Rework, and Reliability Analysis of IPC Class 2 Assemblies
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:J. Gleason; C. Reynolds; J. Bath; Quyen Chu; M. Kelly; K. Lyjak; P. Roubaud
Year: 2005
Determination of Components Candidacy for Second Side Reflow with Lead-Free Solder
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Yueli Liu; D.A. Geiger; Dongkai Shangguan
Year: 2005
New insights in critical solder joint location
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:M. Modi; C. McCormick; N. Armendariz
Year: 2005
Low cycle fatigue analysis of microelectronics solder joints incorporating damage and size effects using a thermodynamics based rate dependent constitutive model
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:J. Gomez; C. Basaran
Year: 2005
Generalized thermal analysis of hotspots on a high power density microprocessor chip
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Kai Xiu; M. Ketchen
Year: 2005
Small form factor pluggable optical transceiver module with extremely low power consumption for dense wavelength division multiplexing applications
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:M. Ichino; S. Yoshikawa; H. Oomori; Y. Maeda; N. Nishiyama; T. Takayama; T. Mizue; I. Tounai; M. Nishie
Year: 2005
DC-34.1 Gbps Single Mode Parallel Optical Interconnecting Module with Low Height MT Receptacle Connector for 10 Tbps
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:T. Okayasu; Y. Hayase; A. Ono; D. Watanabe; T. Shirai; A. Itoh; Y. Isaka; T. Nomura
Year: 2005
Using PDMS Micro-Transfer Moulding for Polymer Flip Chip Packaging on MEMS
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:E.K.L. Chan; C.K.Y. Wong; M. Lee; M.M.F. Yuen; Yi-Kuen Lee
Year: 2005
A study on packaging of PZT MEMS microphone
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Jian Cai; Haining Wang; Shuidi Wang; Xiaoming Wu; Tianling Ren; Songliang Jia
Year: 2005
Electrical Performance and Reliablity of Fine-Pitch Cu Bumpless Interconnect
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:A. Shigetou; T. Itoh; T. Suga
Year: 2005
Solder-Free Pressure Contact Micro-Springs in High-Density Flip-Chip Packages
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:E.M. Chow; C. Chua; T. Hantschel; K. van Schuylenbergh; D.K. Fork
Year: 2005
Study on the Electrical Performance of 80 μm Pitch Bumpless Bonding for Several GHz Interconnections
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:K. Saito; T. Fujii; Y. Akiyama; T. Usami; K. Otsuka; T. Suga
Year: 2005
Z-Axis Interconnection for Enhanced Wiring in Organic Laminate Electronic Packages
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:F.D. Egitto; S.R. Krasniak; K.J. Blackwell; S.G. Rosser
Year: 2005
50 Micron Pitch Wafer Level Packaging Testbed with Reworkable IC-Package Nano Interconnects
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:A.O. Aggarwal; P.M. Raj; V. Sundaram; D. Ravi; Sauwee Koh; R. Mullapudi; R.R. Tummala
Year: 2005
Nano-Ag Filled Anisotropic Conductive Adhesives (ACA) with Self-Assembled Monolayer and Sintering Behavior for High
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:G. Yi Li; C.P. Wong
Year: 2005
Dielectric Integrity Test for Flip-Chip Devices with Cu/Low-k Interconnects
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:C. Odegard; Tz-Cheng Chiu; C. Hartfield; V. Sundararaman
Year: 2005
Fundamentals of delamination initiation and growth in flip chip assemblies
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:M.K. Rahim; J.C. Suhling; R.C. Jaeger; P. Lall
Year: 2005
BGA brittle fracture - alternative solder joint integrity test methods
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:K. Newman
Year: 2005
Drop Impact: Fundamentals and Impact Characterisation of Solder Joints
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:E.H. Wong; R. Rajoo; Y.W. Mai; S.K.W. Seah; K.T. Tsai; L.M. Yap
Year: 2005
Effect of Stress Relaxation on Board Level Reliability of Sn Based Pb-Free Solders
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:S. Yoon; Z. Chen; M. Osterman; B. Han; A. Dasgupta
Year: 2005
High-K Nanocomposites with Core-Shell Structured Nanoparticles for Decoupling Applications
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Jianwen Xu; C.P. Wong
Year: 2005
An extension of the omega method to primary and tertiary creep of lead-free solders
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:J.-P. Clech
Year: 2005
Effects of Ramp-Time on the Thermal-Fatigue Life of SnAgCu Lead-Free Solder Joints
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:J. Lau; W. Dauksher
Year: 2005
Prognostication and health monitoring of leaded and lead free electronic and MEMS packages in harsh environments
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:P. Lall; N. Islam; J. Suhling
Year: 2005
Wafer-Level Packaging Technology for 10 Gbps TOSAs
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:D.W. Sherrer; N. Brese; J. Fisher; C. Gaebe; N.A. Heiks; J. Getz; J. Rasnake; E.S. Simon
Year: 2005
Hybrid integration of monolithic semiconductor optical amplifier arrays using passive assembly
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:G. Maxwell; A. Poustie; C. Ford; M. Harlow; P. Townley; M. Nield; T. Lealman; S. Oliver; L. Rivers; R. Waller
Year: 2005
Large thin organic PTFE substrates for multichip applications
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:R. Nowak; P. Hart; D. Alcoe
Year: 2005
A new organic composite dielectric material for high performance IC packages
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Shichun Qu; Guoping Mao; Fuming Li; R. Clough; N. O'Bryan; R. Gorrell
Year: 2005
Using MMAP for mixed signal empirical substrate design optimization
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:G. Robertson
Year: 2005
Challenges of megapixel camera module assembly and test
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:A. Chowdhury; R. Darveaux; J. Tome; R. Schoonejongen; M. Reifel; A. De Guzman; Sung Soon Park; Yong Woo Kim; Hyung Wook Kim
Year: 2005
Miniaturised inertial measurement units (IMU) for wireless sensor networks and novel display interfaces
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:J. Barton; A. Lynch; S. Bellis; B. O'Flynn; F. Murphy; K. Delaney; S.C. O'Mathuna; P. Repetto; R. Finizio; C. Carvignese; L. Liotti
Year: 2005
Reliability of lead-free SnAg solder bumps: influence of electromigration and temperature
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:B. Ebersberger; R. Bauer; L. Alexa
Year: 2005
Integrating electrothermal coupling analysis in the calibration of experimental electromigration reliability of flip-chip packages
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Yi-Shao Lai; S. Sathe; Chin-Li Kao; Chiu-Wen Lee
Year: 2005
A study of electromigration in Sn3.5Ag and Sn3.8Ag0.7Cu solder lines
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Shengquan Ou; K.N. Tu
Year: 2005
Impact of material properties and assembly geometry on bond-line stress when bonding PCBs to heat sinks with an isotropic conductive adhesive. Part II
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:A. Collins
Year: 2005
Advances in flip chip underfill technology for lead-free component packaging
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:K. Ghosh; M. McCabe; Guoyun Tian
Year: 2005
Design optimization of a high performance FCAMP package for manufacturability and reliability
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:J. Priest; M. Ahmad; Li Li; Jie Xue; M. Brillhart
Year: 2005
01005 SMT component assembly for wireless SIP modules
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:R. Jarvina; S. Greiner; R. Warren
Year: 2005
Application of MRF scheme for low-loss transmission lines on CMOS-grade silicon
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Sang-No Lee; Sung-Jun Park; Joon-Ik Lee; Jong-Gwan Yook; Yong-Jun Kim; Sang-Jo Lee
Year: 2005
A novel mechanical shock test method to evaluate lead-free BGA solder joint reliability
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:D. Reiff; E. Bradley
Year: 2005
Efficient modeling methodology and hardware validation of glass-ceramic based wiring for high-performance single- and multi-chip modules
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Sungjun Chun; A. Haridass; A. Deutsch; B. Rubin; C. Surovic; E. Klink; D. O'Connor; Hsichang Liu; C. Spring; T.-M. Winkel; W. Dyckman; G. Katopis; G. Kopcsay
Year: 2005
Neuro-genetic models in modeling nonlinear digital I/O buffer circuits
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:M. Roumbakis; B. Mutnury; S. Ulrich; J. Ratcliffe; D. de Araujo; M. Cases
Year: 2005
Concurrent chip-package design for 10GHz global clock distribution network
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:M. Shen; Li-Rong Zheng; E. Tjukanoff; J. Isoaho; H. Tenhunen
Year: 2005
Design of millimeter-wave metamaterials using deterministic full wave electromagnetic simulators and path of ascent statistical optimizer
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:D. Staiculescu; L. Martin; N. Bushyager; M.M. Tentzeris
Year: 2005
Variable embedded capacitor for active systems packaging
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:R. Doraiswami; S. Bhatacharya; I.R. Abothu; R. Tummala
Year: 2005
Fabrication of application specific integrated passive devices using wafer level packaging technologies
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:K. Zoschke; J. Wolf; M. Topper; O. Ehrmann; T. Fritzsch; K. Scherpinski; H. Reichl; F.-J. Schmuckle
Year: 2005
High manufacturability and high reliable 10Gb/s electro-absorption laser package
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Ying-Chih Chen; Yuan-Jen Chang; Yi-Ming Chen; Chen-Kun Chen; Chun-Hsing Lee; Chi-Yu Ni; Chih-Hao Hsu; Fu-Yi Cheng; Shin-Ge Lee; Yu-Chen Yu; Jyh-Long Chern
Year: 2005
Integration of 0/1-level packaged RF-MEMS devices on MCM-D at millimeter-wave frequencies
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:G. Carchon; A. Jourdain; O. Vendier; J. Schoebel; H.A.C. Tilmans
Year: 2005
Methodology for the determination of reliable separable contact interfaces
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:L. Brodsky; A.E. Mikhail; M.D. Plucinski
Year: 2005
Realization of a 27-MHz wireless transmitter using embedded passives on a thin organic substrate
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:S. Lam; C.K. Liu; M.K. Mui; K.T. Shek; C.W. Kok; D.C.C. Lam
Year: 2005
Solid-state microchip laser bonding by a low temperature epoxy-free and flux-less process
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:C. Kopp; K. Gilbert
Year: 2005
Thermal performance of a thin high interconnect density organic substrate for flip-chip applications
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:V.V. Calmidi
Year: 2005
Volume production of on-board optical waveguides
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:J. Hietala; E. Muukkonen; T. von Lerber; M. Immonen; A. Oy
Year: 2005
Analysis of characteristics of transmission line with two reference planes through high-frequency measurements
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Hyo-Seog Ryu; Seong-Woo Han; Yong-Ju Kim; Jong-Ho Kang; Pil-Soo Lee; Gun-Woo Park; Joong-Sik Kih
Year: 2005
Design and packaging for a reliable 8-Watt solid state RF power amplifier for radar
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:E.R. Crespin; D. Lee
Year: 2005
Effects of discontinuities and technological fluctuations on the RF performance of BGA packages
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:I. Ndip; W. John; H. Reichl
Year: 2005
Fabrication and characteristics of traveling-wave electro-absorption modulator (TWEAM) modules for millimeter-wave radio-over-fiber link
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Kwang-Seong Choi; Jong-Hyun Lee; Yong-Duck Chung; Young-Shik Kang; Byoung-Tae Ahn; Jong-Tae Moon; Jeha Kim
Year: 2005
Lotus effect surface for prevention of microelectromechanical system (MEMS) stiction
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Lingbo Zhu; Jianwen Xu; Zhuqing Zhang; D.W. Hess; C.P. Wong
Year: 2005
Millimeter wave RF front end design using neuro-genetic algorithms
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:R.J. Pratap; J.H. Lee; S. Pinel; G.S. May; J. Laskar; E.M. Tentzeris
Year: 2005
Modeling-based design optimization of wafer-level and chip-scale packaging for RF-MEMS devices
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:M. Kelley; A.P. Malshe; F. Barlow
Year: 2005
Multi-flip chip on lead frame overmolded IC package: a novel packaging design to achieve high performance and cost effective module package
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Jinbum Kim; J.A. Noquil; Teik keng Tan; Chung-Lin Wu; Seung-Yong Choi
Year: 2005
Novel approach to numerical prototyping in microelectronics and microsystems
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:A. Wymyslowski; G.Q. Zhang; J. Van de Peer; N. Tzannetakis; W. Van Driel
Year: 2005
Optical interconnection schemes using micro-optic connectors for passive packaging in optical PCBs
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Mu Hee Cho; Han Seo Cho; Sung Hwan Hwang; Hyo-Hoon Park; Kyung Rok Kim; Jongho Lee
Year: 2005
Rapid, predictive measurement-based modeling for high frequency interconnect on FR4 substrate
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Jaemin Shin; Jae Hong Kim; Cheolung Cha; N.M. Jokerst; M. Brooke
Year: 2005
Thermal-mechanical analysis of Terabus high-speed optoelectronic package
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Shashikant Hegde; Lei Shan; D.M. Kuchta; Y.H. Kwark; C.W. Baks; F. Doany; J.A. Kash; J.M. Trewhella
Year: 2005
Demonstration for rapid prototyping of micro-systems packaging by data-driven chip-first process using nano-particles metal colloids
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Sungchul Joo; D.F. Baldwin
Year: 2005
Effects of 3D shapes in PWB design
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:T. Peltola; P. Mansikkamaki; E.O. Ristolainen
Year: 2005
Analysis of distance learning courses offered by the EuroTraining course directory
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Z. Illyefalvi-Vitez; G. Harsanyi; B. Balogh; P. Civera
Year: 2005
Interactive multimedia development for mixed-signal design and test education
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:K.E. Newman; S. Maitra; M.M. Meshram
Year: 2005
Developing a course about nano-packaging
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:T. Zerna; K.-J. Wolter
Year: 2005
International collaboration in packaging education: hands-on system-on-package (SOP) graduate level courses at Indian Institute of Science and Georgia Tech PRC
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:M. Varadarajan; S. Bhattacharya; R. Doraiswami; G. Ananda Rao; N.J. Rao; G. May; L. Conrad
Year: 2005
An Internet course for teaching basic MEMS technologies and applications: MEMSEdu
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:G. Harsanyi; P. Bojta; P. Gordon; H. Santha
Year: 2005
Adapting the electronics technology teaching process to current needs-case study
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:D. Pitica; G. Chindris; M. Radu; P. Svasta
Year: 2005
Research on service oriented simulation grid
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Bo Hu Li; Xudong Chai; Yanqiang Di; Haiyan Yu; Zhihui Du; Xiaoyuan Peng
Year: 2005
Basic building blocks for mobile service provisioning
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:B. Mrohs; C. Rack; S. Steglich
Year: 2005
An architectural approach for building platforms is still needed
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:O. Drogehorn; K. David
Year: 2005
Importance of real-time distributed computing software building-blocks in realization of ubiquitous computing societies
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:K.H. Kim
Year: 2005
Autonomous decentralized high-speed processing technology and the application in an integrated IC card fixed-line and wireless system
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:A. Shiibashi
Year: 2005
The simulation research for the ATO model based on fuzzy predictive control
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Jinling Zhu; Xiaoyun Feng; Qing He; Jian Xiao
Year: 2005
Research on train group operation model in RITS
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Yangdong Ye; Zundong Zhang; Limin Jia; Honghua Dai
Year: 2005
Assurance technology for large transport operation control system
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:K. Kera; M. Shoji; T. Igarashi; A. Ando; K. Mori
Year: 2005
An ideal run mode for mass transit based on ADS
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Qing He; Xiaoyun Feng; Jinling Zhu; Hongyun He
Year: 2005
Autonomous decentralized resource allocation for tracking dynamic load change
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:T. Masuishi; H. Kuriyama; Y. Ooki; K. Mori
Year: 2005
Enabling context-aware group collaboration in MANETs
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:D. Bottazzi; A. Corradi; R. Montanari
Year: 2005
The future of high-speed train
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Y. Ishida
Year: 2005
Situational reasoning - a practical OWL use case
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:M. Luther; B. Mrohs; M. Wagner; S. Steglich; W. Kellerer
Year: 2005
The Yaoyorozu project designing ubiquitous information society in 2010
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Matohisa Funabashi; Koichi Homma; Toshiro Sasaki
Year: 2005
A novel forward search strategy to automatically harmonize intensification and diversification in tabu search
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:KaiYou Lei; Fang Wang; Yuhui Qiu; Guangyuan Liu; Yi He
Year: 2005
Lattice model based on a new information security function
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Yihe Liu; Xuwei LI
Year: 2005
Blending Web services and agents for mobile users
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:W. Zahreddine; Q.H. Mahmoud
Year: 2005
HADS-humanized autonomous decentralized systems
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Tu Xuyan; Zeng Guangping; Tangtao
Year: 2005
The revolution of train control system in Japan
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:M. Matsumo
Year: 2005
Autonomous decentralized organization model and coordination control of SoftMan Crowd
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Zeng Guangping; Lu Qingling; Zhang Shumin; Chen Ming; Tu Xuyan
Year: 2005
Research on the architecture of ERP system based on intelligent autonomous decentralized system
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Ye Bin; Ma Zhong-gui; Tu Xu-yan
Year: 2005
Digital gas fields produce real time scheduling based on intelligent autonomous decentralized system
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Hongbo Wang; Guangping Zeng; Xuyan Tu; Zongjie Wang
Year: 2005
Ad hoc unidirectional routing protocol based on relay control of route requests
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:H. Morino; T. Miyoshi; M. Ogawa
Year: 2005
Autonomics in telecommunications service activation
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:S. Magrath; F. Chiang; S. Markovits; R. Braun; F. Cuervo
Year: 2005
The role of power electronics in raising our standard of living
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:A. Lidow
Year: 2005
Technology trends in computer architecture and their impact on power subsystems
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:K. Kettler
Year: 2005
The future of power semiconductors
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:I. Bencuya
Year: 2005
Changing the rules in power electronics
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:H. Stork
Year: 2005
AC-DC server power supplies: making the leap to higher efficiency
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:C. Calwell; A. Mansoor
Year: 2005
AC-DC power supply growth variation in China and North America
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:J.P. Bryant
Year: 2005
Trends in digital power management: power converter and system demand characteristics
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:L. Brush
Year: 2005
A 10 kW single-stage converter for welding with inherent power factor correction
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Nianci Huang; Dairun Zhang; Tingting Song; Muwen Fan; Yamay Liu; Yianchun Zhao
Year: 2005
Design methodology for dynamic voltage scaling in the buck converter
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:A. Soto; P. Alou; J.A. Cobos
Year: 2005
A novel input-side current sensing method to achieve AVP for future VRs
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Julu Sun; Jinghai Zhou; Ming Xu; F.C. Lee
Year: 2005
Design considerations for a new generation mid-voltage power MOSFET technology
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Qun Zhao; G. Stojcic
Year: 2005
Functional integration in active IPEM by using a planar integration technology
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Zhenxian Liang; J.D. van Wyk
Year: 2005
Impact of hybrid multilevel modulation strategy on input and output harmonic performances
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:C. Rech; J.R. Pinheiro
Year: 2005
Design and implementation of a hybrid energy supply system for railway vehicles
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:R. Li; A. Pottharst; N. Frohleke; J. Bocker; K. Witting; M. Bellnitz; O. Znamenshchykov; R. Feldmann
Year: 2005
Simulation and field-testing of hybrid ultra-capacitor/battery energy storage systems for electric and hybrid-electric transit vehicles
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:J.R. Anstrom; B. Zile; K. Smith; H. Hofmann; A. Batra
Year: 2005
A novel hysteresis current control for three-phase three-level PWM rectifiers
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:L. Dalessandro; U. Drofenik; S.D. Round; J.W. Kolar
Year: 2005
Steady-state invariant frequency and amplitude droop control using adaptive output impedance for parallel-connected UPS inverters
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:J.M. Guerrero; L.G. de Vicuna; J. Matas; J. Miret; J. Cruz
Year: 2005
Optimized design of single-phase uninterruptible power supply (UPS) system
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Qiuhua Zhu; Jingtao Tan; Jie Ma; Jianping Ying
Year: 2005
An automatic lamp detection technique for electronic ballasts
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:L.M. Lee; S.Y.R. Hui; H.S.H. Chung
Year: 2005
Electronic ballast for metal halide lamps based on a class E resonant inverter operating at 1 MHz
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:R.J. Cardesin; J. Garcia; J. Dalla-Costa; J.M. Alonso
Year: 2005
Practical aspects of the unity power factor isolated three-phase rectifier based on the Scott transformer
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:S.K.T. Miller; I. Barbi
Year: 2005
Evaluation of harmonic detection methods for active power filter applications
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:L. Asiminoaei; F. Blaabjerg; S. Hansen
Year: 2005
Voltage regulation in induction machines with multiple stator windings by zero sequence harmonic control
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:A.-T. Avestruz; J.W. Holloway; R. Cox; S.B. Leeb
Year: 2005
Integrated MOSFET inverter module for low-power drive system
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Yo-Chan Son; Ki-Young Jang; Bum-Seok Suh
Year: 2005
DSP implementation of a single-cycle predictive current controller in a boost PFC rectifier
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:P. Athalye; D. MAksimovic; R. Erickson
Year: 2005
Small signal modeling for current mode controlled Cuk and SEPIC converters
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:W. Gu
Year: 2005
A novel brushless DC motor speed estimator based on space-frequency localized wavelet neural networks (WNNs)
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Y. Song; F. Ponci; A. Monti; L. Gao; R.A. Dougal
Year: 2005
On-line minimum-copper-loss control of an interior permanent-magnet synchronous machine for automotive applications
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Yu-seok Jeong; Seung-Ki Sul; S. Hiti; K. Rahman
Year: 2005
Sensorless vector control of super high speed turbo compressor
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Jung-Sik Yim; Wook-Jin Lee; Seung-Ki Sul; Hyun-Sup Yang; Jin-Tae Kim
Year: 2005
An indirect method of measuring DC bus capacitor current
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:R.W. Reese; L. Wei; R.A. Lukaszewski
Year: 2005
A low cost, triple-voltage bus DC-DC converter for automotive applications
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:G.-J. Su; F.Z. Peng
Year: 2005
Arc fault management by solid state switches for enhanced automotive safety
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:A. Martinez; B. Diong; S. Arunachalam; S. Dulluru
Year: 2005
Design and analysis of high-voltage transformer for HID lamp igniter
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:W.S. Kim; B.H. Cho; K.C. Lee
Year: 2005
Design of resonant inverters for optimal efficiency over lamp life in electronic ballast with phase control
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:F.J. Azcondo; R. Zane; C. Branas
Year: 2005
Inductor design considerations for optimizing performance & cost of continuous mode boost PFC converters
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:S. Basu; T.M. Undeland
Year: 2005
Simple control and high efficiency in the boost converter used to shape the line current to comply with the IEC 61000-3-2 regulations
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:J. Sebastian; A. Fernandez; M.M. Hernando; D.G. Lamar
Year: 2005
Quality assurance verification using a virtual prototyping system
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:L. McGarry; K.Y. Qu; W. Lee; M. Sun; T.G. Wilson
Year: 2005
Design and implementation of a power-hardware-in-the-loop interface: a nonlinear load case study
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:X. Wu; S. Lentijo; A. Deshmuk; A. Monti; F. Ponci
Year: 2005
Practical issues of input/output impedance measurements in switching power supplies and application of measured data to stability analysis
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Y. Panov; M. Jovanovic
Year: 2005
Dynamic performance analysis of outer-loop current sharing control for paralleled DC-DC converters
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:J. Sun; Y. Qiu; B. Lu; M. Xu; F.C. Lee; W.C. Tipton
Year: 2005
Equivalent circuit modeling of a multilayer planar winding array structure for use in a universal contactless battery charging platform
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:X. Liu; S.Y.R. Hui
Year: 2005
Design and IC implementation of an ultra-low-ripple switched-capacitor-based buck dc-dc converter
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Jifeng Han; A. von Jouanne; G.C. Temes
Year: 2005
A generic algorithm for global steady-state characterization of POL converters
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:M. Plesnik; M.S. Nakhla
Year: 2005
Analysis and design of switched capacitor converters
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:J.W. Kimball; P.T. Krein
Year: 2005
High-efficiency series-parallel resonant converter for the non-contact power supply
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Young-Su Kong; Eun-Soo Kim; In-Gab Hwang; Hyun-Kwan Lee
Year: 2005
A driving strategy dedicated to S.R.: the theory of waveform modification with periodical driving circuit regulation
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Yilei Gu; Yu Du; Zhengyu Lu; Zhaoming Qian; Wenxi Yao; Guisong Huang
Year: 2005
Unified steady-state and dynamic modeling for symmetric and asymmetric half-bridge DC-DC converters with current doubler rectifiers
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Yangyang Wen; Songquan Deng; Hong Mao; I. Batarseh
Year: 2005
DC bias analysis and small-signal characteristic of active-clamp forward-flyback DC-DC converter with a current doubler rectifier
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Yangyang Wen; Hong Mao; I. Batarseh
Year: 2005
Investigation of candidate topologies for brick DC-DC
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Yilei Gu; Huiming Chen; Zhengyu Lu; Zhaoming Qian; Kun Wei
Year: 2005
A novel single stage AC-DC self-oscillating series parallel resonant converter
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:M.Z. Youssef; P.K. Jain; H. Pinheiro; M. Orabi
Year: 2005
Modeling of CCFL using lamp delay and stability analysis of backlight inverter for large size LCD TV
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Chang-Gyum Kim; Kyu-Chan Lee; B.H. Cho
Year: 2005
A novel safe shutdown strategy for matrix converter even under fault condition
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Lina Wang; Fuyuan Xu; Kai Sun; Lipei Huang
Year: 2005
Emulation of output characteristics of rotor blades using a hardware-in-loop wind turbine simulator
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Seung-Ho SOng; Byoung-Chang Jeong; Hye-In Lee; Jeong-Jae Kim; Jeong-Hun Oh; G. Venkataramanan
Year: 2005
Delayless harmonic detection based on DSP with high-accuracy for active power filter
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Zhong Chen; Dehong Xu
Year: 2005
Influence of deep bar effect on induction machine modeling with gamma-controlled soft starters
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:K. Lee; W.E. Berkopec; T.M. Jahns; T.A. Lipo
Year: 2005
B4 topology options for operating three phase induction machines on single phase grids
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:T.B. Bashaw; T.A. Lipo
Year: 2005
A very simple analytical approach of thermal modeling for magnetic components
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:L.M. Escribano; P. Zumel; R. Prieto; J.A. Oliver; J.A. Cobos
Year: 2005
Control of dc-dc converters by direct pole placement and adaptive feedforward gain adjustment
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:A. Kelly; K. Rinne
Year: 2005
Modeling and analysis of thermoelectric modules
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:S. Lineykin; S. Ben-Yaakov
Year: 2005
Application of press-pack IGBTs in traction refurbishment
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:A. Golland; F. Wakeman
Year: 2005
Extraction of critical dimension reference feature CDs from new test structure using HRTEM imaging
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:R.A. Allen; A. Hunt; C.E. Murabito; B. Park; W.F. Guthrie; M.W. Cresswell
Year: 2005
Improved test structures for the electrical measurement of feature size on an alternating aperture phase-shifting mask
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:S. Smith; A.J. Walton; M. McCallum; A.C. Hourd; J.T.M. Stevenson; A.W.S. Ross
Year: 2005
90nm CMOS technology characterization at transfer and ramp
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:A. Kelleher; D. Gourley; A.M. Holmes; T. Hepburn; C. Farrell; R. Groves; T. Taskin; J. McMillan; W. Rawlins
Year: 2005
Design and characterization of a post-processed copper heat sink for smart power drivers [lateral nDMOS drivers]
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:G. Van den bosch; T. Webers; E. Driessens; B. Elattari; D. Wojciechowski; P. Gassot; P. Moens; G. Groeseneken
Year: 2005
Test structure for performance evaluation of 3 dimensional FinFETs
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Young Joon Ahn; Hye Jin Cho; Hee Soo Kang; Choong-Ho Lee; Chul Lee; Jae-man Yoon; Tae Yong Kim; Eun Suk Cho; Suk-kang Sung; Donggun Park; Kinam Kim; Byung-Il Ryu
Year: 2005
Recent trends in reliability assessment of advanced CMOS technologies
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:G. Groeseneken; R. Degraeve; B. Kaczer; P. Roussel
Year: 2005
Speed - accuracy trade-off for measurement and characterization of the matching performance of SiGe:C HBTs, applied to a 200 GHz technology
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:L.J. Choi; R. Venegas; S. Decoutere
Year: 2005
Parameter variation on chip-level
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:U. Schaper; J. Einfeld; A. Sauerbrey
Year: 2005
Experimental analysis of a Ge-HfO/sub 2/-TaN gate stack with a large amount of interface states
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:J.A. Croon; B. Kaczer; G.S. Lujan; S. Kubicek; G. Groeseneken; M. Meuris
Year: 2005
A failure analysis test structure for deep sub-micron CMOS copper interconnect technologies
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:A. Cabrini; D. Cantarelli; P. Cappelletti; R. Casiraghi; D. Iezzi; A. Maurelli; M. Pasotti; P.L. Rolandi; G. Torelli
Year: 2005
Transition to lead free soldering - a great change for a better understanding of materials and processes and green electronics
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:J. Mueller; H. Griese; K. Schischke; L. Stobbe
Year: 2005
Eco-design and beyond - key requirements for a global sustainable development
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:H. Griese; L. Stobbe; H. Reichl; A. Stevels
Year: 2005
A reflow soldering retro-design system for rework station based on Q-factor
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:X.J. Sheng; Han Ding; Y.H. Yin; Y.P. Wu
Year: 2005
A methodical planning to enhance reutilisation potential in product design
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Ke Xing; Lee Luong; K. Abhary
Year: 2005
Mechanical design and optimization of flip chip bonder
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Zhou Chen; Yin Yuehong; Guo Xinming; Lin Zhongqin; Ding Han
Year: 2005
LCA case study for copier using the matrix-based LCA software and JLCA database
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:W. Lu; S. Sakai; S. Izumi
Year: 2005
Assessment of long-term reliability in lead-free assemblies
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:S. Ganesan; Ji Wu; M. Pecht; R. Lee; J. Lo; Yun Fu; Yonghong Li; Ming Xu
Year: 2005
Mechanical shock modeling and testing of lead-free solder joint in hard disk drive head assembly
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Chen Hongtao; Wang Chunqing; Li Mingyua
Year: 2005
Hardness of Max 3SAT with no mixed clauses
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:V. Guruswami; S. Khot
Year: 2005
Pseudorandomness for approximate counting and sampling
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:R. Shaltiel; C. Umans
Year: 2005
Segment-based hand pose estimation
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:C. Schwarz; N.V. Lobo
Year: 2005
A hierarchical nonparametric method for capturing nonrigid deformations
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:A. Ecker; S. Ullman
Year: 2005
Two-stage image segmentation by adaptive thresholding and gradient watershed
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Ming Hong Pi; Hong Zhang
Year: 2005
Feature planning for robust execution of general robot tasks using visual servoing
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:M. Paulin
Year: 2005
Average cell orientation, shape and size estimated from tissue images
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:P.J.W. Iles; D.A. Clausi; S.M. Puddister; G.W. Brodland
Year: 2005
Recognizing hand-raising gestures using HMM
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:M. Hossain; M. Jenkin
Year: 2005
Using vanishing points to correct camera rotation in images
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:A.C. Gallagher
Year: 2005
Iterative corner extraction and matching for mosaic construction
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:S. Alkaabi; F. Deravi
Year: 2005
Structure from motion using SIFT features and the PH transform with panoramic imagery
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:M. Fiala
Year: 2005
Dry granular flows need special tools
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:A. Biancardi; P. Ghilardi; M. Pagliardi
Year: 2005
Kinematic variables estimation using eye-in-hand robot camera system
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:S. Verma; I. Sharf; G. Dudek
Year: 2005
Combining local and global features for image segmentation using iterative classification and region merging
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Qiyao Yu; D.A. Clausi
Year: 2005
Seeing the trees before the forest [natural object detection]
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:D.C. Asmar; J.S. Zelek; S.M. Abdallah
Year: 2005
3D reconstruction of environments for planetary exploration
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:S. Gemme; J.N. Bakambu; I. Rekleitis
Year: 2005
Deciding knowledge in security protocols under (many more) equational theories
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:M. Abadi; V. Cortier
Year: 2005
Type annotations to improve stack-based access control
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Tian Zhao; J. Boyland
Year: 2005
Enforcing secure service composition
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:M. Bartoletti; P. Degano; G.L. Ferrari
Year: 2005
On declassification and the non-disclosure policy
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:A.A. Matos; G. Boudol
Year: 2005
Foreword
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Year: 2005
Further improving geometric fitting
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:K. Kanatani
Year: 2005
Multiresolution interactive modeling with efficient visualization
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:J.-D. Deschenes; P. Hebert; P. Lambert; J.-N. Ouellet; D. Tubic
Year: 2005
Multisensor fusion for volumetric reconstruction of large outdoor areas
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:M. Fiocco; G. Bostrom; J.G.M. Goncalves; V. Sequeira
Year: 2005
Incremental Catmull-Clark subdivision
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:H.-R. Pakdel; F. Samavati
Year: 2005
An efficient scattered data approximation using multilevel B-splines based on quasi-interpolants
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Byung-Gook Lee; Joon Jae Lee; Jaechil Yoo
Year: 2005
Virtual clay modeling system using multi-viewpoint images
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:E. Ueda; Y. Matsumoto; T. Ogasawara
Year: 2005
Spatio-temporal fusion of multiple view video rate 3D surfaces
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:G. Collins; A. Hilton
Year: 2005
3D models from extended uncalibrated video sequences: addressing key-frame selection and projective drift
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:J. Repko; M. Pollefeys
Year: 2005
Semi-automatic range to range registration: a feature-based method
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Chen Chao; I. Stamos
Year: 2005
Hierarchical segmentation of range images with contour constraints
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:P. Boulanger; G. Osorio; F. Prieto
Year: 2005
Accurate principal directions estimation in discrete surfaces
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:G. Agam; Xiaojing Tang
Year: 2005
Accuracy of 3D scanning technologies in a face scanning scenario
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:C. Boehnen; P. Flynn
Year: 2005
Capturing 2 1/2 D depth and texture of time-varying scenes using structured infrared light
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:C. Frueh; A. Zakhor
Year: 2005
Efficient photometric stereo technique for three-dimensional surfaces with unknown BRDF
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Li Shen; T. Machida; H. Takemura
Year: 2005
Robust and accurate partial surface registration based on variational implicit surfaces for automatic 3D model building
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:P. Claes; D. Vandermeulen; L. Van Gool; P. Suetens
Year: 2005
Bayesian modelling of camera calibration and reconstruction
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Rashmi Sundareswara; P.R. Schrater
Year: 2005
A contour-based approach to 3D text labeling on triangulated surfaces
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:G. Slabaugh; V. Mihalef; G. Unal
Year: 2005
Determining characteristic views of a 3D object by visual hulls and Hausdorff distance
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:A. Theetten; J.-P. Vandeborre; M. Daoudi
Year: 2005
The Planar: a mobile VR tool with pragmatic pose estimation for generation and manipulation of 3D data in industrial environments
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:R. Schoenfelder; J. Baur; F. Spenling
Year: 2005
Stereo by multiperspective imaging under 6 DOF camera motion
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:N. Ichimura
Year: 2005
Non-parametric 3D surface completion
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:T.P. Breckon; R.B. Fisher
Year: 2005
Optimistic parallel discrete event simulations of physical systems using reverse computation
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Y. Tang; K.S. Perumalla; R.M. Fujimoto; H. Karimabadi; J. Driscoll; Y. Omelchenko
Year: 2005
Performance benchmark of a parallel and distributed network simulator
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:S. Lee; J. Leaney; T. O'Neill; M. Hunter
Year: 2005
RINSE: the real-time immersive network simulation environment for network security exercises
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:M. Liljenstam; J. Liu; D. Nicol; Y. Yuan; G. Yan; C. Grier
Year: 2005
Concurrent replication of parallel and distributed simulations
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:L. Bononi; M. Bracuto; G. D'Angelo; L. Donatiello
Year: 2005
Service provisioning for HLA-based distributed simulation on the grid
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Y. Xie; Y.M. Teo; W. Cai; S.J. Turner
Year: 2005
"TellMe": a novel protocol and location prediction scheme exploiting the "one for all" framework for location management
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:A. ElNahas; A. Hamad; O.H. Karam; I. Ramzy
Year: 2005
Probabilistic calculation of execution intervals for workflows
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:J. Eder; H. Pichler
Year: 2005
Specification patterns for time-related properties
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:V. Gruhn; R. Laue
Year: 2005
Test technology educational program: Overview of tutorials
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Year: 2005
A built-in self-test method for write-only content addressable memories
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:D.K. Bhaysar
Year: 2005
Flash memory built-in self-diagnosis with test mode control
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Jen-Chieh Yeh; Yan-Ting Lai; Yuan-Yuan Shih; Cheng-Wen Wu; Chien-Hung Ho; Yen-Tai Lin
Year: 2005
Transition tests for high performance microprocessors
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Yi-Shing Chang; S. Chakravarty; Hiep Hoang; N. Thorpe; Khen Wee
Year: 2005
On silicon-based speed path identification
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:L. Lee; L.-C. Wang; P. Parvathala; T.M. Mak
Year: 2005
Minimal March tests for unlinked static faults in random access memories
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:G. Harutunvan; V.A. Vardanian; Y. Zorian
Year: 2005
SRAM retention testing: zero incremental time integration with March algorithms
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Baosheng Wang; Yuejian Wu; Josh Yang; A. Ivanov; Y. Zorian
Year: 2005
Meeting the test challenges of the 1 Gbps parallel RapidIO/spl reg/ interface with new automatic test equipment capabilities
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:D. Aaberge; K. Mockler; D. Van Dinh; R. Belleau; T. Donovan; R. Hewlitt
Year: 2005
On a software-based self-test methodology and its application
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:C.H.-P. Wen; L.-C. Wang; Kwang-Ting Cheng; Kai Yang; Wei-Ting Liu; Ji-Jan Chen
Year: 2005
Synthesis of X-tolerant convolutional compactors
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:J. Rajski; J. Tyszer
Year: 2005
An efficient random jitter measurement technique using fast comparator sampling
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Dongwoo Hong; C. Dryden; G. Saksena; M. Panis
Year: 2005
Production test methods for measuring 'out-of-band' interference of ultra wide band (UWB) devices
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:S. Bhattacharya; A. Chatterjee
Year: 2005
Towards an understanding of no trouble found devices
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:S. Davidson
Year: 2005
Reducing pattern delay variations for screening frequency dependent defects
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:B.N. Lee; L.-C. Wang; M.S. Abadir
Year: 2005
A new algorithm for dynamic faults detection in RAMs
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:M. Azimane; A. Majhi; G. Gronthoud; M. Lousberg; S. Eichenberger; A.L. Ruiz
Year: 2005
Soft error mitigation for SRAM-based FPGAs
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:G.-H. Asadi; M.B. Tahoori
Year: 2005
On-chip electro-thermal stimulus generation for a MEMS-based magnetic field sensor
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:N. Dumas; F. Azais; L. Latorre; P. Nouet
Year: 2005
Measures to improve delay fault testing on low-cost testers - a case study
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:M. Beck; O. Barondeau; F. Poehl; Xijiang Lin; R. Press
Year: 2005
Static compaction of delay tests considering power supply noise
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Jing Wang; Wangqi Qiu; S. Fancler; D.M.H. Walker; Xiang Lu; Ziding Yue; Weiping Shi
Year: 2005
Synthesis of low power CED circuits based on parity codes
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:S. Ghosh; N.A. Touba; S. Basu
Year: 2005
Defect tolerance for gracefully-degradable microfluidics-based biochips
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Fei Su; K. Chakrabarty
Year: 2005
Diagnosis of arbitrary defects using neighborhood function extraction
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:R. Desineni; R.D. Blanton
Year: 2005
An agent-based architecture for handover initiation and decision in 4G networks
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:V.E. Zafeiris; E.A. Giakoumakis
Year: 2005
What is wrong in multimedia messaging?
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:O.-P. Pohjola; K. Kilkki
Year: 2005
Lightweight replication middleware for data and service components in dense MANETs
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:P. Bellavista; A. Corradi; E. Magistretti
Year: 2005
Modeling and analysis of robust header compression performance
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Chia Yuan Cho; Yong Huat Chew; W.K.G. Seah
Year: 2005
Precise distributed localization algorithms for wireless networks
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:S. Biaz; Yiming Ji
Year: 2005
A hidden environment model for constructing indoor radio maps
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Zhe Xiang; Hangjin Zhang; Jian Huang; Song Song; K.C. Almeroth
Year: 2005
VARS: a vehicle ad-hoc network reputation system
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:F. Dotzer; L. Fischer; P. Magiera
Year: 2005
Autonomic and load-adaptive optimization of beacon exchange rate for proactive configuration in ubiquitous MANETs
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:M.M. Iqbal; I. Gondal; L. Dooley
Year: 2005
QoS and routing in the cognitive packet network
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:E. Gelenbe; Peixiang Liu
Year: 2005
How trusted computers can enhance privacy preserving mobile applications
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:S. Pearson
Year: 2005
Gene Ontology Automatic Annotation Using a Domain Based Gene Product Similarity Measure
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:M. Popescu; J.M. Keller; J.A. Mitchell
Year: 2005
A New Method for Feature Subset Selection for Handling Classification Problems
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Shyi-Ming Chen; Jen-Da Shie
Year: 2005
Fuzzy Filters for Noise Reduction: The Case of Gaussian Noise
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:M. Nachtegael; S. Schulte; D. Van der Weken; V. De Witte; E.E. Kerre
Year: 2005
The Association between Non-Stationary and Interval Type-2 Fuzzy Sets: A Case Study
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:J.M. Garibaldi; S. Musikasuwan; T. Ozen
Year: 2005
Towards More Efficient Type-2 Fuzzy Logic Systems
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:S. Coupland; R. John
Year: 2005
Fuzzy Controller for MIMO Systems using Defuzzification based on Boolean Relations (DBR)
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:J. Soriano; A. Olarte; M. Melgarejo
Year: 2005
Observer Based Iterative Neural Network Model Inversion
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:A.R. Varkonyi-Koczy; A. Rovid
Year: 2005
Increasing the Flexibility and Intelligence of Material Handling through the Factory by Integrated Fuzzy Logic Controller with Programmable Logic Controller
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:M. Yahyaei; A.W. Labib
Year: 2005
Comparison between Fuzzy and Interval Partitions in Evolutionary Multiobjective Design of Rule-Based Classification Systems
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:H. Ishibuchi; Y. Nojima
Year: 2005
Quality of Service Control in IP Networks Using Fuzzy Logic for Policy Condition Evaluation
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:R.A. Resende; N.A. Nassif; M.A. de Siqueira; A.E. da Silva; M. Lima-Marques
Year: 2005
A Fuzzy Logic Approach to the Evaluation of Material Recyclability
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Y.A. Phillis; V.S. Kouikoglou; Xiaomin Zhu
Year: 2005
Fuzzy Logic Control of a Projectile Smart Fin
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:M.B. Trabia; Surya Kiran Parimi; Woosoon Yim
Year: 2005
Identification of Enhanced Fuzzy Models with Multidimensional Fuzzy Membership Functions
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:O. Ciftcioglu; I.S. Sariyildiz
Year: 2005
A SPSA Algorithm for Solving Fuzzy Random Expected Value Models
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Yunqi Zhang; Ruiqing Zhao; Yufu Ning
Year: 2005
On Choosing an Appropriate Data Analysis Algorithm
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:M. Spott; D. Nauck
Year: 2005
Robust PCA with Intra-Sample Outlier Process Based on Fuzzy Mahalanobis Distances and Noise Clustering
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:H. Ichihashi; K. Honda; N. Wakami
Year: 2005
Using Ant Colony Optimization for Learning Maximal Structure Fuzzy Rules
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:P. Carmona; J.L. Castro
Year: 2005
Analysis of the Stability of a Fuzzy Control System Developed to Control a Simulated Robot
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:P.B. Moratori; M.V. Pedro; L.M.B. Manhaes; C. Lima; A.J.O. Cruz; E.B. Ferreira; L.C.V. de Andrade
Year: 2005
Hardware Based Fuzzy Logic Controllers Using Frequency Domain Singleton Fuzzification
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:S.A. Lopez; M.A. Melgarejo
Year: 2005
Genetic Learning of the Knowledge Base of a Fuzzy System by Using the Linguistic 2-Tuples Representation
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:R. Alcala; J. Alcala-Fdez; F. Herrera; J. Otero
Year: 2005
Modification of Evolutionary Multiobjective Optimization Algorithms for Multiobjective Design of Fuzzy Rule-Based Classification Systems
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:K. Narukawa; Y. Nojima; H. Ishibuchi
Year: 2005
Dynamic Case Based Reasoning in Fault Diagnosis and Prognosis
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:H. Berenji; Yan Wang; A. Saxena
Year: 2005
Fault Detection and Isolation of Industrial Processes Using Optimized Fuzzy Models
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:L.F. Mendonca; J.M.C. Sousa; J.M.G. Sa da Costa
Year: 2005
Effects of Irrelevant Attributes in Fuzzy Clustering
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:C. Doring; C. Borgelt; R. Kruse
Year: 2005


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