Design and fabrication of six pole microstrip elliptical low pass filter
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:P. Kumar; C. Jagadeesh; R.N. Baral; P.K. Singhal
Year: 2008
Microwave promoted and improved thermal synthesis of biodynamic organotitanium(IV) complexes and their electrochemical behaviour
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:S. Malik; M. Kumari; D.K. Sharma
Year: 2008
Efficiency enhancement of C-band, 60 W space traveling wave tube (TWT)
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:R.K. Gupta; A. Vohra; V. Srivastava
Year: 2008
Dielectric study of allyl bromide and formamide mixtures using picoseconds time domain reflectometry
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:G.M. Dharne; S.P. Kamble; A.L. Tidar; P.T. Sonwane; S.B. Sayyad; Y.S. Sudake; A.P. Mharolkar; S.S. Patil; P.W. Khirade; S.C. Mehrotra
Year: 2008
Nonlinear distortion analysis of an amplifier, having a large number of nonlinear elements, using Volterra series
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:M. Rafie; A. Abdipour; G. Moradi
Year: 2008
Wideband gap-coupled suspended rectangular microstrip antenna
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:S. Nirate; R.M. Yadahalli; K.K. Usha; R.M. Vani; P.V. Hunagund
Year: 2008
Development of D-band Gunn oscillator
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:M.R. Kumar; D. Kumar; A.K. Shukla
Year: 2008
Compact microstrip circular patch antenna for Wi-Max with double-layered substrate
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:M.M. Sharma; N.C. Bajia; V. Agarwal; S. Kumawat; S. Gupta; R.P. Yadav
Year: 2008
Effect of LiTi ferrite as a substrate for microstrip patch antenna in X band
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:N.K. Saxena; N. Kumar; I.M. Srivastav; P.K.S. Pourush
Year: 2008
Surface Acoustic Wave filters for space use
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:A. Kumar; S. Sinha; U. Mandavia; N.R. Jivani; S. Singh; O.P. Kaushik
Year: 2008
An application of fractal geometry to design the microstrip circuits
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:A. Arora; K.R. Raghunandan; D. Kumar; A. De
Year: 2008
Design of RF structure for a terahertz source
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:A.K. Sharma; R.K. Sharma; G. Dixit; M. Lathar; V. Srivastava
Year: 2008
Design, fabrication and testing of pressurized co-axial directional coupler for high RF power measurements for SST-1 ICRH system
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:D. Rathi; R. Singh; S.V. Kulkarni
Year: 2008
Single - feed miniaturized cross patch antenna
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:M.S. Nishamol; V.P. Sarin; P. Mohanan; C.K. Anandan; K. Vasudevan
Year: 2008
Experimental investigation of an equilateral triangular microstrip antenna with a dielectric radome
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:M. Biswas; D. Guha
Year: 2008
Investigation of varying resonant resistance of the slotted rectangular patch
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:S. Datta; C. Saha; J.Y. Siddiqui
Year: 2008
Study of return loss and radiation patterns of ring antenna using extended cavity model
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:M. Mahajan; T. Chakarvarty; S.K. Khah
Year: 2008
Sapphire based high-power microwave window
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:N. Nayek; K. Subhadra; M. Kandpal; A. Majumdar; S. Chatterjee; C.S. Nainwad; R. Krishnan; S. Das
Year: 2008
Novel Design of Star Shaped Circular Fractal Antenna
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:R. Kumar; Y.B. Thakare; M. Bhattacharya
Year: 2008
Real time location estimation using active RFID system
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:A. Agarwal; G.S. Raghuwanshi; N.K. Meena; A.K. Verma; A.R. Harish
Year: 2008
Dual anode electron gun for Ka-Band helix TWT
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:A.R. Choudhury; R.K. Sharma; S.M. Sharma; S. Arya; A. Bera; V. Srivastava
Year: 2008
Helical slow wave structure for space TWTs- a design approach
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:A. Bera; R.K. Sharma; V. Srivastava
Year: 2008
Demarcation of land-water boundary of Indian coast using MSMR data of IRS-P4 satellite at 10.65 GHz
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:O.P.N. Calla; U. Purohit; M. Khakholia
Year: 2008
Design &development of wide band corrugated horn
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:S.S. Kumar; M.B. Mahajan; R. Jyoti; V.R. Seth; H.S. Solanki; S.B. Sharma
Year: 2008
Design of sheet beam electron gun
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:R.S. Raju; R.K. Barik; J. Banerjee; P. Bhomia
Year: 2008
Multi frequency circular patch antenna with slit for modern communication systems
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:P. Sekra; V. Sharma; D. Bharadwaj; D. Bhatnagar; V.K. Saxena; J.S. Saini
Year: 2008
Probe feed elliptical patch antenna with slits for WLAN application
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:V. Sharma; V.K. Saxena; K.B. Sharma; J.S. Saini; D. Bhatnagar
Year: 2008
Broadband dual frequency pentagonal microstrip antenna for wireless communication systems
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:B. Sharma; V. Sharma; D. Bharadwaj; K.B. Sharma; V.K. Saxena; J.S. Saini; D. Bhatnagar
Year: 2008
Design and optimization of asymmetric RF window for 6 MW pulse power S-band klystron
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:O.S. Lamba; D. Pal; D. Kant; T. Giri; M.K. Verma; S.C. Nangru; L.M. Joshi
Year: 2008
Asymmetric Coplanar Strip fed wide band antenna
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:D. Laila; V. Deepu; R. Sujith; P. Mohanan; C.K. Anandan; K. Vasudevan
Year: 2008
Square patch microstrip antenna with single notch having an air gap
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:D. Bhardwaj; Komal; D. Bhatnagar; S. Sancheti
Year: 2008
Planar reconfigurable adaptive digital beam forming for SAR application
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:U.V. Buch; S.B. Sharma
Year: 2008
Approximations in the design of CPS
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:C.B. Ashesh; R. Garg
Year: 2008
Characteristics of low-k RF MEMS capacitive switches on gallium arsenide substrate
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:P. Sharma; S.K. Koul; R. Murlidharan; A. Mangatayaru; P. Suryanarayanan; S. Chaturvedi; A. Naik
Year: 2008
Broadband design of microstrip antennas: Recent trends and developments
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:M. Bhatnagar
Year: 2008
CAD tools for antennas
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:S. Bhavatharini; S. Raghavan; D.S. Kumar
Year: 2008
Antenna gain determination using a microwave CAD tool - HFSS
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:B.V. Satheesh; R. Srivatsan; S. Raghavan; D.S. Kumar
Year: 2008
Human resource perspective for highly skilled and sensitive technocrats in a sustainable growth model for an organization
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:R. Arora; R. Sharma
Year: 2008
Concept of intellect management and its relevance to technology development
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:A. Dinesh
Year: 2008
Microwave tube research scenario: Role and scope of engineering college students and teachers
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:B.N. Basu
Year: 2008
WMAP - a portrait of the early universe
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:E. Wollack
Year: 2008
Low-Temperature-Cofired Ceramic Technology for Diverse Electronic- Packaging Applications
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:P.K. Khanna
Year: 2008
Soft-computing in antennas & propagation
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:R.K. Mishra
Year: 2008
Managerial aspects in co-relating trends, techniques and collective intellect leading to an efficient technology development and implementation process
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:R. Sharma
Year: 2008
Millimeter wave micromachined antenna development
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:S.K. Koul
Year: 2008
Recent advances in microwave multi-modal SAR remote sensing of the terrestrial covers
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:W.-M. Boerner
Year: 2008
Modern techniques to design wide band power transfer networks and microwave amplifiers on silicon RF Chips
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:B.S. Yarman
Year: 2008
Effectiveness of zonal congestion management in the European electricity market
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:M. Imran; J.W. Bialek
Year: 2008
Performance study of line post insulator under different pollution conditions
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:M.A. Salam; H.M. bin Hj Kassim
Year: 2008
Sliding mode control power system stabilizer (PSS) for Single Machine Connected to Infinite Bus (SMIB)
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:S.I. Safie; M. Shah; A.R. Hasimah; A. Wahab; H.M. Yusri
Year: 2008
Multi-Agent-Based Particle Swarm Optimization Approach for PSS designing in multi-machine power systems
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:H.K. Kargar; R. Aghmasheh; A. Safari; G.R.Z. Govar
Year: 2008
Fuzzy logic based UPFC controller for damping low frequency oscillations of power systems
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:A.M. Dejamkhooy; M. Banejad; N. Talebi
Year: 2008
Fast estimation of transient stability constrained ATC by relevance vector machine
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:A. Wada; Teruhisa Kumano
Year: 2008
Power system stability assessment based on synchronized phasor measurements
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:B.B. Monchusi; Y. Mitani; L. Changsong; S. Dechanupaprittha
Year: 2008
Analysis of the small signal stability for the international space station/JEM electric power systems
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:M. Komatsu; S. Yanabu
Year: 2008
Economic analysis of Iran-Turkey power network interconnection: HVDC vs. HVAC
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:M. Eghlimi; G.H. Shakouri
Year: 2008
Analysis of perturb and observe maximum power point tracking algorithm for photovoltaic applications
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Chee Wei Tan; T.C. Green; C.A. Hernandez-Aramburo
Year: 2008
Design of a MIMO controller for a multimodul Dc-Dc converter based on Particle Swarm Optimized neural network
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:A.M.Z. Jasour; M. Khazraei; A. Rahmati
Year: 2008
Sensorless control of a BLDC motor with back EMF detection method using DSPIC
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:K.S. Rama Rao; Nagadeven; S. Taib
Year: 2008
Improvements on the high frequency signal injection method for permanent magnet synchronous motors and its application in the hybrid drive position control
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:M. Nour; N.Y. Ee; E. Radwan
Year: 2008
A high-performance vector-controlled PMSM drive with maximum torque per ampere operation
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:F. Tahami; H. Nademi; M. Rezaei
Year: 2008
Reduction of commutation torque ripple in a brushless DC motor drive
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:S.S. Bharatkar; R. Yanamshetti; D. Chatterjee; A.K. Ganguli
Year: 2008
Impact of multiple adjustable speed drive system to power system harmonics
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Taufik; E. Matsumoto; M. Anwari
Year: 2008
Comparison of active power filters with series-connected capacitor
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:P. Parkatti; H. Tuusa
Year: 2008
Simulation of the impact of harmonics on distribution transformers
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:D.M. Said; K.M. Nor
Year: 2008
Effects of homogenous soil characteristics to the transient responses of a single long horizontal ground conductor model
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:W.F. Wan Ahmad; D. Thomas; C. Christopoulos; M.S. Mohamad Hashim; J. Jasni; M. Ab Kadir; H. Hizam
Year: 2008
Effect of fill factor on the MPPT performance of a grid-connected inverter under Malaysian conditions
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:N.A. Azli; Z. Salam; A. Jusoh; M. Facta; B.C. Lim; S. Hossain
Year: 2008
MPPT performance of a grid-connected PV inverter under Malaysian conditions
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:N.A. Azli; Z. Salam; A. Jusoh; M. Facta; B.C. Lim; S. Hossain
Year: 2008
Assessment of voltage stability with new NRS
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:M. Eidiani
Year: 2008
A Study on static voltage collapse proximity indicators
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:R. Verayiah; I.Z. Abidin
Year: 2008
Performance of multi-column MOVs for C class protection of AC power circuits
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:M.S. Kamarudin; A. Ponniran; Z.A. Malek
Year: 2008
Analysis and minimization of input current and voltage ripples of five-phase PWM inverters
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:P.A. Dahono; Deni; A. Rizqiawan
Year: 2008
Power Quality and electromagnetic compatibility -The ‘simple or not so simple’ ubiquitous power supply input stage -
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:R.T. Kennedy; I. Daut
Year: 2008
Analysis of PQ waveform for optimum data transmission over IEC 61850 communication standards
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:B. Yunus; H. Li
Year: 2008
Sensorless predictive torque control by means of sliding mode observer
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:S.A. Davari; D.A. Khaburi
Year: 2008
PWM technique to control speed of induction motor using Matlab/xPC target box
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:M.F. bin Romlie; M.F. Pesol; K.N.M. Hasan
Year: 2008
PWM technique to control speed of induction motor using Matlab/xPC target box
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Mohd Fakhizan bin Romlie; Mohammad Fadhil Pesol; Khairul Nisak Md Hasan
Year: 2008
A simple overmodulation strategy in DTC-hysterisis based induction machine drives
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:A. Jidin; N.R.N. Idris; A.H.M. Yatim
Year: 2008
Performance analysis of an electric vehicle in faulty inverter mode
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:M.S. Zadeh; B. Asaei; M. Hamzeh
Year: 2008
Closed-loop control of AC/DC three-phase Current Injection Series Resonant Converter
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:M.N. Seroji; A.J. Forsyth
Year: 2008
Tuning of control loops for grid connected voltage source converters
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:J.A. Suul; M. Molinas; L. Norum; T. Undeland
Year: 2008
Hierarchical approach in steam network modelling
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:R. Arghandeh Jouneghani; M. Amidpour; A. Ghaffari
Year: 2008
Thermal generation scheduling strategy using binary clustered particle swarm optimization algorithm
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:T. Senjyu; S. Chakraborty; A.Y. Saber; H. Toyama; A. Yona; T. Funabashi
Year: 2008
Power compensator for high power fluctuating loads with a supercapacitor bank energy storage
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:A. Virtanen; H. Tuusa
Year: 2008
Next-day peak electricity price forecasting using NN based on rough sets theory
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:H. Toyama; T. Senjyu; S. Chakraborty; A. Yona; T. Funabashi; A.Y. Saber
Year: 2008
Reactive power procurement scheme in competitive power markets
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Fuqiang Zhang; H.W. Ngan; Fushuan Wen; C.W. Yu; C.Y. Chung; K.P. Wong
Year: 2008
Redistribution of transmission loss based on Z-bus method
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Yi-Ping Chen; Wen-Chen Chu
Year: 2008
Performance evaluation of disk MHD accelerator with nozzle and diffuser
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:S. Takeshita; C. Buttapeng; N. Harada
Year: 2008
Development of acoustic emission diagnostic system for condition monitoring of rotating machines
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:M. Elmaleeh; N. Saad
Year: 2008
Permanent magnet brushless machines with minimum difference in slot number and pole number
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:M.S. Ahmad; N.A.A. Manap; Dahaman Ishak
Year: 2008
Rectangular current commutation and open-loop control for starting of a free-piston linear engine-generator
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:S.A. Zulkifli; M.N. Karsiti; A.R.A. Aziz
Year: 2008
A predictive control strategy for the Sheppard-Taylor based PFC rectifier
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:M.R. Abedi; A.A. Sahari; F. Tahami
Year: 2008
An extended dynamic matrix control design for quasi-resonant converters
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:F. Tahami; M. Ebad
Year: 2008
Evaluation of a Generic Virtual Power Plant framework using service oriented architecture
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:P.B. Andersen; B. Poulsen; M. Decker; C. Traeholt; J. Ostergaard
Year: 2008
Static security assessment using artificial neural network
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:I.S. Saeh; A. Khairuddin
Year: 2008
Comparison of distribution transformer losses and capacity under linear and harmonic loads
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:S.B. Sadati; A. Tahani; B. Darvishi; M. Dargahi; H. Yousefi
Year: 2008
An improved integer coded genetic algorithm for security constrained unit commitment problem
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:S. Golestani; M. Raoofat; E. Farjah
Year: 2008
State of art on load monitoring methods
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:H. Najmeddine; K. El Khamlichi Drissi; C. Pasquier; C. Faure; K. Kerroum; A. Diop; T. Jouannet; M. Michou
Year: 2008
Value of combining hydrogen production with wind power in short-term electricity markets
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:C.J. Greiner; M. Korpas; T. Gjengedal
Year: 2008
Market oriented reactive power expansion planning using locational marginal price
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:M.E. Falak; M.O. Buygi; A. Karimpour
Year: 2008
Determination of mean and variance of LMP using probabilistic DCOPF and T-PEM
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:M. Davari; F. Toorani; H. Nafisi; M. Abedi; G.B. Gharehpetian
Year: 2008
Comprehensive model for simultaneous pricing of active and reactive power based on marginal cost theory
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:M.A. Tabrizi; M.E.H. Golshan
Year: 2008
Electricity price forecasting using a clustering approach
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Kh. Sokhanvar; A. Karimpour; N. Pariz
Year: 2008
Optimal location of static VAR compensator (SVC) based on small signal stability of power system
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:M. Joorabian; N.F. Ramandi; M. Ebadi
Year: 2008
Performance study of a diagonal MHD accelerator for space propulsion
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Sukarsan; M. Anwari; N. Harada
Year: 2008
Simulation study of a series hybrid propulsion system for a bimodal tram
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Chang Han Bae; Seky Chang; Jai Kyun Mock; Kang Won Lee; Seok Youl Hwang
Year: 2008
ANN-based detection of broken coils of small generator stator with two parallel branches in phase
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:F. Toorani; A. Darabi; I. Salabeigi
Year: 2008
Coilgun energized by commercial power supply
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Y. Uehara; S. Furuya
Year: 2008
A low ripple voltage multiplier for X-ray power supply
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:S. Iqbal; R. Besar; C. Venkataseshiah
Year: 2008
Particle swarm optimization and genetic algorithm to optimizing the pole placement controller on Cuk converter
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:M.R. Yousefi; S.A. Emami; S. Eshtehardiha; M. Bayati Poudeh
Year: 2008
Annealing of metal wire by atmospheric pressure discharge plasma
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:T. Nakamura; C. Buttapeng; S. Furuya; N. Harada
Year: 2008
Development of mathematical equation for determining breakdown voltage of electrodes gap
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:M.A.M. Piah; P.A. Ping; Z. Buntat
Year: 2008
Optimal siting and sizing of distributed generations in radial and networked systems considering different voltage dependent static load models
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:R.K. Singh; S.K. Goswami
Year: 2008
Gas based distributed generation systems, a key to Iran buildings growing energy demand
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:R. Arghandeh Jouneghani; R. Parvizi; M. Amidpour; A. Chaibakhsh
Year: 2008
Autoregressive method in short term load forecast
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Z. Baharudin; N. Kamel
Year: 2008
Assessment of power composite system annualized reliability indices based on improved particle swarm optimization and comparative study between the behaviour of GA and PSO
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:M.R. Gholami; S.H. Hoseini; M. Mohamad Taheri
Year: 2008
Voltage stability evaluation of real power transmission system using singular value decomposition technique
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:K. Ellithy; M. Shaheen; M. Al-Athba; A. Al-Subaie; S. Al-Mohannadi; S. Al-Okkah; S. Abu-Eidah
Year: 2008
FTTH Network Economics: Key Parameters Impacting Technology Decisions
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:S. Kulkarni; B. Polonsky; M. El-Sayed
Year: 2008
Broadband demand and the role of new technologies
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:K. Stordahl
Year: 2008
Optimisation Methods for Dynamic Frequency Planning in OFDMA Networks
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:D. Lopez-Perez; A. Juttner; Jie Zhang
Year: 2008
Capacity evaluation for multi-layer GSM networks with voice and data traffic
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:K. Majewski; A. Maciolek
Year: 2008
Precise Location Prediction Algorithms Using Improved Random Walk-based and Generalized Markovian Mobility Models
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:K. Lendvai; P. Fulop; S. Szabo; T. Szalka
Year: 2008
Remote Management of Mobile Devices with Broadband Forum's TR-069
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:B.A.G. Hillen; I. Passchier; E.F. Matthijssen; F.T.H. den Hartog; F. Selgert
Year: 2008
Converged communication services and competition in consumer markets
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:A. Saleh; J. Borger; N. Raman
Year: 2008
Economics of Video Telephony and VoIP over EV-DO Rev A; A Service Provider Value Proposition
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Y. Krishnan; N. Raman; E. Zanone
Year: 2008
Optimizing Costs of Migration to NGNs
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:D. Mongeau; G. Rajan
Year: 2008
Systematic QoS class mapping framework for application requirement over heterogeneous networks
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:H. Park
Year: 2008
Hierarchical routing on unstructured identifiers
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:G. Nemeth; J. Tapolcai; A. Csaszar
Year: 2008
Operational databases-related multi-layer network modelling to support network development at Magyar Telekom
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:E. Babics; E. Csakany; T. Jakab; R. Konkoly; L. Szandi
Year: 2008
Network topology design considering detour traffic caused by link failure
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:N. Kamiyama; R. Kawahara; H. Yoshino
Year: 2008
An Advanced Timing Attack Scheme on RSA
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:R. Toth; Z. Faigl; M. Szalay; S. Imre
Year: 2008
Security architectures in mobile integrated pay-TV conditional access system
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:H. Shirazi
Year: 2008
Using discrete event simulation to reduce operational expenses for a telecom operator
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:K. Casier; A. Gouwy; S. Verbrugge; D. Colle; M. Pickavet; P. Demeester
Year: 2008
A practical approach to network planning using both operational and optimization tools
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:N. Perrot; V. Chandrakumar; L. Burity; S. Nicaisse
Year: 2008
Large-scale data transfer method with dynamic window control to reduce reservation bandwidth in Diffserv AF networks
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:N. Ikeda; M. Noro; K.-i. Baba; S. Shimojo
Year: 2008
Practical steps in techno-economic evaluation of network deployment planning part 1: methodology overview
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:S. Verbrugge; K. Casier; J. Van Ooteghem; B. Lannoo
Year: 2008
Practical steps in techno-economic evaluation of network deployment planning part 2: case study "FTTH roll-out in Gent"
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:S. Verbrugge; K. Casier; J. Van Ooteghem; B. Lannoo
Year: 2008
IPv6 tutorial
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:J. Mohacsi; J. Durand; B. Tuy; T. Chown; S. Venaas; J.N. Ferreira; C. Friacas
Year: 2008
Fiber-to-the-X: Technologies & Economics
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:M. El-Sayed
Year: 2008
Focusing the study on wireless multihop networks
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:J.P. Aspas; C.G. Montenegro
Year: 2008
End to end IPTV design and implementation, how to avoid pitfalls
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:R. Chaudhuri
Year: 2008
Carrier Ethernet transport in metro and core networks
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:C.G. Gruber; A. Autenrieth
Year: 2008
Next Generation Networks Techno-Economic Insights
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:S.A. Azcoitia
Year: 2008
A Concept of Inter-AS Priority Signaling using BGP Attributes
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Thomas Martin Knoll
Year: 2008
Next generation networks multiservice network design
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Deirdre H. Doherty; Thomas B. Morawski; Raymond A. Sackett; Benjamin Y. C. Tang; Carlos Urrutia-Valdes; Z. John Zhao
Year: 2008
An efficient and practical layer-preference policy for routing in GMPLS networks
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Peter Fodor; Gabor Enyedi; Gabor Retvari; Tibor Cinkler
Year: 2008
Evaluation of MPLS P2MP distribution tree algorithms
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Ryutaro Matsumura; Masayuki Tsujino; Masayuki Inoue; Motoi Iwashita
Year: 2008
An efficient algorithm for designing reliable ip networks with an access/edge/core hierarchical structure
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Steven Chamberland
Year: 2008
Efficient and scalable design of Protected Working Capacity Envelope
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Samir Sebbah; Brigitte Jaumard
Year: 2008
An advanced timing attack scheme on RSA
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Rudolf Toth; Zoltan Faigl; Mate Szalay; Sandor Imre
Year: 2008
Network capacity analysis using dynamic simulation
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Gerard O'Reilly
Year: 2008
Sensor-based data storage for search and rescue
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:S. Sariel-Talay; E. Ergen; G. Avdan; C. Eroglu
Year: 2008
Evaluating KNN, LDA and QDA classification for embedded online feature fusion
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:A. Starzacher; B. Rinner
Year: 2008
Perception of human gestures through observing body movements
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:A. Hesami; F. Naghdy; D. Stirling; H. Hill
Year: 2008
Forecasting model for crude oil prices based on artificial neural networks
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:I. Haidar; S. Kulkarni; Heping Pan
Year: 2008
Using mixed-initiative human-robot interaction to bound performance in a search task
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:C.W. Nielsen; D.A. Few; D.S. Athey
Year: 2008
Efficient distributed security for wireless medical sensor networks
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:O.G. Morchon; H. Baldus
Year: 2008
Mobile biomedical sensing with dry electrodes
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:G. Gargiulo; P. Bifulco; R.A. Calvo; M. Cesarelli; C. Jin; A. van Schaik
Year: 2008
Legendre Polynomials based biometric authentication using QRS complex of ECG
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:I. Khalil; F. Sufi
Year: 2008
Frequency analysis of inertial sensor data for measuring toe clearance
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:D.T.H. Lai; R. Begg; E. Charry; M. Palaniswami
Year: 2008
Fourier analysis of tibia acceleration in subjects with knee osteoarthritis: Preliminary results
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:P. Levinger; D.T.H. Lai; R. Begg; H. Menz; J. Feller; K. Webster
Year: 2008
Evaluating bouncy gait in idiopathic toe-walkers using accelerometer
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:G. Pendharkar; P. Percival; D. Morgan
Year: 2008
Evaluation of human gait through observing body movements
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:A. Hesami; F. Naghdy; D. Stirling; H. Hill
Year: 2008
System for the detection and analysis of vital functions in unconscious casualties for use by first aiders
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:M. Jaeger; D. Wettach; Y. Jin; R. Jaeger; A. Bolz
Year: 2008
Verification of key establishment protocols for a home health care system
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:K. Singh; V. Muthukkumarasamy
Year: 2008
Measuring toe clearance using a wireless inertial sensing device
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:D.T.H. Lai; R. Begg; E. Charry; M. Palaniswami; K. Hill
Year: 2008
Power control in CDMA systems based on channel identification
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Huan Zhang; P. Pathirana; S. Ekanayake
Year: 2008
Congestion management in opportunistically connected networks using repeated games
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Guohua Zhang; Yonghe Liu
Year: 2008
Practical approach to sensor data gathering
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Soonmok Kwon; Jongmin Shin; Dongmin Yang; Cheeha Kim
Year: 2008
Trade-off between coverage and robustness of automotive environment sensor systems
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:T. Herpel; C. Lauer; R. German; J. Salzberger
Year: 2008
Extending the lifetime of sensor networks using prediction and scheduling
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Jong Chern Lim; C.J. Bleakley
Year: 2008
Probabilistic Analysis of Nanoscale XOR Gate
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Xiao-Jun Lu; Jian-Ping Li
Year: 2008
SOM Classification Method based on Transduction Scheme
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Bin Tong; Zhi-Guang Qin; Xin-Xin Ma; Yong Wang; Wei-Feng Jia
Year: 2008
Optimization Design of Tip Clearance Shape
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Xing-Ming Qi; Zhi-Gang Hua; Jin-Yi Jiao
Year: 2008
Definition of Misclassification Cost & Redistribution Strategy of Telecom Churn Analysis
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Xue Zeng; Yue Wu; Yuan Tang
Year: 2008
An Ant Colony Optimization Approach to Disassembly Planning
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:C. Lu; H.Z. Huang; B. Zheng; J.Y.H. Fuh; Y.S. Wong
Year: 2008
The Choice of Parameters in Arc Length Algorithm
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Xiao-Wen Nie; Xian-Liang Lu; Hai-Mei Xu; Yong-Xiang Peng
Year: 2008
Finite-Element Analysis the Vibrancies of Floating Steel-Pipeline on Sea
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Zhang Shifu; Shu Xiumei; Zhang Qixin
Year: 2008
The Emulation of Flow Field in Nozzles based on FEM
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Shu Xiumei; Zhang Shifu; Zheng Shengqiang; Peng Xueming
Year: 2008
Study on an Adaptive Task Assignment Method in Media Context Invention
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Yi-Feng Shi; Hao Tan; Rong-Fang Ma
Year: 2008
Extract the 3D Facial Region from Point Clouds
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Zhao-Jun Shi; Jian-Ping Li
Year: 2008
Stability and L2-Gain Analysis for Switched Neutral Systems
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Du-Yu Liu; Shou-Ming Zhong; Yuan-Qing Huang
Year: 2008
Exponential Stability Analysis of Bidirectional Associative Memory Neural Networks with Distribute Delays
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Bao-Zhu Zhao; Shou-Ming Zhong
Year: 2008
A Novel Method of Software Vulnerability Detection based on Fuzzing Technique
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Xiao-Song Zhang; Lin Shao; Jiong Zheng
Year: 2008
A Network Management Model based on Mobile Agent System
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Jian Hu; Rui Zhao; Xiao-Mei Qiu
Year: 2008
System Requirement Manage Model Sustain Web-Based Information Publishing System
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Ai-Kui Tian
Year: 2008
A Novel Anti-Trojan Approach using Behavioral Analysis
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Bo Xiang; Yu-Jie Hao; Yan Zhang; Hong-Yu Liu
Year: 2008
The Improvement of Clustering Routing Protocol for Wireless Sensor Networks
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Wen-Sheng Guo; Yong Liao; Nan Sang; Guang-Ze Xiong
Year: 2008
A Visual Management Platform Designed for Wireless Sensor Network based on ZigBee
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Yu-Ting Cai; Guang-Zhong Xie; Ya-Dong Jiang; Xiao-Song Du
Year: 2008
Study on Stability of Equilibrium Point of Asymmetrical Internet Neural Network
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Dan Qi; Jian-Ping Li
Year: 2008
Exponentially Stable Conditions of Parametric Uncertainty Impulsive Switched Systems with Time Delay
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Zi-Xin Liu; Shu Lv; Shou-Ming Zhong; Mao Ye
Year: 2008
Global Exponential Stability for Impulsive Cellular Neural Networks with Discrete and Distributed Time-Varying Delays
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Ze-Ying Xiang; Shou-Ming Zhong; Hao Luo
Year: 2008
Design and Application of Wireless Sensor Networks for Ground Verification of Remote Sensing
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Yu Tian; Bo Gao; Ling Tong
Year: 2008
Modeling for Logistics System
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Xiu-Qing Liu; Liang Sun
Year: 2008
The Innovation Design of the Centrifugal Grinding Machine
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Hai-Xia Zhao; Ji-Qing Xu; Shou-Cheng Wang
Year: 2008
Multi-Agent and Hybrid Genetic Algorithm Approach for Distributed Jobshop Scheduling
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Yan-Hong Wang; Hong Li; Hong-Wei Liu
Year: 2008
The Research and Development as Well as Industrialization of Power Train Control Unit based on Changan Hybrid Electric Vehicle
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Lin Fu; Jin-Qiang Yu; Hong Xiao
Year: 2008
Closed-form analysis for performance evaluation of soft handoff
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:S.D. Roy; A. Chandra
Year: 2008
Enhancing enterprise network management using SMART
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:P. Saravanan; E. Reuter; S. Verma
Year: 2008
Decentralized control of a multivariable flow-level plant based on robust control approach
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Y. Kouhi; B. Labibi; A. Fatehi; R. Adlgostar
Year: 2008
Area of vulnerability for prediction of voltage sags by an analytical method in indian distribution systems
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:A.K. Goswami; C.P. Gupta; G.K. Singh
Year: 2008
A simple approach to space vector pwm signal generation for a five-phase voltage source inverter
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:A. Iqbal; M.A. Khan
Year: 2008
Design and rating issues of power components in active power filters
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:S.P. Singh; R.K. Tripathi
Year: 2008
Fuzzy logic based supervision of DC link PI control in a DSTATCOM
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:H. Suryanarayana; M.K. Mishra
Year: 2008
Extended H2, H and pole placement LMI characterization for continuous-time systems
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:M. Farhoodi; M.T.H. Beheshti
Year: 2008
Lateral stability of a typical nose landing gear using torsional magneto-rheological (MR) damper
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:S. Bandaru; D.K. Maiti
Year: 2008
Repetitive controller for periodic disturbance rejection in motor-gear transmission system
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:G.R. Sangeetha; J. Jacob
Year: 2008
Cost minimization and its realization on induction motor design via SPEED/PC-IMD
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:C.T. Raj; S.P. Srivastava; P. Agarwal
Year: 2008
Performance analysis of an inverter fed three phase Syn-RM drive
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:N. Ur Rahman; A. Iqbal
Year: 2008
Simulation study on DTC based induction motor drives using MATLAB
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:P.R. Tripathy; B.P. Panigrahi
Year: 2008
An interactive GUI for a dual-robot command console
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:A. Banerji; M. Tabassum; D. Venkatesh; M. Singh
Year: 2008
Multiple-model control of pH neutralization plant using the SOM neural networks
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:P. Bashivan; A. Fatehi; E. Peymani
Year: 2008
Coupled neutronics-thermal hydraulics model of Advanced Heavy Water Reactor for control system studies
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:S.R. Shimjith; A.P. Tiwari; B. Bandyopadhyay
Year: 2008
Biased model reduction of discrete interval system by differentiation technique
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:N. Pappa; T. Babu
Year: 2008
A novel automatic method for multivariable process pairing and control
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:M.-A. Moezzi; A. Fatehi; M.A. Nekoui
Year: 2008
Mobile telephony based secured society an anti-terrorism attempt
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:J. Chakraborty; M. Chakraborty
Year: 2008
USIng mobile devices for educational services-a case study of student expectations
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:K. Nagi
Year: 2008
Modified auto-calibration for 3D reconstruction from multiple views of an object
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:S. Sengupta; S. Das
Year: 2008
Synthesis of carry select adder in 65 nm FPGA
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:R. Yousuf; Najeeb-ud-din
Year: 2008
Impact of runtime leakage reduction techniques on delay and power sensitivity under effective channel length variations
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:S. Roy; A. Pal
Year: 2008
Overload minimization approach for Transmission Expansion Planning using Genetic Algorithm
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Y. Pradeep; V.S.K. Murthy; S.A. Khaparde
Year: 2008
Effect of congestion and voltage security on pricing in deregulated environment
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:M. De
Year: 2008
Comparative study of fast output sampling feedback and relay free sliding mode controllers for power system stabilizer
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:V. Deepa; S.J. Mija
Year: 2008
Ultra-wideband variable signal generator using series shunt switch
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:A. Marzuki; T.T. Khor; Z. Sauli; A.Y.M. Shakaff
Year: 2008
CAG: A Component Architecture Graph
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:A. Kanjilal; S. Sengupta; S. Bhattacharya
Year: 2008
Constrained filter-based fundamental frequency tracking in power systems
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:K. Arya; C. Vijaykumar
Year: 2008
Analytical performance evaluation of an OFDM system in the presence of carrier frequency offset, phase noise and timing jitter
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:S. Mallick; I. Ahmed; S.P. Majumder
Year: 2008
Transient stability comparision of 3F and 6F systems for single & three pole switching
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:K. Raghuram; M. Padmalalitha; S. Sreedhar; O. Hemakesavulu
Year: 2008
Improved performance with novel utility functions in a game-theoretic model of medium access control in wireless networks
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:D.K. Sanyal; M. Chattopadhyay; S. Chattopadhyay
Year: 2008
The Experimental System of Gas Hydrates Integrative Simulation and its control module
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Fulong Ning; Guosheng Jiang; Xiang Wu; Ling Zhang; Bin Dou; Bing Li; Jian'an Guan
Year: 2008
Neural network based handwritten numeral recognition of Kannada and Telugu scripts
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:S.V. Rajashekararadhya; P.V. Ranjan
Year: 2008
A bandwidth efficient channel estimation method using superimposed training for MIMO-OFDM systems
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:J.P. Nair; R.V. Raja Kumar
Year: 2008
Two dimensional magnetic and thermal analysis of high speed switched reluctance motor using soft magnetic composite material
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:K. Vijayakumar; R. Karthikeyan; G.K. Sathishkumar; R. Arumugam
Year: 2008
Design of initial conditions based sliding mode controller for buck converter
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:R. Anasraj; S. Thomas
Year: 2008
Microcontroller based receiver stimulator for auditory prosthesis
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:K.R. Kumar; P.S. Ramaiah
Year: 2008
StegoHunter: Passive audio steganalysis using Audio Quality Metrics and its realization through genetic search and X-means approach
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:S. Geetha; S.S.S. Sindhu; N. Kamaraj
Year: 2008
D.C. motor speed controller design through a colony of honey bees
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:K. Sundareswaran; V.T. Sreedevi
Year: 2008
Novel First-order and Second-Order Current Mode filters using dual-output OTAs and Grounded capacitors
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:D.V. Kamat; P.V. Ananda Mohan; K. Gopalakrishna Prabhu
Year: 2008
Performance improvement of basic particle swarm optimization algorithm by Lyapunov function modeling of fitness function
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:A. Acharya; A. Banerjee; K. Chattopadhyay
Year: 2008
Designing low power ad-hoc 802.11 wireless networks for voice and video applications
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:V.K. Khanna
Year: 2008
Efficiency improvement of synchronous buck converter by new passive auxiliary circuit
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:S. Pattnaik; A.K. Panda; K.K. Mahapatra
Year: 2008
Design of active RC variable equalizers
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:T.S. Rathore; U.P. Khot
Year: 2008
Performance of a clustering algorithm for high density wireless sensor networks
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Shudong Fang; S.M. Berber; A.K. Swain
Year: 2008
Unsupervised pixel classification in satellite imagery using a new multiobjective symmetry based clustering approach
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:S. Saha; S. Bandyopadhyay
Year: 2008
Accelerated exploration Particle Swarm Optimizer-AEPSO
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:S.L. Sabat; L. Ali
Year: 2008
Improved performance irregular quasi-cyclic LDPC code design from BIBD’s using threshold minimization
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:S.R. Patil; S.S. Pathak
Year: 2008
Design of cosine modulated filterbank transmultiplexer for unknown channels using genetic algorithm
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:V.J. Manoj; E. Elias
Year: 2008
Reduction of power consumption in sensor network applications using machine learning techniques
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:G.M. Shafiullah; A. Thompson; P.J. Wolfs; S. Ali
Year: 2008
A new L-shape 2-dimensional angle of arrival estimation based on Propagator Method
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:P. Palanisamy; A. Raghu Nandan
Year: 2008
Development and evaluation study on GMPLS peer model to realize optical quality control
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:A.S. Mohamad; S. Asano
Year: 2008
Dynamic simulation of brushless DC drive considering phase commutation and backemf waveform for electromechanical actuator
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:B.I. Rani; A.M. Tom
Year: 2008
PROJECT GRAMS: A graphical reconfigurable architecture MIPS simulator
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:P.I. Bautista; A. Cruz; A.C. Rio; J.A. Reyes
Year: 2008
Cycle based architecture simulation environment framework (MICS) and its optimization
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:T. Miyoshi; N. Sugino
Year: 2008
Stratified agent architecture for on-board mission planning and execution for an autonomous spacecraft
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:A. Indra; V.K. Agrawal; V.V.S. Sarma
Year: 2008
Locomotion interface to the virtual environment to acquire spatial knowledge
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:K.K. Patel; S.K. Vij
Year: 2008
Automatic courtesy amount recognition for Indian banks’ checks
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:L. Chandra; R. Gupta; P. Kumar; D. Ganotra
Year: 2008
A new adaptive marker for bandwidth fairness between TCP and UDP traffic in DiffServ
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:S. Sudha; S. Maddipati; N. Ammasaigounden
Year: 2008
Cross-layer design using multi-channel system in WiMAX mesh networks
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:A. Al-Hemyari; Chee Kyun Ng; N.K. Noordin; A. Ismail; S. Khatun; S.S. Jamuar
Year: 2008
Generalization of an instantaneous frequency estimator based on the higher order differential energy operator
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Byeong-Gwan Iem
Year: 2008
A novel approach to design a Wireless Communication based Railway Information System
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:V. Kumar; S.K. Patra; S. Mishra
Year: 2008
DSP technique for gene and exon prediction taking complex indicator sequence
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:M.K. Hota; V.K. Srivastava
Year: 2008
Tunable band pass Gm-C filter with switched transconductance cells
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:S. Ramasamy; B. Venkataramani; S.M. Stalin; K. Venkatachalam
Year: 2008
IEEE TENCON - 2008 Modernizing a legacy system to SOA - Feature analysis approach
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:P. Vemuri
Year: 2008
Design of an Automated Essay Grading (AEG) system in Indian context
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:S. Ghosh; S.S. Fatima
Year: 2008
PMU based power system stability analysis
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:B.B. Monchusi; Y. Mitani; L. Changsong; S. Dechanupaprittha
Year: 2008
Control of grid connected PV cell distributed generation systems
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:J.N. Reddy; M.K. Moorthy; D.V.A. Kumar
Year: 2008
Multi-threshold CMOS design for low power digital circuits
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:S. Hemantha; A. Dhawan; Haranath Kar
Year: 2008
An efficient partial key pre-distribution scheme for chain oriented sensor networks
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Q.E.K. Mamun; S. Ramakrishnan; B. Srinivasan
Year: 2008
An efficient implementation of synchronization algorithm for IEEE 802.16e on DSP
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:G. Potnis
Year: 2008
Estimation and mitigation of voltage and current harmonics in distribution systems
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:C. Venkatesh; D.S. Kumar; D.V.S. Sarma; M. Sydulu
Year: 2008
Majority filter-based minority prediction (MFMP): An approach for unbalanced datasets
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:T.M. Padmaja; P.R. Krishna; R.S. Bapi
Year: 2008
A new method for frame synchronization in OFDMA mode of WMAN
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:K. Pushpa; C.N. Kishore; Y. Yoganandam
Year: 2008
Methodology for thermal aware physical design
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:V.P. Kalangi; M.A. Kumar; P. Agrawal; R.S.T. Srinivasa; A. Pal
Year: 2008
A Solution to the Unit Commitment Using Hybrid Genetic Algorithm
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Wenping Chang; Xianjue Luo
Year: 2008
CMOS capacitive pressure sensor design and integration with RFID tag for biomedical applications
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:S.R. Munnangi; G. Haobijam; M. Kothamasu; R. Paily; R.S. Kshetrimayum
Year: 2008
DSTATCOM with BESS, an efficient means for flicker mitigation
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:V.B. Virulkar; M.V. Aware
Year: 2008
A low-power ternary content addressable memory (TCAM) with segmented and non-segmented matchlines
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:M. Sultan; M. Siddiqui; Sonika; G.S. Visweswaran
Year: 2008
Artificial intelligence approach to test vector reordering for dynamic power reduction during VLSI testing
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:S. Roy; I. Sen Gupta; A. Pal
Year: 2008
Robust controller design for course changing / course keeping control of a ship using PSO enabled automated quantitative feedback theory
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:B. Satpati; I. Bandyopadhyay; C. Koley; S.K. Ojha
Year: 2008
A digital signal processing based bit synchronizer and novel hardware efficient lock detector circuit for bi-phase data for Chandrayaan-1 mission
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:S. Sharma; Sunil Kulkarni; V.K. Pujari; P. Lakshimnarsimhan
Year: 2008
A new technique for street noise reduction in signal processing applications
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:C.V. Rama Rao; M.B.R. Murthy; K.A. Sheela
Year: 2008
High speed architectural implementation of CORDIC algorithm
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:B. Lakshmi; A.S. Dhar
Year: 2008
Quantitative assessment of torque pulsation in inverter fed five-phase induction motor drive system
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:A. Iqbal; S. Moinuddin; S.M. Ahmed
Year: 2008
Three dimensional ultrasound image enhancement using local structure tensor analysis
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:J. George; S.P. Indu; K. Rajeev
Year: 2008
A novel PSO-IE3D based design and optimization of a low profile Dual Slot Microstrip Patch Antenna
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:R.N. Biswas; A. Kar
Year: 2008
Fractal apertures in waveguides and conducting screens
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:B. Ghosh; S.N. Sinha; M.V. Kartikeyan
Year: 2008
Delayed block LMS algorithm and concurrent architecture for high-speed implementation of adaptive FIR filters
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:B.K. Mohanty; P.K. Meher
Year: 2008
Variable Step Size (VSS) control for Circular Leaky Normalized Least Mean Square (CLNLMS) algorithm used in AEC
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:M.S. Kumar
Year: 2008
Master Data Management-CDI
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:S.D. Suram; R. Muppala
Year: 2008
A method to select programme slots for giving advertisements in different television channels
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:S. Bandyopadhyay; D. Dhal; R.K. Pal
Year: 2008
Keyword Spotting using Vowel Onset Point, Vector Quantization and Hidden Markov Modeling Based techniques
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:B.V.S. Reddy; K.V. Rao; S.R.M. Prasanna
Year: 2008
Design of real-time dDatabase for distribution automation systems
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Yinghui Xu; Xiaohui Xu
Year: 2008
Analysis of the LS estimation error for a MIMO system on a Rician fading channel
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:D.J. Vasanth Kumar; R. Bhattacharjee
Year: 2008
MOEP based design of PSS and FACTS for transient stability improvement under symmetrical and unsymmetrical fault conditions
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:T.R. Jyothsna; K. Vaisakh
Year: 2008
Integrated approach for short term load forecasting using SVM and ANN
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:A. Jain; B. Satish
Year: 2008
FPGA implementation of a new parallel routing algorithm
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:K. Fatima; R. Rao
Year: 2008
An efficient maximum likelihood CFO estimation scheme for MIMO-OFDM systems
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:S.M. Sameer; R.V.R. Kumar
Year: 2008
A logarithmic CMOS digital pixel sensor
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Chia-Nan Yeh; Yen-Tai Lai; Jui-Yu Chang
Year: 2008
Analysis and control of an autonomous hybrid wind-driven PM alternator and photovoltaic array without battery storage
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:H.H. Sait; S.A. Daniel; P.M. Babu
Year: 2008
Some observations on induction motor frequency characterizations under variable supply conditions
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:S. Das; P. Purkait; S. Chakravorti; A. Mukhopadhyay; A. Choudhury
Year: 2008
BiDIFS and CoDEBTS: Exploiting Compiler-Processor Interaction for Performance Enhancement
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:P. Aditya; P. Kulkarni
Year: 2008
Design and performance of optimized relay mappings
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:J. Karlsson; M. Skoglund
Year: 2008
An optical burst reordering model for a time-based burst assembly scheme
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:S. Gunreben
Year: 2008
Effect and optimization of burst assembly algorithms for video traffic transmissions over OBS networks
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:T.R. Vargas; J.C. Guerri; S. Sales
Year: 2008
Impact of burst assembly on TCP performance in hybrid wireless/OBS networks
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:A.M. Guidotti; K. Menendez Lago; C. Raffaelli
Year: 2008
Composite burst assembly with high-priority packets in the middle of burst
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:S. Sarwar; L. Wallentin; G. Franzl; H.R. van As
Year: 2008
Effect of path diversity on the loss performance of UDP packets over the internet
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:R. Haywood; Xiao-Hong Peng
Year: 2008
Variable neighbor selection in live peer-to-peer multimedia streaming networks
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:J. Ghosha; Miao Wang; Lisong Xu; B. Ramamurthy
Year: 2008
Cross-layer optimization and handover managements in next generation Mutlihomed networks
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Z. Jerjees; O. Raoof; H.S. Al-Raweshidy
Year: 2008
Traffic dynamic in modularity structure of complex networks.
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Suyong Eum; Shin'ichi Arakawa; Masayuki Murata
Year: 2008
Economic benefits of a community driven Fiber to the Home rollout
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:B. Lannoo; K. Casier; J. Van Ooteghem; B. Wouters; S. Verbrugge; D. Colle; M. Pickavet; P. Demeester
Year: 2008
A security framework for wireless sensor networks utilizing a unique session key
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Yong Wang; B. Ramamurthy; Yuyan Xue; Xukai Zou
Year: 2008
A Minimum Distance guided Genetic Algorithm for Multi-User Detection in a Multi-Carrier CDMA wireless broadband system
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Qiang Ni; J. Jehanzeb; Yang Zhang; Sheng-Uei Guan
Year: 2008
Computerized modelling of hybrid energy system— Part I: Problem formulation and model development
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:A. Gupta; R.P. Saini; M.P. Sharma
Year: 2008
Self-excited single-phase and three-phase induction generators in remote areas
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:M.H. Haque
Year: 2008
Bioinformatics web data and service integration - An experiemnt with Gene Regulatory Networks
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:E. Ahmed
Year: 2008
Synthesis of CMOS OTA based communication circuit
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:A. Roy; S. Mandal; B.N. Ray; P. Ghosh
Year: 2008
Advances on IPM Technology for Hybrid Cars and Impact in Developing Countries
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:M.A. Rahman
Year: 2008
RF MEMS tunable filter: Design, simulation and fabrication process
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:F. Islam; M.A.M. Ali; B.Y. Majlis; N. Amin
Year: 2008
An analysis of electric fields developed inside microchannels of microfluidic devices
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:B.I. Morshed; M. Shams; T. Mussivand
Year: 2008
Effects of uniaxial strain on the bandstructures of silicon nanowires
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:R.N. Sajjad; K. Alam; Q.D.M. Khosru
Year: 2008
Highly oriented carbon nanotubes by chemical vapor deposition
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:S.M. Mominuzzaman; I. Khatri; Zhang Jianhui; T. Soga; T. Jimbo
Year: 2008
Phase noise reduction in CMOS LC oscillators using tail noise shaping and Gm3 boosting
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:K. Jainwal; J. Mukherjee
Year: 2008
An improved method of highly accurate supply detection using bandgap reference circuit and its implementation in a pseudo BiCMOS process
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:M. Ryadh; K. Zakir; M. Hafiz; A.B.M.H. Rashid
Year: 2008
Evaluation of optimum capacity and location of east west interconnector using tie line planning approach
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:A.H. Chowdhury; Q. Ahsan
Year: 2008
InN-based dual channel high electron mobility transistor
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:M.T. Hasan; M.M. Rahman; A.N.M. Shamsuzzaman; M.S. Islam; A.G. Bhuiyan
Year: 2008
Functional device design using nonuniform gate voltage: Analytical model of a novel MOSFET
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:S. Shembil
Year: 2008
Very deep nanoscale domain inversion in LiNbO3 for high-power and high-efficiency SHG devices
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:M.S. Islam; M. Minakata
Year: 2008
Optimum design of a dispersion managed photonic crystal fiber for nonlinear optics applications in telecom systems
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:S.M.A. Razzak; M.A.G. Khan; Y. Namihira; M.Y. Hussain
Year: 2008
InxGa1-xN based multi junction concentrator solar cell
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:M.S. Islam; A.K.M. Zillur Rahman; M.A.R. Chowdhury; M.R. Islam; A.G. Bhuiyan
Year: 2008
A 7-segment display for Bangla, english and other Indian numerals
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:M.M. Islam; M.K. Hossain; K.S. Hasan; A.L. Haque
Year: 2008
A proposal for a generic multimedia framework with a view to facilitate easy middleware development
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:S.P. Kamat
Year: 2008
Application of artificial neural network in social computing in the context of third world countries
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:M.S. Bayzid; A. Iqbal; C.S. Hyder; M.T. Irfan
Year: 2008
Performance comparison of fuzzy queries on fuzzy database and classical database
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:A.H.M. Hoque; M.S. Ali; M. Aktaruzzaman; S.K. Mondol; B. Islam
Year: 2008
A solution to the security issues of an e-government procurement system
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:M.S. Islam; S. Dey; G. Kundu; A.S.M. Hoque
Year: 2008
A sensor-less adaptive rotor parameter estimation method for three phase induction motor
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:R. Mikail; K.M. Rahman
Year: 2008
Lightning surge impedance measurement on control building using Electromagnetic Transient Program
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:M. Rahman; M.O. Goni; K. Mitobe; M. Suzuki
Year: 2008
Monte-Carlo and recency-weighted learning methods for conjectural variations in dynamic power markets
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:P.N. Vali; A.R. Kian
Year: 2008
Research for data acquisition equipment with Micro-Grid system
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Tae-young Lee; Kwang-ho Ha; Hyun-jea Yoo; Jong-wan Seo; Myong-chul Shin
Year: 2008
Modified physical configuration to compensate parasitic effects in high speed systems
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:S. Bin Abul Kashem; S. Raju; M.I. Raza
Year: 2008
Improved VLSI circuit performance using localized power decoupling
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:L.S. Sraboni; O. Mohaimen; R.H. Mustazir; S.M. Salahuddin; M.I. Raza
Year: 2008
Dual beam phased array antenna with wide scan angle for repeater applications
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:A.U. Zaman; L. Manholm; A. Derneryd
Year: 2008
Calibrated_Time-Frequency_MUSIC method for direction of arrival measurement of pilot signals
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:A.K.M. Baki; K. Hashimoto; N. Shinohara; T. Mitani; M. Matsumoto; H. Matsumoto
Year: 2008
Stacked multiple slot microstrip patch antenna for wireless communication system
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:M.T. Islam; N. Misran; M.N. Shakib; B. Yatim
Year: 2008
Rain fade analysis on earth-space microwave link in a subtropical region
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:M.R. Islam; M.A. Rahman; S.K.E. Hossain; M.S. Azad
Year: 2008
Design, simulation and fabrication of a microstrip patch antenna for dual band application
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:F. Islam; M. Ali; B.Y. Majlis; N. Misran
Year: 2008
Comparison of photoresponse characteristics between nitrogen and phosphorous doped n-C/p-Si heterostructure
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:A.T. Rasin; S.M. Mominuzzaman
Year: 2008
A set of stabilizing PD controllers for multi-input-multi-output systems
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:G. Leena; K.B. Dutta; G. Ray
Year: 2008
Cognitive-based teaching of power electronics
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:M.H. Rashid
Year: 2008
Noise optimized minimum delay spread equalizer design for DMT transceivers
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:T. Islam; S.P. Majumder; M.K. Hasan
Year: 2008
Effect of 3 wt.% Bi in Sn-Zn solder on the interfacial reaction with the Au/Ni metallization in microelectronic packaging
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:M.O. Haque; A. Sharif
Year: 2008
Design, simulation and application of a novel compound MOSFET for emerging CMOS technology
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:S. Binzaid; J.O. Attia
Year: 2008
Design of smart card for automated toll collection at Jamuna Multipurpose Bridge in Bangladesh
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:A. Rahman; S. Azad; F. Anwar; R. Islam
Year: 2008
A Grid Resources Pricing Model based on Financial Options Concept
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:R.K. Thulasiram
Year: 2008
Extension of Max-Min Ant System with Exponential Pheromone Deposition Rule
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:A. Acharya; D. Maiti; A. Banerjee; R. Janarthanan; A. Konar
Year: 2008
Study and Performance Evaluation of P2P Networking in Context of Satellite Image Processing
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:N. Dube; R. Ramakrishnan; K.S. Dasgupta
Year: 2008
Virtual Cluster Development Environment for grids
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:S.T. Selvi; R. Kumar; P. Balakrishnan; R.A. Balachandar; K. Rajendar; R. Rajiv; G. Kannan; E. Mahendran; B. Madhusudhanan; G.R. Britto
Year: 2008
Protocols for Objects with Multiple RFID Tags
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:G. Kapoor; S. Piramuthu
Year: 2008
Limitations of Web Service Security on SOAP Messages in a Document Production Workflow Environment
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:S.K. Sinha; S. Sinha
Year: 2008
Stego-Breaker: Defeating the Steganographic Systems through Genetic-X-Means approach using Image Quality Metrics
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:S. Geetha; S. Sindhu; N. Kamaraj
Year: 2008
Trends of Power Electronic Packaging and Modeling
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Yong Liu; S. Irving; T. Luk; D. Kinzer
Year: 2008
Glass as a Substrate for High Density Electrical Interconnect
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Xiaoyun Cui; D. Bhatt; F. Khoshnaw; D.A. Hutt; P.P. Conway
Year: 2008
Incorporation of π-conjugated Molecular Wires into Anisotropic Conductive Adhesive for High-performance Interconnection Applications
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Rongwei Zhang; Kyoung Sik Moon; Wei Lin; Hongjin Jiang; C.P. Wong
Year: 2008
Solving Technical and Economical Barriers to the Adoption of Through-Si-Via 3D Integration Technologies
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:E. Beyne
Year: 2008
Through Silicon Vias Technology for CMOS Image Sensors Packaging: Presentation of Technology and Electrical Results
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:D. Henry; J. Charbonnier; P. Chausse; F. Jacquet; B. Aventurier; C. Brunet-Manquat; V. Lapras; R. Anciant; N. Sillon; B. Dunne; N. Hotellier; J. Michailos
Year: 2008
Low Cost Lithography Solution for Advanced Packaging and Application to Through Silicon Via Process
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:F. Jacquet; D. Henry; J. Charbonnier; N. Bouzaida; N. Sillon; C. Tsai; C. Balut; J.S. Raine
Year: 2008
Statistical and Evolutionary Techniques for Efficient Electrical Design Space Exploration
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:B. Mutnury; N. Singh; N. Pham; M. Cases
Year: 2008
Signal Power Integrity and Design Consideration in Package Modeling
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Jin Zhao; E.K. Chan
Year: 2008
Crosstalk and Switching Noise Mechanism Study in High Density Wire-bond FPGA Device
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Siow Chek Tan; Yee Huan Yew; Hong Shi
Year: 2008
Recent Development of Nano-solder Paste for Electronics Interconnect Applications
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:J. Liu; C. Andersson; Yulai Gao; Qijie Zhai
Year: 2008
Matte Tin (Sn) Plating of Semiconductor Devices - Update of Whisker Growth Study
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:A. Sriyarunya; J. Tondtan; H. Tukiman
Year: 2008
Process Challenges for Realization of High Quality Roller Embossing for Patterning Large Area Green Ceramic Substrates
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Y.C. Soh; Xuechuan Shan; C.W. Lu
Year: 2008
Chemical Transfer of in-situ Functionalized Aligned Carbon Nanotube Structures for Microelectronic Packaging Applications
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Wei Lin; Rongwei Zhang; Kyoung-Sik Moon; C.P. Wong
Year: 2008
Meeting Green Computing Challenges
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:D. Wang
Year: 2008
First-principles Investigation of the Structural and Electronic Properties of Cu Based Intermetallics
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:A. Chatterjee
Year: 2008
Signal Delay Based Temperature Determination for Production Testing of Advanced Packages
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:J. Jayabalan; S. Ahmad; N. Khan
Year: 2008
Stepped Die Packaging
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Chua Swee Kwang; Neo Yong Loo
Year: 2008
Plastic Packaging Using Low Frequency Induction Heating (LFIH) For Microsystems
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:B.J. Knauf; D.P. Webb; C. Liu; P.P. Conway
Year: 2008
Laser Assisted Solder Bump Mold Fabrication
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Yong-Jin Lim; Seoung-Ho Jung; S.-i. Park; Jung-Su Choi; Eun-Youl Choi; Chung-Tae Kim
Year: 2008
Contactless Component Handling on PCB Using EWOD Principles
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:T. Braun; K.-F. Becker; M. Koch; E. Jung; J. Lienemann; J.G. Korvink; R. Kahle; J. Bauer; R. Aschenbrenner; H. Reichl
Year: 2008
Pareto-Optimal Die Orientations for 3-D Stacking of Identical Dies
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:A. Deshpande; V. Natarajan; J. Methani
Year: 2008
Managing Losses in Through Silicon Vias with Different Return Current Path Configurations
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:B. Curran; I. Ndip; S. Guttovski; H. Reichl
Year: 2008
Advanced Metallization for 3D Integration
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:R. Beica; P. Siblerud; C. Sharbono; M. Bernt
Year: 2008
Fabrication of Die Embedded Substrate and Mechanical Stress Evaluation at Active Area of the Embedded Die
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Doohwan Lee; Seunggu Kim; Moonil Kim; Onecheol Bae; Kwankyu Kim; Hoshik Kang
Year: 2008
Mesh Interconnects for Silicone Embedded Stretchable Silicon Electronics
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:S. Sosin; T. Zoumpoulidis; M. Bartek; L. Wang; K.M.B. Jansen; L.J. Ernst
Year: 2008
A new Embedded Packaging Technology for high power LEDs
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:M. de Samber; T. v. d. Ackerveken; M. Burghoom; N. Bruinsma; E. van Grunsven
Year: 2008
Embedded Leadless Chip Carrier
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:L.A. Lim; M. Ramkumar
Year: 2008
Parametric Analysis of Embedded EBG Structures for Noise Suppression Applications
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Y.T. Ng; L.L. Wai; W. Fan; P.W. Gian; H. Lu; A.C.W. Lu
Year: 2008
Adhesion of Thermoplastics to Materials used in Electronics (Tin)
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:H. Abhyankar; D.P. Webb; D.A. Hutt; G. West
Year: 2008
Mechanical Performance of Polymer Cored BGA Interconnects
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:F.G. Marin; D. Whalley; H. Kristiansen; Z. Zhang
Year: 2008
40μm Die Strength Characterization
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Lem Tien Heng; Cheong Choke Fei; S. Subaramaniym
Year: 2008
Advanced Opportunity Cost Analysis of 3D Packaging Technologies
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:C.E. Bauer; H.J. Neuhaus
Year: 2008
Thermal and Hydraulic Design and Characterization of a Liquid-Cooled 3D Silicon Module
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:S.P. Tan; K.C. Toh; N. Khan; Tang Gong Yue; P. Damaruganath; K. Vaidyanathan; J.H. Lau
Year: 2008
Stacked Thermoelectric Generator Module Integrated with Partial Electric Conducted Interposer Structure
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Chung-Yen Hsu; Chun-Kai Liu; Heng-Chieh Chien; Sheng-Liang Kuo; Chih-Kuang Yu
Year: 2008
3D Integration-Present and Future
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:T. Jiang; Shijian Luo
Year: 2008
Development of Fine Pitch Solder Microbumps for 3D Chip Stacking
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Aibin Yu; A. Kumar; Soon Wee Ho; Hnin Wai Yin; J.H. Lau; Khong Chee Houe; S. Lim Pei Siang; Xiaowu Zhang; Da-Quan Yu; Nandar Su; M. Chew Bi-Rong; Jong Ming Ching; Tan Teck Chun; V. Kripesh; C. Lee; Jun Pin Huang; J. Chiang; S. Chen; Chi-Hsin Chiu; Chang-Yueh Chan; Chin-Huang Chang; Chih-Ming Huang; Cheng-Hsu Hsiao
Year: 2008
Low-Temperature 3D Chip-Stacking Using Compliant Bump
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:N. Watanabe; T. Mori; T. Asano
Year: 2008
Temporary Bonding of Wafer to Carrier for 3D-Wafer Level Packaging
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:M.H. Shuangwu; D. Pang; S. Nathapong; P. Marimuthu
Year: 2008
Challenges for Multi-Scale Modeling of Multiple Failure Modes in Microelectronics Packaging
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:J. Auersperg; R. Dudek; D. Vogel; B. Michel
Year: 2008
Design and Optimization of Bump Structures of Large Die Fine Pitch Copper/Low-k FCBGA and Copper Post Interconnections
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:K. Biswas; Shiguo Liu; Xiaowu Zhang; T.C. Chai
Year: 2008
Finite Element Analysis of Alternating Phase-Shift Masks Subjected to Dynamic Pressure Loading Due to Megasonic Cleaning
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:X. Yin; K. Komvopoulos
Year: 2008
Wafer Level ACA Packages and their Applications to Advanced Electronic Packaging
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Kyung-Wook Paik; Ho-Young Son; Il Kim; Chang-Kyu Chung
Year: 2008
Low K CMOS65 Ball Grid Array 40μm Pitch Wire Bonding Process Development
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Ming-chuan Han; Bei-yue Yan; Hai-yuan Zhang; J.Z. Yao; J. Li
Year: 2008
A Study of Lead-Free BGA Backward Compatibility Through Solderability Testing at Component Level
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Eu Poh Leng; Wong Tzu Ling; N. Amin; I. Ahmad
Year: 2008
Ultrasonic Bonding of Die Attach Film (DAF)-Laminated Thin Silicon Dies on Glass Substrates at Room Temperature
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Sui Yin Wong; Ho Chi Wong; Siu Wing Or; Yiu Ming Cheung; Ping Kong Choy
Year: 2008
Epoxy Die Attach Challenges in Miniature and Compact DFN / QFN Packages
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Chin Lap Sin; Tan Chee Eng; M.S. Amiruddin; Tan Seng Lee
Year: 2008
Non-metallic Bonding Tool Technique; A Key Input Control for Contamination in Ultrasonic Wirebonding Process
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:R.L. Villanueva; I.C.B. Barias; M.A.S. Rosel; G.R. Nuneza
Year: 2008
Effect of Ni Layer Thickness on Intermetallic Formation and Mechanical Strength of Sn-Ag-Cu Solder Joint
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:K. Pun; Poh Leng Eu; M.N. Islam; C.Q. Cui
Year: 2008
Effect of Stand-Off Height on Microstructure and Tensile Strength of Cu/Sn9Zn/Cu Solder Joint
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Fengshun Wu; Bo Wang; Bin Du; Bing An; Yiping Wu
Year: 2008
In-Situ Optical Creep Observation and Constitutive Modelling of Joint-Scale SAC Solder Shear Samples
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:D. Herkommer; M. Reid; J. Punch
Year: 2008
Creep Properties of Sn3wt%Ag0.5wt%Cu0.019wt%Ce (SACC) Lead-Free Solder
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Kok Ee Tan; Xu Luhua; J.H.L. Pang; J.H. Lau; X.W. Zhang
Year: 2008
Thermal Management Technologies for Electronic Packaging: Current Capabilities and Future Challenges for Modelling Tools
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:C. Bailey
Year: 2008
Analysis of Thermal Performance of High Power Light Emitting Diodes Package
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Wei-Hao Chi; Tsung-Lin Chou; Cheng-Nan Han; Kuo-Ning Chiang
Year: 2008
Role of Melt Convection on the Thermal Performance of Heat Sinks with Phase Change Material
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:S.K. Saha; P. Dutta
Year: 2008
Optimization of the Thermal Performance of Microchannel Heat Sinks Using Thermally Developing Nusselt Number Correlation
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:P.S. Lee; S.K. Chou; Y.J. Lee
Year: 2008
An Investigation Concerning the Diffusion Of Elements in Sn-Ag3.8-Cu0.7 and Sn-Pb36-Ag2 on Electrolytic Ni-Au Pads during Pre-Pack Thermal Aging
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:R. Vemal; M. Hamdi
Year: 2008
Determination of Mechanical Material Properties of Joining Materials, in particular Microelectronic Solders
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:W.H. Muller; H. Worrack; J. Sterthaus; J. Wilden; J. Villain
Year: 2008
Fluxless Flip-Chip Bonding Process Using Hydrogen Radical
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:T. Hagihara; T. Takeuchi; Y. Ohno
Year: 2008
Design, Assembly and Reliability of Large Die (21 x 21mm2) and Fine-pitch (150pm) Cu/Low-K Flip Chip Package
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Y.Y. Ong; K. Vaidyanathan; S.W. Ho; V.N. Sekhar; M.C. Jong; L.C. Wai; V.S. Rao; V. Sheng; J. Ong; X. Ong; X. Zhang; Y.U. Seung; J. Lau; Y.K. Lim; D. Yeo; K.C. Chan; Z. Yanfeng; J.B. Tan; D.K. Sohn
Year: 2008
A New process for Flip-chip Interconnections with Variable Stand-offs
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:O.S. Kessling; F. Schussler; K. Feldmann; T.C. Lueth
Year: 2008
Measurement of Temperature Distribution in SnAg3.5 Flip-Chip Solder Joints during Current Stressing Using Infrared Microscopy
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Hsiang-Yao Hsiao; Chih Chen
Year: 2008
Inspection of Miniaturised Interconnections in IC Packages with Nanofocus ® X-Ray Tubes and NanoCT
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:H. Roth; Z. He; T. Paul
Year: 2008
Calibrate MOSFET Micro-Stress Sensors for Electronic Packaging
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Hsien Chung; Chun-Pai Tang; Yung-Ching Chao; Kun-Fu Tseng; Ben-Je Lwo
Year: 2008
A Method of Fabricating Bump-Less Interconnects Applicable to Wafer-Scale Flip-Chip Bonding
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Y. Yamaji; T. Yokoshima; N. Igawa; K. Kikuchi; H. Nakagawa; M. Aoyagi
Year: 2008
Camera Module Design, Assembly and Test Challenges
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Jing-en Luan; X. Baraton; Wingshenq Wong; Kim-yong Goh; D. Yap
Year: 2008
Solder Stencil Printing On Deep Cavity
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:E.A. Cabahug; M.D. Bartolo
Year: 2008
A New Creep Model for SnAgCu Lead-Free Composite Solders: Incorporating Back Stress
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Y.D. Han; H.Y. Jing; S.M.L. Nai; C.M. Tan; J. Wei; L.Y. Xu; S.R. Zhang
Year: 2008
Finite Element Based Solder Joint Fatigue Life Predictions for MLPQ Packages
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Y.S. Ng; S.K. Chin; Rosazlan
Year: 2008
Effect of Voids on the Thermal Fatigue Reliability of PBGA Solder Joints through Submodel Technology
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Zhou Bin; Qiu Baojun
Year: 2008
Studies on the Thermal Cycling Reliability of Fine Pitch Cu/SnAg Double-Bump Flip Chip Assemblies on Organic Substrates: Experimental Results and Numerical Analysis
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Ho-Young Son; Kyung-Wook Paik; Ilho Kim; Jin-Hyoung Park; Soon-Bok Lee; Gi-Jo Jung; Byung-Jin Park; Kwang-Yoo Byun
Year: 2008
Acoustic Limitations in Notebook Thermal Design
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:E. Baugh
Year: 2008
Control of Droplet Formation in Inkjet Printing Using Ohnesorge Number Category: Materials and Processes
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Jiayan Tai; Hiong Yap Gan; Yen Nan Liang; Boon Keng Lok
Year: 2008
The Materials Science of Ballbonding: A Brief Overview
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:C.D. Breach; F.W. Wulff
Year: 2008
TEM Microstructural Analysis of As-bonded Copper Ball Bonds on Aluminum Metallization
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Hui Xu; Changqing Liu; V.V. Silberschmidt; Zhong Chen
Year: 2008
2N Wire for Ultra Fine Pitch Wire Bonding: Challenges & Solutions
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:June Sub Hwang; B.S. Kumar; Jeong Tak Moon; Chul Uhm; Yu Na Kim; M. Sivakumar; J. Song Keng Yew
Year: 2008
Bond Reliability Improvement at High Temperature by Pd Addition on Au Bonding Wires
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:M.A. Bahi; P. Lecuyer; A. Gentil; H. Fremont; J.-P. Landesman; F. Christien
Year: 2008
Interface Characterization and Failure Modeling for Semiconductor Packages
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:L.J. Ernst; A. Xiao; B. Wunderle; K. Jansen; H. Pape
Year: 2008
Development of Evaluation Approach for Delamination Considering Micro-Scale Interfacial Layer Structure between Resin and Silicon
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:T. Matsumoto; Qiang Yu; T. Shibutani; T. Matsuzaki
Year: 2008
Controlling Interfacial Interpenetration of Polymer Waveguide Deposited on Plasma Treated Flexible Substrate
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Tze Yang Hin; Changqing Liu; P.P. Conway; D.J. Scuff
Year: 2008
Design and Reliability in Wafer Level Packaging
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Xuejun Fan; Qiang Han
Year: 2008
Design and Development of Fine Pitch Copper/Low-K Wafer Level Package
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:V.S. Rao; Xiaowu Zhang; Ho Soon Wee; Hnin Wai Yin; C.S. Premachandran; V. Kripesh; Seung Wook Yoon; J.H. Lau
Year: 2008
Thermal-Electrical Co-simulation for Wafer-level Chip Scale Package Maximum Bearing Current
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Rui-Yu; Shu-Qiang Zhang; Chang-Lin Yeh; Chi-Sheng Chung; Chih-Pin Hung
Year: 2008
Patterned Metallic Nanowire Arrays Based Flip Chip Interconnects
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:G. Sharma; K. Vaidyanathan; J.H. Lau
Year: 2008
Fast-Cure Lid Adhesive Development for Microprocessors
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Kee-Hean Keok; S. Too; J. Diep; Quah Hong Tat; A. Fumihiro; Kim Le
Year: 2008
Joint Reliability of Double-Side Packaged SiC Power Devices to a DBC Substrate with High Temperature Solders
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Fengqun Lang; Y. Hayashi; H. Nakagawa; M. Aoyagi; H. Ohashi
Year: 2008
Joint Scale Dependence of Aging Kinetics in Sn-Ag-Cu Solders
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:P. Kumar; O. Cornejo; I. Dutta; G. Subbarayan; V. Gupta
Year: 2008
A Multi-physics Multi-scale Modeling Platform for Research and Development in Solid State Lighting
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Sheng Liu; Kai Wang; Zhiyin Gan; Zongyuan Liu; Zhaohui Chen; Han Yan; Xiaobing Luo; Wei Wei; Pei Wang
Year: 2008
Optical alignment of dual-axis MEMS based scanning optical probe for Optical Coherence Tomography (OCT) application
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Ahmad Khairyanto; C. S. Premachandran; Kelvin Chen W.S.; Janak Singh; Jayakrishnan Chandrappan; John H. Lau; Yingshun Xu
Year: 2008
Long Time Reliability of Cu Wire on Substrates with Al Based Metallisations
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:E. Milke; T. Mueller
Year: 2008
Reliability Results of 0.8 mil Fine Pitch Copper wire bonding on Immersion Gold Plated Pad for Copper Low-k Devices
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Leong Ching Wai; Xiaowu Zhang; V. Kripesh; C.S. Premachandran; S.C. Chong; Ying Ying Liu; J. Madhukumar; V.R. Srinivas; P.P. Thaw; M.J. Jong; J.H. Lau; S. Wang; C.K. Foo; M.L. Thew; E.P.P. Myo; W.L. Teo
Year: 2008
Focused Heat Treatment after Bonding for Cu Wire Bond Reliability Improvement
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Y.K. Yun; E.P. Leng
Year: 2008
Stack Bonding Technique Using Heavy Aluminum Ribbon Wires
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:E.I.V. Almagro; H.T. Granada
Year: 2008
Process Development for Realization of Embedded Structures in Multi-Layer Ceramics Platform using Carbon Fugitive Material
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Y.M. Tan; L.E. Khoong; Y.C. Lam; S.C. Tan; R. Paramasivam
Year: 2008
Embedded Wafer Level Ball Grid Array (eWLB)
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:T. Meyer; G. Ofner; S. Bradl; M. Brunnbauer; R. Hagen
Year: 2008
Band Pass Filter Design and Optimization on High-Resistivity Silicon for 5GHz RF Front End Receiver
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Zhou Jinchang; Xiao Xianghua; Liu Shiguo; K. Nagaya; Y. Tsuchiya; Y. Mano; Khoo Yee Mong; Li Hongyu
Year: 2008
Electrical Characterization of Interconnect in High-Performance BGA Packages
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Weiliang Yuan; Chuen Khiang Wang; Wenhui Zhu; Guang Zhao
Year: 2008
Package Design Optimization for Electrical Performance of a Power Module using Finite Element Analysis
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:I.V.A. Erwin; Seung-Han Paek; Taek-Keun Lee
Year: 2008
FCPBGA with SOP Pad Finishing A Study of Lead-Free Solder Ball Attach Improvement
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Eu Poh Leng; Wong Tzu Ling; N. Amin; I. Ahmad
Year: 2008
The Superior Drop Test Performance of SAC-Ti Solders and Its Mechanism
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Weiping Liu; P. Bachorik; Ning-Cheng Lee
Year: 2008
Effect of SAC Alloy Composition on Drop and Temp cycle Reliability of BGA with NiAu Pad Finish
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:W. Kittidacha; A. Kanjanavikat; K. Vattananiyom
Year: 2008
Study on Board Level Drop Reliability of Wafer Level Chip Scale Package with Leadfree Solder
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Zhang Xueren; Zhu Wenhui; P. Edith; Tan Hien Boon
Year: 2008
A Comprehensive Test Method for Bridging the Gap between Product and Board Level Drop Tests
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:S.K.W. Seah; E.H. Wong; C.S. Selvanayagam; J.F.J. Caers; W.D.V. Driel; N. Owens; Y.-S. Lai
Year: 2008
Electrical Interconnect Design Optimization for Fully Embedded Board-level Optical Interconnects
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:J. Chai; Guan Jie Yap; Teck Guan Lim; Chee Wei Tan; Yee Mong Khoo; C. Teo; Li Shiah Lim; H.L. Yee; P.V. Ramana; J. Lau; R. Chang; T. Tang; H. Chang; S. Chiang; D. Cheng; T.J. Tseng
Year: 2008
Microdot Epoxy Stamping Process Qualification For Substrate Based Optocoupler BGA Packaging
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:E. Livelo; R. Rojas
Year: 2008
Enhancing Sn-Ag Solder Joints Electromigration Lifetime via the Under-Bump-Metallization Structure Design
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Hsiao-Yun Chen; Chih Chen
Year: 2008
Electromigration Reliability with Respect to Cu Content in Solder Joint System
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Yi-Shao Lai; Jenn-Ming Song
Year: 2008
Design for Cyclic Bending Reliability of Large PBGA Assembly Using Experimental and Numerical Methods
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Fa Xing Che; D. Yap; Jing En Luan; Kim Yong Goh; Yi Yi Ma
Year: 2008
Copper-Pillar Bump-Joint Thermo-Mechanical and Thermal Modeling for Flip-Chip Packages
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:R. Mandal; Y.C. Mui
Year: 2008
An Experimental Result on the Effect of Bypass Capacitance in Load Board for Semiconductor's Speed Testing
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:S.M. Low; M. Phoon; A. Suffian; Johan
Year: 2008
Yield Study of Inline Package on Package (PoP) Assembly
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Dongji Xie; D. Geiger; Dongkai Shangguan; B. Hu; J. Sjoberg
Year: 2008
Increasing IC Leadframe Package Reliability
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:D. Hart; B. Lee; J. Ganjei
Year: 2008
Failure Mechanism and Solution Study of IC Wire Bond Heel Crack on Leadframe
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Meijiang Song; Jinzhong Yao; Yongsheng Lu
Year: 2008
Development of Optical Subassembly for Plastic Optical Fiber in High Speed Applications
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Zhang Jing; P.V. Ramana; J. Chandrappan; Tan Chee Wei; Chai Yi Yoon; Teo Wei Liang; J.H. Lau; P.O. Gomex; Wang Ting; V.M. Ramkumar
Year: 2008
Cracking Phenomena on Flexible-Rigid Interfaces in PWBs under Thermo Cycling Loading
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:L. Arruda; R. Bonadiman; J. Costa; T. Reinikainen
Year: 2008
New Approach for Wafer Level Crystal Unit Package
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Tae Hoon Kim; Jong Yeol Jeon; Yun Pyo Kwak; Ju Pyo Hong; Tae Ho Kim; Eun Jung Lim; Jang Ho Park; Seog Moon Choi; Sung Yi
Year: 2008
Dicing Saw Process Study on Wafer Which Has Thick Aluminum Pads on the Scribe Street
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:JunHua Luo; Ting Li; JinZhong Yao
Year: 2008
Novel Approaches to Current BGA Packaging Challenges
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Changgyun Ryu; J. Hsu; L. Mendoza; A. Capuz; J. Caguiat; H. Sy; R. Lathrop
Year: 2008
Evaluation of Stresses in Thin Device Wafer using Piezoresistive Stress Sensor
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:A. Kumar; Xiaowu Zhang; Q.X. Zhang; M.C. Jong; G.B. Huang; L. Vincent; V. Kripesh; C. Lee; J.H. Lau; D.L. Kwong; V. Sundaram; R.R. Tummula; G. Meyer-Berg
Year: 2008
Process Development and Reliability Evaluation of Electrically Conductive Adhesives (ECA) For Low Temperature SMT Assembly
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:J. Lee; J. Sjoberg; D.T. Rooney; D.A. Geiger; D. Shangguan
Year: 2008
Temporary Bonding and DeBonding Enabling TSV Formation and 3D Integration for Ultra-thin Wafers
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:S. Pargfrieder; P. Kettner; M. Privett; J. Ting
Year: 2008
Stacking Technique of Known Good Rebuilt Wafers without Thru-Silicon Via Commercial Applications
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:C. Val; P. Couderc; N. Boulay
Year: 2008
Process and Reliability of Copper Column Flexible Flip Chip Connection (F2C2)
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Ta-Hsuan Lin; F. Andros; S. Lu; B. Sammakia
Year: 2008
A Numerical Simulation Study on Wetting and Bridging of SnAgCu Solder Liquid
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Lei Zhang; Dong Wang; Weiping Tong
Year: 2008
Reliability Assessment of Lead-Free Universal Solder for Direct Bonding in Power Electronics Packaging
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:D. Ibitayo; L. Everhart; M. Morgenstern; B.R. Geil; J.W. Mitchell
Year: 2008
Study of Sn-Bi-Cu Lead-free Solder
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Xu-jun; He hui-jun; Zhang fu-wen; Zhao zhao-hui; Hu-qiang
Year: 2008
Design of a 3-D SiP for T-DMB with Improvement of Sensitivity and Noise Isolation
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Jiwoo Pak; Myunghyun Ha; Jaemin Kim; Donghee Kang; Ho Choi; Seyoung Kwon; Keunsoo La; Joungho Kim
Year: 2008
Core Excitation Modeling Methodology for Efficient Power Delivery Analysis
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:F.N. Tan; S.G. Pang; D. Sasidaran; Chee Siong Lee; J.S. Lim; P.L. Ooi; Lee Kee Yong
Year: 2008
Mold Compound Properties for Low Warpage Array Packages
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:T. Ahsan; Hao Tang
Year: 2008
Flexible High Performance Capacitor on Soft Elastic Material
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:H.Y. Li; L.F. Cheow; T.T. Chua; H.M. Chua; G.Q. Lo
Year: 2008
Role of CAD Post-Processing in a Quality Tool for Low Volume High-Complexity Electronics Manufacture
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:D.S. Velandia; R. Monfared; A.A. West; P.P. Conway; D.C. Whalley; L. Quintero
Year: 2008
In-situ Non-destructive Ultrasonic Rheology Technique for Monitoring Different Lead-free Solder Pastes for Surface Mount Applications
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:A. Seman; N.N. Ekere; S.J. Ashenden; S. Mallik; A.E. Marks; R. Durairaj
Year: 2008
Development of an Apparatus to Diagnose Electronic Instruments from External Thermal Measurements
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:H. Moon; W. Nakayma; S.H. Jung; I. Bajracharya; S.K. Lee
Year: 2008
EuMA general assembly and Steering Committee 2008
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Year: 2008
Women in engineering
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Year: 2008
Illumination constraints for forward-looking radar receivers in bistatic SAR geometries
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:J. Balke; D. Matthes; T. Mathy
Year: 2008
System modeling for active MM-wave imaging systems using an enhanced calculation method
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:V. Tavakol; Q. Feng; I. Ocket; D. Schreurs; B. Nauwelaers
Year: 2008
Polarimetric Synthetic Range Profile Autofocusing via Contrast Optimization
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:A. Cacciamano; E. Giusti; A. Capria; M. Martorella; F. Berizzi
Year: 2008
Position finding based on multiple doppler sensors
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:S. Schelkshorn; J. Detlefsen
Year: 2008
Multiradar tracking in PHOENIX and its extension to fusion with ADS-B and multilateration
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:R. Heidger; A. Mathias
Year: 2008


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