MDD with Added Null-Value and All-Value Edges
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:C.M. Files; M.H. Nodine
Year: 2008
High-Speed Timing Verification Scheme Using Delay Tables for a Large-Scaled Multiple-Valued Current-Mode Circuit
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:T. Nagai; N. Onizawa; T. Hanyu
Year: 2008
High-Level Design of Multiple-Valued Arithmetic Circuits Based on Arithmetic Description Language
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Y. Watanabe; N. Homma; K. Degawa; T. Aoki; T. Higuchi
Year: 2008
A 3/7-Level Mixed-Mode Algorithmic Analog-to-Digital Converter
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:K. Akutagawa; K. Machida; T. Waho
Year: 2008
Remarks on Bandwidth and Regularities in Functions on Finite Non-Abelian Groups
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:R.S. Stankovic; J. Astola
Year: 2008
GaN Device Technology: Manufacturing, Characterization, Modelling and Verification
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:W. Ciccognani; F. Giannini; E. Limit; P.E. Longhi; M.A. Nanni; A. Serino; C. Lanzieri; M. Peroni; P. Romanini; V. Camarchia; M. Pirola; G. Ghione
Year: 2008
Design of a Prime-Focus Feed with Backward Radiation
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:L. Slama; R. Galuscak; P. Hazdra
Year: 2008
An Efficient Truncation Criteria for Computation of Modal Series Appearing in the Green's Function of Shielded Media
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:L. Golestanirad; M. Mattes; J. Mosig
Year: 2008
Multi-Frequency Printed Dipoles Loaded with Metamaterial Particles
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:F.J. Herraiz-Martinez; L.E. Garcia-Munoz; V. Gonzalez-Posadas; D. Segovia-Vargas
Year: 2008
Novel Design of a Fractal Monopole Antenna for Wireless Communications
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:H. Kimouchee; M. Bitchikh; B. Atrouz
Year: 2008
Particle Accelerator Cavity Design
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:T. Matlocha; Z. Skvor
Year: 2008
Exposure System for Verification of Effects of Electromagnetic Field
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:L. Viseki; J. Vrba; L. Oppl
Year: 2008
An Ultrabroadband Microstrip Detector up to 40 GHz
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:L.A. Tejedor-Alvarez; J.I. Alonso; J. Gonzalez-Martin
Year: 2008
IFS Tool for Fractal Microstrip Patch Antenna Analysis
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:P. Hazdra; M. Capek
Year: 2008
Tissue Parameters Influence on the Microwave Energy Absorption in Biological Objects
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:J. Surda; E. Cocherova; O. Ondracek
Year: 2008
High performance 1.5W pHEMT Distributed Power Amplifier with Adjustable Inter-Stage Cascaded Network for 10
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:K. Narendra; C. Paoloni; E. Limiti; J.M. Collantes
Year: 2008
The UWB Amplifier 3.1-10.6 GHz
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:J. Vancl; V. Sokol; P. Cerny; Z. Skvor
Year: 2008
Development of a Versatile Planar Periodic Structure Simulator in MATLAB
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:S. Gona; V. Kfesdlek
Year: 2008
Introduction by the Program Chairs
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Year: 2008
Efficient Test Data Generation for Variables with Complex Dependencies
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:A. Beer; S. Mohacsi
Year: 2008
Traffic-aware Stress Testing of Distributed Real-Time Systems Based on UML Models in the Presence of Time Uncertainty
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:V. Garousi
Year: 2008
Scheduling Timed Modules for Correct Resource Sharing
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:C. Seceleanu; P. Pettersson; H. Hansson
Year: 2008
Testability of Dynamic Real-Time Systems: An Empirical Study of Constrained Execution Environment Implications
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:B. Lindstrom; J. Offutt; S.F. Andler
Year: 2008
A Three-Tiered Testing Strategy for Cookies
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:A. Tappenden; J. Miller
Year: 2008
Automated Session Data Repair for Web Application Regression Testing
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:N. Alshahwan; M. Harman
Year: 2008
Extended Finite State Machine Based Test Derivation Driven by User Defined Faults
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:K. El-Fakih; A. Kolomeez; S. Prokopenko; N. Yevtushenko
Year: 2008
Generating Test Requirements for the Service Connections based on the Layers of SOA
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Hoijin Yoon; Eun Mi Ji; Byoungju Choi
Year: 2008
Detecting and Repairing Inconsistencies across Heterogeneous Models
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:D.S. Kolovos; R.F. Paige; F.A.C. Polack
Year: 2008
Test Instrumentation and Pattern Matching for Automatic Failure Identification
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:D. Travison; G. Staneff
Year: 2008
Comparing Aspects with Conventional Techniques for Increasing Testability
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:J. Metsa; M. Katara; T. Mikkonen
Year: 2008
Designing and Building a Software Test Organization
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:B. Benton
Year: 2008
Testing Predictive Software in Mobile Devices
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:R. Vemuri
Year: 2008
Pre-testing Flash Device Driver through Model Checking Techniques
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Moonzoo Kim; Yunho Kim; Yunja Choi; Hotae Kim
Year: 2008
Model-Based Testing of Automotive Systems
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:E. Bringmann; A. Kramer
Year: 2008
Workflow Inspector – A Test Tool for Microsoft Workflow Foundation
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:A. Lechner; R. Breu
Year: 2008
Model-Based Quality Assurance of Windows Protocol Documentation
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:W. Grieskamp; D. MacDonald; N. Kicillof; A. Nandan; K. Stobie; F. Wurden
Year: 2008
Functional Search-based Testing from State Machines
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:R. Lefticaru; F. Ipate
Year: 2008
Verifying and Analyzing Adaptive Logic through UML State Models
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:A.J. Ramirez; B.H.C. Cheng
Year: 2008
Statistical Sampling Based Approach to Alleviate Log Replay Testing
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:R. Kodre; H. Ziv; D. Richardson
Year: 2008
Production Facilities Maintenance Outage Planning, Execution & Continuous Improvement Program
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:G. Haberer; E. Clerk
Year: 2008
Dust Collector Design and Safety
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:A.F. Hollingshead
Year: 2008
The Final Frontier Safety By Design: Emerging Standards and Designs In Low-Voltage Motor Control Assemblies
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:D.B. Durocher; D. Mohla
Year: 2008
Simplifying and Enhancing Automated Source Transfer Using Protection with PLC Capabilities
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Wayne G. Hartmann
Year: 2008
Using Infrared Sightglasses to Enable Predictive Maintenance of a High Voltage Motor System and Comply with NFPA70E Safety Requirements
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:A.J. Holliday; J.A. Kay; L. Mason
Year: 2008
Automation to Improve Quality Control
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:L. Velasquez; F. D'Souza
Year: 2008
The Applicability of Wireless Technologies for Industrial Manufacturing Applications Including Cement Manufacturing
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:M. Hanssmann; Sokwoo Rhee; Sheng Liu
Year: 2008
Pack Set and the Effect on Pneumatic Conveying of Cement
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Louis S. Schwartz
Year: 2008
New Reasons for Installing a Chloride By-Pass. Interaction Between Chloride and Sulphur
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:E. Jons; S. Hundebol; K. Clausen
Year: 2008
Beneficial Uses of Cement Kiln Dust
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:W.S. Adaska; D.H. Taubert
Year: 2008
Energy-Saving Pneumatic Conveying Pipe System
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:M. Dikty; P. Hilgraf; R. Worthington
Year: 2008
Labor and Energy Issues in Cement Manufacturing from the 1st Cement Industry Technical Conference to the 50th
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Richard P. Bohan
Year: 2008
Selecting Inching Drives for Mill and Kiln Applications
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:G. Cahala; F.C. Uherek
Year: 2008
Concepts, Configurations, & Benefits of Motor Starting and Operation with MV AC Adjustable Speed Drives
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:W.J. Horvath
Year: 2008
Selection of AC Induction Motors for Cement Plant Applications
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:B.J. Sauer
Year: 2008
Sleeve Bearing Design for Slow Speed Applications in Cement Plants
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:S. Singhal
Year: 2008
Rapid Ball-and-Socket Joint Collision Detection
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Ding Cai; Won-Sook Lee; C. Joslin
Year: 2008
Toward Fully Integrated CMOS Based Capacitive Sensor for Lab-on-Chip Applications
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Ebrahim Ghafar-Zadeh; Mohamad Sawan
Year: 2008
The Measurement of Blood Pressure During Sleep
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:H.R. Dajani; R.S.T. Leung
Year: 2008
Standardizing blood pressure measurement - is it possible?
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:R. Leca; V. Groza
Year: 2008
Obtaining High Throughput in Networks with Tiny Buffers
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:N. Beheshti; Y. Ganjali; A. Goel; N. McKeown
Year: 2008
Dynamic Control of Tunable Sub-Optimal Algorithms for Scheduling of Time-Varying Wireless Networks
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:M. Lotfinezhad; Ben Liang; E.S. Sousa
Year: 2008
Achieving Energy Efficiency with Transmission Pushbacks in Sensor Networks
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Sha Liu; R. Srivastava; C.E. Koksal; P. Sinha
Year: 2008
Edge-to-Edge Bailout Forward Contracts for Single-Domain Internet Services
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Weini Liu; H.T. Karaoglu; A. Gupta; M. Yuksel; K. Kar
Year: 2008
The new SI, a unit system for the 21st century
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Terry Quinn
Year: 2008
I2MTC 2008 Executive Committee
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Year: 2008
I2MTC 2008 Technical Program Committee International Board of Advisors
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Year: 2008
Electronic Instrumentation for Real-time Measurement of Fuel Consumption in EFI Gasoline Engines
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:G. Sen Gupta; S.C. Mukhopadhyay; A.M. Booth
Year: 2008
Optimal knot selection for least-squares fitting of noisy data with spline functions
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:J. Blair
Year: 2008
Application of Time Series Models to the Spectral Analysis of Irregular Turbulence Data
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:P.M.T. Broersen
Year: 2008
Full-range, true on-line turbidimeter based upon optical fibers for application in the wine industry
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:M.A.P. Garcia; R.M. Vega; C. de la Torre Fernandez; J.A.B. de la Fuente; L.M.C. Carcel
Year: 2008
Tightly Synchronized Distributed Measurement and Event Triggers
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:B. Kalantari; T. Korhonen; A. Schiper
Year: 2008
GPS-aided lightweight architecture to support multi-sensor data synchronization
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:V. Di Lecce; A. Amato; M. Calabrese
Year: 2008
Suitability of wireless solutions for large bandwidth sensors interconnection
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:M. Codda; A. Mariscotti
Year: 2008
Triaxial Acceleration Measurement for Oblique Penetration of a Rigid Projectile into Concrete Target
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Jinbiao Fan; Jing Zu; Yan Wang; Xu Peng
Year: 2008
A New Weighted Multipoint Interpolated DFT Approach for High-Accuracy Amplitude Estimation
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:D. Belega; D. Dallet
Year: 2008
A High Frame Rate and High Accuracy Implementation using an FPGA for Calculating Laser Doppler Blood Flow
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:H.C. Nguyen; B.R. Hayes-Gill; Yiqun Zhu; S.P. Morgan
Year: 2008
Application of smart sensors to the measurement of power quality
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:A. Moreno-Munoz; J.A. Sanchez; J.J.G. de la Rosa; J.J. Luna
Year: 2008
Monitoring System with Moving Object Detection Based on MSN Messenger
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Chia-Hung Lien; Po-Tsun Chen; Ying-Wen Bai; Ming-Bo Lin
Year: 2008
Instrumented Sphere for Compression Analysis
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:I. Muller; R.M. de Brito; R.J. Bender
Year: 2008
Experimental Low-Cost Short Pulse Generators
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:A. De Angelis; M. Dionigi; R. Giglietti; P. Carbone
Year: 2008
The single emission spectrum densitometry for radiochromic films by flat-bed document scanner with transparency unit employing light emitting diode
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Y. Azuma; H. Aoyama; S. Goto
Year: 2008
A Simple, Low Cost, 3D Scanning System Using the Laser Light-Sectioning Method
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:B.D. Bradley; A.D.C. Chan; M.J.D. Hayes
Year: 2008
Volumetric Modeling with Multiple Cameras for Markerless Motion Capture in Complex Scenes
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:S. Beriault; M. Cote; P. Payeur
Year: 2008
Wireless Remote Controlled Solid-State Fireworks Detonation System
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:S.C. Mukhopadhyay; G.S. Gupta; E.A. Sheppard
Year: 2008
A high performance non invasive rail current sensor
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:A. Mariscotti
Year: 2008
Modified Extrapolated LMS Algorithm
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:T.S. Shehata; T. Aboulnasr; M. El Tanany
Year: 2008
Selective Vision Sensing with Neural Gas Networks
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:A.-M. Cretu; P. Payeur; E.M. Petriu
Year: 2008
Automatic Rain and Wind Measurement Fault Identification in Mesoscale Weather Station Networks
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:V. Hasu; H. Koivo
Year: 2008
A Road Map for Integrated Systems Health Management
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:J.L. Schmalzel; F. Figueroa; J.A. Morris; S.A. Mandayam
Year: 2008
Identification of a harmonic signal in the presence of additive noise, an unknown time base distortion, and an averaging effect
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:V. Beelaerts; F. De Ridder; N. Schmitz; M. Bauwens; R. Pintelon
Year: 2008
Hierarchical least squares parameter estimation algorithms for dual-rate sampled-data systems
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Jie Ding; Feng Ding; P.X. Liu
Year: 2008
Analysis and Modelling of Mixed-Data Systems with Frequency Translation using Multisine Excitations
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:L. Bos; G. Vandersteen; Y. Rolain; R. Pintelon
Year: 2008
Optimum DAC and ADC Testing
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:S. Max
Year: 2008
A Testbed to Measure the Effectiveness of 3D Travel Interfaces for Virtual Environments
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:J.-F. Lapointe
Year: 2008
A Test Bed for Synchronization in Heterogeneous Network Environments
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:G. Giorgi; C. Narduzzi; M. Stellini
Year: 2008
Further Studies on Space Compression in Embedded Cores-Based Systems Using Fault Graded Output Merger
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:S.R. Das; S. Mukherjee; A. Hossain; E.M. Petriu; S. Biswas
Year: 2008
Fill level measurement in a closed vessel by monitoring pressure variations due to thermodynamic equilibrium perturbation
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:G. Holler; A. Fuchs; G. Brasseur
Year: 2008
Modulation Transfer Function Model of Scanning TDI Sensors with Oversampling-Superposition
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Xiaowei Shi; Xingwu Wu; Xiaojian Xu
Year: 2008
Using Neural Network for the Evaluation of Power Consumption of Instructions Execution
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:A. Borovyi; V. Konstantakos; V. Kochan; V. Turchenko; A. Sachenko; T. Laopoulos
Year: 2008
Noise Analysis of the Pulse-Width Modulator for Quasi-Digital Sensors
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:G. Horak; V. Bilas; D. Vasic
Year: 2008
Low-Cost Power Harmonics Analyzer of Nonlinear Loads Based on FPGA
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:J. Lara-Cardoso; R. de Jesus Romero-Troncoso
Year: 2008
Excitation Current Source for Bioimpedance Measurement Applications: Analysis and Design
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:P. Annus; A. Krivoshei; M. Min; T. Parve
Year: 2008
Bias Contributions in Time Series Models for Resampled Irregular Data
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:P.M.T. Broersen
Year: 2008
Window Sharpening
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:S. Engelberg; G. Freidlin; A. Vaknin
Year: 2008
Rotation Speed and Wind Speed Indirect Measurement Methods for the Control of Windmills with Fixed Blades Turbine
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:N. Budisan; V. Groza; O. Prostean; I. Filip; M. Biriescu; I. Szeidert; M. Stern
Year: 2008
A System for Monitoring Workers' Safety in an Unhealthy Environment by means of Wearable Sensors
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:S. Corbellini; F. Ferraris; M. Parvis
Year: 2008
Robust Estimation of Blow-by and Compression Ratio for Large Diesel Engines based on Cylinder Pressure Traces
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:D. Watzenig; G. Steiner; M.S. Sommer
Year: 2008
A Curvilinear Avatar with Avatar Collision Detection Scheme in Collaborative Virtual Environments
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Z. Sakr; C. Sudama
Year: 2008
Customized Configuration and Management of Measurement Procedures on PDA
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:D.L. Carni; D. Grimaldi; F. Lamonaca; A. Nastro
Year: 2008
Real-Time Monitoring Visualization Through On-Line Simulation
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:A. Boukerche; R.B. Araujo; F.M. Iwasaki; E. Pizzolato
Year: 2008
A New Calibration Method for Sampling Clock Skew in Time-interleaved ADC
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Zheng Liu; K. Honda; S. Kawahito
Year: 2008
ADC Standard Harmonization: Comparison of Test Methods
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:E. Balestrieri; P. Daponte; S. Rapuano
Year: 2008
A Sigma-Delta Resistance to Digital Converter Suitable for Differential Resistive Sensors
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:N.M. Mohan; B. George; V.J. Kumar
Year: 2008
A Technique for Detecting Materials Characteristics using Mechanical Impacts and a Multilayer Neural Network
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:E. Molino-Minero-Re; M. Lopez-Garcia; A. Manuel-Lazaro; A. Carlosena; S. Shariat-Panahi
Year: 2008
A new method for the on-line voidage measurement of gas-oil two-phase flow
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Xia Li; Zhiyao Huang; Baoliang Wang; Haiqing Li
Year: 2008
An Electronic Instrumentation Course as Part of a Multidisciplinary Learning Project
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:J.C. Campo; F.J. Ferrero; M. Valledor; J.C. Alvarez-Alvarez; J.C. Alvarez-Anton; J.C. Viera
Year: 2008
Sensor Signal Processing for Autonomous Wireless Sensors
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:S. Bicelli; A. Depari; A. Flammini; D. Marioli; M. Serpelloni; E. Sisinni; A. Taroni
Year: 2008
Low-Power High-Rensponsivity CMOS Temperature Sensor
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:J.M.C. Dantas; H.J.B. Costa; J.P.M. Dantas; F.A.B. Filho; F.R. Sousa; R.C.S. Freire
Year: 2008
A Classification Method for Wood Types using Fluorescence Spectra
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Paolo Camorani; Marco Badiali; Daniela Francomacaro; Marco Gamassi; Vincenzo Piuri; Fabio Scotti; Marco Zanasi
Year: 2008
Uncertainty Consideration in Sampling for High Resolution Fourier Transform Spectroscopy
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:N. Al-Moayed; M.N. Afsar
Year: 2008
Energy Harvesting for Online Condition Monitoring of High Voltage Overhead Power Lines
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:H. Zangl; T. Bretterklieber; G. Brasseur
Year: 2008
Modelling Contact Forces for 3D Interactive Peg-in-Hole Virtual Reality Operations
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Jilin Zhou; N.D. Georganas; E.M. Petriu; Xiaojun Shen; F. Marlic
Year: 2008
Model and experimental characterization of dynamic behaviour of low power Carbon Monoxide MOX sensors with pulsed temperature profile
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:S. Bicelli; A. Depari; G. Faglia; A. Flammini; A. Fort; M. Mugnaini; A. Ponzoni; V. Vignoli
Year: 2008
Optical 2D Displacement and Strain Sensor for Creep Testing of Material Samples in Transparent Fluids
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:M. Brandner; T. Thurner; G. Kukutschki; N. Enzinger
Year: 2008
A Few Notes on Variance of Frequency Estimated Applying Analytical Leakage Compensation
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:N. Hlupic; D. Basch; K. Fertalj
Year: 2008
An Investigation on Wireless Communication and Power Supply Through Metal Tank Walls
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:H. Zangl; A. Fuchs; T. Bretterklieber; M. Moser; G. Holler
Year: 2008
Optical Instrument for Real-Time Ultrasonic Welder Inspection
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:M. Norgia; M. Annoni; C. Svelto
Year: 2008
Rod Shape Testing by High Frequency Eddy Current; The experimental Setup
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:J. Weidenmiiller; C. Knopf; C. Sehestedt; J. Himmel
Year: 2008
A Design Method for Ultra-High Speed for A New Wave Pipeline-based Circuit
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:T. Feng; Z. Patitz; N. Park
Year: 2008
A Novel Approach To Automated Testing To Increase Software Reliability
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:M. Catelani; L. Ciani; V.L. Scarano; A. Bacioccola
Year: 2008
Logic Built-In Self-Test for Core-Based Designs on System-on-a-Chip
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:K. George; C.-I.H. Chen
Year: 2008
Nonlinear Distortion Measurements of Discrete-Time Radio Receivers
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:A. Geis; G. Vandersteen; Y. Rolain
Year: 2008
A Measuring System for the Assurance of the Cold-Chain Integrity
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:A. Carullo; S. Corbellini; M. Parvis; L. Reyneri; A. Vallan
Year: 2008
Verification of Ethernet IP Core MAC Design Using Deterministic Test Methodology
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:M.H. Assaf; S.R. Das; W. Hernias; E.M. Petriu; S. Biswas
Year: 2008
Stability and Static Noise Margin Analysis of Low-Power SRAM
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:R. Keerthi; C.-i.H. Chen
Year: 2008
Improving Efficiency of IC Burn-In Testing
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Yong Han Ng; Yew Hock Low; S. Demidenko
Year: 2008
Calculation of Measurements Uncertainties in Case of Asynchronous Sampling of Complex AC Signals
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:P.B. Petrovic
Year: 2008
Compact Digital Receiver Development for Radar Based Remote Sensing
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:M. Yeary; R. Kelley; J. Meier; S. Ong; R. Palmer
Year: 2008
Introducing a New Measurement Method for Magnetostrictive Linear Displacement Transducers
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:P. Ferrari; A. Flammini; D. Marioli; E. Sisinni; A. Taroni
Year: 2008
A Floorprint-based Defect Tolerance for Nano-scale Application-Specific IC
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:S. Ahn; Z. Patitz; N. Park
Year: 2008
Acceleration of IC verification process using advanced flexible modular measurement systems and software architectures
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:A. Pirker-Fruhauf; W. Gallent; M. Kunze; G. Pelz
Year: 2008
A High-Resolution Hybrid Digital Wattmeter for Measurements at High Voltage
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:B. Djokic; E. So
Year: 2008
An Electro-Optic Hybrid Multifunctional Instrument for 3-Phase Current Measurements
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:S. Zadvornov; A. Sokolovsky
Year: 2008
Automated Registration System of the Density Change at the Depth of Composite Materials, in High Temperature Conditions
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:K.N. Athanassiadis; A.V. Chudakov; M.O. Anshakov; P. Tsardaklis
Year: 2008
A novel measurement strategy for volcanic ash fallout estimation based on RTD Fluxgate magnetometers
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:B. Ando; S. Baglio; N. Pitrone; C. Trigona; A.R. Bulsara; V. In; M. Coltelli; S. Scollo
Year: 2008
New Learning Algorithm for High-Quality Velocity Measurement from Low-Cost Optical Encoders
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:N.K. Boggarpu; R.C. Kavanagh
Year: 2008
Synchronization Uncertainty Contributions in Wireless Sensor Networks
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:A. Ageev; D. Macii; D. Petri
Year: 2008
A non-invasive system for the measurement of the robustness of microprocessor-type architectures against radiation-induced soft errors
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:H. Guzman-Miranda; M.A. Aguirre; J. Tombs
Year: 2008
Designing and tuning an air-cored current transformer for partial discharges pulses measurements
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:G. Robles; J.M. Martinez; J. Sanz; B. Tellini; C. Zappacosta; M. Rojas
Year: 2008
On-line Visual Measurement and Inspection of Weld Bead Using Structured Light
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Yuan Li; Qing Lin Wang; You Fu Li; De Xu; Min Tan
Year: 2008
An easy and accurate calibration procedure for 3-D shape measurement system based on phase-shifting projected fringe profilometry
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:R. Anchini; C. D'Argenio; C. Liguori; A. Paolillo
Year: 2008
Differentiation between Recycling Refractory Bricks by Texture Analysis
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:A. Guerriero; C. Guaragnella; C. Pasquale; F. Quaranta
Year: 2008
Self-Compensating Excitation of Fluxgate Sensors for Space Magnetometers
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:A. Cerman; J.M.G. Merayo; P. Brauer; F. Primdahl
Year: 2008
Multi-sensory system for obstacle detection on railways
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:J.J.D. Garcia; J.U. Urena; A.A. Hernandez; M.Q. Mazo; J.F. Vazquez; M.-J. Diaz
Year: 2008
Solids Volume Fraction Measurement of Gas-Solid Two-Phase Flow Based on Terahertz Time-Domain Spectroscopy Technique
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Liu Yian; Huang Zhiyao; Ji Haifeng; Li Haiqing
Year: 2008
Frequency Estimation of Power System Signals Using a New Spectrum Leakage Correction Algorithm
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:T. Radii; P.M. Ramos; A.C. Serra
Year: 2008
Model and Measurement of State Dissemination in MMOGs
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:D.T. Ahmed; S. Shirmohamrnadi
Year: 2008
A Hierarchical HMM Model for Online Gaming Traffic Patterns
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:B. Hariri; S. Shirmohammadi; M.R. Pakravan
Year: 2008
Empirical Analysis of the Sample Correlation for the Planning of Field Trials in the Digital Broadcasting Services at MF Band
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:D. de la Vega; S. Lopez; I. Pena; J.M. Matias; P. Angueira; M.M. Velez; J.L. Ordiales
Year: 2008
Design and Implementation of an Automatic Testing System for MP3 Players
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Ying-Wen Bai; Chin-Chung Lee
Year: 2008
Transference Impedance Estimation of IEC60318 Couplers by Image Processing and Finite Element Modelling
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:A. Bravo; M. Ruiz; J.M. Lopez; G. De Arcas; M. Sumpsi
Year: 2008
Using Inactivity to Detect Unusual behavior
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:P. Dickinson; A. Hunter
Year: 2008
Fast Body Posture Estimation using Volumetric Features
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:M. Van den Bergh; E. Koller-Meier; L. Van Gool
Year: 2008
3D in the Home: Mass Market or Niche?
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Anthony Vetro
Year: 2008
Compression of 3D Meshes - Applications, Approaches, Standards
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:N. Stefanoski; J. Ostermann; L. Vasa
Year: 2008
Design and Implementation of a DMD Based Volumetric 3D Display
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:V. Yucesoy; D. Tunaoglu; M. Kovachev; R. Ilieva; L. Onural
Year: 2008
Implementation of Stereoscopic and Dualview Images on a Micro-Display High Definition Television
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:M.D. McCormick; H.W. Neal; D.C. Hutchison
Year: 2008
Disparity Adaptive Filter for Anti-Aliasing of Stereoscopic 3D Images
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Wook-Joong Kim; Jinwoong Kim
Year: 2008
Why HDR is Important for 3DTV Model Acquisition
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:B. Huhle; O. Pirinen; S. Fleck; A. Gotchev; W. Strasser
Year: 2008
3DTV View Generation Using Uncalibrated Cameras
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:S. Jarusirisawad; H. Saito
Year: 2008
Depth Estimation Via Stage Classification
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:V. Nedovic; A.W.M. Smeulders; A. Redert; J.-M. Geusebroek
Year: 2008
MPEG-4 Part 25: A Generic Model for 3D Graphics Compression
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:B. Jovanova; M. Preda; F. Preteux
Year: 2008
Depth Scaling of Multiview Images for Automultiscopic 3D Monitors
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Manbae Kim; Seno Lee; Changyeol Choi; Gi-Mun Um; Namho Hur; Jinwoong Kim
Year: 2008
Hybrid Method of 3-D Image Reconstruction from Stereo Pictures
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:M. Breznan
Year: 2008
Objective Quality Assessment in Free-Viewpoint Video Production
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:J. Kilner; A. Hilton
Year: 2008
View Generation with 3D Warping Using Depth Information for FTV
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Y. Mori; N. Fukushima; T. Fujii; M. Tanimoto
Year: 2008
Speech-Driven Automatic Facial Expression Synthesis
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:E. Bozkurt; C.E. Erdem; E. Erzin; T. Erdem; M. Ozkan; A.M. Tekalp
Year: 2008
Example-Based Depth Generation from Single Image for 3D Content
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Kai Che Liu; Qi Wu; Wen Chao Chen; Cheng Feng Wu; F.C. Jan; T. Chen
Year: 2008
Outlier Removal for Sparse 3D Reconstruction from Video
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:E. Vural; A.A. Alatan
Year: 2008
Region-Based 3D Artwork Indexing and Classification
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:M. Alcoverro; S. Philipp-Foliguet; M. Jordan; L. Najman; J. Cousty
Year: 2008
A Vision-Based System For Automatic Detection and Extraction Of Road Networks
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:C. Poullis; S. You; U. Neumann
Year: 2008
Interactive Portrait Art
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Ye Ning; T. Sim
Year: 2008
INSPEC2T: Inexpensive Spectrometer Color Camera Technology
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:W.J. Scheirer; S.R. Kirkbride; T.E. Boult
Year: 2008
Urban building recognition during significant temporal variations
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:G.P. Nguyen; H.J. Andersen; M.F. Christensen
Year: 2008
EAVA: A 3D Emotive Audio-Visual Avatar
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Hao Tang; Yun Fu; Jilin Tu; T.S. Huang; M. Hasegawa-Johnson
Year: 2008
Qualitative Assessment of Video Stabilization and Mosaicking Systems
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Chao Zhang; P. Chockalingam; A. Kumar; P. Burt; A. Lakshmikumar
Year: 2008
Multi-Pose Face Detection with Asymmetric Haar Features
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:G.A. Ramirez; O. Fuentes
Year: 2008
Tracking and Segmentation of Highway Vehicles in Cluttered and Crowded Scenes
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Goo Jun; J.K. Aggarwal; M. Gokmen
Year: 2008
Explanation-Based Object Recognition
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:G. Levine; G. DeJong
Year: 2008
Single View Metrology: A Practical Example
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:P.R.S. Mendonca; R. Kaucic
Year: 2008
Human Pose Estimation with Rotated Geometric Blur
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Bo Chen; Nhan Nguyen; G. Mori
Year: 2008
Image Rendering Based on a Spatial Extension of the CIECAM02
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:O. Tulet; M.-C. Larabi; C. Fernandez-Maloigne
Year: 2008
An Efficient Active Camera Model for Video Surveillance
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:K. Sankaranarayanan; J.W. Davis
Year: 2008
Online Character Recognition using Regression Techniques
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:N. Reddy; R. Kandan; K. Shashikiran; S. Sundaram; A.G. Ramakrishnan
Year: 2008
Three-Dimensional Integration Technology Using Self-Assembly Technique and Super-Chip Integration
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Mitsumasa Koyanagi; Takafumi Fukushima; Tetsu Tanaka
Year: 2008
A 3D-IC Technology with Integrated Microchannel Cooling
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Deepak Sekar; Calvin King; Bing Dang; Todd Spencer; Hiren Thacker; Paul Joseph; Muhannad Bakir; James Meindl
Year: 2008
Resistance to electromigration of purely intermetallic micro-bump interconnections for 3D-device stacking
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Riet Labie; Wouter Ruythooren; Kris Baert; Eric Beyne; Bart Swinnen
Year: 2008
Development and optimization of porous pSiCOH interconnect dielectrics for 45 nm and beyond
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:A. Grill; S. Gates; C. Dimitrakopoulos; V. Patel; S. Cohen; Y. Ostrovski; E. Liniger; E. Simonyi; D. Restaino; S. Sankaran; S. Reiter; A. Demos; K. S. Yim; V. Nguyen; J. Rocha; D. Ho
Year: 2008
A Self-Aligned Air Gap Interconnect Process
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Hsien-Wei Chen; Shin-Puu Jeng; Hao-Yi Tsai; Yu-Wen Liu; CH Yu; YC Sun
Year: 2008
Production Worthy 3D Interconnect Technology
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:H.J. Tu; W.J. Wu; J.C. Hu; K.F. Yang; H.B. Chang; W.C. Chiou; C.H Yu
Year: 2008
Voltage Ramp and Time-Dependent Dielectric Breakdown in Ultra-Narrow Cu/SiO2 Interconnects
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:H. Park; H.-B. Lee; H.-K. Jung; Z.-S. Choi; J.-Y. Bae; J.-W. Hong; K.-I. Choi; B.-L. Park; E.-J. Lee; J.-W. Kim; J.-M. Lee; G.-H. Choi; J.-T. Moon
Year: 2008
Copper direct bonding for 3D integration
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Pierric Gueguen; Lea di Cioccio; Maurice Rivoire; Daniel Scevola; Marc Zussy; Anne Marie Charvet; Laurent Bally; Dominique Lafond; Laurent Clavelier
Year: 2008
Process Control and Physical Failure Analysis for Sub-100NM CU/Low-K Structures
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Ehrenfried Zschech; Rene Huebner; Pavel Potapov; Inka Zienert; Moritz Andreas Meyer; Dmytro Chumakov; Holm Geisler; Michael Hecker; Hans-Juergen Engelmann; Eckhard Langer
Year: 2008
Lithography options and challenges for sub-45nm node interconnect layers
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:M. Maenhoudt
Year: 2008
Structure-Designable Formation-Method of Super Low-k SiOC Film (k=2.2) by Neutral-Beam-Enhanced-CVD
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Shigeo Yasuhara; Juhyun Chung; Kunitoshi Tajima; Hisashi Yano; Shingo Kadomura; Masaki Yoshimaru; Noriaki Matsunaga; Tomohiro Kubota; Hiroto Ohtake; Seiji Samukawa
Year: 2008
Micro Beam IR Characterization of Narrow Width (-100 nm) Low-k Spaces Between Cu Lines Correlated with Valence EELS Evaluation
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Shinichi Ogawa; Hirofumi Seki; Yuji Otsuka; Shinichi Nakao; Yukio Takigawa; Hideki Hashimoto
Year: 2008
Post-Etch Cleaning for Porous Low K Integration: Impact of HF wet etch on "Pore-sealing" and "k recovery"
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:L. Broussous; W. Puyrenier; D. Rebiscoul; V. Rouessac; A. Ayral
Year: 2008
ALD growth of a mixed-phase novel barrier for seedless copper electroplating applications
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:S. Kumar; H. L. Xin; P. Ercius; D. A. Muller; E. Eisenbraun
Year: 2008
Reduction of Electrical Crosstalk in Hybrid Backside Illuminated CMOS Imagers using Deep Trench Isolation
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Kyriaki Minoglou; Koen de Munck; Deniz Sabuncuoglu Tezcan; Tom Borgers; Wouter Ruythooren; Jan Bogaerts; Iacopo Ficai Veltroni; Igor Zayer; Roland Meynart; Jean-Loup Bezy; Chris van Hoof; Piet de Moor
Year: 2008
Interconnect for Out-of-Plane Mems Assembly
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:A.A.A. Aarts; H. P. Neves; R. P. Puers; C. van Hoof
Year: 2008
Impact of Process Induced Stresses and Chip-Packaging Interaction on Reliability of Air-gap Interconnects
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Xuefeng Zhang; Suk-Kyu Ryu; Rui Huang; Paul S. Ho; Junjun Liu; Dorel Toma
Year: 2008
Benchmarking of Metal-to-Carbon Nanotube Side Contact Resistance
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Zhengchun Liu; Lijie Ci; Navdeep Bajwa; Pulickel M. Ajayan; Jian-Qiang Lu
Year: 2008
TDDB Kinetics and their Relationship with the E- and √E-models
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Kok-Yong Yiang; H. Walter Yao; Amit Marathe
Year: 2008
Impact of LER and misaligned vias on the electric field in nanometer-scale wires
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Michele Stucchi; Zsolt Tokei
Year: 2008
Limitation of Low-k Reliability due to Dielectric Breakdown at Vias
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Shou-Chung Lee; A. S. Oates; Kow Ming Chang
Year: 2008
Performance and reliability of airgaps for advanced BEOL Interconnects
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:S. Nitta; D. Edelstein; S. Ponoth; L. Clevenger; X. Liu; T. Standaert
Year: 2008
Cost-effective air-gap interconnects by all-in-one post-removing process
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:N. Nakamura; N. Matsunaga; T. Kaminatsui; K. Watanabe; H. Shibata
Year: 2008
Self Aligned CuGeN Process for 32/22nm Nodes and Beyond
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:C. S. Liu; H. C. Chen; T. I. Bao; J. VanOlmen; K. Croes; E. VanBesien; M. Pantouvaki; C. Zhao; E. Sleeckx; G. Beyer; C. H. Yu
Year: 2008
Robust BEOL Process Integration with Ultra Low-k (k=2.0) Dielectric and Self-Formed MnOx Barrier Technology for 32 nm-node and beyond
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:T. Watanabe; Y. Hayashi; H. Tomizawa; T. Usui; A. Gawase; M. Shimada; K. Watanabe; H. Shibata
Year: 2008
High volume manufacturing issues for on-die interconnects at the 45nm process node
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Peter Moon
Year: 2008
Low-K Interconnect Stack with Thick Metal 9 Redistribution Layer and Cu Die Bump for 45nm High Volume Manufacturing
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:D. Ingerly; S. Agraharam; D. Becher; V. Chikarmane; K. Fischer; R. Grover; M. Goodner; S. Haight; J. He; T. Ibrahim; S. Joshi; H. Kothari; K. Lee; Y. Lin; C. Litteken; H. Liu; E. Mays; P. Moon; T. Mule; S. Nolen; N. Patel; S. Pradhan; J. Robinson; P. Ramanarayanan; S. Sattiraju; T. Schroeder; S. Williams; P. Yashar
Year: 2008
Quantitative analysis of correlation between insulator surface copper contamination and TDDB lifetime based on actual measurement
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:D. Oshida; T. Takewaki; M. Iguchi; T. Taiji; T. Morita; Y. Tsuchiya; H. Tsuchiya; S. Yokogawa; H. Kunishima; H. Aizawa; N. Okada
Year: 2008
Sub-ns Delay Through Multi-Wall Carbon Nanotube Local Interconnects in a CMOS Integrated Circuit
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Gael F. Close; Shinichi Yasuda; Bipul Paul; Shinobu Fujita; H.-S. Philip Wong
Year: 2008
Toward securing a voice conference using SVSP
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:A. Feghali
Year: 2008
Identifying and Overcoming the Design Challenges of Implementing a Multi-Technology System in a High Rise Buildings
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Nayef Azar
Year: 2008
Automatic Location Systems for Mobile Phones
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:N. Nasser
Year: 2008
My fingers are all mine: Five reasons why using biometrics may not be a good idea
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:S.A. Shaikh; C.K. Dimitriadis
Year: 2008
Classical and chaotic encryption techniques for the security of satellite images
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:M. Usama; M.K. Khan
Year: 2008
Comprehensive overview of various lip synchronization techniques
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:S. Aggarwal; A. Jindal
Year: 2008
A hybrid cryptography model for managing security in dynamic topology of MANET
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:M. Razi; J. Quamar
Year: 2008
Conditional Access in Blu-ray Disc MPEG-2 Transport Streams
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:K.S. Ramasubramaniam
Year: 2008
Error Sector Inventory on Optical Disc for Defect Avoidance during Recording / Playback Digest of Technical Papers
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:S. Kudavelly
Year: 2008
Design Method of UI of AV Remote Controller Based on AHP
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:M. Matsuda; Y. Uesugi; T. Nonaka; T. Hase
Year: 2008
An Inexpensive Impulse Detector and Finite State Timing System
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:D.R. Ferraz; Y. Burian
Year: 2008
Enhancement of 3D Shape in 2D Natural Images using a Non-Photorealistic Shading Approach
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:T. Watanabe; S. Ojima
Year: 2008
The Design and Implementation of a Stereoscopic Microdisplay Television
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:D.C. Hutchison; H.W. Neal
Year: 2008
Implementation of Transmitter Identification Signal Analyzer in Single Frequency Network
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Jae-young Lee; Sung Ik Park; Heung Mook Kim; Jong Soo Lim
Year: 2008
A Phone for Human Activity Recognition Using Triaxial Acceleration Sensor
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Sa-kwang Song; Jaewon Jang; Soojun Park
Year: 2008
A Hierarchical Mode Decision Method for The Fast H.264/AVC Intraframe Coding
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Jiantan Liu; Jung Young Choi; Kook Yeol Yoo
Year: 2008
A Novel Performance Measure for Picture Rate Conversion Methods
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:A. Heinrich; G. de Haan; C.N. Cordes
Year: 2008
RFIPv6 - A Novel IPv6-EPC Bridge Mechanism
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Yao Chung Chang; Jiann Liang Chen; Yu Shan Lin; Shi Ming Wang
Year: 2008
Opportunities for 3D on Blu-ray Disc
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:P. Newton; F. Scalori; F. Bruls
Year: 2008
User Interaction And Random Accessibility Analysis For Multiview Video System
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:You Yang; Gangyi Jiang; Peng Zhu; Mei Yu
Year: 2008
Watermarking for Content Aware Intelligent Toys
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:A. Lemma; M. Celik; S. Katzenbeisser; M. van der Veen
Year: 2008
Context Representation of Intelligent Gadgets for Event-driven Services
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:H. Jang; Kugsang Jeong; Jongho Won; Changseok Bae
Year: 2008
Audio DRM Conversion between Different DRM Content Formats
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Yeonjeong Jeong; Junghyun Kim; Kisong Yoon
Year: 2008
Implementation of Smart Headband for the Wearable Healthcare
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Sanghyun Kim; Dongwan Ryoo; Changseok Bae
Year: 2008
Implementing OpenGL ES 1.1 over OpenGL ES 2.0
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:S. Hill; M. Robart; E. Tanguy
Year: 2008
Write System of Blu-ray Disc Drive for Video Camera
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:T. Tsukuda; T. Ishitobi; K. Watanabe; H. Sugiyama
Year: 2008
A wearable health co ntext aware system
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Youngsung Kim; Jeunwoo Lee
Year: 2008
A Scheme for Location Transparent Access to Networked Consumer Electronics
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:H. Kuroki; H. Inoue; T. Ogino; S. Ishihara
Year: 2008
Context-Aware Middle w are for Mobile Phone Based on Operational Logs
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:R. Kiyohara; M. Matsumoto; N. Shimizu; S. Mii; M. Numao; S. Kurihara
Year: 2008
Global Timed-Release Encryption
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:M. Yoshida; T. Fujiwara
Year: 2008
An End-to-end QoS Architectu re for Ensuring The Reliable Delivery of Broadband Applications
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Nikos Koutsouris; Teodor Buburuzan; Krzysztof Loziak; Efstathios Sykas
Year: 2008
A Generic Approach for Digital Clock Synthesis Used for HDTV/PC-VGA Receiver
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:M. Pietrzyk; A. Koellmann; S. Simons
Year: 2008
Real-Time Free Viewpoint Rendering System for Face-to-face Video Conference
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Chia-Ho Pan; Sheng-Chieh Huang; Yu-Lin Chang; Chung-Jr Lian; Liang-Gee Chen
Year: 2008
A Novel Design Approach for H.264/AVC Motion Estimation Architectures
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:S. Lopez; G.M. Callico; F. Tobajas; J.F. Lopez; R. Sarmiento
Year: 2008
Low-Cost Camera Motion Extraction in Compressed Videos
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Ying Weng; Jianmin Jiang
Year: 2008
Performance of Ad-Hoc Wireless Network on 2.4GHz Band in Real Fields
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:N. Kushiro; M. Katsukura; M. Nakata; H. Toshiyasu; Y. Ito; K. Ogaki
Year: 2008
Digital On-Channel Repeater for Terrestrial Digital Multimedia Broadcasting (T-DMB)
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Jung Su Han; Kyungchan Shin; Hyung-Jin Choi
Year: 2008
A Study of Healthcare System for Patient Location Data Based on LBS
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Jinsoo Ahn; Jungil Heo; Suyoung Lim; Jungho Seo; Wooshik Kim
Year: 2008
Efficient and Secure Remote Authenticated Key Agreement Scheme for Multi-server Using Mobile Equipment
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Jun Ho Lee; Dong Hoon Lee
Year: 2008
A Robust Symbol Synchronization Method for Terrestrial-DMB Receivers in Hierarchical Modulation Mode
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Joon Tae Kim; Jong Kyu Oh; Yang Soo Kim; Jong Soo Lim
Year: 2008
Remote Control Generating Dynamic User Interface Corresponding to Audio Visual System Configuration
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:T. Nonaka; S. Kimura; T. Hase
Year: 2008
A DVB-MHP to Blu-ray transcoding scheme for interactive data
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:S. Infante; P. Nasiopoulos
Year: 2008
Intelligent wheelchair using face and mouth shape recognition
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Jin Sun Ju; Yun Hee Shin; Eun Yi Kim; Se Hyun Park
Year: 2008
Dynamic resource allocation for uplink contention channels in WiMAX
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:P. Hosein
Year: 2008
Low-complexity two-stage timing acquisition scheme for UWB communications
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Yanjie Peng; Lang Mai; Xiaoyang Zeng
Year: 2008
A new freqeuncy offset estimation algorithm for DBO-CSS in multipath channels
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Seung-Han Baik; Sang-Hun Yoon; Jong-Wha Chong
Year: 2008
The performance of WiFi network for application in a navigation system for visually impaired people
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:K. Alhajri; N. Al-Salihi; V. Garaj; W. Balachandran
Year: 2008
Cross-layer design for wireless networks with cognitive controllers
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:M. Slavik; I. Mahgoub; A. Badi
Year: 2008
Self-optimization of coverage for femtocell deployments
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:H. Claussen; L.T.W. Ho; L.G. Samuel
Year: 2008
An architecture for mobility management in interworked 3G cellular and WiMAX Networks
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:K.S. Munasinghe; A. Jamalipour
Year: 2008
On the implementation of a space time block coded transmitter in an FPGA platform
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:R.C. Anguiano; G. Galaviz; A.G. Andrade
Year: 2008
An efficient communication system for disaster detection and coordinated emergency evacuation
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Qing-An Zeng; Heng Wei; V. Joshi
Year: 2008
Broadband access for all: The economic and political implications of municipal wireless networks
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:G.W.S. Okamoto
Year: 2008
A New Dynamic Cache Flushing (DCF) algorithm for preventing cache timing attack
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:J. Bani; S.S. Rizvi
Year: 2008
Foreword
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Year: 2008
Technology platform for 3-D stacking of thinned embedded dies
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:F. Iker; P. Soussan; E. Beyne; K. Baert
Year: 2008
Electromigration of Cu-Sn-Cu micropads in 3D interconnect
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Zhihong Huang; R. Chatterjee; P. Justison; R. Hernandez; S. Pozder; A. Jain; E. Acosta; D.A. Gajewski; V. Mathew; R.E. Jones
Year: 2008
Characterization of stacked die using die-to-wafer integration for high yield and throughput
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:K. Sakuma; P.S. Andry; C.K. Tsang; K. Sueoka; Y. Oyama; C. Patel; B. Dang; S.L. Wright; B.C. Webb; E. Sprogis; R. Polastre; R. Horton; J.U. Knickerbocker
Year: 2008
Fabrication of silicon carriers with TSV electrical interconnections and embedded thermal solutions for high power 3-D package
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Aibin Yu; N. Khan; G. Archit; D. Pinjala; Kok Chuan Toh; V. Kripesh; Seung Wook Yoon; J.H. Lau
Year: 2008
A scheme of array memory stacking to the multi-channel solid state disk (SSD) applications: High speed, high reliability, and green compliance
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Li-Cheng Shen; Wen-Chih Chen; Yin-Po Hung; Tsung-Fu Yang; Fang-Jim Leu; Tao-Chih Chang
Year: 2008
Impact of packaging design on reliability of large die Cu/low-κ (BD) interconnect
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:T.C. Chai; Xiaowu Zhang; H.Y. Li; V.N. Sekhar; W.Y. Hnin; M.L. Thew; O.K. Navas; J. Lau; R. Murthy; S. Balakumar; Y.M. Tan; C.K. Cheng; S.L. Liew; D.Z. Chi; W.H. Zhu
Year: 2008
New reflow soldering and tip in buried box (TB2) techniques for ultrafine pitch megapixels imaging array
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:D. Saint-Patrice; F. Marion; M. Fendler; G. Dumont; J. Garrione; V. Mandrillon; F. Greco; M. Diop; C. Largeron; H. Ribot
Year: 2008
Ternary lead-free SnAgCu micro-bumps for ultra-fine pitch chip-to-chip interconnection
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Tsung-Fu Tsai; Jing-Yao Chang; Chien-Wei Chien; Jing-Ye Juang; Li-Cheng Shen
Year: 2008
Cu pillar bumps as a lead-free drop-in replacement for solder-bumped, flip-chip interconnects
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:B. Ebersberger; C. Lee
Year: 2008
All-copper chip-to-substrate interconnects: Bonding, testing, and design for electrical performance and thermo-mechanical reliability
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:T. Osborn; Ate He; H. Lightsey; P. Kohl
Year: 2008
The impact of process parameters on the fracture of device structures during chip joining on organic laminates
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:M. Sylvestre; A. Blander; V. Oberson; E. Perfecto; K. Srivastava
Year: 2008
Effects of warpage on fatigue reliability of solder bumps: Experimental and analytical studies
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Wei Tan; I.C. Ume; Ying Hung; C.F.J. Wu
Year: 2008
An acceleration model for lead-free (SAC) solder joint reliability under thermal cycling
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:V. Vasudevan; Xuejun Fan
Year: 2008
A comprehensive parallel study on the board level reliability of SAC, SACX and SCN solders
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Fubin Song; J.C.C. Lo; J.K.S. Lam; Tong Jiang; S.W.R. Lee
Year: 2008
A stitching technique for expanding large 3-D multi-layer antenna arrays in Ku-band using small array units
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:D.J. Chung; S. Bhattacharya; G. Ponchak; J. Papapolymerou
Year: 2008
Nano-particle enhanced encapsulants for improved humidity resistance
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:T. Braun; F. Hausel; J. Bauer; O. Wittier; R. Mrossko; M. Bouazza; K.-F. Becker; U. Oestermann; M. Koch; V. Bader; C. Minge; R. Aschenbrenner; H. Reichl
Year: 2008
Development of highly moisture durable optical adhesives for optical devices
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:S. Mitachi
Year: 2008
Wafer level packages (WLPs) using anisotropic conductive adhesives (ACAs) solution for flip-chip interconnections
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Il Kim; Kyung-Woon Jang; Ho-Young Son; Jae-Han Kim; Kyung-Wook Paik
Year: 2008
Influence of process parameters on component assembly and drop test performance using a novel Anisotropic Conductive Adhesive for lead-free surface mount assembly
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:S. Manian Ramkumar; K. Srihari
Year: 2008
Surface treatment of MWCNT array and its polymer composites for TIM application
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Kyoung-sik Moon; Wei Lin; Hongjin Jiang; Hyunhyub Ko; Lingbo Zhu; C.P. Wong
Year: 2008
10-Gb/s × 12-ch downsized optical modules with electrical conductive film connector
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:A. Suzuki; T. Ishikawa; Y. Wakazono; D. Nagao; T. Hino; Y. Hashimoto; H. Masuda; S. Suzuki; M. Tamura; T.-i. Suzuki; K. Kikuchi; Y. Okada; H. Nakagawa; M. Aoyaghi; T. Mikawa
Year: 2008
Thin glass based electrical-optical circuit boards (EOCB) using ion-exchange technology for graded-index multimode waveguides
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:H. Schroder; N. Arndt-Staufenbiel; A. Beier; F. Ebling; M. Franke; E. Griese; S. Intemann; J. Kostelnik; T. Kuhler; R. Modinger; I. Roda; I. Schlosser
Year: 2008
A 77 GHz SiGe mixer in an embedded wafer level BGA package
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:M. Wojnowski; M. Engl; B. Dehlink; G. Sommer; M. Brunnbauer; K. Pressel; R. Weigel
Year: 2008
Reflowable ISM WLP
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Won Kyu Jeung; Chang Hyun Lim; Jingli Yuan; Seung Wook Park; Seog Moon Choi; Sung Yi
Year: 2008
Process technology for the fabrication of a Chip-in-Wire style packaging
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:M. Vanden Bulcke; F. Iker; I. De Preter; P. Muller; P. Soussan; E. Beyne; C. Van Hoof; K. Baert
Year: 2008
A novel, wafer-level stacking method for low-chip yield and non-uniform, chip-size wafers for MEMS and 3D SIP applications
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:C.S. Premachandran; J. Lau; Ling Xie; A. Khairyanto; K. Chen; Myo Ei Pa Pa; M. Chew; Won Kyoung Choi
Year: 2008
Effects of UBM thickness, contact trace structure and solder joint scaling on electromigration reliability of Pb-free solder joints
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Seung-Hyun Chae; J. Im; T. Uehling; P.S. Ho
Year: 2008
0.075 × 0.075 mm2 ultra-small 7.5 μm ultra-thin RFID-chip mounting technology
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:H. Noda; M. Usami
Year: 2008
Manufacturability and reliability of a high-speed CSP SRAM on an interposer package
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Kuo-Chuan Liu; J. Priest; Jie Xue; Jarsh Lin; Chin-Li Kao; Tong Hong Wang; Yi-Shao Lai
Year: 2008
A study on the rheological characterization and flow modeling of molded underfill (MUF) for optimized void elimination design
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Min Woo Lee; Woon Kab Jung; Eun Sook Sohn; Joon Yeob Lee; Chan Ha Hwang; Choon Heung Lee
Year: 2008
Package on Package warpage - impact on surface mount yields and board level reliability
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:N. Vijayaragavan; F. Carson; A. Mistry
Year: 2008
Module camber effect on card assembly and reliability for large flip chip BGA organic packages
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:I. de Sousa; H. McCormick; Hua Lu; R. Martel; S. Ouimet
Year: 2008
High temperature alternatives to ball grid coplanarity measurements to improve correlation to surface mount quality
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:P. Raghavan; N. Noolu; J. Sanchez; Yung Hsiang Lee
Year: 2008
Assembling of carbon nanotube structures by chemical anchoring for packaging applications
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Wei Lin; Yonghao Xiu; Lingbo Zhu; Kyoung-Sik Moon; C.P. Wong
Year: 2008
Dendritic palladium-silver nano-structure grown by electrochemical migration method for hydrogen sensing device
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Shin-Bok Lee; Eunsongyi Lee; Wooyoung Lee; Young-Chang Joo
Year: 2008
Laser processing of 3-D structures for embedded and integrated components: An application of flexible and printable nanomaterials in microelectronics
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:R.N. Das; F.D. Egitto; T.E. Antesberger; F. Marconi; How Lin; J.M. Lauffer; V.R. Markovich
Year: 2008
The superior drop test performance of SAC-Ti solders and its mechanism
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Weiping Liu; P. Bachorik; Ning-Cheng Lee
Year: 2008
Temperature dependence of mechanical properties of individual phases in Sn-3.0Ag-0.5Cu lead-free solder alloy
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Feng Gao; H. Nishikawa; T. Takemoto; Jianmin Qu
Year: 2008
Novel bus termination schemes to reduce IO power consumption on low power intel small form factor platforms
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:R. Das; J. Iyer; V. Suchitha; Y. Praveen K; Minh Ti Tran; S.A. Thomas; S.K. Gupta; W. Kraipak
Year: 2008
System performance comparisons of coreless and standard packages for data rate beyond 20 Gbps
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:W.T. Beyene; R. Schmitt; Hao Shi; J. Feng
Year: 2008
3D silicon integration
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:J.U. Knickerbocker; P.S. Andry; B. Dang; R.R. Horton; C.S. Patel; R.J. Polastre; K. Sakuma; E.S. Sprogis; C.K. Tsang; B.C. Webb; S.L. Wright
Year: 2008
Development of 3D silicon module with TSV for system in packaging
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Navas Khan; V.S. Rao; Samule Lim; Ho Soon We; V. Lee; Zhang Xiao Wu; Yang Rui; Liao Ebin
Year: 2008
Through silicon vias technology for CMOS image sensors packaging
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:D. Henry; F. Jacquet; M. Neyret; X. Baillin; T. Enot; V. Lapras; C. Brunet-Manquat; J. Charbonnier; B. Aventurier; N. Sillon
Year: 2008
A Silicon interposer BGA package with Cu-filled TSV and multi-layer Cu-plating interconnect
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:K. Kumagai; Y. Yoneda; H. Izumino; H. Shimojo; M. Sunohara; T. Kurihara; M. Higashi; Y. Mabuchi
Year: 2008
Modern test methods for a comprehensive thermo-mechanical deformation analysis in area-array-assemblies
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:D. Pustan; J. Wilde
Year: 2008
Angled high strain rate shear testing for SnAgCu solder balls
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:T.C. Chai; D.Q. Yu; J. Lau; W.H. Zhu; X.R. Zhang
Year: 2008
A modular segmentation approach for comprehensive electromagnetic modeling of the power distribution network
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:V. Kollia; A.C. Cangellaris
Year: 2008
Bit-pattern optimization for accurate analysis of complex high-speed interfaces
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:N. Singh; B. Mutnury; N. Pham; M. Cases; C. Wesley
Year: 2008
Package substrate built-in three-dimensional distributed matching circuit for high-speed SerDes applications
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:R. Oikawa
Year: 2008
An integrated passive balun on Si, SiGe, and GaAs substrates
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Li Li; D. Keyvani; Jangsup Yoon; V. Bhan
Year: 2008
Design and fabrication of integrated solenoid inductors with magnetic cores
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:D.W. Lee; Kyu-Pyung Hwang; S.X. Wang
Year: 2008
Fabrication and characterization of embedded capacitors in printed circuit boards using B-stage epoxy/BaTiO3 composite embedded capacitor films (ECFs)
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Sangyong Lee; Jin-Gul Hyun; Jim So Pak; Heejae Lee; Hyun Sin Jeon; Kyung-Wook Paik
Year: 2008
1200dpi thin film LED array by silicon photonics technology
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:M. Ogihara; T. Sagimori; M. Mutoh; T. Suzuki; T. Igari; H. Furuta; Y. Nakai; S. Morisaki; H. Fujiwara; I. Abiko; M. Sakuta
Year: 2008
Fine-pitch MOEMS packaging for novel Spatial Light Modulator
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Heung Woo Park; Yeong Gyu Lee; Chang Su Park; Ohk Kun Lim; Dong Hyun Park; Seok Kee Hong; Young Nam Hwang; Jong Hyeong Song; Yun Joon Choi; Sang Kyeong Yun
Year: 2008
A light emitting diode’s chip structure with low stress and high light extraction efficiency
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Liuxi Tan; Jia Li; Zongyuan Liu; Kai Wang; Pei Wang; Zhiying Gan; Sheng Liu
Year: 2008
Multi-chip integrated high-power white LED device on the multi-layer ceramic substrate
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Luqiao Yin; Weiqiao Yang; Yansheng Guo; Kejun Ma; Shuzhi Li; Mingfa Chen; Jia Li; Jianhua Zhang
Year: 2008
Thermal management and novel package design of high power light-emitting diodes
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Kuan Chun Chen; Y.K. Su; C.L. Lin; Yu-Hsuan Lu; Wen-Ling Li; R.W. Chuang; Jin-Quan Huang; Shi-Ming Chen
Year: 2008
Design optimization on the heat transfer and mechanical reliability of High Brightness Light Emitting Diodes (HBLED) package
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Shan Gao; Jupyo Hong; Sanghyun Shin; Yongki Lee; Seogmoon Choi; Sung Yi
Year: 2008
Designing small footprint, low-cost, high-reliability packages for performance sensitive MEMS sensors
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:V. Sarihan; Jian Wen; G. Li; T. Koschmieder; R. Hooper; R. Shumway; J. Macdonald
Year: 2008
Miniaturized camera system using advanced packaging techniques
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Erik Jung; M. Koch; S. Schmitz; R. Boutte; I. Harvey; T. Meacham; F. Solzbacher
Year: 2008
Influence of optical probe packaging on a 3D MEMS scanning micro-mirror for optical coherence tomography (OCT) applications
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:C.S. Premachandran; A. Khairyanto; K. Chen; J. Singh; Sandy Xl Wang; Xu Yingshun; Chen Nanguang; C.J.R. Sheppard; M. Olivo; J. Lau
Year: 2008
Through silicon via technology — processes and reliability for wafer-level 3D system integration
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:P. Ramm; M.J. Wolf; A. Klumpp; R. Wieland; B. Wunderle; B. Michel; H. Reichl
Year: 2008
Integration of high aspect ratio tapered silicon via for through-silicon interconnection
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:N. Ranganathan; Liao Ebin; Linn Linn; W.S.V. Lee; O.K. Navas; V. Kripesh; N. Balasubramanian
Year: 2008
Reliability testing of through-silicon vias for high-current 3D applications
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:S.L. Wright; P.S. Andry; E. Sprogis; B. Dang; R.J. Polastre
Year: 2008
Assessment of PCB pad cratering resistance by joint level testing
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:B. Roggeman; P. Borgesen; Jing Li; G. Godbole; P. Tumne; K. Srihari; T. Levo; J. Pitarresi
Year: 2008
A new method to evaluate BGA pad cratering in lead-free soldering
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Dongji Xie; C. Chin; Kar Hwee Ang; D. Lau; Dongkai Shangguan
Year: 2008
Validation of warpage limit for successful component surface mount (SMT)
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:S. Cho; D. Amir; A. Reichman
Year: 2008
A new method for equivalent acceleration of JEDEC moisture sensitivity levels
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Daniel Shi; Xuejun Fan; Bin Xie
Year: 2008
A 3D-WLCSP package technology: Processing and reliability characterization
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:P. Houston; Zhaozhi Li; D.F. Baldwin; G. Stout; T. Tessier
Year: 2008
20-μm-pitch Au micro-bump interconnection at room temperature in ambient air
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Ying-Hui Wang; T. Suga
Year: 2008
Development and performance characterizations of a QFN/HMT package
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Yi-Shao Lai; Pao-Huei Chang-Chien; Chi-Wen Chang; Tsung-Yueh Tsai; Sung-Ching Hung; A. Tseng; Keiji Takai; T. Hirashima
Year: 2008
Effect of thermal interface materials on manufacturing and reliability of Flip Chip PBGA and SiP packages
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Li Li; M. Nagar; Jie Xue
Year: 2008
Full automated packaging of high-power diode laser bars
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:J. Miesner; F. Frischkorn; N. Boenig; D. Rose; T. Vahrenkamp; K. Boucke
Year: 2008
Highly reliable multi stripe laser diodes
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:E. Wolak; K. Kuppuswamy; J. Harrison; Xu Jin; Hanxuan Li; B. Fidric; R. Miller; P. Cross; T. Towe; T. Truchan; Hoa Nguyen; C. Edirisinghe
Year: 2008
Finite element modeling and experimental validation of conventional and high speed shear testing in Pb-free environment
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:A. Ajmera; S.M. Ramkumar; Ti Lin Liu
Year: 2008
Design envelopes and optical feature extraction techniques for survivability of SnAg leadfree packaging architectures under shock and vibration
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:P. Lall; D. Iyengar; S. Shantaram; R. Pandher; D. Panchagade; J. Suhling
Year: 2008
Peridynamic theory for impact damage prediction and propagation in electronic packages due to drop
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:A. Agwai; I. Guven; E. Madenci
Year: 2008
Thermal stress simulation in the metal-insulator-metal (MIM) wafer fabrication process
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Yumin Liu; Yong Liu; S. Irving; T. Luk
Year: 2008
Effects of package design on top PoP package warpage
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Junfeng Zhao; Yuxiang Luo; Zhenyu Huang; Rong Ma
Year: 2008
Application of through mold via (TMV) as PoP base package
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Jinseong Kim; Kiwook Lee; Dongjoo Park; Taekyung Hwang; Kwangho Kim; Daebyoung Kang; Jaedong Kim; Choonheung Lee; C. Scanlan; C.J. Berry; C. Zwenger; L. Smith; M. Dreiza; R. Darveaux
Year: 2008
A dual face package using a post with wire component: Novel structure for PoP, wafer level CSP and compact image sensor packages
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:M. Ishihara; Y. Takehara; T. Yano; Y. Ino; T. Kurogi; K. Hashimoto; H. Kawano
Year: 2008
Selective one-step plasma patterning process for fluidic self-assembly of silicon chips
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:K. Bock; S. Scherbaum; E. Yacoub-George; C. Landesberger
Year: 2008
Transfer printing: An approach for massively parallel assembly of microscale devices
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:C.A. Bower; E. Menard; P.E. Garrou
Year: 2008
Ultra-thin, flexible electronics
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:B. Holland; R. Mcpherson; Tan Zhang; Zhenwei Hou; R. Dean; R.W. Johnson; L. Del Castillo; A. Moussessian
Year: 2008
Implementation of a mobile phone module with redistributed chip packaging
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:L.N. Ramanathan; B. Keser; C. Amrine; Trung Duong; S. Hayes; G. Leal; M. Mangrum; D. Mitchell; R. Wenzel
Year: 2008
Analysis of copper treatments and the effects on signal propagation
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:S.G. Pytel; P.G. Huray; S.H. Hall; R.I. Mellitz; G. Brist
Year: 2008
A study of crack propagation in Pb-free solder joints under drop impact
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:J.F.J. Caers; E.H. Wong; S.K.W. Seah; X.J. Zhao; C.S. Selvanayagam; W.D. van Driel; N. Owens; M. Leoni; L.C. Tan; L.C. Tan; P.L. Eu; Yi-Shao Lai; Chang-Lin Yeh
Year: 2008
Drop test reliability of lead-free chip scale packages
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:A. farris; Jianbiao Pan; A. Liddicoat; B.J. Toleno; D. Maslyk; Dongkai Shangguan; J. Bath; D. Willie; D.A. Geiger
Year: 2008
An alternative solder interconnect reliability test to evaluate drop impact performance
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:J.J.M. Zaal; H.P. Hochstenbach; W.D. van Driel; G.Q. Zhang
Year: 2008
Electrical modeling of wirebonds in stacked ICs using cylindrical conduction mode basis functions
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Ki Jin Han; M. Swaminathan; E. Engin
Year: 2008
Investigation of mutual inductive coupling in RF stacked-die assemblies
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:R.C. Frye; Kai Liu; Haijing Cao; Phoo Hlaing; M.P. Chelvam
Year: 2008
Probabilistic design approach for integrated passive devices in RF applications
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:P. Limaye; X. Rottenberg; R. d'Ippolito; S. Donders; W. De Raedt; I. De Wolf; E. Beyne
Year: 2008
Cost-competitive RF wafer test methodology for high volume production of complex RF ICs
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:A. Paganini; M. Slamani; Hanyi Ding; J. Ferrario; Nanju Na
Year: 2008
Development of novel, flexible, electrically conductive adhesives for next-generation microelectronics interconnect applications
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Yi Li; M.J. Yim; K. Moon; R.W. Zhang; C.P. Wong
Year: 2008
Reliability of ultra-thin chip-on-flex (UTCOF) with anisotropic conductive adhesive (ACA) joints
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Su-Tsai Lu; Wen-Hwa Chen
Year: 2008
Development of low temperature bonding using in-based solders
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Won Kyoung Choi; Daquan Yu; Chengkuo Lee; Liling Yan; A. Yu; Seung Wook Yoon; J.H. Lau; Moon Gi Cho; Yoon Hwan Jo; Hyuck Mo Lee
Year: 2008
Influence of NiTi shape memory alloy as under bump metallization on thermal mechanical behavior of solder joints
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Chia-Yan Tan; Jenq-Gong Duh
Year: 2008
A novel mask-less method of fabricating high aspect ratio microneedles for blood sampling
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:R. Bhandari; S. Negi; F. Solzbacher
Year: 2008
Development of micro fuel cells with organic substrates and electronics manufacturing technologies
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:R. Hahn; S. Wagner; S. Krumbholz; H. Reichl
Year: 2008
UV-activated surface modification of photo-cleavage polymer for contact printing applications
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:E.K.L. Chan; Cheng Yang; M.M.F. Yuen
Year: 2008
C4NP Cu-cored Pb-free flip chip interconnections
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Jae-Woong Nah; S.L. Buchwalter; P.A. Gruber; D.Y. Shih; B.K. Furman
Year: 2008
Reliability of high-end flip-chip package with large 45nm ultra low-k die
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:A. Bansal; Teck-Gyu Kang; Yuan Li
Year: 2008
Manufacture and ultra-high frequency performance of an LCP-based, Z-interconnect, flip-chip package
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:M.J. Rowlands; R.N. Das
Year: 2008
Method for improved thermal performance of flip chip on flex power devices
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:B. Vaccaro; J. Osenbach; M. Bachman; A. Amin; D. Crouthamel; T. Shilling; E. Thomas
Year: 2008
A novel method of growing aligned carbon nanotubes at low temperature by using integrated micro-heater
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Ting Xu; Hui Li; Zhihong Wang; Jianmin Miao
Year: 2008
Bumpless interconnect of 6-μm pitch Cu electrodes at room temperature
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:A. Shigetou; T. Itoh; K. Sawada; T. Suga
Year: 2008
Effect of board and package attributes on solder joint reliability of FCBGA packages based on IPC9701 characterization
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:J. Radhakrishnan
Year: 2008
Impact of package design and materials on reliability for temperature cycling, bend, and drop loading conditions
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:A. Syed; J. Scanlan; Se Woong Cha; Won Joon Kang; Eun Sook Sohn; Tae Seong Kim; Chang Gyun Ryu
Year: 2008
Stress measurements in large area array flip chip microprocessor chips
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:J.C. Roberts; M.K. Rahim; J.C. Suhling; R.C. Jaeger; P. Lall; Ron Zhang; J. Jones
Year: 2008
Chip package interaction evaluation for a high performance 65nm and 45nm CMOS Technology in a stacked die package with C4 and wirebond interconnections
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:C. Muzzy; D. Danovitch; H. Gagnon; R. Hannon; E. Kinser; P.V. McLaughlin; G. Mongeau; J.-G. Quintal; J. Sylvestre; E. Turcotte; J. Wright
Year: 2008
Reliability design and experiment of low cost WLP-QFN modules
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Dongji Xie; D. Geiger; Dongkai Shangguan
Year: 2008
Observations of the spontaneous growth of tin whiskers in various reliability conditions
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Sung-Won Han; Kyung-Seob Kim; Chung-Hee Yu; M. Osterman; M. Pecht
Year: 2008
50μm pitch Pb-free micro-bumps by C4NP technology
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Bing Dang; Da-Yuan Shih; S. Buchwalter; C. Tsang; C. Patel; J. Knickerbocker; P. Gruber; S. Knickerbocker; J. Garant; K. Semkow; K. Ruhmer; E. Hughlett
Year: 2008
A study on chip thinning process for ultra thin memory devices
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:S. Takyu; J. Sagara; T. Kurosawa
Year: 2008
Multichip self-assembly technique on flexible polymeric substrate
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:T. Fukushima; T. Konno; T. Tanaka; M. Koyanagi
Year: 2008
Die attach adhesives for 3D same-sized dies stacked packages
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Toh Ch; Mehta Gaurav; Tan Hua Hong; Ong Wilson Pl
Year: 2008
Development of wafer level NCF (non conductive film)
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:T. Nonaka; K. Fujimsru; N. Asahi; K.-i. Kasumi; Yu. Matsumoto
Year: 2008
A new bonding technology dealing with large CTE mismatch between large Si chips and Cu substrates
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:P.J. Wang; J.S. Kim; C.C. Lee
Year: 2008
Die-attach materials for high-density memory stacked die packaging
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:M. Huang; J. Gandhi; Shijian Luo; T. Jiang
Year: 2008
Methodology for modeling substrate warpage using copper trace pattern implementation
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:L. McCaslin; S.K. Sitaraman
Year: 2008
Validation of warpage for small form factor flip-chip BGA by experimental and numerical methodology
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Tsrong-Yi Wen; Shih-Chang Ku
Year: 2008
Delamination modeling of three-dimensional microelectronic systems
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:O. van der Sluis; P.H.M. Timmermans; R.B.R. van Silfhout; W.D. van Driel; G.Q. Zhang
Year: 2008
Fracture mechanics study of fatigue crack growth in solder joints under drop impact
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Jason Wang; S.K.W. Seah; E.H. Wong; D. Cadge
Year: 2008
Finite element based three dimensional crack propagation simulation on interfaces in electronic packages
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:U. Ozkan; H.F. Nied
Year: 2008
Peridynamic theory for failure prediction in multilayer thin-film structures of electronic packages
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:A. Agwai; I. Guven; E. Madenci
Year: 2008
A self-aligning latch-up mechanism in out of plane silicon microelectrode array for neural prosthesis
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:S. Negi; R. Bhandari; F. Solzbacher
Year: 2008
C4NP technology: Manufacturability, yields and reliability
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:E.D. Perfecto; D. Hawken; H.P. Longworth; H. Cox; K. Srivastava; V. Oberson; J. Shah; J. Garant
Year: 2008
Characterization of drop impact survivability of a 3D CSP stack module
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:D. Peterson; Cheng-fu Chen; P.C. Karulkar
Year: 2008
Directly synthesizing CNT-TIM on aluminum alloy heat sink for HB-LED thermal management
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Zhang Kai; M.M.F. Yuen; D.G.W. Xiao; Y.Y. Fu; P. Chan
Year: 2008
Disc-like copper vias fabricated in a silicon wafer: Design for reliability
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:E. Suhir; S. Savastiouk
Year: 2008
Drop reliability study of PBGA assemblies with SAC305, SAC105 and SAC105-Ni solder ball on Cu-OSP and ENIG surface finish
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:W.H. Zhu; Luhua Xu; J.H.L. Pang; X.R. Zhang; E. Poh; Y.F. Sun; A.Y.S. Sun; C.K. Wang; H.B. Tan
Year: 2008
Epoxy adhesion strength to ceramic surfaces in commercial optoelectronic assemblies
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:O. Williams; C. Liu; D.P. Webb; P. Firth
Year: 2008
Generation of surface acoustic waves for general sensing applications
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Kyu Tak Son; Hsu-hung Huang; C.C. Lee
Year: 2008
High brightness matrix LED assembly challenges and solutions
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:D.D. Evans
Year: 2008
Interfacial fracture properties and failure modeling for microelectronics
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:A. Xiao; H. Pape; B. Wunderle; K.M.B. Jansen; J. de Vreugd; L.J. Ernst
Year: 2008
Investigation of enhanced solder wetting in 63Sn/37Pb and Sn-Ag-Cu lead free alloy
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:S.J. Anson; J.G. Slezak; K. Srihari
Year: 2008
Laser sintering of Ag nanopaste film and its application to bond-pad formation
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:T. Niizeki; K. Maekawa; M. Mita; K. Yamasaki; Y. Matsuba; N. Terada; H. Saito
Year: 2008
Non-destructive monitoring of Au ball bond stress during high-temperature aging
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:M. Mayer
Year: 2008
Simultaneous through-silicon via and large cavity formation using deep reactive ion etching and aluminum etch-stop layer
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:J. Tian; M. Bartek
Year: 2008
A hermetic chip to chip bonding at low temperature with Cu/In/Sn/Cu joint
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Liling Yan; Chengkuo Lee; Daquan Yu; Won Kyoung Choi; Aibin Yu; Seung Uk Yoon; J.H. Lau
Year: 2008
Chip scale studies of BCB based polymer bonding for MEMS packaging
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:C.H. Wang; J. Zeng; K. Zhao; H.L. Chan
Year: 2008
Coupling noise analysis and high frequency design optimization of power/ground plane stack-up in embedded chip substrate cavities
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:N. Sankaran; V.C. Ramdas; Baik-Woo Lee; V. Sundaram; Ege Engin; M. Iyer; M. Swaminathan; R. Tummala
Year: 2008
Determination of solder bump stand-off height in a flip-chip sub-mount for Micro-Opto-Electro-Mechanical System (MOEMS) packaging applications
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:J.C.C. Lo; S.W.R. Lee; H.H.L. Wu; J.K.S. Lam
Year: 2008
Development and evaluation of lead free reflow soldering techniques for the flip chip bonding of large GaAs pixel detectors on Si readout chip
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:M. Klein; M. Hutter; H. Oppermann; T. Fritzsch; G. Engelmann; L. Dietrich; J. Wolf; B. Bramer; R. Dudek; H. Reichl
Year: 2008
Development of a 50mm dual Flip Chip Plastic Land Grid Array package for server applications
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:S. Ouimet; J. Casey; K. Marston; J. Muncy; J. Corbin; V. Jadhav; T. Wassick; I. Depatie
Year: 2008
Effect of organic package warpage and assembly challenges using thin core substrate
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:A. Dubey
Year: 2008
Electrically conductive adhesive with π-conjugated self-assembled molecular wire junctions for enhanced electrical and thermal properties
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Rongwei Zhang; Yi Li; Myung Jin Yim; Kyoung Sik Moon; Daoqiang Daniel Lu; C.P. Wong
Year: 2008
Enhancement of light efficiency of LED using a novel high refractive encapsulant
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Hsun-Tien Li; Chia-Wen Hsu; Kai-Chi Chen
Year: 2008
Evaluation of new substrate surface finish: Electroless nickel/electroless palladium/immersion gold (ENEPIG)
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Chun-Hsien Fu; Liang-Yi Hung; Don-Son Jiang; Chiang-Cheng Chang; Y.P. Wang; C.S. Hsiao
Year: 2008
Extremely-compact and high-performance (160Gbps = 20GB/s) optical semiconductor module using lead frame embedded optoelectronic ferrule
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:H. Uemura; H. Hamasaki; H. Furuyama; H. Numata; C. Takubo; H. Shibata
Year: 2008
Fabrication and assembly of high gain MEMS antennas for wireless communications
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:C.H. Wang; S.K. Pavuluri
Year: 2008
Low stress and high thermal conductive underfill for cu/low-k application
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Qizhen Liang; Kyoung-Sik Moon; Yuelan Zhang; C.P. Wong
Year: 2008
Mechanical shock robustness of different WLCSP types
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:P. Nummila; M. Johansson; S. Puro
Year: 2008
Novel flip-chip interconnection technology for millimeter wave applications
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:F. Felbier; F. Draheim; U. Goebel; H. Karstensen
Year: 2008
Prediction of drift in foil resistors
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:J. Szwarc; R. Golombick; Y. Hernik
Year: 2008
Process development and reliability evaluation for inline Package-on-Package (pop) assembly
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:J. Sjoberg; D.A. Geiger; Dongkai Shangguan
Year: 2008
Silver pick-up during tail formation and its effect on free air ball in thermosonic copper ball bonding
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:J. Lee; M. Mayer; Y. Zhou; S.J. Hong; J.T. Moon
Year: 2008
Studies on the thermal cycling reliability of fine pitch Cu/SnAg double-bump flip chip assemblies on organic substrates: Experimental results and numerical analysis
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Ho-Young Son; Ilho Kim; Jin-Hyoung Park; Soon-Bok Lee; Gi-Jo Jung; Byung-Jin Park; Kyung-Wook Paik
Year: 2008
System-in-package for extreme environments
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:S. Sivaswamy; Rui Wu; C. Ellis; M. Palmer; R.W. Johnson; P. McCluskey; K. Petrarca
Year: 2008
The development of Anisotropic Conductive Paste (ACP) to make solder metal connection
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:S. Kawamoto; K. Matsumura; Y. Abe
Year: 2008
The hybrid curing adhesive for image sensor module
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Y. Abe; K. Iwaya
Year: 2008
Ultra high Q embedded inductors in highly miniaturized family of low loss organic substrates
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:D. Athreya; V. Sundaram; M. Iyer; R. Tummala
Year: 2008
Electrodeposition of indium for bump bonding
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Yingtao Tian; Changqing Liu; D. Hutt; B. Stevens
Year: 2008
From Data to Events: Checking Properties on the Control of a System
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:C. Jacquet; F. Boulanger; D. Marcadet
Year: 2008
Vacuity Analysis by Fault Simulation
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:L. Di Guglielmo; F. Fummi; G. Pravadelli
Year: 2008
Latency-Insensitive Hardware/Software Interfaces
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:G. Hoover; F. Brewer; C. Gill
Year: 2008
Bisimulator 2.0: An On-the-Fly Equivalence Checker based on Boolean Equation Systems
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:R. Mateescu; E. Oudot
Year: 2008
A System Verilog Rewriting System for RTL Abstraction with Pentium Case Study
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:S. Haynal; T. Kam; M. Kishinevsky; E. Shriver; Xinning Wang
Year: 2008
Directed-Logical Testing for Functional Verification of Microprocessors
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:M. Katelman; J. Meseguer; S. Escobar
Year: 2008
Estimating the Performance of Cache Replacement Policies
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:D. Grund; J. Reineke
Year: 2008
Classification of General Data Flow Actors into Known Models of Computation
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:C. Zebelein; J. Falk; C. Haubelt; J. Teich
Year: 2008
On the Deterministic Multi-threaded Software Synthesis from Polychronous Specifications
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:B.A. Jose; S.K. Shukla; H.D. Patel; J.-P. Talpin
Year: 2008
Virtual prototyping AADL architectures in a polychronous model of computation
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Yue Ma; J.-P. Talpin; T. Gautier
Year: 2008
MEMOCODE 2008 Co-Design Contest
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:P. Schaumont; K. Asanovic; J.C. Hoe
Year: 2008
High-throughput Pipelined Mergesort
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:K. Fleming; Myron King; Man Cheuk Ng; A. Khan; M. Vijayaraghavan
Year: 2008
Hardware Accelerated Crypto Merge Sort: MEMOCODE 2008 Design Contest
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:V.J. Sananda
Year: 2008
H.264 Decoder: A Case Study in Multiple Design Points
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:K. Fleming; Chun-Chieh Lin; N. Dave; Arvind; G. Raghavan; J. Hicks
Year: 2008
GPU smoothing of quad meshes
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:T. Ni; Y. Yeo; A. Myles; V. Goel; J. Peters
Year: 2008
Example based skeletonization using harmonic one-forms
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Ying He; Xian Xiao; Hock-Soon Sean
Year: 2008
Sculptural forms from hyperbolic tessellations
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:G.W. Hart
Year: 2008
OCTOR: OCcurrence selecTOR in pattern hierarchies
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:J. Jang; J. Rossignac
Year: 2008
SHape REtrieval contest 2008: Stability of watertight models
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Silvia Biasotti; Marco Attene
Year: 2008
SHape REtrieval contest 2008: CAD models
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Ramanathan Muthuganapathy; Karthik Ramani
Year: 2008
SHape REtrieval contest 2008: 3D face scans
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Frank B. ter Haar; Mohamed Daoudi; Remco C. Veltkamp
Year: 2008
SHREC’08 entry: Invariant features for robust shape retrieval
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Dong Xu; Li Cui; Ping Hu; Weiguo Cao; Hua Li
Year: 2008
SHREC’08 entry: Visual based 3D CAD retrieval using Fourier Mellin Transform
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Xiaolan Li; A. Godil; A. Wagan
Year: 2008
SHREC’08 entry: 3D shape searching using object partitioning
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:A.I. Wagan; A. Godil; Xiaolan Li
Year: 2008
SHREC’08 entry: Registration and retrieval of 3D faces using a Point Distribution Model
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:P. Nair; A. Cavallaro
Year: 2008
SHREC’08 entry: 3D face recognition using moment invariants
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Dong Xu; Ping Hu; Weiguo Cao; Hua Li
Year: 2008
Polygonizing skeletal sheets of CT-scanned objects by partitioin of unity approximations
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Y. Nagai; Y. Ohtake; K. Kase; H. Suzuki
Year: 2008
Feature suppression based CAD mesh model simplification
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Shuming Gao; Wei Zhao; Fanqin Yang; Xiang Chen
Year: 2008
Robust curve reconstruction with k-order α-shapes
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:D. Krasnoshchekov; V. Polishchuk
Year: 2008
FPGA-Based Acceleration of the Computations Involved in Transcranial Magnetic Stimulation
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:O. Cref; I. Trestian; R. Tudoran; L. Cret; L. Vacariu
Year: 2008
Simulation-Based Approach for Evaluating On-Chip Interconnect Architectures
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:S. Suboh; M. Bakhouya; S. Lopez-Buedo; T. El-Ghazawi
Year: 2008
Polynomic Curve based Representation System Implemented using FPGAs
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:C. Pineiro; C. Valbuena; H. Mecha
Year: 2008
Function Call Optimisation in SystemC Hardware Compilation
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:J. Ditmar; S. McKeever
Year: 2008
Aerodynamics Analysis Acceleration through Reconfigurable Hardware
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:E. Andres; M. Molina; G. Botella; A. del Barrio; J. Mendias
Year: 2008
FPGA-Based Transmit/Receive Distributed Controller for the TR Modules of an L Band Antenna (SAR)
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:J. Siman; G. Jaquenod; H. Mascialino
Year: 2008
Design of a Coherent Generation and Acquisition System at 1,2GHz
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:M.G. Rodriguez
Year: 2008
Automated Signature Insertion in Combinational Logic Patterns for HDL IP Core Protection
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:E. Castillo; L. Parrilla; A. Garcia; U. Meyer-Baese; G. Botella; A. Lloris
Year: 2008
TDES Implementation in a Reconfigurable Computing Enviroment
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:J.A. Jaramillo-Villegas; E.M. Correa-Agudelo; R. Gomez-Londono
Year: 2008
Digital Data Processing Peripheral Design for an Embedded Application based on the Microblaze Soft Core
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:E. Ostua; J. Viejo; M.J. Bellido; A. Millan; J. Juan; A. Munoz
Year: 2008
Implementation of a Wireless Control System with Self Timed Activation for Mobile Robots
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:S. Ortega-Cisneros; J.J. Raygoza-Panduro; A. de la Mora; O. Castillo
Year: 2008
Implementation of a Frequency Measurement Circuit for High-Accuracy QCM Sensors
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:M.D. Valdes; M.J. Moure; L. Rodriguez; J. Farina
Year: 2008
Development Tools for Partial Reconfigurable Systems
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:F.V. Filho; E.L. Horta
Year: 2008
Impact of Cognitive Radio on Future Management of Spectrum
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:M. Nekovee
Year: 2008
Accumulative Interference Modeling for Cognitive Radios with Distributed Channel Access
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:M. Timmers; S. Pollin; A. Dejonghe; A. Bahai; L. Van der Perre; F. Catthoor
Year: 2008
Cognitive Radio Prototyping
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:P. Jung; A. Viessmann; C. Spiegel; A. Burnic; Z. Bai; G.H. Bruck; K. Statnikov; A. Waadt; S. Wang; X. Popon; R.R. Velilla; H. Saarnisaari; M. Alles; T. Brack; F. Kienle; F. Berens; S. Rotolo; F.M. Scalise; N. Wehn
Year: 2008
Dynamic Spectrum Assignment and Access Scenarios, System Architecture, Functional Architecture and Procedures for IEEE P1900.4 Management System
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:S. Filin; K. Ishizu; H. Murakami; H. Harada; G. Miyamoto; T.H. Nguyen; S. Kato; M. Hasegawa
Year: 2008
Signal Detection Scheme for MB-OFDM through Fractional Sampling
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:A. Kobori; Y. Kato; Y. Sanada
Year: 2008
Early Opportunities for Commercialization of TV Whitespace in the U.S
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:F.L. Martin; N.S. Correal; R.L. Ekl; P. Gorday; R. O'Dea
Year: 2008
Efficient scheme for DOA ESTIMATION of Multipath Clusters in WiMedia UWB systems
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:A.K. Marath; A.R. Leyman; H.K. Garg
Year: 2008
Thermal Stability in HVDC Cables: Whether it is Internal or External?
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:C. Chakradhar; T.S. Ramu
Year: 2008
On the DC Conductivity of HV DC Cable Insulation - Cautions in using the Empirical Models
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:C.C. Reddy; T.S. Ramu
Year: 2008
Complex Examination of a Cable Terminal Failure
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Z.A. Tamus; B. Nemeth; I. Kiss; R. Cselko; I. Berta
Year: 2008
Production of Corrosive Sulphur Free Transformer Fluids
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:S. Krawiec
Year: 2008
Experimental Investigations on Mineral and Ester Oils for Power Transformers
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:C. Perrier; A. Beroual
Year: 2008
Large Power Transformer Condition Assessment and Life Extension
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:O. Godswill; E.U. Ubeku; C.E. Mesharun
Year: 2008
A Comparison of Dielectric Characteristics and Voltage Endurance Life for Two High Voltage Coil Designs
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:M.K.W. Stranges; R. Omranipour; N. Stranges
Year: 2008
Fabrication of Permittivity Graded Materials for Reducing Electric Stress on Electrode Surface
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:M. Kurimoto; A. Kai; K. Kato; H. Okubo
Year: 2008
In Service Reduction of Corrosive Sulfur Compounds in Insulating Mineral Oils
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:V. Tumiatti; R. Maina; F. Scatiggio; M. Pompili; R. Bartnikas
Year: 2008


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