Molecular spectroscopy [Book Reveiw]
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:J.J. Shea
Year: 2000
Handbook of electrical engineering calculations [Book Reveiw]
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:J.J. Shea
Year: 2000
Contemporary instrumental analysis [Book Review]
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:J.J. Shea
Year: 2000
Surface treatment of plastics: technology and applications [Book Review]
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:J.J. Shea
Year: 2000
Technically speaking-a guide for communicating complex information [Book Review]
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:J.J. Shea
Year: 2000
The 75 greatest management decisions ever made ... and 21 of the worst [Book Review]
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:J.J. Shea
Year: 2000
Experience in PD site location in XLPE cables
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:T. Fawcett; D. Hilder; K. Johnson; B. Larzelere
Year: 2000
Modern plastics handbook [Book Review]
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:J.J. Shea
Year: 2000
Problems with modern air-cooled generator stator winding insulation
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:G. Griffith; S. Tucker; J. Milsom; G. Stone
Year: 2000
Low dielectric constant materials, vol. 565 [Book Review]
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:J.J. Shea
Year: 2000
Materials science of microelectromechanical systems (MEMS) devices, vol. 546 [Book Reviews]
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:J.J. Shea
Year: 2000
Polymer surfaces, interfaces and thin films [Book Reviews]
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:J.J. Shea
Year: 2000
X-cut miniature tuning forks realized by ion track lithography
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:G. Thornell; H. Rapp; K. Hjort
Year: 2000
Experimental determination of phase velocity of perfluorocarbons: Applications to targeted contrast agents
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:C.S. Hall; G.M. Lanza; J.H. Rose; R.J. Kaufmann; R.W. Fuhrhop; S.H. Handley; K.R. Waters; J.G. Miller; S.A. Wickline
Year: 2000
Sparse 2-D array design for real time rectilinear volumetric imaging
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:J.T. Yen; J.P. Steinberg; S.W. Smith
Year: 2000
Conductance measurements on a leaky SAW harmonic one-port resonator
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:C.K. Campbell; P.J. Edmonson
Year: 2000
Evaluation of the radiation pattern of a split aperture linear phased array for high frequency imaging
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:J.R. Talman; G.R. Lockwood
Year: 2000
Automatic computer-aided design of SAW filters using slanted finger interdigital transducers
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:H. Yatsuda; K. Yamanouchi
Year: 2000
Single element high frequency (<50 MHz) PZT sol gel composite ultrasound transducers
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:M. Lukacs; M. Sayer; S. Foster
Year: 2000
Axial control of thermal coagulation using a multi-element interstitial ultrasound applicator with internal cooling
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:D.L. Deardorff; C.J. Diederich
Year: 2000
Improvement of the longitudinal vibration system for the hybrid transducer ultrasonic motor
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:J. Satonobu; D. Lee; K. Nakamura; S. Ueha
Year: 2000
The effect of nonlinear signal transformations on bias errors in elastography
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:S.K. Alam; J. Ophir
Year: 2000
Elastographic axial resolution criteria: an experimental study
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:S.K. Alam; J. Ophir; T. Varghese
Year: 2000
Introduction to the special issue on frequency control and precision timing
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:M. Driscoll; L. Maloki; T.E. Parker
Year: 2000
A review of wireless SAW sensors
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:A. Pohl
Year: 2000
Micromachined resonant temperature sensors: theoretical and experimental results
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:T.G. Leblois; C.R. Tellier
Year: 2000
Long-term stability and performance characteristics of crystal quartz gauge at high pressures and temperatures
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:N. Matsumoto; Y. Sudo; B.K. Sinha; M. Niwa
Year: 2000
Phase noise measurements of 10-MHz BVA quartz crystal resonators
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:F. Sthal; M. Mourey; F. Marionnet; W.F. Walls
Year: 2000
Toward resonator anharmonic sensors for precision crystal oscillators: a Gaussian model
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Y.S. Shmaliy
Year: 2000
An improved method of MCXO
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Wei Zhou; Zongqiang Xuan; Haixia Liu; Yanfeng Wang
Year: 2000
Low phase noise operation of microwave oscillator circuits
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:J.-C. Nallatamby; M. Prigent; E. Vaury; A. Laloue; M. Camiade; J. Obregon
Year: 2000
High-Q whispering gallery traveling wave resonators for oscillator frequency stabilization
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:M.E. Tobar; E.N. Ivanov; P. Blondy; D. Cros; P. Guillon
Year: 2000
A dynamic analysis of the LO noise transfer mechanism in a Rb-cell frequency standard
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:F. Ortolano; N. Beverini; A. de Marchi
Year: 2000
Assessment of GPS carrier-phase stability for time-transfer applications
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:K.M. Larson; J. Levine; L.M. Nelson; T.E. Parker
Year: 2000
Topology optimization design of flextensional actuators
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:E.C.N. Silva; S. Nishiwaki; N. Kikuchi
Year: 2000
Focal translation by frequency shift in free space
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Hee Chun Song; P. Roux; W.A. Kuperman
Year: 2000
Analysis of viscous losses in the chemical interface layer of Love wave sensors
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:B. Jakoby; M.J. Vellekoop
Year: 2000
Substrates for zero temperature coefficient Love wave sensors
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:B. Jakoby; M.J. Vellekoop
Year: 2000
Vibrations and static responses of asymmetric bimorph disks of piezoelectric ceramics
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:P.C.Y. Lee; Rui Huang; Xiaoping Li; Wei-Heng Shih
Year: 2000
Densification, crystallization, and electrical properties of lead zirconate titanate glass-ceramics
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Boen Houng; Chan Young Kim; M.J. Haun
Year: 2000
Improvement in transient piezoelectric responses of NDE transceivers using selective damping and tuning networks
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:A. Ramos; J.L. San Emeterio; P.T. Sanz
Year: 2000
Piezoelectric micromotor using a metal-ceramic composite structure
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:B. Koc; P. Bouchilloux; K. Uchino
Year: 2000
Electroacoustic evaluations of 1-3 piezocomposite SonoPanel/sup TM/ materials
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:T.R. Howarth; R.Y. Ting
Year: 2000
Dielectric and electromechanical properties of barium titanate single crystals grown by templated grain growth
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:P.W. Rehrig; S. Trolier-McKinstry; Seung-Eek Park; G.L. Messing
Year: 2000
PZT thin films for microsensors and actuators: Where do we stand?
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:P. Muralt
Year: 2000
Intracardiac ultrasound scanner using a micromachine (MEMS) actuator
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:J.M. Zara; S.M. Bobbio; S. Goodwin-Johansson; S.W. Smith
Year: 2000
An object transport system using flexural ultrasonic progressive waves generated by two-mode excitation
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Byoung-Gook Loh; P.I. Ro
Year: 2000
Class D amplifier for a power piezoelectric load
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:K. Agbossou; J.-L. Dion; S. Carignan; M. Abdelkrim; A. Cheriti
Year: 2000
Stability and phase noise tests of two cryo-cooled sapphire oscillators
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:G.J. Dick; N.T. Wang
Year: 2000
The total deviation approach to long-term characterization of frequency stability
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:D.A. Howe
Year: 2000
Compact diode-laser based rubidium frequency reference
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:N. Vukicevic; A.S. Zibrov; L. Hollberg; F.L. Walls; J. Kitching; H.G. Robinson
Year: 2000
Toward a 3:1 frequency divider based on parametric oscillation using AgGaS/sub 2/ and PPLN crystals
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:A. Douillet; J.-J. Zondy; A. Yelisseyev; S. Lobanov; L. Isaenko
Year: 2000
Generation of 1/f noise in locked systems working in nonlinear mode
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:S. Dos Santos; M. Planat
Year: 2000
Performance evaluation of an optoelectronic oscillator
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:S. Romisch; J. Kitching; E. Ferre-Pikal; L. Hollberg; F.L. Walls
Year: 2000
On the frequency and amplitude spectrum and the fluctuations at the output of a communication receiver
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:M. Planat; C. Eckert
Year: 2000
Estimating the stability of N clocks with correlations
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:F. Torcaso; C.R. Ekstrom; E.A. Burt; D.N. Matsakis
Year: 2000
New seed geometry for growth of low dislocation synthetic quartz
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:A.H. Shinohara; M.C. Iano; C.K. Suzuki
Year: 2000
Micromachining of quartz plates: determination of a database by combined stereographic analysis and 3-D simulation of etching shapes
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:C.R. Tellier; T.G. Leblois
Year: 2000
ALC crystal oscillators based pressure and temperature measurement integrated circuit for high temperature oil well applications
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:N.A. Bianchi; J.-M.M. Karam; B. Courtois
Year: 2000
Interrogation oscillator noise rejection in the comparison of atomic fountains
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:S. Bize; Y. Sortais; P. Lemonde; Shougang Zhang; P. Laurent; G. Santarelli; C. Salomon; A. Clairon
Year: 2000
PVDF reference hydrophone development in the UK-from fabrication and lamination to use as secondary standards
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:S. Robinson; R. Preston; M. Smith; C. Millar
Year: 2000
Wideband spherically focused PVDF acoustic sources for calibration of ultrasound hydrophone probes
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:A. Selfridge; P.A. Lewin
Year: 2000
The radiation field characteristics of piezoelectric polymer membrane transducers when operating into air
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:G. Hayward; G. Benny; R. Banks; W. Galbraith
Year: 2000
Time domain evaluation of resonance antireflection (RAR) signals for ultrasonic density measurement
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:M. Hirnschrodt; A. Von Jeana; T. Vontz; B. Fischer; R. Lerch; H. Meixner
Year: 2000
Theory for shear horizontal surface acoustic waves in finite synchronous resonators
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:J. Koskela; V.P. Plessky; M.M. Salomaa
Year: 2000
Optimization of composite transducer designing in high frequency applications
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Haodong Wu; Jiming Lin; Huai Gao; Yongan Shui; Qiang Xue
Year: 2000
Under excitation limiter and its role in preventing excessive synchronous generator stator end-core heating
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:S.S. Choi; X.M. Jia
Year: 2000
Modeling of wind farms in the load flow analysis
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:A.E. Feijoo; J. Cidras
Year: 2000
Advanced SVC models for Newton-Raphson load flow and Newton optimal power flow studies
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:H. Ambriz-Perez; E. Acha; C.R. Fuerte-Esquivel
Year: 2000
Using integer programming to refine Lagrangian-based unit commitment solutions
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:S. Takriti; J.R. Birge
Year: 2000
Multicontingency steady state security evaluation using fuzzy clustering techniques
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:M.A. Matos; N.D. Hatziargriou; J.A. Pecas Lopes
Year: 2000
A critical evaluation of step size optimization based load flow methods
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:L.M.C. Braz; C.A. Castro; C.A.F. Murati
Year: 2000
A simulation model for a competitive generation market
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:I. Otero-Novas; C. Meseguer; C. Batlle; J.J. Alba
Year: 2000
FACTS-based power flow control in interconnected power system
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Naihu Li; Yan Xu; Heng Chen
Year: 2000
Very short-term load forecasting using artificial neural networks
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:W. Charytoniuk; M.-S. Chen
Year: 2000
Fuzzy engineering economic analysis [of electric utilities]
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:A.D. Dimitrovski; M.A. Matos
Year: 2000
Assessing eigenvalue sensitivities [power system control simulation]
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:E.E. Souza Lima; L.F. De Jesus Fernandes
Year: 2000
Identification of voltage collapse through direct equilibrium tracing
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Z. Feng; V. Ajjarapu; B. Long
Year: 2000
A new eigen-sensitivity theory of augmented matrix and its applications to power system stability analysis
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Hae-Kon Nam; Yong-Ku Kim; Kwan-Shik Shim; K.Y. Lee
Year: 2000
Dynamic stability analysis of the interconnected Colombia-Venezuela power system
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:F. Aboytes; F. Sanchez; A.I. Murcia Cabra; J.E. Gomez Castro
Year: 2000
Contingency screening for steady-state security analysis by using FFT and artificial neural networks
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:T.S. Sidhu; Lan Cui
Year: 2000
Impact of subcycle transfer switches on distribution system reliability
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:R.E. Brown; J.R. Ochoa
Year: 2000
Experience with the connection of large variable speed compressor drives to HV utility distribution systems
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:G. Duchon; W. Schultz; C. Unger; L. Voss; B. Lockley; J. Leuw
Year: 2000
A case study on blackout restoration as an educational tool
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:C. Middlebrook; V. Ranganathan; N.N. Schulz
Year: 2000
A personal computer graphical environment for industrial distribution system education, design, and analysis
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Ming-Tong Tsay; Shun-Yu Chan
Year: 2000
Reactive power pricing: a conceptual framework for remuneration and charging procedures
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:J. Barquin Gil; T.G. San Roman; J.J. Alba Rios; P. Sanchez Martin
Year: 2000
Multi-period probabilistic production cost model including dispatch constraints
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:J. Perez-Ruiz; A.J. Conejo
Year: 2000
Symmetrical components in the time domain and their application to power network calculations
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:G.C. Paap
Year: 2000
Strategies for handling UPFC constraints in steady-state power flow and voltage control
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Jun-Yong Liu; Yong-Hua Song; P.A. Mehta
Year: 2000
A comparison of distributed optimal power flow algorithms
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:B.H. Kim; R. Baldick
Year: 2000
A study of the homogeneous algorithm for dynamic economic dispatch with network constraints and transmission losses
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:R.A. Jabr; A.H. Coonick; B.J. Cory
Year: 2000
Factoring the elasticity of demand in electricity prices
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:D.S. Kirschen; G. Strbac; P. Cumperayot; D. de Paiva Mendes
Year: 2000
Optimal electricity supply bidding by Markov decision process
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:H. Song; C.-C. Liu; J. Lawarree; R.W. Dahlgren
Year: 2000
Large scale probabilistic transient stability assessment using BC Hydro's on-line tool
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:E. Vaahedi; W. Li; T. Chia; H. Dommel
Year: 2000
Semi-Newton load flow algorithms in transient security simulations
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:S. Jovanovic
Year: 2000
Sliding mode control of wind energy systems with DOIG-power efficiency and torsional dynamics optimization
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:H. De Battista; P.F. Puleston; R.J. Mantz; C.F. Christiansen
Year: 2000
Interactions between, and effectiveness of, power system stabilizers and FACTS device stabilizers in multimachine systems
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:M.J. Gibbard; D.J. Vowles; P. Pourbeik
Year: 2000
A comprehensive approach for preventive and corrective control to mitigate voltage collapse
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Zhihong Feng; V. Ajjarapu; D.J. Maratukulam
Year: 2000
Transient stability limit conditions analysis using a corrected transient energy function approach
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Da-Zhong Fang; T.S. Chung; Yao Zhang; Wennan Song
Year: 2000
Load recovery in the pulp and paper industry following a disturbance
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:E. Agneholm; J.E. Daalder
Year: 2000
A multiple objective decision support model for the selection of remote load control strategies
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:H. Jorge; C.H. Antunes; A.G. Martins
Year: 2000
A homogeneous linear programming algorithm for the security constrained economic dispatch problem
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:R.A. Jabr; A.H. Coonick; B.J. Cory
Year: 2000
Coordinated design of under-excitation limiters and power system stabilizers
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:S.S. Choi; X.M. Jia
Year: 2000
Testing equality constraint hypotheses in weighted least squares state estimators
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:A. Monticelli
Year: 2000
A study of basic bidding strategy in clearing pricing auctions
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Shangyou Hao
Year: 2000
Analysis of asymmetrical faults in power systems using dynamic phasors
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:A.M. Stankovic; T. Aydin
Year: 2000
A static optimization approach to assess dynamic available transfer capability
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:E. De Tuglie; M. Dicorato; M. La Scala; P. Scarpellini
Year: 2000
Robust design and coordination of multiple damping controllers using nonlinear constrained optimization
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:I. Kamwa; G. Trudel; L. Gerin-Lajoie
Year: 2000
Optimal response of a thermal unit to an electricity spot market
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:J.M. Arroyo; A.J. Conejo
Year: 2000
A fast voltage security assessment method using adaptive bounding
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Hang Liu; A. Bose; V. Venkatasubramanian
Year: 2000
Optimal power flow solutions under variable load conditions
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:K.C. Almeida; R. Salgado
Year: 2000
Estimating the variance of production cost using a stochastic load model
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Jia-Yo Chiang; A.M. Breipohl; F.N. Lee; R. Adapa
Year: 2000
Risk based voltage security assessment
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Hua Wan; J.D. McCalley; V. Vittal
Year: 2000
Designing incentive compatible contracts for effective demand management
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:M. Fahrioglu; F.L. Alvarado
Year: 2000
Identification-based power unit model for load-frequency control purposes
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Y. Hain; R. Kulessky; G. Nudelman
Year: 2000
Genetic algorithm-aided design of a fuzzy logic stabilizer for a superconducting generator
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:R.A.F. Saleh; H.R. Bolton
Year: 2000
Voltage stability analysis: V-Q power flow simulation versus dynamic simulation
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:B.H. Chowdhury; C.W. Taylor
Year: 2000
The use of fault-recorder data for diagnosing timing and other related faults in electricity transmission networks
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:M. Chantler; P. Pogliano; A. Aldea; G. Tornielli; T. Wyatt; A. Jolley
Year: 2000
Discussion of "The application of power system stabilizers to a multigenerator plant" [and reply]
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:M.J. Gibbard; D.J. Vowles; G. Rogers
Year: 2000
The Metropolis Algorithm
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:I. Beichl; F. Sullivan
Year: 2000
Virtual prototyping of solid propellant rockets
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:M.T. Heath; W.A. Dick
Year: 2000
Our perspective on the Alliance Program's benefits
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:D. Crawford; D. McCoy; D. Nowak
Year: 2000
The multicanonical Monte Carlo method
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Jim Gubernatis; Naomichi Hatano
Year: 2000
Basic: the little language that wouldn't die
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:D. L. Shirer
Year: 2000
Teaching techies to become entrepreneurs
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:D.I. Lewin
Year: 2000
Studying the Earth with interferometric radar
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:H.A. Zebker
Year: 2000
Rapid prototyping of virtual environments
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:M. Lanzagorto; R. Rosenberg; L.J. Rosenblum; E.Y. Kuo
Year: 2000
Efficient free-energy calculations by the simulation of nonequilibrium processes
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:M. de Koning; Wei Cai; A. Antonelli; S. Yip
Year: 2000
Sun PCi provides the best of two worlds
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:D. Tougaw
Year: 2000
Simulating the Glast satellite with Gismo
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:T. Burnett; C. Chaput; H. Arrighi; J. Norris; D.J. Suson
Year: 2000
Regression lines: more than meets the eye
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:K.D. Concannon; W.J. Thompson
Year: 2000
3D simulations of interacting particles
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:H. Hortel; M. Ludke
Year: 2000
Do databases need protection? From whom?
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:D.I. Lewin
Year: 2000
Using tagged MRI to reconstruct a 3D heartbeat
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:I. Haber; D.N. Metaxas; L. Axel
Year: 2000
Simulation of vehicular traffic: a statistical physics perspective
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:D. Chowdhury; L. Santen; A. Schadschneider
Year: 2000
Atomic scale modeling of polymerization catalysts
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:T.K. Woo; S. Patchkovskii; T. Ziegler
Year: 2000
Extremal optimization: heuristics via coevolutionary avalanches
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:S. Boettcher
Year: 2000
A computer-aided introductory course in electricity and magnetism
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:P.A. Assimakopoulos
Year: 2000
Janus: The Ideal Patron For Computing
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:N.P. Smith
Year: 2000
The Internet [Technology 2000 analysis and forecast]
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:R. Comerford
Year: 2000
Consumer electronics [Technology 2000 analysis and forecast]
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:T.S. Perry
Year: 2000
Technical software [Technology 2000 analysis and forecast]
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:K. Kornbluh
Year: 2000
Electronic design automation [Technology 2000 analysis and forecast]
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:L. Geppert
Year: 2000
Test and measurement [Technology 2000 analysis and forecast]
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:E.A. Bretz
Year: 2000
The environment [Technology 2000 analysis and forecast]
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:T.S. Perry
Year: 2000
Power and energy [Technology 2000 analysis and forecast]
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:W. Sweet
Year: 2000
Transportation [Technology 2000 analysis and forecast]
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:E.A. Bretz
Year: 2000
Aerospace and military [Technology 2000 analysis and forecast]
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:P. Scott
Year: 2000
Jon Rubinstein [biography]
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:T.S. Perry
Year: 2000
False alarm, nuclear danger
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:G. Forden; P. Podvig; T.A. Postol
Year: 2000
How to lengthen the nuclear fuse
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:H.A. Feiveson; B.G. Blair
Year: 2000
Minding Russia's nuclear store
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:D.E. Mosher; O. Bukharin; T.E. Perry
Year: 2000
Modeling the wiring of deep submicron ICs
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:M.G. Walker
Year: 2000
120000 leagues under the sea [undersea optical cables]
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:M. Mandell
Year: 2000
Lasers speed up board production
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:A.R. Ehsani; M. Kesler
Year: 2000
Up against gates
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:R. Teitelman
Year: 2000
Radar's first comprehensive history [Books]
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:D. Zimmerman
Year: 2000
Web style intranet speeds design flow
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:R. Eads
Year: 2000
The Electric Century
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:F. Nebeker
Year: 2000
Electrical injuries. engineering, medical, and legal aspects [Books]
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:W. Sweet
Year: 2000
The tether solution [space propulsion, electrodynamic tether]
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:L. Johnson
Year: 2000
Microprocessors: the off-beat generation
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:L. Geppert
Year: 2000
The multifaceted Richard W. Sonnenfeldt
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:W. Sweet
Year: 2000
Analyze jitter to improve high-speed design
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:M. Lauterbach; T. Wey
Year: 2000
Handhelds duke it out for the Internet
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:R. Comerford
Year: 2000
Cell phones answer Internet's call
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:W. Sweet
Year: 2000
Boston builds a high-IQ highway
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:E.A. Bretz
Year: 2000
Don't be shocked: power lines are safe!
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:R.L. Coren
Year: 2000
Proven skills: the new yardstick for schools
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:T.E. Bell
Year: 2000
Architecture drives test system standards
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:J. Mueller; R. Oblad
Year: 2000
Defragmenting really speeds up Windows NT machines
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:D. Robb
Year: 2000
The PC goes ready-to-wear
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:S. Ditlea
Year: 2000
A bright new page in portable displays
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:G.P. Crawford
Year: 2000
Engineers turn to e-learning
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:R. Ubell
Year: 2000
Power education at the crossroads
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:B.H. Chowdhury
Year: 2000
Internet ethics [Books]
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:M.C. Loui
Year: 2000
Database nation; the death of privacy in the 21st century [Books]
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:L.E. Harris
Year: 2000
Gene sequencing's industrial revolution
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:J. Hodgson
Year: 2000
Chip detectives [reverse engineering]
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:J. Kumagai
Year: 2000
NASA's big push for the space station
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:J. Oberg
Year: 2000
Bluetooth's slow dawn
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:R. Schneiderman
Year: 2000
Calibration ensures accuracy
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:E. Kruft; P. Packebush
Year: 2000
The many firsts of computer development [Books]
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:N. Ensmenger
Year: 2000
Fourier analysis for the masses [Books]
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:A.D. Snider
Year: 2000
Russia's sorry infrastructure
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:J. Oberg
Year: 2000
Watching the clocks
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:T.S. Perry
Year: 2000
Development of a technique for on-line detection of shorts in field windings of turbine-generator rotors: circuit design and testing
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:A.S. Kulkarni; M.A. El-Sharkawi; R.J. Marks; G. Andexler; Jian Xing; I. Kerszenbaum
Year: 2000
Optimum geometry for torque ripple minimization of switched reluctance motors
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:F. Sahin; H.B. Ertan; K. Leblebicioglu
Year: 2000
Optimization-based steady state analysis of three phase self-excited induction generator
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:A.L. Alolah; M.A. Alkanhal
Year: 2000
A neural network based power system stabilizer suitable for on-line training-a practical case study for EGAT system
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:B. Changaroon; S.C. Srivastava; D. Thukaram
Year: 2000
Dynamic simulation of dynamic eccentricity in induction machines-winding function approach
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:G.M. Joksimovic; M.D. Durovic; J. Penman; N. Arthur
Year: 2000
A three-phase multi-stress accelerated electrical aging test facility for stator bars
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:R. Morin; R. Bartnikas; P. Menard
Year: 2000
Identification of armature, field, and saturated parameters of a large steam turbine-generator from operating data
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:H.B. Karayaka; A. Keyhani; B.L. Agrawal; D.A. Selin; G.T. Heydt
Year: 2000
A novel 16/6 phase modulated winding
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:J.H.H. Alwash; K.S. Ismail; J.F. Eastham
Year: 2000
A multiple reference frame synchronous estimator/regulator
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:P.L. Chapman; S.D. Sudhoff
Year: 2000
Bidirectional starting of a symmetrical two-phase switched reluctance machine
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:R. Hamdy; J. Fletcher; B.W. Williams
Year: 2000
A systematic method for the determination of the parameters of synchronous machines from the results of frequency response tests
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:A. Walton
Year: 2000
Impact of dynamic cross-saturation on accuracy of saturated synchronous machine models
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:E. Levi; V.A. Levi
Year: 2000
Distributed steady state nonlinear modeling of turboalternators
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:M.L. Awad; G.R. Slemon; M.R. Iravani
Year: 2000
Efficiency testing of motors powered from pulse-width modulated adjustable speed drives
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:D.A. Casada; J.D. Kueck; H. Staunton; M.C. Webb
Year: 2000
Characteristic of cylindrical-rotor synchronous generator
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:N.C. Kar; T. Murata; J. Tamura
Year: 2000
Probabilistic production costing of diesel-wind energy conversion systems
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:S.H. Karaki; R.B. Chedid; R. Ramadan
Year: 2000
Robust design of multimachine power system stabilizers using simulated annealing
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:M.A. Abido
Year: 2000
Slotless permanent magnet synchronous motor operation without a high resolution rotor angle sensor
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:T.D. Batzel; K.Y. Lee
Year: 2000
Internal faults in synchronous machines. II. Model performance
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:P.P. Reichmeider; D. Querrey; C.A. Gross; D. Novosel; S. Salon
Year: 2000
A simple nonlinear model of the switched reluctance motor
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:V. Vujicic; S.N. Vukosavic
Year: 2000
Novel approach to the solution of temperature distribution in the stator of an induction motor
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Chang-Chou Hwang; S.S. Wu; Y.H. Jiang
Year: 2000
Influence of design parameters on cogging torque in permanent magnet machines
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Z.Q. Zhu; D. Howe
Year: 2000
Wide range operation of a power unit via feedforward fuzzy control [thermal power plants]
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:R. Garduno-Ramirez; K.Y. Lee
Year: 2000
Stability of a synchronous generator with diode-bridge rectifier and back-EMF load
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Ma Weiming; Hu An; Liu Dezhi; Zhang Gaifan
Year: 2000
Redistribution and bumping of a high I/O device for flip chip assembly
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:L.A. Keser; R. Bajaj; T. Fang
Year: 2000
On enhancing eutectic solder joint reliability using a second-reflow-process approach
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Kuo-Ning Chiang; Yung-Te Lin; Hsien-Chie Cheng
Year: 2000
Ultra-thin electronic device package
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:K.Y. Chen; R.L.D. Zenner; M. Ameson; D. Mountain
Year: 2000
High performance chip to substrate interconnects utilizing embedded structure
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:T.A. Juhola; B. Kerzar; M. Mokhtari; L.F. Eastman
Year: 2000
Extraction of SPICE-type equivalent circuits of microwave components and discontinuities using the genetic algorithm optimization technique
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:P.L. Werner; R. Mittra; D.H. Werner
Year: 2000
Electromagnetic simulation of bonding wires and comparison with wide band measurements
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:C. Schuster; G. Leonhardt; W. Fichtner
Year: 2000
Nondestructive defect detection in multilayer ceramic capacitors using an improved digital speckle correlation method with wavelet packet noise reduction processing
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Y.C. Chan; K.C. Hung; X. Dai
Year: 2000
Characterization of interfacial adhesion damage induced by accelerated life testing
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Jongwoo Park; D.G. Harlow; H.F. Nied
Year: 2000
Reliability of thick Al wire bonds in IGBT modules for traction motor drives
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:J. Onuki; M. Koizumi; M. Suwa
Year: 2000
Heat transfer from pin-fin heat sinks under multiple impinging jets
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:H.A. El-Sheikh; S.V. Garimella
Year: 2000
Correction to "Die-cracking and reliable die design for flip-chip assemblies"
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:S. Michaelides; S.K. Sitaraman
Year: 2000
Foreword additional contributions from the 49th electronic components and technology conference
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:J.P. Krusius; L.S. Watkins
Year: 2000
2 Gbit/s small form factor fiber-optic transceiver for single mode optical fiber
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Y. Sunaga; R. Takahashi; T. Tokoro; M. Kobayashi
Year: 2000
Performance comparison of small form factor fiber optic connectors
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:J.M. Trewhella; C.M. DeCusatis; J. Fox
Year: 2000
Wafer level chip scale packaging (WL-CSP): an overview
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:P. Garrou
Year: 2000
A minimal CSP
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:G.A. Rinne; J.D. Walling; J.D. Mis
Year: 2000
Ultra CSP/sup TM/-a wafer level package
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:P. Elenius; S. Barrett; T. Goodman
Year: 2000
MicroSMD-a wafer level chip scale package
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:N. Kelkar; R. Mathew; H. Takiar; L. Nguyen
Year: 2000
Wafer-level chip size package (WL-CSP)
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:M. Topper; S. Fehlberg; K. Scherpinski; C. Karduck; V. Glaw; K. Heinricht; P. Coskina; O. Ehrmann; H. Reichl
Year: 2000
Improved thermal fatigue reliability for flip chip assemblies using redistribution techniques
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:B. Vandevelde; E. Beyne
Year: 2000
Wafer-level chip scale packaging: benefits for integrated passive devices
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:H.M. Clearfield; J.L. Young; S.D. Wijeyesekera; E.A. Logan
Year: 2000
Development of three-dimensional memory die stack packages using polymer insulated sidewall technique
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Hyoung Soo Ko; J.S. Kim; Hyun Gook Yoon; Se Young Jang; Sung Dong Cho; Kyung Wook Paik
Year: 2000
A novel robust and low cost chips package and its thermal performance
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Soon-Jin Cho; Sang-Wook Park; Myung-Guen Park; Deok-Hoon Kim
Year: 2000
Application of the Taguchi method to chip scale package (CSP) design
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:A. Mertol
Year: 2000
Effect of randomness of Cu-Sn intermetallic compound layer thickness on reliability of surface mount solder joints
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:W. Huang; O.A. Palusinski; D.L. Dietrich
Year: 2000
A comparison of hourly versus daily testing methods for evaluating the reliability of water soluble fluxes
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:W.J. Ready; L.J. Turbini
Year: 2000
Factors influencing the permittivity of polymer/ceramic composites for embedded capacitors
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:S. Ogitani; S.A. Bidstrup-Allen; P.A. Kohl
Year: 2000
Passively aligned LD/PD array submodules by using micro-capillaries
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:H. Takahara; N. Tanaka; Y. Arai
Year: 2000
Design and performance evaluation of microprocessor packaging capacitors using integrated capacitor-via-plane model
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Yuan-Liang Li; Teong-Guang Yew; Chee Yee Chung; D.G. Fugueroa
Year: 2000
Broadband modeling and measurement of the signal behavior in S/390 MCM packages
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:F.M. Ktata; U. Arz; H. Grabinski
Year: 2000
Limitations on the extraction of loss tangent from submicron transmission line test structures
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:R.J. Friar; D.P. Neikirk
Year: 2000
Impact of solder pad size on solder joint reliability in flip chip PBGA packages
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:L.L. Mercado; V. Sarihan; Y. Guo; A. Mawer
Year: 2000
Impact properties of PBGA assemblies reflowed in nitrogen ambient and compressed air
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Y.P. Wu; Y.C. Chan
Year: 2000
Analytical approach to temperature evaluation in bonding wires and calculation of allowable current
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:G.T. Nobauer; H. Moser
Year: 2000
Process induced warpage in multitiled alumina substrates for large area MCM-D processing
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:A.X.H. Dang; I.C. Ume; S.K. Bhattacharya
Year: 2000
A fast 3D modeling approach to electrical parameters extraction of bonding wires for RF circuits
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Xiaoning Qi; P. Yue; T. Arnborg; H.T. Soh; H. Sakai; Zhiping Yu; R.W. Dutton
Year: 2000
A compact three-dimensional packaging technique using super-fine-pitch coaxial connector arrays for on-board satellite equipment
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:F. Ishitsuka; N. Iwasaki; T. Ohira; Y. Suzuki; Y. Ando
Year: 2000
Development of measurement system for die-pad behavior in IC encapsulation process using Hall elements
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:M. Sato; H. Yokoi
Year: 2000
Linear fracture mechanics analysis on growth of interfacial delamination in LSI plastic packages under temperature cyclic loading-Part II: Material properties and package geometry factors
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:T. Saitoh; H. Matsuyama; M. Toya
Year: 2000
An investigation of the electrical contact resistance of corroded pore sites on gold plated surfaces
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:R. Martens; M.G. Pecht
Year: 2000
Underfill adhesion to BCB (Cyclotene/sup TM/) bumping and redistribution dielectrics
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:P. Garrou; D. Scheck; Jang-Hi Im; J. Hetzner; G. Meyers; D. Hawn; Jiali Wu; M.B. Vincent; C.P. Wong
Year: 2000
Influences of molding conditions on die-pad behavior in IC encapsulation process analyzed by Hall element method
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:M. Sato; H. Yokoi
Year: 2000
Assessment of backside processes through die strength evaluation
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:B.H. Yeung; V. Hause; Tien-Yu Lee
Year: 2000
Special section on microsystems design and packaging (Forward)
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Year: 2000
Packaging design of microsystems and meso-scale devices
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:T.-R. Hsu
Year: 2000
MEMS post-packaging by localized heating and bonding
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:L. Lin
Year: 2000
Study of self-alignment of /spl mu/BGA packages
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:K.C. Hung; Y.C. Chan; P.L. Tu; H.C. Ong; D.P. Webb; J.K.L. Lai
Year: 2000
Modeling and evaluation criterion for thermocompression flip-chip bonding
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:T.S. McLaren; Y.-C. Lee
Year: 2000
Low-cost large area processing using small area substrates-a novel multitiled palletization concept for MCM-D thin film process
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:S.K. Bhattacharya; B.M. Gardner; J. Qu; D.F. Baldwin; R.R. Tummala
Year: 2000
Fabrication of semiconductor optical switch module using laser welding technique
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Seung-Goo Kang; Min-Kyu Song; Seong-Su Park; Sang-Hwan Lee; Nam Hwang; Hee-Tae Lee; Kwang-Ryong Oh; Gwan-Chong Joo; Donghan Lee
Year: 2000
Escape routing design to reduce the number of layers in area array packaging
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:M. Horiuchi; E. Yoda; Y. Takeuchi
Year: 2000
Optimal design of electronic system utilizing an integrated multidisciplinary process
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:B.D. Mottahed; S. Manoochehri
Year: 2000
Residual shear strength of Sn-Ag and Sn-Bi lead-free SMT joints after thermal shock
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:N.M. Poon; C.M.L. Wu; J.K.L. Lai; Y.C. Chan
Year: 2000
Solder bump reliability-issues on bump layout
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:T. Alander; P. Heino; E. Ristolainen
Year: 2000
Comparative study of micro-BGA reliability under bending stress
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:P.L. Tu; Y.C. Chan; K.C. Hung; J.K.L. Lai
Year: 2000
Online smoothing of variable-bit-rate streaming video
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:S. Sen; J.L. Rexford; J.K. Dey; J.F. Kurose; D.F. Towsley
Year: 2000
Methodologies for designing video servers
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:D. Meliksetian; Frank Feng-Kuo Yu; C.Y.R. Chen
Year: 2000
Low-power architectures for compressed domain video coding co-processor
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Jie Chen; K.J. Ray Liu
Year: 2000
Pockels high-voltage measurement system
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:J.C. Santos; M.C. Taplamacioglu; K. Hidaka
Year: 2000
The impact of large steel mill loads on power generating units
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:P. Solanics; K. Kozminski; M. Bajpai; J. Esztergalyos; E. Fennell; J. Gardell; C. Mozina; S. Patel; A. Pierce; V. Skendzic; P. Waudby; J. Williams
Year: 2000
An alternative method for transient analysis via wavelets
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:A.P.S. Meliopoulos; Chien-Hsing Lee
Year: 2000
Flux distribution and core loss calculation for single phase and five limb three phase transformer core designs
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:E.G. teNyenhuis; G.F. Mechler; R.S. Girgis
Year: 2000
IEC/TC78 "Live working": background, structure, program of work, and market relevance
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:G. Gela; M. Charest
Year: 2000
Effect of elevated temperatures on mechanical properties of overhead conductors under steady state and short-circuit conditions
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:F. Jakl; A. Jakl
Year: 2000
Magnetic field effects on CRT computer monitors
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:B. Banfai; G.G. Karady; C.J. Kim; K.B. Maracas
Year: 2000
Calculation of electric field and potential distribution along nonceramic insulators considering the effects of conductors and transmission towers
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:T. Zhao; M.G. Comber
Year: 2000
Recommended practices for helicopter bonding procedures for live-line work
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Year: 2000
Benchmark cases for galloping with results obtained from wind tunnel facilities validation of a finite element model
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:R. Keutgen; J.-L. Lilien
Year: 2000
Study on overvoltage protection in HVDC LTT valve
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:S. Tanabe; S. Kobayashi; M. Sampei
Year: 2000
Efficient reduction of fault current through the grounding grid of substation supplied by cable line
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:L.M. Popovic
Year: 2000
Model-aided diagnosis-a new method for online condition assessment of high voltage circuit breakers
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:L. Stanek; K. Frohlich
Year: 2000
Novel techniques for treating singularity problems in the boundary element method applied to electric field evaluation within the tank of a power transformer
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:J. Faiz; M. Ojaghi
Year: 2000
Fault analysis on AC/HV cable transmission lines
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:D. Zaninelli; A. Ballocchi
Year: 2000
IEC method of calculation minimum approach distances for live working
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:G. Gela; P.W. Hotte; M. Charest
Year: 2000
Galloping database on single and bundle conductors prediction of maximum amplitudes
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:J.L. Lilien; D.G. Havard
Year: 2000
Analytical approach to electric circuits containing saturating ferromagnetic coils
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Xi-Fan Wang; Xiu-Li Wang; Jian-Hua Wang
Year: 2000
A scalable PQ event identification system
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:S. Santoso; J. Lamoree; W.M. Grady; E.J. Powers; S.C. Bhatt
Year: 2000
An immune-based optimization method to capacitor placement in a radial distribution system
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Shyh-Jier Huang
Year: 2000
Application of staggered undersampling to power quality monitoring
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:H. Lev-Ari; A.M. Stankovic; S. Lin
Year: 2000
An adaptive arc furnace model
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Tongxin Zheng; E.B. Makram
Year: 2000
Overload prevention and loss minimization in managed distribution networks
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:A.B. Morton; J.M.Y. Mareels
Year: 2000
The influence of nonhomogeneous earth on the inductive interference caused to telecommunication cables by nearby AC electric traction lines
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:K.J. Satsios; D.P. Labridis; P.S. Dokopoulos
Year: 2000
Modeling of bipolar HVDC links in the harmonic domain
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:G.N. Bathurst; N.R. Watson; J. Arrillaga
Year: 2000
An evaluation of some alternative methods of power resolution in a large industrial plant
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:J.-H.C. Pretorius; J.D. van Wyk; P.H. Swart
Year: 2000
Computer generated transformer zones as part of township electrification design software
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:T. Rajakanthan; A.S. Meyer; B. Dwolatzky
Year: 2000
Constrained least squares methods for parameter tracking of power system steady-state equivalent circuits
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:G. Fusco; A. Losi; M. Russo
Year: 2000
A digital compensation method for improving current transformer accuracy
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:N. Locci; C. Muscas
Year: 2000
Design optimization and performance evaluation of the relaying algorithms, relays and protective systems using advanced testing tools
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:M. Kezunovic; B. Kasztenny
Year: 2000
An adaptive PMU based fault detection/location technique for transmission lines. II. PMU implementation and performance evaluation
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Joe-Air Jiang; Ying-Hong Lin; Jun-Zhe Yang; Tong-Ming Too; Chih-Wen Liu
Year: 2000
Fault location using the distributed parameter transmission line model
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:A. Gopalakrishnan; M. Kezunovic; S.M. McKenna; D.M. Hamai
Year: 2000
Comparison of thyristor-controlled reactors and voltage-source inverters for compensation of flicker caused by arc furnaces
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:A. Garcia-Cerrada; P. Garcia-Gonzalez; R. Collantes; T. Gomez; J. Anzola
Year: 2000
Time-frequency and time-scale domain analysis of voltage disturbances
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Y.H. Gu; M.H.J. Bollen
Year: 2000
Discussion of "Highly-accurate modeling of frequency-dependent balanced transmission lines" [Closure to discussion]
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:F.A. Moreira; J.R. Marti; C. Dufour
Year: 2000
Discussion of "A precise calculation of power system frequency and phasor" [Closure to discussion]
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:A. Mariscotti; Jun-Zhe Yang; Chih-Wen Liu
Year: 2000
Discussion of "New power transformer model for the calculation of electromagnetic resonant transient phenomena including frequency-dependent losses" [Closure to discussion]
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:B.L. Hesterman; E.E. Mombello; K. Moller
Year: 2000
Discussion of "Performance of nonceramic insulators under tropical field conditions" [Closure to discussion]
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:T. Nakachi; M.A.R.M. Fernando; S.M. Gubanski
Year: 2000
Discussion of "Magnetic field effects on CRT computer monitors"
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:D.W. Deno
Year: 2000
Discussion of "Effect of elevated temperatures on mechanical properties under steady-state and short-circuit conditions of overhead conductors" [Closure to discussion]
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:V.T. Morgan; F. Jakl; A. Jakl
Year: 2000
Discussion of "On-line diagnostics of high-voltage bushings and current transformers using the sum current method" [Closure to discussion]
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:W. McDermid; M.F. Lachman; W. Walter; P.A. von Guggenberg
Year: 2000
Cost analysis: solder bumped flip chip versus wire bonding
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:J.H. Lau
Year: 2000
Low-cost direct chip attach: comparison of SMD compatible FC soldering with anisotropically conductive adhesive FC bonding
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:R. Haug; R. Behner; C.-P. Czaya; Hongquan Jiang; S.F. Kotthaus; R. Schuetz; C.P.O. Treutler
Year: 2000
Failure analysis of solder bumped flip chip on low-cost substrates
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:J.H. Lau; C. Chang; S.-W.R. Lee
Year: 2000
Chip on chip (COC) and chip on board (COB) assembly on flex rigid printed circuit assemblies
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:J.R. Ganasan
Year: 2000
Quantifying the benefits of cycle time reduction in semiconductor wafer fabrication
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:K. Nemoto; E. Akcali; R.M. Uzsoy
Year: 2000
Integrated electroplated micromachined magnetic devices using low temperature fabrication processes
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Jae Yeong Park; M.G. Allen
Year: 2000
Extensions and performance/robustness tradeoffs of the EWMA run-to-run controller by using the internal model control structure
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:S. Adivikolanu; E. Zafiriou
Year: 2000
Handling of highly-moisture sensitive components-an analysis of low-humidity containment and baking schedules
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:R.L. Shook; J.P. Goodelle
Year: 2000
An integrated system for prediction and analysis of solder interconnection shapes
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Xiujuan Zhao; Chunqing Wang; Guozhong Wang; Guanqun Zheng; Shiqin Yang
Year: 2000
The influence of solder fillet geometry on the occurrence of corona discharge during operation between 400 and 900 V in partial vacuum
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:M. Materassi; B.D. Dunn; L. Capineri
Year: 2000
A new approach in free air ball formation process parameters analysis
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Jau-Liang Chen; Yeh-Chao Lin
Year: 2000
Manufacturing ultra fine line PBGA substrates in a PWB factory
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:J.W. Wilson; R.D. Sebesta; A. D'Aloisio
Year: 2000
Analysis of process models
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:A. Zakarian; A. Kusiak
Year: 2000
Multiple assignment of component types to feeder slots on automated printed circuit card placement machines
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:G.W. DePuy; J.C. Ammons; L.F. McGinnis
Year: 2000
Stencil printing process development for flip chip interconnect
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:L. Li; P. Thompson
Year: 2000
Reduced thermal strain in flip chip assembly on organic substrate using low CTE anisotropic conductive film
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Myung Jin Yim; Young-Doo Jeon; Kyung-Wook Paik
Year: 2000
Confidence assessment of quality prediction from process measurement in sequential manufacturing processes
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:N. Ye; Q. Zhong; G.E. Rahn
Year: 2000
A comparison of PWB warpage due to simulated infrared and wave soldering processes
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Y. Polsky; W. Sutherlin; I.C. Ume
Year: 2000
Taguchi design of experiment for wafer bumping by stencil printing
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:J.H. Lau; C. Chang
Year: 2000
Innovative ESD thermoplastic composites structured through melt flow processing
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:M. Narkis; G. Lidor; A. Vaxman; L. Zuri
Year: 2000
Design methodology of a robust ESD protection circuit for STI process 256 Mb NAND flash memory
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:T. Ikehashi; K. Imamiya; K. Sakui
Year: 2000
Processing and reliability of fast-flow, snap-cure underfills - Part I: processing and moisture sensitivity
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:D.F. Baldwin; P.N. Houston; M. Deladisma; L.N. Crane; M.M. Konarski
Year: 2000
Decomposition in data mining: an industrial case study
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:A. Kusiak
Year: 2000
Design methodology of a robust ESD protection circuit for STI process 256 Mb NAND flash memory
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:T. Ikehashi; K. Imamiya; K. Sakui
Year: 2000
Processing and reliability of fast-flow, snap-cure underfills. I. Processing and moisture sensitivity
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:D.F. Baldwin; P.N. Houston; M. Deladisma; L.N. Crane; M.M. Konarski
Year: 2000
An automated meniscus coating system for polymer deposition on large-area MCM-D and MCM-L substrates
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:S.K. Bhattacharya; S. Bhatevara; H. Morales; S. Kauffman; E. Kamen; G.S. May
Year: 2000
Laser ablation of anisotropic conductive adhesive
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:L.A. Harvilchuck; P.I. Presunka; J.H. Constable
Year: 2000
Design analysis of an electroless plating bath using CFD technique
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Tien-Yu Tom Lee; Jong-Kai Lin
Year: 2000
A model for discrete processing decisions for bulk recycling of electronics equipment
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:J.A. Stuart; Qin Lu
Year: 2000
Decomposition in data mining: an industrial case study
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:A. Kusiak
Year: 2000
Calibration of resistance type die level temperature sensors using a single temperature technique
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:G.L. Solbrekken; Chia-Pin Chiu
Year: 2000
Design optimization of an integrated liquid-cooled IGBT power module using CFD technique
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Tien-Yu Lee
Year: 2000
Toward optimizing enhanced surfaces for passive immersion cooled heat sinks
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:C.S. Baldwin; S.H. Bhavnani; R.C. Jaeger
Year: 2000
Fundamental investigation of roll bond heat pipe as heat spreader plate for notebook computers
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:K. Take; Y. Furukawa; S. Ushioda
Year: 2000
Adhesion and toughening mechanisms at underfill interfaces for flip-chip-on-organic-substrate packaging
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Xiang Dai; M.V. Brillhart; M. Roesch; P.S. Ho
Year: 2000
The volumetric erosion of electrical contacts
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:J.W. McBride
Year: 2000
Make arc erosion and welding in the automotive area
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:L. Morin; N.B. Jeman; D. Jeannot
Year: 2000
Investigation of arcing effects during contact blow open process
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Xin Zhou; P. Theisen
Year: 2000
Low current arc modes of short length and time: a review
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:W.F. Rieder
Year: 2000
Interfacial shear stress, peeling stress, and die cracking stress in trilayer electronic assemblies
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Kang Ping Wang; Yonggang Young Huang; A. Chandra; Kai Xiong Hu
Year: 2000
Anode spot vacuum arc model: graphite anode
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:I.I. Beilis
Year: 2000
A simulation study of IC layout effects on thermal management of die attached GaAs ICs
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:C.J. Reimer; T. Smy; D.J. Walkey; B.C. Beggs; R. Surridge
Year: 2000
Dynamic thermal characterization and modeling of packaged AlGaAs/GaAs HBTs
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:M. Busani; R. Menozzi; M. Borgarino; F. Fantini
Year: 2000
Gallium alloy interconnects for flip-chip assembly applications
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:D.F. Baldwin; R.D. Deshmukh; C.S. Hau
Year: 2000
Contacts materials performances under break arc in automotive applications
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:L. Morin; N.B. Jemaa; D. Jeannot; J. Pinard; L. Nedelec
Year: 2000
Fluxless process of fabricating In-Au joints on copper substrates
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:W.W. So; C.C. Lee
Year: 2000
Advanced flip chip bonding techniques using transferred microsolder bumps
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:N. Koshoubu; S. Ishizawa; H. Tsunetsugu; H. Takahara
Year: 2000
Foreword - polymeric materials for electronics packaging
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:J. Liu
Year: 2000
Flip chip underfill flow characteristics and prediction
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:P. Fine; B. Cobb; L. Nguyen
Year: 2000
Effect of bump height on the strain variation during the thermal cycling test of ACA flip-chip joints
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:K. Pinardi; Z. Lai; D. Vogel; Yi Lan Kang; J. Liu; S. Liu; R. Haug; M. Willander
Year: 2000
Development of virtual reliability methodology for area-array devices used in implantable and automotive applications
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:S.K. Sitaraman; R. Raghunathan; C.E. Hanna
Year: 2000
Compact thermal models of packages used in conduction cooled applications
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:A. Aranyosi; A. Ortega; R.A. Griffin; S. West; D.R. Edwards
Year: 2000
An upper limit for high power switching with a polymer current limiter device
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:A.R. Duggal
Year: 2000
Warpage measurement of large area multitilted silicon substrates at various processing conditions
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:S.K. Bhattacharya; I.C. Ume; A.X.H. Dang
Year: 2000
Nonuniform temperature and strain fields in a powered package
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:J. Wakil; P.S. Ho
Year: 2000
Reliability and failure analyses of thermally cycled ball grid array assemblies
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:R. Ghaffarian; N.P. Kim
Year: 2000
Mechanism of contact enhancing chemicals for electrical interconnection
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:G. Gao; D. Shangguan
Year: 2000
Foreword thermal investigations of ICs and systems (THERMINIC)
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:B. Courtois; C. Lasance
Year: 2000
Parametric compact models for flip chip assemblies
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:S. Van Dooren; B. Vandevelde; E. Beyne; F. Christiaens; D. Corlatan
Year: 2000
Experimental and numerical investigation into the influence of printed circuit board construction on component operating temperature in natural convection
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:J. Lohan; P. Tiilikka; P. Rodgers; C.-M. Fager; J. Rantala
Year: 2000
Thermal dynamics and the time constant domain
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:V. Szekely; M. Rencz
Year: 2000
An avionics guide to uprating of electronic parts
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:D. Humphrey; L. Condra; N. Pendse; D. Das; C. Wilkinson; M.G. Pecht
Year: 2000
Planar inductors on an LTCC substrate realized by the gravure-offset-printing technique
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:M. Lahti; V. Lantto; S. Leppavuori
Year: 2000
Interfacial thermal resistance and temperature dependence of three adhesives for electronic packaging
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:D.P.H. Hasselman; K.Y. Donaldson; F.D. Barlow; A.A. Elshabini; G.H. Schiroky; J.P. Yaskoff; R.L. Dietz
Year: 2000
The corrosion behavior of BK-7 glasses for use in non-hermetic electro-optic devices
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:C.D. Theis; D.A. Fleming; J.W. Osenbach
Year: 2000
Soft solder die bonding of multiple die devices
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:S. Radeck; D. Kellenberger; C. Luechinger
Year: 2000
Manufacturing and materials properties of Ti/Cu/Electroless Ni/solder bump on Si
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Kwang-Lung Lin; Kun-Tzu Hsu
Year: 2000
Solder thickness variation with respect to soldering parameters
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Kwang-Lung Lin; S. Yao
Year: 2000
Analytic modeling, optimization, and realization of cooling devices in silicon technology
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:C. Perret; J. Boussey; C. Schaeffer; M. Coyaud
Year: 2000
Residual thermomechanical stresses in thinned-chip assemblies
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:S. Leseduarte; S. Marco; E. Beyne; R. Van Hoof; A. Marty; S. Pinel; O. Vendier; A. Coello-Vera
Year: 2000
Prediction of paddle shift via 3-D TSOP modeling
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:F. Su; Sheng-Jye Hwang; Huei-Huang Lee; Durn-Yuan Huang
Year: 2000
Conductive aqueous layer formation at the gel-substrate interface in equilibrium with 100% RH environment
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:M. Tencer
Year: 2000
Ribbed package geometry for reducing thermal warpage and wire sweep during PBGA encapsulation
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Sen-Yeu Yang; Shin-Chang Jiang; Wen-Shu Lu
Year: 2000
Electronic part life cycle concepts and obsolescence forecasting
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:R. Solomon; P.A. Sandborn; M.G. Pecht
Year: 2000
Architectures and algorithms for track association and fusion
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Chee-Yee Chong; S. Mori; W.H. Barker; Kuo-Chu Chang
Year: 2000
Space solar power development
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:H. Oman
Year: 2000
Stability analysis of large DC solid-state power systems for space
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:A. Emadi; J.P. Johnson; M. Ehsani
Year: 2000
Access control system with hand geometry verification and smart cards
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:R. Sanchez-Reillo; A. Gonzalez-Marcos
Year: 2000
Characteristics of a successful space system engineer
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:R.C. Moore
Year: 2000
Are there too many MBAs in aerospace?
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:D.E. Chappelle
Year: 2000
Assembling a distributed fused information-based human-computer cognitive decision making tool
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:E. Blasch
Year: 2000
VHF (metric band) radars from Nizhny Novgorod Research Radiotechnical Institute
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:A. Zachepitsky
Year: 2000
Vertical test integration
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:P. Jackson
Year: 2000
Battery condition management: an important way to protect a critical asset
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:T.L. Churchill
Year: 2000
Electronic technical manual development
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:L. Toscano
Year: 2000
Hybrid power sources for Land Warrior scenario
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:L.P. Jarvis; T.B. Atwater; P.J. Cygan
Year: 2000
What is systems engineering?
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Year: 2000
Electronic technologies that enabled aerospace
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Year: 2000
Space systems
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Year: 2000
International Space Station (ISS)-a star is born
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Year: 2000
Global Positioning System-the newest utility
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Year: 2000
Embedded information system re-engineering
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:K. Littlejohn; M.V. DelPrincipe; J.D. Preston
Year: 2000
Data link communication equipment approved by USAF for civil air traffic control
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:D.M. Thornton
Year: 2000
Historical pathways for fuel cells
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:P.G. Grimes
Year: 2000
Sealed nickel cadmium and nickel metal hydride cell advances
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:R.A. Powers
Year: 2000
Interferometric Fiber Optic Gyro Technology (IFOG)
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:D.W. Heckman; M. Baretela
Year: 2000
Policy-based networks: hype and hope
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:S.J. Shepard
Year: 2000
UCITA: take the deal and run
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:J. Voas
Year: 2000
Ensuring e-business success by learning from ERP failures
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:H. Krasner
Year: 2000
Avoiding the pitfalls of installing systems management suites
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:J.A. Gowan, Jr.; C. Jesse; R.C. Mathieu
Year: 2000
It shops take stock of application service providers
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:S.J. Shepard
Year: 2000
Data warehousing and the Internet's impact on ERP
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Yao Yurong; He Houcun
Year: 2000
Implementation design for databases: the 'forgotten' step
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:T. Martyn
Year: 2000
Dirty laundry: privacy issues for IT professionals
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:J.B. Earp; F.C. Payton
Year: 2000
Understanding the dynamics of software compatibility
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:G. Succi; P. Predonzani; T. Vernazza
Year: 2000
Linux Computing
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:A.C. Lear
Year: 2000
Electronic and digital signatures: in search of a standard
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:T.O. Wells
Year: 2000
Bolster your budget proposals with IT market basket statistics
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:H. Rubin
Year: 2000
Storage-over-IP could make SANs more accessible
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:A.C. Lear
Year: 2000
Developing a distributed system for infrastructure protection
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:G. Cybenko; Guofei Jiang
Year: 2000
Axent's rob clyde: why you need intrusion detection
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:A.C. Lear
Year: 2000
Which network design tool is right for you?
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:A.W. Bragg
Year: 2000
Making E-business pay: eight key drivers for operational success
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:A. Barua; P. Konana; A. Whinston; F. Yin
Year: 2000
The Internet revolution in law: teaching in new ways
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:H.H. Perritt, Jr.
Year: 2000
Pay people right! Keeping top technical talent
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:P.K. Zingheim; J.R. Schuster
Year: 2000
Correctly assessing the -ilities" requires more than marketing hype
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:J. Williams
Year: 2000
Integral motor with driver and wireless transmission of power and information for autonomous subspindle drive
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:J. Hirai; Tae-Woong Kim; A. Kawamura
Year: 2000
Wireless transmission of power and information and information for cableless linear motor drive
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:J. Hirai; Tae-Woong Kim; A. Kawamura
Year: 2000
Design optimization of single-stage single-switch input-current shapers
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:L. Huber; M.M. Jovanovic
Year: 2000
Dynamics analysis and controller synthesis for zero-voltage-transition PWM power converters
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Jong-Lick Lin; Hsin-Ying Hsieh
Year: 2000
Modeling and control of a synchronous generator with an active DC load
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:I. Jadric; D. Borojevic; M. Jadric
Year: 2000
Low-cost high power-density electronic ballast for automotive HID lamp
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:A. Reatti
Year: 2000
Control strategies for multiple parallel current-source converters of SMES system
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:K. Imaie; O. Tsukamoto; Y. Nagai
Year: 2000
Inductor voltage control of buck-type single-phase AC-DC converter
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:R. Oruganti; M. Palaniapan
Year: 2000
A single-switch AC-DC converter with power factor correction
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Huai Wei; I. Batarseh; Guangyong Zhu; P. Kornetzky
Year: 2000
A phase tracking system for three phase utility interface inverters
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Se-Kyo Chung
Year: 2000
A DSP controlled variable-frequency resonant-commutated converter
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:S.A. Chickamenahalli; Jun Liu; M. Suryakumar
Year: 2000
New high power, high performance power converter systems
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:R. Zhang; F.C. Lee; D. Boroyevich; Hengchun Mao
Year: 2000
A bidirectional DC-DC converter topology for low power application
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:M. Jain; M. Daniele; P.K. Jain
Year: 2000
Modeling of cross-regulation in converters containing coupled inductors
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:D. Maksimovic; R.W. Erickson; C. Griesbach
Year: 2000
A generalized method for calculating the RMS values of switching power converters
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:G.T. Kostakis; S.N. Manias; N.I. Margaris
Year: 2000
Hybrid active filter for harmonically unbalanced three phase three wire railway traction loads
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:S. Senini; P.J. Wolfs
Year: 2000
An improved starting strategy for voltage-source inverter fed three phase induction motor drives under inverter fault conditions
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:D. Kastha; A.K. Majumdar
Year: 2000
Monitoring of induction motor load by neural network techniques
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:G. Salles; F. Filippetti; C. Tassoni; G. Crellet; G. Franceschini
Year: 2000
Design and implementation of an adaptive controller for torque ripple minimization in PM synchronous motors
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:V. Petrovic; R. Ortega; A.M. Stankovic; G. Tadmor
Year: 2000
Robust speed control of an induction motor: an /spl Hscr//sub /spl infin// control theory approach with field orientation and /spl mu/-analysis
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:C.P. Bottura; M.F.S. Neto; S.A.A. Filho
Year: 2000
Coreless planar printed-circuit-board (PCB) transformers-a fundamental concept for signal and energy transfer
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:S.C. Tang; S.Y. Hui; Henry Shu-Hung Chung
Year: 2000
Dynamic and steady state analysis of a three phase buck rectifier
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:J. Doval-Gandoy; C.M. Penalver
Year: 2000
A new fuzzy logic-based controller design method for DC and AC impressed-voltage drives
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:F. Cupertino; A. Lattanzi; L. Salvatore
Year: 2000
Robust model predictive control and observer for direct drive applications
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Kay-Soon Low; Hualiang Zhuang
Year: 2000
Indirect angle estimation in switched reluctance motor drive using fuzzy logic based motor model
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:N. Ertugrul; A.D. Cheok
Year: 2000
An improvement technique for the efficiency of high-frequency switch-mode rectifiers
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:T. Yoshida; O. Shizuka; O. Miyashita; K. Ohniwa
Year: 2000
Numerical and experimental study of the region of period-one operation of a PWM boost converter
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:E. Toribio; A. El Aroudi; G. Olivar; L. Benadero
Year: 2000
Computer-aided small-signal analysis based on impulse response of DC/DC switching power converters
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:D. Maksimovic
Year: 2000
A self core reset and zero voltage switching forward converter topology
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Youhao Xi; P.K. Jain; Y.F. Liu; R. Orr
Year: 2000
A small-signal model utilizing amplitude modulation for the class-D converter at fixed frequency
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Jung-Hui Cheng; A.F. Witulski; J.L. Vollin
Year: 2000
An overview of reliable multicast transport protocol II
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:B. Whetten; G. Taskale
Year: 2000
NetScope: traffic engineering for IP networks
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:A. Feldmann; A. Greenberg; C. Lund; N. Reingold; J. Rexford
Year: 2000
Traffic engineering with MPLS in the Internet
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Xipeng Xiao; A. Hannan; B. Bailey; L.M. Ni
Year: 2000
A comparison of load balancing techniques for scalable Web servers
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:H. Bryhni; E. Klovning; O. Kure
Year: 2000
An IP transport and routing architecture for next-generation satellite networks
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:F. Yegenoglu; R. Alexander; D. Gokhale
Year: 2000
Data communications: from basics to broad band, 3rd edition [Book Review]
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:I. Nikolaidis
Year: 2000
ARM system-on-chip architecture, 2nd edition [Book Review]
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:I. Nikolaidis
Year: 2000
Optical burst switching: a viable solution for terabit IP backbone
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:S. Verma; H. Chaskar; R. Ravikanth
Year: 2000
Economical clean dry air system for closed manufacturing system
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Y. Ishihara; D. Nakajima; T. Ohmi
Year: 2000
Measurement of wave-front aberrations in high-resolution optical lithographic systems from printed photoresist patterns
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:M.S. Yeung
Year: 2000
Neurofuzzy modeling of chemical vapor deposition processes
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:J.P. Geisler; C.S.G. Lee; G.S. May
Year: 2000
An efficient photoresist development simulator based on cellular automata with experimental verification
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:I. Karafyllidis; P.I. Hagouel; A. Thanailakis; A.R. Neureuther
Year: 2000
Level-specific lithography optimization for 1-Gb DRAM
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:A.K. Wong; R. Ferguson; S. Mansfield; A. Molless; D. Samuels; R. Schuster; A. Thomas
Year: 2000
Optimal predictive control with constraints for the processing of semiconductor wafers on bake plates
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Weng Khuen Ho; A. Tay; C.D. Schaper
Year: 2000
An evaluation of test methods for the detection and control of interconnect reliability
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:S. Foley; J. Molyneaux; A. Mathewson
Year: 2000
A high-density, matched hexagonal transistor structure in standard CMOS technology for high-speed applications
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:A. Van den Bosch; M.S.J. Steyaert; W. Sansen
Year: 2000
Null holographic test structures for the measurement of overlay and its statistical variation
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:S.A. AbuGhazaleh; P. Christie; V. Agrawal; J.T.M. Stevenson; A.J. Walton; A.M. Gundlach; S. Smith
Year: 2000
Evaluating the impact of process changes on cluster tool performance
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:J.W. Herrmann; N. Chandrasekaran; B.F. Conaghan; M.-Q. Nguyen; G.W. Rublof; R.Z. Shi
Year: 2000
An empirical three-dimensional crossover capacitance model for multilevel interconnect VLSI circuits
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Shyh-Chyi Wong; Trent Gwo-Yann Lee; Dye-Junn Ma; Chuan-Jane Chao
Year: 2000
The mask error factor in optical lithography
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:A.K. Wong; R.A. Ferguson; S.M. Mansfield
Year: 2000
3-D visualization of deep submicrometer transistor characteristics
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:R. Sitte
Year: 2000
Particle characteristics of 300-mm minienvironment (FOUP and LPU)
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Y. Kobayashi; S. Kobayashi; K. Tokunaga; K. Kato; T. Minami
Year: 2000
Segment-based approach for real-time reactive rescheduling for automatic manufacturing control
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:H. Toba
Year: 2000
Implementation of modeling and simulation in semiconductor wafer fabrication with time constraints between wet etch and furnace operations
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:W. Scholl; J. Domaschke
Year: 2000
A methodology for product mix planning in semiconductor foundry manufacturing
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Yon-Chun Chou; L-Hsuan Hong
Year: 2000
Application of CMP process monitor to Cu polishing
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:T. Kojima; M. Miyajima; F. Akaboshi; T. Yogo; S. Ishimoto; A. Okuda
Year: 2000
A new method for treating fluorine wastewater to reduce sludge and running costs
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:A. Toyoda; T. Taira
Year: 2000
Wafer thermal desorption spectrometry in a rapid thermal processor using atmospheric pressure ionization mass spectrometry
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:G. Vereecke; E. Kondoh; P. Richardson; K. Maex; M.M. Heyns
Year: 2000
Device dependent control of chemical-mechanical polishing of dielectric films
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:N.S. Patel; G.A. Miller; C. Guinn; A.C. Sanchez; S.T. Jenkins
Year: 2000
SHEWMA: an end-of-line SPC scheme using wafer acceptance test data
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Chih-Min Fan; Ruey-Shan Guo; Shi-Chung Chang; Chih-Shih Wei
Year: 2000
A study in dynamic neural control of semiconductor fabrication processes
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:J.P. Card
Year: 2000
A neural-network approach to recognize defect spatial pattern in semiconductor fabrication
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Fei-Long Chen; Shu-Fan Liu
Year: 2000
A control method to reduce the standard deviation of flow time in wafer fabrication
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Hyun Joong Yoon; Doo Yong Lee
Year: 2000
Analysis of the impact of process variations on clock skew
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:S. Zanella; A. Nardi; A. Neviani; M. Quarantelli; S. Saxena; C. Guardiani
Year: 2000
A novel filtering method to extract three critical yield loss components (gross, repeated, and random) FIMER
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:K. Imai; T. Kaga
Year: 2000
Reducing airborne molecular contamination by efficient purging of FOUPs for 300-mm wafers-the influence of materials properties
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:J. Frickinger; J. Bugler; G. Zielonka; L. Pfitzner; H. Ryssel; S. Hollemann; H. Schneider
Year: 2000
Capture rate enhance method of 0.1-/spl mu/m level defects by pattern-matching inspectors
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:K. Sakurai; A. Onoyama; H. Ishii; K. Oka; K. Yamanishi
Year: 2000
Thermal uniformity of 12-in silicon wafer during rapid thermal processing by inverse heat transfer method
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Senpuu Lin; Hsin-Sen Chu
Year: 2000
Intelligent quality controllers for on-line parameter design
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:R.B. Chinnam; Jie Ding; G.S. May
Year: 2000
Derivation of a nonlinear variance equation and its application to SOI technology
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:D. Rowlands; S. Dimitrijev
Year: 2000
The push toward low voltage devices
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:M. Golio
Year: 2000
RF power amplifiers for wireless communications
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:S.C. Cripps
Year: 2000
High-Q and low-loss matching network elements for RF and microwave circuits
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:I.J. Bahl
Year: 2000


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