VPDS: Virtual Home Region Based Distributed Position Service in Mobile Ad Hoc Networks
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Xiaoxin Wu
Year: 2005
Optimal Asynchronous Garbage Collection for RDT Checkpointing Protocols
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:R. Schmidt; I.C. Garcia; F. Pedone; L.E. Buzato
Year: 2005
Transformations of Mutual Exclusion Algorithms from the Cache-Coherent Model to the Distributed Shared Memory Model
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Hyonho Lee
Year: 2005
Robust Information Dissemination in Uncooperative Environments
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Seung Jun; M. Ahamad; Jun Xu
Year: 2005
Keyword Search in DHT-Based Peer-to-Peer Networks
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Yuh-Jzer Joung; Chien-Tse Fang; Li-Wei Yang
Year: 2005
infer: A Bayesian Inference Approach towards Energy Efficient Data Collection in Dense Sensor Networks
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:G. Hartl; Baochun Li
Year: 2005
A Spatiotemporal Query Service for Mobile Users in Sensor Networks
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Chenyang Lu; Guoliang Xing; O. Chipara; Chien-Liang Fok; S. Bhattacharya
Year: 2005
FraNtiC: A Fractal Geometric Framework for Mesh-Based Wireless Access Networks
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:S. Ghosh; K. Basu; S.K. Das
Year: 2005
Supporting Live Development of SOAP and CORBA Servers
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:S.L. Pallemulle; K.J. Goldman; B.E. Morgan
Year: 2005
Resilient Capacity-Aware Multicast Based on Overlay Networks
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Zhan Zhang; Shigang Chen; Yibei Ling; R. Chow
Year: 2005
Semi-Probabilistic Content-Based Publish-Subscribe
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:P. Costa; G.P. Picco
Year: 2005
Resilient Localization for Sensor Networks in Outdoor Environments
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:YoungMin Kwon; K. Mechitov; S. Sundresh; Wooyoung Kim; G. Agha
Year: 2005
Controlling Gossip Protocol Infection Pattern Using Adaptive Fanout
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:S. Verma; Wei Tsang Ooi
Year: 2005
Robust Task Allocation for Dynamic Distributed Real-Time Systems Subject to Multiple Environmental Parameters
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Dazhang Gu; F. Drews; L. Welch
Year: 2005
Fine-Grain Adaptive Compression in Dynamically Variable Networks
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:C. Pu; L. Singaravelu
Year: 2005
Lightweight Morphing Support for Evolving Middleware Data Exchanges in Distributed Applications
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:S. Agarwala; G. Eisenhauer; K. Schwan
Year: 2005
Distributed Approximation of Fixed-Points in Trust Structures
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:K. Krukow; A. Twigg
Year: 2005
A Byzantine fault-tolerant mutual exclusion algorithm and its application to Byzantine fault-tolerant storage systems
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Joong Man Kim; Y. Manabe
Year: 2005
State checksum and its role in system stabilization
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:C.-T. Huang; M.G. Gouda
Year: 2005
An optimal snap-stabilizing multi-wave algorithm
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:D. Bein; A.K. Datta; M.H. Karaata; S. Zaman
Year: 2005
Dynamic load balancing using network transferable computer
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:M. Hisayuki; S. Inoue; Y. Kakuda; K. Toda; K. Suzaki
Year: 2005
Implementation issues of parallel downloading methods for a proxy system
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:J. Funasaka; A. Kawano; K. Ishida
Year: 2005
Voting multi-dimensional data with deviations for Web services under group testing
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:W.-T. Tsai; Y. Chen; D. Zhang; H. Huang
Year: 2005
InFilter: predictive ingress filtering to detect spoofed IP traffic
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:A. Ghosh; L. Wong; G. Di Crescenzo; R. Talpade
Year: 2005
Performing BGP experiments on a semi-realistic Internet testbed environment
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:K. Zhang; S.-T. Teoh; S.-M. Tseng; R. Limprasittipom; K.-L. Ma; S.F. Wu; C.-N. Chuah
Year: 2005
Configurable middleware-level intrusion detection for embedded systems
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:E. Naess; D.A. Frincke; A.D. McKinnon; D.E. Bakken
Year: 2005
Forensix: a robust, high-performance reconstruction system
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:A. Goel; W.-C. Feng; D. Maier; W.-C. Feng; J. Walpole
Year: 2005
A simple framework for distributed forensics
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Y. Tang; T.E. Daniels
Year: 2005
Increasing attack resiliency of wireless ad hoc and sensor networks
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:H. Vogt
Year: 2005
Defending against Sybil attacks in sensor networks
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Qinghua Zhang; Pan Wang; D.S. Reeves; Peng Ning
Year: 2005
Adaptive real-time anomaly detection with improved index and ability to forget
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:K. Burbeck; S. Nadjm-Tehrani
Year: 2005
Real-time protection against DDoS attacks using active gateways
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:O. Demir; K. Ghose
Year: 2005
An intermediary software infrastructure for edge services
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:R. Grieco; D. Malandrino; V. Scarano; F. Varriale
Year: 2005
Probability based power aware error resilient coding
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:M. Kim; H. Oh; N. Dutt; A. Nicolau; N. Venkatasubramanian
Year: 2005
Using a fairness monitoring service to improve load-balancing in DSR
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:H. Miranda; L. Rodrigues
Year: 2005
A user-driven adaptation strategy for mobile video streaming applications
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:D. Cotroneo; G. Paolillo; C. Pirro; S. Russo
Year: 2005
Framework and rule-based language for facilitating context-aware computing using information appliances
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:K. Nishigaki; K. Yasumoto; N. Shibata; M. Ito; T. Higashino
Year: 2005
Policy-controlled event management for distributed intrusion detection
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:C. Kreibich; R. Sommer
Year: 2005
CHR: a distributed hash table for wireless ad hoc networks
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:F. Araujo; L. Rodrigues; J. Kaiser; C. Liu; C. Mitidieri
Year: 2005
A stateful and open publish-subscribe structure for online marketplaces
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:I.M. Arntzen; D. Johansen
Year: 2005
On the benefits of non-canonical filtering in publish/subscribe systems
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:S. Bittner; A. Hinze
Year: 2005
Using fine-grained infrared positioning to support the surface-based activities of mobile users
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:A. Krohn; M. Beigl; M. Hazas; H.-W. Gellersen
Year: 2005
Visual code widgets for marker-based interaction
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:M. Rohs
Year: 2005
Implementation and evaluation of the personal wellness coach
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:R. Asselin; G. Ortiz; J. Pui; A. Smailagic; C. Kissling
Year: 2005
Adding context information to digital photos
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:P. Holleis; M. Kranz; M. Gall; A. Schmidt
Year: 2005
Angular Routing Protocol for Mobile Ad Hoc Networks
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:V.C. Giruka; Mukesh Singhal
Year: 2005
Stable, time-bound object references in context of dynamically changing environments
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:R. Kapitza; H.P. Reiser; F.J. Hauck
Year: 2005
Wireless LAN positioning with mobile devices in a library environment
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:W.H. Wong; J.K. Ng; W.M. Yeung
Year: 2005
A path-history-sensitive access control model for mobile agent environment
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Chun Cao; Jian Lu
Year: 2005
A two-level ECN marking for fair bandwidth allocation between HSTCP and TCP Reno
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:F. Hirose; M. Fukuhara; T. Hatano; H. Shigeno; K. Okada
Year: 2005
PChord: improvement on chord to achieve better routing efficiency by exploiting proximity
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Feng Hong; Minglu Li; Jiadi Yu; Yi Wang
Year: 2005
Geographical cluster based routing in sensing-covered networks
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:H. Frey; D. Gorgen
Year: 2005
SHARP: a new approach to relative localization in wireless sensor networks
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:A.A. Ahmed; H. Shi; Y. Shang
Year: 2005
Self-stabilization in self-organized multihop wireless networks
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:N. Mitton; E. Fleury; I.G. Lassous; S. Tixeuil
Year: 2005
Automated high-accuracy hybrid measurement for distributed embedded systems
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:M. Thoss
Year: 2005
Topology control for fault-tolerant communication in highly dynamic wireless networks
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:B. Thallner; H. Moser
Year: 2005
An application of a formal approach for distribution of real-time control
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Thanikesavan Sivanthi; Ulrich Killat; Kishore Angrishi
Year: 2005
Soft real-time acquisition in Windows XP
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:J. Cinkelj; M. Mihelj; M. Munih
Year: 2005
Periodic real-time scheduling for FPGA computers
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:K. Danne; M. Platzner
Year: 2005
Application specific vs. standard Web service interfaces for the vertical integration of fieldbus systems
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:M. Venzke; C. Weyer; V. Turau
Year: 2005
The diagnostic architecture of the PEGASUS project car
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:P. Peti; R. Obermaisser; H. Paulitsch
Year: 2005
Comprehensible hierarchical intelligent (CHI) framework for monitoring and preventive maintenance of aircraft systems
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:P. Owotoki; F. Mayer-Lindenberg
Year: 2005
Improving fault-tolerance in intelligent video surveillance by monitoring, diagnosis and dynamic reconfiguration
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:A. Doblander; A. Maier; B. Rinner; H. Schwabach
Year: 2005
Etch chamber condition-based process control model for shallow trench isolation trench depth control
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:S. Gaddam; M.W. Braun
Year: 2005
New optical range inspection and improving optical response for spectroscopic based endpoint detection
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:G. Fazio; P. Petruzza; A. Spandre
Year: 2005
Adaptive sampling methodology for in-line defect inspection
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:A. Bousetta; A.J. Cross
Year: 2005
Impact of back side defects on feol processes and yield
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:L. Pressley; S. Hardin; K. Harper; B. Dunham; D. Sutton; T. Kirsch; M. Allen; B. Klingemann; T. Mathews; L. Kohler; C. Lansford; T. Couteau; B. Hance; J. Darilek; C. Cariss; E. Apelgren; R. Stanley; J. Witowski; L. Cheung
Year: 2005
Effective wafer inspection strategy for memory manufacturing foundries with inspiring HARI results
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:L. Lin; S. Chen; T. Han; Y.H. Kim
Year: 2005
Inline automated defect classification: a novel approach to defect management
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:D. Pepper; O. Moreau; G. Hennion
Year: 2005
Edge and bevel automated defect inspection for 300mm production wafers in manufacturing
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:J.D. Morillo; T. Houghton; J.M. Bauer; R. Smith; R. Shay
Year: 2005
Exposure tool for immersion lithography
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:S. Owa; Y. Ishii; K. Shiraishi
Year: 2005
Exploring the capabilities of immersion lithography
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:C.A. Mack
Year: 2005
Process-window sensitive full-chip inspection for design-tosilicon optimization in the sub-wavelength era
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:M.J. Brodsky; S. Halle; V. Jophlin-Gut; L. Liebmann; D. Samuels; G. Crispo; K. Nafisi; V. Ramani; I. Peterson
Year: 2005
Next generation manufacturing execution system (mes) enabling fully integrated fab automation in 300mm technology development and manufacturing
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:C. Mouli
Year: 2005
An advanced methodology for the reporting of original adders for process tool defect monitoring
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:T.J. Zazado; J.R. Bottin
Year: 2005
Comparison of three different methods to model the semiconductor manufacturing yield
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Y. Dupret; E. Perrin; J.-L. Grolier; R. Kielbasa
Year: 2005
E-beam inspection of SOI wafers for the evaluation of barrier nitride RIEe etching
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:A. Ache; K. Wu; N. Rowand
Year: 2005
Fault detection in reactive ion etching systems using one-class support vector machines
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:T. Sarmiento; S.J. Hong; G.S. May
Year: 2005
Low-yield flier wafer analysis strategies
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:B.A. Dunham; T.D. Kirsch; S. Litwin; M. Covert; A. Bierwag; D. Garcia; K. Holt
Year: 2005
A reticle quality management strategy in wafer fabs addressing progressive mask defect growth problem at low k1 lithography
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:K. Bhattacharyya; M. Eickhoff; M. Lang; M. Ma; S. Pas
Year: 2005
Scanner influences on resolution capabilities
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:H.H. Magoon
Year: 2005
Silicon carbide: barriers to manufacturable devices
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:J. Shovlin; R. Woodin; T. Witt; G. Dolny; P. Shenoy
Year: 2005
SPC based in-line reticle monitoring on product wafers
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:K. Mai; M. Tuckermann
Year: 2005
Ultra short pulse laser meeting the requirements for high speed and high quality dicing of low-k wafers
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:J. Sillanpaa; J. Kangastupa; A. Salokatve; H. Asonen
Year: 2005
Integration of nickel silicide: minimizing defect generation during formation
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:J. Foggiato; Woo Sik Yoo
Year: 2005
Use of surface sensitive analysis techniques for the study of silicide processes in power transistors: platinum silicide formation as an example
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:D. Kraft; P. Ganitzer; P. Kohler-Redlich; U. Scheithauer
Year: 2005
"Stretching factory performance beyond world class, an organizational approach"
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:S. Lantz
Year: 2005
Hybrid manufacturing - lower cost access to DSM technology
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:B.N. Williams; M.M. Nelson
Year: 2005
Measurement and reduction of critical area using Voronoi diagrams
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:D.N. Maynard; J.D. Hibbeler
Year: 2005
A systems approach to evaluating the impact of technician training
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:B. Simington
Year: 2005
Preface
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:A. Clemm; O. Festor; A. Pras
Year: 2005
Programmable middleware for the dynamic deployment of services and protocols in ad hoc networks
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:S. Gouveris; S. Sivavakeesar; G. Pavlou; A. Malatras
Year: 2005
Management of mobile ad-hoc networks: evaluating the network behavior
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:R. Badonnel; R. State; O. Festor
Year: 2005
Health monitoring and control for application server environments
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:N. Anerousis; A. Black; S. Hanson; L. Mummert; G. Pacifici
Year: 2005
Data mining techniques for effective and scalable traffic analysis
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:M. Baldi; E. Baralis; F. Risso
Year: 2005
Adaptive entitlement control of resource containers on shared servers
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:X. Liu; X. Zhu; S. Singhal; M. Arlitt
Year: 2005
Control of fair queueing: modeling, implementation, and experiences
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Ronghua Zhang; Yixin Diao; S. Parekh; T.F. Abdelzaher
Year: 2005
Automatic tuning of ADSL circuits
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:M. Matsuno; S. Nakai; M. Morimitsu; H. Ide; T. Ito
Year: 2005
A novel service oriented framework for automatically switched transport network
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:B. Martini; F. Baroncelli; P. Castoldi
Year: 2005
On the management of aggregation networks with rapidly moving traffic demands
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:F. Van Quickenborne; F. De Greve; I. Moerman; F. De Turck; P. Demeester
Year: 2005
Stabilizing markets via a novel auction based pricing mechanism for short-term contracts for network services
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Juong-Sik Lee; B.K. Szymanski
Year: 2005
Decentralized auction-based pricing with PeerMart
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:D. Haussheer; B. Stiller
Year: 2005
QoS-aware service composition in large scale multi-domain networks
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Jin Xiao; R. Boutaba
Year: 2005
Policy management for networked systems and applications
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:D. Agrawal; S. Calo; J. Giles; Kang-Won Lee; D. Verma
Year: 2005
Policy refinement for DiffServ quality of service management
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:A. Bandara; E. Lupu; A. Russo; N. Dulay; M. Sloman; P. Flegkas; M. Charalambides; G. Pavlou
Year: 2005
Measurement based networking approach applied to congestion control in the multi-domain Internet
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:N. Larrieu; P. Owezarski
Year: 2005
Efficient transmission of periodic that follows a consistent daily pattern
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:M. Albaghdadi; K. Razvi
Year: 2005
Active integrated fault localization in communication networks
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Yongning Tang; E.S. Al-Shaer; R. Boutaba
Year: 2005
A model-driven approach to rapid service introduction
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:M. Cochinwala; H.S. Shim; J.R. Wullert, II
Year: 2005
Moving from data modeling to process modeling in CIM
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:A. Kumar; N. Karnik; C.K. Ravindranath
Year: 2005
Towards an optimal network survivability threshold
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:A. Snow; S. Agarwal
Year: 2005
Managing network security policies: firewall and IPSec/VPN
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Year: 2005
MPLS operations and management
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:T.D. Nadeau; M.J. Morrow
Year: 2005
Data fusion in sensor networks
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:H. Durrant-Whyte
Year: 2005
Dynamic wake-up and topology maintenance protocols with spatiotemporal guarantees
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Sangeeta Bhattacharya; G. Xing; C. Lu; G.-C. Roman; O. Chipara; B. Harris
Year: 2005
Building up to macroprogramming: an intermediate language for sensor networks
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:R. Newton; Arvind; M. Welsh
Year: 2005
A robust architecture for distributed inference in sensor networks
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:M. Paskin; C. Guestrin; J. McFadden
Year: 2005
The effects of ranging noise on multihop localization: an empirical study
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:K. Whitehouse; C. Karlof; A. Woo; F. Jiang; D. Culler
Year: 2005
Statistical model of lossy links in wireless sensor networks
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:A. Cerpa; J.L. Wong; L. Kuang; M. Potkonjak; D. Estrin
Year: 2005
Robust statistical methods for securing wireless localization in sensor networks
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Z. Li; W. Trappe; Y. Zhang; Badri Nath
Year: 2005
Attack-resistant location estimation in sensor networks
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:D. Liu; P. Ning; W.K. Du
Year: 2005
Snow crashing the diamond age: mobile devices meet sensor networks
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:T. Whitted
Year: 2005
Ubiquitous access to distributed data in large-scale sensor networks through decentralized erasure codes
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:A.G. Dimakis; V. Prabhakaran; K. Ramchandran
Year: 2005
Adaptive statistical sampling methods for decentralized estimation and detection of localized phenomena
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:E.B. Ermis; Venkatesh Saligrama
Year: 2005
The sensor selection problem for bounded uncertainty sensing models
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:V. Isler; R. Bajcsy
Year: 2005
On the optimal density for real-time data gathering of spatio-temporal processes in sensor networks
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:R. Cristescu; M. Vetterli
Year: 2005
Sensor configuration and activation for field detection in large sensor arrays
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Y. Sung; L. Tong; H.V. Poor
Year: 2005
Lifetime-aware intrusion detection under safeguarding constraints
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:A. Iranli; H. Fatemi; M. Pedram
Year: 2005
Tracking on a graph
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:S. Oh; Shankar Sastry
Year: 2005
Estimation in sensor networks: a graph approach
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:H. Zhang; J.M.F. Moura; B. Krogh
Year: 2005
Detecting cuts in sensor networks
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Nisheeth Shrivastava; Subhash Suri; C.D. Toth
Year: 2005
Lossy network correlated data gathering with high-resolution coding
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:R. Cristescu; B. Beferull-Lozano
Year: 2005
Robustness vs. efficiency in sensor networks
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:X. Zhang; S.B. Wicker
Year: 2005
Analysis of a wireless sensor dropping problem in wide-area environmental monitoring
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:M. Leoncini; G. Resta; P. Santi
Year: 2005
Virtual patrol: a new power conservation design for surveillance using sensor networks
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:C. Gui; Prasant Mohapatra
Year: 2005
A key pre-distribution scheme using deployment knowledge for wireless sensor networks
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Z. Yu; Y. Guan
Year: 2005
ROPE: robust position estimation in wireless sensor networks
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:L. Lazos; Radha Poovendran; S. Capkun
Year: 2005
Matched source-channel communication for field estimation in wireless sensor network
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:W. Bajwa; A. Sayeed; R. Nowak
Year: 2005
Robust computation of aggregates in wireless sensor networks: distributed randomized algorithms and analysis
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:J.-Y. Chen; G. Pandurangan; D. Xu
Year: 2005
Scalable topology control for deployment-support networks
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:J. Beutel; M. Dyer; L. Meier; L. Thiele
Year: 2005
Telos: enabling ultra-low power wireless research
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:J. Polastre; R. Szewczyk; D. Culler
Year: 2005
Networked infomechanical systems: a mobile embedded networked sensor platform
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:R. Pon; M.A. Batalin; J. Gordon; A. Kansal; D. Liu; M. Rahimi; L. Shirachi; Y. Yu; M. Hansen; W.J. Kaiser; M. Srivastava; G. Sukhatme; D. Estrin
Year: 2005
Robomote: enabling mobility in sensor networks
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:K. Dantu; M. Rahimi; H. Shah; S. Babel; A. Dhariwal; G.S. Sukhatme
Year: 2005
Experiences and directions in Pushpin computing
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:J. Lifton; M. Broxton; J.A. Paradiso
Year: 2005
eBlocks - an enabling technology for basic sensor based systems
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:S. Cotterell; R. Mannion; F. Vahid; H. Hsieh
Year: 2005
XYZ: a motion-enabled, power aware sensor node platform for distributed sensor network applications
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:D. Lymberopoulos; A. Savvides
Year: 2005
A modular power-aware microsensor with >1000X dynamic power range
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:B. Schott; M. Bajura; J. Czarnaski; J. Flidr; T. Tho; L. Wang
Year: 2005
Avrora: scalable sensor network simulation with precise timing
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:B.L. Titzer; D.K. Lee; J. Palsberg
Year: 2005
Design of a wireless sensor network platform for detecting rare, random, and ephemeral events
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Prabal Dutta; M. Grimmer; A. Arora; S. Bibyk; D. Culler
Year: 2005
The design and evaluation of a hybrid sensor network for cane-toad monitoring
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:W. Hu; Van Nghia Tran; N. Bulusu; C.T. Chou; S. Jha; A. Taylor
Year: 2005
Realization of Pb-Free FC-BGA Technology on Low-k Device
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:E. Hayashi; S. Baba; S. Idaka; A. Maeda; M. Satoh; M. Kimura
Year: 2005
Development of 50mm Flipchip Plastic Ball Grid Array Package with Low-K Silicon Technology
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Z. Kutlu; S. Rajagopalan; Chaowen Chung
Year: 2005
Chip Scale Packaging Solution with the Flip-Chip Technologies for CMOS Image Sensor
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Gi-Jo Jung; Young-Woon Yeo; Yun-Mook Park; In-Soo Kang; Jong-Heon Kim; J. Choi
Year: 2005
High I/O Glass Ceramic Package Pb-Free BGA Interconnect Reliability
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Xiang Dai; Ning Pan; A. Castro; J. Culler; M. Hussain; R. Lewis; T. Michalka
Year: 2005
Thermo-Mechanical Reliability of High-End Flip Chip BGA Packages: Comparison Heat Spreader and Motherboard Construction
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Sang Ha Kim; Han Park; K. Suzuki
Year: 2005
Aligned carbon nanotubes for electrical interconnect and thermal management
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Lingbo Zhu; Yangyang Sun; Jianwen Xu; Zhuqing Zhang; D.W. Hess; C.P. Wong
Year: 2005
Study on Thermal Interface Material with Carbon Nanotubes and Carbon Black in High-Brightness LED Packaging with Flip-Chip
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Kai Zhang; Guo-Wei Xiao; C.K.Y. Wong; Hong-Wei Gu; M.M.F. Yuen; P.C.H. Chan; Bing Xu
Year: 2005
Effect of Intermetallics Spalling on the Mechanical Behavior of Electroless Ni(P)/Pb-Free Solder Interconnection
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Yoon-Chul Sohn; Jin Yu; S.K. Kang; Da-Yuan Shih; Taek-Yeong Lee
Year: 2005
150 μm Pitch Pb-Free Flipchip Packaging with Cu/Low-k Interconnects
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Seung Wook Yoon; V. Kripesh; A. Viswanath; Hong Yu Li; M.K. Iyer
Year: 2005
Ag plating and its impact on void-free Ag/Sn bumping
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:H. Ezawa; K. Higuchi; M. Seto; T. Togasaki; S. Takeda; R. Kiumi
Year: 2005
A new method to predict delamination in electronic packages
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:H.B. Fan; C.K.Y. Wong; M.M.F. Yuen
Year: 2005
Multi-Physics Based Structural Similarity Rules for the BGA Package Family
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:W.D. van Driel; A. Mavinkurve; M.A.J. van Gils; G.Q. Zhang; D.G. Yang; L.J. Ernst
Year: 2005
Development of Low Stress No-Flow Underfill for Flip-Chip Application
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:O. Suzuki; S. Kawamoto
Year: 2005
Methods of underfill flow voids detection and minimization in flip chip package
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:J. Wang; M. Hsu; P. Dunaway; D. He; K. Buckmann
Year: 2005
Comprehensive hygro-thermo-mechanical modeling and testing of stacked die BGA module with molded underfill
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:X. Zhang; Tong Yan Tee; Hun Shen Ng; J. Teysseyre; S. Loo; S. Mhaisalkar; Fong Kuan Ng; Chwee Teck Lim; Xinyu Du; E. Bool; Wenhui Zhu; S. Chew
Year: 2005
Wafer bonding of damascene-patterned metal/adhesive redistribution layers for via-first three-dimensional (3D) interconnect
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:J.J. McMahon; J.-Q. Lu; R.J. Gutmann
Year: 2005
Ultra-High Reliability Flip Chip on Laminate For Harsh Environments
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:D.S. Copeland; M.K. Rahim; J.C. Suhling; Guoyun Tian; P. Lall; R.C. Jaeger; K. Vasoya
Year: 2005
High temperature potential of flip chip assemblies for automotive applications
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:T. Braun; K.-F. Becker; J.-P. Sommer; T. Loher; K. Schottenloher; R. Kohl; R. Pufall; V. Bader; M. Koch; R. Aschenbrenner; H. Reichl
Year: 2005
Failure-Envelope Approach to Modeling Shock and Vibration Survivability of Electronic and MEMS Packaging
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:P. Lall; D. Panchagade; P. Choudhary; J. Suhling; S. Gupte
Year: 2005
Simulation of mechanical response of solder joints under drop impact using equivalent layer models
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Jie Gu; C.T. Lim; A.A.O. Tay
Year: 2005
Parametric Investigation of Dynamic Behavior of FBGA Solder Joints in Board-Level Drop Simulation
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:S. Groothuis; Changming Chen; R. Kovacevic
Year: 2005
Development of quasi half coax lines for wafer level packaging
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:S.R. Banerjee; R.F. Drayton
Year: 2005
Design and Development of True-CSP
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:K.R. Kanth; F.K.S. Poh; B.K. Lim; D.Y.R. Chong; A. Sun; H.B. Tan
Year: 2005
Array of Nano-Cantilevers as a Bio-Assay for Cancer Diagnosis
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:K.M. Klein; Jiantao Zheng; A. Gewirtz; D.S. Sarma; S. Rajalakshmi; K. Sitaraman
Year: 2005
Cytotoxicity of COB materials
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:J. Uhlemann; S. Schindler; G. Schlottig; M. Drechsler; S. Starcke; G. Vollmer; K.-J. Wolter
Year: 2005
Fabrication of multilayered microfluidic 3D polymer packages
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:S. Garst; M. Schuenemann; M. Solomon; M. Atkin; E. Harvey
Year: 2005
Disposable Polydimethylsioxane Package for 'Bio~Microfluidic System'
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Ser Choong Chong; Ling Xie; L. Yobas; Hong Miao Ji; Jing Li; Yu Chen; P. Damaruganath; Wing Cheong Hui; M.K. Iyer
Year: 2005
Drop Impact Reliability Testing for Lead-Free and Leaded Soldered IC Packages
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:D.Y.R. Chong; Kellin Ng; J.Y.N. Tan; P.T.H. Low; J.H.L. Pang; F.X. Che; B.S. Xiong; L.H. Xu
Year: 2005
Board level drop test reliability of IC packages
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:T.C. Chai; S. Quek; W.Y. Hnin; E.H. Wong; J. Chia; Y.Y. Wang; Y.M. Tan; C.T. Lim
Year: 2005
Drop test reliability of wafer level chip scale packages
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:M. Alajoki; Luu Nguyen; Jorma Kivilahti
Year: 2005
Modal and impact analysis of modern portable electronic products
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:L.B. Tan; C.W. Ang; C.T. Lim; V.B.C. Tan; Xiaowu Zhang
Year: 2005
Dynamic test and modeling methodology for BGA solder joint shock reliability evaluation
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:P. Geng
Year: 2005
Wafer level package solder joint reliability study for portable electronic devices
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Se-Young Jang; Tae-Sang Park; Yeon-Sung Kim; Jae-Woo Jeong; Jung-Je Ban; Dong-Ki Kang
Year: 2005
Effect of impact pulse parameters on consistency of board level drop test and dynamic responses
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Jing-en Luan; Tong Yan Tee
Year: 2005
Microstructure and Damage Evolution in Sn-Ag-Cu Solder Joints
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:L.P. Lehman; R.K. Kinyanjui; J. Wang; Y. Xing; L. Zavalij; P. Borgesen; E.J. Cotts
Year: 2005
The Bonding of Sn-Zn-Ag-Al-Ga Lead-Free Solder Balls on Cu/Ni-P/Au BGA Substrate
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Kwang-Lung Lin; Ying-Ta Chiu
Year: 2005
Isothermal low cycle fatigue behavior of Sn-8Zn-3Bi on single shear solder joint
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Peng Sun; C. Andersson; Liqiang Cao; Zhonghe Lai; Zhaonian Cheng; Xicheng Wei; J. Liu
Year: 2005
Modeling of Power Supply Noise with Non-Linear Drivers using Recurrent Neural Network (RNN) Models
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:B. Mutnury; M. Swaminathan; M. Cases; Nam Pham; D.N. de Araujo; E. Matoglu
Year: 2005
Design of high power microwave miniaturized terminations
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:S.V. Georgakopoulos; J. Morelli
Year: 2005
High Q, tunable thin film capacitors and geometrical effects on device performance at microwave frequencies
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Jaehoon Park; Jiwei Lu; S. Stemmer; R.A. York
Year: 2005
Ultra-Thin 3D-Stacked SIP Formed using Room-Temperature Bonding between Stacked Chips
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:N. Tanaka; Y. Yoshimira; T. Naito; C. Miyazaki; Y. Nemoto; M. Nakanishi; T. Akazawa
Year: 2005
High thermal performance FBGA MCP with a silicon spacer
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Joonghyun Baek; Heejin Lee; Sangwook Park; Haehyung Lee; Dongho Lee; Seyong Oh
Year: 2005
Nano-Composite Lead-Free Interconnect and Reliability
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:R. Doraiswami; R. Tummala
Year: 2005
Experimental damage mechanics of microelectronic solder joints under fatigue loading
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:C. Basaran; H. Tang; S. Nie
Year: 2005
Shear deformation of lead free solder joints
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:R. Darveaux
Year: 2005
Powercycling Reliability, Failure Analysis and Acceleration Factors of Pb-Free Solder Joints
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:K. Setty; G. Subbarayan; Luu Nguyen
Year: 2005
The effects of Cu doping in eutectic PbSn solder balls on ENIG substrates
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:M. Nguyen
Year: 2005
Flip chip ball grid array component testing under board flexure
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:G. Hsieh; A. Mcallister
Year: 2005
Effect of Reflow Profiles on the Board Level Drop Reliability of Pb-Free (SnAgCu) BGA Assemblies
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:A. Lal; E. Bradley; J. Sharda
Year: 2005
Cu/Ag Leadframe-Finish Migration Phenomena in Stress-Induced Green Phosphorus Mold Epoxy: An Electrochemical and Material
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:S. Chungpaiboonpatana; F.G. Shi
Year: 2005
Pb-free Assembly, Rework, and Reliability Analysis of IPC Class 2 Assemblies
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:J. Gleason; C. Reynolds; J. Bath; Quyen Chu; M. Kelly; K. Lyjak; P. Roubaud
Year: 2005
New insights in critical solder joint location
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:M. Modi; C. McCormick; N. Armendariz
Year: 2005
Molecular dynamics simulation of lead free solder for low temperature reflow applications
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Hai Dong; Lianhua Fan; Kyoung-sik Moon; C.P. Wong; M.I. Baskes
Year: 2005
Novel Damage Model for Delamination in Cu/low-k IC Backend Structures
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:M.A.J. van Gils; O. van der Sluis; G.Q. Zhang; J.H.J. Janssen; R.M.J. Voncken
Year: 2005
Coupled BEM and FEM analysis of functionally graded underfill layers in electronic packages
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:M. Das; I. Guven; E. Madenci
Year: 2005
500-Gbps Parallel-WDM Optical Interconnect
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:B.E. Lemoff; M.E. Ali; G. Panotopoulos; E. de Groot; G.M. Flower; G.H. Rankin; A.J. Schmit; K.D. Djordjev; M.R.T. Tan; A. Tandon; W. Gong; R.P. Tella; B. Law; D.W. Dolfi
Year: 2005
Ultralow-Cost Optical Transceiver Modules Based on Leadframe Plastic-Package Technology
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:F. Ho; V. Hung; E. Tong; T. Choi; A. Chow; E. Wong; B. Lui; K. Yau; G. Egnisaban; T. Mangente; S. Ng; A. Ng; S. Cheng; E. Cheung; T. Wipiejewski
Year: 2005
Flexible Electronic-Optical Local Bus Modules to the Board-to-Board, Board-to-Chip, and Chip-to-Chip Optical Interconnection
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Li-Cheng Shen; Wei-Chung Lo; Hsiang-Hung Chang; Huan-Chun Fu; Yuan-Chang Lee; Shu-Ming Chang; Yu-Chih Chen; Wun-Yan Chen
Year: 2005
Small form factor pluggable optical transceiver module with extremely low power consumption for dense wavelength division multiplexing applications
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:M. Ichino; S. Yoshikawa; H. Oomori; Y. Maeda; N. Nishiyama; T. Takayama; T. Mizue; I. Tounai; M. Nishie
Year: 2005
High Density Packaged 4-Channel Transceiver for Metro and Access Applications
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:T. Tamanuki; Zhenhua Shao; N. Huang; K. Takahashi; C. Keller; Dong-Dong Wang; M. Ito
Year: 2005
Transmitter optical subassembly for XFP applications
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:L.B. Aronson; G. Giaretta; S. Schiaffmo; B. Mason
Year: 2005
Using PDMS Micro-Transfer Moulding for Polymer Flip Chip Packaging on MEMS
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:E.K.L. Chan; C.K.Y. Wong; M. Lee; M.M.F. Yuen; Yi-Kuen Lee
Year: 2005
A study on packaging of PZT MEMS microphone
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Jian Cai; Haining Wang; Shuidi Wang; Xiaoming Wu; Tianling Ren; Songliang Jia
Year: 2005
A Wafer-Level Packaging Approach for MEMS and Related Microsystems using Selective Laser-Assisted Bonding (LAB)
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:A. Mohan; C.B. O'Neal; A.P. Malshe; R.B. Foster
Year: 2005
A low temperature, hermetic wafer level packaging method for RF MEMS switch
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Woonbae Kim; Qian Wang; Junsik Hwang; Moonchul Lee; Kyudong Jung; SukJin Ham; Changyoul Moon; Kyedong Baeks; Byeoungju Ha; Insang Song
Year: 2005
Solder-Free Pressure Contact Micro-Springs in High-Density Flip-Chip Packages
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:E.M. Chow; C. Chua; T. Hantschel; K. van Schuylenbergh; D.K. Fork
Year: 2005
Z-Axis Interconnection for Enhanced Wiring in Organic Laminate Electronic Packages
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:F.D. Egitto; S.R. Krasniak; K.J. Blackwell; S.G. Rosser
Year: 2005
50 Micron Pitch Wafer Level Packaging Testbed with Reworkable IC-Package Nano Interconnects
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:A.O. Aggarwal; P.M. Raj; V. Sundaram; D. Ravi; Sauwee Koh; R. Mullapudi; R.R. Tummala
Year: 2005
Determination of silicon die strength
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:M.Y. Tsai; C.S. Lin
Year: 2005
Dielectric Integrity Test for Flip-Chip Devices with Cu/Low-k Interconnects
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:C. Odegard; Tz-Cheng Chiu; C. Hartfield; V. Sundararaman
Year: 2005
Fundamentals of delamination initiation and growth in flip chip assemblies
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:M.K. Rahim; J.C. Suhling; R.C. Jaeger; P. Lall
Year: 2005
Study of flip chip solder joint cracks under temperature cycling using a laser ultrasound inspection system
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Lizheng Zhang; I.C. Ume; J. Gamalski; K.-P. Galuschki
Year: 2005
Drop Impact: Fundamentals and Impact Characterisation of Solder Joints
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:E.H. Wong; R. Rajoo; Y.W. Mai; S.K.W. Seah; K.T. Tsai; L.M. Yap
Year: 2005
Effect of Stress Relaxation on Board Level Reliability of Sn Based Pb-Free Solders
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:S. Yoon; Z. Chen; M. Osterman; B. Han; A. Dasgupta
Year: 2005
Aqueous-Base-Developable Benzocyclobutene (BCB)-Based Material Curable in Air
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Ying-Hung So; E. Stark; Yongfu Li; T. Stokich; K. Ober; A. Achen; D. Scheck; S. Kisting; J. Hetzner; K. Baranek; J. Curphy; S. Thurston; E. Beach; J. Folkenroth; T. Richardson; S. Rozeveld
Year: 2005
High-K Nanocomposites with Core-Shell Structured Nanoparticles for Decoupling Applications
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Jianwen Xu; C.P. Wong
Year: 2005
Frequency and Temperature Dependence of Dielectric Constant of Epoxy/BaTiO3 Composite Embedded Capacitor Films (ECFs) for Organic Substrate
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Jin-Gul Hyun; Sangyong Lee; Sung-Dong Cho; Kyung-Wook Paik
Year: 2005
Absolute and relative fatigue life prediction methodology for virtual qualification and design enhancement of lead-free BGA
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Hun Shen Ng; Tong Yan Tee; Kim Yong Goh; Jing-en Luan; T. Reinikainen; E. Hussa; A. Kujala
Year: 2005
Reliability analysis for the design of a multi-layer flexible board
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Feixia Pan; R. Vatanporast
Year: 2005
Reliability prediction in electronic packages using molecular simulation
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:H.B. Fan; C.K.Y. Wong; M.M.F. Yuen
Year: 2005
Silicon Carrier with Deep Through-Vias, Fine Pitch Wiring and Through Cavity for Parallel Optical Transceiver
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:C.S. Patel; C.K. Tsang; C. Schuster; F.E. Doany; H. Nyikal; C.W. Baks; R. Budd; L.P. Buchwalter; P.S. Andry; D.F. Canaperi; D.C. Edelstein; R. Horton; J.U. Knickerbocker; T. Krywanczyk; Y.H. Kwark; K.T. Kwietniak; J.H. Magerlein; J. Rosner; E. Sprogis
Year: 2005
Wafer-Level Packaging Technology for 10 Gbps TOSAs
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:D.W. Sherrer; N. Brese; J. Fisher; C. Gaebe; N.A. Heiks; J. Getz; J. Rasnake; E.S. Simon
Year: 2005
Highly integrated VCSEL-based 10Gb/s miniature optical sub-assembly
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:S. Bernabe; R. Stevens; M. Volpert; R. Hamelin; C. Rossat; F. Berger; L. Lombard; C. Kopp; J. Berggren; P. Sundgren; M. Hammar
Year: 2005
Silicon optical benches for next generation optical packaging: going vertical or horizontal?
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:M. Epitaux; Y. Petremand; W. Noell; N. de Rooij; J.-M. Verdiell
Year: 2005
Hybrid integration of monolithic semiconductor optical amplifier arrays using passive assembly
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:G. Maxwell; A. Poustie; C. Ford; M. Harlow; P. Townley; M. Nield; T. Lealman; S. Oliver; L. Rivers; R. Waller
Year: 2005
High power VCSEL devices for free space optical communications
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:M. Yoshikawa; A. Murakami; J. Sakurai; H. Nakayama; T. Nakamura
Year: 2005
Recent Advances in Ceramic Composite Substrate Materials for High-Density and High Reliability Packaging Applications
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:N. Kumbhat; P.M. Raj; R.V. Pucha; S. Atmur; R. Doraiswamy; V. Sundaram; S. Bhattacharya; S.K. Sitaraman; R.R. Tummala
Year: 2005
Using MMAP for mixed signal empirical substrate design optimization
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:G. Robertson
Year: 2005
Challenges of megapixel camera module assembly and test
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:A. Chowdhury; R. Darveaux; J. Tome; R. Schoonejongen; M. Reifel; A. De Guzman; Sung Soon Park; Yong Woo Kim; Hyung Wook Kim
Year: 2005
Miniaturised inertial measurement units (IMU) for wireless sensor networks and novel display interfaces
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:J. Barton; A. Lynch; S. Bellis; B. O'Flynn; F. Murphy; K. Delaney; S.C. O'Mathuna; P. Repetto; R. Finizio; C. Carvignese; L. Liotti
Year: 2005
Integrating electrothermal coupling analysis in the calibration of experimental electromigration reliability of flip-chip packages
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Yi-Shao Lai; S. Sathe; Chin-Li Kao; Chiu-Wen Lee
Year: 2005
An evaluation of electromigration performance of SnPb and Pb-free flip chip solder joints
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Peng Su; Min Ding; T. Uehling; D. Wontor; P.S. Ho
Year: 2005
Modeling deformation in microelectronics BGA solder joints under high current density. Part I. Simulation and testing
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Hua Ye; C. Basaran; D.C. Hopkins; Minghui Lin
Year: 2005
Effect of interface on thermal conductivity of polymer composite
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Hai Dong; Lianhua Fan; C.P. Wong
Year: 2005
Improving solder joint reliability in Pb-free flip chips with advanced underfill adhesives
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:S. Kanagavel; M. Painaik; J.M. Hurley; A. Dhoble
Year: 2005
Advances in flip chip underfill technology for lead-free component packaging
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:K. Ghosh; M. McCabe; Guoyun Tian
Year: 2005
Internal stresses evolution of non conductive pastes (NCPs) and underfill materials for flip chip applications
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Kyung-Woon Jang; Hyoung-Joon Kim; Woon-Seong Kwon; Kyung-Wook Paik
Year: 2005
Design optimization of a high performance FCAMP package for manufacturability and reliability
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:J. Priest; M. Ahmad; Li Li; Jie Xue; M. Brillhart
Year: 2005
01005 SMT component assembly for wireless SIP modules
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:R. Jarvina; S. Greiner; R. Warren
Year: 2005
Identification of process variables affecting the quality of fine pitch high performance ASIC substrates
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:E. Bay; A. Bhatt; R. Keesler; J. Konrad; R. Sebesta
Year: 2005
A novel mechanical shock test method to evaluate lead-free BGA solder joint reliability
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:D. Reiff; E. Bradley
Year: 2005
Design and verification of multi-gigabit transmission channels using equalization techniques
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:E. Matoglu; M. Cases; D.N. de Araujo; N. Pham; P.W. Metty; K. Dramstad
Year: 2005
Neuro-genetic models in modeling nonlinear digital I/O buffer circuits
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:M. Roumbakis; B. Mutnury; S. Ulrich; J. Ratcliffe; D. de Araujo; M. Cases
Year: 2005
Prediction of maximum operating frequency for packaged microprocessor using measurements and modeling
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:R.J. Wenzel
Year: 2005
Incorporation of impedance boundary conditions into an advanced, integral equation, full-wave simulator
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Yi Cao; Zhaohui Zhu; Xing Wang; S.L. Dvorak; J.L. Prince
Year: 2005
Comparison of compact on-chip inductors embedded in wafer-level package
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:K. Itoi; M. Sato; K. Okada; K. Masu; T. Ito
Year: 2005
Influence of via-connections on electrical performance of vertically-spaced RF passives
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:M. Bartek; S.M. Sinaga; J.N. Burghartz
Year: 2005
Development of high-Q embedded passive library for RF-SOP module applications
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:T.S. Horng; Y.S. Tsai; C.T. Chiu; S.M. Wu; C.P. Hung; R. Chen; C.H. Chu
Year: 2005
Fabrication of application specific integrated passive devices using wafer level packaging technologies
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:K. Zoschke; J. Wolf; M. Topper; O. Ehrmann; T. Fritzsch; K. Scherpinski; H. Reichl; F.-J. Schmuckle
Year: 2005
A new thermal measurement technique using nematic liquid crystals with IR laser illumination for visible light emitting devices
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Jeong Park; C.C. Lee
Year: 2005
Comparative high speed optical interconnections using thin film photodetectors embedded in polymer waveguides
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Sang-Yeon Cho; Sang-Woo Seo; N.M. Jokerst; M. Brooke
Year: 2005
Evaluation of gold and aluminum wire bond performance for high temperature (500 /spl deg/C) silicon carbide (SiC) power modules
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:H.A. Mustain; A.B. Lostetter; W.D. Brown
Year: 2005
Fiber-based BiDi transceiver module using optical subassembly with an injection molded polymer optical bench
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:M.L. Tsai; C.H. Ko; M.J. Chou; W.S. Lin; J.S. Chang; B.C. Tsai; Y.T. Chiou; C.H. Chu
Year: 2005
High manufacturability and high reliable 10Gb/s electro-absorption laser package
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Ying-Chih Chen; Yuan-Jen Chang; Yi-Ming Chen; Chen-Kun Chen; Chun-Hsing Lee; Chi-Yu Ni; Chih-Hao Hsu; Fu-Yi Cheng; Shin-Ge Lee; Yu-Chen Yu; Jyh-Long Chern
Year: 2005
Influence of environmental stresses on board-level integrated polymer optics
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:M. Immonen; Jianbo Wu; J. Kivilahti
Year: 2005
Mechanical behavior of flip chip packages under thermal loading
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Shoulung Chen; C.Z. Tsai; N. Kao; Enboa Wu
Year: 2005
Mechanics of coated optical fibers: review and extension
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:E. Suhir
Year: 2005
Solid-state microchip laser bonding by a low temperature epoxy-free and flux-less process
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:C. Kopp; K. Gilbert
Year: 2005
The thermal conductivity of solder joint material with plastic core
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:A. Hasegawa; M. Okuda; N. Okinaga
Year: 2005
Volume production of on-board optical waveguides
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:J. Hietala; E. Muukkonen; T. von Lerber; M. Immonen; A. Oy
Year: 2005
10Gbps multi-mode waveguide for optical interconnect
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Yi-Ming Chen; Cheng-Lin Yang; Yao-Ling Cheng; Hsiu-Hsiang Chen; Ying-Chih Chen; Yen Chu; Tsung-Eong Hsieh
Year: 2005
Design and packaging for a reliable 8-Watt solid state RF power amplifier for radar
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:E.R. Crespin; D. Lee
Year: 2005
Determine two-port S-parameters from one-port measurements using calibration substrate standards
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:J. Ou; M.F. Caggiano
Year: 2005
Experimental testing and computational stress analysis of printed circuit board for the failure prediction of passive components under the depaneling load condition
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:D. Lau; M. Tsang; S.W.R. Lee; J. Lo; Lifong Fu; Jiwen Jin; Sang Liu
Year: 2005
Fabrication and characteristics of traveling-wave electro-absorption modulator (TWEAM) modules for millimeter-wave radio-over-fiber link
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Kwang-Seong Choi; Jong-Hyun Lee; Yong-Duck Chung; Young-Shik Kang; Byoung-Tae Ahn; Jong-Tae Moon; Jeha Kim
Year: 2005
Lotus effect surface for prevention of microelectromechanical system (MEMS) stiction
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Lingbo Zhu; Jianwen Xu; Zhuqing Zhang; D.W. Hess; C.P. Wong
Year: 2005
Novel approach to numerical prototyping in microelectronics and microsystems
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:A. Wymyslowski; G.Q. Zhang; J. Van de Peer; N. Tzannetakis; W. Van Driel
Year: 2005
Optical interconnection schemes using micro-optic connectors for passive packaging in optical PCBs
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Mu Hee Cho; Han Seo Cho; Sung Hwan Hwang; Hyo-Hoon Park; Kyung Rok Kim; Jongho Lee
Year: 2005
Rapid, predictive measurement-based modeling for high frequency interconnect on FR4 substrate
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Jaemin Shin; Jae Hong Kim; Cheolung Cha; N.M. Jokerst; M. Brooke
Year: 2005
Scattering parameter characterization of differential four-port networks using a two-port vector network analyzer
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Ka Mun Ho; K. Vaz; M. Caggiano
Year: 2005
Thermal-mechanical analysis of Terabus high-speed optoelectronic package
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Shashikant Hegde; Lei Shan; D.M. Kuchta; Y.H. Kwark; C.W. Baks; F. Doany; J.A. Kash; J.M. Trewhella
Year: 2005
Effects of the solder oxide layer on high frequency signal propagation in Pb-free interconnections
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:D. Burlacu; Luu Nguyen; Jorma Kivilahti
Year: 2005
Flip chip mountable optical waveguide amplifier for optical backplane systems
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:S. Uhlig; M. Robertsson
Year: 2005
Low cost reconfigurable impedance tuner in organic substrate for system-on-package (SOP) applications
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:C. Lee; C. Lugo, Jr.; Guizhen Zheng; J. Papapolymerou
Year: 2005
Analysis of distance learning courses offered by the EuroTraining course directory
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Z. Illyefalvi-Vitez; G. Harsanyi; B. Balogh; P. Civera
Year: 2005
Interactive multimedia development for mixed-signal design and test education
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:K.E. Newman; S. Maitra; M.M. Meshram
Year: 2005
Developing a course about nano-packaging
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:T. Zerna; K.-J. Wolter
Year: 2005
An Internet course for teaching basic MEMS technologies and applications: MEMSEdu
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:G. Harsanyi; P. Bojta; P. Gordon; H. Santha
Year: 2005
Developing and assuring trustworthy Web services
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:W.T. Tsai; X. Wei; Y. Chen; B. Xiao; R. Paul; H. Huang
Year: 2005
Applying synthesized immune networks hypothesis to mobile robots
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Q.J. Duan; R.X. Wang; H.S. Feng; L.G. Wang
Year: 2005
Socio-technical implications of the ubiquitous information systems
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:M. Funabashi; K. Homma; T. Sasaki
Year: 2005
Ubiquitous service - using RFID tag reader on a mobile terminal
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:M. Ohashi
Year: 2005
Autonomous video-on-demand system for heterogeneous quality levels to achieve high assurance
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:M. Kanda; M. Tasaka; Xiaodong Lu; I. Luque; Jiang Yanqing; K. Moriyama; R. Takanuki; Y. Kuba
Year: 2005
Effect of preventive rejuvenation in communication network system with burst arrival
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:H. Okamura; S. Miyahara; T. Dohi
Year: 2005
The study of Maglev train diagnosis system based on ADS' ideas
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Liu Zhigang; He Zhengyou; Zhang Dabo; Zhang Yajun
Year: 2005
Multisensor multitarget tracking methods based on particle filter
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Xiong wei; Zhang jing-wei; He you
Year: 2005
Autonomous cooperation technology for real-time marketing with high accuracy in autonomous decentralized community system
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Y. Horikoshi; N. Kaji; H. Kuriyama; Y. Sugiyama
Year: 2005
Decentral control of a robot-swarm
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:I. Dahm; M. Hebbel; M. Hulsbusch; J. Kerdels; W. Nistico; C. Schumann; M. Wachter
Year: 2005
v-SVM for transient stability assessment in power systems
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Xiaohong Wang; Sitao Wu; Qunzhan Li; Xiaoru Wang
Year: 2005
Content-based color image retrieval via lifting scheme
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Huihui Huang; Wei Huang; Zhigang Liu; Weirong Chen; Qingquan Qian
Year: 2005
High-level representations of temporary traffic states using Hasse graph and temporal change map under a grid-based site model
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Xiaoming Yao; Qingquan Qian
Year: 2005
Creation, deployment, and execution of rule-based services
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Ilja Radusch; S. Arbanowski; S. Steglich; R. Popescu-Zeletin
Year: 2005
The future of high-speed train
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Y. Ishida
Year: 2005
The Yaoyorozu project designing ubiquitous information society in 2010
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Matohisa Funabashi; Koichi Homma; Toshiro Sasaki
Year: 2005
A novel forward search strategy to automatically harmonize intensification and diversification in tabu search
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:KaiYou Lei; Fang Wang; Yuhui Qiu; Guangyuan Liu; Yi He
Year: 2005
An immune-based model for Web data mining
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Wang Feng; Xuwei Li; Zhu Hong
Year: 2005
Web services-based collaborative and cooperative computing
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:W.T. Tsai; Z. Cao; Y. Chen; R. Paul
Year: 2005
HADS-humanized autonomous decentralized systems
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Tu Xuyan; Zeng Guangping; Tangtao
Year: 2005
IIPP and CIT based intelligent autonomous QA system
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Wang Cong; Guo Yahui; Liu Jianyi
Year: 2005
Achieving power-law placement in wireless sensor networks
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:M. Ishizuka; M. Aida
Year: 2005
A dynamic index allocation scheme for peer-to-peer networks
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:T. Ohta; Y. Masuda; K. Mitsukawa; Y. Kakuda; A. Ito
Year: 2005
Efficient on-demand route establishment methods for dense ad-hoc networks
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Y. Noishiki; H. Yokota; A. Idoue
Year: 2005
Replication scheme for traffic load balancing and its parameter tuning in pure P2P communication
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:S. Nogami; M. Uchida; T. Abe
Year: 2005
Reputation management: experiments on the robustness of ROCQ
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:A. Garg; R. Battiti; R. Cascella
Year: 2005
Autonomics in telecommunications service activation
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:S. Magrath; F. Chiang; S. Markovits; R. Braun; F. Cuervo
Year: 2005
The future of power semiconductors
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:I. Bencuya
Year: 2005
Analysis and minimization of input ripple current in PWM inverters for designing reliable fuel cell power systems
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:W. Shireen; R.A. Kulkarni; M. Arefeen
Year: 2005
An improved anti-islanding algorithm for utility interconnection of multiple distributed fuel cell powered generations
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:C. Jeraputra; E.C. Aeloiza; P.N. Enjeti; S. Choi
Year: 2005
A small-signal equivalent circuit model for PEM fuel cells
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:E. Hernandez; B. Diong
Year: 2005
AC-DC server power supplies: making the leap to higher efficiency
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:C. Calwell; A. Mansoor
Year: 2005
AC-DC power supply growth variation in China and North America
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:J.P. Bryant
Year: 2005
The design of a high-frequency multiphase voltage regulator with adaptive voltage positioning and all ceramic capacitors
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Wenkang Huang
Year: 2005
Novel 600 V GaN Schottky diode delivering SiC performance at Si prices
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:I. Cohen; Ting Gang Zhu; Linlin Liu; M. Murphy; M. Pophristic; M. Pabisz; M. Gottfried; B.S. Shelton; B. Peres; A. Ceruzzi; R.A. Stall
Year: 2005
High temperature operation of a dc-dc power converter utilizing SiC power devices
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:B. Ray; J.D. Scofield; R.L. Spyker; B. Jordan; Sei-Hyung Ryu
Year: 2005
Characterization of 6.5 kV IGBT modules for hard- and soft-switching operation in medium voltage applications
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:U. Schwarzer; R.W. De Doncker
Year: 2005
Design of integrated LLCT module for LLC resonant converter
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Wenduo Liu; J.D. van Wyk
Year: 2005
A new three-phase five-level current-source inverter
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Yu Xiong; Yuling Li; Xin Yang; Zhongchao Zhang; Kun Wei
Year: 2005
Reduced switch count dual-winding ac drive system with common-mode voltage mitigation
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:M.B. de R Correa; C.B. Jacobina; C.R. da Silva; A.M.N. Lima
Year: 2005
A new controller for three-phase boost rectifiers lacking balance in source voltages and impedances
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:O. Ojo; Zhiqiao Wu
Year: 2005
Constant power control based self-oscillating electronic ballast
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:R.L. Lin; Y.D. Lee
Year: 2005
Design of piezoelectric transformer for PFC electronic ballast
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Weixing Huang; D.Y. Chen; E.M. Baker; Jinghai Zhou; F.C. Lee
Year: 2005
Practical aspects of the unity power factor isolated three-phase rectifier based on the Scott transformer
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:S.K.T. Miller; I. Barbi
Year: 2005
A DSP based digitally controlled interleaved PFC converter
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:S. Choudhury; J.P. Noon
Year: 2005
Control and topologies for three-phase three-level active power filters
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Taotao Jin; Jun Wen; K. Smedley
Year: 2005
A robust 18-pulse rectifier for adjustable speed drive systems
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:E. Aeloiza; Y. Durrani; M. Rayner; R. Gopinath; P. Enjeti
Year: 2005
Simple feedback linearizing controller to reduce audiosusceptibility and load disturbance in the full-bridge current doubler synchronous rectifier
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:J.M. Guerrero; L.G. de Vicuna; N. Berbel; J. Sosa; M. Castilla
Year: 2005
Emulation of fractional turns in push-pull topologies
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:K.D. Papastergiou; C.K.R.M. Loh; D.E. Macpherson
Year: 2005
PSM drives with fault-tolerant position detection
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:M. Lambeck; M. Schrodl
Year: 2005
Current sensing trench power MOSFET for automotive applications
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Y. Xiao; J. Cao; J.D. Chen; K. Spring
Year: 2005
Short circuit analysis and protection of power module IGBTs
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:R. Pagano; Y. Chen; K. Smedley; S. Musumeci; A. Raciti
Year: 2005
Novel three-phase CM/DM conducted emissions separator
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:M.L. Heldwein; T. Nussbaumer; F. Beck; J.W. Kolar
Year: 2005
Digital current-mode controller for DC-DC converters
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:H. Peng; D. Maksimovic
Year: 2005
An indirect method of measuring DC bus capacitor current
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:R.W. Reese; L. Wei; R.A. Lukaszewski
Year: 2005
Large signal dielectric characterization for integrated electromagnetic power passives
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Yan Liang; Rengang Chen; J.D. van Wyk
Year: 2005
Wavelet neural network based battery state-of-charge estimation for portable electronics applications
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:L. Gao; Y. Song; R.A. Dougal
Year: 2005
A SPICE compatible behavioral electrical model of a heated tungsten filament
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:S. Ben-Yaakov; M.M. Peretz; B. Hesterman
Year: 2005
Current sharing for multichannel solar power system with maximum power point tracking
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:H. Al-Atrash; I. Issa Batarseh; K. Rustom
Year: 2005
Input voltage sensorless average current control technique for high-power-factor boost rectifiers operated in discontinuous conduction mode
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:R. Ghosh; G. Narayanan
Year: 2005
Quality assurance verification using a virtual prototyping system
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Laurence McGarry; Kitty Ying Qu; William Lee; Martin Sun; T.G. Wilson, Jr.
Year: 2005
Practical issues of input/output impedance measurements in switching power supplies and application of measured data to stability analysis
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Y. Panov; M. Jovanovic
Year: 2005
Dynamic performance analysis of outer-loop current sharing control for paralleled DC-DC converters
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:J. Sun; Y. Qiu; B. Lu; M. Xu; F.C. Lee; W.C. Tipton
Year: 2005
A general approach to averaged modeling and analysis of active-clamped converters
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:M. Chen; J. Sun
Year: 2005
Equivalent circuit modeling of a multilayer planar winding array structure for use in a universal contactless battery charging platform
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:X. Liu; S.Y.R. Hui
Year: 2005
Multiphase 48 volt conversion for low noise applications in an instrument grade power supply
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:T.R. Emmons
Year: 2005
A generic algorithm for global steady-state characterization of POL converters
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:M. Plesnik; M.S. Nakhla
Year: 2005
Inherently safe DC/DC converter using a normally-on SiC JFET
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:R.L. Kelley; M.S. Mazzola; W.A. Draper; J. Casady
Year: 2005
A unity power factor converter using the synchronous reference frame based hysteresis current control
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:A.I. Maswood; Fangrui Liu
Year: 2005
Parallel operation of one-cycle controlled three-phase PFC rectifiers
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Yang Chen; K. Smedley
Year: 2005
Current sensorless control of a voltage-source active power filter
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:M. Routimo; M. Salo; H. Tuusa
Year: 2005
Statistical modeling of DSP-based Hill-climbing MPPT algorithms in noisy environments
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:H. Al-Atrash; I. Batarseh; K. Rustom
Year: 2005
Sensorless operation of a PWM rectifier for en-gen set as a distributed generation
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Jang-Hwan Kim; Hyun jae Yoo; Seung-Ki Sul
Year: 2005
A novel, digitally-controlled, portable photovoltaic power source
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Zhenhua Jiang; R.A. Dougal
Year: 2005
Application of thyristor in auto-tuning arc suppression coils
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Liu Yancun; Fu Chuang
Year: 2005
A UPFC-based voltage compensator with current and voltage balancing function
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Y. Ikeda; T. Kataoka
Year: 2005
A novel method for dead-time compensation based on SVPWM
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Qingbo Hu; Haibing Hu; Zhengyu Lu; Wenxi Yao
Year: 2005
Design and testing of a modular permanent magnets brushless linear drive
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:K. Patel; S.D. D'Arco; A. Monti; D. Patterson; R. Dougal
Year: 2005
Modeling ceramic and tantalum capacitors by automatic SPICE parameter extractions
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Jun Lu; Lorentz Ou
Year: 2005
Using spectrograms in EMI-analysis - an overview
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:M. Kuisma; P. Silventoinen
Year: 2005
Auto-tuning self-compatibility of power converters
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:C. Attaianese; G. Tomasso
Year: 2005
Synergetic control for ultracapacitors based high dynamic converters
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:A. Lidozzi; L. Solero; A. Di Napoli; F. Crescimbini
Year: 2005
A behavioral SPICE compatible model of a self-oscillating converter
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:S. Ben-Yaakov; I. Fridman
Year: 2005
A new method to measure the switched reluctance motor's flux
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Jinhui Zhang; A.V. Radun
Year: 2005
Suspended Greek cross test structures for measuring the sheet resistance of non-standard cleanroom materials
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:S. Enderling; C.L. Brown, III; S. Smith; M.H. Dicks; J.T.M. Stevenson; A.W.S. Ross; M. Mitkova; M.N. Kozicki; A.J. Walton
Year: 2005
Extraction of critical dimension reference feature CDs from new test structure using HRTEM imaging
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:R.A. Allen; A. Hunt; C.E. Murabito; B. Park; W.F. Guthrie; M.W. Cresswell
Year: 2005
Comparison of SEM and HRTEM CD measurements extracted from test-structures having feature linewidths from 40 nm to 240 nm
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:M.W. Cresswell; B. Park; R.A. Allen; W.F. Guthrie; R.G. Dixson; W.M. Tan; C.E. Murabito
Year: 2005
Improved test structures for the electrical measurement of feature size on an alternating aperture phase-shifting mask
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:S. Smith; A.J. Walton; M. McCallum; A.C. Hourd; J.T.M. Stevenson; A.W.S. Ross
Year: 2005
90nm CMOS technology characterization at transfer and ramp
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:A. Kelleher; D. Gourley; A.M. Holmes; T. Hepburn; C. Farrell; R. Groves; T. Taskin; J. McMillan; W. Rawlins
Year: 2005
High speed test structures for in-line process monitoring and model calibration [CMOS applications]
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:M. Ketchen; M. Bhushan; D. Pearson
Year: 2005
A study of 90nm MOSFET subthreshold hump characteristics using newly developed MOSFET array test structure
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:A. Mizumura; T. Ohishi; N. Yokoyama; M. Nonaka; S. Tanaka; H. Ammo
Year: 2005
Impact of mask alignment on the tunneling field effect transistor (TFET)
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:T. Nirschl; U. Schaper; J. Einfeld; S. Henzler; M. Sterkel; J. Singer; M. Fulde; W. Hansch; G. Georgakos; D. Schmitt-Landsiedell
Year: 2005
A test structure for spatial analysis of hot-carrier-induced photoemission in n-MOSFET
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:T. Matsuda; T. Tanaka; H. Iwata; T. Ohzone; K. Yamashita; N. Koike; K. Tatsuuma
Year: 2005
A self heating test structure using poly resistors and P/sup +//N diodes to characterize anomalous charge transfers in embedded flash memories
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:P. Mora; P. Waltz; S. Renard; P. Candelier
Year: 2005
Test structure for performance evaluation of 3 dimensional FinFETs
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Young Joon Ahn; Hye Jin Cho; Hee Soo Kang; Choong-Ho Lee; Chul Lee; Jae-man Yoon; Tae Yong Kim; Eun Suk Cho; Suk-kang Sung; Donggun Park; Kinam Kim; Byung-Il Ryu
Year: 2005
A test structure to measure sheet resistances of highly-doped-drain and lightly-doped-drain in CMOSFET
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:T. Ohzone; K. Okada; T. Morishita; K. Komoku; T. Matsuda; H. Iwata
Year: 2005
An improved LDMOS transistor model that accurately predicts capacitance for all bias conditions
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:S.F. Frere; P. Moens; B. Desoete; Wojciechowski D; A.J. Walton
Year: 2005
Recent trends in reliability assessment of advanced CMOS technologies
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:G. Groeseneken; R. Degraeve; B. Kaczer; P. Roussel
Year: 2005
Assessment of a 90nm PMOS NBTI in the form of products failure rate
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:H. Masuda; D.G. Pierce; K. Nishitsuru; K. Machida
Year: 2005
Multi-purpose EM test structure with electrical verification of the failure spot demonstrated using SWEAT for fast wafer level reliability monitoring
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:A. Pietsch; A. Martin; J. Fazekas
Year: 2005
On-wafer radiation pattern measurements of integrated antennas on standard BiCMOS and glass processes for 40-80GHz applications
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:N. Segura; S. Montusclat; C. Person; S. Tedjini; D. Gloria
Year: 2005
Verification of layout efficient shield-based de-embedding techniques for on-wafer HBT characterisation up to 30 GHz
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:J.A. O'Sullivan; K.G. McCarthy; A.C. Murphy; P.J. Murphy
Year: 2005
Characterization and model of on-chip flicker noise with deep Nwell (DNW) isolation for 130nm and beyond SOC
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:M.T. Yang; D.C.W. Kuo; C.W. Kuo; Y.J. Wang; P.P.C. Ho; T.J. Yeh; S. Liu
Year: 2005
Speed - accuracy trade-off for measurement and characterization of the matching performance of SiGe:C HBTs, applied to a 200 GHz technology
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:L.J. Choi; R. Venegas; S. Decoutere
Year: 2005
Design and implementation of an ultra high precision parametric mismatch measurement system
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:T. Ewert; H. Tuinhoutt; N. Wils; J. Olsson
Year: 2005
Parameter variation on chip-level
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:U. Schaper; J. Einfeld; A. Sauerbrey
Year: 2005
A simple and accurate capacitance ratio measurement technique for integrated circuit capacitor arrays
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Zhenqiu Ning; L. De Schepper; H.-X. Delecourt; R. Gillon; M. Tack
Year: 2005
Physical meaning of /spl sigma/ value estimated with V/sub TH/-mismatch evaluation circuit
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:K. Terada; T. Yamauchi; A. Ueki
Year: 2005
A novel test fixture with enhanced signal port isolation capability for on-wafer microwave measurements
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:T. Kaija; E.O. Ristolainen
Year: 2005
Mismatch characterisation of chip interconnect resistance
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:J. Deveugele; Libin Yao; M. Steyaert; W. Sansen
Year: 2005
Novel realistic short structure construction for parasitic resistance de-embedding and on-wafer inductor characterization
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:J. Tao; P. Findley; G.A. Rezvani
Year: 2005
Experimental analysis of a Ge-HfO/sub 2/-TaN gate stack with a large amount of interface states
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:J.A. Croon; B. Kaczer; G.S. Lujan; S. Kubicek; G. Groeseneken; M. Meuris
Year: 2005
A new method for precise evaluation of dynamic recovery of negative bias temperature instability
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:S. Aota; S. Fujii; Z.W. Jin; Y. Ito; K. Utsumi; E. Morifuji; S. Yamada; F. Matsuoka; T. Noguchi
Year: 2005
RF monitoring test structures for advanced RF technologies working up to 100GHz with less than 80/spl mu/m width
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:A. Perrotin; D. Gloria
Year: 2005
Measurement of inner-chip variation and signal integrity by a 90-nm large-scale TEG [test element group]
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:M. Yamamoto; Y. Hayasi; H. Endo; H. Masuda
Year: 2005
A novel mobility-variation-free extraction technique of capacitance coupling coefficient for stacked flash memory cell
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:T. Okagaki; M. Tanizawa; M. Fujinaga; T. Kunikiyo; H. Yuki; K. Ishikawa; Y. Nishikawa; T. Eimori; M. Inuishi; Y. Oji
Year: 2005
EOT measurement for ultra-thin gate dielectrics using LC resonance circuit [MOS devices]
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:A. Teramoto; M. Komura; R. Kuroda; K. Watanabe; S. Sugawa; T. Ohmi
Year: 2005
Charge pumping at radio frequencies [MOSFET device interface state density measurement]
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:G.T. Sasse; H. de Vries; J. Schmitz
Year: 2005
A novel CBCM method free from charge injection induced errors: investigation into the impact of floating dummy-fills on interconnect capacitance
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Y.W. Chang; H.W. Chang; T.C. Lu; Y. King; W. Ting; J. Ku; C.Y. Lu
Year: 2005
Extraction of time dependent data from time domain reflection transmission line pulse measurements [ESD protection design]
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:R.A. Ashton
Year: 2005
A failure analysis test structure for deep sub-micron CMOS copper interconnect technologies
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:A. Cabrini; D. Cantarelli; P. Cappelletti; R. Casiraghi; D. Iezzi; A. Maurelli; M. Pasotti; P.L. Rolandi; G. Torelli
Year: 2005
Test chip for inductance characterization and modeling for sub-100nm X architecture and Manhattan chip design
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:N.D. Arora; Li Song; S. Shah; A. Sinha; V. Chang
Year: 2005
New applications of cross-talk-based capacitance measurements [CMOS ICs]
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:L. Vendrame; L. Bortesi; A. Bogliolo
Year: 2005
Portable X-ray fluorescence analyzer for the first level screening of materials for prohibited substances
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:S. Piorek
Year: 2005
Design for green electronics, a great potential is still ahead
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Li Ying; N. de Caluwe; Ab Stevels
Year: 2005
Implementing WEEE in Denmark - has extended producer responsibility been the outcome?
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:C.S. Braun; K.R. Dirckinck-Holmfeld
Year: 2005
Electromigration in Pb-free bumps with different UBM thickness
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Zhang Jinsong; Wu Yiping; Wu Fengshun; An Bing
Year: 2005
Mechanical design and optimization of flip chip bonder
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Zhou Chen; Yin Yuehong; Guo Xinming; Lin Zhongqin; Ding Han
Year: 2005
Mechanical properties of a lead-free solder alloys
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Fulong Zhu; Zhiyong Wang; Rongfeng Guan; Honghai Zhang
Year: 2005
Experimental and modeling analysis on moisture induced failures in flip-chip-on- flex interconnections with anisotropic conductive film
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:C.Y. Yin; H. Lu; C. Bailey; Y.C. Chan
Year: 2005
Mechanical shock modeling and testing of lead-free solder joint in hard disk drive head assembly
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Chen Hongtao; Wang Chunqing; Li Mingyua
Year: 2005
Effect of laser input energy on wetting areas of solder and formation of intermetallic compounds at Sn-3.5Ag-0.75Cu/Au right-angled joint interface
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Wei Liu; Chunqing Wang; Mingyu Li; Li Ling
Year: 2005
Interfacial characteristics of Sn3.5Ag solder on copper after Nd:YAG laser surface irradiation
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Lei Wang; Chun-qing Wang; Zhen-qing Zhao; Yi Huang
Year: 2005
On the ring isomorphism & automorphism problems
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:N. Kayal; N. Saxena
Year: 2005
The complexity of the inertia and some closure properties of GapL
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Thanh Minh Hoang; T. Thierauf
Year: 2005
The quantum adversary method and classical formula size lower bounds
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:S. Laplante; T. Lee; M. Szegedy
Year: 2005
More on noncommutative polynomial identity testing
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:A. Bogdanov; H. Wee
Year: 2005
Short PCPs verifiable in polylogarithmic time
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:E. Ben-Sasson; O. Goldreich; P. Harsha; M. Sudan; S. Vadhan
Year: 2005
Tolerant versus intolerant testing for Boolean properties
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:E. Fischer; L. Fortnow
Year: 2005
Pseudorandomness for approximate counting and sampling
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:R. Shaltiel; C. Umans
Year: 2005
A geometric approach to information-theoretic private information retrieval
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:D. Woodruff; S. Yekhanin
Year: 2005
On the hardness of distinguishing mixed-state quantum computations
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:B. Rosgen; J. Watrous
Year: 2005
Preface
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Year: 2005
An object detection system using image reconstruction with PCA
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:L. Malagon-Borja; O. Fuentes
Year: 2005
Patch-duplets for object recognition and pose estimation
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:B. Johansson; A. Moe
Year: 2005
Resampling 4D images using adaptive filtering
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:A. Andreopoulos; J.K. Tsotsos
Year: 2005
Modeling prior shape and appearance knowledge in watershed segmentation
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Xiaoxing Li; G. Hamarneh
Year: 2005
Identifying precursory cancer lesions using temporal texture analysis
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:A.B. Flores; L.A. Robles; R.M.M. Tepalt; J.D.C. Aragon
Year: 2005
Variational Principles for Diffusion Weighted MRI Restoration and Segmentation
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:B.C. Vemuri
Year: 2005
Segment-based hand pose estimation
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:C. Schwarz; N.V. Lobo
Year: 2005
A hierarchical nonparametric method for capturing nonrigid deformations
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:A. Ecker; S. Ullman
Year: 2005
Two-stage image segmentation by adaptive thresholding and gradient watershed
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Ming Hong Pi; Hong Zhang
Year: 2005
Detection of linear and cubic interpolation in JPEG compressed images
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:A.C. Gallagher
Year: 2005
Entropy-based image merging
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:A. German; M.R. Jenkin; Y. Lesperance
Year: 2005
An attentional framework for stereo vision
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:N.D.B. Bruce; J.K. Tsotsos
Year: 2005
New multi-baseline stereo by counting interest points
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:T. Sato; N. Yokoya
Year: 2005
Photometric stereo via locality sensitive high-dimension hashing
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Lin Zhong; J.J. Little
Year: 2005
Detection of occlusion edges from the derivatives of weather degraded images
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:D. Levesque; F. Deschenes
Year: 2005
Topology inference for a vision-based sensor network
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:D. Marinakis; G. Dudek
Year: 2005
3D SSD tracking with estimated 3D planes
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:D. Cobzas; P. Sturm
Year: 2005
Body tracking in human walk from monocular video sequences
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:F. Jean; R. Bergevin; A.B. Albu
Year: 2005
3D feature tracking using a dynamic structured light system
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:A. Adan; F. Molina; A.S. Vazquez; L. Morena
Year: 2005
PDE-based robust robotic navigation
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:M.S. Hassouna; A.E. Abdel-Hakim; A.A. Farag
Year: 2005
Singularity avoidance in uncalibrated visual servoing
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:M. Shahamiri; M. Jagersand
Year: 2005
Feature planning for robust execution of general robot tasks using visual servoing
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:M. Paulin
Year: 2005
Video with ground-truth for validation of visual registration, tracking and navigation algorithms
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:R. Stolkin; A. Greig; J. Gilby
Year: 2005
A monocular collision warning system
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:F. Woelk; S. Gehrig; R. Koch
Year: 2005
View matching with blob features
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:P.E. Forssen; A. Moe
Year: 2005
Collision and event detection using geometric features in spatio-temporal volumes
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:M.M. Bolduc; F. Deschenes
Year: 2005
A linear Euclidean distance transform algorithm based on the linear-time Legendre transform
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Y. Lucet
Year: 2005
People tracking using robust motion detection and estimation
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:M. Latzel; E. Darcourt; J.K. Tsotsos
Year: 2005
Automatic detection of heads in colored images
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:J. Garcia; N. da Vitoria Lobo; M. Shah; J. Feinstein
Year: 2005
Detecting abnormal gait
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:C. Bauckhage; J.K. Tsotsos; F.E. Bunn
Year: 2005
Face recognition with weighted locally linear embedding
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:N. Mekuz; C. Bauckhage; J.K. Tsotsos
Year: 2005
Real-time detection of faces in video streams
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:M. Castrillon-Santana; O. Deniz-Suarez; C. Guerra-Artal; M. Hernandez-Tejera
Year: 2005
Face exemplars selection from video streams for online learning
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:M. Castrillon-Santana; O. Deniz-Suarez; J. Lorenzo-Navarro; M. Hernandez-Tejera
Year: 2005
3D model-assisted face recognition in video
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Unsang Park; Hong Chen; A.K. Jain
Year: 2005
Video-based framework for face recognition in video
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:D.O. Gorodnichy
Year: 2005
Face as mouse through visual face tracking
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Jilin Tu; T. Huang; Hai Tao
Year: 2005
Multi-view head pose estimation using neural networks
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:M. Voit; K. Nickel; R. Stiefelhagen
Year: 2005
Head pose estimation of partially occluded faces
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:M.T. Wenzel; W.H. Schiffmann
Year: 2005
A computer vision system for monitoring medication intake
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:D. Batz; M. Batz; N. da Vitoria Lobo; M. Shah
Year: 2005
Automated behavioral phenotype detection and analysis using color-based motion tracking
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:A. Shimoide; I. Yoon; M. Fuse; H.C. Beale; R. Singh
Year: 2005
Average cell orientation, shape and size estimated from tissue images
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:P.J.W. Iles; D.A. Clausi; S.M. Puddister; G.W. Brodland
Year: 2005
A novel scheme for fingerprint identification
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Tsong-Liang Huang; Che-Wei Liu; Jui-Peng Lin; Chien-Ying Li; Ting-Yi Kuo
Year: 2005
Upper body pose estimation from stereo and hand-face tracking
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:J. Mulligan
Year: 2005
Comparing classification metrics for labeling segmented remote sensing images
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:P. Maillard; D.A. Clausi
Year: 2005
Segmentation of laparoscopic images: integrating graph-based segmentation and multistage region merging
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Yueyun Shu; G.-A. Bilodeau; F. Cheriet
Year: 2005
Segmentation and feature extraction to evaluate the stomach dynamic
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:M. Benjelloun
Year: 2005
On processing and registration of forward-scan acoustic video imagery
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:S. Negahdaripour; P. Firoozfam; P. Sabzmeydani
Year: 2005
Using vanishing points to correct camera rotation in images
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:A.C. Gallagher
Year: 2005
Iterative corner extraction and matching for mosaic construction
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:S. Alkaabi; F. Deravi
Year: 2005
Head tracking with shape modeling and detection
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Maolin Chen; Seokchedl Kee
Year: 2005
Registration uncertainty for robot self-localization in 3D
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Pifu Zhang; J. Gu; E.E. Milios
Year: 2005
Structure from motion using SIFT features and the PH transform with panoramic imagery
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:M. Fiala
Year: 2005
Dry granular flows need special tools
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:A. Biancardi; P. Ghilardi; M. Pagliardi
Year: 2005
Generalizing inverse perspective
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Mohamed Kotb; S. Beauchemin
Year: 2005
Recognition of partially occluded objects using perfect hashing: an efficient and robust approach
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:R. Dinesh; D.S. Guru
Year: 2005
Kinematic variables estimation using eye-in-hand robot camera system
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:S. Verma; I. Sharf; G. Dudek
Year: 2005
A new photo consistency test for voxel coloring
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Jianfeng Yin; J.R. Cooperstock
Year: 2005
An experimental comparison of a hierarchical range image segmentation algorithm
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:G. Osorio; P. Boulanger; P. Prieto
Year: 2005
Combining local and global features for image segmentation using iterative classification and region merging
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Qiyao Yu; D.A. Clausi
Year: 2005
Seeing the trees before the forest [natural object detection]
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:D.C. Asmar; J.S. Zelek; S.M. Abdallah
Year: 2005
Controlling camera and lights for intelligent image acquisition and merging
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:O. Borzenko; Y. Lesperance; M. Jenkin
Year: 2005
Belief in information flow
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:M.R. Clarkson; A.C. Myers; F.B. Schneider
Year: 2005
An encapsulated authentication logic for reasoning about key distribution protocols
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:I. Cervesato; C. Meadows; D. Pavlovic
Year: 2005
A cryptographically sound Dolev-Yao style security proof of an electronic payment system
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:M. Backes; M. Durmuth
Year: 2005
Temporal rank functions for forward secrecy
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:R. Delicata; S. Schneider
Year: 2005
Type annotations to improve stack-based access control
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Tian Zhao; J. Boyland
Year: 2005
Enforcing secure service composition
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:M. Bartoletti; P. Degano; G.L. Ferrari
Year: 2005
Dimensions and principles of declassification
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:A. Sabelfeld; D. Sands
Year: 2005


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