Surveying the E-Services technical landscape
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Kuno, H.
Year: 2000
Advanced dynamic property evaluation for CORBA-based electronic markets
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Schade, A.; Facciorusso, C.; Field, S.; Hoffner, Y.
Year: 2000
Information kiosk system by cooperation between agents and experts using situation adaptive scenarios
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Taniguchi, Y.; Hirotoshi, M.; Yajima, H.; Komoda, N.
Year: 2000
An open, flexible, and configurable system for service composition
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Casati, F.; Ilnicki, S.; Jin, L.-J.; Shan, M.-C.
Year: 2000
Failure analysis of an e-commerce protocol using model checking
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Ray, I.; Ray, I.
Year: 2000
Speeding up electronic commerce activities using CapBasED-AMS
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Kafeza, E.; Karlapalem, K.
Year: 2000
High accuracy machine automated assembly for opto electronics
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Lecarpentier, G.; Mottet, J.; Dumas, J.; Cooper, K.
Year: 2000
Automated fiber attachment for 980 nm pump modules
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Mueller, P.; Valk, B.
Year: 2000
Automation manufacturing systems technology for opto-electronic device packaging
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Soon Jang
Year: 2000
Automated mass production line for optical module using passive alignment technique
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Yamauchi, K.; Kurata, K.; Kurihara, M.; Sano, Y.; Sato, Y.
Year: 2000
An innovative flexible and accurate packaging technique suited to fabricate low cost micro optoelectronic modules
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Scussat, M.; Wursch, A.; Clavel, R.; Salathe, R.P.
Year: 2000
Investigation of under bump metallization systems for flip-chip assemblies
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Poi Siong Teo; Yu-Wen Huang; Chih Hang Tung; Marks, M.R.; Thiam Beng Lim
Year: 2000
Squeegee bump technology
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Jong-Kai Lin; Treliant Fang; Bajaj, R.
Year: 2000
Kinetics of C4 bump degradation in overly aggressive HTOL
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Master, R.N.; Blish, R.C.; Morken, D.; Adem, E.
Year: 2000
Comparison of electroplated eutectic Sn/Bi and Pb/Sn solder bumps on various UBM systems
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Se-Young Jang; Kyung Wook Paik
Year: 2000
Fab Integrated Packaging (FIP): a new concept for high reliability wafer-level chip size packaging
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Topper, M.; Auersperg, J.; Glaw, V.; Kaskoun, K.; Prack, E.; Keser, B.; Coskina, P.; Jager, D.; Fetter, D.; Ehrmann, O.; Samulewicz, K.; Meinherz, C.; Fehlberg, S.; Karduck, C.; Reichl, H.
Year: 2000
Low cost wafer-level CSP: a novel redistribution methodology
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Rinne, G.A.; Wallin, J.D.; Mis, J.D.
Year: 2000
Low temperature fluxless bonding technique using In-Sn composite
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Choe, S.; So, W.W.; Lee, C.C.
Year: 2000
Mounting of high power laser diodes on boron nitride heat sinks using an optimized Au/Sn metallurgy
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Pittroff, W.; Erbert, G.; Beister, G.; Bugge, F.; Klein, A.; Knauer, A.; Maege, J.; Ressel, P.; Sebastian, J.; Staske, R.; Traenkle, G.
Year: 2000
Screen printing, placement and joining technologies with lead-free joining materials
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Detert, M.; Herzog, T.; Wolter, K.-J.; Zerna, T.
Year: 2000
Lead-free flip chip process development
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Gafffney, K.; Poarch, J.; Delaney, D.
Year: 2000
Microstructural coarsening of lead free solder joints during thermal cycling
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Li-Lei Ye; Zonghe Lai; Liu, J.; Tholen, A.
Year: 2000
Interface microstructure and mechanical fatigue behavior of Sn/sub 63/Pb/sub 37/ on electroplated Cu and Ni
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Zhang, C.; Jian-Ku Shang; Pilin Liu
Year: 2000
Missing solder ball failure mechanisms in plastic ball grid array packages
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Zhong, C.H.; Yi, S.; Mui, Y.C.; Howe, C.P.; Olsen, D.; Chen, W.T.
Year: 2000
The influence of room temperature aging on ball shear strength and microstructure of area array solder balls
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Coyle, R.J.; Solan, P.P.; Serafino, A.J.; Gahr, S.A.
Year: 2000
Processability and reliability of commercial palladium plated structures
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Chan, K.C.; Chai, T.C.; Yang, Y.Z.; Gopalalaishan, R.
Year: 2000
Statistical analysis of embedded capacitors using Monte Carlo simulation
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Carastro, L.; Ilgu Yun; Poddar, R.; Brooke, M.; May, G.S.
Year: 2000
Packaging-compatible microtransformers on a silicon substrate
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Park, J.Y.; Hong, H.K.; Bu, J.U.
Year: 2000
Complex ultrasound emitter and micro-wave irradiator for inner-cavity action
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Belavskay, S.V.; Vityugov, V.A.; Adoniev, V.G.; Lisitsyna, I.I.
Year: 2000
An innovative micro optical element assembly robot characterized by high accuracy and flexibility
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Wursch, A.; Scussat, M.; Clavel, R.; Salathe, R.P.
Year: 2000
Analysis of alignment tolerant hybrid optoelectronic receivers for high density interconnection substrates
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Vrazel, M.; Chang, J.J.; Brooke, M.; Jokerst, N.M.; Youngjoong Joe; Carastro, L.; Dagnall, G.; Brown, A.
Year: 2000
Two-dimensional optical interconnect between CMOS IC's
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Vanwassenhove, L.; Baets, R.; Brunfaut, M.; Van Campenhout, J.; Hall, J.; Ebeling, K.; Melchior, H.; Neyer, A.; Thienpont, H.; Vounckx, R.; Van Koetsem, J.; Heremans, P.; Lentes, F.-T.; Litaize, D.
Year: 2000
Methods for passive fiber chip coupling of integrated optical devices
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Hauffe, R.; Siebel, U.; Petermann, K.; Moosburger, R.; Kropp, J.-R.; Arndt, F.
Year: 2000
Comparison of active and passive fiber alignment techniques for multimode laser pigtailing
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Karioja, P.; Ollila, J.; Putila, V.-P.; Keranen, K.; Hakkila, J.; Kopola, H.
Year: 2000
Electroless plating of optical fibers for hermetic feedthrough seals
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Watson, J.E.; Shreve, G.A.; Miller, M.N.; Stevens, D.; Sykora, C.; LaBella, D.; Ostby, K.; Smith, W.K.
Year: 2000
Bandwidth prediction for high-performance interconnections
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Deutsch, A.; Kopcsay, G.V.; Coteus, P.W.; Surovic, C.W.; Dahlenz, P.; Heckmann, D.L.; Duan, D.W.
Year: 2000
Bridging the gap: package level and system level thermal modeling
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Wang, W.; Liou, S.; Sun, Y.S.; Lai, J.Y.; Tien, C.; Her, T.D.; Michael, M.
Year: 2000
Evaluating underfill materials for high reliability applications
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Goodelle, J.P.; Gilbert, J.J.; Fanucci, R.E.
Year: 2000
Adhesion characterization of no-flow underfills used in flip chip assemblies and correlation with reliability
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Jicun Lu; Smith, B.; Baldwin, D.F.
Year: 2000
Study of a new structured leadframe based CSP, Mini-LOC
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Jui-Meng Jao; Tzong Dar Her; Chien Ping Huang; Ko, E.; Calub, G.; Lo, R.H.Y.
Year: 2000
Chip-scale packaging of power devices and its application in integrated power electronics modules
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Xingsheng Liu; Xiukuan Jing; Guo-Quan Lu
Year: 2000
Development of flex stackable carriers
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Isaak, H.; Uka, P.
Year: 2000
CSP assembly reliability and effects of underfill and double-sided population
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Ghaffarian, R.
Year: 2000
Interfacial degradation of epoxy-coated silicon nitride
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Jongwoo Park; Harlow, D.G.
Year: 2000
Characterization of interfaces involving electrically conductive adhesives using electron-beam moire and infrared microscopy
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Slifka, A.J.; Drexler, E.S.
Year: 2000
A novel method and device for solder joint quality inspection by using laser ultrasound
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Sheng Liu; Erdahl, D.; Ume, C.; Achari, A.
Year: 2000
Wire pull on fine pitch pads: an obsolete test for first bond integrity
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Sundararaman, V.; Edwards, D.R.; Subido, W.E.; Test, H.R.
Year: 2000
Non-invasive optical assessment of packaging-induced defects in high-power laser diodes
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Barwolff, A.; Tomm, J.W.
Year: 2000
A new method to interconnect PCB layers in GHz frequency range
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Kiani, S.; Khusid, M.
Year: 2000
Electrical performance improvements on RFICs using bump chip carrier packages as compared to standard small outline packages
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Horng, T.S.; Wu, S.M.; Li, J.Y.; Chiu, C.T.; Hung, C.P.
Year: 2000
A technique for the characterization of multi-terminal capacitors for high frequency applications
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Figueroa, D.G.; Li, Y.L.
Year: 2000
RF electrical measurements of fine pitch BGA packages
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Caggiano, M.F.; Bulumulla, S.; Lischner, D.
Year: 2000
High frequency performance of integral capacitors in cofired ceramic substrates
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Taguchi, Y.; Itagaki, M.; Inoue, O.; Kato, J.; Eda, K.
Year: 2000
Accurate measurement and characterization up to 50 GHz of CPW-based integrated passives in microwave MCM-D
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Carchon, G.; Brebels, S.; De Raedt, W.; Neuwelaers, B.
Year: 2000
High speed, high performance laser module
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Benzoni, A.; Downie, M.; Kasper, B.; Paslaski, J.; Peral, E.; Xin Mei Wu; Schrans, T.; Swass, M.; Tsai, C.; Ury, I.
Year: 2000
High speed packaged electroabsorption modulators for optical communications
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Bond, A.E.; Shtengel, G.; Singh, P.; Akulova, Y.; Reynolds, C.L., Jr.
Year: 2000
Packaging technology for 40-Gb/s optical receiver module with an MU-connector interface
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Iwasaki, N.; Yanagibashi, M.; Tsunetsugu, H.; Kato, K.; Ishitsuka, F.; Hosoya, M.; Kikuchi, H.
Year: 2000
Module packaging for high-speed serial and parallel transmission
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Karstensen, H.; Auracher, F.; Ebel, N.; Fiedler, J.; Plickert, V.; Melchior, L.; Leininger, L.; Bittner, M.; Festag, M.; Wicke, M.; Meyer, S.; Miller, R.; Kuhn, G.; Althaus, H.-L.; Ebberg, A.
Year: 2000
Physical layer strategies for 10 gigabit Ethernet
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Penty, R.V.; Webster, M.; Massara, A.B.; White, I.H.
Year: 2000
800 Mbit/s/ch/spl times/12 ch, true DC-coupled parallel optical interconnects using single-mode fiber and 1310 nm LD array
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Takai, A.; Furuichi, H.; Miura, A.; Tonehira, K.; Kawamoto, K.; Ueno, S.; Fukashiro, Y.; Haga, T.; Toyonaka, T.; Yamada, K.; Suejima, T.; Saitoh, K.
Year: 2000
Rules for robust generation of accurate reduced-order models of high-speed coupled interconnections
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Cangellaris, A.C.; Igarashi, M.
Year: 2000
Network analyzer calibration methods for high-density packaging characterization and validation of simulation models
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Hammond, C.L.; Virga, K.L.
Year: 2000
A measurement and simulation study of transmission lines on microstrip and stacked-pair structure for high speed signals
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Odate, Y.; Usami, T.; Otsuka, K.; Suga, T.
Year: 2000
Hybrid assembly technology for flip-chip-on-chip (FCOC) using PBGA laminate assembly
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Dufresne, J.; Ouimet, S.; Homa, T.R.
Year: 2000
Manufacturing productivity improvements for PBGA and flip chip substrates in PWB factory
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Chrzanowski, D.E.; Stanke, D.A.; Lapcevich, R.A.
Year: 2000
The other side of UV:YAG laser in printed circuit board fabrication, some experiments and experiences, not always microvia related
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Kohler, R.; Kaminski, J.
Year: 2000
Endoscopic inspection of solder joint integrity in chip scale packages
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Chan, Y.C.; Tang, C.W.; Tu, P.L.
Year: 2000
Interface adhesion between copper lead frame and epoxy moulding compound: effects of surface finish, oxidation and dimples
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Jang-Kyo Kim; Lebbaj, M.; Liu, J.H.; Ji Hoon Kim; Yuen, M.M.F.
Year: 2000
Conduction development in electrically conductive adhesives with a bimodal size distributed conducting and inert particles: effect of polydispersity
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Mikrajuddin; Shi, F.G.; Okuyama, K.; Kim, H.K.
Year: 2000
Experimental and numerical reliability investigations of FCOB assemblies with process-induced defects
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Schubert, A.; Dudek, R.; Kloeser, J.; Michel, B.; Reichl, H.; Hauck, T.; Kaskoun, K.
Year: 2000
Assessment of flip chip interconnect integrity using scanning acoustic microscopy
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Wolf, R.K.; Hooghan, T.K.; Bachman, M.A.; Weachock, R.J.
Year: 2000
Flip chip assembly utilizing anisotropic conductive films: a feasibility study
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Delaney, D.; White, J.
Year: 2000
Prediction of fatigue crack initiation between underfill epoxy and substrate
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Wu, D.; Su, B.; Lee, Y.C.; Dunn, M.L.
Year: 2000
Thermally induced deformations in a flip-chip HDI substrate
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Drexler, E.S.
Year: 2000
Effect of circuit board flexure on flip chips before underfill
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Chengalva, M.K.; Jeter, N.; Baxter, S.C.
Year: 2000
Challenges in interconnection and packaging of microelectromechanical systems (MEMS)
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Ramesham, R.; Ghaffarian, R.
Year: 2000
MEMS sensor multi-chip module assembly with TAB carrier pressure belt for aircraft flight testing
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Kim, N.P.; Holland, M.J.; Tanielian, M.H.; Poff, R.
Year: 2000
Gold-aluminum wirebond interface testing using laser-induced ultrasonic energy
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Romenesko, B.M.; Charles, H.K., Jr.; Cristion, J.A.; Siu, B.K.
Year: 2000
Single mode fiber MT-RJ SFF transceiver module using optical sub assembly with a new shielded silicon optical bench
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Iwase, M.; Nomura, T.; Izawa, A.; Mori, H.; Tamura, S.; Shirai, T.; Kamiya, T.
Year: 2000
A novel low-cost small-form-factor transceiver module
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Hogan, W.K.; Gaio, D.P.; Cohen, M.S.; Trewhella, J.M.
Year: 2000
Lens-less semiconductor optical amplifier (SOA) modules using laser welding techniques
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Park, M.W.; Kim, J.R.; Park, S.; Lee, J.S.; Kim, H.I.; Choo, A.G.; Kim, T.I.
Year: 2000
Low-cost laser modules for SMT
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Rehm, W.; Adam, K.; Goth, A.; Jorg, W.; Lauckner, J.; Scherb, J.; Aribaud, P.; Artigue, C.; Duchemin, C.; Fernier, B.; Grard, E.; Keller, D.; Kerboeuf, S.; Rabaron, S.; Rainsant, J.M.; Tregoat, D.; Nicque, J.L.; Tournereau, A.; Laroulandie, P.J.; Berthier, P.
Year: 2000
Low cost packaging techniques for active waveguide devices
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Shaw, M.; Marazzi, M.; Bonino, S.
Year: 2000
Electro-optical printed circuit board (EOPCB)
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Schmieder, K.; Wolter, K.-J.
Year: 2000
Noise verification across 3 levels of packaging hierarchy for the IBM G5/G6 mainframes
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Smith, H.; Kuppinger, S.; Venkatachalam, P.; Becker, W.
Year: 2000
Direct generation of Spice compatible passive reduced order models of ground/power planes
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Myoung Joon Choi; Kyu-Pyung Hwang; Cangellaris, N.
Year: 2000
US initiatives and worldwide markets for Die Products
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Bridges, S.; Gilg, L.
Year: 2000
An overview of MCM/KGD development activities in Japan
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Sudo, T.
Year: 2000
Chip scale package versus direct chip attach (CSP vs. DCA)
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Arnold, R.
Year: 2000
Under bump metallurgies for a wafer level CSP with eutectic Pb-Sn solder ball
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Soon-Jin Cho; Ji-Yon Kim; Myung-Geun Park; Ik-Sung Park; Heung-Sup Chun
Year: 2000
Investigation of high reliability micro bump plating technique on tape carrier
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Chinda, A.; Matsuura, A.; Yoshioka, O.; Mita, M.
Year: 2000
A barrier metallization technique on copper substrates for soldering applications
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:So, W.W.; Choe, S.; Chuang, R.; Lee, C.C.
Year: 2000
Assessment on the effects of electroless nickel plating on the reliability of solder ball attachment to the bond pads of PBGA substrate
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Shi-Wei Ricky Lee; Chien Chun Yan; Karim, Z.; Xingjia Huang
Year: 2000
Fabrication and adhesion of low stress electroless Ni-Cu-P bump on copper pad
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Chun-Jen Chen; Kwang-Lung Lin
Year: 2000
Electrical characteristics of an ACF bond as a function of temperature and humidity aging
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Weidler, J.D.; Burg, R.D.; Decker, J.J.; Constable, J.H.
Year: 2000
Laser programmable multichip module using vertical make-link
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Joo-Han Lee; Gao Zhuo; Bernstein, J.B.
Year: 2000
MOSFET BGA package
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Joshi, R.; Granada, H.; Tangpuz, C.
Year: 2000
Over-coated flip-chip fine package development for MCM fabricated with Si IC and GaAs MMIC
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Kurata, H.; Ogata, T.; Mitsuka, K.; Matsushita, H.
Year: 2000
Highly accelerated life testing for non-hermetic laser modules
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Theis, C.D.; Siconolfi, D.J.; Comizzoli, R.B.; Kiely, P.A.; Wu, P.; Chakrabarti, U.K.; Osenbach, J.W.
Year: 2000
Self-organizing waveguide coupling method "SOLNET" and its application to film optical circuit substrates
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Yoshimura, T.; Roman, J.; Takahashi, Y.; Wang, W.-C.V.; Inao, M.; Ishitsuka, T.; Tsukamoto, K.; Aoki, S.; Motoyoshi, K.; Sotoyama, W.
Year: 2000
New technology for electrical/optical systems on module and board level: the EOCB approach
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Krabe, D.; Ebling, F.; Arndt-Staufenbiel, N.; Lang, G.; Scheel, W.
Year: 2000
Epoxy adhesives for optical element attachment in planar passive optical components
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Liu, J.G.; Andersen, B.M.; Bergmann, E.E.; Fairchild, S.K.
Year: 2000
Experimental and numerical studies in the evaluation of epoxy-cured fiber optic connectors
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Broadwater, K.; Mead, P.F.
Year: 2000
The corrosion behavior of BK-7 glasses for use in non-hermetic electro-optic devices
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Theis, C.D.; Fleming, D.A.; Osenbach, J.W.
Year: 2000
Modeling alignment shift of soldered optical fiber
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Powell, A.
Year: 2000
The first entrepreneurial and practice-oriented masters program in microelectronics systems packaging
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Conrad, L.; Tummala, R.; May, G.
Year: 2000
Networking the electronics packaging education
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Illyefalvi-Vitez, Z.; Golonka, L.; Mach, P.; Nicolics, J.; Svasta, P.
Year: 2000
New course development in electronic products and systems cost analysis
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Sandborn, P.; Allen, D.T.; Murphy, C.F.
Year: 2000
Mixed signal system design course development
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Tenhunen, H.
Year: 2000
Sensors' education and related student research projects
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Harsanyi, G.; Lepsenyi, I.
Year: 2000
FEA simulation on moisture absorption in PBGA packages under various moisture pre-conditioning
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Lam Tim Fai
Year: 2000
Interfacial adhesion study for low-k interconnects in flip-chip packages
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Miller, M.R.; Ho, P.S.
Year: 2000
Eutectic Sn-Ag solder bump process for ULSI flip chip technology
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Ezawa, H.; Miyata, M.; Honma, S.; Inoue, H.; Tokuoka, T.; Yoshioka, J.; Tsujimura, M.
Year: 2000
Bump height effect on the reliability and on the strains variations of ACA flip-chip joints
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Pinardi, K.; Lai, Z.; Yi Lan Kang; Liu, J.; Liu, S.; Haug, R.
Year: 2000
The viability of anisotropic conductive film (ACF) as a flip chip interconnection technology
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Kim, K.M.; Kim, J.O.; Kim, S.G.; Lee, K.H.; Chen, A.S.; Ahmad, N.; Dugbartey, N.; Karnezos, M.; Tam, S.; Kweon, Y.D.; Pendse, R.
Year: 2000
Comparison of flip chip technologies on rigid polyimide with respect to reliability and manufacturing costs
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Miessner, R.; Aschenbrenner, R.; Reichi, H.; Ling, S.; Binh Le; Lew, A.; Benson, R.; Nhan, E.
Year: 2000
Development of a wafer-level burn-in test socket for fine-pitch BGA interconnect
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Qiao, Q.; Gordon, M.H.; Schmidt, W.F.; Li, L.; Ang, S.S.; Huang, B.
Year: 2000
Highly reliable probe card for wafer testing
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Maekawa, S.; Takemoto, M.; Kashiba, Y.; Deguchi, Y.; Miki, K.; Nagata, T.
Year: 2000
The effect of sliding wear on lubricated tin-lead contacts
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Aukland, N.; Hardee, H.
Year: 2000
New CBGA package with improved 2/sup nd/ level reliability
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Pendse, R.; Afshari, B.; Butel, N.; Leibovitz, J.; Hosoi, Y.; Shimada, M.; Maeda, K.; Maeda, M.; Yonekura, H.
Year: 2000
Assembly and solder joint reliability of plastic ball grid array with lead-free versus lead-tin interconnect
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Levis, K.-M.; Mawer, A.
Year: 2000
Effect of package design and layout on BGA solder joint reliability of an organic C4 package
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Chandran, B.; Goyal, D.; Thomas, J.
Year: 2000
Reliability of flip chip BGA package on organic substrate
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Eun-Chul Ahn; Tae-Je Cho; Jong-Bo Shin; Ho-Joong Moon; Ju-Hyun Lyu; Ki-Won Choi; Sa-Yoon Kang; Se-Yong Oh
Year: 2000
Current progress of advanced high speed parallel optical links for computer clusters and switching systems
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Drogemuller, K.; Kuhl, D.; Blank, J.; Ehlert, M.; Kracker, T.; Hohn, J.; Klix, D.; Plickert, V.; Melchior, L.; Schmale, I.; Hildebrandt, P.; Heinemann, M.; Schiefelbein, F.P.; Leininger, L.; Wolf, H.-D.; Wipiejewski, T.; Ebberg, A.
Year: 2000
Fabrication of a 2D connector for coupling a 4/spl times/8 array of small diameter plastic optical fiber (117/125 /spl mu/m) to RCLED or VCSEL arrays
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Coosemaus, T.; Van Hove, A.; Naessens, K.; Vanwassenhove, L.; Van Daele, P.; Baets, R.
Year: 2000
High performance selectively oxidized VCSELs and arrays for parallel high-speed optical interconnects
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Mederer, F.; Grabherr, M.; Eberhard, F.; Ecker, I.; Jager, R.; Joos, J.; Jung, C.; Kicherer, M.; King, R.; Schnitzer, P.; Unold, H.; Wiedenmann, D.; Ebeling, K.J.
Year: 2000
ParaBIT-1: 60-Gb/s-throughput parallel optical interconnect module
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Usui, M.; Sato, N.; Ohki, A.; Matsuura, N.; Tanaka, N.; Enbutsu, K.; Amano, M.; Hikita, M.; Kagawa, T.; Katsura, K.; Ando, Y.
Year: 2000
Packaging aspects of the Litebus/sup TM/ parallel optoelectronic module
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Freitag, L.; Kuczynski, J.; Fortier, P.; Guindon, F.; Letourneau, M.; Chan, B.; Sherman, J.; Johnson, G.; Demangone, D.; Mentzer, M.; Naghski, D.; Trostle, B.
Year: 2000
Realisation of a phased-array multi-wavelength laser using hybridly integrated PICs
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Van Thourhout, D.; Van Hove, A.; Van Caenegem, T.; Vandeputte, K.; Vandaele, P.; Moerman, I.; Leijtens, X.; Smit, M.K.; Baets, R.
Year: 2000
System level packaging of high density optoelectronic interconnections
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Nyquist, J.S.; Sherman, C.J.; Grimes, G.J.
Year: 2000
Distance learning in thermal design of electronic systems - the IEEE/NSF project
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Joshi, Y.; Sircar, J.K.; Bar-Cohen, A.; Bhavnani, S.; Barnes, J.
Year: 2000
Progress in electronics packaging virtual laboratory development
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Gordon, P.; Bojta, P.; Hertel, L.; Kallai, I.; Lepsenyi, I.; Varnai, L.; Illyefalvi-Fitez, Z.
Year: 2000
The virtual packaging laboratory
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Light, L.; May, G.S.
Year: 2000
Recent experiences on developing multimedia educational modules
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Kim, B.C.
Year: 2000
An analysis of interface delamination in flip-chip packages
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Mercado, L.L.; Sarihan, V.; Hauck, T.
Year: 2000
Numerical and experimental investigations of large IC flip chip attach
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Schubert, A.; Dudek, R.; Leutenbauer, R.; Coskina, P.; Becker, K.-F.; Kloeser, J.; Michel, B.; Reichl, H.; Baldwin, D.; Qu, J.; Sitaraman, S.; Wong, C.P.; Tummala, R.
Year: 2000
Vibration fatigue of /spl mu/BGA solder joint
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Tu, P.L.; Chan, Y.C.; Tang, C.W.; Lai, J.K.L.
Year: 2000
Reliability characterization in Ultra CSP/sup TM/ package development
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Yang, H.; Elenius, P.; Barrett, S.; Schneider, C.; Leal, J.; Moraca, R.; Moody, R.; Young-Do Kweon; Deok Hoon Kim; Patterson, D.; Goodman, T.
Year: 2000
New evaluation method of CSPs board level reliability using strain gauge
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Yamaji, Y.; Suzuki, T.; Yamasaki, H.; Ohishi, T.; Chikawa, Y.; Kako, N.
Year: 2000
Lead free solder paste flux evaluation and implementation in personal communication devices
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Butterfield, A.; Visintainer, V.; Goudarzi, V.
Year: 2000
Extensive fatigue investigation of solder joints in IGBT high power modules
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Thebaud, J.-M.; Woirgard, E.; Zardini, C.; Sommer, K.-H.
Year: 2000
Characterization of the melting and wetting of Sn-Ag-X solders
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Bradley, E., III; Hramisavljevic, J.
Year: 2000
Chip scale polymer stud grid array packaging and reliability based on low cost flip chip processing
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Paydenkar, C.S.; Baldwin, D.F.; Sitaraman, S.; Wong, C.P.; Lewis, B.J.
Year: 2000
Single level integrated packaging modules for high performance electronic systems
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Li-Rong Zheng; Tenhunen, H.
Year: 2000
Development of Chip-on-Dot flip chip technique utilizing Gold Dot/sup TM/ flexible circuitry
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Wang, Z.P.; Tan, Y.M.; Schreiber, C.M.; Tsui, C.C.; Shi, Z.F.; Wei, J.
Year: 2000
Metallization for direct solder interconnection of power devices
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Haque, S.; Guo-Quan Lu
Year: 2000
Packaging single fiber probe based reflective sensors
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Ghosh, A.K.; Asundi, A.K.
Year: 2000
Fabrication of silicon-on-reflector for Si-based resonant-cavity-enhanced photodetectors
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Cheng Li; Qinqing Yang; Haiyan Ou; Qiming Wang
Year: 2000
Alignment considerations in packaging array-based optical interconnects and processors
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Ghosh, A.K.
Year: 2000
The effect of temperature cycling on fiber-solder-ferrule joints in laser module packaging
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Cheng, W.H.; Sheen, M.T.; Kuang, J.H.; Chen, J.C.; Wang, G.L.; Wang, S.C.; Chang, H.L.; Wang, C.; Wang, C.M.
Year: 2000
Advances in multi-channel optical multi-gbytes/sec bit-parallel WDM single fiber link
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Bergman, L.A.; Yeh, C.; Morookian, J.
Year: 2000
A dry silver electromigration process to fabricate optical waveguides on glass substrates
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Chuang, R.W.; Lee, C.C.
Year: 2000
Time-dependent material modeling for finite element analyses of flip chips
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Feustel, F.; Wiese, S.; Meusel, E.
Year: 2000
Design of distributed elements in Ku-band in coplanar-waveguide based MCM-D
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Carchon, G.; Brebels, S.; De Raedt, W.; Nauwelaers, B.
Year: 2000
Novel, high density R/C terminating networks
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Schaper, L.; Ulrich, R.; Gross, C.; Parkerson, P.
Year: 2000
Integral thin film capacitors: Fabrication and integration issues
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Ramesh, S.; Shutzberg, B.A.; Giannelis, E.P.
Year: 2000
Discretely tunable multi cavity FFP filter for standard WDM frequency grid
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Lamperski, J.
Year: 2000
Qualification and reliability tests: What are we doing and why?
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Munroe, R.A.
Year: 2000
Characterization of low alpha emissivity system on electroplated solder bumps
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Mistry, A.; Lee, S.; Enman, C.; Carroll, B.; Mitchell, D.; Mathew, V.; Weeks, D.; Tucker, M.
Year: 2000
Evaluation of quality of silicon/copper interfaces in IC packaging
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Abdul, J.; Wang, Y.; Guo, N.; Rehman, A.; Chan, K.C.
Year: 2000
Warpage studies of HDI test vehicles during various thermal profiling
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Petriccione, G.J.; Ume, I.C.
Year: 2000
Special characteristic of future flip chip underfill materials and the process
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Usui, H.; Mizutani, M.; Noro, H.; Kuwamura, M.; Kuroyanagi, A.; Ito, H.; Harada, T.; Ito, S.
Year: 2000
Realization of hybrid microfluidic systems using standard LTCC process
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Rebenklau, L.; Wolter, K.-J.; Howitz, S.
Year: 2000
Improved bonding pad design for fluxless flip chip bonding process and low fracture strength substrates
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Bonda, R.; Guo, Y.; Stafford, J.; Swan, G.
Year: 2000
A reliability and failure mode analysis of no flow underfill materials for low cost flip chip assembly
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Smith, B.S.; Thorpe, R.; Baldwin, D.F.
Year: 2000
An optical clock distribution network for gigascale integration
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Mule, A.V.; Schultz, S.M.; Gaylord, T.K.; Meindl, J.D.
Year: 2000
Estimation of the signal-to-noise ratio for on-chip wireless clock signal distribution (year 2000)
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Bravo, D.; Hyun Yoon; Kihong Kim; Floyd, B.; O, K.K.
Year: 2000
New interconnect structure design methodology by Layout-design-based Interconnect Structure Optimization System (LADINOS)
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Kobayashi, S.; Edahiro, M.; Hayashi, Y.
Year: 2000
Comparison of key performance metrics in two- and three-dimensional integrated circuits
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Rahman, A.; Fan, A.; Reif, R.
Year: 2000
Comparative analysis of metal and optical interconnect technology
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Jiang, D.; Bhuva, B.L.; Kerns, D.V., Jr.; Kerns, S.E.
Year: 2000
Multilevel test structures for metal CMP integration application to Cu/SiO/sub 2/ damascene interconnect
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Fayolle, M.; Gayet, P.; Morand, Y.
Year: 2000
A grain size limitation inherent to electroplated copper films
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Brongersma, S.H.; Richard, E.; Vervoort, I.; Maex, K.
Year: 2000
Trench and via filling profile simulations for copper electroplating process
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Kobayashi, K.; Sano, A.; Akahoshi, H.; Itabashi, T.; Haba, T.; Fukada, S.; Miyazaki, H.
Year: 2000
A new hollow-cathode magnetron source for 0.10 /spl mu/m copper applications
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Ashtiani, K.A.; Klawuhn, E.; Hayden, D.; Ow, M.; Levy, K.B.; Danek, M.
Year: 2000
Development of TiSiN diffusion barriers for Cu/SiLK metallization schemes
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Sankaran, S.; Harris, W.; Nuesca, G.; Shaffer, E.O.; Hiartin, S.J.; Geer, R.E.
Year: 2000
An evaluation of the HotOzone/sup TM/ process: a new post etch resist and residue removal process
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Shawming Ma; Parker, R.; Kavari, R.; Leal, I.; Boyers, D.G.; Cremer, J.T., Jr.
Year: 2000
Physical modeling of rinsing and cleaning of submicron trenches
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Hong Lin; Busnaina, A.A.; Suni, I.I.
Year: 2000
The characterization of trimethylsilane based PE-CVD /spl alpha/-SiCO:H low-k films
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Wang, B.K.; Loboda, M.J.; Cerny, G.A.; Schneider, R.F.; Seifferly, J.A.; Washer, T.
Year: 2000
Effect of fluorinated plasma on SiLK during mineral hard masks etching
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Maisonobe, J.C.; Ermolieff, A.; Holliger, P.; Laugier, F.; Passemard, G.
Year: 2000
Preliminary study on dependency of basic properties of porous silica ILD thin film on CMP compatibility
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Hanahata, H.; Miyamoto, M.; Kamata, T.; Matsuno, S.; Tanabe, T.
Year: 2000
Irregular growth of PECVD-Ti silicide film on doped Si substrates
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Kaori Tai; Yusuke Harada; Muneyuki Matsumoto; Hisanori Oki
Year: 2000
New method to study unlanded via architecture. Application to advanced interconnects: Al with low k and copper dual damascene
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Gayet, P.; Lair, C.; van den Vegt, E.
Year: 2000
Integration of low-k spin-on polymer and Cu for Damascene
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Chang, W.; Chiou, W.C.; Li, L.J.; Chao, L.C.; Jang, S.M.; Yu, C.H.; Liang, M.S.
Year: 2000
Lithography as a critical step for low-k dual damascene: from 248 nm to 193 nm
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Ronse, K.; Maenhoudt, M.; Pollentier, I.; Wiaux, V.; Struyf, H.; Lepage, M.; Vanhaelemeersch, S.
Year: 2000
Physical and electrical characterization of silsesquioxane-based ultra-low k dielectric films
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Donaton, R.A.; Iacopi, F.; Baklanov, R.; Shamiryan, D.; Coenegrachts, B.; Struyf, H.; Lepage, M.; Meuris, M.; van Hove, M.; Gray, W.D.; Meynen, H.; de Roest, D.; Vanhaelemeersch, S.; Maex, K.
Year: 2000
Nanoscale elastic imaging: a new metrology tool for low-k dielectric integration
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Shekhawat, G.S.; Kolosov, O.V.; Briggs, G.A.D.; Shaffer, E.O.; Martin, S.J.; Geer, R.E.
Year: 2000
Characterization and integration of porous extra low-k (XLK) dielectrics
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Changming Jin; Wetzel, J.
Year: 2000
Cu dual damascene process for 0.13 um technology generation using self ion sputtering (SIS) with ion reflector
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Wada, J.; Sakata, A.; Matsuyama, H.; Watanabe, K.; Katata, T.
Year: 2000
Correlation of stress and texture evolution during self- and thermal annealing of electroplated Cu films
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Haebum Lee; Lopatin, S.D.; Wong, S.S.
Year: 2000
A thick-Cu process for add-on interconnections using photosensitive varnish for thick interlayer dielectric
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Saito, K.; Kosugi, T.; Yagi, S.; Yamaguchi, C.; Kudo, K.; Yano, M.; Kumazaki, T.; Yaita, M.; Ishii, H.; Machida, K.; Kyuragi, H.
Year: 2000
Effect of W-plug via on electromigration lifetime of metal interconnect
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Guo, Q.; Lo, K.F.; Manna, I.; Lim, S.; Zeng, X.; Cai, J.
Year: 2000
Low-frequency noise measurement of copper damascene interconnects
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Koh, L.T.; Chu, L.W.; Pey, K.L.; Chim, W.K.
Year: 2000
0.42 /spl mu/m contacted pitch dual damascene copper interconnect for 0.15 /spl mu/m EDRAM using tapered via aligned to trench
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Hattori, T.; Masuda, H.; Sato, H.; Matsuda, T.; Yamamoto, A.; Kato, Y.; Ogawa, S.; Ohsaki, A.; Ueda, T.
Year: 2000
Tungsten via poisoning caused by water trapped in embedded organic low-K dielectrics
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Ikeda, K.; Hasegawa, T.; Tokunaga, K.; Fukasawa, M.; Kito, H.; Miyamoto, T.; Kadomura, S.
Year: 2000
Ultra-low dielectric constant low density material (k=2.2) for Cu damascene
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Cheng, Y.Y.; Chao, L.C.; Jang, S.M.; Yu, C.H.; Liang, M.S.
Year: 2000
The effects of substrate resistivity on RF component and circuit performance
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Floyd, B.A.; Chih-Ming Hung; O, K.K.
Year: 2000
Thickness measurement for Cu and Ta thin films using optoacoustics
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Gostein, M.; Bailey, T.C.; Emesh, I.; Diebold, A.C.; Maznev, A.A.; Banet, M.; Joffe, M.; Sacco, R.
Year: 2000
Picosecond ultrasonic study of the electrical and mechanical properties of CoSi/sub 2/ formed under Ti and TiN cap layers
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Stoner, R.; Tas, G.; Morath, C.; Maris, H.; Lee-Jen Chen; Haw-Feng Chuang; Chi-Tung Huang; Yaw-Lin Hwang
Year: 2000
Film properties and surface profile after gap fill of electrochemically deposited Cu films by DC and pulse reverse processes
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Hsieh, C.H.; Chou, S.W.; Shue, S.L.; Yu, C.H.; Liang, M.S.
Year: 2000
CVD copper thin film deposition by using (1-pentene)Cu(I)(hfac)
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Zhuang, W.W.; Charneski, L.J.; Evans, D.R.; Sheng Teng Hsu
Year: 2000
Novel post electroplating in-situ rapid annealing process for advanced copper interconnect application
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Chen, M.; Ho Seon Shin; Cheung, R.; Morad, R.; Dordi, Y.; Rengarajan, S.; Tsai, S.
Year: 2000
Quantitative analysis on Cu diffusion through TaN barrier metal and the device degradation by using two-level Cu-interconnects implemented 0.25 /spl mu/m-256 Mbit DRAMs
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Kawanoue, T.; Iijima, T.; Matsuda, T.; Yamada, Y.; Morikado, M.; Sugimae, K.; Kajiyama, T.; Maekawa, H.; Hamamoto, T.; Kumagai, J.; Kaneko, H.; Hayasaka, N.
Year: 2000
Electromigration in multi-level interconnects with polymeric low-k interlevel dielectrics
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Justison, P.; Ogawa, E.; Gall, M.; Capasso, C.; Jawarani, D.; Wetzel, J.; Kawasaki, H.; Ho, P.S.
Year: 2000
The effect of residual tensile stress on electromigration lifetime of metal lines passivated by various oxides
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Young-Pil Kim; Dong-Chul Kwon; Han-Mei Choi; Young-Wook Park; Sang-In Lee
Year: 2000
A copper drift-model for the low-/spl kappa/ polymer DVS-BCB
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Hoernig, T.; Melzer, K.; Schubert, U.; Geisler, H.; Barthar, J.W.
Year: 2000
Integration of copper and fluorosilicate glass for 0.18 /spl mu/m interconnections
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Barth, E.P.; Ivers, T.H.; McLaughlin, P.S.; McDonald, A.; Levine, E.N.; Greco, S.E.; Fitzsimmons, J.; Melville, I.; Spooner, T.; DeWan, C.; Chen, X.; Manger, D.; Nye, H.; McGahay, V.; Biery, G.A.; Goldblatt, R.D.; Chen, T.C.
Year: 2000
Simple, reliable Cu/low-k interconnect integration using mechanically-strong low-k dielectric material: silicon-oxycarbide
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Furusawa, T.; Sakuma, N.; Ryuzaki, D.; Kondo, S.; Takeda, K.; Machida, S.-T.; Hinode, K.
Year: 2000
Extension of copper plating to 0.13 /spl mu/m nodes by pulse-modulated plating
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Gandikota, S.; Duboust, A.; Siew Neo; Liang-Yuh Chen; Cheung, R.; Carl, D.
Year: 2000
Inline monitoring of multi-level dual inlaid copper interconnect technologies
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Kolagunta, V.; Smith, B.; Islam, R.; Angyal, M.; Mendonca, J.; Bartaszewicz, S.; Duraiswami, N.; Jana, P.; Veeraraghavan, S.; Venkatesan, S.
Year: 2000
Cleaning process strategies compatible with low-k dielectric and copper: state of the art, evolution and perspectives
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Louis, D.; Beverina, A.; Arvet, C.; Lajoinie, E.; Peyne, C.; Holmes, D.; Maloney, D.; Lee, S.; Lee, W.M.
Year: 2000
The investigation of galvanic corrosion in post-copper-CMP cleaning
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Chen, H.C.; Yang, M.S.; Wu, J.Y.; Wang, V.
Year: 2000
Dual damascene architectures evaluation for the 0.18 /spl mu/m technology and below
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Verove, C.; Descouts, B.; Gayet, P.; Guillermet, M.; Sabouret, E.; Spinelli, E.; Van der Vegt, E.
Year: 2000
An optimized integration scheme for 0.13 /spl mu/m technology node dual-damascene Cu interconnect
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Shyue-Shyh Lin; Chih-Wei Chen; Shien-Ming Huang; Tsung-Kuei Kang; Chen-Nan Yeh; Tsyr-Lih Li; Bing-Yue Tsui; Hsia, C.C.
Year: 2000
Copper-SiOC-AirGap integration in a double level metal interconnect
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Demolliens, O.; Morand, Y.; Fayolle, M.; Cochet, M.; Assous, M.; Feldis, H.; Lonis, D.; Royer, J.C.; Gobil, Y.; Passemard, G.; Maury, P.; Jourdan, F.; Cordeau, M.; Morel, T.; Perroud, L.; Ulmer, L.; Lugard, J.F.; Renaud, D.
Year: 2000
Predicting computation time for advanced processor architectures
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Burns, A.; Edgar, S.
Year: 2000
Tolerating faults while maximizing reward
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Aydin, H.; Melhem, R.; Mosse, D.
Year: 2000
Physics and applications of dielectric-barrier discharges
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Kogelschatz, U.
Year: 2000
Electron heating in atmospheric pressure air discharges
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Stark, R.H.; Schoenbach, K.H.
Year: 2000
Laser initiation and radiofrequency sustainment of seeded air plasmas
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Scharer, J.; Cao, R.; Gui, H.; Kelly, K.; Paller, E.; Sund, R.
Year: 2000
Spectroscopic studies of high-pressure microhollow cathode discharge plasmas in Ne/H/sub 2/ and Ne/N/sub 2/ mixtures
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Kurunczi, P.; Becker, K.
Year: 2000
A study on gas desorption from inductively coupled plasma chamber wall by optical emission spectroscopy method
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Shafiul, A.A.B.M.; Shuyan Xu; Yin-An Li
Year: 2000
Real-time feedback control of plasma density in inductively coupled plasmas
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Chang, C.H.; Leou, K.C.; Lin, C.
Year: 2000
Doping of thin plasma polymerized aniline films
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Pedrow, P.D.; Lynn, K.G.; Mahalingam, R.; Osman, M.A.; Shepsis, L.V.
Year: 2000
Plasma formation and seeding of Rayleigh-Taylor instabilities in wire array z-pinches
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Lebedev, S.V.; Chittenden, J.P.; Bland, S.N.; Beg, F.N.; Dangor, A.E.; Haines, M.G.; Pikuz, S.A.; Shelkovenko, T.A.
Year: 2000
Effects of interwire gap and initial load diameter on long implosion time aluminum Z-pinches on Saturn
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Coverdale, C.A.; Deeney, C.; Douglas, M.R.; LePell, P.D.; Sze, H.; Failor, B.; Coleman, P.; Whitney, K.G.; Thornhill, J.W.; Apruzese, J.P.; Davis, J.; Schneider, R.
Year: 2000
Improved dynamics and radiated powers from titanium Z-pinch implosions by employing nested wire arrays
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Deeney, C.; Coverdale, C.A.; Douglas, M.R.; Bailey, J.; Thornhill, J.W.; Whitney, K.G.; Apruzese, J.P.; Davis, J.; Clark, R.; Schnelder, R.
Year: 2000
Measurements of ion temperatures of Al wire arrays in short and long current pulse Z-pinches
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Yadlowsky, E.J.; Carlson, E.P.; Barakat, F.; Hazelton, R.C.; Klepper, C.C.; Coverdale, C.R.; Deeney, C.; Bailey, J.E.; Spielman, R.B.; Failor, B.H.; Levine, J.S.; Song, Y.; Whitten, B.L.; Apruzese, J.B.; Davis, J.
Year: 2000
Factors affecting the expansion of single 25 /spl mu/m wires driven by a current rise rate of 10/sup 10/ a/s for 1100 ns
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Sinars, D.B.; Min Hu; Chandler, K.M.; Pikuz, S.A.; Shelkovenko, T.A.; Greenly, J.B.; Hammer, D.A.; Kusse, B.R.
Year: 2000
Radiation trapping efficiency in Double Liner and Dynamic Hohlraum
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Zakharov, S.V.; Nikiforov, A.F.; Novikov, V.G.; Chubatin, A.S.
Year: 2000
New plasma-focus experiments without and with additional targets
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Sadowski, M.; Kubes, P.; Kravarik, J.; Paduch, M.; Skladnik, E.; Scholz, M.; Tomaszewski, K.; Zebrowski, J.
Year: 2000
Theory of intermodulation in a klystron
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Lau, Y.Y.; Chernin, D.; Wilsen, C.; Gilgenbach, R.M.
Year: 2000
3D simulation of cross field devices
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Ludeking, L.D.; Smithe, D.N.; Smith, R.; Chung, C.
Year: 2000
Physics of pasotrons
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Nusinovich, G.; Bliokh, Yu.P.
Year: 2000
A model of ion noise in microwave tubes
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Manheimer, W.M.; Freund, H.P.; Levush, B.; Antonsen, T.M. Jr.
Year: 2000
Progress on a 3D particle-in-cell model of a W-band klystron
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Mardahl, P.J.; Verboncoeur, J.P.; Birdsall, C.K.; Hall, C.
Year: 2000
Modeling of the plasma heating in unmagnetized low pressure microwave discharges
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Grotjohn, T.A.
Year: 2000
Multi-temperature, thermal and ion fraction effects over wedge and bluff body in hypervelocity flow
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Vuillernot, W.W.; Shumlak, U.
Year: 2000
The photo-triggered discharge as an alternative device for NO-removal
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Baravian, G.; Fresnet, F.; Pasquiers, S.; Postel, C.; Puech, V.; Rousseau, A.; Rozoy, M.
Year: 2000
Chemical and bacterial decontamination using a micromachined plasma discharge
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Birmingham, J.
Year: 2000
On the use of the resistive barrier discharge to kill bacteria: recent results
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Richardson, J.P.; Dyer, F.F.; Dobbs, F.C.; Alexeff, I.; Laroussi, M.
Year: 2000
The DC atmospheric barrier plasma discharge-recent results
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Alexeff, I.; Garland, C.; Weng Lock Kang; Laroussi, M.
Year: 2000
Plasma cathode sustained filamentary glow discharges in atmospheric air
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Block, R.; Mohamed, A.-A.H.; Schoenbach, K.H.
Year: 2000
High pressure glow discharges based on MSE arrays
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Penache, C.; Brauning-Demian, A.; Spielberger, L.; Schmidt-Bocking, H.
Year: 2000
Plasma properties of high-pressure microhollow cathode discharges in argon
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Ernst, U.; Frank, K.; Hartmann, W.
Year: 2000
Diagnostics and analyses of a laser produced organic vapor plasma
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Ding, G.; Scharer, J.E.; Cao, R.; Kelly, K.L.
Year: 2000
A laser produced plasma sustained by a radiofrequency source
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Kelly, K.L.; Scharer, J.E.; Ding, G.; Paller, E.; Cao, R.
Year: 2000
Argon and air mixture plasmas produced by a radiofrequency plasma source
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Paller, E.S.; Scharer, J.E.; Kelly, K.L.; Ding, C.
Year: 2000
Electrical properties of plasmas formed in explosive magnetic flux compression generator environments
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Dorsey, D.J.; Freeman, B.L.
Year: 2000
Two-dimensional simulation of ion energy and angular distributions at the wafer in low-pressure RF discharges
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Hu, Y.; Lin, T.L.; Huang, C.Y.
Year: 2000
A design for a multipactor experiment on a dielectric surface
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Anderson, R.; Getty, W.; Lau, Y.Y.; Brake, M.L.; Valfells, A.; Gilgenbach, R.M.
Year: 2000
Modeling of thermal plasmas
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Pfender, E.
Year: 2000
Local thermodynamic equilibrium analysis of the supersonic induction plasma jet
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Sember, V.; Schwenk, A.; Gravelle, D.V.; Boulos, M.I.
Year: 2000
Enthalpy and heat flux distributions in a triple torch plasma reactor
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Hyundae Kim; Hancun Chen; Heberlein, J.
Year: 2000
RF thermal plasma CVD of diamond: the role of acetylene in film morphology
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Larson, J.L.; Iordanoglou, D.I.; Girshick, S.L.
Year: 2000
A molecular beam mass spectrometer for plasma jet chemical vapor deposition reactor diagnostics
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Kull, A.E.; Cappelli, M.A.
Year: 2000
FEA cathodes (FEACs) for space based applications
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Gilchrist, B.E.; Jensen, K.I.; Marrese, C.M.; Severns, J.G.; Gallimore, A.D.; Morris, D.
Year: 2000
Development of a diamond RF switch for a pulse compression system
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Xiaoxi Xu; Schein, J.; Niansheng Qi; Prasad, R.R.; Krishnan, M.; Tamura, F.; Tantawi, S.
Year: 2000
Vacuum ultraviolet emission and metastable state properties of DC microdischarges
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Postel, O.B.; Cappelli, M.A.
Year: 2000
Modeling and diagnostics of micro-plasmas for application to plasma display panels (PDP)
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Hyeon Park; Okuda, H.
Year: 2000
High current experiments with Ranchero explosive pulsed power generators
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Goforth, J.H.; Denninger, W.J.; Fowler, C.M.; Herrera, D.H.; King, J.C.; Lindemuth, I.R.; Lopez, E.A.; McGuire, J.A.; Martinez, E.C.; Oona, H.; Sena, F.C.; Stokes, J.L.; Tabaka, L.J.; Tasker, D.G.; Torres, D.T.
Year: 2000
Differences in liner performance at ATLAS current levels
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Aitchison, W.L.; Faehl, R.J.; Keinigs, R.; Reinovsky, R.E.
Year: 2000
Results of fiber optic interferometer measurements on a magnetically confined plasma opening switch
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:McFarland, M.; Gensler, S.; Krishnan, M.; Savage, M.; Goyer, J.; Huet, D.
Year: 2000
MACH2 simulations of an explosively formed fuse
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Keefer, D.; Rhodes, R.
Year: 2000
Explosively formed fuses for high voltage systems
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Tasker, D.G.; Goforth, J.H.; Fowler, C.M.; Herrera, D.H.; King, J.C.; Lopez, E.A.; Martinez, E.C.; Oona, H.; Stokes, J.L.; Tabaka, L.J.; Torres, D.T.; Sena, F.C.; Kiutti, G.; Degnan, J.
Year: 2000
A plasma opening switch for PRS loads on Double-EAGLE
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Levine, J.S.; Chantrenne, S.; Price, D.; Spence, P.; Putnam, S.; Bailey, V.; Ware, K.
Year: 2000
Optimization of the Decade Quad, a modular NWE simulator
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Kortbawi, D.; Price, D.; Babineau, M.; Kenyon, V.
Year: 2000
Observation of snow plow motion and surface plasma formation in plasma opening switches
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Yadlowsky, E.J.; Hazelton, R.C.; Moschella, J.J.; Klepper, C.C.; Thaler, G.T.; Manzanzani, M.W.; Vidoli, C.
Year: 2000
Characterization of the ACE 4 catcher's mitt POS-load configuration
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Thompson, J.R.; Coleman, P.L.; Crumley, R.J.; Goodrich, P.J.; Goyer, J.R.; Parks, D.E.; Rauch, J.E.; Steen, P.; Waisman, E.M.; Maron, Y.; Moschella, J.J.
Year: 2000
Analyses of the dynamics and spectra from long implosion time aluminum wire array experiments on the 8-MA Saturn generator
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Deeney, C.; Coverdale, C.A.; Douglas, M.R.; Apruzese, J.P.; Thornhill, J.W.; Whitney, K.G.; Davis, J.; Sze, H.; Failor, B.; Coleman, P.; Schneider, R.
Year: 2000
Computational modeling of long implosion time aluminum z-pinches on the Saturn generator
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Douglas, M.; Coverdale, C.; Deeney, C.; Roderick, N.
Year: 2000
Modelling the interaction of nested wire arrays in imploding Z-pinches
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Chittenden, J.P.; Lebedev, S.V.; Bland, S.N.; Ciardi, A.; Haines, M.G.
Year: 2000
Wire dynamic model of offset nested arrays
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Terry, R.E.; Davis, J.; Velikovich, A.L.
Year: 2000
Measurements of the structural evolution of X pinches and the formation of radiating hot spots
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Pikuz, S.A.; Shelkovenko, T.A.; Sinars, D.B.; Hammer, D.A.; Chandler, K.M.; Min Hu
Year: 2000
Spectroscopic investigations of X-ray radiation from X pinches
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Shelkovenko, T.A.; Pikuz, S.A.; Sinars, D.B.; Scobelev, I.Yu.; Hammer, D.A.; Chandler, K.M.; Min Hu
Year: 2000
Study of the rapid expansion rates of 25 /spl mu/m Ag, Au, and Cu wires driven by a current rise rate of 10/sup 10/ A/s for <100 ns
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Chandler, K.M.; Min Hu; Sinars, D.B.; Shelkovenko, T.A.; Pikuz, S.A.; Greenly, J.B.; Hammer, D.A.; Kusse, B.R.
Year: 2000
Optical measurements of the properties of exploding wires
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Kusse, B.R.; Min Hu; Pikuz, S.A.; Sinars, D.B.; Chandler, K.M.; Greenly, J.B.; Hammer, D.A.; Shelkovenko, T.A.
Year: 2000
Polarizability measurements of exploding wire vapor using optical interferometry and X-pinch backlighting
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Min Hu; Sinars, D.B.; Pikuz, S.A.; Chandler, K.M.; Greenly, J.B.; Hammer, D.A.; Kusse, B.R.; Shelkovenko, T.A.
Year: 2000
Dense Z-pinch at the Nevada terawatt facility
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Bauer, B.S.; Kantsyrev, V.L.; Le Galloudec, N.; Mancini, R.C.; Petrashen, A.G.; Presura, R.; Sarkisov, G.S.; Shlyaptseva, A.S.; Sotnikov, V.I.; Winterberg, F.; Batie, S.; Brinsmead, W.; Faretto, H.; Le Galloudec, B.; Oxner, A.; Al-Shorman, M.; Fedin, D.A.; Gharaibeh, M.; Golovkin, I.E.; Hansen, S.; Paraschiv, I.; Sherrill, M.; Zheng, H.; McCrorey, D.; Farley, J.W.; Glassman, J.; De Groot, J.S.
Year: 2000
Investigation of the initial stage of exploding wire
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Sarkisov, G.S.; McCrorey, D.; Bauer, B.S.; Reisman, D.; DeGroot, J.S.
Year: 2000
Relativistic focusing and ponderomotive self-channeling of intense laser beams
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Hafizi, B.; Ting, A.; Sprangle, P.; Hubbard, R.F.
Year: 2000
Investigation of magnetic guiding of laser plasmas for thin film deposition
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Redman, D.G.; Roupassov, S.; Tsui, Y.Y.; Rankin, R.; Capjack, C.E.; Fedosejevs, R.
Year: 2000
Experimental methods for investigation of photo-field fusion concept
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Belyaev, V.S.; Matafonov, A.P.
Year: 2000
Measurement of Ar(1s/sub 2/) population in a carbon plume excited by ArF excimer laser using a laser absorption method
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Sakai, Y.; Bratescu, M.A.; Suda, Y.; Mizuno, M.
Year: 2000
Experimental and numerical investigation of a planar type radio frequency inductively coupled oxygen plasma
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Chung, T.H.; Seo, D.C.; Chung, S.W.; Yoon, H.J.
Year: 2000
Construction and characterization of an Ar-Fe hollow cathode tube with modeling of the argon plasma discharge
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Motta, C.C.; Mirage, A.
Year: 2000
Measuring electron densities in highly collisional plasmas using a 110 GHz interferometer
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Kelly, K.L.; Scharer, J.E.; Laroussi, M.; Block, R.; Schoenbach, K.
Year: 2000
First experimental measurement of the free streaming plasma mode
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Hoffman, J.R.; Muggli, P.; Katsouleas, T.; Joshi, C.
Year: 2000
Experimental investigation of power deposition and ionization kinetics in an inductively coupled discharge
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Rullenraad, W.; Crowley, B.; Turner, M.M.; Vender, D.
Year: 2000
Large area plasma processing system based on electron beam ionization
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Leonhardt, D.; Walton, S.G.; Blackwell, D.B.; Murphy, D.P.; Fernsler, R.F.; Meger, R.A.
Year: 2000
Theoretical overview of the large area plasma processing system (LAPPS)
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Manheimer, W.M.; Fernsler, R.; Lampe, M.; Meger, R.
Year: 2000
The effect of static magnetic field configuration on the ion production efficiency and operational stability of a microwave plasma source
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Perrin, M.; Grotjohn, T.A.; Asmussen, J.
Year: 2000
Experimental characterization of a compact microwave plasma source employing three different coupling geometries
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Khan, A.; Asmussen, J.
Year: 2000
Triggerless shunting arc generation and pulsed ion extraction
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Yukimura, K.; Tani, Y.; Yoshioka, K.; Masamune, S.
Year: 2000
Characterization of a surface wave argon discharge sustained by microwave
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Motta, C.C.; Fonseca, A.D.; Gomes, G.H.; Maciel, H.S.
Year: 2000
Pulsed microwave discharge in gas mixtures N/sub 2//O/sub 2//NO: experimental study and modeling
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Baeva, M.; Gier, H.; Pott, A.; Uhlenbusch, J.
Year: 2000
A high power microwave-driven plasma torch
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Read, M.; Kremer, M.; Oakes, D.; Gelb, A.
Year: 2000
A transmission line filled with fast switched periodic plasma as a wideband frequency transformer
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Kuo, S.P.; Bivolaru, D.; Orlick, L.; Alexeff, I.; Kalluri, D.K.
Year: 2000
An incidence of electromagnetic wave on a flat plasma layer
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Nerukh, A.; Yemelyanov, K.
Year: 2000
Control of sub-critical microwave filamentary plasma in dense gases
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Barker, P.F.; McAndrew, B.; Macheret, S.O.; Miles, R.B.
Year: 2000
Recent progress in static-wall hohlraum development for ICF studies
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Sanford, T.W.L.; Olson, R.E.; Bailey, J.E.; Chandler, G.A.; Fehl, D.L.; Hebron, D.E.; Lash, J.S.; Leeper, R.J.; Mock, R.C.; Nash, T.J.; Porter, J.L.; Ruggles, L.E.; Ruiz, C.L.; Simpson, W.W.; Struve, K.W.; Vesey, R.A.; Bowers, R.L.; Chrien, R.E.; Idzorek, G.C.; Matsuka, W.; Peterson, D.L.; Watt, R.G.; Peterson, R.R.; Roderick, N.F.; Reisman, D.B.
Year: 2000
A two-sided Z-pinch driven-hohlraum for improved ICF radiation symmetry
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Cuneo, M.E.; Vesey, R.A.; Hanson, D.L.; Porter, J.L., Jr; Spielman, R.B.; Chandler, G.A.; Slutz, S.A.; Gilliland, T.J.; Reynolds, P.; Ruggles, L.E.; Simpson, W.W.; Seaman, H.; Primm, P.; Torres, J.; McGurn, J.; Hammer, J.H.
Year: 2000
Laser Megajoule Project status
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Andre, M.; Jequier, F.
Year: 2000
Shock waves generated by intense femtosecond lasers
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Ao, T.; Ng, A.
Year: 2000
Isotopic enrichment of swift ions from laser plasmas
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Pronko, P.P.; VanRompay, P.A.; Zhang, Z.; Nees, J.
Year: 2000
Computation and measurement of electron circulation patterns in phase space
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Kortshagen, U.; Heil, B.
Year: 2000
Multifrequency beam-wave interaction in an idealized broadband vacuum microwave amplifier model
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Wohlbier, J.G.; Dobson, I.; Booske, J.H.
Year: 2000
Nonlinear characterization and comparison with simulation of a high gain, broad band helix traveling wave tube
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:McNeely, M.M.; Converse, M.C.; Booske, J.H.; Scharer, J.E.; Kory, C.L.; Zavadil, D.
Year: 2000
Investigations of non-linear spectral behavior in multi-toned helix traveling wave tubes
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Wirth, M.A.; Scharer, J.E.; Booske, J.H.; Comverse, M.C.; McNeely, M.M.; Wohlbier, J.G.; Groshart, G.; Ganon, B.; Armstrong, C.
Year: 2000
PIC-circuit hybrid model for coupled cavity traveling wave tubes
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Qiu, W.D.; Verboncoeur, J.P.; Birdsall, C.K.
Year: 2000
Computer characterisation of resonance modes of a magnetron cavity
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Wang, Z.; Chen, X.; Esterson, M.; Lindsay, P.A.
Year: 2000
94 GHz sixth-harmonic slotted gyrotron
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Stutzman, R.C.; McDermott, D.B.; Hirata, Y.; Gallagher, D.A.; Spencer, T.A.; Luhmann, N.C., Jr.
Year: 2000
Simulation of beam collector heating patterns in small-orbit gyrodevices
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Calame, J.P.; Danly, B.G.; Levush, B.; Nguyen, K.T.; Blank, M.; Felch, K.; Chu, T.S.
Year: 2000
Design of a low-voltage W-band gyro-amplifier with depressed collector
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Blank, M.; Saraph, G.P.; Felch, K.; Borchard, P.; James, B.G.; Danly, B.G.; Levush, B.; Nguyen, K.T.
Year: 2000
X-band magnicon amplifier experiment
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Gold, S.H.; Fliflet, A.W.; Nezhevenko, O.A.; Yakovlev, V.P.; Hirshfield, J.I.; Kozyrev, E.V.; Kinkead, A.K.
Year: 2000
1 MW, 140 GHz, CW gyrotron for Wendelstein 7-X
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Dammertz, G.; Alberti, S.; Arnold, A.; Borie, E.; Erckmann, V.; Forstr, W.; Gantenbein, G.; Garin, P.; Giguet, E.; Illy, S.; Kasparek, W.; Laqua, H.; Le Cloaree, G.; Le Goff, Y.; Magne, R.; Michel, G.; Muller, G.; Piosczyk, B.; Tran, M.Q.; Thumm, M.
Year: 2000
Status of a 35 GHz sixth-harmonic amplifier experiment
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Velazco, J.E.; Ceperley, P.H.; Menz, D.M.
Year: 2000
Gyrokinetic analysis of the e-beam misalignment effect on a millimeter-wave gyrotron oscillator
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Shi-Chang Zhang
Year: 2000
High energy electrons in the micropinch region of vacuum spark
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Semyonov, O.G.
Year: 2000
Observation of the metallic vapor from a plasma focus with a laser differential interferometer
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Xinxin Wang; Chengmu Luo; Min Han
Year: 2000
Experimental study of neutron emission under low rep-rate operation in a small plasma focus device
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Han, M.; Guo, Zh.G.; Wang, X.X.
Year: 2000
Demonstrated sub-nanosecond timing of waveform data in the distributed data acquisition at the Z facility
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Mills, J.A.; Slopek, J.; Dinwoodie, T.; McGurn, J.S.
Year: 2000
Fiber-optic array streak-camera coupled diagnostics in use at the Z accelerator record single point, one-, or two-dimensional data from z-pinch plasmas
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Lazier, S.; Bernard, M.; Derzon, M.; Hall, C.; Torres, J.
Year: 2000
Electron density measurements in pulsed atmospheric pressure air plasmas by IR heterodyne interferometry
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Leipold, F.; Stark, R.H.; El-Habachi, A.; Schoenbach, K.H.
Year: 2000
E179: A 1.4 meter-long plasma wakefield acceleration experiment
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Muggli, P.; Katsouleas, T.C.; Lee, S.; Assmann, R.; Decker, F.J.; Hogan, M.; Iverson, R.; Raimondi, P.; Siemann, R.H.; Walz, D.; Blue, B.; Clayton, C.E.; Dodd, E.; Hemker, R.; Joshi, C.; Marsh, K.A.; Mori, W.B.; Wang, S.
Year: 2000
Heavy ion beam probe development
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Connor, K.A.; Crowley, T.P.; Demers, D.R.; Howard, S.J.; Lei, J.; Schatz, J.G.; Schoch, P.M.; Shah, U.; Si, J.
Year: 2000
Plasma diagnostic measurements of argon-hydrogen-methane discharges used for ultra-nanocrystalline diamond deposition in a microwave CVD system
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Huang, W.S.; Grotjohn, T.A.; Asmussen, J.
Year: 2000
A novel inversion algorithm for optical tomography of plasmas
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Etemadi, K.; Benck, E.C.
Year: 2000
Temperature fields in glow discharges measured with ultra violet filtered Rayleigh scattering
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Yalin, A.P.; Ionikh, Y.; Miles, R.B.
Year: 2000
Calculation of ion energy distributions from RF plasmas using a simplified kinetic model
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Misakian, M.; Wang, Y.
Year: 2000
Direct spectroscopic observation of multicharged MeV ions in plasma, heated by intense femtosecond laser radiation
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Faenov, A.Ya.; Skobelev, I.Yu.; Magunov, A.I.; Pilcuz, T.A.; Auguste, T.; d'Oliveira, P.; Hulin, S.; Monor, P.; Zhidkov, A.G.; Sasaki, A.; Tahima, T.
Year: 2000
Using spherically bent crystals for obtaining high-resolution, large-field, monochromatic X-ray backlighting imaging for wide range of Bragg angles
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Pikuz, T.A.; Faenov, A.Ya.; Fraenkel, M.; Zigler, A.; Flora, F.; Bollanti, S.; Di Lazzaro, P.; Letardi, T.; Grilli, A.; Palladino, L.; Tomassetti, G.; Reale, A.; Reale, L.; Scafati, A.; Limongi, T.; Bonfigli, F.; Alainelli, L.; Sanchez del Rio, M.
Year: 2000
Hot-electron influence for K spectra emission of Ar clusters, heated by 65 fs high-intensive laser radiation
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Faenov, A.Ya.; Skobelev, I.Yu.; Magunov, A.I.; Pikuz, T.A.; Abdallah, J., Jr.; Auguste, T.; d'Oliveira, P.; Hulin, S.; Monot, P.
Year: 2000
Plasma density measurements inside a laboratory model Hall thruster using a resonance probe diagnostic
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Haas, J.M.; Beal, B.E.; Gallimore, A.D.
Year: 2000
Using emissive and non-emissive segmented electrodes to control beam divergence in Hall thrusters
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Dorf, L.; Raitses, Y.; Fisch, N.J.
Year: 2000
Fluctuation-induced electron transport in closed-drift Hall discharges
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Cappelli, M.A.; Meezan, N.B.; Chesta, E.
Year: 2000
Experimental investigation of Hall thruster magnetic field topography
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Peterson, P.Y.; Haas, J.M.; Gallimore, A.D.
Year: 2000
Two dimensional simulations of Hall thrusters
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Fernandez, E.; Cappelli, M.
Year: 2000
Spectroscopic characterization of FMT2 discharge ionization processes
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Smith, T.B.; Williams, G.J., Jr.; Gallimore, A.D.
Year: 2000
Two-stream efficiency model of the pulsed plasma thruster
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Burton, R.L.
Year: 2000
Small and microthruster propulsion research at the Air Force Research Laboratory, Edwards AFB
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Dulligan, M.; Gulczinski, F.; Spanjers, G.
Year: 2000
Plasma-surface diagnostics in LAPPS
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Walton, S.G.; Leonhardt, D.; Murphy, D.P.; Fernsler, R.F.; Meger, R.A.
Year: 2000
Probes in non-uniform plasma
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Oksuz, L.; Hershkowitz, N.; Lho, T.
Year: 2000
Spatial and time resolved investigations of NO- and OH-distributions in dielectric barrier discharge plasmas using planar laser induced fluorescence
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Kleinhans, R.; Tiase, L.; Beushausen, V.
Year: 2000
An improved model of the SEERS diagnostic method
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Brinkmann, R.P.
Year: 2000
Use of localized self-induced plasmas to focus high energy electron beams
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Chen, P.; Craddock, W.; Decker, F.; Iverson, R.; King, F.; Kirb, R.; Kotseroglou, T.; Ng, J.; Walz, D.; Yan, Y.; Cline, D.; Fukui, Y.; Kumar, V.; Colestock, P.; Crawford, C.; Noble, R.; Katsouleas, T.; Meyerhoger, D.; Masuda, S.; Ogata, A.; Chattopadhyay, S.; Sessler, A.; Weidemann, A.; Baldis, H.; Bolton, P.; Esparza, F.; Foy, J.
Year: 2000
Simulations of Cerenkov wake radiation sources
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Spence, N.; Katsouleas, T.; Muggli, P.; Mori, W.B.
Year: 2000
Pulsed ICP plasma generation and characterization
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Wei Guo; DeJoseph, C.A., Jr.
Year: 2000
X-ray spectromicroscopy investigations of fast ions and hot electrons in plasmas, heated by nanosecond laser radiation with different wavelengths
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Faenov, A.Ya.; Skobelev, I.Yu.; Magunov, A.I.; Pikuz, T.A.; Rosmej, F.B.; Hoffmann, D.H.H.; Suss, W.; Geissel, M.; Bock, R.; Letardi, T.; Flora, F.; Bollanti, S.; Di Lazzaro, P.; Satov, Yu.A.; Smakovskii, Yu.B.; Stepanov, A.E.; Roerich, V.K.; Khomenko, S.V.; Nischuk, S.; Makarov, K.N.; Reale, A.; Scafati, A.; Auguste, T.; d'Oliveira, P.; Hulin, S.; Monot, P.; Sharkov, B.Yu.
Year: 2000
The plasma sphere and its possible role in ball lightning
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Singer, S.
Year: 2000
Performance of the vacuum spark (VSX) and the spherical pinch (SPX) X-ray/EUV point sources
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Ahtik, I.; Guo, X.; Klibanov, L.; Semyonov, O.; Tang, W.; Wirpszo, K.W.; Wu, F.; Xu, M.; Panarella, E.
Year: 2000
A generalization of critical velocity concept to neutral or charged particles and beams in neutral and/or partially ionized collisional cases
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Kikuchi, H.
Year: 2000
On the spheric radiation
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Arnhoff, G.H.
Year: 2000
A 250 GHz gyrotron for NMR spectroscopy
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Kreischer, K.; Farrar, C.; Griffin, R.; Temkin, R.; Vieregg, J.
Year: 2000
A 360 GHz, second harmonic gyroklystron for EPR
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Read, M.; Nusinovich, G.; Walter, M.; Kremer, M.
Year: 2000
Continued testing and applications of high power cusp gun
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Gallagher, D.; Frawley, P.; Barsanti, M.; Scafuri, F.; Armstrong, C.
Year: 2000
Calculation of the effect of electron correlations on shot noise in gyroklystrons
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Fliflet, A.W.; Antonsen, T.M., Jr.; Calame, J.P.; Danly, B.G.
Year: 2000
Nonlinear contraction of field profile in the gyro-BWO and its effect on frequency tuning
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Chang, T.H.; Chen, S.H.; Chu, K.R.
Year: 2000
Advanced high power gyrotrons for ECRH applications
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Kuntze, M.; Arnold, A.; Borle, E.; Dammertz, G.; Koppenburg, K.; Piosczyk, B.; Thumm, M.
Year: 2000
Progress in experimental studies of harmonic multiplying gyro-amplifiers
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Guo, H.; Granatstein, V.L.; Rodgers, J.; Zhao, J.J.; Chen, W.J.; Miao, Y.
Year: 2000
Interpulse plasmas of high power short pulse microwaves
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Bhattacharjee, S.
Year: 2000
RF breakdown by toroidal bounded whistlers
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Tripathi, S.K.P.; Bora, D.
Year: 2000
Collisionless transport coefficients in heated plasmas by high-frequency electromagnetic waves
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Tahraoul, A.; Bendib, A.
Year: 2000
Attenuation of microwaves by plasma torches
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Bivolaru, D.; Kuo, S.P.
Year: 2000
Gas discharges induced by a high-power and short-pulse microwave
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Onoi, M.; Azuma, K.; Fujiwara, E.; Yatsuzuka, M.
Year: 2000
Plasma surface modification of LDPE to improve insulation property
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Chen, M.; Yu, Q.S.; Yasuda, H.K.
Year: 2000
Portable decontamination systems using nonequilibrium plasmas
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Moeller, T.M.; Cordell, J.; Irving, P.M.
Year: 2000
Plasma reactors with nanosecond coronas and semiconductor SOS generators
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Mesyats, G.A.; Novoselov, Yu.N.; Rukin, S.N.
Year: 2000
Generation of atmospheric pressure plasma using two chambers
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Park, H.; Muthuswamy, N.; Dhali, S.K.
Year: 2000
A fuzzy model of inductively coupled plasma by adaptive-network-based fuzzy inference system (ANFIS)
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Chang, C.H.; Lin, C.; Leou, K.C.
Year: 2000
Ablation plasma ion implantation
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Gilgenbach, R.M.; Qi, B.; Lau, Y.Y.; Johnston, M.D.; Doll, G.L.
Year: 2000
Long-pulse plasma immersion ion implantation using a grounded conduction grid
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Xuchu Zeng; Kowk, T.T.K.; Xiubo Tian; Chung Chan; Chu, P.K.
Year: 2000
Plasma characterization of a plasma doping system for semiconductor device fabrication
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Bon-Woong Koo; Felch, S.; Ziwei Fang
Year: 2000
Fabrication of duplex coatings on biomedical titanium alloys by plasma nitriding, metal plasma immersion ion implantation, and reactive plasma oxidation
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Leng, Y.X.; Tian, X.B.; Zeng, Z.M.; Zeng, X.C.; Tang, B.Y.; Chu, P.K.; Yang, P.; Chen, J.Y.; Huang, N.; Zhou, Z.R.
Year: 2000
Polar flux symmetry in Z-pinch-driven hohlraums using a self-backlit foam ball diagnostic
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Hanson, D.L.; Cuneo, M.E.; Vesey, R.A.; Porter, J.L., Jr.; Spielman, R.B.; Chandler, G.A.; Gilliland, T.J.; Reynolds, P.; Ruggles, L.E.; Simpson, W.W.; Seaman, H.; Primm, P.; Torres, J.; McGurn, J.; Hebron, D.E.; Dropinski, S.C.; Hawn, R.E.; Schroen-Carey, D.G.; Hammer, J.H.; Landen, O.; Koch, J.
Year: 2000
Examination of emission mitigation protocols for power flow surfaces on 20-MA Z utilizing electrochemical processing, hydrogen firing, and vacuum firing
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:McKenney, J.L.; Garrity, J.E.; Gluth, J.W.; Lobley, D.K.; Romero, A.R.; Spielman, R.B.; Seamen, J.F.; Stygar, W.A.; Johnson, D.J.; Renk, T.
Year: 2000
Gas-puff-on-wire-array structured load experiments on the GIT-12 facility
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Shishlov, A.V.; Baksht, R.B.; Fedunin, A.V.; Kovalchuk, B.M.; Kokshenev, V.A.; Labetsky, A.Yu.; Oreshkin, V.I.; Russkikh, A.G.
Year: 2000
On structure of imploding double shell liner
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Chaikovsky, S.A.; Sorokin, S.A.
Year: 2000
PRS experiments with shell-on-shell gas puff loads
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Song, Y.; Coleman, P.L.; Failor, B.H.; Fisher, A.; Ingermanson, R.; Levine, J.S.; Sze, H.M.; Waisman, E.; Coverdale, C.; Deeney, C.; Schneider, R.F.
Year: 2000
2-D snowplow modeling of gas puff Z-pinches
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Ingermanson, R.; Waisman, E.; Coleman, P.; Song, Y.
Year: 2000
Z pinch implosions in the kinetic ion regime
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Sgro, A.G.
Year: 2000
Vacuum arc electron source for pre-ionizing Z-pinch gas loads
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Binder, R.; Niansheng Qi; Prasad, R.R.; Schein, J.; McFarland, M.; Krishnan, M.; Yushkov, A.; Yushkov, G.
Year: 2000
Design and operation of a two-color, four-beam fiber optic interferometer
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:McFarland, M.; Niansheng Qi; Xiaoxi Xu; Prasad, R.R.; Gensler, S.; Krishnan, M.
Year: 2000
Pinhole camera imaging of an ablative capillary discharge investigated for the development of a soft X-ray laser
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Dussart, R.; Gotze, S.; Hong, D.; Pons, J.; Cachoncinlle, C.; Pouvesle, J.-M.; Fleurier, C.
Year: 2000
Production of uniform dense titanium plasmas for experiments on Atlas
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Wysocki, F.J.; Benage, J.F.; Newton, R.R.; Wood, B.P.
Year: 2000
Basic principles of photo field fusion concept
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Belyaev, V.S.; Arefyev, V.I.
Year: 2000
Detailed modeling of proposed liner-on-plasma fusion experiments
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Sheehey, P.T.; Faehl, R.J.; Kirkptrick, R.C.; Lindemuth, I.R.
Year: 2000
Modeling of collisional, low temperature plasmas fundamentals and applications
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Kushner, M.J.
Year: 2000
Nonlinear skin effect in inductive discharge
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Godyak, V.A.; Piejak, R.B.; Alexandrovich, B.M.; Smolyakov, A.I.
Year: 2000
Instabilities in low pressure inductive discharges with attaching gases
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Lieberman, M.A.; Lichtenberg, A.J.; Marakhtanov, A.M.; Chabert, P.; Tuszcwski, M.
Year: 2000
Evidence of electron trapping in a helicon discharge
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Degeling, A.; Scharer, J.; Boswell, R.
Year: 2000
Explosive generation of cold electrons in low-pressure discharges
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Berezhonoi, S.; Kaganovich, I.; Tsendin, L.
Year: 2000
Bohm presheaths
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Hershkowtiz, N.; Oksuz, L.; Hala, A.M.; Khedr, M.A.
Year: 2000
Absolute measurements of rf fields using a retarding field energy analyser
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Charles, C.; Degeling, A.; Sheridan, T.; Harris, J.; Boswell, R.; Lieberman, M.
Year: 2000
Langmuir probe and ion acoustic velocity measurement of the concentration of two species in a multi-dipole plasma
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Hala, A.M.; Hershkowitz, N.
Year: 2000
Spontaneous generation of a magnetic field in a compressing inhomogeneous plasma
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Peterkin, R.E., Jr.; Turchi, P.J.
Year: 2000
Radiofrequency sustainment of a laser-produced plasma
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Kelly, K.L.; Scharer, J.E.; Paller, E.; Gui, H.; Cao, R.
Year: 2000
Pulsed power driven radiographic approaches
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Maenchen, J.
Year: 2000
Assessment of the rod-pinch as a 1-2 MV radiography source on the NRL Gamble II generator
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Stephanakis, S.J.; Commisso, R.J.; Cooperstein, G.; Mosher, D.; Neri, J.M.; Young, F.C.; Carlson, R.L.; Fulton, R.D.; Oro, D.M.; Ulibarri, M.D.; Hunt, E.E.; Droemer, D.W.
Year: 2000
Experimental development of radiographic sources on TriMeV
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Menge, P.R.; Gustwiller, J.; Johnson, D.L.; Maenchen, J.E.; Molina, I.; Rovang, D.C.; Shear, R.; Cordova, S.; Droemer, D.; Hunt, E.; Ormand, E.; Woo, L.; Commisso, R.J.; Cooperstein, G.; Swanekamp, S.B.; Oliver, B.V.; Rose, D.V.; Welch, D.R.
Year: 2000
Z-discharge electron beam transport for Decade Quad
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Hinshelwood, D.D.; Black, D.C.; Cooperstein, G.; Ottinger, P.F.; Rose, D.V.; Schumer, J.W.; Harper-Slaboszewicz, V.
Year: 2000
Experimental results from a dynamic magnetic field controlled ion ring
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Freeman, B.L.; Deninger, W.; Faehl, R.; Glidden, S.; Greenly, J.; Luginbill, A.; Oona, H.; Rock, J.; Shannon, J.; Williams, P.
Year: 2000
Development and application of pulsed ion beams under the combination of cryogenic and pulsed-power-technique
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Kasuya, K.; Kamiya, T.; Funatsu, M.; Renk, T.; Turman, B.; Quintenz, J.
Year: 2000
Overview of intense beam-driven relativistic backward wave oscillators and their use in high power microwave effects studies
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Schamiloglu, E.; Hegeler, F.; Abdallah, C.T.; Hahn, K.; Choi, S.
Year: 2000
Overmoded GW-class surface wave microwave oscillator
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Vlasov, A.N.; Shkvarunets, A.G.; Rodgers, J.; Carmel, Y.; Antonsen, T.M., Jr.; Abuelfadl, T.M.; Lingze, D.; Cherepenin, V.A.; Nusinovich, G.S.; Botton, M.; Granatstein, V.L.
Year: 2000
MILO research at ARFL: Past and present
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Haworth, M.; Cavazos, T.; Golby, K.; Hendricks, K.; Henley, D.; LaCour, M.; Lemke, R.; Luginsland, J.; Ralph, D.; Sena, M.
Year: 2000
Multi-dimensional effects in space-charge-limited emission: an improved voltage-current relation for parallel plate geometry
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Watrous, J.J.; Luginsland, J.W.; Frese, M.H.
Year: 2000
Optimization of Hall thruster magnetic field topography
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Hofer, R.R.; Peterson, P.Y.; Gallimore, A.D.
Year: 2000
Radiation power emitted from Ar torch short plasma as function of input power in several kW
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Iwao, T.; Miyazaki, H.; Hayashi, T.; Hirano, T.; Inaba, T.
Year: 2000
A model of teflon ablation in a pulsed plasma thruster
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Keidar, M.; Boyd, I.D.; Beilis, I.I.
Year: 2000
Little black hole model of ball lightning
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Rabinowitz, M.
Year: 2000
Possible formation of a toroidal current layer in a plasma vortex
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Vlasov, A.N.
Year: 2000
Spectroscopic study of a moly-oxide electrodeless discharge for lighting applications
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Giuliani, J.L.; Pechacek, R.E.; Meger, R.A.; Shamamian, V.
Year: 2000
XeCl excimer fluorescence in a microwave discharge
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Anderson, S.; Keyser, M.; Collard, C.; Brake, M.L.
Year: 2000
Characteristic improvement of inductively coupled electrode-less metal halide lamps
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Uemura, K.; Ishigami, T.; Itoh, A.; Yokozeki, I.; Shimizu, K.
Year: 2000
Excimer emission from microhollow cathode discharges in rare gas halides
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:El-Habachi, A.; Shi, W.; Moselhy, M.; Stark, R.H.; Schoenbach, K.H.
Year: 2000
Modelling rare-gas medium pressure discharge lamps
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Zissis, G.; Damelincourt, J.-J.; Yan-Ming Li; Lister, G.
Year: 2000
A coupled radiation transport particle-in-cell model for fluorescent lamp discharges
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Lee, H.J.; Verboncoeur, J.P.; Smith, H.B.; Parker, G.J.; Birdsall, C.K.
Year: 2000
Barium transport in fluorescent lamps
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Garner, R.C.; Moskowitz, P.
Year: 2000
Analysis of the diffuse-to-hot spot attachment mode transition for high pressure arcs on thermionic cathodes
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Coulombe, S.
Year: 2000
Increasing the surface energy of nonwoven fabrics by exposure to a one atmosphere uniform glow discharge plasma (OAUGDP)
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Tsai, P.P.-Y.; Sherman, D.M.; Karakaya, F.; Zhiyu Chen; Roth, J.R.
Year: 2000
Viral inactivation by a one atmosphere uniform glow discharge plasma
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Kelly-Wintenberg, K.; Montie, T.; Roth, J.R.; Zhiyu Chen; Morrison, J.
Year: 2000
Sterilization by active species from an improved remote exposure reactor (RER) using a one atmosphere uniform glow discharge plasma (OAUGDP)
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Roth, J.R.; Sherman, D.M.; Karakaya, F.; Zhiyu Chen; Montie, T.C.; Kelly-Wintenberg, K.; Tsai, P.P.-Y.; Helfritch, D.J.; Feldman, P.
Year: 2000
Advances in air filter sterilization using a one atmosphere uniform glow discharge plasma (the OAUGDP Volfilter)
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Sherman, D.M.; Chen, Z.; Karakaya, F.; Roth, J.R.; Kelly-Wintenberg, K.; Montie, T.C.; Tsai, P.P.-Y.; Helfritch, D.J.; Feldman, P.L.
Year: 2000
The fusion portfolio
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Goldston, R.J.
Year: 2000
Excimer emission from microhollow cathode discharges
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:El-Habachi, A.; Moselhy, M.; Stark, R.H.; Schoenbach, K.H.
Year: 2000
Hg 185 nm and 254 nm resonance radiation production from a low pressure Hg-Ar discharge at high current densities
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Curry, J.J.; Lawler, J.E.; Lister, G.G.
Year: 2000
Numerical predictions of the power balance in the positive column of a low-pressure Ba discharge
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Curry, J.J.; Lister, G.G.; Lawler, J.E.
Year: 2000
Progress in development of theta pinches for formation of field reversed configurations suitable for subsequent compression to magnetized target fusion conditions
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Degnan, J.H.; Barnes, D.C.; Cavazos, T.; Coffey, S.K.; Faehl, R.J.; Frese, M.; Gale, D.; Hussey, T.W.; Intrator, T.P.; Kirkpatrick, R.; Kiuttu, G.F.; Lehr, F.M.; Letterio, J.D.; Lindemuth, I.; Moses, R.; Peterkin, R.E.; Roderick, N.F.; Ruden, E.L.; Schoenberg, K.; Siemon, R.E.; Sommars, W.; Turchi, P.J.; Wurden, G.A.; White, R.; Wysocki, F.
Year: 2000
Energy balance and ionization dynamics in an imploding Z-pinch plasma
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Gregorian, L.; Kroupp, E.; Davara, G.; Bernshtam, V.; Ralchenko, Yu.V.; Maron, Y.
Year: 2000
Radiation from dynamic Z-pinches
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Davis, J.; Giuliani, J., Jr; Clark, R.; Apruzese, J.; Deeney, C.
Year: 2000
Analysis of nested gas-puff Z-pinch implosion dynamics and radiation performance using measured initial-density distributions
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Mosher, D.; Weber, B.; Moosman, B.; Coleman, P.; Waisman, E.; Sze, H.; Song, Y.; Parks, D.; Steen, P.; Levine, J.; Failor, B.; Fisher, A.
Year: 2000
Use of tracers in double shell Z-pinches to study implosion dynamics
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Coleman, P.L.; Failor, B.H.; Fisher, A.; Levine, J.S.; Song, Y.; Sze, H.; Apruzese, J.P.; Davis, J.; Velikovich, A.L.; Weber, B.V.
Year: 2000
2-D MHD calculations for argon double shell experiments on Double Eagle and Saturn
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Waisman, E.M.; Coleman, P.; Ingermanson, R.; Parks, D.; Steen, P.
Year: 2000
Laser shearing interferometer for space- and time-resolved imploding z-pinch plasmas
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Qi, N.; Schein, J.; Prasad, R.R.; Krishnan, M.; Weber, B.V.; Moosman, B.G.; Mosher, D.; Commisso, R.J.
Year: 2000
Gas puff implosion measurements and modeling
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:B. Moosman; J.R. Boller; R.J. Commisso; D. Mosher; S.J. Stephankis; B.V. Weber; F.C. Young; N. Qi; J. Schein; S. Gensler; R.R. Prasad; M. Krishnan
Year: 2000
Uniform-fill nozzles for long-implosion-time PRS experiments
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:J.S. Levine; P.L. Coleman; B.H. Failor; A. Fisher; S.K. Lam; J.C. Riordan; Y. Song; H.M. Sze; J.P. Apruzese; J. Davis; F.L. Cochran; B. Moosman; J.W. Thornhill; A.L. Velikovich; B.V. Weber; K.G. Whitney; C.A. Coverdale; C. Deeney; J.S. McGurn; R. Schneider
Year: 2000
Gas and vacuum switches-a review
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Lehr, J.; Kristiansen, M.
Year: 2000
Charge transport and persistent conduction in high gain photoconductive semiconductor switches used in pulsed power applications
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Islam, N.E.; Schamiloglu, E.
Year: 2000
Design and implementation of a portable lightning current simulator
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Warren, C.; Burnett, E.; Mazzola, M.; Donohoe, J.P.; Molen, G.M.
Year: 2000
Studies to improve performance of Maxwell ATLAS rail-gap switches
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Guy, T.L.; Freeman, B.L.
Year: 2000
Microwave generation in a reflex triode powered by an explosive wire generator
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Krasik, Ya.E.; Dunaevsky, A.; Felsteiner, J.
Year: 2000
Near field diagnostics for HPM sources
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Hendricks, K.J.; Coleman, P.D.; Haworth, M.D.; Clark, M.C.; Gallegoes, R.
Year: 2000
Testing and benchmarking of a novel resistive wall boundary condition in the presence of an intense relativistic electron beam
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Bowers, L.A.; Luginsland, J.W.; Watrous, J.J.; Hendricks, K.J.; Sasser, G.E.
Year: 2000
Electrodynamic beam loading and pulse shortening effects due to a intense relativistic electron beam/plasma
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Luginsland, J.W.; Lau, Y.Y.; Hendricks, K.J.; Lemke, R.W.; Haworth, M.D.; Baca, C.
Year: 2000
Magnetron simulations and experiments
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Lopez, M.R.; Gilgenbach, R.M.; Anderson, S.A.; Lau, Y.Y.; Brake, M.L.; Peters, C.W.; Cohen, W.E.; Jaynes, R.L.; Luginsland, J.W.; Spencer, T.A.; Lemke, R.W.; Price, D.; Booske, J.H.; McNeely, M.J.; Ludeking, L.
Year: 2000
Pulse-shortening observations in large-orbit, coaxial gyrotron high power microwave experiments
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Cohen, W.E.; Jaynes, R.L.; Gilgenbach, R.M.; Peters, C.W.; Lopez, M.R.; Lau, Y.Y.; Spencer, T.A.
Year: 2000
3-D PIC simulations of a SLAC klystrino
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Spencer, T.A.; Luginsland, J.W.; Hackett, K.; Liqun Song; Schietrum, G.
Year: 2000
High-power annular beam klystrons
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Pasour, J.; Smithe, D.; Ludeking, L.; Friedman, M.
Year: 2000
Optimization of the signal growth rate in a class of multicavity RKOs with axially varying geometry using a parallel real-valued evolutionary algorithm
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Merkle, L.D.; Luginsland, J.W.
Year: 2000
Two-frequency undulator brightness and gain with the aid of induced betatron oscillations
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Chouhan, S.; Mishra, G.
Year: 2000
Evaluation of fast turn-on characteristics of power devices by IR-laser probing technique
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Yasuoka, K.; Ibuka, S.; Ishii, S.
Year: 2000
Critique of fluid model of the microsecond plasma opening switch
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Parks, D.E.; Coleman, P.; Ingermanson, R.; Steen, P.; Thompson, J.; Waisman, E.
Year: 2000
Fundamental studies of a simple helical magnetic flux compression generator
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:A. Neuber; J. Dickens; M. Giesselmann; B. Freeman; J. Rasty; H. Krompholz; M. Kristiansen
Year: 2000
Spectroscopic study of the magnetic field penetration and electron density evolution in a POS
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Arad, R.; Tsigutkin, K.; Ralchenko, Yu.V.; Osin, D.; Maron, Y.; Fruchtman, A.
Year: 2000
Pulsed generator based on shock demagnetization of ferromagnetic material
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Shkuratov, S.I.; Kristiansen, M.; Dickens, J.
Year: 2000
Emission properties of metal-ceramic and velvet cathodes
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Krasik, Ya.E.; Dunaevsky, A.; Felsteiner, J.; Gunin, A.V.; Pegel, I.V.; Korovin, S.D.
Year: 2000
Operation of a carbon fiber cathode
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Krasik, Ya.E.; Dunaevsky, A.; Felsteiner, J.
Year: 2000
Development dynamics of the 2-D vortex structures in high-current plasma lens
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Goncharov, A.; Kirichenko, G.; Litovko, I.
Year: 2000
Ion-species distribution in a high-current broad beam
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Sakudo, N.; Hayashi, K.; Okuji, S.; Nishiyama, Y.; Komatsy, K.; Miyamoto, A.; Yutani, M.
Year: 2000
Theory and simulation of electron beam dynamics in the Tri-MeV magnetically immersed diode
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Oliver, B.V.; Welch, D.R.; Olson, C.L.; Rosenthal, S.E.
Year: 2000
Numerical simulation techniques for the study of high-power diodes for radiography
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Welch, D.R.; Rose, D.V.; Oliver, B.V.; Hughes, T.P.; Clark, R.E.
Year: 2000
New developments in pulsed power technology and associated electron beam transport mechanisms at the United Kingdom Atomic Weapons Establishment
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Birrell, A.R.; Edwards, R.D.; Goldsack, T.J.; Sinclair, M.A.
Year: 2000
Effects of plasmas on electron beam transport in a fast magnetic kicker
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Christenson, P.J.; Ang, K.L.; Kwan, T.J.T.
Year: 2000
Multi foil targets and pellicle dynamics for X-ray radiography
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Ho, D.D.-M.; Chen, Y.-J.
Year: 2000
Intense electron beam generation by a fast filamentary discharge
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Udrea, M.; Goktas, H.; Kirkici, H.
Year: 2000
Production and application of low-energy, high-current electron beams
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Proskurovsky, D.I.; Ozur, G.E.; Rotshtein, V.P.
Year: 2000
Experimental diagnostic of an industrial SF/sub 6/ PTFE confined circuit breaker
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Gentils, F.; Fleurier, C.; Fievet, C.; Le Menn, E.
Year: 2000
Transient fault detection via simultaneous multithreading
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Reinhardt, S.K.; Mukherjee, S.S.
Year: 2000
Trace preconstruction
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Jacobson, Q.; Smith, J.E.
Year: 2000
A fully associative software-managed cache design
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:E.G. Hallnor; S.K. Reinhardt
Year: 2000
Recency-based TLB preloading
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:A. Saulsbury; F. Dahlgren; P. Stenstrom
Year: 2000
Memory access scheduling
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:S. Rixner; W.J. Dally; U.J. Kapasi; P. Mattson; J.D. Owens
Year: 2000
An embedded DRAM architecture for large-scale spatial-lattice computations
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:N. Margolus
Year: 2000
Lx: a technology platform for customizable VLIW embedded processing
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:P. Faraboschi; G. Brown; J.A. Fisher; G. Desoll; F.M.O. Homewood
Year: 2000
Reconfigurable caches and their application to media processing
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:P. Ranganathan; S. Adve; N.P. Jouppi
Year: 2000
Circuits for wide-window superscalar processors
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:D.S. Henry; B.C. Kuszmaul; G.H. Loh; R. Sami
Year: 2000
Clock rate versus IPC: the end of the road for conventional microarchitectures
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Agarwal, V.; Hrishikesh, M.S.; Keckler, S.W.; Burger, D.
Year: 2000
Asymmetric multiple-quantum-well heterostructures: conception, properties, and laser characteristics
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Kononenko, V.K.
Year: 2000
Semiconductor mid-infrared lasers working at high temperature application to gas analysis
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Rouillard, Y.; Baranov, A.N.; Yarekha, D.A.; Perona, A.; Vicet, A.; Joullie, A.; Alibert, C.
Year: 2000
Pulse transmission through controllable semiconductor photonic band gap structure
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Nefedov, I.; Morozov, Y.; Gusyatnikov, V.; Zheltikov, A.
Year: 2000
Nonlinear interactions in short-haul DWDM optical fibre telecommunication system
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Kowakewski, M.; Marciniak, M.; Sedlin, A.
Year: 2000
Frequency stabilized lasers for coherent optical communications
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Babich, V.M.; Machekhin, Yu.P.
Year: 2000
Holographic model of physiological optics-new direction for creation of information system
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Titar, V.P.; Spachenko, O.V.
Year: 2000
Spatio-temporal transformations of laser beam in thin light-sensitive AgCl-Ag film
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Ageev, L.A.; Miloslavski, V.K.; Larionova, E.I.; Elashhab, H.
Year: 2000
Mode selection in laser resonators containing waveguide and open sections
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Tkachenko, V.M.; Gurin, O.V.; Degtyarev, A.V.; Maslov, V.A.; Svich, V.A.; Topkov, A.N.
Year: 2000
Laser beam characterization
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Katrich, A.B.; Katrich, A.A.; Priz, I.A.
Year: 2000
Mathematical modeling at development of the optical measuring devices
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Nokody, N.G.
Year: 2000
New classes of objects in polarimetry: including the isotropic depolarisation
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Savenkov, S.N.; Yushtin, K.E.
Year: 2000
Spectral properties of optical mediums with transmitting symmetry containing plasma-like layers
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Bulgakov, A.A.; Kononenko, V.K.; Shramkova, O.V.
Year: 2000
Resonance diffraction theory: new achievements
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Kats, A.V.
Year: 2000
Optical fluxes in parallel plane nonlinear waveguide arrays in linear optical media
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Gerasimchuk, I.V.; Kovalev, A.S.
Year: 2000
Thermal properties of semiconductor oxide-confinement vertical-cavity lasers
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Ivanov, P.S.; Sukkoivanov, I.A.; Lysak, V.V.; Kublik, A.V.
Year: 2000
Determination of nonlinear gain coefficients for infrared optical sources
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Lysak, V.V.; Sukhoivanov, I.A.
Year: 2000
Basic problems of metrology maintenance optical testers and wattmeters
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Machekhin, Yu.P.; Raschektaeva, A.I.
Year: 2000
Development of the equipment for precise measurement of optical radiation power in a spectral range of 1000-1600 nm
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Grishchenko, L.V.; Machekhin, Yu.P.
Year: 2000
Forming of solitons using ring optical resonator
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Gerasimchuk, T.; Katok, V.; Manko, A.
Year: 2000
Counteracting of stimulated Brillouin scattering in externally modulated lightwave AM-CATV systems
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Jaworski, M.; Marciniak, M.
Year: 2000
Fiber connector end face analysis by interference method
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Filipenko, A.I.
Year: 2000


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