Control of output signal entropy of the deterministic chaotic oscillations sources
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Vladimirov, S.N.; Negrul, V.V.
Year: 1999
Radar conversion and evolution
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Immoreev, I.J.; Taylor, J.D.
Year: 1999
Propagation of elf radio waves on "zeus - zabaikalie" path
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Bashkuev, Lu.B.; Khaptanov, V.B.
Year: 1999
The screens set ap-art to attenuate mirror reflections from the ground
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Batoroev, A.S.; Dugarzhapova, D.B.
Year: 1999
Calculation of diffractional and tropospheric components of uhf trans-horizon field in mountainous terrain
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Darizhapov, D.D.; Bazarov, A.V.
Year: 1999
Ground penatrating radar and borehole electromagnetic logging in siberia
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Sato, M.
Year: 1999
Algorithms signal finding in additing chaotic hindrances
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Klimov, I.Z.; Zhidkov, S.V.
Year: 1999
Simulation of sounding of the atmospheric wind fields by doppler lidar systems
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Banakh, V.A.; Werner, Ch.; Smalikho, I.N.
Year: 1999
Updating the ionospheric delay model using gps data
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Afraimovich, E.L.; Chernukhov, V.V.; Dernyanov, V.V.
Year: 1999
Measuring the full field vector of the ionospheric radio signal on a short-range path when three mutually orthogonal antennas are used
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Afraimovich, E.L.; Kobzar, V.A.; Palamatchouk, K.S.; Chernukhov, V.V.
Year: 1999
Radar study of nonlinear scattering in L-band microwave range by semiconductor objects
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Novikov, S.A.; Zelentsov, D.V.
Year: 1999
Characterization of indoor channel propagation in 450 mhz, 900 mhz and 1800 mhz band
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Affandi, A.; Zein, G.E.; Citerne, J.
Year: 1999
Dielectric permeability of soil equation made precise
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Shirapova, N.
Year: 1999
Electromagnetic surface waves on a boundary of bianisotropic magnetoactive omega composites
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Marakasov, D.A.; Fisanov, V.V.
Year: 1999
Attenuation hindrance floors devices of weakly direct antennas
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Vetlujsky, A.Yu.; Lomukhin, Yu.L.
Year: 1999
The antenna array with new type of the divide device
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Panchenko, B.A.; Voitovitch, N.I.
Year: 1999
The nanosecond pulse generator-radiator for subsurface radar videopulse systems
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Karaush, A.S.; Lukjanov, S.P.; Semenchuk, V.E.; Potemin, R.V.
Year: 1999
The application of kalman theory of random fields filtering for sar image processing
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Mironov, B.M.; Lezhankin, B.V.
Year: 1999
Updating the ionospheric delay model using gps data
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Afraitnevich, E.L.; Chernukhov, V.V.; Demyanov, V.V.
Year: 1999
An influence of diffraction multipath phenomenon on accuracy of amplitude-monopulse designating systems
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Dagurov, P.N.; Zajakhanov, A.S.; Tsybikov, A.E.
Year: 1999
Studies on the performance of amorphous ti-ni film hydrogen-storage electrodes
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Mu Zongxin; Li Guoqing; Ren Houmin
Year: 1999
Computer simulation of metal Ion beam enhanced deposition of metallization for diamond film
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Li Guoqing; Wong, N.B.; Zhang Tao; Lee, S-T.; Mu Zongxin
Year: 1999
Means for generation and injection of low energy focused electron beams into gas
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Orlikov, L.N.
Year: 1999
Superfine aluminum powder (sfap) combustion products by limited air access conditions
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Gromov, A.A.; Yablunowsky, G.V.; Bychin, N.V.; Ilyin, A.P.
Year: 1999
Quantum cascade lasers based on superlattice active regions and n-i-p-i doping
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Faist, J.; Muller, A.; Beck, M.
Year: 1999
Room temperature operation of 1.5 /spl mu/m InAsP/InP strained quantum wire DFB lasers fabricated by mass transport method
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Toda, T.; Nakano, Y.
Year: 1999
980 nm Al-free ridge waveguide distributed feedback lasers with lateral gain coupling
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Kamp, M.; Hofmann, J.; Forchel, A.; Krakowski, M.; Rondi, D.; Guyaux, J.L.; Chirlias, E.; Glastre, G.; Blondeau, R.
Year: 1999
Complex coupled 1.55 /spl mu/m DFB-lasers based on focused ion beam enhanced wet chemical etching and quantum well intermixing
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Konig, H.; Rennon, S.; Reithmaier, J.P.; Forchel, A.; Gentner, J.; Goldstein, L.
Year: 1999
1.55 /spl mu/m high efficiency tapered DFB laser using UV 250 2-in technology process
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Voiriot, V.; Thedrez, B.; Gentner, J.L.; Rainsant, J.-M.; Colson, V.; Duchemin, C.; Gaborit, F.; Hubert, S.; Lafragette, J.L.; Pinquier, A.; Roux, L.; Fernier, B.
Year: 1999
Narrow-stripe selective MOVPE technology for high-quality strained InGaAsP MQW structures
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Sakata, Y.; Komatsu, K.
Year: 1999
Large number of periods in highly strained InGaAlAs/InGaAlAs MQW structures grown by metalorganic vapor-phase epitaxy
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Tsuchiya, T.; Takemoto, D.; Taike, A.; Aoki, M.; Uomi, K.
Year: 1999
Planarised InP regrowths around tall and narrow mesas using chloride-MOVPE [and electroabsorption modulator fabrication]
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Perrin, S.D.; Moore, R.T.; Moodie, D.G.; Rogers, D.C.; Barrell, A.H.
Year: 1999
High gain limiting amplifier for 10 Gbps lightwave receivers
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Georgiou, G.; Paschke, P.; Kopf, R.; Hamm, R.; Ryan, R.; Tate, A.; Burm, J.; Schulien, C.; Chen, Y.-K.
Year: 1999
1.3 /spl mu/m InAsP-GaInAsP-InGaP strain-compensated MQW lasers grown by GSMBE
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Saito, K.; Shimizu, H.; Kumada, K.; Yamanaka, N.; Mukaihara, T.; Yokouchi, N.; Kasukawa, A.
Year: 1999
Self-phase-modulation in integrated InGaAsP-laser-modulator-amplifiers
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Koch, M.; Stegmiiller, B.; Harth, W.
Year: 1999
InAs(P,Sb)/InAsSb LEDs emitting in the 3-4 /spl mu/m range at room temperature
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Stein, A.; Behres, A.; Heime, K.; Wilk, A.; Christol, P.; Joullie, A.; Brozicek, M.; Hulicius, E.; Simecek, T.; Rushworth, S.; Smith, L.; Ravetz, M.
Year: 1999
Solid source molecular beam epitaxy growth of low threshold and high temperature 1.3 /spl mu/m AlGaInAs-AlInAs-InP laser diodes suitable for uncooled application
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Savolainen, P.; Toivonen, M.; Melanen, P.; Vilokkinen, V.; Saarinen, M.; Orsila, S.; Kuuslahti, T.; Salokatve, A.; Asonen, H.; Panarello, T.; Murisonib, R.; Pessa, M.
Year: 1999
Gain linearity and bandwidth improvement of InP-based transimpedance amplifiers by feedback loop designs
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Feng-Tso Chien; Yi-Jen Chan
Year: 1999
Minority carrier lifetime in MOCVD-grown C- and Zn-doped InGaAs
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Chellic, C.; Cui, D.; Hubbard, S.M.; Eisenbach, A.; Pavlidis, D.; Krawczyk, S.K.; Sermage, B.
Year: 1999
Low temperature growth of GaInAs by MOVPE
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Oe, K.; Okamoto, H.; Nakao, M.
Year: 1999
Improved homogeneity of LP-MOVPE grown InP/GaInAsP heterostructure for DBR using an optimized liner and susceptor arrangement
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Westphalen, R.; Landgren, G.; Stalnacke, B.; Beccard, R.
Year: 1999
Characterization of He-plasma-assisted GSMBE InGaAsP
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Pinkney, H.; Thompson, D.A.; Robinson, B.J.; Simpson, P.J.; Myler, U.; Streater, R.W.
Year: 1999
Energy gaps and bowing of interband gaps of lattice matched In/sub 1-x/Ga/sub x/As/sub y/P/sub 1-y//InP
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Reh, C.; Weiser, G.
Year: 1999
Transferred-substrate heterojunction bipolar transistor integrated circuit technology
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Rodwell, M.; Lee, Q.; Mensa, D.; Guthrie, J.; Betser, Y.; Martin, S.C.; Smith, R.P.; Jaganathan, S.; Mathew, T.; Krishnan, P.; Serhan, C.; Long, S.
Year: 1999
Submicron transferred-substrate heterojunction bipolar transistors with greater than 8000 GHz f/sub max/
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Lee, Q.; Martin, S.C.; Mensa, D.; Smith, R.P.; Guthrie, J.; Jaganathan, S.; Mathew, T.; Krishnan, S.; Creran, S.; Rodwell, M.J.W.
Year: 1999
InP/GaAsSb/InP double heterojunction bipolar transistors with high cut-off frequencies and breakdown voltages
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Matine, N.; Dvorak, M.W.; Xu, X.G.; Watkins, S.P.; Bolognesi, C.R.
Year: 1999
Proposal of buried metal heterojunction bipolar transistor and fabrication of HBT with buried tungsten
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Arai, T.; Tobita, H.; Harada, Y.; Suhara, M.; Miyamoto, Y.; Furuya, K.
Year: 1999
Properties of fully self-aligned InAlAs/InGaAs PNP HBTs with very thin bases
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Sawdai, D.; Zhang, X.; Cui, D.; Pavlidis, D.; Bhattacharya, P.
Year: 1999
Design and characterization of a 50 GHz InP/InGaAs HBT amplifier
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Huber, A.; Huber, D.; Bergamaschi, C.; Morf, T.; Jackel, H.
Year: 1999
Optimizing InP HBT technology for 50 GHz clock-rate MSI circuits
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Sokolich, M.; Fields, C.; Raghavan, G.; Hitko, D.A.; Lui, M.; Docter, D.P.; Brown, Y.K.; Case, M.G.; Kramer, A.R.; Henige, J.A.; Jensen, J.F.
Year: 1999
Ruthenium doped high power 1.48 /spl mu/m SIPBH laser
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:van Geelen, A.; Binsma, J.J.M.; van Dongen, T.; van Leerdam, A.; Dadger, A.; Bimberg, D.; Stenzel, O.; Schumann, H.
Year: 1999
Multiple micro-cavity laser with /spl lambda//4-wide deep grooves buried with benzocyclobutene
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Madhan Raj, M.; Toyoshima, S.; Arai, S.
Year: 1999
Selectively formed AlAs/InP current confining tunnel junction for GaInAsP/InP surface emitting lasers
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Sekiguchi, S.; Miyamoto, T.; Kimura, T.; Koyama, F.; Iga, K.
Year: 1999
A novel GaInAsP microcylinder laser with AlInAs(O/sub x/) claddings
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Fujita, M.; Baba, T.; Matsutani, A.; Koyama, F.; Iga, K.
Year: 1999
High reliable, low threshold 1.3 /spl mu/m SL-QW PACIS (p-substrate Al-oxide Confined Inner Stripe) laser array
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Iwai, N.; Mukaihara, T.; Yamanaka, N.; Itoh, M.; Arakawa, S.; Shimizu, H.; Kasukawa, A.
Year: 1999
Wafer bonding: a flexible approach to materials integration
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Gosele, U.; Kastner, G.; Senz, S.; Kopperschmidt, P.; Plossl, A.; Scholz, R.; Tong, Q.-Y.; Chao, Y.-L.; Huang, L.-J.
Year: 1999
Fabrication and characterization of 0.2 to 6 /spl mu/m GaInAs/InP electron waveguides
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Maximov, I.; Wang, Q.; Graczyk, M.; Omling, P.; Samuelson, L.; Seifert, W.; Shorubalko, I.; Hieke, K.; Lourdudoss, S.; Messmer, E.R.
Year: 1999
Modeling of Zn diffusion in InP/InGaAs materials during MOVPE growth
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Cheng-Yu Tai; Seiler, J.; Geva, M.
Year: 1999
VGF crystal growth and vapor-phase Fe doping technologies for semi-insulating 100 mm diameter InP substrates
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Asahi, T.; Uchida, M.; Kainosho, K.; Oda, O.
Year: 1999
Deep-level optical spectroscopy on iron acceptor doped in InP and In/sub x/Ga/sub 1-x/P
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Takanohashi, T.
Year: 1999
A long-wavelength 10 V optical-to-electrical InGaAs photogenerator
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Dentai, A.G.; Giles, C.R.; Burrows, E.
Year: 1999
Tunable InP/air gap Fabry Perot filter for wavelength division multiplex fiber optical transmission
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Daleiden, J.; Chitica, N.; Strassner, M.; Spisser, A.; Leclercq, J.L.; Viktorovitch, P.; Rondi, D.; Goutin, E.; Peerlings, J.; Pfeiffer, J.; Riemenschneider, R.; Hjort, K.
Year: 1999
Proposal of a novel semiconductor optical waveguide isolator
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Takenaka, M.; Nakano, Y.
Year: 1999
Si/InGaAs ultralow dark current wafer bonded photodetectors
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Levine, B.F.; Pinzone, C.J.; Hui, S.; King, C.A.; Leibenguth, R.E.
Year: 1999
Improved excess noise and temperature dependence of multiplication characteristics in thin InP avalanching regions
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Tan, C.H.; Li, K.F.; Plimmer, S.A.; David, J.P.R.; Rees, G.J.; Clark, J.; Button, C.C.
Year: 1999
InP HEMT lightwave communication ICs for 40 Gbit/s and beyond
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Sano, E.
Year: 1999
Composite-channel InP HEMT for W-band power amplifiers
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Chen, Y.C.; Chin, P.; Ingram, D.; Lai, R.; Grundbacher, R.; Barsky, M.; Block, T.; Wojtowicz, M.; Tran, L.; Medvedev, V.; Yen, H.C.; Streit, D.C.; Brown, A.
Year: 1999
InP power HEMTs with 36% PAE at 60 GHz
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Grundbacher, R.; Nishimoto, M.; Chin, T.P.; Chen, Y.C.; Lai, R.; Yamauchi, D.; Schreyer, G.; Block, T.; Medvedev, V.; Streit, D.
Year: 1999
0.1-/spl mu/m InAlP/InAlAs/InGaAs/InP HEMTs with improved breakdown voltages
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Yamane, Y.; Yokoyama, H.; Makimura, T.; Kobayashi, T.; Ishii, Y.
Year: 1999
A 3-channel InP-HEMT with low output conductance
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Maher, H.; Decobert, J.; Falcou, A.; Post, G.; Scavennec, A.
Year: 1999
High performance InP-based HEMTs with dry etched gate recess for the fabrication of low-noise microwave oscillators
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Duran, H.C.; Lin Ren; Py, M.A.; Homan, O.J.; Lott, U.; Bachtold, W.
Year: 1999
Low-voltage, high-speed AlSb-InAsSb HEMTs
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Boos, J.B.; Yang, M.J.; Bennett, B.R.; Park, D.; Kruppa, W.; Bass, R.
Year: 1999
InAs/GaAs quantum dots: a material for very highspeed, long-wavelength photodetectors on GaAs
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Bottcher, E.H.; Pirk, T.; Pfitzenmaier, H.; Heinrichsdorff, F.; Bimberg, D.
Year: 1999
Observation of resonant tunneling through InAs quantum dots by using novel electrophotoluminescence spectroscopy
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Ohno, Y.; Asaoka, K.; Kishimoto, S.; Maezawa, K.; Mizutani, T.
Year: 1999
Contacting of buried InP-based layers by epitaxial overgrowth over patterned tungsten features
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Wernersson, L.-E.; Jarlskog, L.; Lofgren, A.; Nilsson, N.; Samuelson, L.; Seifert, W.; Suhara, M.
Year: 1999
Improved luminescence from InGaAsP/InP MQW active regions using a wafer fused superlattice barrier
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Black, K.A.; Abraham, P.; Karim, A.; Bowers, J.E.; Hu, E.L.
Year: 1999
Integration of optical amplifiers and passive waveguide devices on InP using selective area chemical beam epitaxy
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Harmsma, P.J.; Leys, M.R.; Verschuren, C.A.; Vonk, H.; Smit, M.K.; Oei, Y.S.
Year: 1999
A selective low induced damage ICP dry etching process for a self-aligned InP-InGaAs HBT technology
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Etrillard, J.; Blayac, S.; Riet, M.
Year: 1999
Monolithically integrated 40-Gb/s InP/InGaAs PIN/HBT optical receiver module
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Bitter, M.; Bauknecht, R.; Hunziker, W.; Melchior, H.
Year: 1999
1.3-/spl mu/m AlGaInAs/InP ridge-waveguide lasers with integrated beam-expanders
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Takemasa, K.; Wada, H.; Munakata, T.; Kamijoh, T.
Year: 1999
A 2.0 /spl mu/m cutoff wavelength separate absorption, charge, and multiplication layer avalanche photodiode using strain-compensated InGaAs quantum wells
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Dries, J.C.; Gokhale, M.R.; Forrest, S.R.; Olsen, G.H.
Year: 1999
Optimisation of butt coupling between deep-ridge and buried ridge waveguides for the realisation of monolithically integrated wavelength selectors
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Pommereau, F.; Mestric, R.; Martin, B.; Rao, E.V.K.; Gaborit, F.; Leclerc, D.; Porcheron, C.; Renaud, M.
Year: 1999
Applications of resonant-tunneling diodes to high-speed digital ICs
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Akeyoshi, T.; Matsuzaki, H.; Itoh, T.; Waho, T.; Osaka, J.; Yamamoto, M.
Year: 1999
Novel MOBILE gates with low-power, relaxed parameter sensitivity, and increased driving capability
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Prost, W.; Auer, U.; Brennemann, A.; Goser, K.F.; Tegude, F.-J.
Year: 1999
A novel frequency divider using a resonant tunneling chaos circuit
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Maezawa, K.; Kawano, Y.; Kishimoto, S.; Mizutani, M.
Year: 1999
InP-based high speed digital logic gates using an RTD/HBT heterostructure
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Lin, C.-H.; Yang, K.; Gonzalez, A.F.; East, J.R.; Mazumder, P.; Haddad, G.I.
Year: 1999
190 GHz InP HEMT MMIC LNA with dry etched backside vias
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Barsky, M.; Lai, R.; Kok, Y.L.; Sholley, M.; Streit, D.C.; Block, T.; Liu, P.H.; Sabin, E.; Rogers, H.; Medvedev, V.; Gaier, T.; Samoska, L.
Year: 1999
A 50 mm copper/polymer substrate HBT IC technology for >100 GHz MMICs
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Guthrie, J.R.; Mensa, D.; Mathew, T.; Lee, Q.; Krishnan, S.; Jaganathan, S.; Ceran, S.; Betser, Y.; Rodwell, M.J.W.
Year: 1999
50 to 70 GHz InP/InGaAs HBT amplifier with 20 dB gain
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Morf, T.; Huber, D.; Huber, A.; Schwarz, V.; Jackel, H.
Year: 1999
InAlAs/InP/InGaAs/InP DHBTs with a novel composite-emitter design
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Driad, R.; McKinnon, W.R.; McAlister, S.P.; Renaud, A.; Garanzotis, T.; SpringThorpe, A.J.
Year: 1999
A consistent physical model for the gate-leakage and breakdown in InAlAs/InGaAs HFETs
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Auer, U.; Prost, W.; Brockerhoff, W.; Tegude, F.J.
Year: 1999
High switching rate capability of mm-wave InGaAs PIN diodes
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Alekseev, E.; Pavlidis, D.
Year: 1999
Hot-carrier induced degradation in InP/InGaAs/InP double heterojunction bipolar transistors
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Hong Wang; Geok Ing Ng; McAlister, S.P.; Driad, R.; McKinnon, R.
Year: 1999
Observation of high field regions in GaAs MESFETs by using Kelvin probe force microscopy
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Mizutani, T.; Takeyama, T.; Matsunami, K.; Kishimoto, S.; Maezawa, K.; Tomizawa, M.; Schmid, P.; Lipka, K.M.; Kohn, E.
Year: 1999
High current InP double hetero bipolar transistor driver circuit for laser diodes
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Schneibel, I.; Graf, C.; Bauknecht, R.; Melchior, H.
Year: 1999
Advanced non-linear InP HEMT model parameter estimation from vectorial large-signal measurements
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Schreurs, D.; Verspecht, J.; Vandenberghe, S.; van der Zanden, K.; Carchon, G.; Nauwelaers, B.
Year: 1999
InP-based thermionic coolers
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Shakouri, A.; Labounty, C.; Abraham, P.; Piprek, J.; Bowers, J.E.
Year: 1999
LP-MOVPE grown GaAs- and InP-based HBTs using all-liquid alternative sources
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Veiling, P.; Agethen, M.; Herenda, E.; Prost, W.; Stolz, W.; Tegude, F.-J.
Year: 1999
A new concept for InP-HBT fabrication process
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Le Pallec, M.; Bauknecht, R.; Bitter, M.; Melchior, H.
Year: 1999
InGaP/GaAs superlatticed resonant-tunneling transistor (SRTT)
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Liu, W.C.; Cheng, S.Y.; Pan, H.J.; Chen, J.Y.; Wang, W.C.; Thei, K.B.; Feng, S.C.; Yu, K.H.
Year: 1999
A new GaInP/GaAs high-barrier gate and tri-step doped channel transistor
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Liu, W.C.; Chang, W.L.; Shie, Y.H.; Pan, H.J.; Wang, W.C.; Chen, J.Y.; Thei, K.B.; Yu, K.H.; Feng, S.C.
Year: 1999
InP HBT self-aligned technology for 40 Gbit/s ICs: fabrication and CAD geometric model
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Blayac, S.; Riet, M.; Benchimol, J.L.; Abboun, M.; Aniel, F.; Berdaguer, P.; Duchenois, A.M.; Konczykowska, A.; Godin, J.
Year: 1999
Influence of deep levels in AlInAs/GalnAs/InP HFETs
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Souifi, A.; Georgescu, B.; Bremond, G.; Py, M.A.; Decobert, J.; Post, G.; Guillot, G.
Year: 1999
Fermi-level dependence of implanted Be diffusion in InP
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Molnar, B.
Year: 1999
Size and composition dependence of photoluminescence from In/sub x/Ga/sub 1-x/As quantum wires
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Shim, B.R.; Bando, K.; Ota, T.; Kobayashi, K.; Nakashima, H.
Year: 1999
Long wavelength GaInAs/GaAs quantum well lasers
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Schlenker, D.; Miyamoto, T.; Chen, Z.; Koyama, F.; Iga, K.
Year: 1999
Quantum confined Stark effects of heavy hole subbands in In/sub 0.53/Ga/sub 0.47/As/In/sub 0.52/Al/sub 0.48/As multi-quantum well structures using photocurrent spectroscopy
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Tanaka, K.; Kurata, T.; Kotera, N.
Year: 1999
Recent advances in the monolithic integration of waveguide grating router based devices on InP
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Joyner, C.H.; Doerr, C.R.; Storz, F.G.
Year: 1999
MOCVD growth assessment of the first all monolithic 1.56 /spl mu/m VCSELs with GaInAlAs/InP system
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Sagnes, I.; Le Roux, G.; Legay, P.; Kazmierski, C.; Palmier, J.F.; Debray, J.P.
Year: 1999
Microarray selective epitaxy (MASE) for integrated photonic devices
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Kudo, K.; Nakazaki, T.; Yamaguchi, M.
Year: 1999
Growth of high quality InGaP and related heterostructures by gas-source molecular beam epitaxy using tertiarybutylphosphine
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Hirama, A.; Sai, H.; Fujikura, H.; Hasegawa, H.
Year: 1999
New MOVPE process for InP based HBT's using CBr/sub 4/, TBA and TBP in N/sub 2/ ambient
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Keiper, D.; Eriksson, U.; Westphalen, R.; Landgren, G.
Year: 1999
Improvement of CBE grown InGaAs/InP HBT's using a carbon doped and compositionally graded base
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Benchimol, J.L.; Mba, J.; Duchenois, A.R.; Berdaguer, P.; Sermage, B.; Le Roux, G.; Blayac, S.; Riet, M.; Thuret, J.; Gonzalez, C.; Andre, P.
Year: 1999
Composition dependence of carrier lifetime and spontaneous emission of highly strained GaInNAs/GaAs QW lasers
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Koyama, F.; Sato, S.; Miyamoto, T.; Iga, K.
Year: 1999
STM/STS study on high lateral density, well-aligned In-Ga-P quantum dots self-formed in GaP/InP short-period superlattices grown on GaAs(N11)A substrate
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Asahi, H.; Noh, J.H.; Fudeta, M.; Watanabe, D.; Mori, J.; Gonda, S.
Year: 1999
InGaAs quasi-quantum-wire FET on V-grooved substrate by selective growth with As/sub 2/ flux in hydrogen-assisted molecular beam epitaxy
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Sugaya, T.; Tanuma, Y.; Nakagawa, T.; Ogura, M.; Yonei, K.; Sugiyama, Y.
Year: 1999
50 GHz monolithically integrated InP/InGaAs PIN/HBT-receiver
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Huber, D.; Bitter, M.; Gini, E.; Neiger, A.; Morf, T.; Bergamaschi, C.; Jackel, H.
Year: 1999
A novel flexible, reliable and easy to use technique for the fabrication of optical spot size converters for InP based PICs
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Trommer, D.; Steingruber, R.; Loffler, R.; Umbach, A.
Year: 1999
A novel gate process for InP based HEMTs with gate length from 0.06 to 0.2 /spl mu/m
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Nawaz, M.; Persson, S.H.M.; Zirath, H.; Choumas, E.; Mellberg, A.
Year: 1999
Higher mobility with high concentration of 2DEG in pseudomorphic In/sub 0.7/Ga/sub 0.3/As/In/sub 0.52/Al/sub 0.48/As quantum-well HEMT structure with [411]A super-flat interfaces grown on [411]A InP substrate by MBE
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Hiyamizu, S.; Kitada, T.; Aoki, T.; Higashiwaki, M.; Shimomura, S.
Year: 1999
Transfer of thin InP films onto silicon substrate by proton implantation process
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Jalaguier, E.; Aspar, B.; Pocas, S.; Michaud, J.F.; Papon, A.M.; Bruel, M.
Year: 1999
IC technology R&D for the next century
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Nishi, Y.
Year: 1999
Clock skew determination from parameter variations at chip and wafer level
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Sauter, S.; Cousinard, D.; Thewes, R.; Schmitt-Landsiedel, D.; Weber, W.
Year: 1999
Circuit performance variability decomposition
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Orshansky, M.; Spanos, C.; Chenming Hu
Year: 1999
Analysis of the impact of intra-die variance on clock skew
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Zanella, S.; Nardi, A.; Quarantelli, M.; Neviani, A.; Guardiani, C.
Year: 1999
A systematic and physical application of multivariate statistics to MOSFET I-V models
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Kondo, M.; Onodera, H.; Tamaru, K.
Year: 1999
TCAD-prototyping with new accurate worst-case definition for a 0.2 micron CMOS-ASIC process
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Kunitomo, H.; Sato, H.; Tsuneno, K.; Ikematsu, R.; Masuda, H.
Year: 1999
Application of covariance based models to fit response surfaces to experimental data
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Redford, M.; Walton, A.J.; Sprevak, D.; Ferguson, R.S.
Year: 1999
A study of within-wafer non-uniformity metrics
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Smith, T.; Boning, D.; Fang, S.; Shinn, G.; Stefani, J.
Year: 1999
Calibration of a 2D numerical model for the optimization of LOCOS type isolations by response surface methodology
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Senez, V.; Tixier, A.; Hoffmann, T.
Year: 1999
A new method for calculating one-dimensional process margin in consideration of process variations
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Miwa, T.; Noda, T.; Akiyama, T.; Sugimoto, S.
Year: 1999
Graduate IS curriculum for the 21st century
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Gorgone, J.T.; Gray, P.
Year: 1999
Thematic modules in an asynchronous learning network: designing introductory courses
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Nulden, U.
Year: 1999
Voting before discussing: computer voting as social communication
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Whitworth, B.; McQueen, R.J.
Year: 1999
An assessment of group support systems research: results
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Fjermestad, J.; Hiltz, S.R.
Year: 1999
Communication media for supporting distributed engineering design
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Gammack, J.; Poon, S.
Year: 1999
The impact of computer mediated communication on information overload in distributed teams
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Franz, H.
Year: 1999
A comparison of business process improvement approaches between US and Japanese firms: a model application
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Paper, D.
Year: 1999
Combining business and network simulation models for IT investment evaluation
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Giaglis, G.M.; Paul, R.J.; O'Keefe, R.M.
Year: 1999
Exploring the boundaries of successful GSS application: supporting inter-organizational policy networks
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:de Brujin, H.; de Vreede, G.-J.
Year: 1999
Designing interfaces to maximize the quality of collaborative work
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Burgoon, J.K.; Bengtsson, B.; Bonito, J.A.; Ramirez, A., Jr.; Dunbar, N.E.
Year: 1999
The impact of anthropomorphic interfaces on influence understanding, and credibility
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Bengtsson, B.; Burgoon, J.K.; Cederberg, C.; Bonito, J.; Lundeberg, M.
Year: 1999
Negotiation in network based requirements analysis
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Ramesh, B.; Tung Bui
Year: 1999
Organizational memory and knowledge management
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Morrison, J.; Olfman, L.
Year: 1999
Annotate: a Web-based knowledge management support system for document collections
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Ginsburg, M.; Kambil, A.
Year: 1999
Educational software and learning: subversive use and volatile design
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Squires, D.
Year: 1999
Student-directed learning: Hong Kong experiences
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Vogel, D.; Wagner, C.; Ma, L.
Year: 1999
Rhyme and punishment: the creation and enforcement of conventions in an on-line participatory limerick genre
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Erickson, T.
Year: 1999
On rethinking organizational document genres for electronic document management
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Tyrvainen, P.; Paivarinta, T.
Year: 1999
Designing an intranet from scratch to sketch: experiences from techniques used in the IDEnet project
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Berndtsson, J.
Year: 1999
Interactional coherence in CMC
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Herring, S.C.
Year: 1999
Visualizing conversation
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Donath, J.; Karahalios, K.; Viegas, F.
Year: 1999
Interactive document retrieval using faceted terminological feedback
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Anick, P.; Tipirneni, S.
Year: 1999
Design of a vision system for identity verification
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Tistarelli, M.; Lagorio, A.; Jentile, M.; Grosso, E.
Year: 1999
Object-oriented thermal placement using an accurate heat model
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Beebe, C.; Carothers, J.D.; Ortega, A.
Year: 1999
Self-timed design: An avenue to complex computer systems
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Senn, E.; Zavidovique, B.
Year: 1999
A hierarchical analysis approach for high performance computing and communication applications
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Hariri, S.; Varshney, P.; Luying Zhou; Haibo Xu; Ghaya, S.
Year: 1999
Market monitoring and leader follower incentive control of ancillary services
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Keyhani, A.; Cruz, J., Jr.; Simaan, M.A.
Year: 1999
An overview of advances in reconfigurable computing systems
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Radunovic, B.
Year: 1999
Hardware/software codesign for FPGA-based systems
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Saul, J.M.
Year: 1999
Dynamic circuit generation for Boolean satisfiability in an object-oriented design environment
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Mencer, O.; Plazner, M.
Year: 1999
A methodical approach for stream-oriented configurable signal processing
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Swanchara, S.; Athanas, P.
Year: 1999
A development system for creating real-time machine vision hardware using field programmable gate arrays
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Drayer, T.H.; Tront, J.G.; Conners, R.W.; Araman, P.A.
Year: 1999
Issues in FPGA-based configurable computer design for operating systems and multimedia applications
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Knezevic, P.; Radunovic, B.; Elhouni, A.
Year: 1999
An extensible formal framework for the specification and verification of an optimistic simulation protocol
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Frey, P.; Radhakrishnan, R.; Wilsey, P.A.; Alexander, P.; Carter, H.W.
Year: 1999
Formalization of a software architecture for embedded systems: a process algebra for SPLICE
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Dechering, P.; Groenboom, R.; de Jong, E.; Udding, J.T.
Year: 1999
Five reasons for scenario-based design
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Carrol, J.M.
Year: 1999
Improving reviews by extended traceability
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Haumer, P.; Pohl, K.; Weidenhaupt, K.; Jarke, M.
Year: 1999
The use of scenarios for organisational requirements generation
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Harker, S.; Eason, K.
Year: 1999
Clinical information systems
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Friedman, R.
Year: 1999
VSDB: a large-scale vascular screening database
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Berndt, D.J.; Jehle, E.; Moore, S.B.
Year: 1999
Hospital information systems quality: a customer satisfaction assessment tool
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Ribiere, V.; LaSalle, A.J.; Khorramshahgol, R.; Gousty, Y.
Year: 1999
Interpreting IS/IT decision support in the UK primary health care system: issues of consumer orientation and structures
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Dhillon, G.; Hackney, R.; McBride, N.; Kesar, S.
Year: 1999
Theory of user acceptance of information technologies: an examination of health care professionals
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Succi, M.J.; Walter, Z.D.
Year: 1999
Integration of medical images into the total hospital information system-experiences at Kochi Medical School
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Kurihara, Y.; Okuhara, Y.; Narita, Y.; Kitazoe, Y.; Sawada, A.; Yoshida, S.
Year: 1999
WAX ActiveLibrary; a tool to manage information overload
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Hanka, R.; O'Brien, C.; Heathfield, H.; Buchan, I.
Year: 1999
Creation of professional networks: an emergent model using telemedicine as a case
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Tanriverdi, H.; Venkatraman, N.
Year: 1999
Breaking the wall: the rise of telemedicine as the new collaborative interface
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Dardelet, B.F.
Year: 1999
An overview of the AKAMAI telemedicine project: a Pacific perspective
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Floro, F.C.; Nelson, R.; Garshnek, V.
Year: 1999
Telemedicine evaluation in the Pacific: overview and status of the AKAMAI Evaluation Initiative
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Garshnek, V.; Hassell, L.H.
Year: 1999
The Theater Telemedicine Prototype Project: multimedia e-mail in the Pacific
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Rasberry, C.
Year: 1999
A study of Web diffusion in travel agencies
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Standing, C.; Borbely, S.; Vasudavan, T.
Year: 1999
The nature of goods and Internet commerce benefit: a preliminary study
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Poon, S.
Year: 1999
Logic for media. The computational media metaphor
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Lechner, U.; Schmid, B.F.
Year: 1999
Constraint programming applications in designing electronic agents: An experimental study
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Wu, D.J.
Year: 1999
Introduction to the minitrack: managing information on the web
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Ting-Peng Liang; Shaw, M.J.P.; Chih-Ping Wei
Year: 1999
Object-oriented Web engineering for large-scale Web service management
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Gaedke, M.; Gellersen, H.-W.; Schmidt, A.; Stegemuller, U.; Kurr, W.
Year: 1999
Evaluating the use of information technology in inter-organizational relationships
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Buxmann, P.; Gebauer, J.
Year: 1999
Electronic intermediaries: trust building and market differentiation
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Clark, T.H.; Ho Geun Lee
Year: 1999
Efficient large-scale access control for Internet/intranet information systems
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Qi Lu; Shang-Hua Teng
Year: 1999
Retrieval of volatile database output through hypermedia applications
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Houben, G.-J.; De Bra, P.
Year: 1999
Using intranets: preliminary results from a socio-technical field study
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Lamb, R.
Year: 1999
Evaluation of workflow management systems using meta models
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:zur Muhlen, M.
Year: 1999
Reengineering organizational structures from within
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Ott, M.; Huth, C.; Nastansky, L.
Year: 1999
Introduction To Modeling Technology And Intelligent Systems Track
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Dolk, D.R.
Year: 1999
Geographic Information System Technology And Decision Support Systems
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Marble, D.F.
Year: 1999
Economic and environmental impact assessment using WAMADSS
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Fulcher, C.; Prato, T.; Barnett, Y.
Year: 1999
GIS-based dynamic traffic congestion modeling to support time-critical logistics
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Miller, H.J.; Yi-Hwa Wu; Ming-Chih Hung
Year: 1999
Web-based access to distributed high-performance geographic information systems for decision support
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Coddington, P.D.; Hawick, K.A.; James, H.A.
Year: 1999
An intelligent solution support system for spatial modelling and decision support
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Gar-On Yeh, A.; Jiming Qiao
Year: 1999
Visual specification, modeling, and illustration of complex systems
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Geiger, C.; Lehrenfeld, G.; Mueller, W.
Year: 1999
Designing a power tool for policy analysts: dynamic actor network analysis
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Bots, P.W.G.; Van Twist, M.J.W.; Van Duin, R.
Year: 1999
Introduction To The 1999 Hicss Minitrack On Logic Modeling
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Kimbrough, S.O.; Nute, D.
Year: 1999
What is default reasoning good for? Applications revisited
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Antoniou, G.; Ghose, A.
Year: 1999
On lean messaging with wrapping and unfolding for E-commerce
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Kimbrough, S.O.; Yao-Hua Tan
Year: 1999
Soft Computing Modelling Technologies And Intelligent Systems Minitrack
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Carlsson, C.
Year: 1999
Five degrees of separation: a human capital model of employment-related decisionmaking in the information technology workforce
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Josefek, R.A., Jr.; Kauffman, R.J.
Year: 1999
The impact of the World Wide Web on idea generation
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Massetti, B.; White, N.H.; Spitler, V.K.
Year: 1999
Knowledge management systems: emerging views and practices from the field
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Alavi, M.; Leider, D.
Year: 1999
Identification of factors affecting the implementation of data warehousing
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Gorver Little, R., Jr.; Gibson, M.L.
Year: 1999
Key issues in achieving data quality and consistency in data warehousing among large organisations in Australia
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Rudra, A.; Yeo, E.
Year: 1999
Critical success factors (CSFs) and the growth of IT in selected geographic regions
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Khandelwal, V.K.; Ferguson, J.R.
Year: 1999
Improving process performance through market network redesign: a study of the impact of electronic markets in the financial securities sector
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Toppen, R.; Smits, M.; Ribbers, P.
Year: 1999
Market Technostructure
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Clemons, E.K.; Schwartz, R.A.; Weber, B.W.
Year: 1999
Information Technology In Developing Countries
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Davison, R.; Harris, R.; Vogel, D.; de Vreede, G.
Year: 1999
Implementation of information technology in developing countries: experiences of a Mongolian Internet service provider
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Enns, H.G.; Huff, S.L.
Year: 1999
Developing a Web-based object-oriented multimedia medical system
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Aluen, M.; Arrechedera, H.; Matteo, A.; Metzner, C.
Year: 1999
The impact of technology on Ireland's economic growth and development: lessons for developing countries
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Tallon, P.P.; Kraemer, K.L.
Year: 1999
Cultivating a research discipline for IT in developing countries (ITDC)
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Harris, R.; De Vreede, G.-J.; Davison, R.; Vogel, D.
Year: 1999
The relation between outsourcing and the return from corporate IT spending: perceptions from practitioners
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Senn, J.A.; Gefen, D.
Year: 1999
Implementation predictors of formal information technology strategy
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Gottschalk, P.
Year: 1999
Methods And Tools For Information Systems Development Introduction To Minitrack
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Hevner, A.R.; Linger, R.C.
Year: 1999
Enterprise resource planning: a business approach to systems development
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Gibson, N.; Holland, C.P.; Light, B.
Year: 1999
Emergent algorithms-a new method for enhancing survivability in unbounded systems
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Fisher, D.A.; Lipson, H.F.
Year: 1999
Strategic And Competitive Information Systems
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Clemons, E.K.; Weber, B.W.
Year: 1999
Real options for risk management in information technology projects
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Chatterjee, D.; Ramesh, V.C.
Year: 1999
Selecting the appropriate organizational design for the modern global firm: interaction among product design, environment, and technology
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Clemons, E.K.; Dandridge, J.; Carney, B.; Flynn, D.
Year: 1999
Rosenbluth International: strategic transformation of a successful enterprise
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Clemons, E.K.; Il-Horn Hann
Year: 1999
Capturing community and program information to induce and support grassroots entrepreneurship
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Furino, A.; Gibson, D.V.; McCloskey, L.; Treadwell, H.; Baker, Q.
Year: 1999
The adoption and impact of EDI in Dutch SMEs
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Van Heck, E.; Ribbers, P.M.
Year: 1999
Organizational back ups: reconfiguring technology in a telemediated environment
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Faia-Correia, M.; Patriotta, G.; Brigham, M.; Corbett, J.M.
Year: 1999
Introduction To The Trends In Outsourcing Of Information Systems Minitrack
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Aubert, B.A.; Rivard, S.
Year: 1999
Analyzing IT outsourcing relationships as alliances among multiple clients and vendors
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Gallivan, M.J.; Wonseok Oh
Year: 1999
Information technology outsourcing: conceptualizing practice in the public and private sector
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Hancox, M.; Hackney, R.
Year: 1999
Managing the risk of IT outsourcing
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Aubert, B.A.; Dussault, S.; Patry, M.; Rivard, S.
Year: 1999
Minitrack on distributed cooperative work environments
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Ferscha, A.
Year: 1999
An inclusive and extensible architecture for electronic brokerage
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Hands, J.; Bessonov, M.; Patel, A.; Smith, R.
Year: 1999
Focusing on mobility
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Bergner, K.; Grosu, R.; Rausch, A.; Schmidt, A.; Scholz, P.; Broy, M.
Year: 1999
T Spaces: the next wave
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Lehman, T.J.; McLaughry, S.W.; Wyckoff, P.
Year: 1999
A generic, distributed and scalable multimedia information management framework using CORBA
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Szentivanyi, G.; Kourzanov, P.
Year: 1999
On metrics for the dynamic load balancing of optimistic simulations
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:El-Khatib, K.; Tropper, C.
Year: 1999
Synchronisation primitives for highly parallel discrete event simulations
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Kerridge, J.; Welch, P.; Wood, D.
Year: 1999
Software agent communities
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Pancerella, C.; Unruh, A.
Year: 1999
Properties and models of software agents and prefabrication for agent application systems
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Horn, E.; Kupries, M.; Reinke, T.
Year: 1999
Agent Communication Languages for information-centric agent communities
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Nodine, M.; Chandrasekara, D.
Year: 1999
Making behaviour a concrete architectural concept
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Buhr, R.J.A.
Year: 1999
Object-oriented architecture measures
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Miller, B.K.; Pei Hsia; Chenho Kung
Year: 1999
Development of an optimizing compiler for a Fujitsu fixed-point digital signal processor
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:S.P. Rajan; M. Fujita; A. Sudarsanam; S. Malik
Year: 1999
An ASIP design methodology for embedded systems
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Kucukcakar, K.
Year: 1999
An MPEG-2 decoder case study as a driver for a system level design methodology
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:P. van der Wolf; P. Lieverse; M. Goel; D. La Hei; K. Vissers
Year: 1999
Timed executable system specification of an ADSL modem using a C++ based design environment: A case study
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:D. Desmet; M. Esvelt; P. Avasare; D. Verkest; H. De Man
Year: 1999
Flexible design of SPARC cores: a quantitative study
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:T. Bautista; A. Nunez
Year: 1999
The case for a configure-and-execute paradigm
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:F. Vahid; T. Givargis
Year: 1999
Fast prototyping: a system design flow for fast design, prototyping and efficient IP reuse
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:F. Pogodalla; R. Hersemeule; P. Coulomb
Year: 1999
Using codesign techniques to support analog functionality
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:F.G. Wolff; M.J. Knieser; D.J. Weyer; C.A. Papachristou
Year: 1999
Iterative cache simulation of embedded CPUs with trace stripping
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Z. Wu; W. Wolf
Year: 1999
A unified formal model of ISA and FSMD
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Zhu, J.; Gajski, D.D.
Year: 1999
Graph based communication analysis for hardware/software codesign
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Knudsen, P.V.; Madsen, J.
Year: 1999
Communication refinement in video systems on Ohio
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Brunel, J.-Y.; de Kock, E.A.; Kruijtzer, W.M.; Kenter, H.J.H.N.; Smits, W.J.M.
Year: 1999
A hardware-software cosynthesis technique based on heterogeneous multiprocessor scheduling
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Hyunok Oh; Soonhoi Ha
Year: 1999
Embedded system synthesis under memory constraints
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:J. Madsen; P. Bjorn-Jorgensen
Year: 1999
Packaging trends for semiconductor lasers for DWDM-applications
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Vreeburg, C.G.M.; Groeneveld, C.M.
Year: 1999
Challenges in the design and packaging of optical amplifiers for DWDM lightwave networks
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Tench, R.E.
Year: 1999
Tunable WDM add/drop components in silicon-oxynitride waveguide technology
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Offrein, B.J.; Horst, F.; Bona, G.-L.; Germann, R.; Salemink, H.W.M.
Year: 1999
Novel fast cure and reworkable underfill materials
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Tong, Q.; Ma, B.; Savoca, A.; Nguyen, L.; Fine, P.; Cobb, B.
Year: 1999
Development of underfill material with high valued performance
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Wada, M.
Year: 1999
Low cost flip chip processing and reliability of fast-flow, snap-cure underfills
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Houston, P.N.; Baldwin, D.F.; Deladisma, M.; Crane, L.N.; Konarski, M.
Year: 1999
Polymer thick film materials for integral resistors
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Xiao, A.Y.; Tong, Q.K.; Savoca, A.C.
Year: 1999
Highly reliable embedded thin film resistors in Cu/PI MCM-Ds for aerospace applications
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Coates, K.L.; Chien, C.-P.; Hsiao, Y.-Y.R.; Kovach, D.J.; Tanielian, M.H.
Year: 1999
Integrated thin film capacitors: interfacial control and implications on fabrication and performance
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Ramesh, S.; Huang, C.; Shurong Liang; Giannelis, E.P.
Year: 1999
Are we over designing for solder joint reliability? Field vs. accelerated conditions, realistic vs. specified requirements
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Syed, A.; Doty, M.
Year: 1999
Board-level characterization of 1.0 and 1.27 mm pitch PBGA for automotive under-hood applications
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Mawer, A.; Vo, N.; Johnson, Z.; Lindsay, W.
Year: 1999
Effect of electroless Ni/immersion Au plating parameters on PBGA solder joint attachment reliability
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Zequn Mei; Johnson, P.; Kaufmann, M.; Eslambolchi, A.
Year: 1999
Fatigue life prediction of flip-chips in terms of nonlinear behavior of solder and underfill
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Zhengfang Qian; Minfu Lu; Sheng Liu
Year: 1999
Development of BGA solder joint vibration fatigue life prediction model
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Wong, T.E.; Reed, B.A.; Cohen, H.M.; Chu, D.W.
Year: 1999
Chip on chip (COC) and chip on board (COB) assembly on flex rigid printed circuit assemblies
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Ganasan, J.R.
Year: 1999
Flow modeling and visualization of the transfer molding of plastic ball grid array packages
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Nguyen, L.T.; Quentin, C.G.; Lee, W.W.
Year: 1999
Passive alignment optical subassemblies for military/aerospace fiber-optic transmitter/receiver applications
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Beranek, M.W.; Chan, E.Y.; Chen, C.C.; Davido, K.W.; Hager, H.E.; Hong, C.S.; Koshinz, D.G.; Rassaian, M.; Soares, H.P., Jr; St. Pierre, R.L.; Anthony, P.J.; Cappuzzo, M.A.; Gates, J.V.; Gomez, L.T.; Henein, G.E.; Shmulovich, J.; Occhionero, M.A.; Fennessy, K.P.
Year: 1999
Design and manufacturability issues of a co-packaged DFB/MZ module
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Anderson, K.
Year: 1999
Performance of an SC duplex transceiver for 2.5 Gbit/s with clock and data recovery
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Gee, S.; Rookes, C.; Schmitt, N.; Ring, W.S.; Tremaine, R.; Rayson, M.; Vaughan, B.; Park, C.; Clark, D.
Year: 1999
High performance 10 Gb/s PIN and APD optical receivers
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Rue, J.; Itzler, M.; Agrawal, N.; Bay, S.; Sherry, W.
Year: 1999
Improvement of cost-effective optical module for optical access system
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Tanaka, H.; Tsumori, M.; Ichihara, J.; Kitajima, H.
Year: 1999
Flip-chip package with a heat spreader for high power dissipation LSI chips
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Ando, H.; Kikuchi, H.; Sato, T.
Year: 1999
Flip chip package design optimization
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Shenoy, J.N.; Dandia, S.
Year: 1999
Heat spreader attach: a microprocessor thermal solution
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Starr, O.; Master, R.N.; Khan, M.Z.; Tain, A.; Ding, D.H.; Juwanda, A.
Year: 1999
Flip-chip BGA applied high-density organic substrate
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Baba, S.; Qiang Wu; Hayashi, E.; Watanabe, M.; Matsushima, H.; Tomita, Y.; Takemoto, Y.
Year: 1999
Impact of solder pad size on solder joint reliability in flip chip PBGA packages
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Mercado, L.; Sarihan, V.; Yifan Guo; Mawer, A.
Year: 1999
Recent advances in flip chip wafer bumping using solder paste technology
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Elenius, P.; Leal, L.; Ney, J.; Stepniak, D.; Shing Yeh
Year: 1999
Integrated circuit packaging with laminated microinterconnect
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Chen, Y.K.; Egbert, W.C.; Kane, D.; Schultz, J.C.
Year: 1999
Pb-free solder alloys for flip chip applications
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Kang, S.K.; Horkans, J.; Andricacos, P.C.; Carruthers, R.A.; Cotte, J.; Datta, M.; Gruber, P.; Harper, J.M.E.; Kwietniak, K.; Sambucetti, C.; Shi, L.; Brouillette, G.; Danovitch, D.
Year: 1999
A testing method and device for intrinsic stress measurement in wafer bumping process
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Yifan Guo; Mitchell, D.; Sarihan, V.; Shun-Meen Kuo; Jung-Kai Lin; Yeung, B.; Lee, T.; Dawei Zheng
Year: 1999
Simulating underfill flow for microelectronics packaging
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Iwamoto, N.; Nakagawa, M.; Mustoe, G.G.W.
Year: 1999
Non-Fickian moisture properties characterisation and diffusion modeling for electronic packages
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Wong, E.H.; Chan, K.C.; Lim, T.B.; Lam, T.F.
Year: 1999
Mechanical stress reduction in heat sink bond layers-a numerical feasibility study
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Achour, M.F.B.; Bar-Cohen, A.
Year: 1999
A cooling solution for power amplifier modules in cellular phone applications
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Langari, A.; Hashemi, H.
Year: 1999
Board-level thermal modeling of PBGA and CSP in natural and forced convection
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Lu, A.S.; Prabhu, A.; Jeeves, N.J.; Nguyen, L.T.
Year: 1999
Effect of nonuniform temperature on thermal modeling and strain distribution in electronic packaging
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Wakil, J.; Ho, P.S.
Year: 1999
Mechanisms underlying the unstable contact resistance of conductive adhesives
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Daoqiang Lu; Wong, C.P.; Tong, Q.K.
Year: 1999
Conductive adhesives with stable contact resistance and superior impact performance
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Tong, Q.K.; Markley, D.L.; Frederickson, G.; Kuder, R.; Daoqiang Lu
Year: 1999
Development of novel anisotropic conductive film (ACF)
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Yamaguchi, M.; Asai, F.; Eriguchi, F.; Hotta, Y.
Year: 1999
MU connector system for compact and dense packaging
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Iwano, S.
Year: 1999
Small and efficient connector system
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Shahid, M.A.; Lampert, N.R.; Carlisle, A.W.; Hendrickson, D.A.; Emmerich, D.M.; McNeil, T.E.; George, J.E.
Year: 1999
Compact and durable MT-RJ connector
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Tamaki, Y.; Arikawa, T.; Tanaka, T.; Nishimura, A.; Takizawa, K.
Year: 1999
Injection-molded polish-free 2-ch connectors
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Katsura, H.; Sakurai, W.; Ohtsuka, K.; Ueda, T.; Kakii, T.
Year: 1999
Application of V-groove technology for small form factor connector and transceiver modules
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Berglund, S.; Selli, R.
Year: 1999
Performance comparison of small form factor fiber optic connectors
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Trewhella, J.M.; DeCusatis, C.; Fox, J.
Year: 1999
Solder column interposer for single chip ceramic packaging
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Master, R.N.; Dolbear, T.; Ong, O.T.; Dubey, A.; Yamasaki, K.; Saiki, H.
Year: 1999
Manufacturing ultra fine line PBGA substrates in a PWB factory
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Wilson, J.W.; Sebesta, R.D.; d'Aloisio, A.
Year: 1999
Low-cost, high reliability flip-chip removal for multi-chip modules
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Stalter, K.A.; Jackson, R.A.; Linnell, D.C.
Year: 1999
Solder metallization interdiffusion in microelectronic interconnects
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Zribi, A.; Chromik, R.R.; Presthus, R.; Clum, J.; Teed, K.; Zavalij, L.; DeVita, J.; Tova, J.; Cotts, E.J.
Year: 1999
A solderless interconnect technology for millimeter wave device/circuit assembly
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Choudhury, D.; Lawyer, P.H.; Rensch, D.B.
Year: 1999
Experimental evaluation of effect of global to local interaction on HDI solder joint deformation
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Hua Lu; Chao-Pin Yeh; Jiabin Dai
Year: 1999
Sensitivity analysis of multiconductor transmission lines and optimization for high-speed interconnect circuit design
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Cheng Jiao; Cangellaris, A.C.; Yaghmour, A.; Prince, J.L.
Year: 1999
Microwave model of anisotropic conductive adhesive flip-chip interconnections for high frequency applications
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Myung-Jin Yim; Woonghwan Ryu; Young-Doe Jeon; Junho Lee; Joungho Kim; Kyung-Wook Paik
Year: 1999
Passive SPICE-compatible models of dispersive interconnects
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Pasha, S.; Celik, M.; Cangellaris, A.C.; Prince, J.L.
Year: 1999
Pole-residue formulation for transient simulation of high-speed interconnects using Householder LS curve-fitting techniques
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Elzinga, M.; Virga, K.L.; Li Zhao; Prince, J.L.
Year: 1999
MEG-Array(R) connector, the first ball grid array connector
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Moyer, T.D.; Kopec, J.A.
Year: 1999
Development of burn-in test socket for 0.5 mm 256 pins LGA
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Sakata, M.; Ono, K.; Furusawa, K.
Year: 1999
Shielded differential connector delivers increased bandwidth and signal integrity performance
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Ortega, J.L.; Elco, R.A.
Year: 1999
Characterization and modeling of cables for high-speed data communications applications
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Diepenbrock, J.C.
Year: 1999
Method of achieving excellent APC connector end face parameters using chamfered ferrules
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Contreras, E.; Demangone, D.; Marino, P.; Mentzer, M.; Naghski, D.; Petrillo, N.; Smith, B.; Trostle, B.; Kosiorska, H.
Year: 1999
2 Gbit/s small form factor fiber-optic transceiver for single mode optical fiber
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Sunaga, Y.; Takahashi, R.; Tokoro, T.; Kobayashi, M.
Year: 1999
Manufacturing technique of SFF transceiver
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Kurashima, H.; Go, H.; Tsumura, E.; Inujima, T.; Nishiyama, N.; Mikamura, Y.; Nishie, M.
Year: 1999
High port density MT-RJ transceiver
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Tanaka, T.; Isono, Y.; Watanabe, T.; Ohsawa, M.; Nishimura, A.; Yokosuka, H.
Year: 1999
True Z axis pluggable high speed surface mount small form factor transceivers
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Rowlette, J.R., Sr.; Green, E.T.; Chau, S.P.; Kadar-Kallen, M.A.
Year: 1999
Effects of underfill material properties on the reliability of solder bumped flip chip on board with imperfect underfill encapsulants
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Lau, J.H.; Lee, S.-W.R.; Chang, C.; Ouyang, C.
Year: 1999
Influence of flux selection and underfill selection on the reliability of flip-chips on FR-4
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Feustel, F.; Eckebracht, A.
Year: 1999
Metrology of thin layers in IC packages using an acoustic microprobe: bondline thickness
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Canumalla, S.; Schackmuth, B.P.
Year: 1999
BATEL-ball grid array technologies for advanced telecom applications. I
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Kelly, G.; Schols, G.; Herard, L.; Allard, P.; Van Hoof, W.; Grenier, R.; Smeyers, G.; Altmann, R.; Hayes, T.; Egan, E.; Wuyts, I.
Year: 1999
Chip scale package implementation challenges
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Ghaffarian, R.
Year: 1999
CSP die shrink solution for memory devices [DRAMs]
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Kim, Y.G.; Gamini, N.; Mitchell, C.
Year: 1999
Thermal and electrical performance and reliability results for cavity-up enhanced BGAs
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Hayden, T.F.; Harvey, P.M.; Schueller, R.D.; Clatanoff, W.J.
Year: 1999
Effects of assembly methodology on manufacturing-induced stresses in /spl mu/BGA packages
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Pei-Haw Tsao; Chun-Liang Chen; Yu-Jen Huang; Chender Huang
Year: 1999
Ultra-thin electronic device package
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Chen, K.; Zenner, R.; Arneson, M.; Mountain, D.
Year: 1999
Development of three-dimensional memory die stack packages using polymer insulated sidewall technique
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Hyoung-Soo Ko; Kim, J.S.; Yoon, H.G.; Jang, S.Y.; Cho, S.D.; Paik, K.W.
Year: 1999
Analysis of the performance of integrated inductors (fabricated in MCM-L technology) in RF amplifier applications
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Duffy, M.; O'Reilly, S.; O'Donnell, T.; O Mathuna, S.C.
Year: 1999
Packaging 1000 MIPS for IBM's S/390 G5 server
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Katopis, G.A.; Backer, W.D.; Mazzawy, T.; Stoller, H.
Year: 1999
Palletized approach to large-area thin-film processing-materials, modeling, and measurement
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Variyam, M.N.; Sitaraman, S.K.
Year: 1999
Achieving crack free package through elimination of type II failure
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Chai, T.C.; Chan, K.C.; Wong, E.H.; Fan, X.J.; Lim, T.B.
Year: 1999
The effects of epoxy molding compound composition on the warpage and popcorn resistance of PBGA
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Wen-Li Yang; Yin, D.M.S.
Year: 1999
Flip-chip bonded, back-emitting, microlensed arrays of monolithic vertical cavity lasers and resonant photodetectors
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Coldren, L.A.; Sjolund, O.; Louderback, D.A.; Nakagawa, S.; Hegblom, E.R.
Year: 1999
Packaging of VCSEL arrays for cost-effective interconnects at <10 meters
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Hibbs-Brenner, M.; Lehman, J.; Yue Liu; Johnson, K.; Morgan, R.; Strzelecka, E.; Skogman, R.
Year: 1999
A 100-Gb/s throughput ATM switch MCM with a 320-channel parallel optical I/O interface
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Kawano, R.; Yamanaka, N.; Oki, E.; Yasukawa, S.; Okazaki, K.; Ohki, A.; Usui, M.; Sato, N.; Katsura, K.; Ando, Y.; Kagawa, T.; Hikita, M.
Year: 1999
10-channel optical transmitter module operating over 10 Gb/s based on VCSEL and hybrid integrated silicon optical bench
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Delpiano, F.; Bostica, B.; Burzio, M.; Pellegrino, P.; Pesando, L.
Year: 1999
Flip chip underfill flow characteristics and prediction
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Fine, P.; Cobb, B.; Nguyen, L.
Year: 1999
Mechanical modeling of underfills based on two-phase composites
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Haiying Wang; Zhengfang Qian; Sheng Liu; Jiali Wu; Wong, C.P.; Okuno, A.
Year: 1999
Delamination from process induced sources
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Cheung, A.T.
Year: 1999
The impact of moisture diffusion during solder reflow on package reliability
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Tay, A.A.O.; Lin, T.Y.
Year: 1999
Palladium pre-plated copper leadframe for DRAM LOC packages
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Ji-Cheng Yang; Kian-Chai Lee; Ah-Chin Tan
Year: 1999
Electrical characterization of metal enhanced BGA packages
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Solomon, D.; Del Rosario, E.; Opiniano, E.; Jackson Wong; Pinello, W.
Year: 1999
A capacitor's inductance: critical property for certain applications
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Stevenson, B.; Ewell, G.
Year: 1999
Thin film decoupling capacitors: a high frequency performance analysis
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Schaper, L.W.; Chen, K.Y.; Brown, W.D.; Ang, S.S.; Naseem, H.A.
Year: 1999
Electrical modeling of RFIC packages up to 12 GHz
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Horng, T.S.; Wu, S.M.; Shih, C.
Year: 1999
Package and chip-level EMI/EMC structure design, modeling and simulation
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Diaz-Alvarez, E.; Krusius, J.P.
Year: 1999
Overshoot and undershoot control for transmission line interconnects
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Jaebum Lee; Shragowitz, E.
Year: 1999
The needs, evolution, status and challenges of microelectronics packaging education in the US
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Tummala, R.; Conrad, L.; May, G.
Year: 1999
Globalisation of packaging research, education and further training
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Zerna, T.; Detert, M.
Year: 1999
A course on introduction to electronic packaging
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Rao, N.J.; Ananda Rao, G.
Year: 1999
Multi-media enhancement of teaching electronic packaging education
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Kim, B.C.; Severance, C.
Year: 1999
Global collaborative electronic packaging education
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Tong, P.; Lam, D.C.C.; Yuen, M.M.F.; Kim, J.K.; Lee, R.S.W.; Lee, S.H.K.; Chan, P.
Year: 1999
Compact 1-to-8, double 1-to-4 or fourfold 1-to-2 space switch based on beam steering by a waveguide array
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Horst, F.; Fluck, E.; Offrein, B.J.; Germann, R.; Salemink, H.W.M.; Bona, G.-L.
Year: 1999
Poled polymers for MCMs with integrated dielectric and optical layers
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Mechtel, D.M.; Charles, H.K., Jr.; Francomacaro, A.S.
Year: 1999
Low-loss MTP/sup TM/-based optical backplane interconnect system
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Satake, T.; Keesee, J.; Knight, K.; Hart, L.; Nozawa, T.
Year: 1999
Low-latency skew-compensation circuits for parallel optical interconnections
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Sakamoto, T.; Tanaka, N.; Ando, Y.
Year: 1999
Global/local finite element analysis for singular stress fields near the junction of dissimilar elastic and elastic-plastic materials in electronic packages
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Kay, N.; Madenci, E.; Shkarayev, S.
Year: 1999
Investigation of the underfill delamination and cracking in flip-chip modules under temperature cyclic loading
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Fan, X.J.; Wang, H.B.; Lim, T.B.
Year: 1999
The necessity of reexamining previous life prediction analyses of solder joints in electronic packages
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Anderson, T.; Guven, I.; Madenci, E.; Gustafsson, G.
Year: 1999
Advanced photo integrated circuits in CMOS technology
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Zimmermann, H.; Ghazi, A.; Heide, T.; Popp, R.; Buchner, R.
Year: 1999
Protection of tombstone problems for small chip devices
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Takaki, A.; Kato, R.; Taguchi, T.; Suzuki, R.H.
Year: 1999
Properties and reliability of Ta/sub 2/O/sub 5/ thin films deposited on Ta
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Ezhilvalavan, S.; Tseung-Yuen Tseng
Year: 1999
A novel double p-well lateral emitter switched thyristor
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Zuxin Qin; Sankara Narayanan, E.M.
Year: 1999
Models for internet-delivered courses in electronics packaging
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Wesling, P.
Year: 1999
Progress towards developing a web-based virtual packaging laboratory
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Leigh Light, D.; Elshazly, D.; May, G.S.
Year: 1999
Virtual laboratory support for microelectronics packaging education
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Illyefalvi-Vitez, Z.; Nemeth, P.; Pinkola, J.; Ripka, G.; Ruszinko, M.
Year: 1999
A modular, Internet based, inter-disciplinary course on electronics packaging
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Fillo, J.; Jiayuan Fang; Lehmann, G.; Srihari, H.; Sammakia, B.
Year: 1999
Modeling the power and ground effects of BGA packages
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Caggiano, M.F.; DelGiudice, B.
Year: 1999
Structural design system for thermally enhanced LSI packages
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Yoneda, N.; Kitano, M.; Miura, H.; Shimizu, I.; Koike, N.
Year: 1999
Direct MT(TM)-compatible connectorisation of VCSEL and LED-arrays to plastic optical fiber ribbon for low cost parallel datalinks
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Van Hove, A.; Coosemans, T.; Bockstaele, R.; Vandeputte, K.; Vanwassenhove, L.; Dhoedt, B.; Baets, R.; Van Daele, P.; Van Koetsem, J.; Van Den Torren, L.
Year: 1999
Surface mount type LD module with receptacle structure
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Yamamoto, N.; Kojima, T.; Watanabe, T.; Sasaki, S.; Mesaki, A.; Suzuki, F.; Hakogi, H.; Miura, K.
Year: 1999
Thermal performance and mechanical stress analysis of BGA and flex-CSP using parametric FEA models
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Lall, B.S.
Year: 1999
Post-weld-shift in semiconductor laser packaging
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Wang, S.C.; Chan, H.L.; Wang, C.; Wang, C.M.; Liaw, J.W.; Sheen, M.T.; Kuang, J.H.; Chien, C.P.; Wang, G.L.; Cheng, W.H.
Year: 1999
Post-weld-shift in semiconductor laser packaging
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:S.C. Wang; H.L. Chang; C. Wang; C.M. Wang; J.W. Liaw; M.T. Sheen; J.H. Kuang; C.P. Chien; G.L. Wang; W.H. Cheng
Year: 1999
Optical interconnects by hot embossing for module and PCB technology-the EOCB approach
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Krabe, D.; Scheel, W.
Year: 1999
Low cost solution to thermal enhancement package for plastic encapsulated microcircuits
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Trongjitwikrai, S.; Yansalee, W.; Netpu, S.
Year: 1999
Bare die probing with novel anisotropic conductive film (ACF)
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Kaneto, M.; Asai, F.; Eriguchi, F.; Yamaguchi, M.; Hotta, Y.
Year: 1999
New probe microstructure for full-wafer, contact-probe cards
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Soejima, K.; Kimura, M.; Shimada, Y.; Aoyama, S.
Year: 1999
Multilayer high density flex technology
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Chou, B.; Beilin, S.; Jiang, H.; Kudzuma, D.; Lee, M.; McCormack, M.; Massingill, T.; Peters, M.; Roman, J.; Takahashi, Y.; Wang, V.
Year: 1999
Implementation of and extensions to Darveaux's approach to finite-element simulation of BGA solder joint reliability
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Johnson, Z.
Year: 1999
The effect of mold compounds on warpage in LOC package
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Minjin Ko; Dongsuk Shin; Myungsun Moon; Inhee Lee; Yongjoon Park; Youngkyu Jung; Chijoong Song
Year: 1999
D2CSP (double density CSP): a new solution for high-density packaging
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Kwang-Seong Choi; Ki-Bon Cha; Jong-Hyun Lee; Chang-Kuk Choi
Year: 1999
Early footprint comparison for area I/O packages and first level interconnect
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Hirt, E.; Troster, G.
Year: 1999
Early footprint comparison for area I/0 packages and first level interconnect
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:E. Hirt; G. Troster
Year: 1999
PBGA warpage and stress prediction for efficient creation of the thermomechanical design space for package-level reliability
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Egan, E.; Kelly, C.; Herard, L.
Year: 1999
Scale effect on packaging materials
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Wei Ren; Zhengfang Qian; Sheng Liu
Year: 1999
Fabrication process of copper lead frame chip scale package (LF-CSP)
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Jong Tae Moon; Sung Hak Hong; Seung Wook Yoon; Chang Jun Park; Yoon Hwa Choi; Jae Myun Kim; Jong Hyun Lee; Ja Ryoung Kim; Yo Hwan Koh
Year: 1999
Calculation and validation of thermomechanical stresses in flip chip BGA using the ATC4.2 test vehicle
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Peterson, D.W.; Burchett, S.N.; Sweet, J.N.; Mitchell, R.T.; Luu Nguyen
Year: 1999
Die surface stress variation during thermal cycling and thermal aging reliability tests
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Yida Zou; Suhling, J.C.; Jaeger, R.C.; Shun-Tien Lin; Benoit, J.T.; Grzybowski, R.R.
Year: 1999
Compact, low-crosstalk, WDM filter elements for multimode ribbon fiber data links
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Patel, R.R.; Garrett, H.E.; Emanuel, M.A.; Larson, M.C.; Pocha, M.D.; Krol, D.M.; Deri, R.J.; Lowry, M.E.
Year: 1999
Beyond the endless frontier: the future of research university in the digital age
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Duderstadt, J.J.
Year: 1999
Semantic mediation for cooperative spatial information systems: the AMUN data model
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Leclercq, E.; Benslimane, D.; Yetongnon, K.
Year: 1999
Digital Earth
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Halem, M.; Hoban, S.
Year: 1999
Flow tele-metrology
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Espina, P.I.
Year: 1999
Automation of NIST frequency calibrations at remote sites
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Lombardi, M.A.
Year: 1999
The rebirth of the MMT
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Foltz, C.B.; Williams, J.T.; West, S.C.; Fabricant, D.G.; Martin, H.M.
Year: 1999
Digital techniques for flicker measurement: Algorithms and implementations analysis
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Caldara, S.; Nuccio, S.; Spataro, C.
Year: 1999
Robust and accurate real-time estimation of sensors signal parameters by a DSP approach
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Bertocco, M.; Flammini, A.; Marioli, D.; Taroni, A.
Year: 1999
An outlook on the DSP dynamic error blind correction of the analog part of the measurement channel
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Nabielec, J.
Year: 1999
A multi-DSP based measurement apparatus for on-line testing of MSK wireless data communication devices
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Bucci, G.; Landi, C.; Ocera, G.
Year: 1999
Fuzzy control based frequency synchronization using GPS carrier phase measurements
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Tu, K.-Y.; Chang, F.-R.; Liao, C.-S.; Wang, L.-S.
Year: 1999
The performance of spectral quality measures
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Broersen, P.M.T.
Year: 1999
Future large ground-based telescopes
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Andersen, T.; Ardeberg, A.; Gontcharov, A.; Owner-Petersen, M.
Year: 1999
A new approach for testing MOS circuits based on large defects
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Rauscher, R.; Schutz, B.
Year: 1999
An effective apparatus for at-speed self-testing
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Xiaowei Li; Cheung, P.Y.S.
Year: 1999
Space compression revisited
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Das, S.R.; Barakat, T.F.; Petriu, E.M.; Assaf, M.H.; Chakrabarty, K.
Year: 1999
Ultrasonic technique for imaging welds in copper
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Stepinski, T.; Wu, P.
Year: 1999
Maximum likelihood estimator for jitter noise models
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Vandersteen, G.; Pintelou, R.
Year: 1999
New multisymbol multifrequency signals for identification of a linear system with non-linear distortion
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:El-Fandi, M.; McGhee, J.; Henderson, I.A.; McGlone, P.
Year: 1999
Sensing strategies and performance assessment for a flexible manipulator
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Guoli Wang; Youfu Li; Weiliang Xu
Year: 1999
System identification techniques for simulating fire detector signals
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Derbel, F.; Horn, M.; Trankler, H.-R.
Year: 1999
System identification using identification patterns
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Henderson, I.A.; Jackowska-Strummillo, L.; McGhee, J.; McGlone, P.; Sankowski, D.
Year: 1999
Practical choices in the FRF measurement in presence of nonlinear distortions
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Dobrowiecki, T.P.; Schoukens, J.
Year: 1999
Permittivity tomographic characterization of dielectric materials vs. partial discharge activity
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:D'Antona, G.; Lazzaroni, M.
Year: 1999
Uncertainty characterization in image based measurements: a preliminary discussion
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:De Santo, M.; Liguori, C.; Pietrosanto, A.
Year: 1999
The Hubble Space Telescope
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Macchetto, F.D.
Year: 1999
Disturbances of data acquisition system caused by frequency converters
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Firczyk, W.; Korczynski, M.J.
Year: 1999
Dry calibration procedure of electromagnetic flowmeter for open channels
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Michalski, A.
Year: 1999
A multiscale method for 1/f noise modeling: application to linear prediction
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Soltani, S.; Simard, P.; Boichu, D.
Year: 1999
Leakage reduction in measurement data contaminated with 50 Hz mains and harmonic frequency components
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Verbeeck, J.; Rolain, Y.; Pintelon, R.
Year: 1999
System identification via hybrid FIR-IIR adaptive filtering
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Pasquato, L.; Kale, I.
Year: 1999
Broadband versus stepped sine FRF measurements
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Schoukens, J.; Pintelon, R.; Rolain, Y.
Year: 1999
Identification of continuous-time systems with missing data
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Pintelon, R.; Schoukens, J.
Year: 1999
Automated qualitative description of measurements
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Ruspini, E.H.; Zwir, I.S.
Year: 1999
Adaptive optics projects
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Ragazzoni, R.
Year: 1999
Average power estimation under nonsinusoidal conditions
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Carbone, P.; Petri, D.
Year: 1999
A novel optical device with wide bandwidth wavelength-conversion, and an optical sampling experiment using this device
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Furukawa, H.; Yoshidaya, H.; Takakura, H.; Kuroda, K.
Year: 1999
New design of optical current sensor for sensitivity improvement
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Yi, B.; Chu, B.C.B.; Chiang, K.S.
Year: 1999
3D optical whole-field range sensor: development of procedures for the automatic set-up of the measurement and the calibration of the system
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Sensoni, G.
Year: 1999
Error analysis of an optical current transducer operating with a digital signal processing system
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Niewczas, P.; Cruden, A.; Michie, W.C.; Madden, W.I.; McDonald, J.R.
Year: 1999
Analysis of roughly quantized Gaussian signals
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Chiorboli, G.; Fontanili, M.
Year: 1999
A time domain error measure for resampled irregular data
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:de Waele, S.; Broersen, P.M.T.
Year: 1999
Compiler support for interval arithmetic
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Schulte, M.J.; Akkas, A.; Zelov, V.A.; Burley, J.C.
Year: 1999
Signal switching in automated test system for the transfer function characterization
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Manuel, A.; Roset, X.; Gomez, J.; Garrido, A.; Carlosena, A.; Romos, R.
Year: 1999
On-line frequency domain system identification based on a virtual instrument
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Nemeth, J.G.; Vargha, B.; Kollar, I.
Year: 1999
The optics of Galileo Telescope: alignment and active optics preliminary results
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Adriano, G.; Fabio, B.; Enrico, M.; Daniele, G.; Roberto, R.; Claudio, P.
Year: 1999
Oscillator-based interface for measurand-plus-temperature readout from resistive bridge sensors
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Ferrari, V.; Marioli, D.; Taroni, A.
Year: 1999
New passive sensors
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Pohl, A.; Reindl, L.
Year: 1999
3D position measurement based on force sensors for a one-wire haptic interface
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Arcara, P.; Melchiorri, C.
Year: 1999
Composite real-time image processing for railways track profile measurement
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Alippi, C.; Casagrande, E.; Scotti, F.; Piuri, V.
Year: 1999
Anti-aliasing analog low pass filter transfer function parametric spectral estimation for digital compensation
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:D'Antona, G.; Di Rienzo, L.; Ottoboni, R.
Year: 1999
Frequency noise measurements of 1.5 /spl mu/m erbium lasers against molecular and Fabry-Perot reference lines
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Svelto, C.; Galzerano, G.; Taccheo, S.; Laporta, P.; Bava, E.
Year: 1999
Temperature characterisation of material using SAW
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Benech, P.; Dali-Ali, M.; Keradec, J.P.
Year: 1999
Temperature controlled oven for low noise measurement systems
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Ciofi, C.; Ciofi, I.; Di Pascoli, S.; Neri, B.
Year: 1999
Progress in CMOS integrated measurement systems
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Baltes, H.; Brand, O.
Year: 1999
A CMOS image sensor with motion vector estimator for low-power image compression
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Kawahito, S.; Handoko, D.; Tadokoro, Y.
Year: 1999
An integrated microsystem for 3D magnetic field measurements
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Malcovati, P.; Maloberti, F.
Year: 1999
An ASIC for multichannel data acquisition systems [and application to ESCA]
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Aizza, A.; Bernacchia, G.; Carrato, S.; Marsi, S.; Cautero, G.; Tommasini, R.
Year: 1999
Combined detection of respiratory and cardiac rhythms disorders by high resolution differential cuff pressure measurement
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Dupuis, P.; Eugene, C.
Year: 1999
Testing microwave devices under different source impedances: a novel technique for on-line measurement of source and device reflection coefficients
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Madonna, G.L.; Pirola, M.; Pisani, U.
Year: 1999
Active Q factor improvement of microstrip antenna
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Zolghadri, M.; Akyel, C.
Year: 1999
Requirements for motion estimation in image sequences for traffic applications
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Van Leeuwen, M.B.; Groen, F.C.A.; Dev, A.
Year: 1999
Image compression based on fast adaptive resampling on a Hilbert-Peano curve
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Marusic, B.; Kale, I.; Tasic, J.
Year: 1999
A novel collector for imaging detector applications
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Giakos, G.C.
Year: 1999
Computerized device with CCD camera for measurement of surface tension and wetting angle in solid-liquid systems
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Sankowski, D.; Strzecha, K.; Jezewski, S.; Senkara, J.; Lobodzinski, W.
Year: 1999
Design of a wireless communications module for telemetry in civil infrastructure monitoring
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Iraqi, A.; Barwicz, A.; Mermelstein, P.; Morawski, R.Z.; Bock, W.
Year: 1999
An in-service measurement system for the quality analysis of facsimile transmissions
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Bertocco, M.; Narduzzi, C.; Paglierani, P.; Rizzi, E.
Year: 1999
Microgravity Acceleration Measurement System for the International Space Station
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Rice, J.E.; Fox, J.C.; Lange, W.G.; Dietrich, R.W.; Wagar, W.O.
Year: 1999
Frequency-weighting filter selection, for H/sub 2/ control of microgravity isolation systems: a consideration of the "implicit frequency weighting" problem
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Hampton, R.D.; Whorton, M.S.
Year: 1999
Magnetic field sensor by giant magneto-impedance
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Hauser, H.; Nicolics, J.; Pohl, A.
Year: 1999
Optimised CdTe sensors for measurement of electric and magnetic fields in the near field region
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Cecelja, F.; Balachandran, W.
Year: 1999
Optimization of integrated magnetic sensor by mixed signal processing
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Trontelj, J.
Year: 1999
A switched-capacitor interface for differential capacitance transducers
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Watanabe, K.; Ogawa, S.; Oisugi, Y.; Kondo, K.
Year: 1999
Automatic micromanipulation system using stereoscopic microscope
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Sano, T.; Nagahata, H.; Yamamoto, H.
Year: 1999
A method for reducing fouling at the sensor-sample interface
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Gregory, C.M.; Hatfield, J.V.; Higgins, S.; Vadgama, P.J.
Year: 1999
Feature extraction with time series models: application to lung sounds
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Broersen, P.M.T.; de Waele, S.
Year: 1999
Metrological characterisation for the quality of the measurement process in a structural monitoring system
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Iuculano, G.; Catelani, M.; de Mauro, S.; Fissi, S.
Year: 1999
Quantitative velocity field measurements in reduced-gravity combustion science and fluid physics experiments
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Greenberg, P.S.; Wernet, M.P.
Year: 1999
A high-sensitivity particle monitor using an integration sphere
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Yamaguchi, T.; Watanabe, K.; Nakayama, M.; Yi-Zhu Gao; Nagasawa, T.; Ozawa, T.
Year: 1999
Hybrid neural network for gas analysis measuring system
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Osowski, S.; Brudzewski, K.
Year: 1999
Resonant magnetic field microsensors in standard CMOS technology
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Baglio, S.; Latorre, L.; Nouet, P.
Year: 1999
Switched current interface circuit for capacitive micromachined accelerometer
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Rubio, C.; Ruiz, O.; Bota, S.; Samitier, J.
Year: 1999
Influence of multipath fading on the implementation of a radio sensor as an isolated station on a Web CAN-based control systems
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Hasnaoui, S.; Bouallegue, A.
Year: 1999
Instrument for the measurement of the instantaneous frequency
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Carlosena, A.; Macua, C.; Zivanovic, M.
Year: 1999
A new method for sensor fault detection, isolation and accommodation
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Yong Liu; Yi Shen; Hengzhang Hu
Year: 1999
Signal interpretation for monitoring and diagnosis, a cooling system testbed
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Manders, E.J.; Biswas, G.; Mosterman, P.J.; Barford, L.; Ram, V.; Barnett, J.
Year: 1999
A low-cost diagnostic tool for stepping motors
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Flammini, A.; Marioli, D.; Taroni, A.
Year: 1999
A digitally controlled wideband precision electronic attenuator
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Massey, S.; Johnson, B.
Year: 1999
Investigation on the limit quantization error for a general case of a three-voltage measurement method for ratiometric output sensors
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Gawedzki, W.; Jurkiewicz, J.
Year: 1999
Digit-serial design of a wave digital filter
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Ming Hu; Vainio, O.; Renfors, M.
Year: 1999
Filter circuits synthesis with CFOA-based differentiators
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Palumbo, G.; Pennisi, S.
Year: 1999
RLS adaptive predictor-enhanced differentiation
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Vainio, O.
Year: 1999
Simple genetic algorithm applied to the analysis of human respiratory transfer impedance data
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Tomalax, W.; Radinski, J.
Year: 1999
Computer assisted treated for motor speech disorders
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Awad, S.S.; Coreless, M.W.; Merson, R.
Year: 1999
The effect of electric-field bending on the linearity of capacitive position sensors with various electrode structures
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Xiujun Li; de Jong, G.; Meijer, G.C.M.
Year: 1999
Effects of the size of the measured surface on the performance of an air cone-jet sensor for in-process inspection
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Tuqiang Xie; Qingping Yang; Jones, B.E.; Haizhuang Kang; Butler, C.
Year: 1999
A fusion toolbox for sensor data fusion in industrial recycling
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Karlsson, B.; Jarrhed, J.-O.; Wide, P.
Year: 1999
A new UWB-principle for sensor-array application
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Sachs, J.; Peyerl, P.; Rossberg, M.
Year: 1999
A new adaptive analog test and diagnosis system
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Cota, E.F.; Negreiros, M.; Carro, L.; Lubaszewski, M.
Year: 1999
A built-in current sensor for testing analog circuit blocks
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Tabatabaei, S.; Ivanov, A.
Year: 1999
On the issues of oscillation test methodology
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Wong, M.W.T.
Year: 1999


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