Changes along the electronics value chain GÇö Packaging as a key enabler
Publisher: International Microelectronics Assembly and Packaging Society (IMAPS)
Authors:Michael Alexander
Year: 2015
Document Type:
Industry consortium for new era of automotive electronics with entire system-on-package vision at Georgia Tech
Publisher: International Microelectronics Assembly and Packaging Society (IMAPS)
Authors:Rao Tummala; Klaus-Juergen Wolter; Venky Sundaram; Vanessa Smet; Pulugurtha M. Raj
Year: 2015
Document Type:
Future 2050 - The most important technologies in the decades to come
Publisher: International Microelectronics Assembly and Packaging Society (IMAPS)
Authors:Ulrich Eberl
Year: 2015
Document Type:
Investigation of fracture mechanisms and bond-line of insert bump bonding specimens
Publisher: International Microelectronics Assembly and Packaging Society (IMAPS)
Authors:Jae Hak Lee; Jun Yeob Song; Tae Ho Ha; Chang Woo Lee; Seung Man Kim; Yong Jin Kim; Young Kang Lee
Year: 2015
Document Type:
Wire bonding of Au-coated Ag wire: Bondwire properties, bondability and IMCs formation
Publisher: International Microelectronics Assembly and Packaging Society (IMAPS)
Authors:Yi-Wei Tseng; Fei-Yi Hung; Truan-Sheng Lui
Year: 2015
Document Type:
Bump scaling and shear test requirements
Publisher: International Microelectronics Assembly and Packaging Society (IMAPS)
Authors:Rene Zingg
Year: 2015
Document Type:
Isotropic conductive paste based on epoxy with Ag coated Cu and SAC305 solder
Publisher: International Microelectronics Assembly and Packaging Society (IMAPS)
Authors:Yong-Sung Eom; Hak-Son Lee; Hyun-Cheol Bae; Kwang-Seong Choi; Jin-Ho Lee
Year: 2015
Document Type:
Reliability prediction for textile packages
Publisher: International Microelectronics Assembly and Packaging Society (IMAPS)
Authors:Hartmann Hieber
Year: 2015
Document Type:
Influence of the PCB attachment on the mechanical properties in modal analysis
Publisher: International Microelectronics Assembly and Packaging Society (IMAPS)
Authors:Boleslav Psota; Alexandr Otahal; Ivan Szendiuch
Year: 2015
Document Type:
A crack propagation analysis of multilayer ceramic capacitors
Publisher: International Microelectronics Assembly and Packaging Society (IMAPS)
Authors:Joseph Al Ahmar; Steffen Wiese
Year: 2015
Document Type:
Conformal barrier/seed layers deposition for voids free copper electroplating in high aspect ratio TSV
Publisher: International Microelectronics Assembly and Packaging Society (IMAPS)
Authors:Susu Yang; Wan Cheng; Heng Wu; Chongshen Song; Wenqi Zhang
Year: 2015
Document Type:
Functional surface coating of screens and stencils for thick film application
Publisher: International Microelectronics Assembly and Packaging Society (IMAPS)
Authors:Ralf Weber
Year: 2015
Document Type:
Design, setup and test of a heterogeneous module and characterization by stress measurement
Publisher: International Microelectronics Assembly and Packaging Society (IMAPS)
Authors:Thomas Schreier-Alt; Claus Reitlinger; Franz Kaul; Thomas Metzger; Kees Revenberg
Year: 2015
Document Type:
WiCkeD tool-based design method for divide-by-2 circuits with multiple loads
Publisher: International Microelectronics Assembly and Packaging Society (IMAPS)
Authors:Agord de Matos Pinto; Raphael Ronald Noal Souza; Yuzo Iano; Leandro Tiago Manera
Year: 2015
Document Type:
System I/O optimization with SoC, SiP, PCB co-design
Publisher: International Microelectronics Assembly and Packaging Society (IMAPS)
Authors:Humair Mandavia; Kazunari Koga; Ralf Bruning; Nikola Kontic
Year: 2015
Document Type:
Thermal considerations for systems with high speed memories
Publisher: International Microelectronics Assembly and Packaging Society (IMAPS)
Authors:Andy Heinig; Dimitrios Papaioannou; Robert Fischbach
Year: 2015
Document Type:
Cost-effective thermoelectric cooler packaging using hybrid Cu paste
Publisher: International Microelectronics Assembly and Packaging Society (IMAPS)
Authors:Hyun-Cheol Bae; Yong-Sung Eom; Aesun Oh; Haksun Lee; Kwang-Seong Choi; Seung Eon Moon; Jin Ho Lee
Year: 2015
Document Type:
Temperature stabilized chip expander
Publisher: International Microelectronics Assembly and Packaging Society (IMAPS)
Authors:Michal Reznicek; Martin Bursik; Jaroslav Jankovsky; Vaclav Simek; Richard Ruzicka
Year: 2015
Document Type:
Investigation on the suitability of electrically conductive adhesives for die-attachment of power devices
Publisher: International Microelectronics Assembly and Packaging Society (IMAPS)
Authors:Eike Moller; Lars Middelstadt; Folkhart Grieger; Andreas Lindemann; Jurgen Wilde
Year: 2015
Document Type:
Impact strength of Sn-58mass%Bi/Cu joints by laser process
Publisher: International Microelectronics Assembly and Packaging Society (IMAPS)
Authors:Hiroshi Nishikawa; Sinya Kubota
Year: 2015
Document Type:
Lapping and polishing of different LTCC substrates for thin film applications
Publisher: International Microelectronics Assembly and Packaging Society (IMAPS)
Authors:Nam Gutzeit; Michael Fischer; Heike Bartsch; Jens Muller
Year: 2015
Document Type:
Fabrication of elastic bumps and narrow metal patterning for Si-based flexible electronics
Publisher: International Microelectronics Assembly and Packaging Society (IMAPS)
Authors:Joon Yub Song; Yongjin Kim; Jae Hak Lee; Seung Man Kim; Ju Yong Lee; Chang Woo Lee; Tae Ho Ha
Year: 2015
Document Type:
Improved CFD analysis of wave soldering in pin through-hole technology
Publisher: International Microelectronics Assembly and Packaging Society (IMAPS)
Authors:Adam Yuile; Steffen Wiese; Heinz Wohlrabe
Year: 2015
Document Type:
Electrical tensile test
Publisher: International Microelectronics Assembly and Packaging Society (IMAPS)
Authors:Hao-Wen Hsueh; Fei-Yi Hung; Truan-Sheng Lui; Li-Hui Chen
Year: 2015
Document Type:
Development of a new piezoelectric sensor to measure loads
Publisher: International Microelectronics Assembly and Packaging Society (IMAPS)
Authors:Sophie Engelsberger; Anton Harasim; Tobias Schmidt
Year: 2015
Document Type:
Large area, transparent heaters based on carbon nanotubes and graphene platelets for heated glass application
Publisher: International Microelectronics Assembly and Packaging Society (IMAPS)
Authors:Grzegorz Wroblewski; Marcin Sloma; Daniel Janczak; Lucja Sarapuk-Dybowska; Malgorzata Jakubowska
Year: 2015
Document Type:
Plasma dicing for thin wafers
Publisher: International Microelectronics Assembly and Packaging Society (IMAPS)
Authors:Reinhard Windemuth
Year: 2015
Document Type:
Ultra-thin high density capacitors for advanced packaging solutions
Publisher: International Microelectronics Assembly and Packaging Society (IMAPS)
Authors:Konrad Seidel; Mathias Bottcher; Stefan Dobritz; Malte Czernohorsky; Stefan Riedel; Wenke Weinreich
Year: 2015
Document Type:
Development of a statistical approach for DNA-based nanowires electrical study
Publisher: International Microelectronics Assembly and Packaging Society (IMAPS)
Authors:Christophe Brun; Cheikh Tidiane-Diagne; Corentin Carmignani; Simona Torrengo; Pierre-Henri Elchinger; Patrick Reynaud; Aurelie Thuaire; Severine Cheramy; Didier Gasparutto; Raluca Tiron; Arianna Filoramo; Xavier Baillin
Year: 2015
Document Type:
Advanced interposers with metalized through via
Publisher: International Microelectronics Assembly and Packaging Society (IMAPS)
Authors:Satoru Kuramochi; Sumio Koiwa; Takamasa Takano; Miyuki Akazawa; Hiroshi Mawatari; Kousuke Suzuki; Yoshitaka Fukuoka
Year: 2015
Document Type:
Thermally enhanced FOWLP-development of a power-eWLB demonstrator
Publisher: International Microelectronics Assembly and Packaging Society (IMAPS)
Authors:Andre Cardoso; Mariana Pires; Raquel Pinto; Steffen Kroehnert; Gusztav Hantos
Year: 2015
Document Type:
Cutting the cost of packaging with nanoceramic substrates
Publisher: International Microelectronics Assembly and Packaging Society (IMAPS)
Authors:Giles Humpston
Year: 2015
Document Type:
Quantifying the thermal conductivity enhancement of percolating thermal underfills
Publisher: International Microelectronics Assembly and Packaging Society (IMAPS)
Authors:Brian R. Burg; J. Zurcher; G. Schlottig; X. Chen; T. Brunschwiler
Year: 2015
Document Type:
"Non-piercing" GÇö A must for flip chips!
Publisher: International Microelectronics Assembly and Packaging Society (IMAPS)
Authors:Ingolf Schlosser
Year: 2015
Document Type:
Ni-Sn solid-liquid interdiffusion (SLID) bonding for thermo-electric elements in extreme environments — FEA of the joint stress
Publisher: International Microelectronics Assembly and Packaging Society (IMAPS)
Authors:Andreas Larsson; Torleif A. Tollefsen; Ole Martin Lovvik; Knut E. Aasmundtveit
Year: 2015
Document Type:
Analysis of soldering processes using in-situ X-Ray observations
Publisher: International Microelectronics Assembly and Packaging Society (IMAPS)
Authors:Alexander Klemm; Martin Oppermann; Thomas Zerna
Year: 2015
Document Type:
Assembly and packaging of micro systems by using reactive bonding processes
Publisher: International Microelectronics Assembly and Packaging Society (IMAPS)
Authors:Axel Schumacher; Ulrike Gais; Stephan Knappmann; Georg Dietrich; Stefan Braun; Erik Pflug; Frank Roscher; Klaus Vogel; Silvia Hertel; Dirk Kahler; Wolfgang Reinert
Year: 2015
Document Type:
Challenges of wafer-level MEMS packaging
Publisher: International Microelectronics Assembly and Packaging Society (IMAPS)
Authors:Sebastian Schuler-Watkins; Ralf Reichenbach; Uwe Hansen
Year: 2015
Document Type:
Flexible packaging by film assisted molding for microintegration of MEMS based sensors
Publisher: International Microelectronics Assembly and Packaging Society (IMAPS)
Authors:Daniel Hera; Jan Dirk Schulze Spuntrup; Thomas Gunther; Christine Harendt; Armin Berndt; Christian Reuter; Karl-Peter Fritz; Heinz Kuck; Andre Zimmermann
Year: 2015
Document Type:
Flip-chip MEMS microphone package with small front-volume and large back-volume
Publisher: International Microelectronics Assembly and Packaging Society (IMAPS)
Authors:Sebastian Walser; Christian Siegel; Matthias Winter; Michael Loibl; Wolfgang Pahl; Anton Leidl; Gregor Feiertag
Year: 2015
Document Type:
Influence of sensor-package hermeticity-level on long-term drift for a piezoresistive MEMS pressure-sensor
Publisher: International Microelectronics Assembly and Packaging Society (IMAPS)
Authors:Asmund Sandvand; Einar Halvorsen; Knut E. Aasmundtveit; Henrik Jakobsen
Year: 2015
Document Type:
Nickel-free final finishes in the electronics industry
Publisher: International Microelectronics Assembly and Packaging Society (IMAPS)
Authors:Andreas Gross; Norbert Sitte
Year: 2015
Document Type:
Thin Film based lcp multi-layer circuits: Manufacturing technology and characterization
Publisher: International Microelectronics Assembly and Packaging Society (IMAPS)
Authors:Alexander Kaiser; Carlos Maximilian Bee; Frederic Dupuis; Rene von Metzen; Karin Rues; Paul Matej; Christian Herbort; Bruno Holl; Sebastian Loffler; Gunther Baubock; Karl-Heinz Fritz
Year: 2015
Document Type:
Combining organic and printed electronics in Hybrid System in Foil (HySiF) based smart skin for robotic applications
Publisher: International Microelectronics Assembly and Packaging Society (IMAPS)
Authors:Mahadi-Ul Hassan; Jurgen Keck; Hagen Klauk; Jan Kostelnik; Yigit Mahsereci; Stefan Sailer; Alina Schreivogel; Tarek Zaki; Joachim N. Burghartz
Year: 2015
Document Type:
Innovative solutions for systems based on embedding of thin components into flexible printed circuit boards
Publisher: International Microelectronics Assembly and Packaging Society (IMAPS)
Authors:Jurgen Wolf; Muhammad Samir Alshahed; Joachim N. Burghartz; Thomas Gneiting; Christine Harendt; Jan Kostelnik; Andreas Kugler; Enno Lorenz
Year: 2015
Document Type:
Direct attach led soldering by new printable AuSn paste
Publisher: International Microelectronics Assembly and Packaging Society (IMAPS)
Authors:Abdenacer Ait Mani; Manon Arch
Year: 2015
Document Type:
A LED micro-display with 90+ù90 pixels on a 80 ++m pitch
Publisher: International Microelectronics Assembly and Packaging Society (IMAPS)
Authors:Mahbub Akhter; Jun Su Lee; Pleun P. Maaskant; Marc Rensing; Noreen Nudds; Peter O'Brien; Patrick Degenaar; Brian Corbett
Year: 2015
Document Type:
Highly reliable thick film solutions for power LEDs and electronics
Publisher: International Microelectronics Assembly and Packaging Society (IMAPS)
Authors:Paul Gundel; Melanie Bawohl; Mark Challingsworth; Christoph Czwickla; Virginia Garcia; Ilias Nikolaidis; Christina Modes; Ryan Persons; Jessica Reitz
Year: 2015
Document Type:
Thermal simulations and design propositions for LEDs used in automotive applications
Publisher: International Microelectronics Assembly and Packaging Society (IMAPS)
Authors:G. Thin; Z. Zojceski; J. B. Millet; Y. Alayli
Year: 2015
Document Type:
Solder paste residue corrosivity assessment: Bono test
Publisher: International Microelectronics Assembly and Packaging Society (IMAPS)
Authors:Celine Puechagut; Anne-Marie Laugt; Emmanuelle Guene; Richard Anisko
Year: 2015
Document Type:
The effect of thermal stress on the reliability of low Ag solder joints in high-power LEDs
Publisher: International Microelectronics Assembly and Packaging Society (IMAPS)
Authors:Miriam Rauer; Timo Schreck; Stefan Harter; Michael Kaloudis
Year: 2015
Document Type:
Comparative tests for lead-free solder bumps
Publisher: International Microelectronics Assembly and Packaging Society (IMAPS)
Authors:Rene Zingg; Ricardo Geelhaar; Chan Myat; Armin Struwe; Evstatin Krastev
Year: 2015
Document Type:
Effects of component stand-off height on reliability of solder joints in assembled electronic component
Publisher: International Microelectronics Assembly and Packaging Society (IMAPS)
Authors:Jude E. Njoku; Sabuj Mallik; Raj Bhatti; Emeka H. Amalu; B. Ogunsemi
Year: 2015
Document Type:
Assembly of transducer array using anisotropic conductive film for medical imaging applications
Publisher: International Microelectronics Assembly and Packaging Society (IMAPS)
Authors:Hoang-Vu Nguyen; Trym Eggen; Knut E. Aasmundtveit
Year: 2015
Document Type:
Improvement of connectivity in Cu/OSP flip chip package using slow cure NCP
Publisher: International Microelectronics Assembly and Packaging Society (IMAPS)
Authors:Masaaki Hoshiyama; Yuusuke Kamata; Makoto Kobayashi; Hiromi Sone; Hiroki Myodo; Toshikazu Hocchi; Hirotatsu Ikarashi; Shinichi Munemura
Year: 2015
Document Type:
New MEMS die attach adhesives combining maximum flexibility and outstanding dispensability including screen printing
Publisher: International Microelectronics Assembly and Packaging Society (IMAPS)
Authors:Tobias Koniger
Year: 2015
Document Type:
Development of bimodal electrically conductive pastes with Ag micro- and nano-fillers for printing stretchable E-textile systems
Publisher: International Microelectronics Assembly and Packaging Society (IMAPS)
Authors:Masahiro Inoue; Yosuke Itabashi; Yasunori Tada
Year: 2015
Document Type:
Electrical, thermal and mechanical characterization of low temperature, pressure-less sintered silver bond interfaces
Publisher: International Microelectronics Assembly and Packaging Society (IMAPS)
Authors:Tilo Welker; Jens Muller; Frank Kramer; Steffen Wiese
Year: 2015
Document Type:
A novel approach for thin-film Ag-sintering process through Aerosol Jet Printing in power electronics
Publisher: International Microelectronics Assembly and Packaging Society (IMAPS)
Authors:Aarief Syed-Khaja; Johannes Hoerber; Christopher Gruber; Joerg Franke
Year: 2015
Document Type:
Failure analysis of Ag sintered joints after power cycling under harsh temperature conditions from + 30-¦C up to + 180-¦C
Publisher: International Microelectronics Assembly and Packaging Society (IMAPS)
Authors:Constanze Weber; Matthias Hutter; Christian Ehrhardt; Klaus-Dieter Lang
Year: 2015
Document Type:
Investigations on power cycling induced fatigue failure of IGBTs with silver sinterea interconnects
Publisher: International Microelectronics Assembly and Packaging Society (IMAPS)
Authors:R. Dudek; R. Doring; S. Rzepka; C. Ehrhardt; M. Hutter; J. Rudzki; F. Osterwald; R. Eisele; S. Stegmeier; K. Weidner; M. Rittner
Year: 2015
Document Type:
The role of molding compound microstructure for packaging reliability
Publisher: International Microelectronics Assembly and Packaging Society (IMAPS)
Authors:Hartmut Fischer; Hasan Sadat Nabi; Laurens Weiss; Alexander W. J. Gielen
Year: 2015
Document Type:
CCGA solder column GÇö Reliable solution for absorbing large CTE mismatch
Publisher: International Microelectronics Assembly and Packaging Society (IMAPS)
Authors:Martin Hart
Year: 2015
Document Type:
Influence of humidity on reliability of plastic packages
Publisher: International Microelectronics Assembly and Packaging Society (IMAPS)
Authors:T. Braun; J. Bauer; K.-F Becker; O. Holck; H. Walter; M. van Dijk; R. Aschenbrenner; K.-D Lang
Year: 2015
Document Type:
Design for reliability of Au-Sn and Cu-Sn based SLID bonds
Publisher: International Microelectronics Assembly and Packaging Society (IMAPS)
Authors:Vesa Vuorinen; Antti Rautiainen; Mervi Paulasto-Krockel
Year: 2015
Document Type:
Sol gel thin films on LTCC ceramic multilayers enable their use as thin film substrates
Publisher: International Microelectronics Assembly and Packaging Society (IMAPS)
Authors:Heike Bartsch; Ulrike Brokmann; Boris Goj; Robert Weiss; Edda Radlein; Jens Muller
Year: 2015
Document Type:
Thermal improvement of plastic laminate based LED modules with embedded chips
Publisher: International Microelectronics Assembly and Packaging Society (IMAPS)
Authors:Andreas Munding; Martin Gruber; Tino Both; Michael Herfurth; Thomas Hammer; Dirk Schweitzer; Klaus Pressel; Andreas Waldschick; Elmar Baur; Axel Kaltenbacher
Year: 2015
Document Type:
Embedded power electronics on the way to be launched
Publisher: International Microelectronics Assembly and Packaging Society (IMAPS)
Authors:Mike Morianz; Hannes Stahr
Year: 2015
Document Type:
Development of advanced power modules for electric vehicle applications
Publisher: International Microelectronics Assembly and Packaging Society (IMAPS)
Authors:Dionysios Manessis; Lars Boettcher; Andreas Ostmann; Klaus-Dieter Lang; Simon Whalley
Year: 2015
Document Type:
Silicon photonics assembly industrialisation
Publisher: International Microelectronics Assembly and Packaging Society (IMAPS)
Authors:Adamo Bazzotti; Massimo Fere; Luca Maggi; Mark Shaw
Year: 2015
Document Type:
Multichannel optical link based on polymer multimode waveguides for board-level interchip communication
Publisher: International Microelectronics Assembly and Packaging Society (IMAPS)
Authors:Krzysztof Nieweglowski; Lukas Lorenz; Klaus-Jurgen Wolter; Karlheinz Bock
Year: 2015
Document Type:
Wafer-level integration technology for multi emitter high power fiber coupled lasers
Publisher: International Microelectronics Assembly and Packaging Society (IMAPS)
Authors:Lukas Lorenz; Ralf Rieske; Krzysztof Nieweglowski; Klaus-Jurgen Wolter; Karlheinz Bock
Year: 2015
Document Type:
Development of a microcamera with embedded image processor using panel level packaging
Publisher: International Microelectronics Assembly and Packaging Society (IMAPS)
Authors:Andreas Ostmann; Christian Boehme; Kai Schrank; Klaus-Dieter Lang
Year: 2015
Document Type:
Evaluation of the dielectric cure monitoring of epoxy molding compound in transfer molding process for electronic packages
Publisher: International Microelectronics Assembly and Packaging Society (IMAPS)
Authors:Burcu Kaya; Jan-Martin Kaiser; Karl-Friedrich Becker; Tanja Braun; Klaus-Dieter Lang
Year: 2015
Document Type:
Functionalized sensor packaging based on thermoset injection molding and selective metallization technology
Publisher: International Microelectronics Assembly and Packaging Society (IMAPS)
Authors:Stefan Beichter; Sascha Weser; Hagen Muller; Simon Petillon; Benno Haug; Thomas Gunther; Wolfgang Eberhardt; Andre Zimmermann
Year: 2015
Document Type:
Biased humidity degradation model for Cu-Al wire bonded contacts based on molding compound properties
Publisher: International Microelectronics Assembly and Packaging Society (IMAPS)
Authors:Amar Mavinkurve; Rene Rongen; Michiel van Soestbergen; Orla O'Halloran; Leon Goumans; Mark Luke Farrugia
Year: 2015
Document Type:
Prospects of wire bonding as an approach for contacting additive manufactured Aerosol Jet printed structures
Publisher: International Microelectronics Assembly and Packaging Society (IMAPS)
Authors:Christopher Kaestle; Johannes Hoerber; Florian Oechsner; Joerg Franke
Year: 2015
Document Type:
FEM analysis of ball- and wedge bond techniques for the interconnection formation of soft die bonds
Publisher: International Microelectronics Assembly and Packaging Society (IMAPS)
Authors:F. Kraemer; S. Wiese
Year: 2015
Document Type:
Si interposer with 10+ù100++m copper TSVs for 2.5D integration
Publisher: International Microelectronics Assembly and Packaging Society (IMAPS)
Authors:K. Xue; C. Song; S. Yang; Z. Yong; H. Li; X. Jing; U. Lee; W. Zhang
Year: 2015
Document Type:
Low-temperature refill process for through-silicon-vias (TSVs) in stacked ultra-thin chip-on-wafer by Aerosol Jet printed silver
Publisher: International Microelectronics Assembly and Packaging Society (IMAPS)
Authors:Saleh Ferwana; Jurgen Keck; Mahadi-Ul Hassan; Christine Harendt; J. N. Burghartz
Year: 2015
Document Type:
Comparison of passivation materials for high frequency 3D packaging application up to 110 GHz
Publisher: International Microelectronics Assembly and Packaging Society (IMAPS)
Authors:Xiaomin Duan; Mathias Bottcher; Stephan Dobritz; David Dahl; Christian Schuster; Ivan Ndip; Klaus-Dieter Lang
Year: 2015
Document Type:
eWLB package for millimeter wave application
Publisher: International Microelectronics Assembly and Packaging Society (IMAPS)
Authors:Ngoc-Hoa Huynh; Trotta Saverio; Maciej Wojnowski; Gerhard Haubner; Sebastian Pahlke; Jean Schmitt; Helmut Mayr; Johann Wurtele; Uwe Rueddenklau; Ismail Nasr; Jagjit Singh Bal
Year: 2015
Document Type:
Application of the IForce piezoresistive silicon based stress sensor for prognostic and health monitoring methods
Publisher: International Microelectronics Assembly and Packaging Society (IMAPS)
Authors:Alicja Palczynska; Bulong Wu; Dae-Suk Kim; Przemyslaw Gromala; Bongtae Han; Dirk Mayer; Tobias Melz
Year: 2015
Document Type:
Void formation in Cu-Sn Solid-Liquid Interdiffusion (SLID) bonding
Publisher: International Microelectronics Assembly and Packaging Society (IMAPS)
Authors:Knut E. Aasmundtveit; Thi-Thuy Luu; Kaiying Wang; Nils Hoivik
Year: 2015
Document Type:
Adequate mechanical characterization of PCB copper traces for 2nd level FEM simulations
Publisher: International Microelectronics Assembly and Packaging Society (IMAPS)
Authors:F. Kraemer; D. Bruch; S. Wiese
Year: 2015
Document Type:
Evaluation of pattern scale stress effects of 28nm technology during wire bond and Cu pillar flip chip assembly
Publisher: International Microelectronics Assembly and Packaging Society (IMAPS)
Authors:Eberhard Kaulfersch; Jurgen Auersperg; Dirk Breuer; Birgit Bramer; Sven Rzepka
Year: 2015
Document Type:
Manufacturing of flexible (ultra-)thin magnetic field sensors
Publisher: International Microelectronics Assembly and Packaging Society (IMAPS)
Authors:Daniel Ernst; J. Ingolf Monch; Oliver G. Schmidt; Thomas Zerna
Year: 2015
Document Type:
Integrated high-frequency sensors in catheters for minimally invasive plaque characterization
Publisher: International Microelectronics Assembly and Packaging Society (IMAPS)
Authors:Subhajit Guha; Ulrich Schumann; Farabi Ibne Jamal; David Wagner; Chafik Meliani; Bertram Schmidt; Christian Wenger; Jan Wessel; Markus Detert
Year: 2015
Document Type:
Temperature sensors based on thermoelectric effect
Publisher: International Microelectronics Assembly and Packaging Society (IMAPS)
Authors:Lars Rebenklau; Paul Gierth; Angelika Paproth; Klaus Irrgang; Lutz Lippmann; Axel Wodtke; Lars Niedermeyer; Klaus Augsburg; Franz Bechtold
Year: 2015
Document Type:
Very compact, water-cooled SiPM module for PET/MRT applications
Publisher: International Microelectronics Assembly and Packaging Society (IMAPS)
Authors:Rainer Dohle; Thomas Rittweg; Vladimir Chernyshev; Elke Beyer; Jorg Gosler; Ilaria Sacco; Peter Fischer
Year: 2015
Document Type:
Heat sensitive joining method for miniaturized sensor components in medical technology
Publisher: International Microelectronics Assembly and Packaging Society (IMAPS)
Authors:David Wagner; David Ranisch; Bertram Schmidt; Markus Detert
Year: 2015
Document Type:
Lamination of 3D structures in LTCC using elastomer bags
Publisher: International Microelectronics Assembly and Packaging Society (IMAPS)
Authors:Artem Ivanov; Andrej Besborodow; Gerhard Sattelberger
Year: 2015
Document Type:
Solder wettability and solder joint reliability of rapid thermal firing thick film pastes
Publisher: International Microelectronics Assembly and Packaging Society (IMAPS)
Authors:Paul Gierth; Lars Rebenklau
Year: 2015
Document Type:
LTCC technology for microfluidic applications based on the gap waveguide technology
Publisher: International Microelectronics Assembly and Packaging Society (IMAPS)
Authors:Cristina Arenas-Buendia; Francois Gallee; Alejandro Valero-Nogueira; Christian Person
Year: 2015
Document Type:
Thickfilm ceramic ready for MCM interposer
Publisher: International Microelectronics Assembly and Packaging Society (IMAPS)
Authors:Sebastian Loffler; Gunter Reppe; Angela Rebs; Marcus Herrmann; Christopher Mauermann; Alexander Kaiser; Karl-Heinz Fritz
Year: 2015
Document Type:
Advancing packaging solutions using 3D capabilities of ceramic multilayers
Publisher: International Microelectronics Assembly and Packaging Society (IMAPS)
Authors:Torsten Thelemann; Thomas Bartnitzek; Karl-Heinz Suphan; Stefan Apel
Year: 2015
Document Type:
Conference program
Publisher: International Microelectronics Assembly and Packaging Society (IMAPS)
Year: 2015
Document Type:
Copyright page
Publisher: International Microelectronics Assembly and Packaging Society (IMAPS)
Year: 2013
Document Type:
Front matter
Publisher: International Microelectronics Assembly and Packaging Society (IMAPS)
Year: 2013
Document Type:
Challenges with manufacturability of package on package (PoP)
Publisher: International Microelectronics Assembly and Packaging Society (IMAPS)
Authors:Petri Savolainen; Craig Hillman; Cheryl Tulkoff; Greg Caswell
Year: 2013
Document Type:
New approach for assessment of dielectric layer adhesion strength, demonstrated on eWLB FO-WLP interfaces
Publisher: International Microelectronics Assembly and Packaging Society (IMAPS)
Authors:Jorge Teixeira; Raquel Pinto; Abel Janeiro; Paulo Cardoso; Mario Ribeiro
Year: 2013
Document Type:
Probabilistic design for reliability (PDfR) in space electronics and photonics: A change of vision
Publisher: International Microelectronics Assembly and Packaging Society (IMAPS)
Authors:A. Bensoussan
Year: 2013
Document Type:
Board level reliability testing of hermetic packages equipped with high-rel interconnection solutions and dedicated to space applications
Publisher: International Microelectronics Assembly and Packaging Society (IMAPS)
Authors:Olivier Gaillard
Year: 2013
Document Type:
Verification of an LTCC packaging technology on board of the ongoing TET-1 satellite mission
Publisher: International Microelectronics Assembly and Packaging Society (IMAPS)
Authors:Reinhard Kulke; Tobias Klein; Gregor Mollenbeck; Carsten Gunner; Matthias Rittweger
Year: 2013
Document Type:
Coupling experimental and modelling results for device failure anticipation
Publisher: International Microelectronics Assembly and Packaging Society (IMAPS)
Authors:Diane Ecoiffier; Pierre Vernhes
Year: 2013
Document Type:
Wafer-level AuSn and CuSn bonding for MEMS encapsulation
Publisher: International Microelectronics Assembly and Packaging Society (IMAPS)
Authors:T. Suni; H. Xu; V. Vuorinen; H. Heikkinen; S. Vahanen; A. Jaakkola; P. Monnoyer; M. Paulasto-Krockel
Year: 2013
Document Type:
Chemically resistant encapsulant to enable a novel MEMS fabrication process
Publisher: International Microelectronics Assembly and Packaging Society (IMAPS)
Authors:Serguei Stoukatch; Thomas Walewyns; Ester Tooten; Fabrice Axisa; Laurent A. Francis; Jacques Destine
Year: 2013
Document Type:
Highly flexible die attach adhesives for MEMS packages
Publisher: International Microelectronics Assembly and Packaging Society (IMAPS)
Authors:Tobias Koniger
Year: 2013
Document Type:
Improved chip & component encapsulation by dedicated diffusion barriers to reduce corrosion sensitivity in biological and humid environments
Publisher: International Microelectronics Assembly and Packaging Society (IMAPS)
Authors:Maaike Op de Beeck; Ahmed Jarboui; Maarten Cauwe; Heidi Declercq; Griet Uytterhoeven; Maria Cornelissen; Jan Vanfleteren; Chris Van Hoof
Year: 2013
Document Type:
Analysis of stress in silicon-based microsystems by X-ray diffraction techniques
Publisher: International Microelectronics Assembly and Packaging Society (IMAPS)
Authors:T. Bandi; A. Dommann; A. Neels
Year: 2013
Document Type:
Solid-Liquid Interdiffusion (SLID) bonding — Intermetallic bonding for high temperature applications
Publisher: International Microelectronics Assembly and Packaging Society (IMAPS)
Authors:Knut E. Aasmundtveit; Torleif A. Tollefsen; Thi-Thuy Luu; Ani Duan; Kaiying Wang; Nils Hoivik
Year: 2013
Document Type:
Ultra-fine pitch redistribution for 3D interposer
Publisher: International Microelectronics Assembly and Packaging Society (IMAPS)
Authors:R. Segaud; C. Aumont; R. Eleouet; N. Allouti; T. Mourier; L. Gabette; S. Minoret; T. Magis; A. Roman; R. Hida; C. Ratin; L. Lachal; S. Delachanal; M. L. Cordini; P. Nardi; H. Feldis; A. Charpentier; P. Chausse; C. Laviron; S. Cheramy
Year: 2013
Document Type:
Power modules with embedded components
Publisher: International Microelectronics Assembly and Packaging Society (IMAPS)
Authors:A. Ostmann; L. Boettcher; D. Manessis; S. Karaszkiewicz; K-D Lang
Year: 2013
Document Type:
Custom plastic ball grid array packages for microwave space applications up to 30 GHz
Publisher: International Microelectronics Assembly and Packaging Society (IMAPS)
Authors:Barbara Bonnet; Nicolas Malgouyres; Olivier Vendier; Sophie Dareys; Jean-Francois Villemazet
Year: 2013
Document Type:
Hermetic packaging for millimetre wave applications
Publisher: International Microelectronics Assembly and Packaging Society (IMAPS)
Authors:M. Lahti; K. Kautio; J. Ollila; T. Vaha-Heikkila; M. Kaunisto
Year: 2013
Document Type:
Thin film flexible circuits: Technology, characteristics and applications
Publisher: International Microelectronics Assembly and Packaging Society (IMAPS)
Authors:A. Kaiser; K. Ruess; P. Matej; C. Herbort; B. Holl; G. Baubock
Year: 2013
Document Type:
Assembly of high-aspect ratio optoelectronic sensor arrays on flexible substrates
Publisher: International Microelectronics Assembly and Packaging Society (IMAPS)
Authors:W. Buss; F. Kraze; A. Bruckner; R. Leitel; A. Mann; A. Brauer
Year: 2013
Document Type:
Micro-structural changes and crack propagation in solder joints due to vibration
Publisher: International Microelectronics Assembly and Packaging Society (IMAPS)
Authors:Bastian Reichling; Andreas Fix; Roumen Ratchev; Jurgen Wilde
Year: 2013
Document Type:
Study of influential parameters for lead-free flip chip solder joint cracking
Publisher: International Microelectronics Assembly and Packaging Society (IMAPS)
Authors:A. Ayari-Kanoun; V. Oberson; I. Paquin; C. Fortin; R. Fontaine; D. Danovitch; D. Drouin
Year: 2013
Document Type:
Combining humidity testing and static bending with flip chip test structures
Publisher: International Microelectronics Assembly and Packaging Society (IMAPS)
Authors:Kati H. Kokko
Year: 2013
Document Type:
Novel investigation of influencing factors for corrosive interface degradation in wire bond contacts
Publisher: International Microelectronics Assembly and Packaging Society (IMAPS)
Authors:Robert Klengel; Sandy Klengel; Tino Stephan; Matthias Petzold
Year: 2013
Document Type:
Flex to flex bonding using anisotropic conductive film for imaging systems
Publisher: International Microelectronics Assembly and Packaging Society (IMAPS)
Authors:K. Imenes; H-V Nguyen; A. Lifjeld; T. Eggen; C. E. Baumgartner; K. E. Aasmundtveit
Year: 2013
Document Type:
Impact of integrating microchannel cooling within 3D microelectronic packages for portable applications
Publisher: International Microelectronics Assembly and Packaging Society (IMAPS)
Authors:Louis-Michel Collin; Luc G. Frechette; Abdelkader Souifi; Sandrine Lhostis; Francois de Crecy; Severine Cheramy; Jean-Philippe Colonna; Vincent Fiori
Year: 2013
Document Type:
BGA package technology considerations for high speed and RF applications
Publisher: International Microelectronics Assembly and Packaging Society (IMAPS)
Authors:Laurent Marechal; David Auchere; Yvon Imbs
Year: 2013
Document Type:
Embedded capacitor design rules in multilayer organic-based substrate for HF circuits
Publisher: International Microelectronics Assembly and Packaging Society (IMAPS)
Authors:Massar Wade; Isabelle Bord-Majek; Tristan Dubois; Genevieve Duchamp
Year: 2013
Document Type:
Release holes: Physical implementation checks for thin films packaging
Publisher: International Microelectronics Assembly and Packaging Society (IMAPS)
Authors:M. Gary; J.-L Pornin; G. Cibrario; C. Jaffard
Year: 2013
Document Type:
Ball Grid Array package for automotive application: Strong link between design and 3D modeling
Publisher: International Microelectronics Assembly and Packaging Society (IMAPS)
Authors:Giovanni Graziosi; Cristina Somma; Arianna Morelli; Claudio Maria Villa; Patrice Joubert Doriol; Laurent Marechal; Sebastien Gallois-Garreignot
Year: 2013
Document Type:
Transfer molding of primary LED optics; High aspect ratio domes
Publisher: International Microelectronics Assembly and Packaging Society (IMAPS)
Authors:S. H. M. Kersjes; J. L. J. Zijl; R. H. Poelma; H. W. Wensink
Year: 2013
Document Type:
Electro-optical strength assessment of white LEDs multichip modules for automotive forward-lighting application: Failure analysis and packaging influence
Publisher: International Microelectronics Assembly and Packaging Society (IMAPS)
Authors:B. Chambion; L. Mendizabal; L. Bechou; A. Gasse; Y. Deshayes; V. Carreau
Year: 2013
Document Type:
Silicon embedded line integration for high end passive silicon interposer
Publisher: International Microelectronics Assembly and Packaging Society (IMAPS)
Authors:Jean Charbonnier; Myriam Assous; Jean-Philippe Bally; Robert Cuchet; Thierry Mourier; Stephane Minoret; Thomas Magis; Alain Toffoli; Fabienne Allain; Gilles Simon
Year: 2013
Document Type:
Heterogeneous packaging for mixed LED and electronic packages
Publisher: International Microelectronics Assembly and Packaging Society (IMAPS)
Authors:B. R. de Jong; E. A. Patent; M. A. de Samber
Year: 2013
Document Type:
Packaging material issues in high temperature power electronics
Publisher: International Microelectronics Assembly and Packaging Society (IMAPS)
Authors:B. Boettge; F. Naumann; R. Klengel; S. Klengel; M. Petzold
Year: 2013
Document Type:
Utilising advanced packaging technologies to enable smaller, more efficient GaN power devices
Publisher: International Microelectronics Assembly and Packaging Society (IMAPS)
Authors:Andy Longford; Greg Klowak
Year: 2013
Document Type:
Computational modeling of electrodepostion in small features under megasonic agitation
Publisher: International Microelectronics Assembly and Packaging Society (IMAPS)
Authors:N. Strusevich; C. Bailey; M. K. Patel
Year: 2013
Document Type:
Solder joint fatigue model for large silicon interposers
Publisher: International Microelectronics Assembly and Packaging Society (IMAPS)
Authors:C. Ferrandon; F. de Crecy; S. Moreau; D. Yap; G. Simon
Year: 2013
Document Type:
Constitutive modeling of thin films under thermal cycling
Publisher: International Microelectronics Assembly and Packaging Society (IMAPS)
Authors:Tiphaine Pelisset; Walther Heinz; Balamurugan Karunamurthy; Thomas Antretter
Year: 2013
Document Type:
RF characterization and modeling of through-silicon vias
Publisher: International Microelectronics Assembly and Packaging Society (IMAPS)
Authors:X. Sun; J. Ryckaert; G. Van der Plas; E. Beyne
Year: 2013
Document Type:
BGA packages classification to reach ESD CDM standards
Publisher: International Microelectronics Assembly and Packaging Society (IMAPS)
Authors:David Auchere; Gerald Afflard; Blaise Jacquier; Stephan Jeune; Corinne Richier; Alexandre Dray; Celine Roussel; David Aleo; Eric Picolet; Cedric Le Borgne; Yvon Imbs; Laurent Marechal
Year: 2013
Document Type:
Improvement of low-temperature sintered ink containing nano-Ag for ink-jet printing of conductive structures on flexible substrates
Publisher: International Microelectronics Assembly and Packaging Society (IMAPS)
Authors:Jan Felba; Anita Smolarek; Andrzej Moscicki; Tomasz Falat; Michal Zawierta; Zbigniew Zaluk
Year: 2013
Document Type:
Multi beam low-k grooving evaluation of various removal principals
Publisher: International Microelectronics Assembly and Packaging Society (IMAPS)
Authors:Richard van der Stam; Jeroen van Borkulo; Peter Dijkstra
Year: 2013
Document Type:
Silicon interposers with integrated passive devices, an excellent alternativ to discrete components
Publisher: International Microelectronics Assembly and Packaging Society (IMAPS)
Authors:Florent Lallemand; Frederic Voiron
Year: 2013
Document Type:
Improvement of connectivity in Cu/OSP flip chip package using NCP
Publisher: International Microelectronics Assembly and Packaging Society (IMAPS)
Authors:Masaaki Hoshiyama; Toyokazu Hocchi; Hirotatsu Ikarashi; Yosuke Sakai; Hiroki Myodo; Takuya Hoshino; Shinichi Munemura; Kiyoshi Kotaka
Year: 2013
Document Type:
New method for deposition of thixotropic materials with resolution under 100 μm
Publisher: International Microelectronics Assembly and Packaging Society (IMAPS)
Authors:M. Bursik; J. Haze; I. Szendiuch; J. Jankovsky; M. Reznicek
Year: 2013
Document Type:
Thermo-mechanical material characterization of organic polymer films in advanced packages using nanoindentation
Publisher: International Microelectronics Assembly and Packaging Society (IMAPS)
Authors:Katrin Unterhofer; Harald Preu; Jurgen Walter; Georg Lorenz; Walter Mack; Matthias Petzold
Year: 2013
Document Type:
Smart neuroprobes with disposable micro-machined shank protection defined at wafer level
Publisher: International Microelectronics Assembly and Packaging Society (IMAPS)
Authors:A. Andrei; C. Mora Lopez; P. Soussan
Year: 2013
Document Type:
Development of a conductometric biocompatible sensor for detecting ischemia
Publisher: International Microelectronics Assembly and Packaging Society (IMAPS)
Authors:Lars Holhjem; Runar Strand-Amundsen; Knut E. Aasmundtveit; Tor Inge Tonnessen
Year: 2013
Document Type:
Thermoplastic packaging and embedding technology for ID-cards
Publisher: International Microelectronics Assembly and Packaging Society (IMAPS)
Authors:Joao Marques; Barbara Pahl; Christine Kallmayer
Year: 2013
Document Type:
Dispersion of functionalized SiO2 particles into a Liquid Crystal Polymer matrix for a reliable HF package
Publisher: International Microelectronics Assembly and Packaging Society (IMAPS)
Authors:Walide Chenniki; Isabelle Bord-Majek; Melanie Louarn; Vincent Gaud; Jean-Luc Diot; Bruno Levrier; Virginie Verriere; Thomas Frank; Komkrisd Wongtimnoi; Yves Ousten
Year: 2013
Document Type:
Thermal cycling of anisotropically conductive adhesive interconnections in demanding sensor applications
Publisher: International Microelectronics Assembly and Packaging Society (IMAPS)
Authors:Sanna Lahokallio; Anniina Parviainen; Laura Frisk
Year: 2013
Document Type:
PZT acoustic wave force sensor made in LTCC technology
Publisher: International Microelectronics Assembly and Packaging Society (IMAPS)
Authors:A. Dabrowski; L. J. Golonka
Year: 2013
Document Type:
Importance of vibration testing for new technological configurations in electronics
Publisher: International Microelectronics Assembly and Packaging Society (IMAPS)
Authors:I. Szendiuch; B. Psota; A. Otahal; M. Klapka
Year: 2013
Document Type:
Optimized wire-bond transitions for microwave applications up to 67 GHz using the low loss LTCC material DuPont 9k7
Publisher: International Microelectronics Assembly and Packaging Society (IMAPS)
Authors:Alexander Schulz; Dirk Stopel; Tilo Welker; Robert Muller; Frank Wollenschlager; Jens Muller
Year: 2013
Document Type:
Heterogeneous wafer reconstruction and wafer level hybridization by copper direct bonding for Infrared imagers
Publisher: International Microelectronics Assembly and Packaging Society (IMAPS)
Authors:Abdenacer Ait Mani; Stephanie Huet
Year: 2013
Document Type:
STMicroelectronics package design rules Check coverage enhancement with Cadence Ravel
Publisher: International Microelectronics Assembly and Packaging Society (IMAPS)
Authors:G. Bouteloup; O. Franiatte; M. Gracietti; Y. Imbs; J. Jaklic; B. Lindberg; J. Lopez; D. Signoret
Year: 2013
Document Type:
Cleaning in electronics: Understanding today's needs
Publisher: International Microelectronics Assembly and Packaging Society (IMAPS)
Authors:P. J. Duchi; Anne-Marie Laügt; Marie Verdier
Year: 2013
Document Type:
Novel interconnection technology for flex-on-glass (FOG) applications
Publisher: International Microelectronics Assembly and Packaging Society (IMAPS)
Authors:Haksun Lee; Yong-Sung Eom; Hyun-Cheol Bae; Kwang-Seong Choi
Year: 2013
Document Type:
Novel Low-volume solder-on-pad for fine pitch Cu pillar bump
Publisher: International Microelectronics Assembly and Packaging Society (IMAPS)
Authors:Hyun-Cheol Bae; Haksun Lee; Yong-Sung Eom; Kwang-Seong Choi
Year: 2013
Document Type:
Toward a reliability analysis method of wide band gap power electronic components and modules
Publisher: International Microelectronics Assembly and Packaging Society (IMAPS)
Authors:Guillaume Parent; Gregor Massiot; Vincent Rouet; Catherine Munier; Paul-Etienne Vidal; Francisco Carrillo
Year: 2013
Document Type:
Effect of protective casting materials on product level reliability under accelerated test conditions
Publisher: International Microelectronics Assembly and Packaging Society (IMAPS)
Authors:J. Pippola; T. Marttila; L. Frisk
Year: 2013
Document Type:
Optimizing of PCBA cleaning process through process calibration tools
Publisher: International Microelectronics Assembly and Packaging Society (IMAPS)
Authors:V. Sitko; M. Saffer; M. Bursik; I. Szendiuch; J. Jankovsky; M. Reznicek
Year: 2013
Document Type:
Handling of ultra-thin dies with fine pitch micro-bumps for advanced packaging applications
Publisher: International Microelectronics Assembly and Packaging Society (IMAPS)
Authors:Zlatko Hajdarevic; Karl Malachowski; Alastair Attard
Year: 2013
Document Type:
UV replication technology for micro optical applications and bonding challenges using active alignment
Publisher: International Microelectronics Assembly and Packaging Society (IMAPS)
Authors:Andreas Kraft; Karl Bitzer; Markus Brehm; Rainer Dörfler
Year: 2013
Document Type:
Au-Sn Transient Liquid Phase bonding for hermetic sealing and getter activation
Publisher: International Microelectronics Assembly and Packaging Society (IMAPS)
Authors:S. Giudice; C. Bosshard
Year: 2013
Document Type:
Impact of pad finish on mechanical shock resistance of lead-free solder joints tested under shear and in pull mode
Publisher: International Microelectronics Assembly and Packaging Society (IMAPS)
Authors:Bart Vandevelde; Matthias Van Kerckhove; Dominiek Degryse; Wim D'Haese; David Schaubroeck; Bart Allaert; Eddy Geerinckx; Ralph Lauwaert; Geert Willems
Year: 2013
Document Type:
Bridging the infrastructure gap between traditional wire-bond and TSV semiconductor package technology
Publisher: International Microelectronics Assembly and Packaging Society (IMAPS)
Authors:Vern Solberg; Belgacem Haba; Wael Zohni; Ilyas Mohammed
Year: 2013
Document Type:
3D TSV system in package (SiP) for aerospace applications
Publisher: International Microelectronics Assembly and Packaging Society (IMAPS)
Authors:J. C. Riou; E. Bailly; C. Bunel; L. Lenoir; M. Pommier
Year: 2013
Document Type:
Low temperature dielectric deposition for via-reveal passivation
Publisher: International Microelectronics Assembly and Packaging Society (IMAPS)
Authors:Kath Crook; Mark Carruthers; Daniel Archard; Steve Burgess; Keith Buchanan
Year: 2013
Document Type:
Development of through glass via technology for 3D packaging
Publisher: International Microelectronics Assembly and Packaging Society (IMAPS)
Authors:Shintaro Takahashi; Kohei Horiuchi; Shigetoshi Mori; Kentaro Tatsukoshi; Motoshi Ono; Masaki Mikayama; Nobuhiko Imajo; Tim Mobley
Year: 2013
Document Type:
Direct integration of Carbon Nanotubes in Si microsystems — Towards truly integrated micro/nano systems
Publisher: International Microelectronics Assembly and Packaging Society (IMAPS)
Authors:Knut E. Aasmundtveit; Bao Quoc Ta; Quoc-Huy Nguyen; Tormod B. Haugen; Nils Hoivik; Einar Halvorsen
Year: 2013
Document Type:
Graphene applications with printed electronics technology
Publisher: International Microelectronics Assembly and Packaging Society (IMAPS)
Authors:Marcin Sloma; Daniel Janczak; Grzegorz Wroblewski; Anna Mlozniak; Malgorzata Jakubowska
Year: 2013
Document Type:
A bottom-up approach to developing innovative resistive sensors
Publisher: International Microelectronics Assembly and Packaging Society (IMAPS)
Authors:S. Behar; B. Viallet; J. Grisolia; N. M. Sangeetha; L. Ressier
Year: 2013
Document Type:
Investigation on interaction between indium based thermal interface material and copper and silicon substrates
Publisher: International Microelectronics Assembly and Packaging Society (IMAPS)
Authors:Tomasz Falat; Przemyslaw Matkowski; Bartosz Platek; Carl Zanden; Jan Felba; Li-Lei Ye; Johan Liu
Year: 2013
Document Type:
The discrete vacuum packaging reliability issue in MEMS
Publisher: International Microelectronics Assembly and Packaging Society (IMAPS)
Authors:L. Mauri; E. Rizzi; M. Moraja; M. Campaniello
Year: 2013
Document Type:
Copper ribbon bonding for power electronics applications
Publisher: International Microelectronics Assembly and Packaging Society (IMAPS)
Authors:Norman Marenco; Magdalena Kontek; Wolfgang Reinert; Jan Lingner; Max-Hermann Poech
Year: 2013
Document Type:
Wireless communicating implant for record of vital diagnosis parameters
Publisher: International Microelectronics Assembly and Packaging Society (IMAPS)
Authors:Achkar Charbel; Molina Julien; Sou Gerard; Koskas Fabien; Haentjens Yan; Alquie Georges; Leborgne Alain
Year: 2013
Document Type:
Technological investigation of LTCC-based Micro-Electro-Mechanical Systems (MEMS) to improve reliability and accuracy
Publisher: International Microelectronics Assembly and Packaging Society (IMAPS)
Authors:Christian Lenz; Steffen Ziesche; Uwe Partsch; Holger Neubert
Year: 2013
Document Type:
Holed packaging for mems sensors
Publisher: International Microelectronics Assembly and Packaging Society (IMAPS)
Authors:Fulvio Fontana; Kevin Formosa; Giovanni Graziosi; Mark Shaw; Fabrizio Soglio; Marco Tumiati
Year: 2013
Document Type:
Demonstration of a 3D embedded wafer-level SIP for smartcard application
Publisher: International Microelectronics Assembly and Packaging Society (IMAPS)
Authors:G. Pares; C. Bouvier; L. Castagne; M. Saadaoui; J. Mazuir; J. Noiray; K. Martinschitz; L. Mercier; A. Planchais; G. Simon
Year: 2013
Document Type:
Large-scale manufacturing of embedded subsystems-in-substrates and a 3D-stacking approach for a miniaturised medical system integration
Publisher: International Microelectronics Assembly and Packaging Society (IMAPS)
Authors:D. Manessis; A. Podlasly; A. Ostmann; R. Aschenbrenner; K.-D Lang
Year: 2013
Document Type:
Assembly and embedding of ultra-thin chips in polymers
Publisher: International Microelectronics Assembly and Packaging Society (IMAPS)
Authors:Mahadi-Ul Hassan; Christiane Schomburg; Christine Harendt; Elisabeth Penteker; Joachim N. Burghartz
Year: 2013
Document Type:
High curvature bending characterization of ultra-thin chips and chip-on-foil assemblies
Publisher: International Microelectronics Assembly and Packaging Society (IMAPS)
Authors:Daan van den Ende; Frits Verhoeven; Pepijn van der Eijnden; Roel Kusters; Ashok Sridhar; Maarten Cauwe; Jeroen van den Brand
Year: 2013
Document Type:
Advanced organic substrate technologies for HiRel and medical applications
Publisher: International Microelectronics Assembly and Packaging Society (IMAPS)
Authors:Frank Egitto; Dave Alcoe; Susan Bagen; Rabindra Das; Kim Blackwell; Steven Rosser; Glen Thomas
Year: 2013
Document Type:
Challenges in IC-package-PCB co-design of an advanced flip-chip PoP package for a mobile application
Publisher: International Microelectronics Assembly and Packaging Society (IMAPS)
Authors:Xavier Lecoq; Stephane Cosmo; Prem Bacle; Corinne Devey; Olivier Bayet; Laurent Schwarz
Year: 2013
Document Type:
Study on high density interconnect with organic build up substrate
Publisher: International Microelectronics Assembly and Packaging Society (IMAPS)
Authors:Takuya Torii; Masahiro Inoue; Erina Miyamoto; Toshinori Hida
Year: 2013
Document Type:
Systematic characterization of key parameters of hermetic wafer-level Cu-Sn SLID bonding
Publisher: International Microelectronics Assembly and Packaging Society (IMAPS)
Authors:H. J. van de Wiel; A.-S B. Vardoy; G. Hayes; M. H. M. Kouters; A. van der Waal; M. Erinc; A. Lapadatu; S. Martinsen; M. M. V. Taklo; H. R. Fischer
Year: 2013
Document Type:
Reliability of wafer-level SLID bonds for MEMS encapsulation
Publisher: International Microelectronics Assembly and Packaging Society (IMAPS)
Authors:H. Xu; M. Broas; H. Dong; V. Vuorinen; T. Suni; S. Vahanen; P. Monnoyer; M. Paulasto-Krockel
Year: 2013
Document Type:
MEMS packaging reliability assessment: Last development in the field of residual gas analysis tests
Publisher: International Microelectronics Assembly and Packaging Society (IMAPS)
Authors:P.-L Charvet; P. Nicolas; D. Bloch; B. Savornin
Year: 2013
Document Type:
Board level reliability comparison of Bump on Polymer WLCSP structures
Publisher: International Microelectronics Assembly and Packaging Society (IMAPS)
Authors:Yu-Chih Chen; Martyn Owen; Chiung-Chen Chen; Chun-Hung Tsai; Jui-Tu Huang; Hiew-Watt Ng; Hsin-Lun Chang; Shih-Ying Wu; Shih-Chieh Lin
Year: 2013
Document Type:
Non-destructive fault localization in advanced IC packages using electro optical terahertz pulse reflectometry
Publisher: International Microelectronics Assembly and Packaging Society (IMAPS)
Authors:Jesse Alton; Martin Igarashi
Year: 2013
Document Type:
Bow management with temperature for thin chips integration
Publisher: International Microelectronics Assembly and Packaging Society (IMAPS)
Authors:Jean Charbonnier; Myriam Assous; Jean-Philippe Bally; Edouard Deschaseaux; Christophe Ratin; Rachid Hida; Christophe Poulain; Nacima Allouti; Helene Issele; Lionel Vignoud; Stephane Moreau; Gilles Simon
Year: 2013
Document Type:
Wafer warpage in FO-WLP — Making friends out of enemies
Publisher: International Microelectronics Assembly and Packaging Society (IMAPS)
Authors:Eoin O'Toole; Mario Ribeiro; Jose Campos
Year: 2013
Document Type:
60GHz BGA solution packaging reliability and warpage study
Publisher: International Microelectronics Assembly and Packaging Society (IMAPS)
Authors:Didier Campos; Romain Pilard; Eric Saugier; Yvon Imbs; Jean-Michel Riviere; Jerome Lopez; Pierino Calascibetta; Norbert Chevrier; Luc Petit; Nadine Martin; Martine Salle; Frederic Gianesello; Aymeric Bisognin; Daniel Gloria; Phone-Maw Hla; Kim Yong Goh
Year: 2013
Document Type:
Performance of molding materials and interconnections integrated in interposers dedicated to RF or microwave 3DIC applications
Publisher: International Microelectronics Assembly and Packaging Society (IMAPS)
Authors:T. Lacrevaz; C. Bermond; B. Flechet; Y. Lamy; O. El Bouayadi; Gregory Houzet; Philippe Artillan
Year: 2013
Document Type:
Study of 3D process impact on advanced CMOS devices
Publisher: International Microelectronics Assembly and Packaging Society (IMAPS)
Authors:A. La Manna; W. Guo; S. Van Huylenbroeck; E. Sirignano; V. Cherman; G. Van der Plas; B. De Wachter; A. Phommahaxay; Anne Jourdain; G. Beyer; E. Beyne
Year: 2013
Document Type:
Flip chip market and technology trends
Publisher: International Microelectronics Assembly and Packaging Society (IMAPS)
Authors:Rozalia Beica
Year: 2013
Document Type:
Reliable wafer-level-bonding method for MEMS packaging using LTCC interposers
Publisher: International Microelectronics Assembly and Packaging Society (IMAPS)
Authors:Martin Ihle; Steffen Ziesche; Frank Roscher; Beate Capraro; Uwe Partsch
Year: 2013
Document Type:
Copper pillar shape and related stress simulation studies in flip chip packages
Publisher: International Microelectronics Assembly and Packaging Society (IMAPS)
Authors:Ying-Chih Lee; Bradford Factor; Chin-Li Kao; Jean-Marc Yannou; Chang-Chi Lee
Year: 2013
Document Type:
Integration of capillary self-alignment for face to face micro bump bonding
Publisher: International Microelectronics Assembly and Packaging Society (IMAPS)
Authors:Nga P. Pham; Robert Daily; Silvia Armini; Tinne Delande; Marianna Pantouvaki; Philippe Soussan
Year: 2013
Document Type:
Joint strength of Cu-to-Cu joint using mixed Ag particle paste
Publisher: International Microelectronics Assembly and Packaging Society (IMAPS)
Authors:H. Nishikawa; K. Niwa
Year: 2013
Document Type:
Factors affecting conduction in novel isotropic conductive adhesives filled with silver coated polymer spheres
Publisher: International Microelectronics Assembly and Packaging Society (IMAPS)
Authors:S. Jain; D. C. Whalley; M. Cottrill; H. Kristiansen; K. Redford; S. Helland; T. Helland; Erik Kalland; C. Liu
Year: 2013
Document Type:
Evaluation of the hot embossing technology for the fabrication of resonant circuits as instrument visualization method for interventional magnetic resonance imaging
Publisher: International Microelectronics Assembly and Packaging Society (IMAPS)
Authors:Markus Detert; Mandy Kaiser; Stephan Friesecke; Georg Rose; Bertram Schmidt
Year: 2013
Document Type:
Epoxy molding compounds for high temperature applications
Publisher: International Microelectronics Assembly and Packaging Society (IMAPS)
Authors:A. Mavinkurve; L. Goumans; J. Martens
Year: 2013
Document Type:
Copper filled polyurethane based electrically conductive adhesive with improved mechanical strength
Publisher: International Microelectronics Assembly and Packaging Society (IMAPS)
Authors:Li-Ngee Ho; Hiroshi Nishikawa
Year: 2013
Document Type:
Reliable filling of through vias with silver based conductive adhesives in flexible PEN substrates using low-cost optimized stencil printing methods
Publisher: International Microelectronics Assembly and Packaging Society (IMAPS)
Authors:Maria Peter; Daan van den Ende; Bart van Remoortere; Steven van Put; Tomas Podprocky; Anja Henckens; Jeroen van den Brand
Year: 2013
Document Type:
ENEPIG finish: An alternative solution for space printed circuit boards (PCB)
Publisher: International Microelectronics Assembly and Packaging Society (IMAPS)
Authors:A. Chaillot; N. Venet; P-E Tegehall; J. Hokka; J-L Lortal
Year: 2013
Document Type:
Vacuum packaging at wafer level for MEMS using gold-tin metallurgy
Publisher: International Microelectronics Assembly and Packaging Society (IMAPS)
Authors:C-A Manier; K. Zoschke; H. Oppermann; D. Ruffieux; S. Dalla Piazza; T. Suni; J. Dekker; G. Allegato
Year: 2013
Document Type:
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