Millimeter-Wave Transmission Line in 90-nm CMOS Technology
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Heng-Ming Hsu; Tai-Hsin Lee; Chan-Jung Hsu
Year: 2012
Opportunities and Challenges of Using Plasmonic Components in Nanophotonic Architectures
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:H. M. G. Wassel; Daoxin Dai; M. Tiwari; J. K. Valamehr; L. Theogarajan; J. Dionne; F. T. Chong; T. Sherwood
Year: 2012
A 1 TB/s 1 pJ/b 6.4 ${\rm mm}^{2}/{\rm TB/s}$ QDR Inductive-Coupling Interface Between 65-nm CMOS Logic and Emulated 100-nm DRAM
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:N. Miura; M. Saito; T. Kuroda
Year: 2012
A Low Energy Network-on-Chip Fabric for 3-D Multi-Core Architectures
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:V. S. Nandakumar; Malgorzata Marek-Sadowska
Year: 2012
Using Transmission Lines for Global On-Chip Communication
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:A. Carpenter; Jianyun Hu; Jie Xu; M. Huang; Hui Wu; Peng Liu
Year: 2012
Guest Editorial New Interconnect Technologies in On-Chip Communication
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Kiyoung Choi; John Kim; Gabriel Loh
Year: 2012
Swizzle-Switch Networks for Many-Core Systems
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:K. Sewell; R. G. Dreslinski; T. Manville; S. Satpathy; N. Pinckney; G. Blake; M. Cieslak; R. Das; T. F. Wenisch; D. Sylvester; D. Blaauw; T. Mudge
Year: 2012
Analysis of Noncoherent ASK Modulation-Based RF-Interconnect for Memory Interface
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Yanghyo Kim; Sai-Wang Tam; Gyung-Su Byun; Hao Wu; Lan Nan; G. Reinman; J. Cong; M. F. Chang
Year: 2012
DCOF—An Arbitration Free Directly Connected Optical Fabric
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:C. Nitta; M. Farrens; V. Akella
Year: 2012
Utilizing Radio-Frequency Interconnect for a Many-DIMM DRAM System
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:K. Therdsteerasukdi; Gyung-Su Byun; J. Ir; G. Reinman; J. Cong; M. F. Chang
Year: 2012
Designing Chip-Level Nanophotonic Interconnection Networks
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:C. Batten; A. Joshi; V. Stojanovic; K. Asanovic
Year: 2012
Exploiting New Interconnect Technologies in On-Chip Communication
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:J. Kim; Kiyoung Choi; G. Loh
Year: 2012
IEEE Journal on Emerging and Selected Topics in Circuits and Systems publication information
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Year: 2012
IEEE Journal on Emerging and Selected Topics in Circuits and Systems information for authors
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Year: 2012
IEEE Xplore Digital Library [advertisement]
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Year: 2012
CMOS-3D Smart Imager Architectures for Feature Detection
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:M. Suarez; V. M. Brea; J. Fernandez-Berni; R. Carmona-Galan; G. Linan; D. Cabello; A. Rodriguez-Vazquez
Year: 2012
Power Distribution in TSV-Based 3-D Processor-Memory Stacks
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:S. M. Satheesh; E. Salman
Year: 2012
An Optically Powered CMOS Receiver System for Intravascular Magnetic Resonance Applications
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:B. Sarioglu; O. Aktan; A. Oncu; S. Mutlu; G. Dundar; A. D. Yalcinkaya
Year: 2012
Heterogeneous Integration of Bio-Sensing System-on-Chip and Printed Electronics
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Li Xie; Geng Yang; M. Mantysalo; Lin-Lin Xu; F. Jonsson; Li-Rong Zheng
Year: 2012
A Self-Contained System With CNTs-Based Biosensors for Cell Culture Monitoring
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:C. Boero; J. Olivo; S. Carrara; G. De Micheli
Year: 2012
Distributed On-Chip Power Delivery
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:S. Kose; E. G. Friedman
Year: 2012
3-D Sequential Integration: A Key Enabling Technology for Heterogeneous Co-Integration of New Function With CMOS
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:P. Batude; T. Ernst; J. Arcamone; G. Arndt; P. Coudrain; P.-E Gaillardon
Year: 2012
Editorial
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Giovanni De Micheli; Subhasish Mitra; Maciej Ogorzalek
Year: 2012
IEEE Circuits and Systems Society Information
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Year: 2012
IEEE Journal on Emerging and Selected Topics in Circuits and Systems publication information
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Year: 2012
IEEE Journal on Emerging and Selected Topics in Circuits and Systems information for authors
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Year: 2012
2012 Index IEEE Journal on Emerging and Selected Topics in Circuits and Systems Vol. 2
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Year: 2012
Compressive Spectrum Sensing Using a Bandpass Sampling Architecture
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:L. Bai; S. Roy
Year: 2012
Compressive Sensing for Sparse Touch Detection on Capacitive Touch Screens
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Chenchi Luo; M. A. Borkar; A. J. Redfern; J. H. McClellan
Year: 2012
Stochastic Gradient Pursuit for Adaptive Equalization of Sparse Multipath Channels
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:E. Vlachos; A. S. Lalos; K. Berberidis
Year: 2012
Fast and Robust Compressive Sensing Method Using Mixed Hadamard Sensing Matrix
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:S. L. Shishkin
Year: 2012
A Compressed Sensing Parameter Extraction Platform for Radar Pulse Signal Acquisition
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Juhwan Yoo; C. Turnes; E. B. Nakamura; C. K. Le; S. Becker; E. A. Sovero; M. B. Wakin; M. C. Grant; J. Romberg; A. Emami-Neyestanak; E. Candes
Year: 2012
Low Power Sparse Approximation on Reconfigurable Analog Hardware
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:S. Shapero; A. S. Charles; C. J. Rozell; P. Hasler
Year: 2012
A Nonuniform Sampler for Wideband Spectrally-Sparse Environments
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:M. Wakin; S. Becker; E. Nakamura; M. Grant; E. Sovero; D. Ching; Juhwan Yoo; J. Romberg; A. Emami-Neyestanak; E. Candes
Year: 2012
Interval-Passing Algorithm for Non-Negative Measurement Matrices: Performance and Reconstruction Analysis
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:V. Ravanmehr; L. Danjean; B. Vasic; D. Declercq
Year: 2012
Maximum a Posteriori Based Approach for Target Detection in MTI Radar
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:M. D. Hyder; K. Mahata
Year: 2012
Progressive Compressed Sensing and Reconstruction of Multidimensional Signals Using Hybrid Transform/Prediction Sparsity Model
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:G. Coluccia; S. K. Kuiteing; A. Abrardo; M. Barni; E. Magli
Year: 2012
VLSI Design of Approximate Message Passing for Signal Restoration and Compressive Sensing
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:P. Maechler; C. Studer; D. E. Bellasi; A. Maleki; A. Burg; N. Felber; H. Kaeslin; R. G. Baraniuk
Year: 2012
Fast Decoding and Hardware Design for Binary-Input Compressive Sensing
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Min Wang; Jun Wu; Sai Feng Shi; Chong Luo; Feng Wu
Year: 2012
Design and Exploration of Low-Power Analog to Information Conversion Based on Compressed Sensing
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:H. Mamaghanian; N. Khaled; D. Atienza; P. Vandergheynst
Year: 2012
A Hybrid Architecture for Compressive Sensing 3-D CT Reconstruction
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Jianwen Chen; Jason Cong; Luminita A. Vese; John Villasenor; Ming Yan; Yi Zou
Year: 2012
A Sub-Nyquist Rate Compressive Sensing Data Acquisition Front-End
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Xi Chen; E. A. Sobhy; Zhuizhuan Yu; S. Hoyos; J. Silva-Martinez; S. Palermo; B. M. Sadler
Year: 2012
A Low-Power Compressive Sampling Time-Based Analog-to-Digital Converter
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:P. K. Yenduri; A. Z. Rocca; A. S. Rao; S. Naraghi; M. P. Flynn; A. C. Gilbert
Year: 2012
Image Compressive Sensing Recovery via Collaborative Sparsity
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Jian Zhang; Debin Zhao; Chen Zhao; Ruiqin Xiong; Siwei Ma; Wen Gao
Year: 2012
A Pragmatic Look at Some Compressive Sensing Architectures With Saturation and Quantization
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:J. Haboba; M. Mangia; F. Pareschi; R. Rovatti; G. Setti
Year: 2012
Digital-Assisted Asynchronous Compressive Sensing Front-End
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Jun Zhou; M. Ramirez; S. Palermo; S. Hoyos
Year: 2012
Impact of Compressed Sensing With Quantization on UWB Receivers With Multipath Channel Estimation
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:O. U. Khan; Shao-Yuan Chen; D. D. Wentzloff; W. E. Stark
Year: 2012
Analog-to-Information and the Nyquist Folding Receiver
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:R. Maleh; G. L. Fudge; F. A. Boyle; P. E. Pace
Year: 2012
Multi-Channel Sparse Data Conversion With a Single Analog-to-Digital Converter
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Youngchun Kim; Wenjuan Guo; B. V. Gowreesunker; Nan Sun; A. H. Tewfik
Year: 2012
A Time-Encoding Machine Based High-Speed Analog-to-Digital Converter
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Xiangming Kong; R. Matic; Zhiwei Xu; V. Kukshya; P. Petre; J. Jensen
Year: 2012
Editorial
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:David Allstot; Riccardo Rovatti; Gianluca Setti
Year: 2012
Algorithms to Approximately Solve NP Hard Row-Sparse MMV Recovery Problem: Application to Compressive Color Imaging
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:A. Majumdar; R. K. Ward; T. Aboulnasr
Year: 2012
IEEE Circuits and Systems Society Information
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Year: 2012
IEEE Journal on Emerging and Selected Topics in Circuits and Systems publication information
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Year: 2012
IEEE Journal on Emerging and Selected Topics in Circuits and Systems information for authors
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Year: 2012
Open Access [advertisement]
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Year: 2012
Real-Time Structural Analysis of Compositionally Graded InGaAs/GaAs(0 0 1) Layers
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:T. Sasaki; H. Suzuki; M. Inagaki; K. Ikeda; K. Shimomura; M. Takahasi; M. Kozu; Wen Hu; I. Kamiya; Y. Ohshita; M. Yamaguchi
Year: 2012
Detailed Investigation of Surface Passivation Methods for Lifetime Measurements on P-Type Silicon Wafers
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:K. L. Pollock; J. Junge; Giso Hahn
Year: 2012
A Contactless Method for Determining the Carrier Mobility Sum in Silicon Wafers
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:F. E. Rougieux; Peiting Zheng; M. Thiboust; J. Tan; N. E. Grant; D. H. Macdonald; A. Cuevas
Year: 2012
A Maximum Power Point Tracker for Long-Term Logging of PV Module Performance
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:U. Zimmermann; M. Edoff
Year: 2012
Solar Profiles and Spectral Modeling for CPV Simulations
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:I. R. Cole; T. R. Betts; R. Gottschalg
Year: 2012
Demonstration of Photon Coupling in Dual Multiple-Quantum-Well Solar Cells
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:K. H. Lee; K. W. J. Barnham; J. P. Connolly; B. C. Browne; R. J. Airey; J. S. Roberts; M. Fuhrer; T. N. D. Tibbits; N. J. Ekins-Daukes
Year: 2012
Current Losses at the Front of Silicon Heterojunction Solar Cells
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Z. C. Holman; A. Descoeudres; L. Barraud; F. Z. Fernandez; J. P. Seif; S. De Wolf; C. Ballif
Year: 2012
Understanding and Fabrication of 20% Efficient Cells Using Spin-on-Based Simultaneous Diffusion and Dielectric Passivation
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:S. Ramanathan; V. Meemongkolkiat; A. Das; A. Rohatgi; I. Koehler
Year: 2012
Reliability Study of Ruthenium-Based Dye-Sensitized Solar Cells (DSCs)
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:D. Bari; A. Cester; N. Wrachien; L. Ciammaruchi; T. M. Brown; A. Reale; A. Di Carlo; G. Meneghesso
Year: 2012
Metamorphic GaAsP and InGaP Solar Cells on GaAs
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:S. Tomasulo; K. N. Yaung; M. L. Lee
Year: 2012
IEEE Journal of Photovoltaics information for authors
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Year: 2012
Special issue on advanced modeling of power devices and their applications
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Year: 2012
IEEE Foundation [advertisement]
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Year: 2012
IEEE Journal of Photovoltaics publication information
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Year: 2012
Thermal Performance of the SunPower Alpha-2 PV Concentrator
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:R. J. Linderman; Z. S. Judkins; M. Shoecraft; M. J. Dawson
Year: 2012
New Generation Transparent LPCVD ZnO Electrodes for Enhanced Photocurrent in Micromorph Solar Cells and Modules
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:L. Ding; M. Boccard; G. Bugnon; M. Benkhaira; M. Despeisse; F. Sculati-Meillaud; S. Nicolay; P. A. Losio; O. Kluth; P. Carroy; O. Caglar; C. Ballif
Year: 2012
Superposition and Reciprocity in the Electroluminescence and Photoluminescence of Solar Cells
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:U. Rau
Year: 2012
In Situ Current Determination of a-Si/μc-Si Tandem Solar Cells via Transmission Measurements During Silicon PECVD
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:M. Meier; T. Merdzhanova; U. W. Paetzold; S. Muthmann; A. Mück; R. Schmitz; A. Gordijn
Year: 2012
Gallium Arsenide Solar Cell Absorption Enhancement Using Whispering Gallery Modes of Dielectric Nanospheres
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:J. Grandidier; D. M. Callahan; J. N. Munday; H. A. Atwater
Year: 2012
Status of C3MJ+ and C4MJ Production Concentrator Solar Cells at Spectrolab
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:J. H. Ermer; R. K. Jones; P. Hebert; P. Pien; R. R. King; D. Bhusari; R. Brandt; O. Al-Taher; C. Fetzer; G. S. Kinsey; N. Karam
Year: 2012
High-Efficiency, Multijunction nc-Si:H-Based Solar Cells at High Deposition Rate
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:A. Banerjee; T. Su; D. Beglau; G. Pietka; F. S. Liu; S. Almutawalli; J. Yang; S. Guha
Year: 2012
Optimal Bandgap Combinations—Does Material Quality Matter?
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:N. L. A. Chan; N. J. Ekins-Daukes; J. G. J. Adams; M. P. Lumb; M. Gonzalez; P. P. Jenkins; I. Vurgaftman; J. R. Meyer; R. J. Walters
Year: 2012
The Relation Between the Bandgap and the Anisotropic Nature of Hydrogenated Amorphous Silicon
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:A. H. M. Smets; M. A. Wank; B. Vet; M. Fischer; R. A. C. M. M. van Swaaij; M. Zeman; D. C. Bobela; C. R. Wronski; R. M. C. M. van de Sanden
Year: 2012
Nanometer- and Micrometer-Scale Texturing for High-Efficiency Micromorph Thin-Film Silicon Solar Cells
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:M. Boccard; P. Cuony; C. Battaglia; S. Hänni; S. Nicolay; L. Ding; M. Benkhaira; G. Bugnon; A. Billet; M. Charrière; K. Söderström; J. Escarré; F. Sculati-Meillaud; M. Despeisse; C. Ballif
Year: 2012
Single-Variable Optimization Method for Evaluating Solar Cell and Solar Module Parameters
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:F. Caracciolo; E. Dallago; D. G. Finarelli; A. Liberale; P. Merhej
Year: 2012
Experimental Study of Design Parameters in Silicon Micropillar Array Solar Cells Produced by Soft Lithography and Metal-Assisted Chemical Etching
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Jae Cheol Shin; D. Chanda; W. Chern; Ki Jun Yu; J. A. Rogers; Xiuling Li
Year: 2012
A New Technique for Tracking the Global Maximum Power Point of PV Arrays Operating Under Partial-Shading Conditions
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:E. Koutroulis; F. Blaabjerg
Year: 2012
Measurement of the Open-Circuit Voltage of Individual Subcells in a Dual-Junction Solar Cell
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:J. Holovský; M. Bonnet-Eymard; G. Bugnon; P. Cuony; M. Despeisse; C. Ballif
Year: 2012
Honeycomb Texturing of Silicon Via Nanoimprint Lithography for Solar Cell Applications
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:H. Hauser; B. Michl; S. Schwarzkopf; V. Kübler; C. Müller; M. Hermle; B. Bläsi
Year: 2012
12.0% Efficiency on Large-Area, Encapsulated, Multijunction nc-Si:H-Based Solar Cells
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:A. Banerjee; Frank Shengzhong Liu; D. Beglau; Tining Su; G. Pietka; J. Yang; S. Guha
Year: 2012
Kerf-Less Removal of Si, Ge, and III–V Layers by Controlled Spalling to Enable Low-Cost PV Technologies
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:S. W. Bedell; D. Shahrjerdi; B. Hekmatshoar; K. Fogel; P. A. Lauro; J. A. Ott; N. Sosa; D. Sadana
Year: 2012
Increasing Upconversion by Plasmon Resonance in Metal Nanoparticles—A Combined Simulation Analysis
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:J. C. Goldschmidt; S. Fischer; H. Steinkemper; F. Hallermann; G. von Plessen; K. W. Krämer; D. Biner; M. Hermle
Year: 2012
Contactless Qualitative Series Resistance Imaging on Solar Cells
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:M. Kasemann; L. M. Reindl; B. Michl; W. Warta; A. Schütt; J. Carstensen
Year: 2012
Wide Band Gap Gallium Phosphide Solar Cells
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Xuesong Lu; S. Huang; M. B. Diaz; N. Kotulak; R. Hao; R. Opila; A. Barnett
Year: 2012
Maximizing the Power Output of Partially Shaded Photovoltaic Plants Through Optimization of the Interconnections Among Its Modules
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:L. F. L. Villa; D. Picault; B. Raison; S. Bacha; A. Labonne
Year: 2012
Effect of UV-Ozone Exposure on PCBM
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:A. B. Belay; Wei Zhou; R. Krueger; K. O. Davis; U. Alver; N. Sorloaica-Hickman
Year: 2012
Enhanced Carrier Escape in MSQW Solar Cell and Its Impact on Photovoltaics Performance
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Yu Wen; Yunpeng Wang; K. Watanabe; M. Sugiyama; Y. Nakano
Year: 2012
Synergistic Effects of Rear-Surface Passivation and the Metal Wrap Through Concept
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:B. Thaidigsmann; A. Drews; T. Fellmeth; P. Saint-Cast; A. Wolf; F. Clement; R. Preu; D. Biro
Year: 2012
Ga Composition Dictates Macroscopic Photovoltaic and Nanoscopic Electrical Characteristics of Cu(In $_{1-X}$Ga$_X$)Se $_2$ Thin Films via Grain-Boundary-Type Inversion
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Wenjie Li; S. R. Cohen; K. Gartsman; D. Cahen
Year: 2012
IEEE Journal of Photovoltaics information for authors
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Year: 2012
IEEE Journal of Photovoltaics publication information
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Year: 2012
Special issue on advanced modeling of power devices and their applications
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Year: 2012
3rd International Symposium on Reliability of Optoelectronics for Space (ISROS 2012)
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Year: 2012
Optimization of ZnO Front Electrodes for High-Efficiency Micromorph Thin-Film Si Solar Cells
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:M. Boccard; T. Söderström; P. Cuony; C. Battaglia; S. Hänni; S. Nicolay; L. Ding; M. Benkhaira; G. Bugnon; A. Billet; M. Charrière; F. Meillaud; M. Despeisse; C. Ballif
Year: 2012
First-Year Performance of a 20-MW$_{\rm ac}$ PV Power Plant
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:A. F. Panchula; W. Hayes; A. Kimber
Year: 2012
A Superlattice Solar Cell With Enhanced Short-Circuit Current and Minimized Drop in Open-Circuit Voltage
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Yunpeng Wang; Yu Wen; Hassanet Sodabanlu; Kentaroh Watanabe; Masakazu Sugiyama; Yoshiaki Nakano
Year: 2012
Bifacial Growth InGaP/GaAs/InGaAs Concentrator Solar Cells
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Steven Wojtczuk; Philip Chiu; Xuebing Zhang; Daryl Pulver; Chris Harris; Mike Timmons
Year: 2012
Influence of Solvents and Surface Treatment on Photovoltaic Response of DSSC Based on Natural Curcumin Dye
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:C. O. Sreekala; I. Jinchu; K. S. Sreelatha; Yojana Janu; Narottam Prasad; Manish Kumar; Amit K. Sadh; M. S. Roy
Year: 2012
Open-Circuit Voltage Improvement of InAs/GaAs Quantum-Dot Solar Cells Using Reduced InAs Coverage
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Christopher G. Bailey; David V. Forbes; Stephen J. Polly; Zachary S. Bittner; Yushuai Dai; Chelsea Mackos; Ryne P. Raffaelle; Seth M. Hubbard
Year: 2012
An Explicit Multiexponential Model as an Alternative to Traditional Solar Cell Models With Series and Shunt Resistances
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Adelmo Ortiz-Conde; Denise Lugo-Muñoz; Francisco J. García-Sánchez
Year: 2012
Design and Construction of a ∼7× Low-Concentration Photovoltaic System Based on Compound Parabolic Concentrators
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Mark A. Schuetz; Kara A. Shell; Scott A. Brown; Gregory S. Reinbolt; Roger H. French; Robert J. Davis
Year: 2012
Compositional Gradients in Cu(In,Ga)Se$_{\bf 2}$ Thin Films for Solar Cells and Their Effects on Structural Defects
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Jens Dietrich; Daniel Abou-Ras; Thorsten Rissom; Thomas Unold; Hans-Werner Schock; Christian Boit
Year: 2012
Real-Time Irradiance Simulation for PV Products and Building Integrated PV in a Virtual Reality Environment
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Anton J. Veldhuis; Angele H. M. E. Reinders
Year: 2012
Separation of Series Resistance and Space Charge Region Recombination in Crystalline Silicon Solar Cells From Dark and Illuminated Current–Voltage Characteristics
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Johannes Greulich; Markus Glatthaar; Stefan Rein
Year: 2012
Separation of Front and Backside Surface Recombination by Photoluminescence Imaging on Both Wafer Sides
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Bernhard Michl; Johannes A. Giesecke; Wilhelm Warta; Martin C. Schubert
Year: 2012
Wafer-Scale Growth of Silicon Microwire Arrays for Photovoltaics and Solar Fuel Generation
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Adele C. Tamboli; Christopher T. Chen; Emily L. Warren; Daniel B. Turner-Evans; Michael D. Kelzenberg; Nathan S. Lewis; Harry A. Atwater
Year: 2012
Latest Developments of High-Efficiency Micromorph Tandem Silicon Solar Cells Implementing Innovative Substrate Materials and Improved Cell Design
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Fanny Meillaud; Adrian Billet; Corsin Battaglia; Mathieu Boccard; Grégory Bugnon; Peter Cuony; Mathieu Charrière; Matthieu Despeisse; Laura Ding; Jordi Escarre-Palou; Simon Hänni; Linus Löfgren; Sylvain Nicolay; Gaetano Parascandolo; Michael E. Stückelberger; Christophe Ballif
Year: 2012
Recent Progress in Modeling, Simulation, and Optimization of Polymer Solar Cells
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Guangyong Li; Liming Liu; Fanan Wei; Songtao Xia; Xiaoping Qian
Year: 2012
Contacting Interdigitated Back-Contact Solar Cells With Four Busbars for Precise Current–Voltage Measurements Under Standard Testing Conditions
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Carsten Schinke; Fabian Kiefer; Matthias Offer; David Hinken; Arne Schmidt; Nils-Peter Harder; Robert Bock; Till Brendemuhl; Jan Schmidt; Karsten Bothe; Rolf Brendel
Year: 2012
InGaN Solar Cells: Present State of the Art and Important Challenges
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Ashraful Ghani Bhuiyan; Kenichi Sugita; Akihiro Hashimoto; Akio Yamamoto
Year: 2012
Experimental Results From Performance Improvement and Radiation Hardening of Inverted Metamorphic Multijunction Solar Cells
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:P. Patel; D. Aiken; A. Boca; B. Cho; D. Chumney; M. B. Clevenger; A. Cornfeld; N. Fatemi; Y. Lin; J. McCarty; F. Newman; P. Sharps; J. Spann; M. Stan; J. Steinfeldt; C. Strautin; T. Varghese
Year: 2012
Experimental Analysis of Majority Carrier Transport Processes at Heterointerfaces in Photovoltaic Devices
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:R. Hoheisel; A. W. Bett
Year: 2012
Resonant thermotunneling design for high-performance single-junction quantum-well solar cells
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Andenet Alemu; Alexandre Freundlich
Year: 2012
Photocurrent Generation by Two-Step Photon Absorption With Quantum-Well Superlattice Cell
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Masakazu Sugiyama; Yunpeng Wang; Kentaroh Watanabe; Takayuki Morioka; Yoshitaka Okada; Yoshiaki Nakano
Year: 2012
Antireflection Coating Design for Triple-Junction III–V/Ge High-Efficiency Solar Cells Using Low Absorption PECVD Silicon Nitride
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Ram Homier; Abdelatif Jaouad; Artur Turala; Christopher E. Valdivia; Denis Masson; Steven G. Wallace; Simon Fafard; Richard Ares; Vincent Aimez
Year: 2012
Strong Internal and External Luminescence as Solar Cells Approach the Shockley–Queisser Limit
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Owen D. Miller; Eli Yablonovitch; Sarah R. Kurtz
Year: 2012
2013 Karl W. Boer Solar Energy Medal of Merit
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Year: 2012
IEEE Journal of Photovoltaics information for authors
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Year: 2012
IEEE Journal of Photovoltaics publication information
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Year: 2012
Simulation Tool for Equivalent Circuit Modeling of Photovoltaic Devices
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:S. Eidelloth; F. Haase; R. Brendel
Year: 2012
A Crystalline Metallic Copper Network Application Film Produced by High-Temperature Atmospheric Sintering
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:T. Kato; S. Adachi; T. Aoyagi; T. Naito; H. Yamamoto; T. Nojiri; M. Yoshida
Year: 2012
Influence of a-Si:H Deposition Temperature on Surface Passivation Property and Thermal Stability of a-Si:H/SiN$_{x}$:H Stack
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Hua Li; S. Wenham
Year: 2012
A Review and Comparison of One- and Two-Dimensional Simulations of Solar Cells Featuring Selective Emitters
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:J. Greulich; Ulrich Jager̈; S. Rein; R. Preu
Year: 2012
Analysis of Phosphorus-Doped Silicon Oxide Layers Deposited by Means of PECVD as a Dopant Source in Diffusion Processes
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:A. Fallisch; D. Wagenmann; R. Keding; D. Trogus; M. Hofmann; J. Rentsch; H. Reinecke; D. Biro
Year: 2012
The Effect of Spectrum Variation on the Energy Production of Triple-Junction Solar Cells
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Xiaoting Wang; A. Barnett
Year: 2012
Static Large-Area Hydrogenation of Polycrystalline Silicon Thin-Film Solar Cells on Glass Using a Linear Microwave Plasma Source
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:H. Hidayat; P. I. Widenborg; A. Kumar; F. Law; A. G. Aberle
Year: 2012
An Infant Mortality Study of III–V Multijunction Concentrator Cells
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:N. Bosco; C. Sweet; M. Ludowise; S. Kurtz
Year: 2012
Reverse Saturation Current Density Imaging of Highly Doped Regions in Silicon Employing Photoluminescence Measurements
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:J. Müller; K. Bothe; S. Herlufsen; T. Ohrdes; R. Brendel
Year: 2012
Temperature Dependence of Open-Circuit Voltage and UPS Study for P3HT:PCBM Organic Solar Cells
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Yang Shen; L. Scudiero; M. C. Gupta
Year: 2012
An Investigation of the Surface Properties of (Ag,Cu)(In,Ga)Se $_{\bf 2}$ Thin Films
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:H. Simchi; B. E. McCandless; K. Kim; J. H. Boyle; R. W. Birkmire; W. N. Shafarman
Year: 2012
Isotextured Silicon Solar Cell Analysis and Modeling 2: Recombination and Device Modeling
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:S. C. Baker-Finch; K. R. McIntosh; M. L. Terry; Yimao Wan
Year: 2012
Maximum-Power-Based PV Performance Validation Method: Application to Single-Axis Tracking and Fixed-Tilt c-Si Systems in the Italian Alpine Region
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:A. Colli; W. J. Zaaiman
Year: 2012
Investigating Internal Gettering of Iron at Grain Boundaries in Multicrystalline Silicon via Photoluminescence Imaging
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:AnYao Liu; D. Walter; Sieu Pheng Phang; D. Macdonald
Year: 2012
Dynamic Stability of Three-Phase Grid-Connected Photovoltaic System Using Zero Dynamic Design Approach
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:M. A. Mahmud; H. R. Pota; M. J. Hossain
Year: 2012
Limits of Advisability for Master–Slave Configuration of DC–AC Converters in Photovoltaic Systems
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:F. Spertino; F. Corona; P. Di Leo
Year: 2012
A Method for Imaging the Emitter Saturation Current With Lateral Resolution
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:M. Müller; P. P. Altermatt; K. Schlegel; G. Fischer
Year: 2012
Isotextured Silicon Solar Cell Analysis and Modeling 1: Optics
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:S. C. Baker-Finch; K. R. McIntosh; M. L. Terry
Year: 2012
GeSiSn Photodiodes With 1 eV Optical Gaps Grown on Si(100) and Ge(100) Platforms
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:R. T. Beeler; D. J. Smith; J. Kouvetakis; J. Menéndez
Year: 2012
Performance Analysis of a Single-Axis Tracking PV System
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:A. Dolara; F. Grimaccia; S. Leva; M. Mussetta; R. Faranda; M. Gualdoni
Year: 2012
Geometrical Analysis of Solar Cells With Partial Rear Contacts
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:A. Cuevas
Year: 2012
Hot Carrier Solar Cells: Controlling Thermalization in Ultrathin Devices
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:A. Le Bris; J. Rodiere; C. Colin; S. Collin; Jean-Luc Pelouard; R. Esteban; M. Laroche; Jean-Jacques Greffet; Jean-François Guillemoles
Year: 2012
Using Phase Effects to Understand Measurements of the Quantum Efficiency and Related Luminescent Coupling in a Multijunction Solar Cell
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:M. A. Steiner; S. R. Kurtz; J. F. Geisz; W. E. McMahon; J. M. Olson
Year: 2012
Comparison of Analytical and Numerical Models for the Optimization of c-Si Solar Cells’ Front Metallization
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:J. Greulich; T. Fellmeth; M. Glatthaar; D. Biro; S. Rein
Year: 2012
Colored Ribbons Achieve +0.28%$_{\bf abs.}$ Efficiency Gain
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:L. Hamann; Liv Prönneke; J. H. Werner
Year: 2012
IEEE Journal of Photovoltaics publication information
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Year: 2012
Special Issue on GaN Electronic Devices
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Year: 2012
2012 Index IEEE Journal of Photovoltaics Vol. 2
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Year: 2012
Ultracompact UHF Tunable Filter Embedded Into Multilayered Organic Packaging Substrate
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Tae-Chang Lee; Seong-Jong Cheon; Jae-Yeong Park
Year: 2012
Optimization of Phase Change Material Heat Sinks for Low Duty Cycle High Peak Load Power Supplies
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:A. Stupar; U. Drofenik; J. W. Kolar
Year: 2012
Enhancing the Fracture Resistance of Medium/Small-Sized TFT-LCDs Using the Six Sigma Methodology
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Chao-Ton Su; Yu-Hsiang Hsiao; Yen-Lin Liu
Year: 2012
Reduction of Thermal Resistance of High-Power Amplifiers by Carbon Fiber-Reinforced Carbon Composite-Based Package
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:N. Kuroda; A. Wakejima; M. Tanomura; K. Ota; Y. Ando; T. Nakayama; Y. Okamoto; K. Matsunaga; H. Miyamoto
Year: 2012
Moving Boundary Simulation and Experimental Verification of High Aspect-Ratio Through-Silicon-Vias for 3-D Integration
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Chongshen Song; Zheyao Wang; Zhimin Tan; Litian Liu
Year: 2012
Integrated Transformer-Coupled Balun Bandpass Filters With an Optimal Common-Mode Rejection Ratio
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Chien-Hsun Chen; Chien-Hsiang Huang; Tzyy-Sheng Horng
Year: 2012
Novel Chip-Last Method for Embedded Actives in Organic Packaging Substrates
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Baik-Woo Lee; V. Sundaram; S. Kennedy; D. Baars; R. Tummala
Year: 2012
WISE: Warped Impulse Structure Estimation for Time-Domain Linear Macromodeling
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Chi-Un Lei; Ngai Wong
Year: 2012
Improving conduction and mechanical reliability of woven metal interconnects
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:R. Bhattacharya; L. van Pieterson; K. van Os
Year: 2012
Signal Integrity Analysis of High-Speed Interconnects by Using Nonconformal Domain Decomposition Method
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Yang Shao; Zhen Peng; Jin-Fa Lee
Year: 2012
Study on the Effect of Wafer Back Grinding Process on Nanomechanical Behavior of Multilayered Low-k Stack
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:V. N. Sekhar; Lu Shen; A. Kumar; Tai Chong Chai; Xiaowu Zhang; C. S. Premchandran; V. Kripesh; Seung Wook Yoon; J. H. Lau
Year: 2012
Fast Layout Generation of RF Embedded Passive Circuits Using Mathematical Programming
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:M. Pathak; Sung Kyu Lim
Year: 2012
Reliable Operation for 14500 h of a Wavelength-Stabilized Diode Laser System on a Microoptical Bench at 671 nm
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:B. Sumpf; M. Maiwald; A. Muller; A. Ginolas; K. Hausler; G. Erbert; G. Trankle
Year: 2012
Random Rough Surface Effects in Waveguides Using Mode Matching Technique and the Method of Moments
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Ruihua Ding; Leung Tsang; H. Braunisch
Year: 2012
CUSUM Charts for Monitoring Bivariate Zero-Inflated Poisson Processes With an Application in the LED Packaging Industry
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Shuguang He; Zhen He; G. A. Wang
Year: 2012
Affect of Anneal Temperature on All-Copper Flip-Chip Connections Formed via Electroless Copper Deposition
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Hyo-Chol Koo; C. Lightsey; P. A. Kohl
Year: 2012
High Density Metal–Metal Interconnect Bonding for 3-D Integration
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:J. M. Lannon; C. Gregory; M. Lueck; J. D. Reed; C. A. Huffman; D. Temple
Year: 2012
IEEE Transactions on Components, Packaging and Manufacturing Technology publication information
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Year: 2012
IEEE Components, Packaging, and Manufacturing Technology Society information for authors
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Year: 2012
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Year: 2012
Impact of the Surface Roughness Description on the Electrical Contact Resistance of Ohmic Switches Under Low Actuation Forces
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:F. Pennec; D. Peyrou; D. Leray; P. Pons; R. Plana; F. Courtade
Year: 2012
Process and Reliability of Embedded Micro-Wafer-Level Package (EMWLP) Using Low Cure Temperature Dielectric Material
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:V. S. Rao; V. N. Sekhar; Ho Soon Wee; R. Rajoo; G. Sharma; Lim Ying Ying; P. Damaruganath
Year: 2012
IEEE Components, Packaging, and Manufacturing Technology Society Information
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Year: 2012
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Year: 2012
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Year: 2012
GaN-Based LEDs With Sapphire Debris Removed by Phosphoric Etching
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Shoou-Jinn Chang; D. S. Kuo; K. T. Lam; K. H. Wen; T. K. Ko; S. J. Hon
Year: 2012
Silicon Carbide Power Modules for High-Temperature Applications
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:M. J. Palmer; R. W. Johnson; T. Autry; R. Aguirre; V. Lee; J. D. Scofield
Year: 2012
Pick-and-Place Silver Sintering Die Attach of Small-Area Chips
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:J. Kahler; N. Heuck; A. Stranz; A. Waag; E. Peiner
Year: 2012
Thermal Conductivity Enhancement of Benzocyclobutene With Carbon Nanotubes for Adhesive Bonding in 3-D Integration
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Xiangming Xu; Zheyao Wang
Year: 2012
Vibration-Induced Changes in the Contact Resistance of High Power Electrical Connectors for Hybrid Vehicles
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Rujian Fu; Song-Yul Ben Choe; R. L. Jackson; G. T. Flowers; M. J. Bozack; Liang Zhong; Daegee Kim
Year: 2012
On-Chip Two-Phase Cooling With Refrigerant 85 $\mu{\rm m}$-Wide Multi-Microchannel Evaporator Under Hot-Spot Conditions
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:E. Costa-Patry; S. Nebuloni; J. Olivier; J. R. Thome
Year: 2012
Parameterized Partial Element Equivalent Circuit Method for Sensitivity Analysis of Multiport Systems
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:L. De Camillis; F. Ferranti; G. Antonini; Dries Vande Ginste; Daniël De Zutter
Year: 2012
Thermal Analysis and Packaging Optimization of Collector-Up HBTs Using an Enhanced Genetic-Algorithm Methodology
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Hsien-Cheng Tseng; Jhin-Yuan Chen
Year: 2012
Extension of the Contour Integral Method to Anisotropic Modes on Circular Ports
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Xiaomin Duan; Renato Rimolo-Donadio; Heinz-Dietrich Bruns; C. Schuster
Year: 2012
Microstructurally Adaptive Model for Primary and Secondary Creep of Sn-Ag-Based Solders
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:P. Kumar; Zhe Huang; S. C. Chavali; D. K. Chan; I. Dutta; G. Subbarayan; V. Gupta
Year: 2012
Effect of Transient Boundary Conditions and Detailed Thermal Modeling of Data Center Rooms
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:M. Ibrahim; S. Bhopte; B. Sammakia; B. Murray; M. Iyengar; R. Schmidt
Year: 2012
Reduction of Electromagnetic Interference Susceptibility in Small-Signal Analog Circuits Using Complementary Split-Ring Resonators
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:D. Perez; I. Gil; J. Gago; R. Fernandez-Garcia; J. Balcells; D. Gonzalez; N. Berbel; J. Mon
Year: 2012
Evaluation of Coatings Applied to Flexible Substrates to Enhance Quality of Ink Jet Printed Silver Nano-Particle Structures
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:H. Andersson; C. Lidenmark; T. Ohlund; J. Ortegren; A. Manuilskiy; S. Forsberg; H-E Nilsson
Year: 2012
Design of Complex Structured Monolithic Heat Sinks for Enhanced Air Cooling
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:S. Krishnan; D. Hernon; M. Hodes; J. Mullins; A. M. Lyons
Year: 2012
TEM Study of Local Conduction Mechanisms in Model Specimens of Ag-Based Conductive Adhesive
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:K. Kurosu; N. Kawamoto; Y. Murakami; D. Shindo
Year: 2012
Bandwidth Enhancement Based on Optimized Via Location for Multiple Vias EBG Power/Ground Planes
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Chuen-De Wang; Yi-Min Yu; F. de Paulis; A. C. Scogna; A. Orlandi; Yih-Peng Chiou; Tzong-Lin Wu
Year: 2012
Reliability of liquid crystal polymer air cavity packaging
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:K. Aihara; M. J. Chen; Cheng Chen; A-V H. Pham
Year: 2012
Application of Lamination Theory to Study Warpage Across PWB and PWBA During Convective Reflow Process
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Wei Tan; I. C. Ume
Year: 2012
IEEE Components, Packaging, and Manufacturing Technology Society information for authors
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Year: 2012
IEEE Components, Packaging, and Manufacturing Technology Society Information
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Year: 2012
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Year: 2012
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Year: 2012
Analytical Solution of Thermal Spreading Resistance in Power Electronics
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Dazhong Guan; M. Marz; Jingtao Liang
Year: 2012
Mechanisms of Spiking and Humping in Keyhole Welding
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:P. S. Wei; K. C. Chuang; J. S. Ku; T. DebRoy
Year: 2012
Sn–Cu–Ni Soldering Process Optimization Using Multivariate Analysis
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Chien-Yi Huang; Hui-Hua Huang; Kuo-Ching Ying
Year: 2012
Air Cavity Transmission Lines for Off-Chip Interconnects Characterized to 40 GHz
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:T. J. Spencer; R. Saha; Jikai Chen; R. Bashirullah; P. A. Kohl
Year: 2012
Review of test methods used for the measurement of hermeticity in packages containing small cavities
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:S. Costello; M. P. Y. Desmulliez; S. McCracken
Year: 2012
Thermal Management of Electronics Using PCM-Based Heat Sink Subjected to Cyclic Heat Load
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:S. K. Saha; P. Dutta
Year: 2012
Fabrication of 3-D Metamaterials Using LTCC Techniques for High-Frequency Applications
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:V. V. Varadan; In Kwang Kim
Year: 2012
Impact of Isothermal Aging and Sn Grain Orientation on the Long-Term Reliability of Wafer-Level Chip-Scale Package Sn–Ag–Cu Solder Interconnects
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Tae-Kyu Lee; B. Zhou; T. R. Bieler
Year: 2012
Drop-Shock Failure Prediction in Electronic Packages by Using Peridynamic Theory
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:A. Agwai; I. Guven; E. Madenci
Year: 2012
Thermoelectric Module-Variable Conductance Heat Pipe Assemblies for Reduced Power Temperature Control
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:C. Melnick; M. Hodes; G. Ziskind; M. Cleary; V. P. Manno
Year: 2012
Design, Fabrication, and Reliability of Low-Cost Flip-Chip-On-Board Package for Commercial Applications up to 50 GHz
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Li-Han Hsu; Chee-Way Oh; Wei-Cheng Wu; E. Y. Chang; H. Zirath; Chin-Te Wang; Szu-Ping Tsai; Wee-Chin Lim; Yueh-Chin Lin
Year: 2012
Suppression of Vertical Electromagnetic Coupling in Multilayer Packages
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:N. Sankaran; S. Huh; Sunghwan Min; M. Swaminathan; R. Tummala
Year: 2012
Optimal Design of Thermoelectric Refrigerators Embedded in a Thermal Resistance Network
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:M. Hodes
Year: 2012
Ultra-Compact WiMAX Bandpass Filter Embedded Into a Printed Circuit Board With a ${\rm SrTiO}_{3}$ Composite Layer
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Seong Jong Cheon; Sung Phyo Lim; Jae Yeong Park
Year: 2012
Efficient Method for Modeling of SSN Using Time-Domain Impedance Function and Noise Suppression Analysis
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Tong-Hao Ding; Yu-Shan Li
Year: 2012
Robust Superhydrophobic Surfaces Prepared With Epoxy Resin and Silica Nanoparticles
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Yonghao Xiu; Yan Liu; B. Balu; D. W. Hess; Chingping Wong
Year: 2012
Transient Frequency-Domain Thermal Measurements With Applications to Electronic Packaging
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Yizhang Yang; R. Master; G. Refai-Ahmed; M. Touzelbaev
Year: 2012
Heat Transfer Characteristics of a Heat Sink in Presence of a Synthetic Jet
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:M. B. Chaudhari; B. Puranik; A. Agrawal
Year: 2012
Electrical Characterization of Advanced MIM Capacitors With ${\rm ZrO}_{2}$ Insulator for High-Density Packaging and RF Applications
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:T. Bertaud; C. Bermond; S. Blonkowski; C. Vallee; T. Lacrevaz; A. Farcy; M. Gros-Jean; B. Flechet
Year: 2012
Effects of Ultrasonic Power and Time on Bonding Strength and Interfacial Atomic Diffusion During Thermosonic Flip–Chip Bonding
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Li Junhui; Zhang Xiaolong; Liu Linggang; Deng Luhua; Han Lei
Year: 2012
Effects of Conductive Particles on the Electrical Stability and Reliability of Anisotropic Conductive Film Chip-on-Board Interconnections
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Chang-Kyu Chung; Gi-Dong Sim; Soon-Bok Lee; Kyung-Wook Paik
Year: 2012
IEEE Transactions on Components, Packaging and Manufacturing Technology publication information
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Year: 2012
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Year: 2012
IEEE Components, Packaging, and Manufacturing Technology Society Information
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Year: 2012
Fluid/Structure Interaction Analysis of the Effects of Solder Bump Shapes and Input/Output Counts on Moulded Packaging
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Chu Yee Khor; M. Z. Abdullah; Wei Chiat Leong
Year: 2012
Flow Induced Deflection and Stress on Flexible Printed Circuit Board in Fan-Cooled Electronic Systems: FSI Approach
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Wei Chiat Leong; M. Z. Abdullah; M. A. Mujeebu
Year: 2012
FSI Simulation of Wire Sweep PBGA Encapsulation Process Considering Rheology Effect
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:D. Ramdan; Z. M. Abdullah; M. A. Mujeebu; Wei Keat Loh; Chun Keang Ooi; Renn Chan Ooi
Year: 2012
Laser-Enabled Advanced Packaging of Ultrathin Bare Dice in Flexible Substrates
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:V. Marinov; O. Swenson; R. Miller; F. Sarwar; Y. Atanasov; M. Semler; S. Datta
Year: 2012
Design, Fabrication, and Characterization of Freestanding Mechanically Flexible Interconnects Using Curved Sacrificial Layer
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Hyung Suk Yang; M. S. Bakir
Year: 2012
A Transient Electrothermal Analysis of Three-Dimensional Integrated Circuits
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:T. R. Harris; S. Priyadarshi; S. Melamed; C. Ortega; R. Manohar; S. R. Dooley; N. M. Kriplani; W. R. Davis; P. D. Franzon; M. B. Steer
Year: 2012
From Layout Directly to Simulation: A First-Principle-Guided Circuit Simulator of Linear Complexity and Its Efficient Parallelization
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Qing He; Duo Chen; Dan Jiao
Year: 2012
Low-Temperature and Pressureless Ag–Ag Direct Bonding for Light Emitting Diode Die-Attachment
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:M. Kuramoto; T. Kunimune; S. Ogawa; M. Niwa; Keun-Soo Kim; K. Suganuma
Year: 2012
Studies on the Thermal Cycling Reliability of BGA System-in-Package (SiP) With an Embedded Die
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Seon Young Yu; Yong-Min Kwon; Jinsu Kim; Taesung Jeong; Seogmoon Choi; Kyung-Wook Paik
Year: 2012
Assessment of Accrued Damage and Remaining Useful Life in Leadfree Electronics Subjected to Multiple Thermal Environments of Thermal Aging and Thermal Cycling
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:P. Lall; R. Vaidya; V. More; K. Goebel
Year: 2012
Thermal Performance Assessment and Validation of High-Concentration Photovoltaic Solar Cell Module
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Tsung-Lin Chou; Zun-Hao Shih; Hwen-Fen Hong; Cheng-Nan Han; Kou-Ning Chiang
Year: 2012
Investigation of Contact Behavior and Design of Vertical Probe for Wafer Level Probing
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Hao-Yuan Chang; Wen-Fung Pan; Shueei-Muh Lin
Year: 2012
Characterization of Encapsulants for High-Voltage High-Temperature Power Electronic Packaging
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Yiying Yao; Zheng Chen; Guo-Quan Lu; D. Boroyevich; K. D. T. Ngo
Year: 2012
Application of the Spark Plasma Sintering Technique to Low-Temperature Copper Bonding
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:B. Mouawad; M. Soueidan; D. Fabregue; C. Buttay; B. Allard; V. Bley; H. Morel; C. Martin
Year: 2012
Thermo-Mechanical Analysis and Design for SOD Package Based on Finite Element Method
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Yuning Shi; Haibin Chen; J. Wu; I. Shiu; Fei Wong
Year: 2012
Return-Path Extraction Technique for SSO Analysis of Low-Cost Wire-Bonding BGA Packages
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:R. Oikawa; D. Gope; V. Jandhyala
Year: 2012
Preparation and Low-Temperature Sintering of Cu Nanoparticles for High-Power Devices
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:S. Krishnan; A. S. M. A. Haseeb; M. R. Johan
Year: 2012
IEEE Transactions on Components, Packaging and Manufacturing Technology publication information
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Year: 2012
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Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Year: 2012
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Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Year: 2012
Measurement and Analysis for Residual Warpage of Chip-on-Flex (COF) and Chip-in-Flex (CIF) Packages
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Jae-Won Jang; Kyoung-Lim Suk; Kyung-Wook Paik; Soon-Bok Lee
Year: 2012
Encapsulation of Microelectronic Components Using Open-Ended Microwave Oven
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Sumanth Kumar Pavuluri; Marju Ferenets; George Goussetis; Marc P. Y. Desmulliez; Tim Tilford; Raphael Adamietz; Guido Mueller; Frank Eicher; Chris Bailey
Year: 2012
Ultrasonic Bonding of Anisotropic Conductive Films Containing Ultrafine Solder Balls for High-Power and High-Reliability Flex-On-Board Assembly
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Won-Chul Kim; Kiwon Lee; I. J. Saarinen; L. Pykari; Kyung-Wook Paik
Year: 2012
Optimal Terminations for Crosstalk Mitigation of High-Speed Interconnects With Discontinuities Using Modal Signaling
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:P. Milosevic; W. T. Beyene; J. E. Schutt-Aine
Year: 2012
Affordable Ink-Jet Printed Antennas for RFID Applications
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:S. Pranonsatit; D. Worasawate; P. Sritanavut
Year: 2012
Drop-on-Demand Laser Sintering With Silver Nanoparticles for Electronics Packaging
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Katsuhiro Maekawa; Kazuhiko Yamasaki; Tomotake Niizeki; Mamoru Mita; Yorishige Matsuba; Nobuto Terada; Hiroshi Saito
Year: 2012
Novel Self-Assembly Process Using Magnetically Aligned $z$-Axis Anisotropic Conductive Adhesive for High-Density Vertical Interconnection
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Sungwook Moon; W. J. Chappell
Year: 2012
Transmission Performances of CPW Lines on a Laser-Crystallization Polysilicon Passivated High-Resistivity Silicon Substrate
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Ruey-Lue Wang; Yan-Kuin Su; Chao-Jung Chen
Year: 2012
Hybrid Liquid Immersion and Synthetic Jet Heat Sink for Cooling 3-D Stacked Electronics
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:K. Kota; P. Hidalgo; Y. Joshi; A. Glezer
Year: 2012
Ni Barrier-Induced Cracks in Matte Sn Films
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Ting Liu; Dongyan Ding; Klaus-Peter Galuschki; Yu Hu; Yihua Gong; Ming Shen
Year: 2012
Alternating Direction Explicit-Latency Insertion Method (ADE-LIM) for the Fast Transient Simulation of Transmission Lines
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:H. Kurobe; T. Sekine; H. Asai
Year: 2012
Compact High-Gain mmWave Antenna for TSV-Based System-in-Package Application
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Sanming Hu; Yong-Zhong Xiong; Lei Wang; Rui Li; Jinglin Shi; Teck-Guan Lim
Year: 2012
Mold-Free in Situ Formation of Encapsulating Lens With Controllable Viewing Angle for LEDs by Photosensitive Polymerization Process
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Miaomiao Cai; Lilin Liu
Year: 2012
Impact of Packaging Design on Reliability of Large Die Cu/Low-$\kappa$ (BD) Interconnect
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:T. C. Chai; X. Zhang; H. Y. Li; V. N. Sekhar; O. K. N. Khan; J. Lau; R. Murthy; Yeow Meng Tan; C. K. Cheng; Siao Li Liew; Dongzhi Chi
Year: 2012
Solder-Joint Quantitative Crack Analysis—Ohmic Resistance Approach
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:I. Gershman; J. B. Bernstein
Year: 2012
Self-Packaged Millimeter-Wave Substrate Integrated Waveguide Filter With Asymmetric Frequency Response
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Xiao-Ping Chen; Ke Wu
Year: 2012
Comparative Study of Metal Films and Their Affinity for Metal Whisker Growth
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:A. Fortier; M. G. Pecht
Year: 2012
Power Delivery for 3-D Chip Stacks: Physical Modeling and Design Implication
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Gang Huang; Muhannad S. Bakir; Azad Naeemi; James D. Meindl
Year: 2012
Numerical Analysis of Novel Micro Pin Fin Heat Sink With Variable Fin Density
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:C. A. Rubio-Jimenez; S. G. Kandlikar; A. Hernandez-Guerrero
Year: 2012
Thermal Chip Placement in MCMs Using a Novel Hybrid Optimization Algorithm
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Hsien-Chie Cheng; I-Chun Chung; Wen-Hwa Chen
Year: 2012
IEEE Transactions on Components, Packaging and Manufacturing Technology publication information
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Year: 2012
IEEE Components, Packaging, and Manufacturing Technology Society information for authors
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Year: 2012
IEEE Components, Packaging, and Manufacturing Technology Society Information
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Year: 2012
IEEE Foundation [advertisement]
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Year: 2012
IEEE Xplore Digital Library [advertisement]
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Year: 2012
Testing of Copper Pillar Bumps for Wafer Sort
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:B. Tunaboylu
Year: 2012
Equivalent-Circuit Model for High-Capacitance MLCC Based on Transmission-Line Theory
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Myoung-Gyun Kim; Byoung Hwa Lee; Tae-Yeoul Yun
Year: 2012
Finite Element Modeling and Analysis of Surface Acoustic Wave Devices in CMOS Technology
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:O. Tigli; M. E. Zaghloul
Year: 2012
Workpiece Property Effect on Resistance Spot Welding
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Je-Ee Ho; Peng-Sheng Wei; Tzong-Huei Wu
Year: 2012
Effects of Slurry in Cu Chemical Mechanical Polishing (CMP) of TSVs for 3-D IC Integration
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Jui-Chin Chen; J. H. Lau; Pei-Jer Tzeng; Shang-Chun Chen; Chien-Ying Wu; Chien Chou Chen; Yu Chen Hsin; Yi-Feng Hsu; Shang Hung Shen; Sue-Chen Liao; Chi-Hon Ho; Cha-Hsin Lin; Tzu-Kun Ku; Ming-Jer Kao
Year: 2012
Fabrication of Electronic Packaging Grade Cu–W Materials by High-Temperature and High-Velocity Compaction
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Guosheng Jiang; Zhifa Wang; Yi Gu; Qiwang Zhang; Yong Gao; Ken Kuang
Year: 2012
Lifetime Prediction of Non-Collapsible Solder Joints in LTCC/PWB Assemblies Using a Recalibrated Engelmaier's Model
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:J. Putaala; O. Salmela; O. Nousiainen; T. Kangasvieri; A. Uusimaki
Year: 2012
Noncontact Selective Laser-Assisted Placement of Thinned Semiconductor Dice
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:R. Miller; V. Marinov; O. Swenson; Zhigang Chen; M. Semler
Year: 2012
Multiscale, Multiphysics Model of Underfill Flow for Flip-Chip Packages
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Siyi Zhou; Ying Sun
Year: 2012
A Compact and Embedded Balanced Bandpass Filter With Wideband Common-Mode Suppression on Wireless SiP
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Hung-Chuan Chen; Chung-Hao Tsai; Tzong-Lin Wu
Year: 2012
Electroless Ni Plating to Compensate for Bump Height Variation in Cu–Cu 3-D Packaging
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Jaesik Lee; D. M. Fernandez; Myo Paing; Yen Chen Yeo; Shan Gao
Year: 2012
40 $\mu{\rm m}$ Flip-Chip Process Using Ag–In Transient Liquid Phase Reaction
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:W. P. Lin; Chu-Hsuan Sha; C. C. Lee
Year: 2012
Embedded Module for 3-D Mechanical Strain Measurement
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:L. Moore; J. Barrett
Year: 2012
Efficient Wafer-Level Edge-Tracing Technique for 3-D Interconnection of Stacked Die
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Sun-Rak Kim; P. Lee; Jae-Hak Lee; Jun-Yeob Song; C. D. Yoo; S. S. Lee
Year: 2012
Reliable Microjoints Formed by Solid–Liquid Interdiffusion (SLID) Bonding Within a Chip-Stacking Architecture
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Jing-Yao Chang; Ren-Shin Cheng; Kuo-Shu Kao; Tao-Chih Chang; Tung-Han Chuang
Year: 2012
High-Conductivity Adhesive for Light-Emitting Diode Die-Attachment by Low-Temperature Sintering of Micrometer-Sized Ag Particles
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:T. Kunimune; M. Kuramoto; S. Ogawa; M. Niwa; M. Nogi; K. Suganuma
Year: 2012
Development of Wafer-Level Warpage and Stress Modeling Methodology and Its Application in Process Optimization for TSV Wafers
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Faxing Che; H. Y. Li; Xiaowu Zhang; Shan Gao; K. H. Teo
Year: 2012
Study of Optimal Dummy Fill Modes in Chemical–Mechanical Polishing Process
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Tianyu Ma; Lan Chen; Jingjing Fang
Year: 2012
Application of Piezoresistive Stress Sensor in Wafer Bumping and Drop Impact Test of Embedded Ultrathin Device
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Xiaowu Zhang; R. Rajoo; C. S. Selvanayagam; A. Kumar; V. S. Rao; N. Khan; V. Kripesh; J. H. Lau; Dim-Lee Kwong; V. Sundaram; R. R. Tummala
Year: 2012
Theoretical Analysis of the Deflection of a Cantilever Plate for Wirebonding on Overhang Applications
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Dong-Kil Shin; Jung Ju Lee
Year: 2012
IEEE Transactions on Components, Packaging and Manufacturing Technology publication information
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Year: 2012
IEEE Components, Packaging, and Manufacturing Technology Society information for authors
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Year: 2012
IEEE Components, Packaging, and Manufacturing Technology Society Information
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Year: 2012
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Year: 2012
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Year: 2012
Studies on the Polymer Adhesive Wafer Bonding Method Using Photo-Patternable Materials for MEMS Motion Sensors Applications
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Jonghyun Kim; Il Kim; Yongwon Choi; Kyung-Wook Paik
Year: 2012
Miniature Moisture Sensor Based on Ultracapacitor Technology
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:E. G. Bakhoum; M. H. M. Cheng
Year: 2012
Compact 60-GHz IPD-Based Branch-Line Coupler for System-on-Package V-Band Radios
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:I. Haroun; C. Plett; Yuan-Chia Hsu; Da-Chiang Chang
Year: 2012
Fabrication and Characterization of Flexible Ultrathin Chip Package Using Photosensitive Polyimide
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Liang Wang; T. Sterken; M. Cauwe; D. Cuypers; J. Vanfleteren
Year: 2012
Integration Method for Electronics in Woven Textiles
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:C. Zysset; T. W. Kinkeldei; N. Munzenrieder; K. Cherenack; G. Troster
Year: 2012
Improved Microstrip Filters Using PMC Packaging by Lid of Nails
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:A. A. Brazalez; A. U. Zaman; P. Kildal
Year: 2012
Study on the Reliability of Application-Specific LED Package by Thermal Shock Testing, Failure Analysis, and Fluid–Solid Coupling Thermo-Mechanical Simulation
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Zhaohui Chen; Qin Zhang; Feng Jiao; Run Chen; Kai Wang; Mingxiang Chen; Sheng Liu
Year: 2012
3- to 5-GHz Ultra-Compact Bandpass Filter With Independent Transmission Zeros Using PCB Embedding Passive Technology
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:S. J. Cheon; S. P. Lim; J. Y. Park
Year: 2012
Effect of Surface Roughness on Paper Substrate Circuit Board
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:A. Ryan; H. Lewis
Year: 2012
Silicon Platform With Vertically Aligned Carbon Nanotubes for Enhancing Thermal Conduction in Hybrid Optoelectronic Integration
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Szu-Chieh Chen; San-Liang Lee; Hsinyi Lo; Yung-Jr Hung; Kuei-Yi Lee; Charng-Gan Tu; Yen-Ting Pan; R. J. Ram
Year: 2012
Stochastic Modeling-Based Variability Analysis of On-Chip Interconnects
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:D. Vande Ginste; Daniël De Zutter; D. Deschrijver; T. Dhaene; P. Manfredi; F. Canavero
Year: 2012
Impact of Thermal Cycling in Humid Environments on Power Electronic Modules
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Ningyan Wang; I. Cotton; K. Evans
Year: 2012
Overlapping Partitioning Techniques for Simulation of Strongly Coupled Distributed Interconnects
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:M. A. Farhan; N. M. Nakhla; M. S. Nakhla; R. Achar; A. E. Ruehli
Year: 2012
A Closed-Form Multiscale Thermal Contact Resistance Model
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:R. L. Jackson; H. Ghaednia; Y. A. Elkady; S. H. Bhavnani; R. W. Knight
Year: 2012
Board-Folding Method for Fabrication of 3-D System in Package Devices
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:L. Moore; J. Barrett
Year: 2012
Electrical Properties and Reliability of ZnO-Based Nanorod Current Emitters
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:I-Chuan Yao; Pang Lin; Sheng-He Huang; Tseung-Yuen Tseng
Year: 2012
Effect of Nano-Particles on Heterogeneous Void Nucleation in No-Flow Underfill Materials
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:S. Lee; Myung Jin Yim; D. Baldwin
Year: 2012
Thermal and Mechanical Considerations for Silicon-Resin High-Density Substrate
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:B. Smith; P. Kwok; J. Thompson; A. Mueller; L. Racz
Year: 2012
Competing Fracture Modeling of Thin Chip Pick-Up Process
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Bo Peng; Yongan Huang; Zhouping Yin; Youlun Xiong
Year: 2012
Compact Thermal Resistor-Capacitor-Network Approach to Predicting Transient Junction Temperatures of a Power Amplifier Module
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Y. Yu; T-Y T. Lee; V. A. Chiriac
Year: 2012
IEEE Transactions on Components, Packaging and Manufacturing Technology publication information
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Year: 2012
IEEE Components, Packaging, and Manufacturing Technology Society information for authors
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Year: 2012
IEEE Components, Packaging, and Manufacturing Technology Society Information
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Year: 2012
IEEE Foundation [advertisement]
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Year: 2012
Quality without compromise [advertisement]
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Year: 2012
IEEE Xplore Digital Library [advertisement]
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Year: 2012
Optimum Design of Transformer-Type Marchand Balun Using Scalable Integrated Passive Device Technology
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Chien-Hsiang Huang; Tzyy-Sheng Horng; Chen-Chao Wang; Chi-Tsung Chiu; Chih-Pin Hung
Year: 2012
Thick-Copper-Buried Inductors Using Anodized Aluminum Package Substrates
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Cheol Ho Kim; Young-Se Kwon
Year: 2012
Development of Low-Cost 24-GHz Circuits Exploiting System-in-Package (SiP) Approach and Commercial PCB Technology
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:F. Alimenti; P. Mezzanotte; G. Tasselli; A. Battistini; V. Palazzari; L. Roselli
Year: 2012
Preparation of Sn–Ag–In Solder Bumps by Electroplating of Sn–Ag and Indium in Sequence and the Effect of Indium Addition on Microstructure and Shear Strength
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Dong-Liang Wang; Yuan Yuan; Le Luo
Year: 2012
Thermal Management Challenges in Telecommunication Systems and Data Centers
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:S. V. Garimella; Lian-Tuu Yeh; T. Persoons
Year: 2012
High-$Q$ Inductors Embedded in the Fan-Out Area of an eWLB
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:M. Wojnowski; V. Issakov; G. Knoblinger; K. Pressel; G. Sommer; R. Weigel
Year: 2012
Dynamics of Free Air Ball Formation in Thermosonic Wire Bonding
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Fuliang Wang; Kang Xiang; Lei Han
Year: 2012
Packaging Effects of Multiple X-Band SiGe LNAs Embedded in an Organic LCP Substrate
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Chung Hang John Poh; C. E. Patterson; S. K. Bhattacharya; S. D. Philips; N. E. Lourenco; J. D. Cressler; J. Papapolymerou
Year: 2012
Effect of Epoxy Molding Compound on the Electrical Performance of Microelectronic Devices
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:J. A. Herbsommer
Year: 2012
Prognostics Model Development of BGA Assembly Under Vibration Environment
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Changwoon Han; Chul-Min Oh; Won-Sik Hong
Year: 2012
Wafer Bumping, Assembly, and Reliability of Fine-Pitch Lead-Free Micro Solder Joints for 3-D IC Integration
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Ching-Kuan Lee; Tao-Chih Chang; J. H. Lau; Yu-Jiau Huang; Huan-Chun Fu; Jui-Hsiung Huang; Zhi-Cheng Hsiao; Cheng-Ta Ko; Ren-Shin Cheng; Pei-Chen Chang; Kuo-Shu Kao; Yu-Lan Lu; R. Lo; Ming-Jer Kao
Year: 2012
Planar Power Module With Low Thermal Impedance and Low Thermomechanical Stress
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Xiao Cao; Guo-Quan Lu; Khai D. T. Ngo
Year: 2012
Impact of Isothermal Aging on the Long-Term Reliability of Fine-Pitch Ball Grid Array Packages With Different Sn-Ag-Cu Solder Joints
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Jiawei Zhang; S. Thirugnanasambandam; J. L. Evans; M. J. Bozack; R. Sesek
Year: 2012
Compressed Passive Macromodeling
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:S. B. Olivadese; S. Grivet-Talocia
Year: 2012
Thermal Fatigue Characteristics of Die Attach Materials for Packaged High-Brightness LEDs
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Guangchen Zhang; Shiwei Feng; Zhou Zhou; Jing Liu; Jingwan Li; Hui Zhu
Year: 2012
Visualization of Fluid/Structure Interaction in IC Encapsulation
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Chu Yee Khor; Mohd Zulkifly Abdullah; Wei Chiat Leong
Year: 2012
Characterization of Heat Dissipation From a Microprocessor Chip Using Digital Interferometry
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:V. Sajith; C. B. P. Sobhan
Year: 2012
On the De-Embedding Issue of Millimeter-Wave and Sub-Millimeter-Wave Measurement and Circuit Design
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Bo Zhang; Yong-Zhong Xiong; Lei Wang; Sanming Hu; Joshua Le-Wei Li
Year: 2012
System Element Obsolescence Replacement Optimization via Life Cycle Cost Forecasting
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:T. E. Herald; J. E. Ramirez-Marquez
Year: 2012
Study on the Fluid–Structure Interaction of Flexible Printed Circuit Board Electronics in the Flow Environment
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Wei Chiat Leong; M. Z. Abdullah; Chu Yee Khor; E. E. S. Ong
Year: 2012
IEEE Transactions on Components, Packaging and Manufacturing Technology publication information
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Year: 2012
IEEE Components, Packaging, and Manufacturing Technology Society information for authors
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Year: 2012
IEEE Components, Packaging, and Manufacturing Technology Society Information
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Year: 2012
IEEE Foundation [advertisement]
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Year: 2012
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Year: 2012
IEEE Xplore Digital Library [advertisement]
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Year: 2012
Time-Domain Green's Function-Based Parametric Sensitivity Analysis of Multiconductor Transmission Lines
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:D. Spina; F. Ferranti; G. Antonini; T. Dhaene; L. Knockaert; Dries Vande Ginste
Year: 2012
Thermal Management of Power Inverter Modules at High Fluxes via Two-Phase Spray Cooling
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:H. Bostanci; D. Van Ee; B. A. Saarloos; D. P. Rini; L. C. Chow
Year: 2012
Bended Differential Transmission Line Using Compensation Inductance for Common-Mode Noise Suppression
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Chia-Han Chang; Ruei-Ying Fang; Chun-Long Wang
Year: 2012
Height Measurement of Micro-Solder Balls on Metal Pad by White Light Projection
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Fuliang Wang; Jingwen Qin; Lei Han; Hengsheng Wang
Year: 2012
Highly Reliable and Manufacturable Ultrafine Pitch Cu–Cu Interconnections for Chip-Last Embedding With Chip-First Benefits
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:N. Kumbhat; A. Choudhury; G. Mehrotra; P. M. Raj; V. Sundaram; R. Tummala
Year: 2012
Modeling and Design Optimization of Ultrathin Vapor Chambers for High Heat Flux Applications
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:R. Ranjan; J. Y. Murthy; S. V. Garimella; D. H. Altman; M. T. North
Year: 2012
Substrate-Integrated Waveguide Vertical Interconnects for 3-D Integrated Circuits
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:B. Y. E. Khatib; T. Djerafi; Ke Wu
Year: 2012
Development of Cu/Ni/SnAg Microbump Bonding Processes for Thin Chip-on-Chip Packages Via Wafer-Level Underfill Film
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Chang-Chun Lee; Tsung-Fu Yang; Kuo-Shu Kao; Ren-Chin Cheng; Chau-Jie Zhan; Tai-Hong Chen
Year: 2012
Tombstone Initiation Model for Small Form-Factor Surface Mount Passives
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:N. Raravikar; R. Panat; S. Jadhav
Year: 2012
Low-Cost Thin Glass Interposers as a Superior Alternative to Silicon and Organic Interposers for Packaging of 3-D ICs
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:V. Sukumaran; T. Bandyopadhyay; V. Sundaram; R. Tummala
Year: 2012
Phase Compensation of Cascaded Conductor-Backed CPW Periodic Cells
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Kaixue Ma; Kiat Seng Yeo; Jian-Guo Ma
Year: 2012
Predicting the Effect of Underfill Filler Volume Fraction on Solder Fatigue Life and Residual Stress for Surface Mount Components Using Nonlinear Viscoelastic Analyses
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:M. A. Neidigk; Yu-Lin Shen
Year: 2012
Effect of Capillary Trace on Dynamic Loop Profile Evolution in Thermosonic Wire Bonding
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Fuliang Wang; Yun Chen; Lei Han
Year: 2012
Color Biological Features-Based Solder Paste Defects Detection and Classification on Printed Circuit Boards
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Jun Jiang; Jun Cheng; Dacheng Tao
Year: 2012
Development of a 3-D Process Technology for Wafer-Level Packaging of MEMS Devices
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Woo-Chang Choi; Hyun-Jin Choi
Year: 2012
Study on the Near Field Characteristic of Antenna in Package
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Guorui Han; Jing Yang; Xinwei Chen; Yanfeng Geng; Yi Zhang; Wenmei Zhang
Year: 2012
Effects of Sol-Gel Treatment and Plating on the Electrical Properties of Multilayer Filters
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Jiabang Wang; Feng Tian; Deyu Kong
Year: 2012
Analysis of the Electronic Assembly Repair Process for Lead-Free Parts Under Combined Loading Conditions
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:A. Konoza; P. A. Sandborn; A. C. Chaloupka
Year: 2012
CMOS RF Transmitter Using Pulsewidth Modulation for Wireless Smart Sensors
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Wanghoon Lee; H. Takao; K. Sawada; M. Ishida
Year: 2012
Quasi-Axial GRIN Lens Implemented in Wedge-Shaped Fiber Coupling With InP-Based PLC
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Xu Liu; Xiaohan Sun
Year: 2012
IEEE Transactions on Components, Packaging and Manufacturing Technology publication information
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Year: 2012
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Year: 2012
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Year: 2012
IEEE Foundation
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Year: 2012
IEEE Xplore Digital Library [advertisement]
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Year: 2012
Reduced-Size Low-Voltage RF MEMS X-Band Phase Shifter Integrated on Multilayer Organic Package
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:D. J. Chung; R. G. Polcawich; J. S. Pulskamp; J. Papapolymerou
Year: 2012
Hotspot Detection by Improved Adaptive Finite Element Method and its Application in High-Speed PCB and IC Package Design
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Zhanghong Tang
Year: 2012
Sintering of Copper Particles for Die Attach
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:J. Kahler; N. Heuck; A. Wagner; A. Stranz; E. Peiner; A. Waag
Year: 2012
Multiorder Arnoldi Approach for Model Order Reduction of PEEC Models With Retardation
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:E. Rasekh; A. Dounavis
Year: 2012
Influence of Package Structure on the Performance of the Single Emitter Diode Laser
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Xiaoning Li; Yanxin Zhang; Jingwei Wang; Lingling Xiong; Pu Zhang; Zhiqiang Nie; Zhenfu Wang; Hui Liu; Xingsheng Liu
Year: 2012
System Integration of Electronic Functions in Smart Packaging Applications
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:H. Nilsson; T. Unander; J. Siden; H. Andersson; A. Manuilskiy; M. Hummelgard; M. Gulliksson
Year: 2012
Radiation Suppression for Cable-Attached Packages Utilizing a Compact Embedded Common-Mode Filter
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Chih-Ying Hsiao; Chung-Hao Tsai; Cheng-Nan Chiu; Tzong-Lin Wu
Year: 2012
Novel Electrical Joints Using Deformation Machining Technology—Part II: Experimental Verification
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:L. Solovyeva; N. Zubkov; B. Lisowsky; A. Elmoursi
Year: 2012
Design of an Integrated Loop Heat Pipe Air-Cooled Heat Exchanger for High Performance Electronics
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:T. B. Peters; M. McCarthy; J. Allison; F. A. Dominguez-Espinosa; D. Jenicek; H. A. Kariya; W. L. Staats; J. G. Brisson; J. H. Lang; E. N. Wang
Year: 2012
Measurement and Analysis of a High-Speed TSV Channel
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Heegon Kim; Jonghyun Cho; Myunghoi Kim; Kiyeong Kim; Junho Lee; Hyungdong Lee; Kunwoo Park; Kwangseong Choi; Hyun-Cheol Bae; Joungho Kim; Jiseong Kim
Year: 2012
Numerical and Experimental Study of a Hybrid Thermoelectric Cooler Thermal Management System for Electronic Cooling
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:M. K. Russel; D. Ewing; C. Y. Ching
Year: 2012
Highly Accelerated Life Testing of Embedded Planar Capacitors With Epoxy-${\rm BaTiO}_{3}$ Nanocomposite Dielectric
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:M. A. Alam; M. H. Azarian; M. G. Pecht
Year: 2012
Design of Planar Complex Impedance Transformers With the Modified Coupled Line
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Ming-Guang Chen; Teng-Bang Hou; Ching-Wen Tang
Year: 2012
Efficient Foster-Type Macromodels for Rectangular Planar Interconnections
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:V. Vahrenholt; M. Leone
Year: 2012
Miniaturized Coplanar Waveguide to Rectangular Waveguide Transition Using Inductance-Compensated Slotline
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Ruei-Ying Fang; Chun-Long Wang
Year: 2012
Spatial Variation of Temperature on Printed Circuit Boards: Effects of Anisotropic Thermal Conductivity and Joule Heating
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:M. B. Dogruoz; G. Shankaran
Year: 2012
Use of ${\rm Al}_{2}{\rm O}_{3}\hbox{--}{\rm Cu}$/Water Hybrid Nanofluid in an Electronic Heat Sink
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:P. Selvakumar; S. Suresh
Year: 2012
Novel Electrical Joints Using Deformation Machining Technology Part I: Computer Modeling
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:L. Solovyeva; N. Zubkov; B. Lisowsky; A. Elmoursi
Year: 2012
Thermal Conductivity Enhancement of Epoxy Composites by Interfacial Covalent Bonding for Underfill and Thermal Interfacial Materials in Cu/Low-K Application
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Qizhen Liang; Kyoung-Sik Moon; Hongjin Jiang; Ching Ping Wong
Year: 2012
IEEE Transactions on Components, Packaging and Manufacturing Technology publication information
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Year: 2012
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Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Year: 2012
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Year: 2012
IEEE Foundation
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Year: 2012
IEEE Xplore Digital Library [advertisement]
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Year: 2012
Fast Full-Wave Solution That Eliminates the Low-Frequency Breakdown Problem in a Reduced System of Order One
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Jianfang Zhu; Dan Jiao
Year: 2012
Narrow-Band Microwave Filter Using High-Q Groove Gap Waveguide Resonators With Manufacturing Flexibility and No Sidewalls
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:A. U. Zaman; P. Kildal; A. A. Kishk
Year: 2012
Crystallographic Characterization of an Electroplated Zinc Coating Prone to Whiskers
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:A. Etienne; E. Cadel; A. Lina; L. Cretinon; P. Pareige
Year: 2012
Failure Mechanism in Thick Film Materials for 300$~{}^{\circ}{\rm C}$ Operation
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Rui Zhang; R. W. Johnson; A. Vert; Tan Zhang; D. Shaddock
Year: 2012
Moisture Ingress Into Packages With Walls of Varying Thickness And/Or Properties: A Simple Calculation Method
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:N. Dahan; A. Vanhoestenberghe; N. Donaldson
Year: 2012
Genetic-Algorithm-Based Controlling of Microcontact Distributions to Minimize Electrical Contact Resistance
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Noh Sung Kwak; Jongsoo Lee; Yong Hoon Jang
Year: 2012
Anomaly Detection and Classification for PHM of Electronics Subjected to Shock and Vibration
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:P. Lall; P. Gupta; A. Angral
Year: 2012
Development of 25-$\mu{\rm m}$ -Pitch Microbumps for 3-D Chip Stacking
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Aibin Yu; A. Kumar; Soon Wee Ho; Hnin Wai Yin; J. H. Lau; Nandar Su; Khong Chee Houe; Jong Ming Ching; V. Kripesh; S. Chen; Chien-Feng Chan; Chun-Chieh Chao; Chi-Hsin Chiu; Chang-Yueh Chan; Chin-Huang Chang; Chih-Ming Huang; C. Chen
Year: 2012
Analysis on Thermal Management Schemes of LED Backlight Units for Liquid Crystal Displays
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Sung Ki Kim
Year: 2012
Modeling Relative Humidity and Temperature Effects on Scattering Parameters in Transmission Lines
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:S. S. Agili; A. W. Morales; Ji Li; M. Resso
Year: 2012
Intelligent Parametric Design for a Robust LED Encapsulation Process
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Chien-Yi Huang
Year: 2012
Model Pulses for Performance Prediction of Digital Microelectronic Systems
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:I. E. Lager; A. T. de Hoop; T. Kikkawa
Year: 2012
Pressure-Assisted Low-Temperature Sintering of Nanosilver Paste for 5$\,\times\,$5-${\rm mm}^{2}$ Chip Attachment
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Gang Chen; Yunjiao Cao; Yunhui Mei; Dan Han; Guo-Quan Lu; Xu Chen
Year: 2012
Fluid/Structure Interaction Investigation in PBGA Packaging
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:D. Ramdan; M. Z. Abdullah; ChuYee Khor; Wei Chiat Leong; Wei Keat Loh; Chun Keang Ooi; Renn Chan Ooi
Year: 2012
Automated Void Detection in Solder Balls in the Presence of Vias and Other Artifacts
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:A. F. Said; B. L. Bennett; L. J. Karam; A. Siah; K. Goodman; J. S. Pettinato
Year: 2012
Finite Element Modeling of System Design and Testing Conditions for Component Solder Ball Reliability Under Impact
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Xuejun Fan; A. S. Ranouta
Year: 2012
Effects of Multiple Reworks on the Accelerated Thermal Cycling and Shock Performance of Lead-Free BGA Assemblies
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Hongtao Ma; Weidong Xie; G. Subbarayan
Year: 2012
Comparison of Deionized Water and FC-72 in Pool and Jet Impingement Boiling Thermal Management
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:R. Cardenas; V. Narayanan
Year: 2012
IEEE Transactions on Components, Packaging and Manufacturing Technology publication information
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Year: 2012
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Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Year: 2012
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Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Year: 2012
Thermal Performance Comparison of Thick-Film Insulated Aluminum Substrates With Metal Core PCBs for High-Power LED Modules
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:E. Juntunen; A. Sitomaniemi; O. Tapaninen; R. Persons; M. Challingsworth; V. Heikkinen
Year: 2012
Effect of Solder Joint Arrangements on BGA Lead-Free Reliability During Cooling Stage of Reflow Soldering Process
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Chun-Sean Lau; M. Z. Abdullah; F. C. Ani
Year: 2012
Compact and Passive Parametric Macromodeling Using Reference Macromodels and Positive Interpolation Operators
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:F. Ferranti; T. Dhaene; L. Knockaert
Year: 2012
Reliability of Sputtered Aluminum Thin Film on Flexible Substrate Under High Cyclic Bending Fatigue Conditions
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:M. M. Hamasha; K. Alzoubi; James C. Switzer; S. Lu; M. D. Poliks; C. R. Westgate
Year: 2012
Miniaturization of Rat-Race Coupler With Dual-Band Arbitrary Power Divisions Based on Stepped-Impedance Double-Sided Parallel-Strip Line
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Lin-Sheng Wu; Junfa Mao; Wen-Yan Yin
Year: 2012
Hot Laminated Multilayer Polymer Illumination Structure Based on Embedded LED Chips
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:K. Keranen; J-T Makinen; M. Heikkinen; M. Hiltunen; M. Koponen; M. Lahti; A. Sunnari; K. Ronka
Year: 2012
Sintering of Silver–Aluminum Nanopaste With Varying Aluminum Weight Percent for Use as a High-Temperature Die-Attach Material
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:V. R. Manikam; K. A. Razak; Kuan Yew Cheong
Year: 2012
In-Plane Deformation Measurement of Thin Packages Using an Atomic Force Microscope Moiré Method With a Pseudo-Phase-Shifting Technique
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Jae-Won Jang; Jin-Hyoung Park; Soon-Bok Lee
Year: 2012
Development Pattern Recognition Model for the Classification of Circuit Probe Wafer Maps on Semiconductors
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Cheng-Wei Chang; Tsung-Ming Chao; Jorng-Tzong Horng; Chien-Feng Lu; Rong-Hwei Yeh
Year: 2012
Analytical Solution for Steady-State and Transient Temperature Fields in Vertically Stacked 3-D Integrated Circuits
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:L. Choobineh; A. Jain
Year: 2012
Modeling and Analysis of a Power Distribution Network in TSV-Based 3-D Memory IC Including P/G TSVs, On-Chip Decoupling Capacitors, and Silicon Substrate Effects
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Kiyeong Kim; Chulsoon Hwang; Kyoungchoul Koo; Jonghyun Cho; Heegon Kim; Joungho Kim; Junho Lee; Hyung-Dong Lee; Kun-Woo Park; Jun So Pak
Year: 2012
273-GHz 2X Subharmonic Up-Conversion Mixer for System-on-Package Applications
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Rui Li; Teck Guan Lim; Soon Wee Ho
Year: 2012
Glass–Glass Laser-Assisted Glass Frit Bonding
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:R. Cruz; J. A. da Cruz Ranita; J. Macaira; F. Ribeiro; A. M. B. da Silva; J. M. Oliveira; M. H. F. V. Fernandes; H. A. Ribeiro; J. G. Mendes; A. Mendes
Year: 2012
Enhanced Thermal Performance of InGaP/GaAs Collector-Up HBTs With a Miniaturized Backside Heat-Dissipation Structure
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Hsien-Cheng Tseng; Jer-Li Lin
Year: 2012
Enhancement of Silicon-Based Inductor Q-Factor Using Polymer Cavity
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Yee Mong Khoo; Teck Guan Lim; Soon Wee Ho; Rui Li; Yong-Zhong Xiong; Xiaowu Zhang
Year: 2012
Investigation of Resistivity Variation of Printed Circuit Board Laminates Due to Aging
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:A. Bulletti; L. Capineri; B. D. Dunn; M. Bruzzi
Year: 2012
Lead-Free Flip-Chip Packaging Affects on Ultralow-$k$ Chip Delamination
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Kuo Ming Chen; Yunn Horng Guu; Tsung Shu Lin
Year: 2012
Reduced-Order Parametric Behavioral Model for Digital Buffers/Drivers With Physical Support
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:W. Dghais; T. R. Cunha; J. C. Pedro
Year: 2012
Delay-Extraction-Based Waveform Relaxation Algorithm for Fast Transient Analysis of Power Distribution Networks
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:S. Roy; A. Dounavis
Year: 2012
Study on Fine Pitch Flex-on-Flex Assembly Using Nanofiber/Solder Anisotropic Conductive Film and Ultrasonic Bonding Method
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Sang-Hoon Lee; Kyung-Lim Suk; Kiwon Lee; Kyung-Wook Paik
Year: 2012
Our Thanks to Reviewers IEEE Transactions on Components, Packaging and Manufacturing Technology
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Year: 2012
2012 Index IEEE Transactions on Components, Packaging and Manufacturing Technology Vol. 2
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Year: 2012
IEEE Transactions on Components, Packaging and Manufacturing Technology publication information
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Year: 2012
IEEE Components, Packaging, and Manufacturing Technology Society information for authors
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Year: 2012
IEEE Components, Packaging, and Manufacturing Technology Society Information
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Year: 2012
Comparison of Sub-Millimeter-Wave Scattering-Parameter Calibrations With Imperfect Electrical Ports
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:D. F. Williams
Year: 2012
3.1-THz Heterodyne Receiver Using an NbTiN Hot-Electron Bolometer Mixer and a Quantum Cascade Laser
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:S. Shiba; Y. Irimajiri; T. Yamakura; H. Maezawa; N. Sekine; I. Hosako; S. Yamamoto
Year: 2012
Experimental Investigation of a Low-Cost, High Performance Focal-Plane Horn Array
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:J. Leech; Boon Kok Tan; G. Yassin; P. Kittara; S. Wangsuya
Year: 2012
A 650 GHz Unilateral Finline SIS Mixer Fed by a Multiple Flare-Angle Smooth-Walled Horn
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Boon-Kok Tan; G. Yassin; P. Grimes; J. Leech; K. Jacobs; C. Groppi
Year: 2012
Improved Bend Waveguide Design for Terahertz Transmission
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:E. Degirmenci; F. Surre; S. Philippe; R. Maldonado-Basilio; P. Landais
Year: 2012
Internally Integrated Active-Type Patch Antenna for Semiconductor Superlattice THz Oscillators
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:V. S. Jagtap; C. Minot
Year: 2012
Balanced Receiver Technology Development for the Caltech Submillimeter Observatory
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:J. W. Kooi; R. A. Chamberlin; R. Monje; B. Force; D. Miller; T. G. Phillips
Year: 2012
Terahertz Tomographic Imaging of Transdermal Drug Delivery
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Kyung Won Kim; Hyeongmun Kim; Jisuk Park; Joon Koo Han; Joo-Hiuk Son
Year: 2012
The SPICA-SAFARI Detector System: TES Detector Arrays With Frequency-Division Multiplexed SQUID Readout
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:B. D. Jackson; P. A. J. de Korte; J. van der Kuur; P. D. Mauskopf; J. Beyer; M. P. Bruijn; A. Cros; J. Gao; D. Griffin; R. den Hartog; M. Kiviranta; G. de Lange; B. van Leeuwen; C. Macculi; L. Ravera; N. Trappe; H. van Weers; S. Withington
Year: 2012
In Vivo Dual-Modality Terahertz/Magnetic Resonance Imaging Using Superparamagnetic Iron Oxide Nanoparticles as a Dual Contrast Agent
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Jae Yeon Park; Hyuck Jae Choi; Gi-Eun Nam; Kyoung-Sik Cho; Joo-Hiuk Son
Year: 2012
Terahertz Frequency-Domain Spectroscopy Method for Vector Characterization of Liquid Using an Artificial Dielectric
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:S. C. Saha; J. P. Grant; Yong Ma; A. Khalid; Feng Hong; D. R. S. Cumming
Year: 2012
Experimental Demonstration of an Interferometric Technique for Characterizing the Full Optical Behavior of Multi-Mode Power Detectors
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:C. N. Thomas; S. Withington
Year: 2012
The ALMA Band-7 Cartridge
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:S. Mahieu; D. Maier; B. Lazareff; A. Navarrini; G. Celestin; J. Chalain; D. Geoffroy; F. Laslaz; G. Perrin
Year: 2012
Chemical Identification With Information-Weighted Terahertz Spectrometry
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:D. Brigada; Xi-Cheng Zhang
Year: 2012
Limiting Factors to the Temperature Performance of THz Quantum Cascade Lasers Based on the Resonant-Phonon Depopulation Scheme
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Y. Chassagneux; Q. J. Wang; S. P. Khanna; E. Strupiechonski; J. Coudevylle; E. H. Linfield; A. G. Davies; F. Capasso; M. A. Belkin; R. Colombelli
Year: 2012
Editorial
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Peter H. Siegel
Year: 2012
Terahertz pioneers: A series of interviews with significant contributors to terahertz science and technology
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Peter H. Siegel
Year: 2012
Terahertz Pioneer: Maurice F. Kimmitt “A Person Who Makes Things Work”
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Peter H. Siegel
Year: 2012
Origin of Birefringence in Wood at Terahertz Frequencies
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:T. M. Todoruk; I. D. Hartley; M. E. Reid
Year: 2012
Introduction to the Special Section on 22nd International Symposium on Space Terahertz Technology
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Christopher K. Walker; Christopher E. Groppi
Year: 2012
The 37th International Conference on Infared, Millimeter and Terahertz Waves
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Year: 2012
The 23rd International Symposium on Space Terahertz Technology
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Year: 2012
IEEE Transactions on Terahertz Science and Technology publication information
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Year: 2012
IEEE Transactions on Terahertz Science and Technology Editorial Board
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Year: 2012
FTT2012 Japan
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Year: 2012
IEEE Transactions on Terahertz Science and Technology information for authors
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Year: 2012
Evaluation of Applicability of Noncontact Analysis Methods to Detect Rust Regions in Coated Steel Plates
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Norikazu Fuse; T. Fukuchi; T. Takahashi; M. Mizuno; K. Fukunaga
Year: 2012
CMOS THz Generator With Frequency Selective Negative Resistance Tank
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Qun Jane Gu; Z. Xu; Heng-Yu Jian; Bo Pan; Xiaojing Xu; Mau-Chung Frank Chang; Wei Liu; H. Fetterman
Year: 2012
Terahertz Information and Signal Processing by RF-Photonics
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:S. J. B. Yoo; R. P. Scott; D. J. Geisler; N. K. Fontaine; F. M. Soares
Year: 2012
Performance of the First ALMA Band 5 Production Cartridge
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:B. Billade; O. Nystrom; D. Meledin; E. Sundin; I. Lapkin; M. Fredrixon; V. Desmaris; H. Rashid; M. Strandberg; S. Ferm; A. Pavolotsky; V. Belitsky
Year: 2012
Full-Scale Three-Dimensional Electromagnetic Simulations of a Terahertz Folded-Waveguide Traveling-Wave Tube Using ICEPIC
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:P. D. Gensheimer; C. K. Walker; R. W. Ziolkowski; Christian Drouet d'Aubigny
Year: 2012
Model-Based Material Parameter Estimation for Terahertz Reflection Spectroscopy
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Gabriel P. Kniffin; L. M. Zurk
Year: 2012
Upgrade of EMIR's Band 3 and Band 4 Mixers for the IRAM 30 m Telescope
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:D. Maier; J. Reverdy; D. Billon-Pierron; A. Barbier
Year: 2012
On-Wafer S-Parameter Measurements in the 325–508 GHz Band
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:A. Fung; L. Samoska; D. Pukala; D. Dawson; P. Kangaslahti; M. Varonen; T. Gaier; C. Lawrence; G. Boll; R. Lai; X. B. Mei
Year: 2012
Design and Characterization of a Room Temperature All-Solid-State Electronic Source Tunable From 2.48 to 2.75 THz
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:A. Maestrini; I. Mehdi; J. V. Siles; J. S. Ward; R. Lin; B. Thomas; C. Lee; J. Gill; G. Chattopadhyay; E. Schlecht; J. Pearson; P. Siegel
Year: 2012
Link Budget Analysis for Terahertz Fixed Wireless Links
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Thomas Schneider; A. Wiatrek; S. Preussler; M. Grigat; R. Braun
Year: 2012
Polymeric THz 2D Photonic Crystal Filters Fabricated by Fiber Drawing
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:M. Stecher; C. Jansen; M. Ahmadi-Boroujeni; Richard Lwin; A. Stefani; M. Koch; G. E. Town
Year: 2012
Terahertz pioneers: A series of interviews with significant contributors to terahertz science and technology
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Peter H. Siegel
Year: 2012
Terahertz Pioneer: Robert W. Wilson The Foundations of THz Radio Science
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Peter H. Siegel
Year: 2012
Editorial
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Peter H. Siegel
Year: 2012
The 37th International Conference on Infared, Millimeter and Terahertz Waves
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Year: 2012
IEEE Transactions on Terahertz Science and Technology Information for Authors
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Year: 2012
IEEE Transactions on Terahertz Science and Technology publication information
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Year: 2012
IEEE Transactions on Terahertz Science and Technology Editorial Board
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Year: 2012
2012 IEEE membership form
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Year: 2012
Broadband THz Uncooled Antenna-Coupled Microbolometer Array—Electromagnetic Design, Simulations and Measurements
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Duy-Thong Nguyen; F. Simoens; J. Ouvrier-Buffet; J. Meilhan; J. Coutaz
Year: 2012
A System for THz Imaging of Low-Contrast Targets Using the Born Approximation
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:R. Dahlback; T. Rubaek; M. Persson; J. Stake
Year: 2012
Analysis of Doubly Corrugated Spoof Surface Plasmon Polariton (DC-SSPP) Structure With Sub-Wavelength Transmission at THz Frequencies
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Zhao Xu; Kyungjun Song; P. Mazumder
Year: 2012
A Low Noise 2.7 THz Waveguide-Based Superconducting Mixer
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Faouzi M. Boussaha; Jonathan H. Kawamura; Jeffery A. Stern; Anders Skalare; Victor White
Year: 2012
Corrugated Goubau Lines to Slow Down and Confine THz Waves
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:S. Laurette; A. Treizebre; B. Bocquet
Year: 2012
Heterodyne Detection of Intracavity Generated Terahertz Radiation
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:M. Scheller; A. G. Young; J. M. Yarborough; J. V. Moloney; S. W. Koch; C. Y. Drouet d'Aubigny; C. K. Walker
Year: 2012
Electro-Thermal Model for Multi-Anode Schottky Diode Multipliers
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Aik Yean Tang; E. Schlecht; R. Lin; G. Chattopadhyay; Choonsup Lee; J. Gill; I. Mehdi; J. Stake
Year: 2012
Terahertz Detection by a Homodyne Field Effect Transistor Multiplicative Mixer
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:S. Preu; Sangwoo Kim; R. Verma; P. G. Burke; N. Q. Vinh; M. S. Sherwin; A. C. Gossard
Year: 2012
Terahertz Pioneers
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Peter H. Siegel
Year: 2012
Terahertz Pioneer: Richard J. Saykally - Water, Water Everywhere ...
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:P. H. Siegel
Year: 2012
Radiation Model for Terahertz Transmission-Line Metamaterial Quantum-Cascade Lasers
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:P. W. C. Hon; A. A. Tavallaee; Qi-Sheng Chen; B. S. Williams; T. Itoh
Year: 2012
340 GHz Integrated Receiver in 250 nm InP DHBT Technology
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Yu Yan; Yogesh B. Karandikar; Sten E. Gunnarsson; Miguel Urteaga; Richard Pierson; Herbert Zirath
Year: 2012


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