SoftTrak: an industrial case study
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Arluk, J.; Michaely, B.; Ze'evi, M.
Year: 1996
Using software metrics tools for maintenance decisions: a classroom exercise
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Marshall, A.D.; Katchabaw, M.J.; Bauer, M.A.
Year: 1996
A characterization of OOA tools
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Kaschek, R.; Mayr, H.C.
Year: 1996
Assessment of tools in the telecommunications industry: a customer perspective
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Mayrand, J.
Year: 1996
Assessing software tools in the telecommunications industry
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Tarkiainen, M.
Year: 1996
JANUS: Software Tools - Looking Back/Looking Forward
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Belanger, D.
Year: 1996
Defining a set of criteria for the assessment of tool support for CMM-based software process improvement
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Ellmer, E.; Merkl, D.
Year: 1996
Status of software tools developed in Japan
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Takeshita, T.
Year: 1996
Software tool assessment-an Australian perspective
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Bailes, P.A.
Year: 1996
Methodology of a CASE-tool assessment
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Hierholzer, A.; Herzwurm, G.
Year: 1996
Software Thesaurus: a tool for reusing software objects
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Llorens, J.; Amescua, A.; Velasco, M.
Year: 1996
Assessing the potentials of CASE-tools in software process improvement: a benchmarking study
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Daneva, M.; Terzieva, R.
Year: 1996
Object-oriented modeling in Metaview
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Yong Zhuang; Findeisen, P.; Sorenson, P.
Year: 1996
EMERALD: software metrics and models on the desktop
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Hudepohl, J.P.; Aud, S.J.; Khoshgoftaar, T.M.; Allen, E.B.; Mayrand, J.
Year: 1996
CAME tools-lessons learned
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Dumke, R.R.
Year: 1996
If yesterday is tomorrow, this must be Toronto [Internet software]
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Williamson, S.
Year: 1996
Java and JDBC: tools supporting data-centric business application development
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Hamilton, J.
Year: 1996
The role of tools in development of a data warehouse
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:McCabe, M.C.; Grossman, D.
Year: 1996
Author index
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Year: 1996
Design verification based on hardware emulation
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Nguyen, H.N.; Thill, M.
Year: 1996
A novel approach to real-time verification of transport system design using FPGA based emulator
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Hayashi, K.; Miyazaki, T.; Shirakawa, K.; Yamada, K.; Ichimori, T.; Fukami, K.; Ohta, N.
Year: 1996
A platform for co-design and co-synthesis based on FPGA
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Mosanya, E.; Perrier, J.-Y.; Goeke, M.; Rampogna, F.; Linder, J.; Sanchez, E.
Year: 1996
Automatic generation of interprocess communication in the PARAGON system
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Xiong, X.; Gutberiet, P.; Rosenstiel, W.
Year: 1996
Hierarchical partitioning in a rapid prototyping environment
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Ober, U.; Herpel, H.-J.; Glesner, M.
Year: 1996
Capturing time constraints by using Petri-nets in the context of Hardware/Software codesign
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Maciel, P.; Barros, E.
Year: 1996
Rapid prototyping of a CATV network termination for ATM-based video-on-demand services
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Vande Keere, V.; Staelens, B.; Vandewege, J.
Year: 1996
Embedded test environment
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Martin, S.; Olive, V.
Year: 1996
Real-time emulation method for ATM switching systems in broadband ISDN
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Matsumura, T.; Yamanaka, N.; Yamaguchi, R.; Ishikawa, K.
Year: 1996
Rapid protocol prototyping from message sequence chart based specification
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Ishikawa, K.; Hoshino, T.
Year: 1996
An integrated hardware-software cosimulation environment with automated interface generation
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Kyuseok Kim; Yongjoo Kim; Youngsoo Shin; Kiyoung Choi
Year: 1996
Automatic generation of interfaces for distributed C-VHDL cosimulation of embedded systems: an industrial experience
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Valderrama, C.A.; Nacabal, F.; Paulin, P.; Jerraya, A.A.
Year: 1996
Simulating hardware, software and electromechanical parts using communicating simulators
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Petrellis, N.C.; Birbas, A.N.; Birbas, M.K.; Mariatos, E.P.; Papadopoulos, G.D.
Year: 1996
A smoothly upgradable approach to virtual emulation of HW/SW systems
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Borgatti, M.; Rambaldi, R.; Gori, G.; Guerrieri, R.
Year: 1996
The CARE toolset for developing verified programs from formal specifications
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Hemer, D.; Lindsay, P.
Year: 1996
An expert system for the verification of finite-element calculations
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Breitfeld, T.; Kroplin, B.
Year: 1996
Exploratory analysis tools for tree-based models in software measurement and analysis
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Troster, J.; Tian, J.
Year: 1996
Author index
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Year: 1996
Programming with transactions and chemical abstract machine
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Wanli Ma; Johnson, C.W.; Brent, R.P.
Year: 1996
Scalability of parallel algorithm implementation
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Xingfu Wu; Wei Li
Year: 1996
Programming with communicating nondeterministic logic objects
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Man-Lai Tse; Wing-Hang Wong; Ho-Fung Leung
Year: 1996
Wormhole routing and its chip design
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Rong Zeng; Xiang Jun Dong; Ming Fa Zhu
Year: 1996
Logarithmic conversion by four partitioned hybrid-ROMs
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Hao-Yung Lo; Hsiu-Feng Lin; Yue-Yuan Ho
Year: 1996
Analyzing nondeterminacy of message passing programs
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Xiong Jianxin; Wang Dingxing
Year: 1996
A fault-tolerant strategy for real-time task scheduling on multiprocessor system
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Ma Maode; Babak, H.
Year: 1996
On a class of concatenated (2log/sub 2/N-1)-stage interconnection networks
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Yanggon Kim; Tse-Yun Feng; Seung-Woo Seo
Year: 1996
The PASM project: a study of reconfigurable parallel computing
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Siegel, H.J.; Braun, T.D.; Dietz, H.G.; Kulaczewski, M.B.; Maheswaran, M.; Pero, P.; Siegel, J.M.; So, J.J.E.; Min Tan; Theys, M.D.; Lee Wang
Year: 1996
Object oriented prototyping at the system level: an image reconstruction application example
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Mariatos, E.P.; Birbas, M.K.; Birbas, A.N.; Petrellis, N.
Year: 1996
HW/SW specification using OOM techniques
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Calha, M.; Teixeira, J.P.; Teixeira, I.C.
Year: 1996
A multi formalisms prototyping approach from formal description to implementation of distributed systems
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Diagne, A.; Kordon, F.
Year: 1996
Fast prototyping of memory models in VHDL for hardware emulation
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:O'Brien, K.; Maginot, S.
Year: 1996
New design and prototyping methods are needed in missile electronics industry
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Foulon, M.; Foucault, B.
Year: 1996
Industrial approach in design methodologies for mobile communications systems
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Metafas, D.E.; Karathanasis, H.C.; Blionas, S.V.
Year: 1996
ASIC prototyping with reprogrammable implementations of large ASICs
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Brasen, D.; Saucier, G.
Year: 1996
Rapid-prototyping of embedded systems via reprogrammable devices
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Cardelli, S.; Chiodo, M.; Giusto, P.; Jurecska, A.; Lavagno, L.; Sangiovanni-Vincentelli, A.
Year: 1996
CO: the Chameleon 64-bit microprocessor ASIC prototype
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Ramanadin, B.; Pogodalla, F.
Year: 1996
Rapid-prototyping of a CAN-Bus controller: a case study
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Kirschbaum, A.; Renner, F.M.; Wilmes, A.; Glesner, M.
Year: 1996
Rapid prototyping of a communication controller for the CAN bus
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Winter, A.; Bittruf, D.; Tanurhan, Y.; Muller-Glaser, K.D.
Year: 1996
Fast prototyping based on generic and synthesizable VHDL models. A case study: punctured Viterbi decoders
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Deltoso, C.; Joanblanq, C.; Cand, M.; Senn, P.
Year: 1996
Implementing DSP applications on heterogeneous targets using minimal size data buffers
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Ade, M.; Lauwereins, R.; Peperstrate, J.A.
Year: 1996
Miami: a hardware software co-simulation environment
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Klein, R.
Year: 1996
Prototyping and reengineering of microcontroller-based systems
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Carro, L.; Pereira; Suzim, A.
Year: 1996
MCG: a correct-by-design multichip module router with crosstalk avoidance
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Carothers, J.D.; Donghui Li; Hameenanttila, T.
Year: 1996
Index of authors
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Year: 1996
Blood pressure dependence of systemic arterial compliance global effects
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Ying Zhu; Li, J.-K.J.; Drzewiecki, G.; O'Hara, D.
Year: 1996
Power spectral analysis of arterial pressure fluctuations in salt-loaded spontaneously hypertensive rats
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Ju, K.; Onishi, S.; Yamazaki, H.; Kuwaki, T.; Ono, A.; Fujita, T.; Kumada, M.
Year: 1996
Physiological effects of various G-suit vs. positive pressure breathing ratios on +Gz tolerance
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Coll, R.M.; Venziale, P.; Cammarota, J.; Sun, H.H.; Hrebien, L.
Year: 1996
Comparison of time domain and frequency domain assessments of arterial wave reflections
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Lei, C.Q.; Li, J.K.-J.; Quick, C.
Year: 1996
Time-local vagal power
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Cordero, D.; Reisman, S.; Tapp, W.
Year: 1996
A new measure for quantifying the spectral changes of parasympathetic activity in heart rate variability
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Tazebay, M.V.; Reisman, S.
Year: 1996
Heart rate complexity as a diagnostic of autonomic neuropathy
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Curcie, D.J.
Year: 1996
Hearing aids: fixed microphone arrays with frequency equalization based on a sliding DFT
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Bin Zhu; Micheli-Tzanakou, E.; Sideman, S.
Year: 1996
Three dimensional printing of metallic surfaces for total joint fixation
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Melican, M.C.; Zimmerman, M.C.; Dhillon, M.; Goltz, D.; Treacy, D.; Parsons, J.R.
Year: 1996
The effects of fluoride ions (F/sup -/) on the mechanical properties of bovine bone tissue with different ultrastructures
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:DePaula, C.; Koike, K.; Kotha, S.P.; Weinstein, C.L.J.; Abjornson, C.; Guzelsu, N.
Year: 1996
The acoustic properties of healing rat fractures
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Harten, R.D.; Lee, F.Y.; Zimmer, M.C.
Year: 1996
Effects of ovariectomization on interfacial interactions of cortical bone in the rat femur
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Abjornson, C.; Guzelsu, N.
Year: 1996
Effect of fluoride incorporation on the mineral-organic interface of rat cortical bone
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Abjornson, C.; Walsh, W.R.; DePaula, C.A.; Guzelsu, N.
Year: 1996
Cochlear signal processing
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:J.B. Allen
Year: 1996
Development of apnea interruption system by vibratory stimulus
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Marcotte, A.L.; Rosow, E.; Eisenfeld, L.; Bronzino, J.D.
Year: 1996
Isolation of the disparity vergence late components
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Carpenter, T.L.; Semmlow, J.L.
Year: 1996
Cone ratios cannot discriminate between reflectance and illuminant borders
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Fan, L.; Finkel, L.; Buchsbaum, G.
Year: 1996
Simulation and analysis of nerve growth cone-target encounter
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Thompson, D.M.; Buettner, H.M.
Year: 1996
Self-similarity in sensory neural signals
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Teich, M.C.
Year: 1996
On the perceptual distance between speech segments
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Ghitza, O.; Sondhi, M.M.
Year: 1996
Optimality and adaptation in motion estimation by the blowfly visual system
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:de Ruyter van Steveninck, R.; Bialek, W.
Year: 1996
Two neural pathways for Fourier and non-Fourier motion
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Papathomas, T.V.; McGowan, J.W.; Chubb, C.; Gorea, A.
Year: 1996
Unified computational model for Fourier and non-Fourier motion
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Papathomas, T.V.; Rosenthal, A.S.
Year: 1996
Non-invasive, continuous monitoring of cerebral oxygenation changes during cardiopulmonary bypass by near-infrared spectroscopy (NIRS)
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Benni, P.B.; Bo Chen; Amory, D.; Li, J.K.-J.
Year: 1996
Application of ion mobility analysis method to surgical anesthesia gas monitoring
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Rosenblatt, R.; Sacristan, E.; Shahnarian, A.; Peura, R.A.; Gotal, J.; Peura, B.; Harjunmaa, H.
Year: 1996
Effect of skin preparation on transdermal insulin delivery
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Cawley, P.J.; Zakzewski, C.; Wasilewski, J.; Ford, W., Jr.
Year: 1996
Design of a mode of delivery for macrobead transplantation
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Desai, J.; Jain, K.
Year: 1996
Development of a pH based tissue ischemia monitor: hardware realization
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Gumbrell, G.P.; Peura, R.A.; Kun, S.; Dunn, R.M.
Year: 1996
Hollow glass waveguide for high energy pulsed CO/sub 2/ laser delivery
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Jiwang Dai; Harrington, J.A.; Li, J.K.-J.
Year: 1996
On the independence of Starling's law
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Palladino, J.L.; Mulier, J.P.; Noordergraaf, A.
Year: 1996
Cardiac geometry as a measure of contractility-comparison of hypertrophic and athletic hearts
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Drzewiecki, G.; Knap, B.; Li, J.K.-J.; Juznic, G.; Juznic, S.C.J.E.; Noordergraaf, A.
Year: 1996
Non-invasive control of aortic pressure and cardiac output in a reciprocating pusher-plate artificial heart
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Martin, L.R.; Gaumond, R.P.; Gardner, J.F.; Snyder, A.J.; Geselowitz, D.B.
Year: 1996
Effect of venous compliance on left ventricular stroke work at different heart rates
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Jia-Jung Wang; Drzewiecki, G.; Li, J.K.-J.
Year: 1996
Preliminary computerized comparison of ambulance response times in CVA and Cardiac calls
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Stavroulakis, A.M.; Ortiz, M.T.; Taras, L.; Kenny, J.F.; Ortiz, V.
Year: 1996
Design of a real-time acquisition and processing system for ultrasonic myocardial tissue characterization
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Cheng Yi; Micheli-Tzanakou, E.; Shindler, D.; Kostis, J.
Year: 1996
A new structured light method for 3-D wound measurement
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Ozturk, C.; Dubin, S.; Schafer, M.E.; Wen-Yao Shi; Min-Chih Chou
Year: 1996
Development of an intraventricular impedance imaging (III) system: design of the signal acquisition module
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Yi-Chih Huang; Kun, S.; Peura, R.A.
Year: 1996
Using deconvolved dispersion parameters for selecting EIT frequencies
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:McRae, D.A.; Esrick, M.A.
Year: 1996
Generation of perfect map codes for an active stereo imaging system
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Ozturk, C.; Nissanov, J.; Dubin, S.
Year: 1996
A prototype device to measure the lumbosacral-sacroiliac range-of-motion
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Engler, P.E.; Mertz, J.; Robbins, H.; Warner, M.J.; Findley, T.
Year: 1996
Interface monitoring of a prosthetic silicone suction socket system
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Glass, C.; Bain, M.; Craelius, W.
Year: 1996
Comparative study of the protease digestion of No-React and conventional glutaraldehyde treated bioprosthetic heart valves
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Sumei Yu; Kristol, D.; Abolhoda, A.; McCormick, J.R.; Gabbay, S.
Year: 1996
Application of a new streaming potential device on phosphate treated bovine bone particles: a reversibility study
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Jacobs Weinstein, C.L.; Guzelsu, N.
Year: 1996
Development of inhibitory and facilitatory modulation in the rat dentate gyrus
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Blaise, J.H.; Austin-Lafrance, R.J.; Bronzino, J.D.
Year: 1996
Na-Ca exchange as a regulator in action potentials of neonatal rat ventricles
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Chien-Jung Huang; Green, W.; Craelius, W.
Year: 1996
Effect of smoothing window length on RMS EMG amplitude estimates
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:St-Amant, Y.; Rancourt, D.; Clancy, E.A.
Year: 1996
Measurement of the electroencephalogram (EEG) coherence in group meditation
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Newandee, D.A.; Reisman, S.S.
Year: 1996
Muscle tissue ischemia monitoring using impedance spectroscopy: preliminary results
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Ristic, B.; Kun, S.; Peura, R.A.
Year: 1996
Maturation of non-linear interactions: bispectral analysis of CA1 and the dentate gyrus
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Tranquillo, J.; Taikang Ning; Bronzino, J.
Year: 1996
A system for the detection and non-pharmacological intervention in attention deficit/attention deficit hyperactivity disorder [EEG analysis]
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Miles, R.K., Jr.; Smith, W.J.; LaCourse, J.R.; Petrie, R.A.
Year: 1996
Respiration derived from the electrocardiogram: a quantitative comparison of three different methods
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Caggiano, D.; Reisman, S.
Year: 1996
Evaluation of step interpolation of systolic arterial blood pressure signals
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:O'Bara, C.; Reisman, S.S.
Year: 1996
Molecular modeling studies of AChE inhibition by sarin
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Linaras, C.E.; Ritter, A.; Kristol, D.
Year: 1996
Monte Carlo simulation of photon propagation in diffusive media
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Thottan, M.K.; Ostrander, L.E.
Year: 1996
Modeling of regulatory volume decrease in mesangial cells
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Chien-Jung Huang; Palant, C.E.; Craelius, W.
Year: 1996
StylPen: on-line adaptive canceling of pathological tremor for computer pen handwriting
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Hsu, D.S.; Wen-Mei Huang; Thakor, N.V.
Year: 1996
Parametric stability in a silicon model of the leech swim oscillator
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Wolpert, S.
Year: 1996
Detecting lapses in visual awareness from the EEG power spectrum with a neural network
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Kirk, B.P.; LaCourse, J.R.
Year: 1996
Blood cell identification using neural networks
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Sheikh, H.; Bin Zhu; Micheli-Tzanakou, E.
Year: 1996
Design and implementation of modular neural networks based on the ALOPEX algorithm [face recognition application]
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Aleynikov, S.; Micheli-Tzanakou, E.
Year: 1996
Three-dimensional neural networks
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Bricker, J.; Micheli-Tzanakou, E.
Year: 1996
Non-rigid image alignment for layered cell representation and motion tracking
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Shemlon, S.; Hawkins, S.
Year: 1996
Author index
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Year: 1996
Use of AuSn solder bumps in three-dimensional passive aligned packaging of LD/PD arrays on Si optical benches
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Itoh, M.; Sasaki, J.; Uda, A.; Yoneda, I.; Honmou, H.; Fukushima, K.
Year: 1996
Low cost packaging of semiconductor laser arrays using passive self-aligned flip-chip technique on Si motherboard
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Hunziker, W.; Vogt, W.; Melchior, H.; Germann, R.; Harder, C.
Year: 1996
Optical module with MU connector interface using self-alignment technique by solder-bump chip bonding
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Hayashi, T.; Tsunetsugu, H.
Year: 1996
Multi-chip hybrid integration on PLC platform using passive alignment technique
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Nakasuga, Y.; Hashimoto, T.; Yamada, Y.; Terui, H.; Yanagisawa, M.; Moriwaki, K.; Akahori, Y.; Tohmori, Y.; Kato, K.; Sekine, S.; Horiguchi, M.
Year: 1996
Soldering technology for optoelectronic packaging
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Qing Tan; Lee, Y.C.
Year: 1996
Fabrication of optical Tx/Rx subscriber modules incorporating passive alignment technique
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Gwan-Chong Joo; Sang-Hwan Lee; Nam Hwang; Ki-Sung Park; Hong-Man Kim; Min-Kyu Song; Kwang-Eui Pyun
Year: 1996
Solder bonding alignment of microlens in hybrid receiver for free space optical interconnections
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Pusarla, C.; Christou, A.
Year: 1996
Effects of mold compound properties on lead-on-chip (LOC) package reliability during IR reflow
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Yang Ji-Chen; Leong Chew Weng; Goh Jing Sua; Yew Chee Kiang
Year: 1996
Experimental evaluation of moisture-induced failures of surface mount plastic packages
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Ilyas, Q.S.M.; Potter, M.E.
Year: 1996
Organic contamination in IC package assembly and it's impact on interfacial integrity
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Ganesan, G.S.; Lewis, G.L.; Anderson, T.; Berg, H.M.
Year: 1996
A synthetic criterion for level-1 crack-free package-proposal of a superior package structure
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Inoue, Y.; Sawada, K.; Kawamura, N.; Sudo, T.
Year: 1996
A new leadframe design solution for improved pop-corn cracking performance
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Lee, C.; Wong Teck Chin; Pape, H.
Year: 1996
Elimination of assembly-induced package cracks in plastic SOIC
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:De Guzman, J.C.; Epistola, E.; Mena, M.G.
Year: 1996
Prevention of aluminum pad corrosion by UV/ozone cleaning
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Seung-Ho Ahn; Tae-Je Cho; Yoon-Soo Kim; Se-Yong Oh
Year: 1996
3-dimensional memory module
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Takahashi, N.; Senba, N.; Shimada, Y.; Morizaki, I.; Tokuno, K.
Year: 1996
Embedded thin film resistors, capacitors and inductors in flexible polyimide films
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Lenihan, T.; Schaper, L.; Shi, Y.; Morcan, G.; Parkerson, J.
Year: 1996
A novel integrated decoupling capacitor for MCM-L technology
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Chahal, P.; Tummala, R.R.; Allen, M.G.; Swaminathan, M.
Year: 1996
MCM and bare chip technology for a wide range of computers
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Yamamoto, H.; Fujisaki, A.; Kikuchi, S.
Year: 1996
Advances in MCM packaging for microprocessors
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Benson, D.; Hodges, C.R.; Huey, K.; Kim, P.; Logan, E.A.; Drobac, S.
Year: 1996
A user's view of MCM-D/C packaging: is it worth the trouble?
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Bartley, J.
Year: 1996
MCM-D/L using copper/photosensitive-BCB multilayer for upper microwave band systems
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Miyagi, T.; Iseki, Y.; Higuchi, K.; Shizuki, Y.; Hanawa, T.; Takagi, E.; Saito, M.; Yoshihara, K.; Konno, M.
Year: 1996
Transient thermal modeling and characterization of a hybrid component
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Christiaens, F.; Beyne, E.
Year: 1996
Validation study of compact thermal resistance models of IC packages
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Zemo Yang; Young Kwon
Year: 1996
DELPHI-a status report on the European-funded project for the development of libraries and physical models for an integrated design environment
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Rosten, H.I.
Year: 1996
Measuring the effects of energy flow on IC package thermal performance
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Wyland, C.
Year: 1996
The development of component-level thermal compact models of a C4/CBGA interconnect technology: the Motorola PowerPC 603/sup TM/ and PowerPC 604/sup TM/ RISC microprocessors
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Parry, J.; Rosten, H.; Kromann, G.B.
Year: 1996
Transient thermal management in electronic packaging using dynamic control of power dissipation and heat transfer
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Cao, L.; Krusius, J.P.; Korhonen, M.; Fisher, T.
Year: 1996
Lasersonic bonding of TAB components to epoxy-glass circuit boards
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Vanderlee, K.A.; Porter, R.B.; Kulterman, R.W.; Chalco, P.A.
Year: 1996
PBGA wire bonding development
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Shu, W.K.
Year: 1996
High resolution and low-cost test technique for unpopulated MCM substrate
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Kim, B.C.; Swaminathan, M.; Chatterjee, A.
Year: 1996
Is the current surface insulation resistance (SIR) methodology appropriate to today's manufacturing technology?
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Chan, H.A.
Year: 1996
Reducing optoelectric response when functionally tuning thin-film resistors on silicon IC's
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Barcey, R.; Svenson, E.J.; Yunlong Sun
Year: 1996
In-process board warpage measurement in a lab scale wave soldering oven
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Stiteler, M.R.; Ume, C.; Leutz, B.
Year: 1996
1-Gbyte/sec array transmitter and receiver modules for low-cost optical fiber interconnection
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Nagahori, T.; Miyoshi, K.; Hatakeyama, I.; Araki, S.; Yoneda, I.; Kimura, N.; Fukushima, K.; Itoh, M.
Year: 1996
A complete sub-system of parallel optical interconnects for telecom applications
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Niburg, M.; Eriksen, P.; Gustafsson, K.; Hesselbom, H.; Palmskog, G.; Robertsson, M.; Tan, N.; Akermark, K.; Djupsjobacka, A.; Juhola, T.; Kerzar, B.; Mokhtari, M.; Schuppener, G.
Year: 1996
Parallel optical interconnections for future broad band systems, based on the "fibre in board technology"
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:De Pestel, G.; Picard, A.; Vandewege, J.; Morlion, D.; Tan, Q.; Van Koetsem, J.; Migom, F.; Vetter, P.
Year: 1996
OptoElectronic Technology Consortium (OETC) parallel optical data link: components, system applications, and simulation tools
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Wong, Y.M.; Muehlner, D.J.; Faudskar, C.C.; Fishteyn, M.; Gates, J.V.; Anthony, P.J.; Cyr, G.J.; Choi, J.; Crow, J.D.; Kuchta, D.M.; Pepeljugoski, P.K.; Stawiasz, K.; Nation, W.; Engebretsen, D.; Whitlock, B.; Morgan, R.A.; Hibbs-Brenner, M.K.; Lehman, J.; Walterson, R.; Kalweit, E.; Marta, T.
Year: 1996
Characteristics of VCSEL arrays for parallel optical interconnects
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Lebby, M.; Gaw, C.A.; Wenbin Jiang; Kiely, P.A.; Chan Long Shieh; Claisse, P.R.; Ramdani, J.; Hartman, D.H.; Schwartz, D.B.; Grula, J.
Year: 1996
The Jitney Parallel Optical Interconnect
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Crow, J.D.; Joong-Ho Choi; Cohen, M.S.; Johnson, G.; Kuchta, D.; Lacey, D.; Ponnapalli, S.; Pepeljugoski, P.; Stawiasz, K.; Trewhella, J.; Xiao, P.; Tremblay, S.; Ouimet, S.; Lacerte, A.; Gauvin, M.; Booth, D.; Nation, W.; Smith, T.L.; DeBaun, B.A.; Henson, G.D.; Igl, S.A.; Lee, N.A.; Piekarczyk, A.J.; Kuczma, A.S.; Spanoudis, S.L.
Year: 1996
Gigabyte/s data communications with the POLO parallel optical link
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Hahn, K.H.; Giboney, K.S.; Wilson, R.E.; Straznicky, J.; Wong, E.G.; Tan, M.R.; Kaneshiro, R.T.; Dolfi, D.W.; Mueller, E.H.; Plotts, A.E.; Murray, D.D.; Marchegiano, J.E.; Booth, B.L.; Sano, B.J.; Madhaven, B.; Raghavan, B.; Levi, A.F.J.
Year: 1996
Polymer optical interconnect technology (POINT) optoelectronic packaging and interconnect for board and backplane applications
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Liu, Y.S.; Wojnarowski, R.J.; Hennessy, W.A.; Bristow, J.P.; Yue Liu; Peczalski, A.; Rowlette, J.; Plotts, A.; Stack, J.; Kadar-Kallen, M.; Yardley, J.; Eldada, L.; Osgood, R.M.; Scarmozzino, R.; Lee, S.H.; Ozgus, V.; Patra, S.
Year: 1996
The P-VixeLink/sup TM/ multichannel optical interconnect
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Swirhun, S.; Dudek, M.; Neumann, R.; Calkins, J.; Brusenbach, P.; Brinkmann, D.; Northrop, T.; Moore, A.; Paananen, D.; Scott, J.; White, T.
Year: 1996
Experimental and analytical study on the flow of encapsulant during underfill encapsulation of flip-chips
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Sejin Han; Wang, K.K.; Sung-Yong Cho
Year: 1996
Moisture resistant aluminum nitride filler for high thermal conductivity microelectronic molding compounds
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Gallo, A.A.; Bischof, C.S.; Howard, K.E.; Dunmead, S.D.; Anderson, S.A.
Year: 1996
High thermal conductance liquid encapsulants for direct chip attach
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Koh, W.H.
Year: 1996
Non-hermetic plastic packaging of high voltage electronic switches utilizing a low-stress glob coating for 95/5 Pb/Sn solder joints of flip-chip bonded multi-chip module high voltage devices
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Wong, C.P.; Segelken, J.M.; Tai, K.L.; Wong, C.C.
Year: 1996
Printed circuit board material and design considerations for wireless applications
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Daigle, B.
Year: 1996
High frequency characteristics of MCM decoupling capacitors
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Schaper, L.W.; Morcan, G.
Year: 1996
Reliability and characterization of MLC decoupling capacitors with C4 interconnections
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Scheider, D.; Hopkins, D.; Zucco, P.; Moszczynski, E.; Griffin, M.; Takacs, M.; Galvagni, J.
Year: 1996
A comparison of micromachined inductors with different magnetic core materials
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Park, J.Y.; Allen, M.G.
Year: 1996
High resistivity Si as a microwave substrate
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Reyes, A.C.; El-Ghazaly, S.M.; Dorn, S.; Dydyk, M.; Schroder, D.K.; Patterson, H.
Year: 1996
Plastic encapsulated microcircuits (PEM) qualification testing
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Scalise, J.
Year: 1996
Investigation on reliability test plan and failure analyses for relay
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Tang Yiliang; Wang Jingqin; Lu Jianguo
Year: 1996
Time integration procedures for a cyclic thermoviscoplasticity model for Pb-Sn solder applications
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Chiayu Fu; McDowell, D.; Ume, C.
Year: 1996
Delamination cracking in encapsulated flip chips
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Le Gall, C.A.; Jianmin Qu; McDowell, D.L.
Year: 1996
Application of a surrogate layer for lower bending stress in a tri-material body
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Suhir, E.; Weld, J.D.
Year: 1996
Thermo-structural behavior of underfilled flip-chips
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Gektin, V.; Bar-Cohen, A.; Witzman, S.
Year: 1996
Bottom leaded plastic (BLP) package: a new design with enhanced solder joint reliability
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Young-Gon Kim; Bongtae Han; Shin Choi; Myung-Ki Kim
Year: 1996
A high density optical backplane connector
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Melchior, L.; Kropp, J.-R.
Year: 1996
Field-based design of a new high pincount board connector for high data rate transmission
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Katzier, H.; Keller, B.-M.; Pagnin, P.
Year: 1996
BGA sockets-a dendritic solution
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Chan, B.; Singh, P.
Year: 1996
New ball grid array module test sockets
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Da-Yuan Shih; Lauro, P.; Fogel, K.; Beaman, B.; Yun-Hsin Liao; Hedrick, J.
Year: 1996
New insights for the specification of copper alloy strip metals for connectors
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Zarlingo, S.P.
Year: 1996
A straddle mount connector system attach process
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Schluter, R.L.; Pearsall, K.J.; Burns, R.W.
Year: 1996
Alignment tolerance measurements and optical coupling modeling for optoelectronic array interface assemblies
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Sutherland, J.; George, G.; van der Green, S.; Krusius, J.P.
Year: 1996
Multifiber optical components for subscriber networks
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Yokosuka, H.; Naidu, H.; Hosoya, H.; Kikuchi, Y.
Year: 1996
Single-mode multifiber connector design and performance
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Satake, T.; Tatsuno, T.; Ouchi, Y.; Knasel, D.; Knight, K.; Lundberg, J.; Keller, D.
Year: 1996
Photonic packaging using laser/receiver arrays and flexible optical circuits
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Grimes, G.J.; Markush, J.P.C.; Wong, Y.M.; Anthony, P.J.; Holland, W.R.; Priest, E.G.; Sherman, C.J.; Peck, S.R.; Muehlner, D.J.; Faudskar, C.C.; Nyquist, J.S.; Helton, J.S.; Sonnier, G.L.; Gates, J.V.; Honea, W.K.; Bortolini, J.R.
Year: 1996
Optical fiber interconnections
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Shahid, M.A.; Roil, R.A.
Year: 1996
An optical active connector: an optical interconnect module with an electrical connector interface
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Sasaki, S.; Tanaka, N.; Yamaguchi, S.; Nakamura, M.; Hayashi, T.
Year: 1996
Low-cost automated fiber pigtailing machine
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Strand, O.T.
Year: 1996
Materials and mechanics issues in flip-chip organic packaging
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Wu, T.Y.; Tsukada, Y.; Chen, W.T.
Year: 1996
Motorola's first DCA product: the Gold Line Pen Pager
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Doot, R.K.
Year: 1996
The evaluation of fast-flow, fast-cure underfills for flip chip on organic substrates
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Wun, K.L.B.W.; Margaritis, G.
Year: 1996
Fluxless no-clean assembly of solder bumped flip chips
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Koopman, N.; Nangalia, S.; Rogers, V.
Year: 1996
Solder transfer technique for flip chip and electronic assembly applications
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Puttlitz, K.J.; Lidestri, K.A.; Totta, P.A.
Year: 1996
Development of high conductivity lead (Pb)-free conducting adhesives
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Kang, S.K.; Rai, R.; Purushothaman, S.
Year: 1996
The development of a new resin with high mechanical strength at a high temperature for TCP's
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Ohsono, M.; Iwane, T.; Uchida, I.; Tajima, N.; Kada, M.
Year: 1996
Highly thermally conductive, low stress molding compounds
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Chen, A.S.; Lo, R.H.Y.
Year: 1996
Multi-GHz VCSEL electrical packaging analysis
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Hall, S.H.; Walters, W.L.; Mattson, L.F.; Gilbert, B.K.
Year: 1996
Ultra-low-power, long-wavelength photoreceivers for massively-parallel optical data links
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Lovejoy, M.L.; Patrizi, G.A.; Enquist, P.M.; Carson, R.F.; Craft, D.C.; Shul, R.J.
Year: 1996
High performance optoelectronic packaging for 2.5 and 10 Gb/s laser modules
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Sherry, W.M.; Gaebe, C.; Miller, T.J.; Schweizer, R.C.
Year: 1996
High-speed optical receiver module fabrication using laser welding technique
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Seung Goo Kang; Min Kyu Song; Nam Hwang; Chan Yong Park; Hee Tae Lee; Kwang Eui Pyun
Year: 1996
A 10 Gbit/s PIN-HBT MMIC receiver front-end
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Kwark, B.S.; Park, M.S.
Year: 1996
Accurate thermal impedance measurement for semiconductor lasers by the double modes of fiber grating lasers
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Huang, S.Y.
Year: 1996
The packaging of large spot-size optoelectronic devices
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Collins, J.V.; Lealman, I.F.; Fiddyment, P.J.; Thurlow, A.R.; Ford, C.W.; Rogers, D.C.; Jones, C.A.
Year: 1996
Design trade-offs in high performance packages
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Kadakia, S.D.; Agrawal, A.P.
Year: 1996
Thermal management of a C4/CBGA interconnect technology for a high-performance RISC microprocessor: the Motorola PowerPC 620/sup TM/ microprocessor
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Kroman, G.
Year: 1996
Measurement and simulation of simultaneous switching noise in the multi-reference plane package
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Rosser, S.G.; Kerr, M.K.; Chi Shih Chang; Jiayuan Fang; Zhaoqing Chen; Yuzhe Chen
Year: 1996
ESD qualification and testing of semiconductor electronic components
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Gross, V.P.; Voldman, S.H.; Guthrie, W.H.
Year: 1996
High performance, low-cost leadframe with a heat spreader for HQFPs
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Ohtaka, T.; Kameyama, Y.; Yamagishi, I.; Yonemoto, T.; Suzumura, T.
Year: 1996
Reliability assessment of BGA packages
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Geok-Leong Tan; Chuan-Yau Hoo; Gerard Chew; Jim-Hee Low; Nam-Beng Tay; Chakravorty, K.K.; Thiam-Beng Lim
Year: 1996
Warpage study of glob top cavity-up EPBGA packages
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Dexin Liang
Year: 1996
Enhanced PBGA-the next generation
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Carichner, K.; Dandia, S.
Year: 1996
TBGA bond process for ground and power plane connections
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Domadia, A.; Mendoza, D.
Year: 1996
PBGA for high power: extending the thermal envelope
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Mulgaonker, S.; Hawkins, G.; Ramakrishna, K.; Mawer, A.; Winkler, E.
Year: 1996
Design and development of a high performance PBGA package for the UltraSPARC-I/sup TM/ processor
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Abbott, J.; Hamilton, G.; Kalidas, N.; Murtuza, M.; Thornton, C.; Thomas, S.; Umeda, Y.; Malladi, D.; Towne, D.; Shun-Lung Chao
Year: 1996
Development of molded fine-pitch ball grid array (FPBGA) using through-hole bonding process
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Matsuda, S.; Kata, K.; Nakajima, H.; Hagimoto, E.
Year: 1996
Package switching noise evaluation using boundary scan circuitry
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Games, E.; Shrivastava, U.; Liao, J.C.
Year: 1996
New electrical modeling approach for simultaneous switching noise for high-performance packages
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Kato, K.; Miura, M.; Ito, K.; Yamaji, Y.; Sudo, T.
Year: 1996
Simultaneous switching noise simulation for thin film packages using macromodeling technique
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Huang, C.; Celik, M.; Prince, J.L.
Year: 1996
Signal integrity issues at split ground and power planes
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Haw-Jyh Liaw; Merkelo, H.
Year: 1996
Optimum placement of decoupling capacitors on packages and printed circuit boards under the guidance of electromagnetic field simulation
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Yuzhe Chen; Zhaoqing Chen; Jiayuan Fang
Year: 1996
Optimal pin-assignment for ground noise minimization in IC packages and connectors
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Lihong Zhang; Zhang, Q.J.
Year: 1996
Correlation between material composition, processing, chemical bonding state, and electrochemical migration failure rate in isolating compounds of high density microelectronics systems
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Harsanyi, G.; Illyefalvi-Vitez, Z.; Jones, W.K.
Year: 1996
Plastic chip carrier package
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Joshi, R.; Shanker, B.J.
Year: 1996
Effects of moisture and delamination on cracking of plastic IC packages during solder reflow
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Tay, A.A.O.; Lin, T.Y.
Year: 1996
Thermal evaluation of /spl Theta//sub JA/ for varying board conductivity
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Weed, K.; Kirkpatrick, A.
Year: 1996
A method to determine the frequency performance and noise margin of various interconnect technologies
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Kar, J.; Shukla, R.; Bhattacharyya, B.
Year: 1996
Low-stress leadframe design for plastic IC packages
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Bhandarkar, N.; Lim Thiam Beng
Year: 1996
Analysis of electrical resistance monitoring of PCMCIA interconnection failures
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Zheng, D.; Constable, J.H.
Year: 1996
Thermo-mechanical modeling of a novel MCM-DL technology
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Dunne, R.C.; Sitaraman, S.K.
Year: 1996
A high density, high performance MCM-D/C package: a design, electrical, and process perspective
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Ellsworth, M.J., Jr.; Hamel, H.; Perfecto, E.D.; Wassick, T.
Year: 1996
Moisture sensitivity evaluation of ball grid array packages
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Yip, L.; Massingill, T.; Naini, H.
Year: 1996
Characterization of the fatigue properties of bonding wires
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Deyhim, A.; Yost, B.; Mirng-Ji Lii; Che-Yu Li
Year: 1996
Design for manufacturability through the use of statistical simulation
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Sanders, T.J.; Means, D.P.; Hess, G.T.
Year: 1996
Low cost and room temperature plasma CVD silicon nitride passivation
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Arif uz Zaman, M.; Sanders, T.J.; Gsteiger, K.E.; Linn, J.H.
Year: 1996
Recipe synthesis for PECVD SiO/sub 2/ films using neural networks and genetic algorithms
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Seung-Soo Han; May, G.S.
Year: 1996
Thermal modeling of a few-chip module housing a DC-DC power supply
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Walshak, D.; Hashemi, H.; Mehrotra, P.
Year: 1996
Popcorning-a fracture mechanics approach
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Kuo, A.Y.; Chen, W.T.; Nguyen, L.T.; Chen, K.L.; Slenski, G.
Year: 1996
Practical considerations for the design, performance, and application of plastic BGA packages
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Evans, T.C.
Year: 1996
High frequency modeling for 10 Gbps DFB laser diode module packaging
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Seong-Su Park; Min Kyu Song; Seung Goo Kang; Nam Hwang; Hee Tae Lee; Heung Ro Choo; Kwang Eui Pyun
Year: 1996
Modeling and analysis of interconnects within a package incorporating vias and a perforated ground plane
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Mathis, A.W.; Peterson, A.F.
Year: 1996
Simulation of frequency dependent conductor loss in interconnects
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Divekar, D.; Raghuram, R.; Balistreri, F.; Matsui, N.
Year: 1996
Numerical investigation of radiated emissions mechanisms in single-chip packages
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Aguirre, G.; Cangellaris, A.C.; Pasik, M.F.
Year: 1996
A priori wiring estimations and optimal multilevel wiring networks for portable ULSI systems
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Davis, J.A.; De, V.K.; Meindl, J.D.
Year: 1996
Propagation characteristics of coaxial cable with a helically wound ground shield
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Hochberg, T.; Merkelo, H.
Year: 1996
An interim report on the comparisons of polymide to non-polyimide reliability for C4
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Phillips, J.; Margaritis, G.; Afshari, B.
Year: 1996
Manufacturing semiconductor integrated circuits with built-in hermetic equivalent reliability
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Loboda, M.J.; Camilletti, R.C.; Goodman, L.A.; White, L.K.; Pinch, H.L.; Wu, C.P.
Year: 1996
Area array packaging technologies for high-performance computer workstations and multiprocessors
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Chung, T.C.; Ghahghahi, F.; Oberlin, B.; Carey, D.; Nelson, D.
Year: 1996
Board and system level effects on plastic package thermal performance
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Tiao Zhou; Hundt, M.
Year: 1996
Inductance and SSN performance comparison of a 225 plastic BGA and a 208 plastic QFP
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Chi-Taou Tsai
Year: 1996
Statistical methods for stress screen development
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Cooper, M.R.
Year: 1996
An improvement in reflow performance of plastic packages
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Tae-Je Cho; Kyu-Jin Lee; Min-Ho Lee; Seung-Ho Ahn; Se-Yong Oh
Year: 1996
Multifiber connector end face attributes for optimal connector performance
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Kevern, J.; Harper, D.; Knasel, D.; Knight, K.; Satake, T.
Year: 1996
Effect of Au coating on joint strength in laser welding for Invar-Invar packages
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Wang, S.C.; Wang, C.; Tu, Y.K.; Hwang, C.J.; Chi, S.; Wang, W.H.; Cheng, W.H.
Year: 1996
Superbroadband or multiwavelength transmitter for optical fiber communication systems
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Mirov, S.B.; Grimes, G.J.; Basiev, T.T.
Year: 1996
Grazing angle planar diffraction grating for photonic wavelength demultiplexing
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Livingston, R.A.; Krchnavek, R.R.
Year: 1996
Electroplated solder joints for optoelectronic applications
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Hongtao Han; Boudreau, R.; Song-Sheng Tan
Year: 1996
A practical test method for DC-DC converter qualification
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Ellacott, K.D.; Stone, K.P.
Year: 1996
A 533 MBits/sec/wire modular bus with single or double parallel termination
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Nimmagadda, S.; Dillon, J.; Moncayo, A.
Year: 1996
Extraction of transient behavioral model of digital I/O buffers from IBIS
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Tehrani, P.F.; Yuzbe Chen; Jiayuan Fang
Year: 1996
Effect of polyimide processing on multichip glass ceramic module fabrications
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Da-Yuan Shih
Year: 1996
Advances in flip-chip underfill flow and cure rates and their enhancement of manufacturing processes and component reliability
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Daqing Max Shi; Carbin, J.W.
Year: 1996
Thermal and viscoelastic characterization of transfer-molded epoxy encapsulant during simulated post-mold cure
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Chew, S.
Year: 1996
Physical design and assembly process development of a multi-chip package containing a light emitting diode (LED) array die
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Bonda, R.; Fang, T.; Kaskoun, K.; Lytle, B.; Swan, G.; Stafford, J.W.; Marlin, B.; Tam, G.
Year: 1996
Three-dimensional modeling of wire sweep incorporating resin cure
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Wu, J.H.; Tay, A.A.O.; Yeo, K.S.; Lim, T.B.
Year: 1996
Global technical and commercial developments with flip chip technology
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Lassen, C.L.
Year: 1996
A new flip-chip technology for high-density packaging
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Smith, D.L.; Alimonda, A.S.
Year: 1996
Laser isotope purification of lead for use in semiconductor chip interconnects
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Scheibner, K.; Haynam, C.; Worden, E.; Esser, B.
Year: 1996
The effect of ultrasonic frequency on fine pitch aluminum wedge wirebond
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Gonzalez, B.; Knecht, S.; Handy, H.; Ramirez, J.
Year: 1996
Self-aligned, fluxless flip-chip bonding technology for photonic devices
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Kuhmann, J.F.; Hensel, H.-J.; Pech, D.; Harde, P.; Bach, H.-G.
Year: 1996
Low-cost fabrication of optical subassemblies
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Cohen, M.S.; Johnson, G.W.; Trewhella, J.M.; Lacey, D.L.; Oprysko, M.M.; Karst, D.L.; DeFoster, S.M.; Hogan, W.K.; Peterson, M.D.; Weirick, J.A.
Year: 1996
Advanced molding technique for optical transceivers
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Robinson, S.D.; Anigbo, F.C.J.; Shevchuk, G.J.
Year: 1996
Unibody plastic injection-molded optical sub-assembly for large core fiber
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Trewhella, J.M.; Oprysko, M.M.; Backhauss, H.; Ritter, M.; Cina, M.
Year: 1996
Challenges for developing low-cost avionics/aerospace-grade optoelectronic modules
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Chan, E.Y.; Beranek, M.W.; Davido, K.W.; Hager, H.E.; Hong, C.S.; St. Pierre, R.L.
Year: 1996
2D vertical-cavity laser arrays for free-space and multimode fiber transmission systems
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Wipiejewski, T.; Ko, J.; Thibeault, B.J.; Young, D.B.; Coldren, L.A.
Year: 1996
Creep deformation of 96.5Sn-3.5Ag solder joints in a flip chip package
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Hong Yang; Deane, P.; Magill, P.; Murty, K.L.
Year: 1996
A novel bonding technique to bond CTE mismatched devices
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Chandran, B.; Schmidt, W.F.; Gordon, M.H.
Year: 1996
PWB solder wettability after simulated storage
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Hernadez, C.L.; Hosking, F.M.
Year: 1996
Aging studies of Cu-Sn intermetallic compounds in annealed surface mount solder joints
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:So, A.C.K.; Chan, Y.C.
Year: 1996
Compatibility of lead-free solders with lead containing surface finishes as a reliability issue in electronic assemblies
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Vianco, P.; Rejent, J.; Artaki, I.; Ray, U.; Finley, D.; Jackson, A.
Year: 1996
FCOB reliability evaluation simulating multiple rework/reflow processes
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Chen, W.; Gentile, J.; Higgins, L.
Year: 1996
Highly accurate design of thermal fatigue life for flipchip joint
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Kawai, M.; Harada, M.; Andou, A.; Yamada, O.; Satoh, R.; Netsu, T.
Year: 1996
Reliability characterization of the SLICC package
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Lall, P.; Gold, G.; Miles, B.; Banerji, K.; Thompson, P.; Koehler, C.; Adhihetty, I.
Year: 1996
Thermal fatigue reliability enhancement of plastic ball grid array (PBGA) packages
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Syed, A.R.
Year: 1996
Reliability evaluations on a new tape ball grid array (TBGA)
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Gainey, T.; Stover, M.; Auray, M.
Year: 1996
Solder joint reliability study of 256 pin, 0.4 mm pitch, PQFP
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Yeo, C.K.; Mhaisalkar, S.; Pang, H.L.J.
Year: 1996
TSOP solder joint reliability
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Zequn Mei
Year: 1996
Transition: lessons learned in the development and production of IBM's /spl mu/Laminate/sup TM/ PBGA
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Delisle, G.; Dibble, E.; Fuller, J.
Year: 1996
Molded chip scale package for high pin count
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Baba, S.; Tomita, Y.; Matsuo, M.; Matsushima, H.; Ueda, N.; Nakagawa, O.
Year: 1996
Foil covered PACkage (FPAC): a new package concept
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Hotta, Y.; Sigyo, H.; Kondo, S.; Oizumi, S.
Year: 1996
Assembly process and solder joint integrity of the metal ball grid array (MBGA/sup TM/) package
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Tostado, S.; Chow, J.
Year: 1996
Flex tape ball grid array
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Karnezos, M.; Goetz, M.; Dong, F.; Ciaschi, A.; Chidambaram, N.
Year: 1996
Diffractive optics for packaging of laser diodes and fiber-optics
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Feldman, M.R.; Welch, W.H.; Te Kolste, R.D.; Morris, J.E.
Year: 1996
Alignment of multiple optical axes in a multistage optical system by using Hamiltonian algorithm
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Mizukami, M.; Hirano, M.; Shinjo, K.
Year: 1996
Screen printed adhesive technologies for all-silicon optical packaging
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Sasaki, S.; Tanaka, K.; Miura, K.; Yano, M.
Year: 1996
Quantitative characterization of optical fiber solder bond joints on silicon
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Rassaian, M.; Beranek, M.W.
Year: 1996
A new cost effective packaging technique for optoelectronic devices
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Rainer Dohle, G.; Callahan, J.J.; Drabik, T.J.; Martin, K.P.
Year: 1996
Structure-dependent reliability assessment of 1.3 /spl mu/m InGaAsP/InP uncooled laser diodes by accelerated aging test
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Nara Hwang; Gwan-Chong Joo; Sang-Hwan Lee; Seong-Su Park; Ho-Sung Cho; Min-Kyu Song; Kwang-Eui Pyun
Year: 1996
Low-power modular parallel photonic data links
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Carson, R.F.; Lovejoy, M.L.; Lear, K.L.; Warren, M.E.; Seigal, P.K.; Patrizi, G.A.; Kilcoyne, S.P.; Craft, D.C.
Year: 1996
Flip chip bonding using isotropically conductive adhesives
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Rosner, B.; Liu, J.; Zonghe Lai
Year: 1996
Aluminum thick-metal-backed circuits: conductive adhesive technology
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Light, D.N.; Jimarez, L.J.; Egitto, F.D.; Matienzo, L.J.; Logan, P.E.; Seman, A.M.
Year: 1996
Am extended eutectic solder bump for FCOB
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Greer, S.E.
Year: 1996
Operational maintenance data for power generation distribution and HVAC components
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Hollis, H.D.; Arno, R.G.; Briggs, S.J.; Hale, P.S., Jr.
Year: 1996
Power interruption costs to industrial and commercial consumers of electricity
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Sullivan, M.J.; Vardell, T.; Johnson, M.
Year: 1996
Canadian National Power Quality Survey: frequency of industrial and commercial voltage sags
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Koval, D.O.; Hughes, M.B.
Year: 1996
Limitations of current limiting protectors for expansion of electrical distribution systems
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Das, J.C.
Year: 1996
An evaluation of energy storage techniques for improving ride-through capability for sensitive customers on underground networks
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Braz, A.; Hofmann, P.; Mauro, R.; Melhorn, C.J.
Year: 1996
Voltage sags: their impact on the utility and industrial customers
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Davis, T.; Beam, G.E.; Melhorn, C.J.
Year: 1996
Applicability of neural networks to industrial and commercial power systems: a tutorial overview
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Halpin, S.M.; Burch, R.F., IV
Year: 1996
Vacuum arc research expands interpretation of test data from vacuum interrupters
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Schulman, M.B.; Kirkland Smith, R.
Year: 1996
Study for the performance of high speed switchgear for protection of in-house generation system
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Matsushita, K.; Matsuura, Y.; Funabashi, T.; Takeuchi, N.; Kai, T.; Oobe, M.
Year: 1996
Automated coordination programs do not make correct results automatic
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Cardinal, P.G.
Year: 1996
Using transformer differential relay I/sub OP/ characteristics to measure near-trip conditions
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Criss, J.; Lawhead, L.
Year: 1996
Sensible approaches to diagnosing power quality problems
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Michaels, K.M.
Year: 1996
Case study of a unique power quality problem and solution. Application of a damped harmonic filter to a cycloconverter
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Baier, M.; Sheppard, J.
Year: 1996
Complete characterization of utilization-voltage power system impedance using wideband measurement
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Rhode, J.P.; Kelley, A.W.; Baran, M.E.
Year: 1996
Significance of working point determining line current harmonics in controlled AC/DC converter
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Grotzbach, M.; Bauta, M.
Year: 1996
Electric power systems design: The NEC and the IEC approach
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Parise, G.; Grasselli, U.; Zan, R.; Sanders, M.K.
Year: 1996
Standby power generation under utility curtailment contract agreements
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Nolan, G.J.; Puccio, V.J.; Calhoun, C.W.
Year: 1996
Development of a real time power system dynamic performance monitoring system
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Wei-Jen Lee; Jae-Hyeon Gim; Mo-Shing Chen; Shih-Ping Wang; Ren-Jun Li
Year: 1996
NEC grounding requirements for parallel circuits
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Daly, J.M.
Year: 1996
Survey results of low voltage circuit breakers as found during maintenance testing
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:O'Donnell, P.
Year: 1996
An isomorphism theorem for circuit complexity
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Agrawal, M.; Allender, E.
Year: 1996
Nondeterministic NC/sup 1/ computation
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Caussinus, H.; McKenzie, P.; Therien, D.; Vollmer, H.
Year: 1996
Parallel complexity hierarchies based on PRAMs and DLOGTLME-uniform circuits
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Iwama, K.; Iwamoto, C.
Year: 1996
Collapsing oracle-tape hierarchies
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Gottlob, G.
Year: 1996
Extracting randomness: how and why. A survey
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Nisan, N.
Year: 1996
On coherence, random-self-reducibility, and self-correction
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Feigenbaum, J.; Fortnow, L.; Laplante, S.; Naik, A.
Year: 1996
Error reduction by parallel repetition-a negative result
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Feige, U.; Verbitsky, O.
Year: 1996
Deciding the Vapnik-Cervonenkis dimension is /spl Sigma//sub 3//sup p/-complete
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Schafer, M.
Year: 1996
VC dimension in circuit complexity
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Koiran, P.
Year: 1996
Reducing P to a sparse set using a constant number of queries collapses P to L
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Van Melkebeek, D.
Year: 1996
L-printable sets
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Fortnow, L.; Goldsmith, J.; Levy, M.A.; Mahaney, S.
Year: 1996
Hierarchies of circuit classes that are closed under complement
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Vinay, V.
Year: 1996
Succinct representation, leaf languages, and projection reductions
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Veith, H.
Year: 1996
Randomization and derandomization in space-bounded computation
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Saks, M.
Year: 1996
On the measure of two-dimensional regions with polynomial-time computable boundaries
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Ker-I Ko; Weihrauch, K.
Year: 1996
On positive P
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Lautemann, C.; Schwentick, T.; Stewart, I.A.
Year: 1996
A comparison of weak completeness notions
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Ambos-Spies, K.; Mayordomo, E.; Xizhong Zheng
Year: 1996
The law of the iterated logarithm for random sequences
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Yongge Wang
Year: 1996
Truth-table closure and Turing closure of average polynomial time have different measures in EXP
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Schuler, R.
Year: 1996
Much ado about functions
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Selman, A.L.
Year: 1996
Inverting onto functions
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Fenner, S.A.; Fortnow, L.; Naik, A.V.; Rogers, J.D.
Year: 1996
A note on p-selective sets and on adaptive versus nonadaptive queries to NP
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Naik, A.V.; Selman, A.L.
Year: 1996
Good degree bounds on Nullstellensatz refutations of the induction principle
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Buss, S.R.; Pitassi, T.
Year: 1996
The complexity of knowledge representation
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Papadimitriou, C.H.
Year: 1996
Integer programming as a framework for optimization and approximability
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Barland, I.; Kolaitis, P.G.; Thakur, M.N.
Year: 1996
Complements of multivalued functions
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Fenner, S.; Green, F.; Homer, S.; Selman, A.L.; Thierauf, T.; Vollmer, H.
Year: 1996
A note on decision versus search for graph automorphism
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:M. Agrawal; V. Arvind
Year: 1996
Zero knowledge and the chromatic number
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Feige, U.; Kilian, J.
Year: 1996
DNA models and algorithms for NP-complete problems
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Bach, E.; Glaser, E.; Condon, A.; Tanguay, C.
Year: 1996
Reversible simulation of irreversible computation
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Ming Li; Vitanyi, P.
Year: 1996
Author index
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Year: 1996
Limitations and challenges of multi-gigabit DRAM circuits
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:K. Itoh; Y. Nakagome; S. Kimura; T. Watanabe
Year: 1996
Analog circuit design in scaled CMOS technology
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:W. Sansen
Year: 1996
A low power data holding circuit with an intermittent power supply scheme for sub-1V MT-CMOS LSIs
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:T. Iwata; H. Yamamoto; H. Yamauchi; A. Matsuzawa
Year: 1996
A low-power current-sensing complementary pass-transistor logic (LCSCPTL) for low-voltage high-speed applications
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Kuo-Hsing Cheng; Yii-Yih Liaw
Year: 1996
Self resetting logic register and incrementer
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:R.A. Haring; M.S. Milshtein; T.I. Chappell; B.A. Chappell
Year: 1996
FCL (FET coupled logic) circuit for 1.5 V, multi-GHz BiCMOS LSIs
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:H. Okamura; M. Sato; S. Nakamura; S. Kishi; K. Kokubu
Year: 1996
Power-on contention elimination [CMOS digital circuits]
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:G. Taylor; K. Wong
Year: 1996
A 2-GHz 1.6-mW phase-locked loop
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:B. Razavi
Year: 1996
An analytical model of planar inductors on lowly doped silicon substrates for high frequency analog design up to 3 GHz
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:J. Crols; P. Kinget; J. Craninckx; M. Steyaert
Year: 1996
A 1.8-GHz low-phase-noise spiral-LC CMOS VCO
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:J. Craninckx; M. Steyaert
Year: 1996
A 1.5 V, 1.5 GHz CMOS low noise amplifier
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:D.K. Shaeffer; T.H. Lee
Year: 1996
The IDCT processor on the adder-based distributed arithmetic
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Chingson Chen; Tian Sheuan Chang; Chein-Wei Jen
Year: 1996
A scalable multiprocessor architecture for professional digital audio
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:P. Duc; H. Hassig; D. Mlynek
Year: 1996
A microcontroller embedded with 4 Kbit ferroelectric non-volatile memory
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:T. Fukushima; A. Kawahara; T. Nanba; M. Matsumoto; T. Nishimoto; N. Ikeda; Y. Judai; T. Sumi; T. Otsuki
Year: 1996
2 V/100 ns 1 T/1 C nonvolatile ferroelectric memory architecture with bitline-driven read scheme and non-relaxation reference cell
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:H. Hirano; T. Honda; N. Moriwaki; T. Nakakuma; A. Inoue; G. Nakane; S. Chaya; T. Sumi
Year: 1996
The charge-share modified precharge-level (CSM) architecture for high-speed and low-power ferroelectric memory
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:H. Fujisawa; T. Sakata; T. Sekiguchi; O. Nagashima; K. Kimura; K. Kajigaya
Year: 1996
A small data-line-swing read/write scheme for high-endurance nonvolatile DRAMs with ferroelectric capacitors
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:T. Sakata; H. Fujisawa; T. Sekiguchi; K. Torii; K. Kajigaya; K. Kimura
Year: 1996
A fully integrated low noise RF frequency synthesizer design for mobile communication application
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Seog-Jun Lee; Beomsup Kim; Kwyro Lee
Year: 1996
A 30-mW 10.7-MHz pseudo-N-path sigma-delta band-pass modulator
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:F. Francesconi; G. Caiulo; V. Liberali; F. Maloberti
Year: 1996
A CMOS channel-select filter for a direct-conversion wireless receiver
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:P.J. Chang; A. Rofougaran; A.A. Abidi
Year: 1996
Demonstration of 5T SRAM and 6T dual-port RAM cell arrays
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:H. Tran
Year: 1996
A board level parallel test and short circuit failure repair circuit for high-density, low-power DRAMs
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:K. Furutani; T. Ooishi; M. Asakura; H. Hidaka; H. Ozaki
Year: 1996
A cost-oriented two-port unified cache for low-power RISC microprocessors
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:H. Mizuno; K. Ishibashi
Year: 1996
A compact on-chip ECC for low cost flash memories
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:T. Tanzawa; T. Tanaka; K. Takeuchi; R. Shirota; S. Aritome; H. Watanabe; G. Hemink; K. Shimizu; S. Sato; Y. Takeuchi; K. Ohuchi
Year: 1996
Negative heap pump for low voltage operation flash memory
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:M. Mihara; Y. Terada; M. Yamada
Year: 1996
Future of the multimedia home PC
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:W. Patterson
Year: 1996
The development of lithium ion secondary batteries
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Y. Nishi
Year: 1996
A high-resolution, compact, and low-power ADC suitable for multi-channel implementation: measurements and methods of self-calibration
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:C. Jansson
Year: 1996
A 14-bit 10-MHz calibration-free CMOS pipelined A/D converter
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:L.A. Singer; T.L. Brooks
Year: 1996
An integrated 12 bit analog front end for CCD based image processing applications
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:D. Reynolds; S. Ho
Year: 1996
A 3 V CMOS video acquisition channel
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:K. Nakamura; S. Ho; C. Mangelsdorf; K. Nishio
Year: 1996
A 2/sup nd/-order double-sampled /spl Delta//spl Sigma/ modulator with individual-level averaging
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:C. Thanh; S.H. Lewis; P.J. Hurst
Year: 1996
Low voltage high speed circuit designs for giga-bit DRAMs
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:K.-C. Lee; C.-H. Kim; D.-Y. Yoo; J.-H. Sim; S.-B. Lee; B.-S. Moon; K.-Y. Kim; N.-J. Kim; S.-M. Yoo; J.-H. Yoo; S.-I. Cho
Year: 1996
Technique for controlling effective Vth in multi-Gbit DRAM sense amplifier
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:M. Saito; J. Ogawa; K. Gotoh; S. Kawashima; H. Tamura
Year: 1996
A 0.9 V sense-amplifier driver for high-speed Gb-scale DRAMs
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:K. Gotoh; J. Ogawa; M. Saito; H. Tamura; M. Taguchi
Year: 1996
An efficient charge recycle and transfer pump circuit for low operating voltage DRAMs
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:T. Hamamoto; Y. Morooka; T. Amano; H. Ozaki
Year: 1996
Capacitance coupled bus with negative delay circuit for high speed and low power (10 GB/s<500 mW) synchronous DRAMs
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:T. Yamada; T. Suzuki; M. Agata; A. Fujiwara; T. Fujita
Year: 1996
A 4 Gsamples/s line-receiver in 0.8 /spl mu/m CMOS
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:H.O. Johansson; Jiren Yuan; C. Svensson
Year: 1996
A 960 Mbps/pin interface for skew-tolerant bus using low jitter PLL
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Sungjoon Kim; Kyeongho Lee; Yongsam Moon; Deog-Kyoon Jeong; Yunho Choi; Hyung Kyu Lim
Year: 1996
A data recovery circuit for burst signal using 440 MHz CMOS direct phase controlled VCO
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:A. Yoshida; T. Taya; N. Yamaoka; S. Matsumoto; T. Yokoyama
Year: 1996
A 156 Mbps CMOS clock recovery circuit for burst-mode transmission
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:N. Ishihara; Y. Akazawa
Year: 1996
A 0.8 V/100 MHz/sub-5 mW-operated mega-bit SRAM cell architecture with charge-recycle offset-source driving (OSD) scheme
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:H. Yamauchi; T. Iwata; H. Akamatsu; A. Matsuzawa
Year: 1996
A 2 ns access, 500 MHz 288 Kb SRAM macro
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:A.R. Pelella; Pong-Fei Lu; Y.H. Chan; W.V. Huott; U. Bakhru; S. Kowalczyk; P. Patel; J. Rawlins; P.T. Wu
Year: 1996
A 500 MHz 1 Mb on-chip cache design using multi-level bit line sensing scheme
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:R. Guo; T.Y. Su; Chia-Chi Chao
Year: 1996
A deep sub-V, single power-supply SRAM cell with multi-V/sub T/, boosted storage node and dynamic load
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:K. Itoh; A.R. Fridi; A. Bellaouar; M.I. Elmasry
Year: 1996
A 15 mW 1.6 Gb/s wormhole data router for 2-D meshes
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Yen-Wen Lu; G.K. Yeh; J.B. Burr
Year: 1996
Receiver with constant active termination
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:M. Rau; A. Rothermel; H.-J. Pfleiderer
Year: 1996
A 700 Mbps/pin CMOS signalling interface using current integrating receivers
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:S. Sidiropoulos; M. Horowitz
Year: 1996
A programmable low-voltage micropower CMOS input stage architecture
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:A. Motamed; Changku Hwang; M. Ismail
Year: 1996
A high bandwidth constant g/sub m/ and slew-rate rail-to-rail CMOS amplifier circuit for embedded low-voltage applications
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:W. Redman-White
Year: 1996
Novel design techniques for high-linearity MOSFET-only switched-capacitor circuits
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:P. Ferguson, Jr.; F. Krummenacher
Year: 1996
An automatic tuning scheme for G/sub m/-C filters with an integrator as master
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Changsik Yoo; Seung-Wook Lee; Wonchan Kim
Year: 1996
An efficient controller for variable supply-voltage low power processing
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:V. Gutnik; A. Chandrakasan
Year: 1996
New TSPC latches and flipflops minimizing delay and power
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Jiren Yuan; C. Svensson
Year: 1996
A low-power video motion estimation array processor
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:G.K. Yeh; Yen-Wen Lu; J.B. Burr
Year: 1996
An energy-efficient single-chip FFT processor
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:B.M. Baas
Year: 1996
A 120 mm/sup 2/ 64 Mb NAND flash memory achieving 180 ns/byte effective program speed
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Jin-Ki Kim; Koji Sakui; Sung-Soo Lee; J. Itoh; Suk-Chon Kwon; K. Kanazawa; Ji-Jun Lee; H. Nakamura; Kang-Young Kim; T. Himeno; Jang-Rae Kim; K. Kanda; Tae-Sung Jung; Y. Oshima; Kang-Deog Suh; K. Hashimoto; J. Miyamoto
Year: 1996
A high speed programming scheme for multi-level NAND flash memory
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Young-Joon Choi; Kang-Deog Suh; Yong-Nam Koh; Jong-Wook Park; Ki-Jong Lee; Yun-Jin Cho; Byung-Hoon Suh
Year: 1996
A 2.7 V only 8 Mb/spl times/16 NOR flash memory
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:J.C. Chen; T.H. Kuo; L.E. Cleveland; C.K. Chung; N. Leong; Y.K. Kim; T. Akaogi; Y. Kasa
Year: 1996
20-Mb/s erase/record flash memory by asymmetrical operation
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:T. Kawahara; Y. Jyouno; S. Saeki; N. Miyamoto; K. Kimura
Year: 1996
A mixed-signal RAM decision-feedback equalizer for disk drives
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:B.C. Rothenberg; J.E.C. Brown; P.J. Hurst; S.H. Lewis
Year: 1996
A 3 V video signal processing LSI using only bipolar technology
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:H. Hirose; F. Yamaguchi; K. Sato; T. Ikeda; J. Nakamura; K. Daio; Y. Takayanagi
Year: 1996
Simulation and analysis of substrate coupling in realistically-large mixed-A/D circuits
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:K.H. Kwan; I.L. Wemple; A.T. Yang
Year: 1996
All Verilog mixed-signal simulator with analog behavioral and noise models
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:M.K. Mayes; S.W. Chin
Year: 1996
A dual layer bitline DRAM array with Vcc/Vss hybrid precharge for multi-gigabit DRAMs
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:H. Nakano; D. Takashima; K. Tsuchida; S. Shiratake; T. Inaba; M. Ohta; Y. Oowaki; S. Watanabe; K. Ohuchi; J. Matsunaga
Year: 1996
Skew minimization techniques for 256M-bit synchronous DRAM and beyond
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Jin-Man Han; Jung-Bae Lee; Sei-Seung Yoon; Se-Jin Jeong; Churoo Park; Il-Jae Cho; Seung-Hoon Lee; Domg-Il Seo
Year: 1996
Flexible test mode design for DRAM characterization
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:H. Wong; T. Kirihata; J. DeBrosse; Y. Watanabe; T. Hara; M. Yoshida; M. Wordeman; S. Fujii; B. Krsnik
Year: 1996
Noise suppression scheme for giga-scale DRAM with hundreds of I/Os
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:D. Takashima; Y. Oowaki; S. Watanabe; K. Ohuchi; J. Matsunaga
Year: 1996
A long data retention SOI-DRAM with the body refresh function
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:S. Tomishima; F. Morishita; M. Tsukude; T. Yamagata; K. Arimoto
Year: 1996
Author index
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Year: 1996
Push/Pull: PC technology/end user demand
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:R. Whittier
Year: 1996
Market and technology trends in the nomadic age
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:T. Makimoto
Year: 1996
A Ti salicide process for 0.10 /spl mu/m gate length CMOS technology
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:J.A. Kittl; Qi-Zhong Hong; D.A. Prinslow; G.R. Misium
Year: 1996
Novel salicide technology using Ti hydrogenation for 0.1 /spl mu/m CMOS
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:K. Ando; Y. Matsubara; T. Horiuchi; S. Nishimoto
Year: 1996
25 /spl Aring/ gate oxide without boron penetration for 0.25 and 0.3-/spl mu/m PMOSFETs
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:C.T. Liu; Y. Ma; K.P. Cheung; C.P. Chang; L. Fritzinger; J. Becerro; H. Luftman; H.M. Vaidya; J.I. Colonell; A. Kamgar; J.F. Minor; R.G. Murray; W.Y.C. Lai; C.S. Pai; S.J. Hillenius
Year: 1996
Fully self-aligned 6F/sup 2/ cell technology for low cost 1Gb DRAM
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:T. Ozaki; T. Hamamoto
Year: 1996
A stack capacitor technology with (Ba,Sr)TiO/sub 3/ dielectrics and Pt electrodes for 1 Giga-Bit density DRAM
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Soon Oh Park; Cheol Seong Hwang; Chang-Suk Kang; Hag-Ju Cho; Byoung Teak Lee; Won Jong Yoo; Young So Park; Sang In Lee; Moon Yong Lee
Year: 1996
A new electrode technology for high-density nonvolatile ferroelectric (SrBi/sub 2/Ta/sub 2/O/sub 9/) memories
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Bo Jiang; V. Balu; Tung-Sheng Chen; Shao-Hong Kuah; J.C. Lee; P.Y. Chu; R.E. Jones; P. Zurcher; D.J. Taylor; M.L. Kottket; S.J. Gillespie
Year: 1996
A 7.03-/spl mu/m/sup 2/ Vcc/2-plate nonvolatile DRAM cell with a Pt/PZT/Pt/TiN capacitor patterned by one-mask dry etching
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:K. Shoji; M. Moniwa; H. Yamashita; T. Kisu; T. Kaga; T. Kumihashi; T. Morimoto; H. Kawakami; Y. Gotoh; T. Itoga; T. Tanaka; N. Yokoyama; T. Kure; M. Ohkura; Y. Fujisaki; K. Sakata; K. Kimura
Year: 1996
A comparative study of advanced MOSFET structures
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:C.H. Wann; R. Tu; Bin Yu; Chenming Hu; K. Noda; T. Tanaka; M. Yoshida; K. Hui
Year: 1996
High-performance double-layer epitaxial-channel PMOSFET compatible with a single gate CMOSFET
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:H. Matsuhashi; T. Ochiai; M. Kasai; T. Nakamura; S. Nishikawa
Year: 1996
A gate-side air-gap structure (GAS) to reduce the parasitic capacitance in MOSFETs
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:M. Togo; A. Tanabe; A. Furukawa; K. Tokunaga; T. Hashimoto
Year: 1996
A low temperature CVD Al plug and interconnect process for 0.25 /spl mu/m metallization technologies
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:R. Fiordalice; R. Blumenthal; M. Fernandes; S. Garcia; J. Gelatos; H. Kawasaki; J. Klein; R. Marsh; T. Ong; R. Venkatraman; E. Weitzman; F. Pintchovski
Year: 1996
Multilevel metallization based on Al CVD
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:K. Masu; H. Matsuhashi; A. Gotoh; Ju-Hyuck Chung; M. Yokoyama; R. Tajima; Y. Fujita; K. Tsubouchi
Year: 1996
A new CVD tungsten nitride diffusion barrier for Cu interconnection
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:S.C. Sun; M.H. Tsai; H.T. Chiu; S.H. Chuang
Year: 1996
Copper interconnection deposition techniques and integration
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Gang Bai; N. Cox; Sychyi Fang; D.S. Gardner; A. Mack; T. Marieb; Xiao-Chun Mu; V. Ochoa; R. Villasol; Jick Yu
Year: 1996
Optimum voltage scaling methodology for low voltage operation of CHE type flash EEPROMs with high reliability, maintaining the constant performance
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:S. Ueno; H. Oda; N. Ajika; M. Inuishi; H. Miyoshi
Year: 1996
Non-volatile FCG (ferroelectric-capacitor and transistor-gate connection) memory cell with non-destructive read-out operation
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Y. Katoh; S. Fujieda; Y. Hayashi; T. Kunio
Year: 1996
ROS: an extremely high density mask ROM technology based on vertical transistor cells
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:E. Bertagnolli; F. Hofmann; J. Willer; F. Lau; P.W. von Basse; M. Bollu; R. Thewes; U. Kollmer; M. Hain; W.H. Krautschneider; A. Rusch; B. Hasler; A. Kohlhase; H. Klose
Year: 1996
Channel engineering in sub-quarter-micron MOSFETs using nitrogen implantation for low voltage operation
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:A. Furukawa; Y. Abe; S. Shimizu; T. Kuroi; Y. Tokuda; M. Inuishi
Year: 1996
Advanced ion implantation and rapid thermal annealing technologies for highly reliable 0.25 /spl mu/m dual gate CMOS
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:S. Shimizu; T. Kuroi; Y. Kawasaki; T. Tsutsumi; H. Oda; M. Inuishi; H. Miyoshi
Year: 1996
A 0.25 /spl mu/m gate length CMOS technology for 1V low power applications-device design and power/performance considerations
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:M. Nandakumar; A. Chatterjee; G. Stacey; I.-C. Chen
Year: 1996
Single step PVD planarized aluminum interconnect with low-/spl epsiv/ organic ILD for high performance and low cost ULSI
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:B. Zhao; A. Biberger; V. Hoffman; S.-Q. Wang; P.k. Vasudev; T.E. Seidel
Year: 1996
Wide feature dielectric planarization using MnO/sub 2/ slurry
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:S. Kishii; K. Nakamura; Y. Okui; R. Suzuki; Y. Arimoto
Year: 1996
High-reliability interconnects using Cu-Zr alloy for future LSIs
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Y. Igarashi; T. Ito
Year: 1996
Optimal low power interconnect networks
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:J.A. Davis; V. De; J. Meindl
Year: 1996
NURA: a feasible, gas-dielectric interconnect process
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:M.B. Anand; M. Yamada; H. Shibata
Year: 1996
Manufacturable and reliable fluorine-doped low-k interlayer dielectric process for high performance logic LSI
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:H. Igarashi; H. Oyamatsu; M. Kodera; N. Kaji; T. Matsuno; I. Shibata; M. Kinugawa; M. Kakumu
Year: 1996
An integrated low resistance aluminum plug and low-k polymer dielectric for high performance 0.25 /spl mu/m interconnects
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:G.A. Dixit; K.J. Taylor; A. Singh; C.K. Lee; G.B. Shinn; A. Konecni; W.Y. Hsu; K. Brennan; Mi-Chang Chang; R.H. Havemann
Year: 1996
A new two-step metal-CMP technique for a high performance multilevel interconnects featured by Al- and "Cu in low /spl epsiv/, organic film"-metallizations
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Y. Hayashi; T. Onodera; T. Nakajima; K. Kikuta; Y. Tsuchiya; J. Kawahara; S. Takahashi; K. Ueno; S. Chikaki
Year: 1996
Suppression of the SOI floating-body effects by linked-body device structure
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:W. Chen; Y. Taur; D. Sadana; K.A. Jenkins; J. Sun; S. Cohen
Year: 1996
Ultra-thin, highly uniform thin film SOI MOSFET with low series resistance using pattern-constrained epitaxy (PACE)
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:H.-S. Wong; K. Chan; Y. Lee; P. Roper; Y. Taur
Year: 1996
Suppression of threshold voltage variation in MTCMOS/SIMOX circuit operating below 0.5 V
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:M. Harada; T. Douseki; T. Tsuchiya
Year: 1996
Direct measurement for SOI and bulk diodes of single-event-upset charge collection from energetic ions and alpha particles
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:T. Aton; J. Seitchik; K. Joyner; T. Houston; H. Shichijo
Year: 1996
Asymmetrically-dope buried layer (ADB) structure CMOS for low-voltage mixed analog-digital applications
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:M. Miyamoto; K. Toyota; K. Sekic; T. Nagano
Year: 1996
Silicon RF devices fabricated by ULSI processes featuring 0.1-/spl mu/m SOI-CMOS and suspended inductors
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:D. Hisamoto; S. Tanaka; T. Tanimoto; Y. Nakamura; S. Kimura
Year: 1996
100-GHz f/sub T/ Si homojunction bipolar technology
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:E. Ohue; Y. Kiyota; T. Onai; M. Tanabe; K. Washio
Year: 1996
A 50 GHz implanted base silicon bipolar technology with 35 GHz static frequency divider
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:A. Felder; T.F. Meister; M. Franosch; K. Aufinger; M. Wurzer; R. Schreiter; S. Boguth; L. Treitinger
Year: 1996
Application of HSQ (hydrogen silsesquioxane) based SOG to pre-metal dielectric planarization in STC (stacked capacitor) DRAM
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:H.J. Lee; J.H. Choi; B.K. Hwang; J.S. Goo; K. Fujihara; U.I. Chung; K.H. Kim; S.I. Lee; M.Y. Lee
Year: 1996
Highly reliable SiOF film formation by ECR-CVD using SiF/sub 2/H/sub 2/
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:T. Fukuda; T. Hosokawa; Y. Nakamura; K. Katoh; N. Kobayashi
Year: 1996
A novel damascene process for one mask via/interconnect formation
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Tue Nguyen; B.D. Ulrich; L.R. Allen; D.R. Evans
Year: 1996
History dependence of non-fully depleted (NFD) digital SOI circuits
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:G.G. Shahidi; M. Hargrove; H. Hovel; S. Kulkarni; W. Rausch; D. Sadana; D. Schepis; R. Schulz; D. Yee; J. Sun; R. Dennard; B. Davari
Year: 1996
Variable threshold-voltage SOI CMOSFETs with implanted back-gate electrodes for power-managed low-power and high-speed sub-1-V ULSIs
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:T. Kachi; T. Kaga; S. Wakahara; D. Hisamoto
Year: 1996
Data retention times in SOI-DRAMs
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Dong-Uk Choi; Sang-Hoon Lee; Seung-Kuk Lee; Jae-Kwan Park; Jong-Woo Park
Year: 1996
Design and performance of SOI pass transistors for 1 Gbit DRAMs
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Yin Hu; C.W. Teng; T.W. Houston; K. Joyner; T.J. Aton
Year: 1996
0.2 /spl mu/m analog CMOS with very low noise figure at 2 GHz operation
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:E. Morifuji; M. Saito; M. Ono; H.S. Momose; N. Ito; H. Iwai
Year: 1996
High performance CMOS for GHz communication IC
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:A. Tanabe; M. Togo; M. Soda; H. Tezuka; T. Suzaki; A. Furakawa; K. Emura
Year: 1996
High-frequency characteristics and its dependence on parasitic components in 0.1 /spl mu/m Si-MOSFETs
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:T. Yamamoto; A. Tanabe; M. Togo; A. Furukawa; T. Mogami
Year: 1996
Effects of quantization on the electrical characteristics of deep submicron p- and n-MOSFETs
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:S. Jallepalli; J. Bude; W.K. Shih; M.R. Pinto; C.M. Maziar; A.F. Tasch, Jr
Year: 1996
A novel local interconnect technology (MSD) for high-performance logic LSIs with embedded SRAM
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:T. Uehara; T. Nakabayashi; M. Segawa; K. Yamashita; M. Arai; T. Ukeda; T. Yabu; S. Kobayashi; M. Yamanaka; M. Saiki; H. Okuyama; A. Kanda; M. Ogura
Year: 1996
A symmetric diagonal driver transistor SRAM cell with imbalance suppression technology for stable low voltage operation
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:S. Horiba; T. Takahashi; H. Ohkubo; K. Noda; F. Hayashi; T. Uchida; T. Yokoyama; K. Ando; T. Yoshida; T. Hashimoto; T. Shimizu
Year: 1996
A 5-/spl mu/m/sup 2/ full-CMOS cell for high-speed SRAMs utilizing a optical-proximity-effect correction (OPC) technology
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:M. Ueshima; M. Mano; Y. Yoneda; T. Ichikawa; K. Tsudaka; H. Takahashi; M. Yabuta; M. Motoyoshi
Year: 1996
Impact of cosmic ray neutron induced soft errors on advanced submicron CMOS circuits
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Y. Tosaka; S. Satoh; T. Sugii; H. Ehara; S.A. Wender
Year: 1996
Electrical performances of retrograde versus conventional profile MOSFETs
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:T. Skotnicki; P. Bouillon
Year: 1996
Linear versus saturated drive current: tradeoffs in super steep retrograde well engineering
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:S.E. Thompson; P.A. Packan; M.T. Bohr
Year: 1996
An optimized densification of the filled oxide for quarter micron shallow trench isolation (STI)
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Han Sin Lee; Moon Han Park; Yu Gyun Shin; Tai-su Park; Ho Kyu Kang; Sang In Lee; Moon Yong Lee
Year: 1996
Reverse short-channel effects and channel-engineering in deep-submicron MOSFETs: modeling and optimization
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Bin Yu; E. Nowak; K. Noda; Chenming Hu
Year: 1996
Two-stage drain leakage degradation in sub-micron MOSFET technology
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:A. Frommer; M.R. Pinto; J.D. Bude
Year: 1996
Accurate determination of channel length, series resistance and junction doping profile for MOSFET optimisation in deep submicron technologies
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:S. Biesemans; M. Hendriks; S. Kubicek; K. De Meyer
Year: 1996
Increase of parasitic resistance of shallow p+ extension with SiN sidewall process by hydrogen passivation of boron and its improvement by preamorphization for sub-0.25 /spl mu/m pMOSFETs
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:S. Inaba; A. Murakoshi; M. Tanaka; M.T. Takagi; H. Koyama; H. Koike; H. Yoshimura; F. Matsuoka
Year: 1996
A high-performance 0.08 /spl mu/m CMOS
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:L. Su; S. Subbanna; E. Crabbe; P. Agnello; E. Nowak; R. Schulz; S. Rauch; H. Ng; T. Newman; A. Ray; M. Hargrove; A. Acovic; J. Snare; S. Crowder; B. Chen; J. Sun; B. Davari
Year: 1996
Plasma doping of boron for fabricating the surface channel sub-quarter micron PMOSFET
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:B. Mizuno; M. Takase; I. Nakayama; M. Ogura
Year: 1996
0.15 /spl mu/m delta-doped CMOS with on-field source/drain contacts
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:K. Imai; C. Hu; T. Andoh; Y. Kinoshita; Y. Matsubara; T. Tatsumi; T. Yamazaki
Year: 1996
Ultra-shallow in-situ-doped raised source/drain structure for sub-tenth micron CMOS
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Y. Nakahara; K. Takeuchi; T. Tatsumi; Y. Ochiai; S. Manako; S. Samukawa; A. Furukawa
Year: 1996
Buried source and drain (BSD) structure for ultra-shallow junction using selective deposition of highly doped amorphous silicon
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Y. Mitani; I. Mizushima; S. Kambayashi; H. Koyama; M.T. Takagi; M. Kashiwagi
Year: 1996
193 nm phase-shifting lithography with single layer resist for VLSIs beyond 1 G-bit DRAM
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:S. Asai; S. Takechi; Y. Kitamura; Y. Tabata; K. Nozaki; E. Yano; I. Hanyu
Year: 1996
Fabrication of small contact with novel mask design
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:H.Y. Kang; J.H. Lee; D.H. Cha; S.Y. Moon; Y.B. Koh
Year: 1996
Feasibility demonstration of 0.18 /spl mu/m and 0.13 /spl mu/m optical projection lithography based on CD control calculations
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Kee-Ho Kim; K. Ronse; A. Yen; L. Van den Hove
Year: 1996


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