Disk Graph-Based Model: A Graph Theoretical Approach for Linking Agent-Based Models and Dynamical Systems
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Nguyen Ngoc Doanh; Phan Thi Ha Duong; Nguyen Thi Ngoc Anh; Drogoul, A.; Zucker, J.-D.
Year: 2010
An Efficient Cache Invalidation Strategy in Mobile Information Systems
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Thu Nguyen Tran Minh; Thuy Dong Thi Bich
Year: 2010
Fast Event Detection in Mission-Critical Surveillance with Wireless Video Sensor Networks
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Congduc Pham
Year: 2010
Burst Loss Probability Model for Hybrid Deflection and Retransmission Routing in OBS Networks
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Son Hong Ngo; Xiaohong Jiang
Year: 2010
Fuzzy Signature Based Fuzzy Communication of Mobile Robots
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Ballagi, A.; Koczy, L.T.; Pozna, C.
Year: 2010
TrustSets - Using Trust to Detect Deceitful Agents in a Distributed Information Collecting System
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Quang Anh Nguyen Vu; Gaudou, B.; Canal, R.; Hassas, S.; Armetta, F.
Year: 2010
Qualitative DC Mode Conditions for Fast Intra Prediction Mode Decision in H.264/AVC
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Do Quan; Yo-Sung Ho
Year: 2010
Combining DEMO Models with RAD's Techniques in the Analysis Phase of Software Development Process
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Nguyen Hoang Thuan; Dietz, J.L.G.; Tran Van Lang
Year: 2010
Testability Analysis Integrated into Scicos Development Environment
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Nguyen Thanh Binh; Dang Thien Binh; Delaunay, M.; Robach, C.
Year: 2010
Clusters-Based Relevance Feedback for CBIR: A Combination of Query Movement and Query Expansion
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Nhu-Van Nguyen; Boucher, A.; Ogier, J.; Tabbone, S.
Year: 2010
A Novel Group Communication for Disaster Positioning in Mobile Ad Hoc Network
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Chun-Shian Tsai; Chen-Yin He
Year: 2010
Quasipseudometric Spaces and Topological Properties
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Basileu, C.; Lamure, M.; Ben Amor, S.; Bui, M.
Year: 2010
An Agent-Based Approach to the Simulation of Brown Plant Hopper (BPH) Invasions in the Mekong Delta
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Phan, C.H.; Huynh, H.X.; Drogoul, A.
Year: 2010
EWAT+: Finding Time Series Discords Based on New Discord Measure Functions
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Mai Thai Son; Duong Tuan Anh
Year: 2010
An Efficient Vietnamese Text Summarization Approach Based on Graph Model
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Tu Anh Nguyen Hoang; Hoang Khai Nguyen; Quang Vinh Tran
Year: 2010
Zygomatic Smile Detection: The Semi-Supervised Haar Training of a Fast and Frugal System: A Gift to OpenCV Community
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Hromada, D.D.; Tijus, C.; Poitrenaud, S.; Nadel, J.
Year: 2010
Incremental and Situated Modeling for Multi-Agent Based Simulations
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Sempé, F.; Gil-Quijano, J.
Year: 2010
Energy Efficiency of Hybrid-ARQ Based Geographic Routing
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Chakrapani, A.; Malaney, R.; Jinhong Yuan
Year: 2010
Greedy Geographic Routing with Path Optimization in Wireless Sensor Networks
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Thanh Le Dinh; Dai Tho Nguyen
Year: 2010
Active Learning for Co-Clustering Based Collaborative Filtering
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Quang Thang Le; Minh Phuong Tu
Year: 2010
Structure of Association Rule Set Based on Min-Min Basic Rules
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Truong, T.C.; Tran, A.N.; Thong Tran
Year: 2010
Preface
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Year: 2010
On the Capacity of Location Tracking Systems for Wireless VoIP
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Dao, N.T.; Malaney, R.A.
Year: 2010
Detection of Hazardous Information Based on HTML Elements
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Ikeda, K.; Yanagihara, T.; Matsumoto, K.; Takishima, Y.
Year: 2010
A Layered Stacked Graphical Model for Learning Complex Visual Object Class
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Thuy Thi Nguyen
Year: 2010
A Meta-Logical Approach for Reasoning with an OWL 2 Ontology
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Hirankitti, V.; Trang Mai Xuan
Year: 2010
Efficient Syntactic Parsing with Beam Search
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Huong Thanh Le; Lam Ba Do; Nhung Thi Pham
Year: 2010
A Service Level Guarantee for SCTP-Based Applications
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Chalouf, M.A.; Krief, F.; Boussen, S.
Year: 2010
Significant Aspects Evaluating Replication Strategies for Video Stream in Multihop Wireless Networks
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Nguyen-Son Vo; Minh Nguyen
Year: 2010
A Solution to Apply Artificial Neural Network for Extracting Hidden Information from Vietnamese Document Image
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Hoang Giang Vo; Hoang Chau Ly; Van Doan Nguyen; Nhat Minh Ngo Nguyen
Year: 2010
Discrete Tomography Based on DC Programming and DCA
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Le Thi Hoai An; Nguyen Trong Phuc; Pham Dinh Tao
Year: 2010
An Efficient Human-Computer Interaction Framework Using Skin Color Tracking and Gesture Recognition
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Nam Vo; Quang Tran; Thang Ba Dinh; Tien Ba Dinh; Nguyen, Q.M.
Year: 2010
Adaptive Neural Network Metamodel for Short-Term Prediction of Background Ozone Level
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Wahid, H.; Ha, Q.P.; Hiep Nguyen-Duc
Year: 2010
The Lattice Structure of Rotor-Router Model
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Le Manh Ha
Year: 2010
Combining Named Entities with WordNet and Using Query-Oriented Spreading Activation for Semantic Text Search
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Ngo, V.M.; Cao, T.H.; Le, T.M.V.
Year: 2010
Information Retrieval and Social Tagging for Digital Libraries Using Formal Concept Analysis
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Eklund, P.; Goodall, P.; Wray, T.
Year: 2010
O.D.D.: A Promising but Incomplete Formalism for Individual-Based Model Specification
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Amouroux, E.; Gaudou, B.; Desvaux, S.; Drogoul, A.
Year: 2010
Securing a Critical Infrastructure
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Baud, L.; Bellot, P.
Year: 2010
Index
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Year: 2010
Optimally Sequence Sparse Matching Pursuit
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Long Nguyen; My Ho
Year: 2010
Moving Objects Segmentation in Video Sequence Based on Bayesian Network
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Thach-Thao Duong; Anh-Duc Duong
Year: 2010
Combining Color and Texture for a Robust Interactive Segmentation Algorithm
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Trung Tran; Phong Vo; Bac Le
Year: 2010
Automatic Speech Recognition for Vietnamese Using HTK System
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Nguyen Hong Quang; Trinh Van Loan; Le The Dat
Year: 2010
Comparison between DFT-, FCT-, Wavelet-, and Lattice Filter-Based Noise Reduction for ASR
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Rank, E.; Al-Khayat, A.; Tuan Van Pham; Saffer, Z.; Stark, M.
Year: 2010
Query Events in Soccer Video Using On-Screen Texts
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Viet Trong Nguyen; Ngoc Quoc Ly
Year: 2010
GPU Implementation of Extended Gaussian Mixture Model for Background Subtraction
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Vu Pham; Phong Vo; Vu Thanh Hung; Le Hoai Bac
Year: 2010
A Meta-Model for Specifying Collaborative Simulation
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Trong Khanh Nguyen; Marilleau, N.; Tuong Vinh Ho; Seghrouchni, A.E.F.
Year: 2010
A Theoretical Approach Based on the Correlation of Unified Data for Different Analyzing Techniques Used in the Modern Investigation of Artworks
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Laurentiu-Marian, A.; Alexandros, R.
Year: 2010
Key Issues Concerning the Simultaneous Development of Technical and Linguistic Competences in a Single E-module
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Venuti, M.Z.; Welzer, T.; Ward, A.E.
Year: 2010
Can We Truly Learn from A Cloud Or Is It Just A Lot of Thunder?
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Al-Jumeily, D.; Williams, D.; Hussain, A.J.; Griffiths, P.
Year: 2010
Implementation of an E-Learning Module in Virtual Centre for Entrepreneurship: The Development of Cultural Awareness in Students
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Welzer, T.; Družovec, M.; Zoriç Venuti, M.; Ward, A.E.; Yahoui, H.
Year: 2010
Leveraging e-Learning for Enhancing Employability of Students
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Chatarajupalli, S.; Venkatswamy, G.; Aryasri, A.R.
Year: 2010
International Curricula Networks for Recognition of Life Long Learning Programs: A Case Study of a Bit Sized e-Learning Module in Internet Security
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Burguillo, J.C.; Peleteiro, A.; Thiriet, J.M.; Yahoui, H.
Year: 2010
A Model-Driven Framework to Support Development of Serious Games for Game-based Learning
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Tang, S.; Hanneghan, M.
Year: 2010
An Analytical Model for Teaching Architectural Building Design
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Azmy, A.M.
Year: 2010
Creating Complex Interactive 3D Visualisations of Naval Battles from Natural Language Narratives
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Presland, S.; Farrimond, B.; Hazlewood, P.; Oddie, A.
Year: 2010
A Self-Configurable Architecture for Wireless Sensor Networks
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Asim, M.; Yu, M.; Mokhtar, H.; Merabti, M.
Year: 2010
Associate Model of Methods Used for Restoration / Conservation Resources
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Ene, D.; Radvan, R.
Year: 2010
Service Oriented Tasking System for WSN
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Le Corre, B.; Leguay, J.; Lopez-Ramos, M.; Gay, V.; Conan, V.
Year: 2010
A Web Services-oriented Architecture for Integrating Small Programmable Objects in the Web of Things
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Akribopoulos, O.; Chatzigiannakis, I.; Koninis, C.; Theodoridis, E.
Year: 2010
Paradigms, Frameworks and Prototypes Towards the Realization of the Internet of Things
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Tselikis, C.; Alexopoulou, A.; Vangelatos, C.; Leventis, A.; Ladis, E.G.
Year: 2010
Reconfiguration in Wireless Sensor NeTworks
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:H C Leligou; L Redondo; D R Retamosa; I Papaefstathiou; S Voliotis
Year: 2010
A Multi-Agent Approach for Self-Diagnosis of a Hydrocephalus Shunting System
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Alkharabsheh, A.R.; Momani, L.; Al-Zubi, N.; Al-Nuaimy, W.
Year: 2010
Implementing a Trust-Aware Routing Protocol in Wireless Sensor Nodes
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Zahariadis, T.; Trakadas, P.; Leligou, H.; Karkazis, P.; Voliotis, S.
Year: 2010
Information Technology Governance, Risk and Compliance in Health Care - A Management Approach
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Krey, M.
Year: 2010
An Automated Method for Segmentation of Coronary Arteries in Coronary CT Imaging
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Yin Wang; Liatsis, P.
Year: 2010
Significance of Healthy Organizational Culture for Superior Risk Management During Software Development
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Verma, C.; Ali Amin, S.
Year: 2010
Information Enrichment for Decision Support in Virtual Collaboration
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Anya, O.; Tawfik, H.; Nagar, A.
Year: 2010
Supporting Cloud Computing Management through an Object Mapping Declarative Language
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Hughes, G.; Al-Jumeily, D.; Hussain, A.
Year: 2010
Jinv: A Parallel Method for Distributed Matrix Inversion
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Sahota, V.; Bayford, R.
Year: 2010
Development and Deployment of Cross-Platform 3D Web-based Games
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Carter, C.; Rhalibi, A.E.; Merabti, M.
Year: 2010
Situation Calculus for HCI Design
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:England, D.; Randles, M.; Taleb-Bendiab, A.
Year: 2010
Framework for Distributed Network Simulation and State Propagation
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Dennett, C.; El Rhalibi, A.; Merabti, M.
Year: 2010
Telemedicine and Smart Phones as Medical Peripheral Devices (Computational Approaches)
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Ivanov, I.E.; Gueorguiev, V.; Bodurski, V.; Trifonov, V.
Year: 2010
Facilitating Semantic Adaptation of Web Services at Runtime Using a Meta-Data Layer
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Baker, T.; Lamb, D.; Taleb-Bendiab, A.; Al-Jumeily, D.
Year: 2010
Bank Loan Processes Modelling Using BPMN
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Mpardis, G.; Kotsilieris, T.
Year: 2010
Conference Committees
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Year: 2010
Reviewers
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Year: 2010
Preface
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Year: 2010
Title Page i
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Year: 2010
Title Page iii
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Year: 2010
Robustness in Autonomic E-Service Systems
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Randles, M.; Taleb-Bendiab, A.; Lamb, D.
Year: 2010
e-System for Public Administration Reporting Services
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Marin, A.; Constantinescu, I.; Dobre, C.; Boldeanu, D.; Cristea, V.
Year: 2010
Roster Page
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Year: 2010
Application of Fuzzy Analytic Hierarchy Process to Evaluate the Quality of E-Government Web Sites
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Markaki, O.I.; Charilas, D.E.; Askounis, D.
Year: 2010
A Proactive Personalized Mobile News Recommendation System
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Kam Fung Yeung; Yanyan Yang
Year: 2010
The Prediction of Non-Stationary Physical Time Series Using the Application of Regularization Technique in Self-organised Multilayer Perceptrons Inspired by the Immune Algorithm
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Mahdi, A.A.; Hussain, A.J.; Al-Jumeily, D.
Year: 2010
Web Structural Metrics Evaluation
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Alsmadi, I.; Al-Taani, A.T.; Zaid, N.A.
Year: 2010
A Computer-based LCA Tool for Sustainable Building Design
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Azmy, A.M.
Year: 2010
Face Recognition Based on Mixed between Selected Feature by Multiwavelet and Particle Swarm Optimization
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Azzawi, A.A.G.; Al-Saedi, M.A.H.
Year: 2010
Revisiting Secure Documents with XML Security: A Component-based Approach
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Haron, G.R.; Maniam, D.; Ngiap, S.T.S.
Year: 2010
Footprinting: A Methodology for Auditing eSystem Vulnerabilities
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Wren, C.; Reilly, D.; Berry, T.
Year: 2010
Author index
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Year: 2010
Vessel Extraction in Fluorescein Angiograms of the Human Retina Using a Supervised Classifier
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Vargas, R.; Liatsis, P.
Year: 2010
Where's the Evidence for Evidence-based Knowledge in Ehealth Systems?
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Bahati, R.; Guy, S.; Bauer, M.; Gwadry-Sridhar, F.
Year: 2010
Healthcare Data Access Control Using XACML for Handheld Devices
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Arunkumar, S.; Rajarajan, M.
Year: 2010
Evaluating Remote Mobile Technology in a Clinical Environment
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Arshad, F.; Fergus, P.; Appleton, S.
Year: 2010
Security-Measurability-Enhancing Mechanisms for a Distributed Adaptive Security Monitoring System
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Reijo M Savola; Petri Heinonen
Year: 2010
Towards Sybil Resistant Authentication in Mobile Ad Hoc Networks
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Saorsh Hashmi; John Brooke
Year: 2010
Protecting Kernel Data through Virtualization Technology
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Donghai Tian; Deguang Kong; Hu Changzhen; Peng Liu
Year: 2010
Verifying Hotspot Quality User Rating with Certified QoS Evidence
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:X Titi; J.-M Seigneur
Year: 2010
Improving the Efficiency of a Highly-Used Access Control Scheme
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Jin Tamura
Year: 2010
Vulnerabilities and Improvements of Du-Xiao-Chen-Wu's Secure Cell Relay Routing Protocol for Sensor Networks
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Keunwoo Rhee; Byunghee Lee; Dongho Won; Hac Yun Na; Seungjoo Kim
Year: 2010
Forthcoming Aggregating Intrusion Detection System Alerts Framework
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:H El-Taj; O Abouabdalla; A Manasrah; Ahmed Al-Madi; M I Sarwar; S Ramadass
Year: 2010
Reviewers
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Year: 2010
BlogCrypt: Private Content Publishing on the Web
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Tamás Paulik; Ádám Máté Földes; Gábor György Gulyás
Year: 2010
An Information Flow Approach for Preventing Race Conditions: Dynamic Protection of the Linux OS
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:J Rouzaud-Cornabas; P Clemente; C Toinard
Year: 2010
Performance Evaluation of SNR Estimation Methods in Forensic Speaker Recognition
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:F Beritelli; S Casale; R Grasso; A Spadaccini
Year: 2010
A Statistical Approach to Biometric Identity Verification Based on Heart Sounds
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Francesco Beritelli; Andrea Spadaccini
Year: 2010
Security Analysis of Firewall Rule Sets in Computer Networks
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Bilal Khan; M K Khan; M Mahmud; K S Alghathbar
Year: 2010
SOA-Based Security Governance Middleware
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Pierre de Leusse; T Dimitrakos
Year: 2010
A Security Adaptation Reference Monitor (SARM) for Highly Dynamic Wireless Environments
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:T E Maliki; J Seigneur
Year: 2010
Prospect of Fine Grain Dynamic Memory Access Control with Profiling
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Dongkyun Ahn; Gyungho Lee
Year: 2010
Identity Management without Revocation
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Anders Fongen
Year: 2010
Heuristic Search in Encrypted Graphs
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:P Failla
Year: 2010
Analysis of Strongly and Weakly Coupled Management Systems in Information Security
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:W Boehmer
Year: 2010
Shifting the Paradigm: Training Undergraduate Students in Software Security
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:C Y Lester
Year: 2010
Patch Scheduling for Risk Exposure Mitigation under Service Disruption Constraints
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:P Bommannavar; N Bambos
Year: 2010
Discovery of Invariant Bot Behavior through Visual Network Monitoring System
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Alireza Shahrestani; Maryam Feily; Rodina Ahmad; Sureswaran Ramadass
Year: 2010
Cascaded Simple Filters for Accurate and Lightweight Email-Spam Detection
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:M Takesue
Year: 2010
Exploiting the x86 Architecture to Derive Virtual Machine State Information
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Jonas Pfoh; Christian Schneider; Claudia Eckert
Year: 2010
Eliciting Information on the Vulnerability Black Market from Interviews
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:J Radianti
Year: 2010
Socio-technical Security Assessment of a VoIP System
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Pekka Pietikäinen; Kati Karjalainen; Juha Röning; Juhani Eronen
Year: 2010
An Analysis of the Asprox Botnet
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:R Borgaonkar
Year: 2010
RBAC+: Dynamic Access Control for RBAC-Administered Web-Based Databases
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Ahlem Bouchahda; Nhan Le Thanh; Adel Bouhoula; Faten Labbene
Year: 2010
Preface
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Year: 2010
Organizing Committee
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Year: 2010
Applications of SAT Solvers to AES Key Recovery from Decayed Key Schedule Images
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Abdel Alim Kamal; Amr M Youssef
Year: 2010
Analyzing the DPA Leakage of the Masked S-box via Digital Simulation and Reducing the Leakage by Inserting Delay Cells
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:S Soydan
Year: 2010
An Efficient Acceleration of Symmetric Key Cryptography Using General Purpose Graphics Processing Unit
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Fan Wu; Chung-han Chen; H Narang
Year: 2010
Protecting Next Generation High Speed Network Protocol - UDT through Generic Security Service Application Program Interface - GSS-API
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:D V Bernardo; Doan Hoang
Year: 2010
Protection of a Shared HPC Cluster
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Mathieu Blanc; Jérémy Briffaut; Thibault Coullet; Maxime Fonda; Christian Toinard
Year: 2010
Towards a Structural Secure Design Process
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:S Hasan Mirjalili; Arjen K Lenstra
Year: 2010
Author index
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Year: 2010
An Efficient Vein Pattern-Based Recognition System
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:M Soni; S Gupta; M S Rao; P Gupta
Year: 2010
Biometric Transaction Authentication Protocol
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Daniel Hartung; Christoph Busch
Year: 2010
A Study of a Social Behavior inside the Online Black Markets
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Jaziar Radianti
Year: 2010
Defaming Botnet Toolkits: A Bottom-Up Approach to Mitigating the Threat
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:T Ormerod; Lingyu Wang; M Debbabi; A Youssef; H Binsalleeh; A Boukhtouta; P Sinha
Year: 2010
A Shuffling Scheme with Strict and Strong Security
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Kun Peng; Feng Bao
Year: 2010
Detection Methods Improving Reliability of Automatic Human Tracking System
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Hiroto Kakiuchi; Takao Kawamura; Toshihiko Sasama; Kazunori Sugahara
Year: 2010
Universal Bluetooth Access Control and Security System for e-Keys Enviroments
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Francisco José Bellido Outeirino; P C Aranda; José Luis de la Cruz Fernández; Benito Pérez Jarauta
Year: 2010
An Access Control Architecture for Context-Risk-Aware Access Control: Architectural Design and Performance Evaluation
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Ali Ahmed; Ning Zhang
Year: 2010
A Security Control Architecture for SOAP-Based Services
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Boulares Ouchenne; Ousmane Koné
Year: 2010
Industrial Sensor Network Security Architecture
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:R Falk; H.-J Hof
Year: 2010
Blind Detectors in Spread Spectrum Watermarking for Interference Reduction
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Cagatay Karabat; Mehmet Keskinoz
Year: 2010
Strategies for Managed Software Integrity Protection
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:M Schafer; W Moeller
Year: 2010
Programmable MBIST Merging FSM and Microcode Techniques Using Macro Commands
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Mohd Noor, N.Q.; Saparon, A.; Yusof, Y.
Year: 2010
Efficient Two-Dimensional Error Codes for Multiple Bit Upsets Mitigation in Memory
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Ming Zhu; Liyi Xiao; Shuhao Li; Yanjing Zhang
Year: 2010
A Strategy for Interconnect Testing in Stacked Mesh Network-on-Chip
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Min-Ju Chan; Chun-Lung Hsu
Year: 2010
High-Performance Cluster-Fault Tolerance Scheme for Hybrid Nanoelectronic Memories
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Haron, N.Z.; Hamdioui, S.
Year: 2010
Adaptive De-noising Filter Algorithm for CMOS Image Sensor Testing Applications
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Chun-Lung Hsu; Chen-Wei Lan; Yu-Chih Lo; Yu-Sheng Huang
Year: 2010
Duplication Based One-to-Many Coding for Trojan HW Detection
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Keren, O.; Levin, I.; Karpovsky, M.
Year: 2010
A Probabilistic Method to Detect Anomalies in Embedded Systems
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Zandrahimi, M.; Zarei, A.; Zarandi, H.R.
Year: 2010
Design and Evaluation of Burst-Mode Asynchronous 8-Bit Microprocessor Using Standard FPGA Development System
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Suto, T.; Ichijo, K.; Yoshioka, Y.
Year: 2010
SEU-Hardened Dual Data Rate Flip-Flop Using C-Elements
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Devarapalli, S.V.; Zarkesh-Ha, P.; Suddarth, S.C.
Year: 2010
A Reliable Reconfiguration Controller for Fault-Tolerant Embedded Systems on Multi-FPGA Platforms
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Bolchini, C.; Fossati, L.; Codinachs, D.M.; Miele, A.; Sandionigi, C.
Year: 2010
Case Studies on Transition Fault Test Generation for At-speed Scan Testing
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Zakaria, N.A.; Bautista, E.V.; Jusoh, S.B.; Weng Fook Lee; Xiaoqing Wen
Year: 2010
An Approximate Soft Error Reliability Sorting Approach Based on State Analysis of Sequential Circuits
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Dan Zhu; Tun Li; Si-kun Li
Year: 2010
A New Soft-Error Resilient Voltage-Mode Quaternary Latch
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Rhod, E.; Sterpone, L.; Carro, L.
Year: 2010
Test Challenge for Deep Sub-micron Era - Test & Diagnosis Platform: STARCAD-Clouseau
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Aikyo, T.
Year: 2010
A Switch Box Architecture to Mitigate Bridging and Short Faults in SRAM-Based FPGAs
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Ebrahimi, H.; Zamani, M.S.; Razavi, S.A.
Year: 2010
Time/Temperature Degradation of Solar Cells under the Single Diode Model
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Junsangsri, P.; Lombardi, F.
Year: 2010
Tradeoffs in Imager Design with Respect to Pixel Defect Rates
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Chapman, G.H.; Leung, J.; Koren, I.; Koren, Z.
Year: 2010
Low-Power Testing for Low-Power Devices
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Xiaoqing Wen
Year: 2010
Modeling Open Defects in Nanometric Scale CMOS
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Hariharan, A.N.; Pontarelli, S.; Ottavi, M.; Lombardi, F.
Year: 2010
Incorporating Heterogeneous Redundancy in a Nanoprocessor for Improved Yield and Performance
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Vijayakumar, P.; Narayanan, P.; Koren, I.; Krishna, C.M.; Moritz, C.A.
Year: 2010
On-die Ring Oscillator Based Measurement Scheme for Process Parameter Variations and Clock Jitter
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Omaña, M.; Giaffreda, D.; Metra, C.; Mak, T.; Tam, S.; Rahman, A.
Year: 2010
Modelling a CNTFET with Undeposited CNT Defects
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Geunho Cho; Lombardi, F.; Yong-Bin Kim
Year: 2010
Single Event Induced Double Node Upset Tolerant Latch
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Namba, K.; Sakata, M.; Ito, H.
Year: 2010
A Multi-dimensional Iddq Testing Method Using Mahalanobis Distance
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Nakamura, Y.; Tanaka, M.
Year: 2010
Industrial Approach for Dependability
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Kanekawa, N.
Year: 2010
Massively Deployable Intelligent Sensors for the Smart Power Grid
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Jain, V.K.; Chapman, G.H.
Year: 2010
Test Selection Policies for Faster Incremental Fault Detection
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Amati, L.; Bolchini, C.; Salice, F.
Year: 2010
AF-Test: Adaptive-Frequency Scan Test Methodology for Small-Delay Defects
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Tsung-Yeh Li; Shi-Yu Huang; Hsuan-Jung Hsu; Chao-Wen Tzeng; Chih-Tsun Huang; Jing-Jia Liou; Hsi-Pin Ma; Po-Chiun Huang; Jenn-Chyou Bor; Cheng-Wen Wu; Ching-Cheng Tien; Wang, M.
Year: 2010
Hybrid Built-In Self-Test Architecture for Multi-port Static RAMs
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Lizhen Yu; Hung, J.; Boryau Sheu; Huynh, B.; Loc Nguyen; Shianling Wu; Laung-Terng Wang; Xiaoqing Wen
Year: 2010
Logic BIST Architecture Using Staggered Launch-on-Shift for Testing Designs Containing Asynchronous Clock Domains
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Shianling Wu; Laung-Terng Wang; Lizhen Yu; Furukawa, H.; Xiaoqing Wen; Jone, W.-B.; Touba, N.A.; Feifei Zhao; Jinsong Liu; Hao-Jan Chao; Fangfang Li; Zhigang Jiang
Year: 2010
Gradual Diagnostic Test Generation Based on the Structural Distance between Indistinguished Fault Pairs
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Pomeranz, I.; Reddy, S.M.
Year: 2010
Prolongation of Lifetime and the Evaluation Method of Dependable SSD
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Tai, K.; Kitakami, M.
Year: 2010
A Study of eSRAM Testability
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Takagi, N.
Year: 2010
Transient Fault and Soft Error On-die Monitoring Scheme
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Rossi, D.; Omaña, M.; Metra, C.
Year: 2010
Warning Prediction Sequential for Transient Error Prevention
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Das, B.P.; Onodera, H.
Year: 2010
Recovery Method for a Laser Array Failure on Dynamic Optically Reconfigurable Gate Arrays
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Seto, D.; Watanabe, M.
Year: 2010
A Hybrid Scheme for Concurrent Error Detection of Multiplication over Finite Fields
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Ansari, B.; Verbauwhede, I.
Year: 2010
Online Multiple Fault Detection in Reversible Circuits
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Farazmand, N.; Zamani, M.; Tahoori, M.B.
Year: 2010
Error Detection and Correction in Content Addressable Memories
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Pontarelli, S.; Ottavi, M.; Salsano, A.
Year: 2010
Author index
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Year: 2010
Analog Design for a Power Transmission Line Sensing and Analysis VLSI Chip
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:MacLean, E.; Jain, V.K.
Year: 2010
Title Page i
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Year: 2010
Publisher's Information
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Year: 2010
Title Page iii
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Year: 2010
Reviewers
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Year: 2010
Committee Members
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Year: 2010
Message from the Symposium Chairs
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Year: 2010
Self-Synchrounous Circuits with Completion/Error Detection as a Candidate of Future LSI Resilient for PVT Variations and Aging
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Asada, K.; Ikeda, M.; Devlin, B.S.; Sogabe, T.
Year: 2010
Logic Gate Failure Characterization for Nanoelectronic EDA Tools
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Zarkesh-Ha, P.; Shahi, A.A.M.
Year: 2010
An Analytical Error Model for Pattern Clipping in DNA Self-Assembly
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Arani, Z.M.; Hashempour, M.; Lombardi, F.
Year: 2010
Reliability-Driven System-Level Synthesis of Embedded Systems
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Bolchini, C.; Miele, A.
Year: 2010
Parameter Variability in Nanoscale Fabrics: Bottom-Up Integrated Exploration
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Narayanan, P.; Leuchtenburg, M.; Kina, J.; Joshi, P.; Panchapakeshan, P.; Chui, C.O.; Moritz, C.A.
Year: 2010
A Hardware-Oriented Fault-Tolerant Routing Algorithm for Irregular 2D-Mesh Network-on-Chip without Virtual Channels
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Fukushima, Y.; Fukushi, M.; Yairi, I.E.; Hattori, T.
Year: 2010
Hypervisor-Based Virtual Hardware for Fault Tolerance in COTS Processors Targeting Space Applications
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Campagna, S.; Hussain, M.; Violante, M.
Year: 2010
Circuit Failure Prediction by Field Test - A New Task of Testing
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Sato, Y.
Year: 2010
Minimal Path, Fault Tolerant, QoS Aware Routing with Node and Link Failure in 2-D Mesh NoC
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Rameshan, N.; Laxmi, V.; Gaur, M.S.; Ahmed, M.; Paliwal, K.K.
Year: 2010
A Design of Self-Defect-Compensatable Hardware Neuron for Multi-layer Neural Networks
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Yamamori, K.; Tashiro, K.; Kusano, M.; Yoshihara, I.
Year: 2010
Soft Error Tolerant BILBO FF
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Namba, K.; Ito, H.
Year: 2010
The Impact of Manufacturing Defects on the Fault Tolerance of TMR-Systems
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Hunger, M.; Hellebrand, S.
Year: 2010
Combining Hardware- and Software-Based Self-Repair Methods for Statically Scheduled Data Paths
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Schölzel, M.; Müller, S.
Year: 2010
CFBLT: A Closed Feed Back Loop Type Queuing System; Modeling and Analysis
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Nagase, T.; Ichijo, K.; Narita, A.; Yoshioka, Y.
Year: 2010
Fabrication and test of arrays of langasite microbalances
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Ansorge, E.; Brose, A.; Schmidt, B.; Sauerwald, J.; Fritze, H.
Year: 2010
New facts from lead-free solders reliability investigation
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Szendiuch, I.; Jankovsky, J.; Bursik, M.; Hejatkova, E.
Year: 2010
Thermodynamic sensors new opportunities for measuring and control in industrial applications
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Reznicek, M.; Szendiuch, I.; Reznicek, Z.
Year: 2010
Underfill and mold compound influence on PoP aging under high current and high temperature stress
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Meinshausen, L.; Weide-Zaage, K.; Frémont, H.
Year: 2010
Organic humidity sensors - improvement of climatic resistance
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Řeboun, J.; Hamáček, A.; Džugan, T.; Kroupa, M.
Year: 2010
Testing and simulation of wire bonding attach for higher current
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Bursik, M.; Hejatkova, E.; Jankovsky, J.; Novotny, M.; Szendiuch, I.
Year: 2010
Characterisation of silver particles used for the Low Temperature Joining Technology
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Früh, C.; Günther, M.; Rittner, M.; Fix, A.; Nowottnick, M.
Year: 2010
Inspection of through silicon vias (TSV) and other interconnections in IC packages by computed tomography
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Roth, H.; Zhenhui He; Mayer, T.
Year: 2010
Die-attach for high-temperature applications using fineplacer-pressure-sintering (FPS)
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Kahler, J.; Heuck, N.; Palm, G.; Stranz, A.; Waag, A.; Peiner, E.
Year: 2010
Electron backscatter diffraction microstructure investigations of electronic materials down to the nanoscale
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Krause, M.; März, B.; Dresbach, C.; Petzold, M.
Year: 2010
Flexible test bench to study the reliability of electronic assemblies
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Moreau, K.; Grieu, M.; Bousquet, S.; Munier, C.
Year: 2010
Controlling the signal integrity through the geometry of the microstrip on the digital PCBs
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Zolog, M.; Pitica, D.
Year: 2010
High yield thermode bond process under activated atmosphere and inline thermal interface measurement for high power optoelectronic devices
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Elger, G.; Lauterbach, R.; Feder, R.; Dankwart, K.; Zilkens, C.
Year: 2010
Virtual qualification - The step into a new period of automotive electronic development
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Bernhardt, A.; Schiessl, A.; Schingale, A.; Wolf, D.
Year: 2010
Assembly requirements for multi-channel coupling micro-optics in board-level optical interconnects
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Nieweglowski, K.; Rieske, R.; Wolter, K.-J.
Year: 2010
Advanced virtual testing of structural integrity in microelectronic assemblies
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:M H Shirangi; C Otto; A Fischer; P van Staa; B Michel
Year: 2010
Mechanical characterization of gold and copper free air balls in thermosonic wire bond interconnections
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Lorenz, G.; Petzold, M.; Mittag, M.; Dresbach, C.; Milke, E.
Year: 2010
Hermeticity of eutectic bond layers for sensor packages on wafer-level
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Schneider, A.; Rank, H.; Müler-Fiedler, R.; Wittler, O.; Reichl, H.
Year: 2010
fibDAC stress relief - A novel stress measurement approach with high spatial resolution
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Vogel, D.; Maus, I.; Michel, B.
Year: 2010
Packaging challenges associated with warpage of ultra-thin chips
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Hassan, M.-U.; Angelopoulos, E.A.; Rempp, H.; Endler, S.; Burghartz, J.N.
Year: 2010
On model fitting methods for modeling polymer cure kinetics in microelectronics assembly applications
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Tilford, T.; Morris, J.E.; Ferenets, M.; Rajaguru, P.R.; Pavuluri, S.K.; Desmulliez, M.P.Y.; Bailey, C.
Year: 2010
Growth and properties of intermetallics formed during thermal aging of Cu-Al ball bonds
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Gubbels, G.H.M.; Kouters, M.H.M.; O'Halloran, O.; Rongen, R.
Year: 2010
Numerical analysis of microwave underfill cure in ball-grid packages
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Tilford, T.; Ferenets, M.; Adamietz, R.; Pavuluri, S.K.; Morris, J.E.; Desmulliez, M.P.Y.; Bailey, C.
Year: 2010
Fundamental analysis of embroidered contacts for electronics in textiles
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Linz, T.; Simon, E.; Walter, H.
Year: 2010
The packaging technologies for photovoltaic modules - technological challenges and mechanical integrity
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Wiese, S.; Kraemer, F.; Betzl, N.; Wald, D.
Year: 2010
The scaling effect on microstructure and creep properties of Sn-based solders
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Wiese, S.; Mueller, M.; Panchenko, I.; Metasch, R.; Roellig, M.; Wolter, K.-J.
Year: 2010
3D welding of ultrathin Pt wires by Joule heating
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Fukui, S.; Tohmyoh, H.; Saka, M.
Year: 2010
On the integration of microwave curing systems into microelectronics assembly processes
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Adamietz, R.; Müller, G.; Othman, N.; Eicher, F.; Tilford, T.; Ferenets, M.; Pavuluri, S.K.; Desmulliez, M.P.Y.; Bailey, C.
Year: 2010
Integrated LED modules
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:de Samber, M.; van Grunsven, E.; Eggink, E.; Peels, W.
Year: 2010
Silver nanocluster formation using UV radiation for direct metal patterning on polyimide
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Watson, D.E.; Ng, J.H.-G.; Sigwarth, J.; Bates, J.; Desmulliez, M.P.Y.
Year: 2010
The connecting of electronic modules using SMD components' package
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Švecová, O.; Šandera, J.
Year: 2010
Simulation and parameters optimization of power DMOS Trench Field Effect Transistors
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Baranov, V.V.; Belous, A.I.; Krechko, M.M.; Roubtsevich, I.I.; Tourtsevich, A.S.
Year: 2010
Investigation of adhesive bonding on non-noble metal in Electronic Packaging
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Paproth, A.; Adolphi, B.; Wolter, K.-J.
Year: 2010
Effect mechanism of moisture diffusion on LED reliability
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Bulong Wu; Xiaobing Luo; Sheng Liu
Year: 2010
Polymer bonding by induction heating for microfluidic applications
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Knauf, B.J.; Webb, D.P.; Changqing Liu; Conway, P.P.
Year: 2010
A novel vapor pressure transfusion model for the popcorning analysis of Quad Flat No-lead (QFN) packages
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Minshu Zhang; Lee, S.-W.R.
Year: 2010
Influence of solder joint constitution and aging process duration on reliability of lead-free solder joints under vibrations combined with thermal cycling
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Matkowski, P.; Felba, J.
Year: 2010
Active optical flex module for ultra-short distance data applications
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Immonen, M.; Wu, J.; Chen, P.; Luo, Y.H.; He, H.; Huang, W.; Xu, J.X.; Rapala-Virtanen, T.
Year: 2010
Epoxy resin curing process evaluation based on signal frequency analysis from interdigital structure sensor
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Blecha, T.; Pihera, J.
Year: 2010
Electrical characterization of PEDOT:PSS
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Pretl, S.; Hamáček, A.; Řeboun, J.; Čengery, J.; Džugan, T.; Kroupa, M.
Year: 2010
Determination of maximum strength and optimization of LED chip structure
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Shin-Yueh Yang; Tsung-Lin Chou; Chien-Fu Huang; Chung-Jung Wu; Chia-Liang Hsu; Kuo-Ning Chiang
Year: 2010
Device simulation for evaluating effects of mechanical stress on semiconductor devices: Impact of stress-induced variation of electron effective mass
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Koganemaru, M.; Yoshida, K.; Ikeda, T.; Miyazaki, N.; Tomokage, H.
Year: 2010
Changes of the coplanarity of SMT-components during soldering and their Measurement
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Wohlrabe, H.; Wolter, K.-J.
Year: 2010
Failure mechanism of solder interconnections under thermal cycling conditions
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Mattila, T.T.; Mueller, M.; Paulasto-Kröckel, M.; Wolter, K.-J.
Year: 2010
Investigation of RFID tag antennas printed on flexible substrates using two types of conductive pastes
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Janeczek, K.; Kozioł, G.; Serzysko, T.; Jakubowska, M.
Year: 2010
Growth behaviour of gold-aluminum intermetallic phases (IMP) in temperature aged ball bonds observed by electron backscatter diffraction
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Marz, B.; Scheibe, S.; Graff, A.; Petzold, M.
Year: 2010
Influence of metallographic preparation on EBSD characterization of Cu wire bonds
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Tkachenko, A.; Mueller, M.; Zerna, T.; Wolter, K.-J.
Year: 2010
Formation of mechanical strains in the component board of a high-end handheld product during shock impact
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Karppinen, J.S.; Pakarinen, J.; Li, J.; Mattila, T.T.; Paulasto-Kröckel, M.
Year: 2010
Wafer-to-wafer hybrid bonding technology for 3D IC
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Cheng-Ta Ko; Zhi-Cheng Hsiao; Huan-Chun Fu; Kuan-Neng Chen; Wei-Chung Lo; Yu-Hua Chen
Year: 2010
Head on pillow defects in BGAs solder joints
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Arazna, A.; Koziol, G.; Steplewski, W.; Lipiec, K.
Year: 2010
Ultra-flexible and ultra-thin embedded medical devices on large area panels
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Kunkel, G.; Debski, T.; Burkard, H.; Link, J.; Petersen, A.E.; Christiaens, W.; Vanfleteren, J.
Year: 2010
Micro bench for optical pulse picking from 4 GHz pulse trains generated by mode locking of DBR lasers
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Klehr, A.; Liero, A.; Hoffmann, T.; Schulz, J.; Schwertfeger, S.; Wenzel, H.; Erbert, G.; Heinrich, W.; Tränkle, G.
Year: 2010
Microstructure and mechanical properties of laser ablation cleaned NiP platings for aluminum wire bonding
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Bennemann, S.; Dresbach, C.; Lorenz, G.; Berthold, L.; Petzold, M.
Year: 2010
A microscope system for characterization of mechanical properties of small-scaled objects
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Tohmyoh, H.; Akanda, M.A.S.; Saka, M.
Year: 2010
Development of a mechanical stress-analysing-tool to characterize packaging processes
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Holl, S.; Majcherek, S.; Hirsch, S.; Schmidt, B.
Year: 2010
Adhesion of moulding compounds on various surfaces. A study on moisture influence and degradation after high temperature storage
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Pufall, R.; Goroll, M.; Bouazza, M.; Wittler, O.; Michel, B.
Year: 2010
Stacked Anodized Metal Substrate for high thermal dissipation performance
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Chang-Hyun Lim; Young-Ki Lee; Ki-Ho Seo; Jong-Woon Kim; Seog-Moon Choi
Year: 2010
Design and implementation of an integrated RF System-in-Package for healthcare applications
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Wagner, F.; Elneel, N.A.; Schroeder, D.; Krautschneider, W.
Year: 2010
Aerosol deposition of catalytic ink to fabricate fine pitch metallizations for moulded interconnect devices (MID)
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Brose, A.; Leneke, T.; Hirsch, S.; Schmidt, B.
Year: 2010
Thermomechanical analysis of electrically conductive adhesives
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Mach, P.; Busek, D.; Polansky, R.
Year: 2010
FPGA-board and active optical cable design for optical multi-gigabit communication
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Merchan, F.; Gregorius, P.; Voss, S.; Brenner, K.
Year: 2010
Fine pitch copper wire bonding introduction to high volume production
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Appelt, B.K.; Tseng, A.; Yi-Shao Lai
Year: 2010
Fracture analysis of interface delamination in Metal-Insulator-Metal capacitor device
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Ming-Che Hsieh; Sheng-Tsai Wu; Chao-Huang Chen
Year: 2010
Mechanical issues induced by Electrical Wafer Sort: Correlations from actual tests, nanoindentation and 3D dynamic modeling
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Roucou, R.; Fiori, V.; Inal, K.; Jaouen, H.
Year: 2010
Ceramic injection molded clevis sensor for online substance concentration measurement
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Hartmann, M.; Doerner, S.; Hirsch, S.
Year: 2010
X-ray resistant packaging for X-ray line detectors
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Oppermann, M.; Lohse, T.; Metasch, R.; Zerna, T.; Wolter, K.-J.
Year: 2010
Aluminium wedge-wedge wire bonding on thermoplastic substrates made by LPKF-LDS® technology
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Buckmüller, P.; Eberhardt, W.; Kessler, U.; Willeck, H.; Kück, H.
Year: 2010
MDS investigation on the heat transfer properties of CNT micro-channel cooler
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Yan Zhang; Shun Wang; Jing-yu Fan; Johan Liu
Year: 2010
Flip Chip bonding with Elasticity Bonding System and Non Conductive Film suitable for intermetallic compounds formation
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Kojima, R.; Saito, T.; Matsumura, T.; Koyama, T.; Umetsu, N.; Furuta, K.; Nishimura, J.; Moriyama, H.
Year: 2010
Board level validation for green IC packaging with strain-controllable dynamic bending method
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Lee, J.C.; Chi-Ko Yu; Chang, G.; Tina Shao; Cherie Chen; Xiang-Kai Meng; Brown, M.
Year: 2010
Eutectic wafer bonding for 3-D integration
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Baum, M.; Chenping Jia; Haubold, M.; Wiemer, M.; Schneider, A.; Rank, H.; Trautmann, A.; Gessner, T.
Year: 2010
Surface modification and wettability of silicone PDMS film
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Kaiying Wang; Guangming Ouyang; Xuyuan Chen
Year: 2010
Flipchip bonding of ultrahin Si dies onto PEN/PET substrates with low cost circuitry
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:van den Brand, J.; Kusters, R.; Heeren, M.; van Remoortere, B.; Dietzel, A.
Year: 2010
Thin wafer processing and chip stacking for 3D integration
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Matthias, T.; Kim, B.; Wimplinger, M.; Lindner, P.
Year: 2010
Label-free chemical/biochemical sensing device based on an integrated microfluidic channel within a waveguide resonator
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:McKeever, E.; Pavuluri, S.K.; Lopez-Villarroya, R.; Goussetis, G.; Kavanagh, D.M.; Mohammed, M.I.; Desmulliez, M.P.Y.
Year: 2010
In-situ test structures for ultra low leak detection
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Millar, S.; Desmulliez, M.P.Y.; Cargill, S.; McCracken, S.
Year: 2010
Micro electrode array for recording electrical membrane ionic currents
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Aryasomayajula, A.; Derix, J.; Perike, S.; Gerlach, G.; Funk, R.H.
Year: 2010
Nanoscaled solder for low-temperature assembling processes
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Novikov, A.; Nowottnick, M.
Year: 2010
A novel approach for reliability assurance of solder pastes against dew condensation
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Matzner, C.; Rösch, M.; Franke, J.
Year: 2010
Frames, cavities & channels - Advanced mechanical structrues in PCBs
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Lehnberger, C.
Year: 2010
3D substrate innovation for complex high pin count flip-chip applications
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Solberg, V.; Oganesian, V.
Year: 2010
Program
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Year: 2010
Reliability improvements for advanced Wafer Level packaging
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Hunt, J.; Huang, D.; Chiu, J.; Liu, M.M.C.; Lin, J.; Lou, J.W.; Chienfan Chen; Chin-Li Kao
Year: 2010
Investigation of properties of the SAC solder paste with the silver nanoparticle and carbon nanotube additives and the nano solder joints
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Jakubowska, M.; Bukat, K.; Koscielski, M.; Mlozniak, A.; Niedzwiedz, W.; Sloma, M.; Sitek, J.
Year: 2010
Self-assembly and self-interconnection of thin RFID devices on plasma-programmed foil substrates
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Landesberger, C.; Yacoub-George, E.; Hell, W.; Bock, K.
Year: 2010
Thermo mechanical behaviour of dies in multi material stacks
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Hintz, M.; Dudek, R.; Koch, I.; Schindler-Saefkow, F.; Steinke, A.
Year: 2010
Process integration of fine pitch micro-bumping and Cu redistribution wiring for power efficient SiP
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Ezawa, H.; Togasaki, T.; Migita, T.; Yamashita, S.; Inohara, M.; Koshio, Y.; Fukuda, M.; Miyata, M.; Nagamine, K.; Iijima, T.
Year: 2010
Fan-Out Wafer-Level Packaging with highly flexible design capabilities
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Kurita, Y.; Kimura, T.; Shibuya, K.; Kobayashi, H.; Kawashiro, F.; Motohashi, N.; Kawano, M.
Year: 2010
Characterization of surface profile for surface activated bonding by using Power Spectral Density function
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Tsukamoto, K.; Suga, T.
Year: 2010
Report on iNEMI Boundary-Scan Adoption Project results and future plans
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Fu, H.; Geiger, P.B.; Butkovich, S.; O'Malley, G.
Year: 2010
Nano materials for microelectronic packaging
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Wong, C.P.; Lin, W.; Zhang, R.
Year: 2010
Integrated magnetics on silicon for power supply in package (PSiP) and power supply on chip (PwrSoC)
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Ningning Wang; Hannon, J.; Foley, R.; McCarthy, K.; O'Donnell, T.; Rodgers, K.; Waldron, F.; Mathúna, C.O.
Year: 2010
System integration with eWLB
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Meyer, T.; Pressel, K.; Ofner, G.; Römer, B.
Year: 2010
Power cycling tests at high temperatures with IGBT power modules for hybrid electrical vehicle applications
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Hensler, A.; Lutz, J.; Thoben, M.; Zachariae, J.
Year: 2010
A small form-factor and low-cost opto-electronic package for short-reach 40 Gbit/s serial speed optical data links
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Kropp, J.R.; Lott, J.A.; Ledentsov, N.N.; Otruba, P.; Drögemüller, K.; Fiol, G.; Bimberg, D.; Ndip, I.; Erxleben, R.; Maass, U.; Klein, M.; Lang, G.; Oppermann, H.; Schröder, H.; Reichl, H.
Year: 2010
Modeling and analysis of coplanar bonding wires for high-speed applications
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Tschoban, C.; Ndip, I.; Schmidt, S.; Guttowski, S.; Schneider-Ramelow, M.; Lang, K.; Reichl, H.
Year: 2010
PCB tracks thermal simulation, analysis and comparison to IPC-2152 for electrical current carrying capacity
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Bunea, R.; Codreanu, N.-D.; Ionescu, C.; Svasta, P.; Vasile, A.
Year: 2010
Multi-physics modelling for packaging of Liquid Crystal Displays in harsh environments
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Bailey, C.; Hua Lu; Chunyan Yin; Yek Lee
Year: 2010
Influence of nano silver filler content on properties of ink-jet printed structures for microelectronics
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Falat, T.; Felba, J.; Moscicki, A.; Smolarek, A.; Bock, K.; Bonfert, D.
Year: 2010
Thermal modeling for advanced high power packaging development and on-line performance monitoring
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Yuan, C.; An Xiao; Salta, J.; de Langen, M.; van Driel, W.
Year: 2010
Crack and damage evaluation in low-k BEoL stacks under assembly and CPI aspects
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Auersperg, J.; Vogel, D.; Lehr, M.U.; Grillberger, M.; Michel, B.
Year: 2010
Anisotropic thermal conductivity in electrically conductive adhesives with single- and bimodal filler-size distributions containing Ag flakes and micro-particles
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Inoue, M.; Muta, H.; Yamanaka, S.; Liu, J.
Year: 2010
Rate dependent mechanical behaviour of SAC solder in fast tensile experiments
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Meier, K.; Roellig, M.; Wiese, S.; Wolter, K.-J.
Year: 2010
Investigation of wettability and interface reactions of Sn-Pb, Sn-Cu, Sn-Ag and Sn-Ag-Cu solders for solar cell interconnections
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Schindler, S.; Wiese, S.
Year: 2010
A novel approach to embed off-chip RF passives in PCB based on thin film technology
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Liang Wang; Christiaens, W.; Brebels, S.; De Raedt, W.; Vanfleteren, J.
Year: 2010
Low temperature hybrid bonding using self-alignment
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Jae Hak Lee; Tae Ho Ha; Chang Woo Lee; Jun-Yeob Song; Choong Don Yoo
Year: 2010
3D IC infrastructure status and issues
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Vardaman, E.J.
Year: 2010
Impact of thermal aging on the thermal fatigue durability of Pb-free solder joints
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Chauhan, P.; Mueller, M.; Osterman, M.; Pecht, M.
Year: 2010
Thermal and mechanical design optimization of a pressure-mounted base-plate-less high temperature power module
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Mattey, N.; Skuriat, R.; Li, J.; Agyakwa, P.; Evans, P.; Johnson, C.M.
Year: 2010
Development of a thin-film stretchable electrical interconnection technology for biocompatible applications
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Verplancke, R.; Sterken, T.; Axisa, F.; Vanfleteren, J.
Year: 2010
A simulation-based design method to transfer surface mount RF system to flip-chip die implementation
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Liqiang Zheng; Rodgers, K.; Mathewson, A.; O'Flynn, B.; Hayes, M.; O'Mathuna, C.
Year: 2010
Analysis of vapor phase soldering in comparison with conventional soldering technologies
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Illyefalvi-Vitéz, Z.; Géczy, A.; Bátorfi, R.; Szöke, P.
Year: 2010
Liquid crystal polymer as a substrate material for flip chip ACA interconnections
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Frisk, L.; Parviainen, A.; Kokko, K.
Year: 2010
Impact of printed circuit board technology on thermal performance of high-power LED assembly - experimental results
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Nicolics, J.; Langer, G.; Lutschounig, F.; Lang, K.-J.; Huber, R.
Year: 2010
Analysis of thermomechanically related failures of traction IGBT power modules at short circuit switching
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Nagl, B.; Nicolics, J.; Gschohsmann, W.
Year: 2010
Influence of processing conditions on the characteristics of LTCC materials (ID #279)
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Makarovič, K.; Meden, A.; Hrovat, M.; Belavič, D.; Holc, J.; Kosec, M.
Year: 2010
An IC-centric biocompatible chip encapsulation fabrication process
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:de Beeck, M.O.; La Manna, A.; Buisson, T.; Dy, E.; Velenis, D.; Axisa, F.; Soussan, P.; Van Hoof, C.
Year: 2010
Board design optimization for fine pitch BGA components
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Geczy, A.; Illyefalvi-Vitez, Z.
Year: 2010
Solder joint reliability in automotive applications: describing damage mechanisms through the use of EBSD
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Steller, A.; Pape, U.; Dudek, R.
Year: 2010
TSV as an alternative to wire bonding for a wireless industrial product: another step towards 3D integration
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Druais, G.; Ancey, P.; Chapelon, L.L.; Charbonnier, J.; Cheramy, S.; Dodo, Y.; Farcy, A.; Garnier, G.; Guillou, Y.; Henry, D.; Leduc, P.; Pruvost, J.; Saugier, E.; Sillon, N.
Year: 2010
Technology trends in the manufacturing and packaging of Wafer Level Cameras
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Zoberbier, R.; Hennemeyer, M.; Toennies, D.; Kraft, A.; Eisner, M.; Völkel, R.
Year: 2010
Influence of the processing method on the amount and development of voids in miniaturized interconnections
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Dimcic, B.; Labie, R.; Wenqi Zhang; De Wolf, I.; Verlinden, B.
Year: 2010
Anodic bonding at low voltage using microstructured borosilicate glass thin-films
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Leib, J.; Hansen, U.; Maus, S.; Feindt, H.; Hauck, K.; Zoschke, K.; Toepper, M.
Year: 2010
Fine-line structuring of microwave components on LTCC substrates
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Stopel, D.; Drue, K.; Humbla, S.; Mach, M.; Mache, T.; Rebs, A.; Reppe, G.; Vogt, G.; Hein, M.; Muller, J.
Year: 2010
Reliability testing of Cu-Sn intermetallic micro-bump interconnections for 3D-device stacking
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Labie, R.; Limaye, P.; Lee, K.W.; Berry, C.J.; Beyne, E.; De Wolf, I.
Year: 2010
Simulation of electro-thermal interaction
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Jancke, R.; Wilde, A.; Martin, R.; Reitz, S.; Schneider, P.
Year: 2010
Simulation of power delivery networks with Joule heating effects for 3D integration
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Jianyong Xie; Swaminathan, M.
Year: 2010
Investigation of nano-patterned PZT thin films by piezoresponse force microscopy
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Waegner, M.; Haussmann, A.; Hoffmann, M.; Suchaneck, G.; Gerlach, G.; Eng, L.M.
Year: 2010
Contactless material deposition by jetting for heterogeneous system integration
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Becker, K.-F.; Kurz, A.; Reichl, H.; Koch, M.; Bauer, J.; Braun, T.
Year: 2010
Use of non-etching adhesion promoters in advanced PCB applications
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Zee, A.; Massey, R.
Year: 2010
Integration of a 3D microwave module
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Sun, X.; Soussan, P.; La Manna, A.; Majeed, B.; Barbaste, R.; Monfraix, P.; De Raedt, W.
Year: 2010
Current density simulations for polymer cored CSP interconnects
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Whalley, D.; Kristiansen, H.
Year: 2010
New silver contact pastes from high pressure sintering to low pressure sintering
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Schmitt, W.; Heraeus, W.C.
Year: 2010
Interface fracture mechanics evaluation by correlation of experiment and simulation
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Keller, J.; Maus, I.; Schlottig, G.; Pape, H.; Wunderle, B.; Michel, B.
Year: 2010
Properties of high-k materials embedded in low temperature cofired ceramics
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Bartsch, H.; Grieseler, R.; Müller, J.; Barth, S.; Pawlowski, B.
Year: 2010
Electrolytic solder deposit for next generation flip chip solder bumping
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Roelfs, B.; Kenny, S.; Matejat, K.
Year: 2010
Surface Activated Bonding between Au layer and vertically aligned Multi-Wall Carbon Nanotubes
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Fujino, M.; Suga, T.; Soga, I.; Kondo, D.; Ishizuki, Y.; Iwai, T.; Mizukoshi, M.
Year: 2010
A detailed investigation of the failure formation of copper trace cracks during drop tests
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Kraemer, F.; Wiese, S.; Rzepka, S.; Faust, W.; Lienig, J.
Year: 2010
Freeform lens for white LEDs with high angular color uniformity
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Kai Wang; Dan Wu; Fei Chen; Zongyuan Liu; Xiaobing Luo; Sheng Liu
Year: 2010
Introduction of nanosized Al2O3 in Sn-Ag3,5 solders by mechanical alloying
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Boareto, J.C.; Rodrigues, G.V.S.; Mastropietro, M.F.; Wendhausen, P.A.P.; Wolter, K.-J.
Year: 2010
Development of charged particle detectors by integrating gas amplification stages and CMOS ASICS on wafer level
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Kaminski, J.; Baumgartner, T.; Desch, K.; Ehrmann, O.; Fritzsch, T.; Krautscheid, T.; Mayer, S.; Töpper, M.
Year: 2010
Implementation of chip embedding processes for the creation of miniaturized system-in-packages
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Boettcher, L.; Manessis, D.; Ostmann, A.; Karaszkiewicz, S.; Aschenbrenner, R.; Lang, K.-D.
Year: 2010
Influence of indium on microstructure and creep properties of SnAg3.5InX (X=0,2,4,8) solder alloys
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Boareto, J.C.; Metasch, R.; Roellig, M.; Wendhausen, P.A.P.; Wolter, K.J.
Year: 2010
Crosstalk analysis in high density connector via pin fields for digital backplane applications using a 12-port vector network analyzer
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Kotzev, M.; Frech, R.; Harrer, H.; Kaller, D.; Huber, A.; Winkel, T.-M.; Brüns, H.-D.; Schuster, C.
Year: 2010
Stretchable electronics manufacturing and application
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Loher, T.; Seckel, M.; Ostmann, A.
Year: 2010
Optimization of lead-free wave soldering process using taguchi orthogonal arrays
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Mach, P.; Zeman, P.; Kotrčová, E.; Barto, S.
Year: 2010
Reliability study of the Stud Bump Bonding flip chip technology on Molded Interconnect Devices
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Dressler, M.; Wunderle, B.; Becker, K.; Reichl, H.
Year: 2010
Understanding die attach materials performance in electronic packages under harsh environments
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Sousa, M.F.; Riches, S.; Johnston, C.; Grant, P.S.
Year: 2010
Module miniaturization by ultra thin package stacking
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Löher, T.; Schütze, D.; Christiaens, W.; Dhaenens, K.; Priyabadini, S.; Ostmann, A.; Vanfleteren, J.
Year: 2010
Polymer nanofiber based continuous metal phase composite for thermal management applications
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Carlberg, B.; Liu, J.; Li-Lei Ye
Year: 2010
Electron transport in tantalum nanolayers: Low temperature characteristics
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Martin, K.; Milos, C.; Vlasta, S.
Year: 2010
Effect of solder diffusion barriers on the joint reliability of SiC power devices operated above 300°C
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Fengqun Lang; Oohashi, H.; Yamaguchi, H.
Year: 2010
Rapid prototyping of electronic modules combining Aerosol printing and Ink Jet printing
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Gieser, H.A.; Bonfert, D.; Hengelmann, H.; Wolf, H.; Bock, K.; Zollmer, V.; Werner, C.; Domann, G.; Bahr, J.; Ndip, I.; Curran, B.; Oehler, F.; Milosiu, H.
Year: 2010
Hermetic wafer-level packaging development for RF MEMS switch
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Ferrandon, C.; Greco, F.; Lagoutte, E.; Descours, P.; Enyedy, G.; Pellat, M.; Gillot, C.; Rey, P.; Mercier, D.; Cueff, M.; Baillin, X.; Perruchot, F.; Sillon, N.; Liu, L.J.; Pacheco, S.; Miller, M.
Year: 2010
Thermal test vehicle for the validation of thermal modelling of hot spot dissipation in 3D stacked ICs
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Oprins, H.; Cherman, V.; Torregiani, C.; Stucchi, M.; Vandevelde, B.; Beyne, E.
Year: 2010
Electrical evaluation of wafer level fan out (WLFO) package using organic substrates for microwave applications
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:SeungJae Lee; SangWon Kim; GaWon Kim; KiCheol Bae; JiHeon Yu; JinYoung Kim; HeeYeoul Yoo; ChoonHeung Lee
Year: 2010
Experimental damage analysis and numerical reliability modeling of lead-free ball-grid-array second level interconnects
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Pustan, D.; Wenxin Zhang; Wilde, J.
Year: 2010
Integration of a multifunctional and multispectral optical sensor for automotive applications using surface mountable planar optical interconnect
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Klein, A.; Gerritzen, A.; Schröder, H.; Oppermann, H.; Capello, D.; Pallaro, N.
Year: 2010
Effects of failure criteria on the constant humidity test results
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Kokko, K.; Frisk, L.
Year: 2010
New packaging concept for ultra high precision 3D tactile probes for CMM applications
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Buetefisch, S.; Solzbacher, F.; Danzebrink, H.U.; Brand, U.; Koenders, L.
Year: 2010
Passive parametric modeling of interconnects and packaging components from sampled impedance, admittance or scattering data
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Triverio, P.; Nakhla, M.; Grivet-Talocia, S.
Year: 2010
Reliability improvement of a powder blasting process for micro-machining applications
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Lacrotte, Y.; Wilhelm, S.; Desmulliez, M.P.Y.
Year: 2010
Highly integrated advanced power electronic systems for automotive applications
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Sommer, J.-P.; Hofmann, T.; Neumann, A.; Podlasly, A.; Michel, B.
Year: 2010
Low cost Thin Film packaging for MEMS over molded
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Pornin, J.-L.; Gillot, C.; Billard, C.; Lagoutte, E.; Pellat, M.; Parat, G.; Sillon, N.
Year: 2010
Benefits of pure palladium for ENEP and ENEPIG surface finishes
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Oezkoek, M.; Ramos, G.; Metzger, D.; Roberts, H.
Year: 2010
Modeling and validation of evaluation method on IC chip pick-up performance of dicing/die bonding tape
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Saiki, N.; Inaba, K.; Kishimoto, K.; Seno, H.; Ichikawa, I.
Year: 2010
TSV modeling and noise coupling in 3D IC
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Joohee Kim; Jonghyun Cho; Joungho Kim
Year: 2010
The impact of carbon nanotubes diameter on their thermal conductivity - Non-equilibrium molecular dynamics approach
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Platek, B.; Falat, T.; Felba, J.
Year: 2010
Investigation into the impact of component floor plan layout on the overall reliability of electronics systems in harsh environments
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Braden, D.R.; Yang, R.S.H.; Duralek, J.; Guang-Ming Zhang; Harvey, D.M.
Year: 2010
Localization of electrical defects in system in package devices using Lock-in Thermography
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Schmidt, C.; Grosse, C.; Altmann, F.
Year: 2010
Application of multi-criteria optimization algorithms to numerical material extraction of thin layers through nanoindentaion technique
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Dowhań, Ł.; Wymysłowski, A.; Janus, P.; Ekwińska, M.; Wittler, O.
Year: 2010
Biocompatibility assessment of advanced wafer-level based chip encapsulation
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Dy, E.; Vos, R.; Rip, J.; la Manna, A.; Op de Beeck, M.
Year: 2010
Investigation of misalignment in microwave multilayer filters
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Ali, W.; Bunyan, H.
Year: 2010
Transfer layer technology for the packaging of high power modules
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Balucani, M.; Nenzi, P.; Crescenzi, R.; Dolgyi, L.; Klyshko, A.; Bondarenko, V.
Year: 2010
RFID system for the identification of biological samples
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Hichri, K.; Wick, H.; Zimmermann, H.; Ihmig, F.R.
Year: 2010
Employing solder joints of concave shape for monitoring electromigration independently of material interfaces
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Jaeschke, J.; Muller, W.H.; Nissen, N.F.; Reichl, H.
Year: 2010
DoE simulations and measurements with the MicroDAC stress chip for material and package investigations
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Schindler-Saefkow, F.; Otto, A.; Rzepka, S.; Wittler, O.; Wunderle, B.; Michel, B.
Year: 2010
Progress towards the development of novel fabrication and assembly methods for the next generation of ultrasonic transducers
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Hoyd-Gigg Ng, J.; Flynn, D.; Lacrotte, Y.; Desmulliez, M.P.Y.; Ssekitoleko, R.; Démoré, C.; Cochran, S.
Year: 2010
Accurate 3D electromagnetic simulation of RF system-in-package
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Ngoc-Hoa Huynh; Pressel, K.; Roemer, B.
Year: 2010
Microelectronic-like packaging for silicon photonics : A 10 Gbps multi-chip-module optical receiver based on Ge-on-Si photodiode
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Bernabé, S.; Kopp, C.; Lombard, L.; Fedeli, J.
Year: 2010
Boundary condition independent multiple cooling surfaces transient compact thermal model
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Azoui, T.; Tounsi, P.; Dorkel, J.-M.
Year: 2010
Influences of soldering processes on piezoelectric properties
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Bramlage, S.; Walter, S.; Wolter, K.-J.
Year: 2010
Thermal signal behaviour for air flow measurements as fundamentals to Time-of-Flight
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Ecin, O.; Engelien, E.; Strathen, B.; Malek, M.; Gu, D.; Viga, R.; Hosticka, B.J.; Grabmaier, A.
Year: 2010
Future high security ID documents based on innovative microsystem technologies
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Kloeser, J.; Holinski, D.; Ferber, A.; Muth, O.; Fischer, J.; Paeschke, M.
Year: 2010
Ceramic substrates with aluminum metallization for power application
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Knoll, H.; Weidenauer, W.; Ingram, P.; Bennemann, S.; Brand, S.; Petzold, M.
Year: 2010
Newly developed low cost, reliable wafer level hermetic sealing using Cu/Sn system
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Yu, D.Q.; Thew, M.L.
Year: 2010
Novel hermetic and low cost glass-capping technology for wafer-level-packaging of optical devices
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Hansen, U.; Maus, S.; Leib, J.; Toepper, M.
Year: 2010
New method for head-up display realization by mean of Chip On Board and Aerosol Jet process
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Padovani, S.; Sinesi, S.; Priante, S.; Antonipieri, M.; Del Negro, A.; Zoellmer, V.; Maiwald, M.; Hedges, M.
Year: 2010
Low profile CSP (LP-CSP) technology for ultra-thin IC packaging applications
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Sharma, U.; Holland, P.; Gee, H.; Lu Ning; Swamy, R.
Year: 2010
An integrated approach to Design for Quality (DfQ) in the high value added printed circuit assembly (PCA) manufacturing: A pilot tool
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Huertas-Quintero, L.A.M.; Conway, P.P.; West, A.A.; Segura-Velandia, D.M.
Year: 2010
Water diffusion in micro- and nano-particle filled encapsulants
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Braun, T.; Georgi, L.; Bauer, J.; Koch, M.; Becker, K.-F.; Bader, V.; Aschenbrenner, R.; Reichl, H.
Year: 2010
Elastic properties of bonding wires
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Dresbach, C.; Mittag, M.; Petzold, M.
Year: 2010
Backlight illumination structure based on inorganic LED devices and laminated multilayer polymer substrate
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Keränen, K.; Heikkinen, M.; Hiltunen, M.; Lahti, M.; Mäkinen, J.-T.; Sunnari, A.; Rekilä, J.; Rönkä, K.
Year: 2010
Impacts of uniaxial mechanical stress on high frequency performance of MOSFETs
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Younggun Han; Koganemaru, M.; Ikeda, T.; Miyazaki, N.; Woon Choi; Tomokage, H.
Year: 2010
SCB - Stamped Circuit Board technology
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Benedikt, M.; Stenger, T.; Andreas, K.; Krüger, F.
Year: 2010
Reliability of Ag ink jet printed traces on polyimide substrate
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Bonadiman, R.; Salazar, M.M.P.
Year: 2010
Wire-bonding on inkjet-printed silver pads reinforced by electroless plating for chip on flexible board packages
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Cauchois, R.; Saadaoui, M.; Legeleux, J.; Malia, T.; Dubois-Bonvalot, B.; Inal, K.; Fidalgo, J.-C.
Year: 2010
Through Silicon Via polymer filling for 3D-WLP applications
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Bouchoucha, M.; Chapelon, L.-L.; Chausse, P.; Moreau, S.; Sillon, N.
Year: 2010
Reliability of solder joints assessed by acoustic imaging during accelerated thermal cycling
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Yang, R.S.H.; Harvey, D.M.; Guang-Ming Zhang; Braden, D.R.
Year: 2010
Thermal optimisation of GaN flip chip power transistors
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Zhytnytska, R.; Hilt, O.; Sidorov, V.; Würfl, J.; Tränkle, G.
Year: 2010
On the role of electromigration in power cycling tests
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Vuorinen, V.; Karppinen, J.S.; Laurila, T.; Paul, A.; Paulasto-Kröckel, M.
Year: 2010
Nanoporous interconnects
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Oppermann, H.; Dietrich, L.; Klein, M.; Wunderle, B.
Year: 2010
Enabling high volume fine pitch copper wire bonding: Enhancements to process and equipment capability
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Foley, J.; Clauberg, H.; Chylak, B.
Year: 2010
Power integrity analysis by using a coupled field-circuit method
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Xing-Chang Wei; Er-Ping Li
Year: 2010
Characterization methods for determination of temperature depended electrical, thermal, mechanical and fatigue properties of SnAg3.5 solder
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Roellig, M.; Metasch, R.; Meier, K.; Alt, F.
Year: 2010
Injection moulded lens array for high power LED modules
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Juntunen, E.; Keranen, A.; Paakkinen, M.; Vuorinen, V.; Tetri, E.; Halonen, L.; Heikkinen, V.
Year: 2010
Self-assembly and self-interconnection of thin RFID devices on plasma-programmed foil substrates
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Landesberger, C.; Yacoub-George, E.; Hell, W.; Bock, K.
Year: 2010
Aerosol printed conductors for miniaturized LTCC packaging
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Partsch, U.; Mosch, S.; Ihle, M.
Year: 2010
Investigations on Zn-Al-Ge alloys as high temperature die attach material
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Haque, A.; Won, Y.S.; Haseeb, A.S.M.A.; Masjuki, H.H.
Year: 2010
Advanced assessment of thermal stress related failure modes occurring during the assembly of high pin count BGAs on PCBs
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Hertl, M.; Weidmann, D.
Year: 2010
Fine pitch Cu/Sn solid state diffusion bonding for making high yield bump interconnections and its application in 3D integration
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Zhang, W.; Limaye, P.; Civale, Y.; Labie, R.; Soussan, P.
Year: 2010
Influence of accelerated aging on the acoustic properties of a ceramic microsystem for structural health monitoring
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Hildebrandt, S.; Boehme, B.; Wolter, K.-J.
Year: 2010
Fluxless wafer-level Cu-Sn bonding for micro- and nanosystems packaging
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Hoivik, N.; Kaiying Wang; Aasmundtveit, K.; Salomonsen, G.; Lapadatu, A.; Kittilsland, G.; Stark, B.
Year: 2010
Adapted assembly processes for flip-chip technology with solder bumps of 50 µm or 40 µm diameter
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Dohle, R.; Schüssler, F.; Friedrich, T.; Gossler, J.; Oppert, T.; Franke, J.
Year: 2010
Experimental investigation of open-ended microwave oven assisted encapsulation process
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Pavuluri, S.K.; Ferenets, M.; Goussetis, G.; Desmulliez, M.P.Y.; Tilford, T.; Adamietz, R.; Muller, G.; Eicher, F.; Bailey, C.
Year: 2010
Local stress measurement methods for packaging purposes- A comparison
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Gollhardt, A.; Vogel, D.; Michel, B.
Year: 2010
Electrical stress on film resistive structures on flexible substrates
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Bonfert, D.; Klink, G.; Gieser, H.; Bock, K.; Svasta, P.; Ionescu, C.
Year: 2010
Influence of moisture on humidity sensitive material parameters of polymers used in microelectronic applications
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Walter, H.; Dermitzaki, E.; Wunderle, B.; Michel, B.
Year: 2010
Thin die - Novel process for stack die packages and yield optimization
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Stöckli, T.; Rodríguez, I.; Ernst, U.; Harnisch, O.
Year: 2010
Au-Sn fluxless SLID bonding: Effect of bonding temperature for stability at high temperature, above 400 °C
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Aasmundtveit, K.E.; Thi Thuy Luu; Hoang-Vu Nguyen; Johannessen, R.; Hoivik, N.; Kaiying Wang
Year: 2010
Modular modeling approach to consider RF and thermal behavior of complex systems built up using interconnect structures in 3D integration
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Reitz, S.; Stolle, J.; Martin, R.; Wilde, A.; Schneider, P.
Year: 2010
Spherical polymer particles in isotropic conductive adhesives a study on rheology and mechanical aspects
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Hoang-Vu Nguyen; Kristiansen, H.; Gakkestad, J.; Johannessen, R.; Hoivik, N.; Aasmundtveit, K.E.
Year: 2010
Heat transfer analysis of force-cooled current leads in superconducting electric equipments based on finite element method
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Jing Ma; Ruifang Liu; Hongjie Zhang
Year: 2010
Magnetic field finite element analysis of permanent magnet synchronous generator
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Hui Guo
Year: 2010
Analysis on the negative sequence impedance directional protection for stator internal fault of turbo generator
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Hao Liangliang; Sun Yuguang; Qiu Ami
Year: 2010
Magnetic-thermal element sequential coupling algorithm in the application of permanent magnet generator temperature analysis
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Zhao Bo; Zou Jibin; Qi Wenjuan
Year: 2010
The rotor topology of slotless permanent-magnet brushless DC motor
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Xinghua Wang; Shichao Yan; Xiaocui Zhang; Xiuhe Wang; Chenghui Zhang
Year: 2010
The analysis of high speed slotless permanent magnet brushless DC motor based on soft magnetic ferrite
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Xinghua Wang; Xiaocui Zhang; Shichao Yan; Xiuhe Wang; Chenghui Zhang
Year: 2010
Asynchronous motor's more-accurate equivalent circuit parameter determining by auto 2fit
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Lin Youjie; Xu Zhiwei; Xie Weicai
Year: 2010
The load magnetic field analysis and simulation of disc permanent magnet synchronous wheel motor used in electric vehicle
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Wang Xiaoyuan; Chen Jing; Wang Pingxin
Year: 2010
The magnetic field analysis of permanent magnet synchronous motor used in pure electric vehicle based on FEM
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Wang Xiaoyuan; Chen Chen; Wang Pingxin
Year: 2010
Research on field regulation range of Synchronous/Permanent Magnet Hybrid Motor
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Shaogang Huang; Aifeng Wang; Rengmou Jin
Year: 2010
Comparative analysis of the methods to reduce flux linkage in flux reversal machine
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Zhu Han; Li Guangyou; Sun Yuping; Xu Yanliang
Year: 2010
Research on voltage regulator in brushless double-fed hybrid poles permanent generator
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Shaogang Huang; Zhen Wang; Yuping Yu
Year: 2010
Analysis of flux-switching permanent-magnet machine by nonlinear magnetic network model with bypass-bridges
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Gan Zhang; Ming Cheng; Wei Hua
Year: 2010
Characteristics of PWM inverter-driven hysteresis motor with short-duration overexcitation
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Kubota, T.; Kurihara, K.; Tamura, T.
Year: 2010
Computation of 3D transient eddy current field and losses in laminated core with sinusoidal excitation
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Zhanxin Zhu; Dexin Xie; Yanli Zhang
Year: 2010
A method for reducing cogging torque by magnet shifting in permanent magnet machines
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Ting Liu; Shoudao Huang; Jian Gao
Year: 2010
Design and control of a high torque density and high field-weakening performance permanent magnet vernier machine
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Guo Wei; Zhang Chengning
Year: 2010
Efficiency evaluation of PMASynRM vs. SynRM using coupled FEM & Preisach modeling
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Jung Ho Lee; Il Kyo Lee; Ah Ram Jeon
Year: 2010
Simulation analysis on detachable transformer in contactless electrical energy transmission system
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Zhuo Yan; Chao Zhang; Haiyan Chen; Qingxin Yang; Wei Gao; Sumei Yang
Year: 2010
Multi-domain analysis of tangential-set permanent magnet synchronous generator
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Hao Qian; Hong Guo; Zhi Huang; Zhiyong Wu
Year: 2010
Analysis of the 3-D magnetic reluctivity tensor based on magnetic properties measurement of SMC materials
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Yongjian Li; Jianguo Zhu; Qingxin Yang; Jingfeng Sun; Yi Wang; Wei Xu
Year: 2010
3D Finite element analysis and experiment for axial sectional claw pole machine with permanent magnet outer rotor
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Fengge Zhang; Hao Zhang; Guangwei Liu
Year: 2010
Analysis of multi-phase permanent magnet motors with concentrated non-overlapping stator windings
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Youlong Wang; Wen Xuhui
Year: 2010
Basic principles of hybrid excitation PM synchronous generator utilizing harmonic for excitation
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Xia Yonghong; Wang Shanming; Ma Mingyuan; Hao Liangliang; Qiu Ami; Huang Shaogang
Year: 2010
State of the art of hybrid excitation permanent magnet synchronous machines
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Wang Shanming; Xia Yonghong; Wang Xiangheng; Su Pengsheng; Huang Shaogang; Zhang Anming
Year: 2010
Design of a novel double salient permanent magnet machine for wind power generation
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Li Taobo; Sun Yuping; Li Guangyou; Xu Yanliang
Year: 2010
FEM analysis of an axial-field permanent magnet motor
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Guo Liang; Ding Hao; Lu Qinfen
Year: 2010
Fault diagnosis and location of brushless DC motor system based on Wavelet Transform and Artificial Neural Network
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Kaiping Yu; Fang Yang; Hong Guo; Jinquan Xu
Year: 2010
Analysis of magnetic field in three-phase induction motor core considering two-dimensional vector magnetic properties
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Yang Liu; Yanli Zhang; Dexin Xie; Chang Seop Koh
Year: 2010
Model selection strategy for the sequential optimization design of electromagnetic devices
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Yanbin Li; Jinhuan Chen; Gang Lei
Year: 2010
Study of a novel permanent magnet synchronous motor with composite-rotor
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Zhu Changqing; Wang Xiuhe; Wei Bei
Year: 2010
Magnetic characteristic analysis of permanent magnet motor with complex E&S modeling
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Zeze, S.; Todaka, T.; Enokizono, M.
Year: 2010
Loss analysis of line start permanent magnet synchronous motor with Time-Stepping Finite Element Method
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Zhang Jian; Zhao Haisen; Dou Na; Libo, T.
Year: 2010
Influence of parameters on performance of permanent magnet brushless DC motor with the air-cored stator
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Huijun Wang; Guangxu Zhou; Zhaoyan Xie; Sensen Song
Year: 2010
Finite element analysis of positive streamer propagation with lightning impulse voltage
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Ho-Young Lee; Se-Hee Lee
Year: 2010
Characteristic analysis & optimum design solutions of Permanent Magnet Assisted Synchronous Reluctance Motor for power improvement
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Jung Ho Lee; Tae Won Yun; Byeong Bu Lee
Year: 2010
Optimum design for premium 250 kW efficiency of traction induction motor using response surface methodology & FEM
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Jung Ho Lee; Byeong Du Lee; Tae Won Yun
Year: 2010
A study on cogging torque reducing method of BLDC motors
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Song Sensen; Zhou Guangxu; Xie Zhaoyan; Zhang Xiaopeng; Li Xiaowei; Wang Yong
Year: 2010
Research on the effect of thickness of permanent magnet to the PMSM based on variable magnetic reluctance field adjustment
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Li Chunyan; Li Chunhong; Baoquan, K.; Cheng Shukang
Year: 2010
Thermal analysis of water cooled surface mount permanent magnet electric motor for electric vehicle
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Jinxin Fan; Chengning Zhang; Zhifu Wang; Strangas, E.G.
Year: 2010
Sliding mode speed control for interior permanent magnet synchronous machine based on variable exponential reaching law
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Huawei Zhou; Xuhui Wen; Jian Zhang; Feng Zhao; Kong Liang
Year: 2010
Optimum design criteria for maximum torque density & minimum torque ripple of Flux Switching Motor using response surface methodology
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Jung Ho Lee; Tae Hoon Lee; Seung Chul Lee
Year: 2010
Analytical nonlinear model for permanent magnet synchronous machine incorporating saturation saliencies
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Yi Wang; Jianguo Zhu; Shuhong Wang; Youguang Guo; Yongjian Li; Wei Xu
Year: 2010
Calculation of cogging torque in squirrel-cage induction motors
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Wang Xun; Qiu Ariu
Year: 2010
Research on induction motor energy saving strategy using voltage regulation control
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Peihua Hao; Ming Cheng; Ruiwu Cao; Yubin Wang; Zheng Wang
Year: 2010
Characteristics of the evaporative cooling technology for the large turbine generator and its analysis
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Gu Guo Biao; Guo Jian Hong; Fu De Ping; Li Zhen Guo; Xiong Bin; Dong Hai Hong; Yuan Jianhua; Huang Deshu
Year: 2010
The field excitation adjustment characteristic of the parallel magnetic circuit hybrid excitation machine
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Kong Liang; Wen Xuhui; Fan Tao; Zhu Lei
Year: 2010
Improved auto-tuning for wide input voltage range digital control buck-boost DC-DC converter
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Babasaki, T.; Ishibashi, T.; Sakemi, J.; Kurokawa, F.
Year: 2010
Cascaded H-bridge multilevel inverter using trinary dc sources
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Cheol-soon Kwon; Won-kyun Choi; Un-Taek Hong; Seok-Hwan Hyun; Feel-soon Kang
Year: 2010
Three-phase Z-source hybrid active power filter system
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Seung-Yeol Oh; Young-Gook Jung; Young-Cheol Lim; Dea-Kyong Kim; Sung-Geun Song
Year: 2010
Derivative three-level boost converter cascaded with KY converter
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Hwu, K.I.; Chun-Chen Lin; Jenn-Jong Shieh
Year: 2010
Design and testing of full-scale 10 kV prototype of inductive fault current limiter with a common core and trifilar windings
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Cvoric, D.; de Haan, S.W.H.; Ferreira, J.A.; van Riet, M.; Bozelie, J.
Year: 2010
Mesh generation of FEM by ANN on iron — Core transformer
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Srasuay, K.; Chumthong, A.; Ruangsinchaiwanich, S.
Year: 2010
Development of electric vehicle using position sensorless controlled switched reluctance motor
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Momma, N.; Miki, I.
Year: 2010
Design and analysis of a novel wind-power permanent magnet generator with Opposite-rotation dual rotors
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Fengge Zhang; Yuge Gao; Jinhua Chen
Year: 2010
Optimal operation for diesel generators in small isolated island power system cosidering controllable load
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Asato, B.; Uchida, K.; Goya, T.; Senjyu, T.; Yona, A.; Urasaki, N.
Year: 2010
The new intelligent power modules with Reverse conducting IGBTs and SOI driver for low power motor drives
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Junho Song; Junbae Lee; Daewoong Chung; Wolfgang, F.
Year: 2010
Predictive torque control of permanent magnet synchronous motor drive with reduced switching frequency
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Yongchang Zhang; Jianguo Zhu; Wei Xu
Year: 2010
Classification of capacitive type converter topologies for SRM
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Jianing Liang; Guoqing Xu; Dong-Hee Lee; Jin-Woo Ahn
Year: 2010
Application of speed feed-forward compensation in digital voltage regulation for three-stage excitation brushless DC generator
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Wang Weihua; Xiao Xi; Cheng Changming
Year: 2010
A new structure single phase switched reluctance motor for household appliances
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Zhou Guangxu; Ren Lanjie; Ahn Jinwoo
Year: 2010
Wide-speed-range sensorless control of Interior PMSM based on MRAS
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Zhuang Xingming; Wen Xuhui; Zhao Feng; Guo Xinhua; Zhang Peng
Year: 2010
Comparative analysis of different kinds of reluctance brushless doubly-fed machine (RBDFM) parameter calculation using tooth flux method
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Zhao Lu; Huang Shaogang; Li Yaohua; Li Zixin; Zhu Yi-feng
Year: 2010
Research of sensorless control for permanent magnet synchronous motor systems
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Feng Yaojing; Yang Kai
Year: 2010
An improved adaptive sliding mode position control of a linear variable reluctance motor
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Pupadubsin, R.; Chayopitak, N.; Nulek, N.; Kachapornkul, S.; Jitkreeyarn, P.; Somsiri, P.; Tungpimolrut, K.
Year: 2010
Design and fabrication of the slotless winding on flexible printed circuit boards for micro brushless motors
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Guo-Jhih Yan; Jing-Hui Wang; Liang-Yi Hsu; Mi-Ching Tsai
Year: 2010
Investigation of inductance variation with rotor eccentricity for permanent magnet motors
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Po-Wei Huang; Shang-Hsun Mao; Mi-Ching Tsai
Year: 2010
Analysis of one step delay in direct torque control of permanent magnet synchronous motor and its remedies
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Yongchang Zhang; Jianguo Zhu; Wei Xu
Year: 2010
A study of the notch shape optimization for a BLAC motor by using the Response Surface Method and Improved Simplex Method
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Woo-Gyong Yim; Kwang-Ok An; Jang-Ho Seo; Dong-Kyun Woo; Hyun-Kyo Jung
Year: 2010
Reduction eddy current loss design and analysis of in-wheel type vehicle traction motor
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Seung-Hee Chai; Byeong-Hwa Lee; Jeong-Jong Lee; Jung-Pyo Hong
Year: 2010
Design of electromagnetic force driving actuator (EMFA) and linkage for molded case circuit breaker
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Seungki Hong; Byung-Jun Bae; Dong-Jin Cho; Hyun-Kyo Jung
Year: 2010


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