List of 2010 ICDL committee members
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Year: 2010
List of reviewers
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Year: 2010
Letter from the conference chairs
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Year: 2010
A voting scheme to improve the secondary structure prediction
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Taheri, J.; Zomaya, A.Y.
Year: 2010
A Multi Start Great Deluge metaheuristic for engineering design problems
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Dhouib, S.
Year: 2010
A model for analyzing architectural attributes
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Derbel, I.; Labed Jilani, L.; Mili, A.
Year: 2010
RBT-Km: K-Means clustering for Multiple Sequence Alignment
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Taheri, J.; Zomaya, A.Y.
Year: 2010
Evaluation of WiMAX QoS in a developing country's environment
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Sedoyeka, E.; Hunaiti, Z.; Tairo, D.
Year: 2010
From UML/MARTE to RTDT: A model driven based method for scheduling analysis and HW/SW partitioning
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Hadj Kacem, Y.; Mahfoudhi, A.; Tmar, H.; Abid, M.
Year: 2010
An algorithm for Constrained LCS
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Becerra, D.; Soto, W.; Nino, L.; Pinzon, Y.
Year: 2010
Small-worlds clustering applied to documents re-ranking
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Khazri, M.; Tmar, M.; Abid, M.
Year: 2010
Accuracy of morphology-based phylogenetic fossil placement under Maximum Likelihood
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Berger, S.A.; Stamatakis, A.
Year: 2010
Facet-based access control model for View-Oriented Programming
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Adda, M.; Mcheick, H.
Year: 2010
A component and aspect-based platform for simulating Real-Time Databases
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Baccouche, L.; Limam, S.
Year: 2010
Design of a library of motion functions for a Humanoid robot for a football game
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Al-Mouhamed, M.A.; Abu-Arafah, A.
Year: 2010
Towards an automated tool for computing loop functions
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Jilani, L.L.; Mraihi, O.; Louhichi, A.; Mili, A.
Year: 2010
Event-based adaptation policies for Fractal components
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Dormoy, J.; Kouchnarenko, O.
Year: 2010
Towards a parameterizable cycle-accurate ISS in ArchC
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Bechara, C.; Ventroux, N.; Etiemble, D.
Year: 2010
A new design of dynamic S-Box based on two chaotic maps
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Zaïbi, G.; Peyrard, F.; Kachouri, A.; Fournier-Prunaret, D.; Samet, M.
Year: 2010
Generate secure mobile agent by using SMS to protect Hosts
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Ahmed, T.M.
Year: 2010
Aspect oriented Modeling of Real-Time system with UML and MARTE
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Machta, N.; Bennani, M.T.; Ben Ahmed, S.
Year: 2010
Implementation of a DNA-based anomaly identification system utilizing associative string processor (ASP)
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Trabelsi, Z.; Hamdy, R.
Year: 2010
QLT: A flow control strategy for wormhole network-on-chip
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Minghua Tang; Xiaola Lin
Year: 2010
A design approach for numerical libraries in large scale distributed systems
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Emad, N.; Delannoy, O.; Dandouna, M.
Year: 2010
3D building modeling based on 3D line grouping using centroid neural network
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Dong-Min Woo; Hai-Nguyen Ho; Dong-Chul Park
Year: 2010
Agents' Coordination in Ad-hoc Networks
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Mir, U.; Aknine, S.; Merghem-Boulahia, L.; Gaïti, D.
Year: 2010
Freshness-aware metadata management: Performance evaluation with SWN models
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Diallo, O.; Sene, M.; Sarr, I.
Year: 2010
A hybrid genetic algorithm for Golomb ruler problem
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Ayari, N.; Thé Van Luong; Jemai, A.
Year: 2010
Design and experimental validation of a sound source model for engine of vehicles
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Redel-Macias, M.D.; Cubero-Atienza, A.J.; Berckmans, D.
Year: 2010
Design of codebook using Centroid Neural Network with state dependence measure
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Dong-Chul Park
Year: 2010
Performance analysis of real-time rewriting models
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Ben Hassan, J.; Hasan, O.; Sadani, T.; Tahar, S.
Year: 2010
Refinements of Longest Common Subsequence algorithm
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Elhadi, M.; Al-Tobi, A.
Year: 2010
On proving languages non-regular
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Chedid, F.B.
Year: 2010
3D object modeling using multi-mother wavelet network
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Othmani, M.; Bellil, W.; Ben Amar, C.; Alimi, A.M.
Year: 2010
Efficient sender authentication and signing of multicast streams over lossy channels
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Eltaief, H.; Youssef, H.
Year: 2010
Graph Coloring for class scheduling
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Dandashi, A.; Al-Mouhamed, M.
Year: 2010
A possibilistic classification approach to handle continuous data
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Bounhas, M.; Mellouli, K.
Year: 2010
Towards a formal framework for developing concurrent programs: Modeling dynamic behavior
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Haghighi, H.
Year: 2010
Sophistication and logical depth revisited
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Chedid, F.B.
Year: 2010
A bind RGB color image watermarking based on singular value decomposition
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Goléa, N.E.-H.; Seghir, R.; Benzid, R.
Year: 2010
Real-time execution models for co-simulation
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Faure, C.; Pernet, N.
Year: 2010
Application of Pruned Bilinear Recurrent Neural Network to load prediction
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Jae-Young Kim; Dong-Chul Park; Dong-Min Woo
Year: 2010
An approach of faults estimation in Takagi-Sugeno fuzzy systems
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Khedher, A.; Benothman, K.; Maquin, D.; Benrejeb, M.
Year: 2010
Image classification using Partitioned-Feature based Classifier model
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Dong-Chul Park
Year: 2010
A new approach for minimizing buffer capacities with throughput constraint for embedded system design
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Benazouz, M.; Marchetti, O.; Munier-Kordon, A.; Urard, P.
Year: 2010
Evolutionary placement of short sequence reads on multi-core architectures
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Stamatakis, A.; Komornik, Z.; Berger, S.A.
Year: 2010
Adaptive audio-aware scheduling in Xen virtual environment
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Huacai Chen; Hai Jin; Kan Hu; Minhao Yuan
Year: 2010
Control for continuous-time Markovian Jumps Linear Systems associated with a finite number of jump times
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Nespoli, C.
Year: 2010
Adaptive particle swarm for solving the Dynamic Vehicle Routing Problem
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Khouadjia, M.R.; Jourdan, L.; Talbi, E.
Year: 2010
Performance evaluation of Independent Component Analysis in an iris recognition system
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Bouraoui, I.; Chitroub, S.; Bouridane, A.
Year: 2010
The open Capacitated Arc Routing Problem: Complexity and algorithms
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:França, P.M.; Usberti, F.L.; Morelato, A.L.
Year: 2010
Comparison of neighborhoods for the HFF-AVRP
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Marmion, M.-E.; Humeau, J.; Jourdan, L.; Dhaenens, C.
Year: 2010
Decentralized resource management using a borrowing schema
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Batouma, N.; Sourrouille, J.-L.
Year: 2010
Scalable co-scheduling strategies in distributed computing
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Toporkov, V.V.; Yemelyanov, D.; Toporkova, A.; Tselishchev, A.
Year: 2010
Recovering business process diagrams from UML diagrams
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Leonardi, M.C.; Mauco, M.V.; Felice, L.; Montejano, G.; Riesco, D.; Debnath, N.
Year: 2010
A parallel version of the Branch & Prune algorithm for the Molecular Distance Geometry Problem
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Mucherino, A.; Lavor, C.; Liberti, L.; Talbi, E.-G.
Year: 2010
The limitations of genetic algorithms in software testing
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Aljahdali, S.H.; Ghiduk, A.S.; El-Telbany, M.
Year: 2010
Software effort estimation by tuning COOCMO model parameters using differential evolution
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Aljahdali, S.; Sheta, A.F.
Year: 2010
Optimization of the Business Process metrics definition according to the BPDM standard and its formal definition in OCL
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Debnath, N.; Salgado, C.; Peralta, M.; Riesco, D.; Montejano, G.
Year: 2010
For more understandable UML diagrams
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Boukhelfa, K.; Belala, F.; Choutri, A.; Douibi, H.
Year: 2010
Characteristics of assembled bursts in OBS network under correlated input traffic
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Chakraborty, G.; Choudhury, S.; Debnath, N.C.
Year: 2010
Implementation of Donald elliptic projection for VH coordinates and calculation of air mileage
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Patil, P.D.; Gongzhu Hu; Murthy, S.N.J.
Year: 2010
OLAP umbrella: Visualization model for multidimensional databases
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Bhowmik, T.; Sarkar, A.; Debnath, N.C.
Year: 2010
Management scheme for intelligent terminals for the information super-highways
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:El-Gendy, H.; Ibrahim, O.; ElKadhi, N.; Debnath, N.
Year: 2010
Towards ISO interface protocol for interactive multimedia intelligent terminals
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:El-Gendy, H.
Year: 2010
An efficient source authentication scheme in wireless sensor networks
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Ben Jaballah, W.; Meddeb, A.; Youssef, H.
Year: 2010
Tracking human face features in thermal images for respiration monitoring
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:AL-Khalidi, F.Q.; Saatchi, R.; Burke, D.; Elphick, H.
Year: 2010
A lightweight user authentication scheme for Wireless Sensor Networks
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Cheikhrouhou, O.; Koubâa, A.; Boujelben, M.; Abid, M.
Year: 2010
A cluster based secure architecture for vehicular ad hoc networks
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Gazdar, T.; Belghith, A.; Benslimane, A.
Year: 2010
802.15.4, a MAC layer solution for PLC
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Chauvenet, C.; Tourancheau, B.; Genon-Catalot, D.
Year: 2010
Asynchronous locally self adjusted routing protocol for mobile multi hop ad hoc networks
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Abid, M.A.; Belghith, A.
Year: 2010
A cooperative infrastructure discovery protocol for vehicle to Internet opportunistic communications
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Mejri, N.; Filali, F.; Kamoun, F.
Year: 2010
Autonomic architecture for wireless routing protocols
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Ben Arbia, A.; Youssef, H.
Year: 2010
Forecasting stock exchange using soft computing techniques
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Rahamneh, Z.; Reyalat, M.; Sheta, A.; Aljahdali, S.
Year: 2010
A testbed for the evaluation of link quality estimators in wireless sensor networks
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Baccour, N.; Ben Jamâa, M.; do Rosário, D.; Koubâa, A.; Youssef, H.; Alves, M.; Becker, L.B.
Year: 2010
A dynamic barriers implementation in Bayesian-based bow tie diagrams for risk analysis
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Badreddine, A.; Ben Amor, N.
Year: 2010
Improving QoS for BE traffics in WIMAX networks
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Mokdad, L.; Ben-Othman, J.; Ould Cheikh, M.
Year: 2010
Raising information system effectiveness through Webservices
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Mahfoudhi, S.; Faiz, R.
Year: 2010
Parallelization of the dynamic programming algorithm for solving the longest common subsequence problem
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Ben Mabrouk, B.; Hasni, H.; Mahjoub, Z.
Year: 2010
Text thematic fragmentation and identification
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Mahmoudi, K.; Faiz, S.
Year: 2010
IK-BKM: An incremental clustering approach based on intra-cluster distance
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Ben Hariz, S.; Elouedi, Z.
Year: 2010
On the impact of irregular radio propagation on coverage control and sleep scheduling in wireless sensor networks
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Bellazreg, R.; Hamdi, M.; Boudriga, N.
Year: 2010
Optimizing area coverage in Wireless Sensor Networks
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Essaddi, N.; Hamdi, M.; Habib, S.; Boudriga, N.
Year: 2010
Towards a multi-agent based architecture to simulate the reality of a stock exchange market
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Mellouli, S.; Bouslama, F.
Year: 2010
A comparison study on children reading stories from e-books and from traditional books
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Tingari, W.M.; Osman, I.M.; Yahia, M.E.
Year: 2010
An overview of search methodologies in Semantic Web
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Slimani, T.; Ben Yaghlane, B.
Year: 2010
Event extraction approach for Web 2.0
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Elkhlifi, A.; Faiz, R.
Year: 2010
Pre-learning from mobile professionals' Trajectory
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Oueslati, W.; Akaichi, J.
Year: 2010
A layered cluster based routing for an ad hoc environment
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Jemili, I.; Belghith, A.; Mosbah, M.
Year: 2010
Predictive dynamic resource reservation for vertical handoff optimization in 4G mobile wireless networks
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Trabelsi, S.; Boudriga, N.
Year: 2010
Web-based recruiting
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Amdouni, S.; Ben Abdessalem Karaa, W.
Year: 2010
A GPU-based iterated tabu search for solving the quadratic 3-dimensional assignment problem
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Thé Van Luong; Loukil, L.; Melab, N.; Talbi, E.-G.
Year: 2010
Exploiting grid computation for solving the Vehicle Routing Problem
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Lecron, F.; Manneback, P.; Tuyttens, D.
Year: 2010
A Record to Record Travel metaheuristic to minimize total dispersion in food industry
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Dhouib, S.; Ben Aissa, M.; Chabchoub, H.
Year: 2010
Towards a decentralized architecture for information dissemination in Inter-Vehicles Networks
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Dar, K.; Bakhouya, M.; Gaber, J.; Wack, M.
Year: 2010
Disassembly scheduling of complex products using parallel heuristic approaches
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Adenso-Diaz, B.; Carbajal, S.; Lozano, S.
Year: 2010
The genus of the complete multipartite graph and the complete multi-layered graph
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Bettayeb, S.; Nguyen, Q.T.
Year: 2010
Architecture conformance checking of multi-language applications
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Rahimi, R.; Khosravi, R.
Year: 2010
An optimized filter for finding multiple repeats in DNA sequences
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Federico, M.; Peterlongo, P.; Pisanti, N.
Year: 2010
Detecting type errors and secure coding in C/C++ applications
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Mcheick, H.; Dhiab, H.; Dbouk, M.; Mcheik, R.
Year: 2010
A trust communication with SIP protocol
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:El Sawda, S.; Urien, P.; El Sawda, R.
Year: 2010
Some side effects of FHSS on Bluetooth networks distributed algorithms
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Jedda, A.; Jourdan, G.-V.; Zaguia, N.
Year: 2010
An improved genetic algorithm for efficient scheduling on distributed memory parallel systems
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Pecero, J.E.; Bouvry, P.
Year: 2010
Evaluations of the strong ground motion parameter by neural computing and microtremor measurement
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Kerh, T.; Tienchi Ku; Gunaratnam, D.
Year: 2010
State of art and practice of COTS components search engines
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Yanes, N.; Ben Sassi, S.; Ben Ghezala, H.H.
Year: 2010
Managing conversational streams by explorative mind-maps
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Poray, J.; Schommer, C.
Year: 2010
An agent-based approach for vertical handover in heterogeneous wireless networks
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Ahmed, A.; Amoud, R.; Merghem-Boulahia, L.; Gaiti, D.
Year: 2010
Feedback architecture for multimedia systems
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Alaya, B.; Duvallet, C.; Sadeg, B.
Year: 2010
A multi-agent based decision mechanism for incident reaction in telecommunication network
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Bonhomme, C.; Feltus, C.; Khadraoui, D.
Year: 2010
Path computation with multiple constraints QoS in multi-domain
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Amari, W.; Gadhgadhi, R.; Ben Letaifa, A.; Tabbane, S.
Year: 2010
A novel Geocast technique with hole detection in underwater sensor networks
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Dhurandher, S.K.; Obaidat, M.S.; Gupta, M.
Year: 2010
Classifying bags of keypoints using HMMs
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Zaklouta, F.; Stanciulescu, B.
Year: 2010
A component based testing technique for a MANET routing protocol
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Zaidi, F.; Lallali, M.; Maag, S.
Year: 2010
Data analyzer based on data mining for Honeypot Router
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Ghourabi, A.; Abbes, T.; Bouhoula, A.
Year: 2010
Empirical performance evaluation of a fast authentication scheme in wireless access networks
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Hassan, J.A.; Landfeldt, B.
Year: 2010
A hybrid performance modeling approach for adaptive algorithm selection on hierarchical clusters
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Nasri, W.; Achour, S.
Year: 2010
Predictive multi-hop stable routing in Vehicular Ad Hoc Networks
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Dhurandher, S.K.; Obaidat, M.S.; Jindal, P.; Chavli, R.; Valecha, S.
Year: 2010
A more efficient MOPSO for optimization
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Elloumi, W.; Alimi, A.M.
Year: 2010
A framework for real time communication in sensor networks
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Aalsalem, M.Y.; Taheri, J.; Zomaya, A.Y.
Year: 2010
Wireless multimedia sensor and actuator system: A necessary public security and safety testbed for an urban emergency preparedness class of applications
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Boukerche, A.
Year: 2010
Advances in e-Infrastructures for computational sciences and engineering
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Gentzsch, W.
Year: 2010
AICSSA 2010 - organizing committee
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Year: 2010
Cloud Computing - an IT paradigm changer
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Yousif, M.
Year: 2010
Copyright page
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Year: 2010
Front
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Year: 2010
MEMS based polymeric drug delivery system
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Ashraf, M.W.; Tayyaba, S.; Afzulpurkar, N.
Year: 2010
Web register control algorithm for roll-to-roll system based printed electronics
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Choi, K.H.; Tran, T.T.; Ganeshthangaraj, P.; Lee, K.H.; Nguyen, M.N.; Jo, J.D.; Kim, D.S.
Year: 2010
Presentation, force estimation and control of an instrumented platform dedicated to automated micromanipulation tasks
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Rakotondrabe, M.; Clévy, C.; Rabenorosoa, K.; Ncir, K.
Year: 2010
Hybrid micro assembly of microchips on segmented patterns
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Bo Chang; Jääskeläinen, M.; Quan Zhou
Year: 2010
Modeling and analysis of hospital emergency department: An analytical framework and problem formulation
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Jingshan Li; Howard, P.K.
Year: 2010
Model order selection criterion with application to physical systems
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Doraiswami, R.; Cheded, L.; Khalid, H.M.
Year: 2010
Virtual Launch & Validation of Manufacturing Automation Controls
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Barajas, L.G.; Biller, S.R.; Fangming Gu; Chengyin Yuan
Year: 2010
Self organizing fuzzy control of pneumatic artificial muscle for active orthotic device
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Chandrapal, M.; XiaoQi Chen; Wenhui Wang
Year: 2010
Review on planning and automation technologies for distributed generation systems
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Tongdan Jin; Jimenez, J.A.
Year: 2010
A mathematical programming for predicting molecular formulas in accurate mass spectrometry
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Kumar, S.; Kumar, M.; Stoll, R.; Thurow, K.
Year: 2010
Diagnosis using labeled Petri nets: Faults may either be silent or undistinguishable events
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Cabasino, M.P.; Giua, A.; Seatzu, C.
Year: 2010
Optimal motion control of magnetically levitated microrobot
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Mehrtash, M.; Khamesee, M.B.
Year: 2010
Aggregated state dynamic programming for operating theater planning
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Ya Liu; Chengbin Chu; Kanliang Wang
Year: 2010
Structural and microfluidic analysis of MEMS based out-of-plane hollow silicon microneedle array for drug delivery
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Ashraf, M.W.; Tayyaba, S.; Afzulpurkar, N.; Nisar, A.; Bohez, E.L.; Tuantranont, A.
Year: 2010
Automation component architecture for the efficient development of industrial automation systems
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Hametner, R.; Zoitl, A.; Semo, M.
Year: 2010
Experimental study of Magnetic Resonance Imaging examination reservation process for stroke patients
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Na Geng; Augusto, V.; Xiaolan Xie; Zhibin Jiang
Year: 2010
Adaptive fuzzy logic motion and posture control of inverted pendulums with unstructured uncertainties
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Chaoui, H.; Sicard, P.
Year: 2010
Automated nanorobotic handling of bio- and nano-materials
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Fatikow, S.; Eichhorn, V.; Jasper, D.; Weigel-Jech, M.; Niewiera, F.; Krohs, F.
Year: 2010
Characterization of micro forces in pushing flat micro-sized objects
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Shahini, M.; Melek, W.W.; Yeow, J.T.W.
Year: 2010
Residual life prediction for systems subject to condition monitoring
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Rui Jiang; Kim, M.J.; Makis, V.
Year: 2010
Dwell-time approach to stability analysis for hybrid control systems: Application to an industrial refrigeration process
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Chaohong Cai; Mijanovic, S.
Year: 2010
Scheduling the internal operations in distribution centers with buffer constraints
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Fanti, M.P.; Stecco, G.; Ukovich, W.
Year: 2010
Delaunay-based triangular surface reconstruction from points via Umbrella Facet Matching
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Ji Ma; Hsi-Yung Feng; Lihui Wang
Year: 2010
Integrating advance demand information in supply chain contracts
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Deng Ge; Krishnamurthy, A.
Year: 2010
CAD-based robot programming: The role of Fuzzy-PI force control in unstructured environments
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Neto, Pedro; Mendes, Nuno; Pires, J. Norberto; Moreira, A. Paulo
Year: 2010
A parallel shifting bottleneck heuristic for scheduling complex job shops: Architecture and performance assessment
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Driessel, R.; Hönig, U.; Mönch, L.; Schiffmann, W.
Year: 2010
On-board AUV autonomy through adaptive fins control
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Seto, M.L.; Li, H.
Year: 2010
Automated high-speed nanopositioning inside scanning electron microscopes
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Jasper, D.; Fatikow, S.
Year: 2010
Improving quality in flexible manufacturing systems: A bottleneck transition approach
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Junwen Wang; Jingshan Li; Arinez, J.; Biller, S.
Year: 2010
Comprehensive planning of robotic therapy and assessment of task-oriented functions via improved QFD applicable to hand rehabilitation
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Huang, Y.Y.; Low, K.H.
Year: 2010
Relation matrices for automated MILP modeling of scheduling problems using temporal constraints
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Frohlich, R.; Steneberg, S.C.
Year: 2010
Modified generalized predictive power control for wireless networked systems with random delays
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Cunwu Han; Dehui Sun; Zhijun Li
Year: 2010
An approach to compute similarity between engineering changes
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Mehta, C.; Patil, L.; Dutta, D.
Year: 2010
Wafer-level inspection system for the automated testing of comb drive based MEMS sensors and actuators
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Beyeler, F.; Muntwyler, S.; Nelson, B.J.
Year: 2010
Kanban-controlled exponential production lines: Analysis and design
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Liang Zhang
Year: 2010
Control of continuous-time Markov chains with safety upper bounds
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Shun-Pin Hsu
Year: 2010
Risk-averse outsourcing strategies for optimal intellectual property protection
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Baejin Kim; Hamza, K.; Saitou, K.
Year: 2010
Optimal allocation of carbon credits to emitting agents in a carbon economy
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Arava, R.; Bagchi, D.; Suresh, P.; Narahari, Y.; Subrahmanya, S.V.
Year: 2010
Development of a system for distributed sharing and reuse of design and manufacturing knowledge in the PFMEA domain using a description logics-based ontology
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Mikos, W.L.; Ferreira, J.C.E.; Botura, P.E.A.; Freitas, L.S.
Year: 2010
Relations identification and visualization for sequence planning and automation design
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Bengtsson, K.; Thorstensson, C.; Lennartson, B.; Åkesson, K.; Chengyin Yuan; Miremadi, S.; Falkman, P.
Year: 2010
Finger pad force display for hand haptic interface
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Kawasaki, H.; Koide, S.; Mouri, T.; Endo, T.
Year: 2010
Energy optimization policies for server clusters
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Singh, N.; Rao, S.
Year: 2010
A new packing heuristic based algorithm for Vehicle Routing Problem with Three-dimensional Loading constraints
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Yi Tao; Fan Wang
Year: 2010
A Mixed Logical Dynamic Model Predictive Control approach for handling industrially relevant transportation constraints
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Braun, M.W.; Shear, J.
Year: 2010
Micro-thermal-fluid transient analysis and active control for two-phase microelectronics cooling
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:TieJun Zhang; Wen, J.T.; Peles, Y.; Tao Tong; Je-Young Chang; Prasher, R.; Jensen, M.K.
Year: 2010
Performance evaluation of a multi-product system with setups and dynamic scheduling policies
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Wei Feng; Li Zheng; Na Li
Year: 2010
Petri net-based scheduling of time-constrained dual-arm cluster tools with bounded activity time variation
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:NaiQi Wu; MengChu Zhou
Year: 2010
Scheduling of steel-making and continuous casting system using the surrogate subgradient algorithm for lagrangian relaxation
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Sun, Liangliang; Chai, Tianyou; Luh, Peter B.
Year: 2010
Generative CAD and CAE integration using common data model
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Gujarathi, G.P.; Ma, Y.-S.
Year: 2010
MobComm: Using BDI-agents for the reconfiguration of mobile commissioning robots
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Angerer, S.; Pooley, R.; Aylett, R.
Year: 2010
Deadlock-free control of ratio-enforced automated manufacturing systems with flexible routes and assembly operations
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Hesuan Hu; Mengchu Zhou; Zhiwu Li; Naiqi Wu
Year: 2010
Distributed model predictive control applied to urban traffic networks: Implementation, experimentation, and analysis
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:de Souza, F.A.; Peccin, V.B.; Camponogara, E.
Year: 2010
A hybrid approach for dynamic assembly shop floor layout
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Lihui Wang; Keshavarzmanesh, S.; Hsi-Yung Feng
Year: 2010
Automated vision-based force measurement of moving C. elegans
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Ghanbari, Ali; Nock, Volker; Blaikie, Richard; Chen, XiaoQi; Chase, J. Geoffrey; Wang, Wenhui
Year: 2010
Learning compliance control of robot manipulators in contact with the unknown environment
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Yanan Li; Chenguang Yang; Shuzhi Sam Ge
Year: 2010
Collision avoidance for nonholonomic mobile robots among unpredictable dynamic obstacles including humans
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Lingqi Zeng; Bone, G.M.
Year: 2010
A novel drowsiness detection scheme based on speech analysis with validation using simultaneous EEG recordings
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Dhupati, L.S.; Kar, S.; Rajaguru, A.; Routray, A.
Year: 2010
Hybrid impedance control of a 3-DOF robotic arm used for rehabilitation treatment
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Jingguo Wang; Yangmin Li
Year: 2010
Automated cutting and handling of carbon fiber fabrics in aerospace industries
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Angerer, A.; Ehinger, C.; Hoffmann, A.; Reif, W.; Reinhart, G.; Strasser, G.
Year: 2010
Accelerating shortest path computations in hardware
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Siew-Kei Lam; Srikanthan, T.
Year: 2010
Precise tracking control of a piezoactuated micropositioning stage based on modified Prandtl-Ishlinskii hysteresis model
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Qingsong Xu; Yangmin Li
Year: 2010
A practical approach to the design of maximally permissive liveness-enforcing supervisors for complex resource allocation systems
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Nazeem, A.; Reveliotis, S.
Year: 2010
Anti-windup controller design using gravity compensation for Euler-Lagrange systems with actuator saturation
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Kanamori, Mitsuru
Year: 2010
Virtual production control system
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Haw-Ching Yang; Ying-Liang Chen; Min-Hsiung Hung; Fan-Tien Cheng
Year: 2010
Data reduction and clustering techniques for fault detection and diagnosis in automotives
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Aurobinda Routray; Aparna Rajaguru; Satnam Singh
Year: 2010
Platinum sponsor
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Year: 2010
Conference sponsors and exhibitors
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Year: 2010
Conference information
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Year: 2010
Workshops and tutorials
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Year: 2010
Special sessions
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Year: 2010
Social events
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Year: 2010
Welcome message from the program chair
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Yu Sun
Year: 2010
Conference awards [6 groups of awards]
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Year: 2010
Plenary talks
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Year: 2010
Comm
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Year: 2010
Procomm
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Year: 2010
Welcome message from the general chair
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:John Wen
Year: 2010
Modeling and control of a fast steering mirror in imaging applications
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Nanhu Chen; Potsaid, B.; Wen, J.T.; Barry, S.; Cable, A.
Year: 2010
Failure detection in assembly: Force signature analysis
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Rodriguez, A.; Bourne, D.; Mason, M.; Rossano, G.F.; JianJun Wang
Year: 2010
Developing a practical approach to measuring sustainability for the proceedings of the 2010 IEEE society spring conference
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Thayer, J.; Ervin, D.
Year: 2010
Integrated modeling to enhance resilience in sustainable supply chains
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Badurdeen, F.; Wijekoon, K.; Shuaib, M.; Goldsby, T.J.; Iyengar, D.; Jawahir, I.S.
Year: 2010
Automated four-point probe measurement of nanowires inside a scanning electron microscope
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Changhai Ru; Yong Zhang; Yu Sun; Yu Zhong; Xueliang Sun; Hoyle, D.; Cotton, I.
Year: 2010
Product modeling framework and language for behavior evaluation
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Lee, J.H.; Fenves, S.J.; Bock, C.; Hyo-Won Suh; Rachuri, S.; Fiorentini, X.; Sriram, R.D.
Year: 2010
Longitude force estimation for bandwidth conservative communication and vehicular monitoring
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Jing Yang; Chang, T.N.; Hou, E.; Ansari, N.
Year: 2010
Keyword index
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Year: 2010
Sustainable Manufacturing: Metrics, Standards, and Infrastructure - Workshop summary
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Sudarsan, R.; Sriram, R.D.; Narayanan, A.; Sarkar, P.; Jae Hyun Lee; Lyons, K.W.; Kemmerer, S.J.
Year: 2010
Author index
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Year: 2010
Real-time 3D shape inspection system for manufacturing parts based on three-step stripe pattern
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Jing Xu; Ning Xi; Chi Zhang; Heping Chen
Year: 2010
Integrated system for 3D assembly of bio-scaffolds and cells
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Lang, M.; Wenhui Wang; XiaoQi Chen; Woodfield, T.
Year: 2010
An information gain based adaptive path planning method for an autonomous underwater vehicle using sidescan sonar
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Paull, L.; Saeedi, S.; Li, H.; Myers, V.
Year: 2010
A vision-based, impedance control strategy for industrial robot manipulators
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Bonilla, I.; González-Galván, E.J.; Chávez-Olivares, C.; Mendoza, M.; Loredo-Flores, A.; Reyes, F.; Biao Zhang
Year: 2010
Stochastic optimization of hydro-thermal system with annual water consumption constraints
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Yiping Qi; Xi Chen
Year: 2010
CAD-enhanced workspace optimization for parallel manipulators: A case study
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Shah, H.; Narayanan, M.S.; Krovi, V.N.
Year: 2010
Local planning using switching time optimization
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Johnson, E.R.; Murphey, T.D.
Year: 2010
Durability studies of PBI-based membrane elect rode assemblies for high temperature PEMFCs
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Krishnan, L.; Snelson, T.; Puffer, R.; Walczyk, D.
Year: 2010
Towards performance analysis of wheel loading process in automotive manufacturing
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Heping Chen; Jianjun Wang; Biao Zhang; Zhang, G.; Fuhlbrigge, T.
Year: 2010
Integration of subcontracting activity in a production planning for randomly failing manufacturing system: Feasibility and profitability conditions
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Dahane, M.; Rezg, N.
Year: 2010
Shape sensing by vision-based tactile sensor for dexterous handling of robot hands
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Ito, Yuji; Kim, Youngwoo; Nagai, Chikara; Obinata, Goro
Year: 2010
Multilevel statistical process control of asynchronous multi-stream processes in semiconductor manufacturing
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Schirru, A.; Pampuri, S.; De Nicolao, G.
Year: 2010
Development of a flexible test platform for household appliance testing based on mobile agents
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Cesetti, A.; Scotti, C.P.; Di Buò, G.; Angione, G.; Lattanzi, L.; Cristalli, C.; Longhi, S.
Year: 2010
A MILP-based batch scheduling for two-stage hybrid flowshop with sequence-dependent setups in semiconductor assembly and test manufacturing
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Xiao Jing; Zheng Li
Year: 2010
Particle filtering of hidden Gamma processes for robust Predictive Maintenance in semiconductor manufacturing
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Schirru, A.; Pampuri, S.; De Nicolao, G.
Year: 2010
Trends and opportunities for robotic automation of trim & final assembly in the automotive industry
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Sang Choi; Eakins, W.J.; Fuhlbrigge, T.A.
Year: 2010
Improving motion of robotic manipulators by an embedded optimizer
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Hao Ding; Schnattinger, G.; Passenberg, B.; Stursberg, O.
Year: 2010
Analysis of circular cluster tools: Transient behavior and semiconductor equipment models
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Younghun Ahn; Morrison, J.R.
Year: 2010
A practical implementation of distributed system control over an asynchronous Ethernet network using time stamped data
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Anand, D.M.; Fletcher, J.G.; Li-Baboud, Y.; Moyne, J.
Year: 2010
Thermal analysis of an HVAC system with TRV controlled hydronic radiator
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Tahersima, F.; Stoustrup, J.; Rasmussen, H.; Gammeljord Nielsen, P.
Year: 2010
Automatic generation of controllers for collision-free flexible manufacturing systems
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Shoaei, M.R.; Lennartson, B.; Miremadi, S.
Year: 2010
Development of an automatic virtual metrology framework for TFT-LCD industry
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Min-Hsiung Hung; Hsien-Cheng Huang; Haw-Ching Yang; Fan-Tien Cheng
Year: 2010
Multi-objective optimization for kinematic reconfiguration of mobile robots
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Freitas, G.; Gleizer, G.; Lizarralde, F.; Liu Hsu
Year: 2010
Utility-based dynamic control of batch processing systems
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Hongsuk Park; Banerjee, A.
Year: 2010
On-line target-motion prediction for autonomous multirobot search in realistic terrains with time-expanding boundaries: A novel probabilistic approach
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Macwan, A.; Nejat, G.; Benhabib, B.
Year: 2010
Manipulator inverse dynamics computation on FPGA for reconfigurable applications
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Chun-Shin Lin; Alapati, P.K.; Hyongsuk Kim
Year: 2010
Singularity-free workspace design for the translational 3-UPU parallel robot
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Yawei Yang; O'Brien, J.F.
Year: 2010
An open scheduling architecture for cluster tools
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Jun-Ho Lee; Tae-Eog Lee
Year: 2010
Automation challenges and opportunities for high volume manufacture of proton exchange membrane fuel cell stacks
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Raymond H. Puffer
Year: 2010
An active light sensory system for 3D mapping of unknown cluttered environments
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Mobedi, B.; Nejat, G.
Year: 2010
A model-based end-to-end toolchain for the probabilistic analysis of complex systems
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Pinto, A.; Krishnamurthy, S.; Kannan, S.
Year: 2010
Nanomanipulation of single virus using Dielectrophoretic concentration on a microfluidic chip
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Maruyama, H.; Kotani, K.; Honda, A.; Takahata, T.; Arai, F.
Year: 2010
Robotic laboratory automation platform based on mobile agents for flexible clinical tests
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Choi, Byung June; You, Won Suk; Shin, Seung Hoon; Moon, Hyungpil; Koo, Ja Choon; Chung, Wankyun; Choi, Hyouk Ryeol
Year: 2010
Precision-based robot path planning for microassembly
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Das, A.N.; Popa, D.O.
Year: 2010
A distributed hybrid sliding mode control system for a class of nonlinear mechanical systems
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Islam, S.; Liu, P.X.
Year: 2010
Performance evaluation of deterministic flow lines: Redundant modules and application to semiconductor manufacturing equipment
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Kyungsu Park; Morrison, J.R.
Year: 2010
Event-based fault detection of manufacturing cell: Data inconsistencies between academic assumptions and industry practice
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Allen, L.V.; Tilbury, D.M.
Year: 2010
A hierarchical reinforcement learning based control architecture for semi-autonomous rescue robots in cluttered environments
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Doroodgar, B.; Nejat, G.
Year: 2010
A Quality Framework to check the applicability of engineering and statistical assumptions for automated gauges
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Bering, T.P.K.; Veldhuis, S.C.
Year: 2010
A real-time visual action-recognition framework for time-varying-geometry objects
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Mackay, M.; Fenton, R.G.; Benhabib, B.
Year: 2010
A modular and hierarchical meta-model for the control design of manufacturing systems
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Ferrarini, L.; Dedè, A.
Year: 2010
Detection and tracking of low contrast human sperm tail
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Clement Leung; Zhe Lu; Navid Esfandiari; Robert F. Casper; Yu Sun
Year: 2010
Integrated management of cooling resources in air-cooled data centers
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Zhikui Wang; Bash, C.; Hoover, C.; McReynolds, A.; Felix, C.; Shih, R.
Year: 2010
Optimal control of bio-attack induced infectious disease dynamics: The case of anthrax
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Qing Hui
Year: 2010
Geometric integration of impact during an orbital docking procedure
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Gibson, C.; Murphey, T.D.
Year: 2010
Global Kinematic Model generation for n-DOF reconfigurable machinery structure
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Djuric, A.M.; Al Saidi, R.; ElMaraghy, W.
Year: 2010
Sensor configuration selection for discrete-event systems under unreliable observations
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Wen-Chiao Lin; Tae-Sic Yoo; Garcia, H.E.
Year: 2010
Towards the automation of water quality monitoring networks
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Copp, J.B.; Belia, E.; Hubner, C.; Thron, M.; Vanrolleghem, P.; Rieger, L.
Year: 2010
Patients assignment for an oncology outpatient unit
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Sadki, A.; Xie, X.; Chauvin, F.
Year: 2010
Automated surface deformations detection and marking on automotive body panels
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Borsu, V.; Yogeswaran, A.; Payeur, P.
Year: 2010
Towards virtual instruments for cardiovascular healthcare: Real-time modeling of cardiovascular dynamics using ECG signals
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Le, T.Q.; Bukkapatnam, S.T.S.; Sangasoongsong, A.; Komanduri, R.
Year: 2010
Model-based design automation and process automation in titanium sheet metal manufacturing
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Saunders, G.; Jensen, M.K.; Maguire, J.; O'Connor, C.; Munoz, M.
Year: 2010
Coverage based tool path planning for automated polishing using contact stress theory
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Rososhansky, M.; Fengfeng Xi; Yuwen Li
Year: 2010
Symbolic approach to nonblocking and safe control of Extended Finite Automata
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Ouedraogo, L.; Kumar, R.; Malik, R.; Akesson, K.
Year: 2010
Micro-mixing of highly viscous bio-samples observed with a miniature wireless video sensor
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Liang Yuan; Zheng, Y.F.
Year: 2010
An integrated control of shading blinds, natural ventilation, and HVAC systems for energy saving and human comfort
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Biao Sun; Luh, P.B.; Qing-Shan Jia; Ziyan Jiang; Fulin Wang; Chen Song
Year: 2010
Optimal design of a decoupled multiple-loop pallet system for cyclic flexible manufacturing plants
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Mashaei, M.; Lennartson, B.; Sannehed, F.; Abbestam, G.
Year: 2010
A framework for stepwise life cycle assessment during product design with case-based reasoning
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Myeon-Gyu Jeong; Hyo-Won Suh; Morrison, J.R.
Year: 2010
Design of an experimental platform for an X-by-wire car with four-wheel steering
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Martin Eder; Alois Knoll
Year: 2010
Scheduling inpatient admission under high demand of emergency patients
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Mazier, A.; Xiaolan Xie; Sarazin, M.
Year: 2010
Embedding detailed robot energy optimization into high-level scheduling
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Vergnano, A.; Thorstensson, C.; Lennartson, B.; Falkman, P.; Pellicciari, M.; Chengyin Yuan; Biller, S.; Leali, F.
Year: 2010
Image-based automated chemical database annotation with ensemble of machine-vision classifiers
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Jungkap Park; Saitou, K.; Rosania, G.
Year: 2010
Active control of adhesion force for pick-and-place of micro objects with compound vibration in micromanipulation
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Liguo Chen; Tao Chen; Lining Sun; Weibin Rong; Bing Shao; Qing Yang
Year: 2010
On gradient estimation of scheduling for multi-cluster tools with general robot moving times
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Chan, W.K.V.; Roeder, T.M.
Year: 2010
A model for the strategic design of Distribution Networks
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Costantino, N.; Dotoli, M.; Falagario, M.; Fanti, M.P.; Mangini, A.M.; Sciancalepore, F.; Ukovich, W.
Year: 2010
Cardiac motion analysis of a rat model for myocardial infarction using high-frame-rate stereo images
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Ishii, I.; Okuda, T.; Yuman Nie; Takaki, T.; Orito, K.; Tanaka, A.; Matsuda, H.
Year: 2010
Color image contrast enhancement using a local equalization and weighted sum approach
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Kwok, N.M.; Ha, Q.P.; Fang, G.; Rad, A.B.; Wang, D.
Year: 2010
Vision inspection system for holograms with mixed patterns
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Tae-Hyoung Park; Hyuk-Joong Kwon
Year: 2010
Thermal aspects of a shipboard integrated electric power system
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Holsonback, C.R.; Kiehne, T.M.
Year: 2010
A two-mass cantilever beam model for vibration energy harvesting applications
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Qing Ou; XiaoQi Chen; Gutschmidt, S.; Wood, A.; Leigh, N.
Year: 2010
Dynamic simulation of ship-system thermal load management
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Hewlett, P.T.; Kiehne, T.M.
Year: 2010
Hybrid/electric vehicle battery manufacturing: The state-of-the-art
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Guerrero, C.P.A.; Jingshan Li; Biller, S.; Guoxian Xiao
Year: 2010
Real-time edge detection for automated fibre-mat stitching
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Richtsfeld, M.; Schöffmann, A.; Vincze, M.
Year: 2010
Dynamics analysis and closed-loop control of biological cells in transportation using robotic manipulation system with optical tweezers
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Songyu Hu; Dong Sun; Gang Feng
Year: 2010
Trajectory-based controller design for hybrid systems with affine continuous dynamics
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Julius, A.A.
Year: 2010
Mobile robot path planning based on shuffled frog leaping optimization algorithm
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Hassanzadeh, I.; Madani, K.; Badamchizadeh, M.A.
Year: 2010
A mixture of Gaussians Hidden Markov Model for failure diagnostic and prognostic
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Tobon-Mejia, D.A.; Medjaher, K.; Zerhouni, N.; Tripot, G.
Year: 2010
An iterative auction mechanism for combinatorial exchanges
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Biswas, S.; Narahari, Y.
Year: 2010
Application of 6-DOF sensing for robotic disturbance compensation
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Kleinigger, M.; Rock, S.
Year: 2010
Exact algorithms for non-overlapping 2-frame problem with non-partial coverage for networked robotic cameras
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Yiliang Xu; Dezhen Song; Jingang Yi
Year: 2010
Vehicle interference effects in warehousing systems with autonomous vehicles
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Roy, D.; Krishnamurthy, A.; Heragu, S.; Malmborg, C.
Year: 2010
Directed motion of an atomic scale engine and stability analysis
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Yi Guo; Wenlin Zhang; Zheng Wang
Year: 2010
Wofs: A Distributed Network File System Supporting Fast Data Insertion and Truncation
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Cheng-Chia Wang; Yarsun Hsu
Year: 2010
BabuDB: Fast and Efficient File System Metadata Storage
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Stender, J.; Kolbeck, B.; Högqvist, M.; Hupfeld, F.
Year: 2010
ZBD: Using Transparent Compression at the Block Level to Increase Storage Space Efficiency
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Makatos, T.; Klonatos, Y.; Marazakis, M.; Flouris, M.D.; Bilas, A.
Year: 2010
Parallel Reed/Solomon Coding on Multicore Processors
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Sobe, P.
Year: 2010
XCo: Explicit Coordination for Preventing Congestion in Data Center Ethernet
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Rajanna, V.S.; Shah, S.; Jahagirdar, A.; Gopalan, K.
Year: 2010
Author index
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Year: 2010
Publisher's Information
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Year: 2010
Title Page i
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Year: 2010
Title Page iii
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Year: 2010
Message from the Conference Chair
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Year: 2010
Program Committee
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Year: 2010
Steering Committee
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Year: 2010
External Reviewers
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Year: 2010
FASTer FTL for Enterprise-Class Flash Memory SSDs
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Sang-Phil Lim; Sang-Won Lee; Bongki Moon
Year: 2010
NAND Flash-Based Disk Cache Using SLC/MLC Combined Flash Memory
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Seongcheol Hong; Dongkun Shin
Year: 2010
hashFS: Applying Hashing to Optimize File Systems for Small File Reads
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Lensing, P.; Meister, D.; Brinkmann, A.
Year: 2010
Enhancing Checkpoint Performance with Staging IO and SSD
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Xiangyong Ouyang; Marcarelli, S.; Panda, D.K.
Year: 2010
Au-Sn co-electroplating solution for flip chip-LED bumps
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Jianling Pan; Mingliang Huang
Year: 2010
Electroless nickel-boron plating on magnesium alloy
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Nanzi Fan; Mingliang Huang; Lai Wang
Year: 2010
Comparative study of interfacial reactions of high-Sn Pb-free solders on (001) Ni single crystal and on polycrystalline Ni
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Huan Liu; Mingliang Huang; Haitao Ma; Yipeng Cui
Year: 2010
Effect of solder volume on interfacial reactions between Sn3.5Ag0.75Cu solder balls and cu pad
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Luwei Liu; Mingliang Huang
Year: 2010
Ultrasonic bondability and antioxidation property of Ti/Cu/Ag metallization on Si substrate
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Yanhong Tian; Ningning Wang; Chunqing Wang; Shaowei Zhao
Year: 2010
Electroplated metallization method for crystalline silicon solar cells
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Jie Gao; Ming Li; Dali Mao
Year: 2010
Effects of dopants on wettability and microstructure evolution of Lead-Free solder joints
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Qiang Chen; Guoyuan Li
Year: 2010
An investigation into copper oxidation behavior
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Wenting Zhao; Jiechen Wu; Anmin Hu; Ming Li; Dali Mao
Year: 2010
Effect of electromigration on the Cu-Ni cross-interaction in line-type Cu/Sn/Ni interconnect
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Leida Chen; Mingliang Huang; Shaoming Zhou; Song Ye
Year: 2010
Effects of bump metallurgies, underfill material and its cure process on package warpage
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Jieping Zhang; Dongwen Gan; Jinlin Wang; Saikumar, J.; Li-Hsin Chang
Year: 2010
Underfill Cure Induced Micro-Anomaly (CIMA) and its mechanism and reliability implications
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Jieping Zhang; Hsu, M.; Jayaraman, S.
Year: 2010
Study on the reliability of high power device assemblies using high-Pb solder alternatives: an overview
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Caers, J.F.J.M.; Zhao, X.J.; Eggink, H.J.
Year: 2010
Effect of glass transition slope of underfill on solder joint fatigue life
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Zhen Zhang; Park, S.B.; Darbha, K.; Master, R.N.
Year: 2010
Procedure to determine interfacial toughness of EMC-copper (oxide) interfaces
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Xiao, A.; Pape, H.; Schlottig, G.; Wunderle, W.; Leung, Y.Y.; Jansen, K.M.B.; Ernst, L.J.
Year: 2010
Thermal stress characteristics of Cu interconnects using Air-Gap
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Lin Xiao-ling; Hou Tong-xian; Zhang Xiao-wen; Yao Ruo-he
Year: 2010
Impact of temperature cycling on copper interconnect
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Lin Xiao-ling; Hou Tong-xian; Zhang Xiao-wen; Yao Ruo-he
Year: 2010
Board level validation for green IC packaging with strain-controllable dynamic bending method
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Lee, J.C.-B.; Chi-Ko Yu; Chang, G.; Shao, T.; Chen, C.; Xiang-Kai Meng; Brown, M.
Year: 2010
Temperature effect on IMC growth behavior of thin film copper-aluminum system in electronic packaging
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Xuefei Ming; Yi Zhang
Year: 2010
Effects of ground vias on high-speed signal transmission in high-speed PCB design
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Li Chunquan; Kuang Xiaole
Year: 2010
Packaging of high power semiconductor laser arrays using a novel macro-channel cooler
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Jingwei Wang; Zhenbang Yuan; Lu Guo; Lingling Xiong; Yanxin Zhang; Chenhui Peng; Xiaoning Li; Xingsheng Liu
Year: 2010
Electrical characterization of sidewall insulation layer of TSV
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Xin Sun; Ming Ji; Shenglin Ma; Yunhui Zhu; Wenping Kang; Min Miao; Yufeng Jin
Year: 2010
Co-design for thermal performance and mechanical reliability of flip chip devices
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Siew Hoon Ore; Poh, S.W.E.; Zhu, W.H.; Yuan, W.L.; Suthiwongsunthorn, N.
Year: 2010
Application of WLP with barrier trench structure in precision screen printing technology by glass frit
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Xiao Chen; Pei-li Yan; Jia-jie Tang; Wen-guo Ning; Gao-wei Xu; Le Luo
Year: 2010
A compact system-level simulation method for modern microelectronic packaging
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Shihu Sun; Jing Song; Qing-An Huang
Year: 2010
Property of impedance matching of novel QFP socket contactor by 3D electro-magnetic simulation
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Sung-Mao Wu; Sheng-Wei Guan; Chun-Ting Kuo; Bo-Huei Yu; Chuan-Hau Liu; Xian-Neng Chiou
Year: 2010
Design of Low Loss Beam Forming Networks - supported by numerical simulations and material characterisation
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Sommer, J.; Gunner, C.; Uhlig, P.; Kulke, R.; Michel, B.
Year: 2010
Dry film photo resists and polymers - the low cost option for standard and 3-D wafer level packaging
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Baumgartner, T.; Hauck, K.; Töpper, M.; Manessis, D.; Ehrmann, O.; Lang, K.; Liebsch, W.; Ehlin, M.; Itabashi, T.
Year: 2010
The next generation advanced MEMS& sensor packaging
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Lingen Wang; Bos, A.; van Weelden, T.; Boschman, F.
Year: 2010
Simulation of electric field uniformity in through silicon via filling
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Haiyong Cao; Huiqin Ling; Kaihe Zou; Ming Li; Dali Mao
Year: 2010
Advanced QFN packaging for low cost and solution
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Bill, C.J.; Hu, B.; Lin, M.; Lin, T.; Lee, S.; Yi-Shao Lai; Tseng, A.
Year: 2010
Development of flip-chip interconnections of photodetector readout circuit (ROIC)
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Gaowei Xu; Qiuping Huang; Yuan Yuan; Xiao Chen; Le Luo
Year: 2010
Novel room-temperature fluorine containing plasma activated bonding and its improvements
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Chenxi Wang; Suga, T.
Year: 2010
Analysis of the motion between CNTs and water in CNTs micro channel cooler with molecular simulation
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Wang Jia; Wang Xiaojing; Liu Hongjun; Li Zongshuo
Year: 2010
CMOS wafer bonding for back-side illuminated image sensors fabrication
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Dragoi, V.; Filbert, A.; Zhu, S.; Mittendorfer, G.
Year: 2010
The anti-pyramid distribution in SIP using LTCC technology
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Yingli Liu; Yuanxun Li; Yunsong Xie; Huaiwu Zhang; Daming Chen; Jie Li
Year: 2010
An MCM package process for 24GHz driver amplifier using photosensitive BCB
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Jiajie Tang; Huajiang Wang; Xiao Chen; Wenguo Ning; Gaowei Xu; Xiaowei Sun; Le Luo
Year: 2010
Properties of TiN films deposited by atomic layer deposition for through silicon via applications
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Wenjie Zhang; Jian Cai; Dejun Wang; Qian Wang; Shuidi Wang
Year: 2010
Fabrication of PN junction capacitor using SiP technology on Si-based interposer wafer
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Dai Fengwei; Wang Huijuan; Wang Qidong; Zhou Jing; Gao Wei; Guo Xueping; Cao Liqiang; Wan Lixi
Year: 2010
Author index
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Year: 2010
IEEE 1413: An IEEE standard for reliability predictions
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Elerath, J.G.; Pecht, M.
Year: 2010
Study on properties of low-Ag content Sn-Ag-Zn lead-free solders
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Tingbi Luo; Xi Chen; Jing Hu; Anmin Hu; Ming Li
Year: 2010
2.0mils au wire wedge bonding process characterization to eliminate lift bond on accelerometer device
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Wang ZhiJie; Bai ZhiGang; Lee, B.; Choi, H.S.; Kwang, K.S.
Year: 2010
Thermally induced packaging effect of a distributed MEMS phase shifter
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Cheng Zhao; Jing Song; Qing-An Huang
Year: 2010
Effects of IMC thickness on fracturing of solder joints
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Wang Chunke; Qin Fei; An Tong
Year: 2010
A novel thermal conductivity meter for thermal interface materials in optoelectronic device
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Liao, P.; Hua, Z.K.; Liao, Y.C.; Zhang, J.H.
Year: 2010
Effect of tightening torque on the frequency of the sandwich piezoelectric ceramic transducer vibrator
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Jiaping Qiao; Fuliang Wang
Year: 2010
A fluid dynamic analysis in the chamber and nozzle for a jetting dispenser design
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Jinsong Zhang; Haili Jia; Jianhua Zhang
Year: 2010
Finite element analysis of the transducer vibration in die bonding operations
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Kelly, R.; Jian Gao; Zhi Jun Yang; Xin Chen
Year: 2010
The effect of microvia-in-pads design on SMT defects in ultra-small component assembly
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Yong-Won Lee; Keun-Soo Kim; Suganuma, K.
Year: 2010
Study on automatic angle correction directed by machine vision in power LED dies sorting
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Tao Wu; Longwen Wang; Kanghua Lin
Year: 2010
Statistical method of modeling and optimization for wireless sensor nodes with different interconnect technologies and substrates
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Liqiang Zheng; Mathewson, A.; O'Flynn, B.; Hayes, M.; O'Mathuna, C.
Year: 2010
Design of impedance matching network in organic substrate with embedded capacitor material
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Yunfeng Wang; Yuanjun Liang; Lixi Wan
Year: 2010
Design of a front-end of a Ku-band transceiver based on LTCC technology
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Su Hanzhang; Xing Mengjiang; Li Yuejin; Li Wei
Year: 2010
A miniaturized multi-layer lowpass filter for microwave application
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Zhao Yingbo; Li Yuejin; Xing Mengjiang
Year: 2010
A study of high-density embedded capacitor for silicon-substrate package
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Huijuan Wang; Fengwei Dai; Guidotti, D.; Yao Lv; Liqiang Cao; Lixi Wan
Year: 2010
Preparation and characterization of ultrasonic electrodeposited copper coating
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Ronghong Cui; Yuting He; Zhiming Yu; Wenjun Shu; Jinqiang Du
Year: 2010
Optimization of broadband characterization for pluggable parallel optical transceiver modules on multilayer substrates
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Baoxia Li; Wei Gao; Fengman Liu; Haifei Xiang; Jing Zhou; Jun Li; Zhihua Li; Jian Song; Lixi Wan
Year: 2010
Fabrication of a high density, high aspect ration and flexible metal/polymer mold with flexible polymer material
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Lu Haijing; Ang Xiao Fang; Liu Hongping; Sun Zheng; Wei Jun
Year: 2010
Die bonding of silicon and other materials with active solder
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Cong Peng; Mingxiang Chen; Sheng Liu
Year: 2010
Preparation of nano silver pastes applied in printed electronics
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Xiangyan Chen; Mingfei Sun; Fei Xiao
Year: 2010
Analysis of the phenomenon of falling off of indium bumps from substrate during reflow process
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Qiuping Huang; Dongliang Wang; Gaowei Xu; Yuan Yuan; Quan Wang; Le Luo
Year: 2010
The investigation of high temperature joint generated by low temperature process
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Cai Chen; Lei Zhang; Li Zhang; Lai, C.M.; Kuo, E.; Tan, K.H.
Year: 2010
Dielectric composite material with enhanced thermal conductivity used for electronic packaging
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Hui Yu; Liangliang Li; Kido, T.; Guannan Xi
Year: 2010
Study on the surface modification of silica particle and its filled epoxy resin
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Dayong Gui; Bo Chen; Wentao Zeng; Xin Miao; Guangfu Zeng; Jianhong Liu
Year: 2010
Effect of nano-TiO2 addition on wettability and interfacial reactions of Sn0.7Cu composite solder/Cu solder joints
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Tsao, L.C.; Wang, B.C.; Chang, C.W.; Wu, M.W.
Year: 2010
Effects of adding some elements on solderability of Sn-0.7Ag-0.5Cu solder
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Zhang Hongwu; Sun Fenglian; Liu Yang
Year: 2010
Wire bonding performance and solder joint reliability investigation on ENEPIG finish substrate
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Li Juanjuan; Zhao Zhenqing; Jaisung Lee
Year: 2010
Oxidation study of copper wire bonding
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Xiangquan Fan; Techun Wang; Yuqi Cong; Binhai Zhang; Jiaji Wang
Year: 2010
Replace ball attach by developing substrate solder bumping for 0.5mm pitch FBGA
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Lei Wang; Zhenqing Zhao; Jiangtao Liu; Jaisung Lee
Year: 2010
Effects of BN and SiC nanoparticles on properties of conductive adhesive
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Huaxiang Lai; Xiuzhen Lu; Huiwang Cui; Xiaohua Liu; Si Chen; Tianan Chen; Johan Liu
Year: 2010
Multi-pulse electrodeposition of soft magnetic thin film Co-P for embedded inductor application
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Yanqiu Li; Liangliang Li; Cai, J.
Year: 2010
Reliability characterisation of Bi-modal high temperature stable Isotropic Conductive Adhesives
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Wenkai Tao; Si Chen; Xiaohua Liu; Huiwang Cui; Tianan Chen; Liu, J.
Year: 2010
Properties of Cu-Al intermetallic compounds in copper wire bonding
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Binhai Zhang; Techun Wang; Yuqi Cong; Zhao, M.; Xiangquan Fan; Jiaji Wang
Year: 2010
Failure strength study of silicon die and LCD glass by FEA and experiment
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Hu, B.; Cai, C.; Dongji Xie; Boyi Wu
Year: 2010
Interfacial reaction and melting/solidification characteristics between Sn and different metallizations of Cu, Ag, Ni and Co
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Zhou Min-Bo; Qin Hong-Bo; Ma Xiao; Zhang Xin-Ping
Year: 2010
Effect of 3.0wt. %Bi and 0.05wt. %Cr additions on the microstructure and tensile strength of the Sn3Ag0.5Cu/Cu solder joint
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Yongjiu Han; Fei Lin; Guokui Ju; Xicheng Wei
Year: 2010
Creep behavior investigation of lead-free solder alloy Sn96.5Ag3Cu0.5
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Fulong Zhu; Shao Song; Wei Zhang; Sheng Liu
Year: 2010
New fast curing isotropic conductive adhesive for electronic packaging application
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Wenhui Du; Chune Fu; Si Chen; Huiwang Cui; Xiaohua Liu; Tianan Chen; Liu, J.
Year: 2010
Solder Bump Maker with coining process on TSV chips for 3D packages
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Ki-Jun Sung; Kwang-Seong Choi; Byeong-Ok Lim; Hyun-Cheol Bae; Sun-Woo Choo; Jong-Tae Moon; Yong Hwan Kwon; Eun Soo Nam; Yong-Sung Eom
Year: 2010
Growth kinetics of the intermetallic compounds during the interfacial reactions between Sn3.5Ag0.9Cu-nanoTiO2 alloys and Cu substrate
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Tsao, L.C.; Lo, T.T.; Peng, S.F.
Year: 2010
Effects of Ce addition on properties of Sn-0.3Ag-0.7Cu low-Ag lead-free solder
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Xue Liu; Lifeng Wang; Jia Wang; Ye Lv
Year: 2010
Morphology and growth mechanisms of SAC305-xNi/pad joints intermetallic compounds
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Lifeng Wang; Jia Wang; Xue Liu; Xiaojing Liu
Year: 2010
Orientation relationships among Sn/Cu6Sn5/Cu3Sn/(111)Cu in the eutectic SnBi/(111)Cu solder joint
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Pan-Ju Shang; Zhi-Quan Liu; Douxing Li; Jian-Ku Shang
Year: 2010
Improving the humidity resistance of electronic packaging materials by micro-nano hierarchical structured silica
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Guangfu Zeng; Dayong Gui; Xin Miao; Jingfeng Hao; Jianhong Liu
Year: 2010
Characterization of the creep constitutive behavior of SnAgCu solder in flip chip joints from the indentation creep testing
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Niu Xiaoyan; Shu Xuefeng
Year: 2010
Study on preparation and properties of epoxy resin modified by amine-terminated polyimide as electronic packaging materials
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Xin Miao; Dayong Gui; Guangfu Zeng; Jianhong Liu
Year: 2010
Development of green molding compound for high voltage discrete package
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Guangchao Xie; Jianhua Ruan; Yue Wang; Xinyu Du; Xingming Cheng
Year: 2010
Solid state reaction of Sn3.0Ag0.5Cu solder with Cu(Mn) under bump metallization
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Chien-Fu Tseng; Jenq-Gong Duh; Su-Yueh Tsai
Year: 2010
Green flame retardance of epoxy molding compound for large-scale integrated circuit packaging
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Yang Ming-shan; Liu Jian-wei; Li Lin-kai
Year: 2010
Toughness improvement study of epoxy molding compound
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Wei Tan; Hongjun Liu; Kok-Soo Goh; Hongjie Liu; Xingming Cheng
Year: 2010
A pre-shaped wafer level packing strategy for RF MEMS
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Xiang Li; Zewen Liu; Zheng Wang; Yongqiang Huang; Ling Li
Year: 2010
Delamination study on SOIC L/F with high thermal conductivity die attach paste
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Xingshou Pang; Xu, N.; Sheila, C.; Jinzhong Yao
Year: 2010
A micro in-situ Pirani vacuum gauge for microsystem package applications
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Hua Gan; Yunsong Qiu; Min Miao; Yufeng Jin
Year: 2010
Scaling system performance through packaging and interconnect: A study in networking applications
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Priest, J.
Year: 2010
A simple setup to test thermal contact resistance between interfaces of two contacted solid materials
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Ju Liu; Han Feng; Xiaobing Luo; Run Hu; Sheng Liu
Year: 2010
Wafer Level Camera technology - from wafer level packaging to wafer level integration
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Hongtao Han; Kriman, M.; Boomgarden, M.
Year: 2010
Solder transfer of lead zirconate titanate (PZT) thin films
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Guangbin Dou; Wright, R.; Holmes, A.; Yeatman, E.; Kirby, P.; Qi Zhang
Year: 2010
A finite element simulation of PoP assembly processes
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Chao Ren; Fei Qin; Xuming Wang
Year: 2010
A stress relief method for copper filled through silicon via with parylene on sidewall
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Wenping Kang; Maosheng Zhang; Yunhui Zhu; Shenglin Ma; Min Miao; Yufeng Jin
Year: 2010
Thermo-mechanical reliability analysis of 3D stacked-die packaging with through silicon via
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Zhaohui Chen; Bin Song; XueFang Wang; Sheng Liu
Year: 2010
Effect of protection atmosphere's temperature on morphology of Au-Sn IMCs in laser reflowed micro-solder joints
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Wei Liu; Chunqing Wang; Lining Sun; Yanhong Tian
Year: 2010
Vibration durability modeling and dynamic response analysis of PBGA mixed solder joints
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Zhou Bin; Qiu Baojun; En Yunfei
Year: 2010
Heat transfer analysis of vapor chamber heat pipe for high power LED package
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Zhi You; Yang, D.; Peng Zhou; Yang Hai; Dongjing Liu; Fengze Hou
Year: 2010
Electrochemical behavior of a new Sn3.5Ag0.5Cu composite solder
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Tsao, L.C.; Lo, T.T.; Peng, S.F.; Chang, S.Y.
Year: 2010
Study on board level solder joints reliability analysis of the copper stud bump flip-chip
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Mu Wei; Zhou Dejian; Wu Zhaohua
Year: 2010
Determining parameter of solder joint defect characterization based on correlation analysis
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Huang ChunYue; Wang Wangang; Liang Ying; Li Tianming
Year: 2010
Failure behavior and life prediction of through-hole solder joints under thermal cycling
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Hui Xiao; Xiaoyan Li; Na Liu; Yongchang Yan
Year: 2010
Interface toughness characterization in microelectronic packages based on four point bending test and simulation
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Ma Ya-hui; Ma Xiao-song; Zhou Peng; Hai Yang; You Zhi; Liu Dong-Jing
Year: 2010
The effect of interface reaction with different finishes and SnAgCu on the reliability of solder joints
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Zhou Peng; Jiang Ting-biao; Yang Dao-guo; You Zhi; Ma Ya-hui; Ren Rong-bin
Year: 2010
The effects of response features on failure modes of board level drop impact test
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Liu, Y.; Sun, F.L.; Kessels, F.J.H.D.; van Driel, W.D.; Zhang, G.Q.
Year: 2010
Study on intelligent detecting technology for solder joint quality of SMT based on fuzzy diagnosis technique
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Chen Xiaoyong; Zhou Dejian; Wu Zhaohua; Li Chunquan
Year: 2010
Application of FEM simulation technology on thermal design of electronic packaging device
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Song Fang fang; Lai Ping; Feng Xian-long; He Xiao-qi
Year: 2010
Effect of Ni barrier on the tin whisker formation of electroplating Sn on lead-frame alloy
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Yiqing Wang; Dongyan Ding; Ting Liu; Galuschki, K.-P.; Yu Hu; Gong, A.; Ming Shen; Hongqi Sun; Xianfeng Wang; Jiangyan Sun; Ming Li; Dali Mao
Year: 2010
Reliability of indium solder die bonding of high power cm-bars
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Lu Guoguang; Huang Yun; En Yunfei
Year: 2010
Genetic-algorithm- annealing-algorithm-based scheme for MCM interconnect test
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Chen Lei
Year: 2010
Collaborative simulation analysis and research of coupled electromagnetic-thermal field of cable bundles
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Wang Quanyong; Wu Zhaohua
Year: 2010
Analysis of application status about microwave devices
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Ping Li; Xiao-Ying Cui; Ping Lai
Year: 2010
Nanoindentation characteristics of Cu6Sn5 formed in lead free solder joints
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Zhihao Zhang; Jongmyung Kim; Mingyu Li
Year: 2010
Focused ion beam technology and application in failure analysis
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Yuan Chen; Xiaowen Zhang
Year: 2010
Effect of Cu substrate and solder alloy on the formation of kirkendall voids in the solder joints during thermal aging
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Jian Zou; Liping Mo; Fengshun Wu; Bo Wang; Hui Liu; Jun Zhang; Yiping Wu
Year: 2010
Model of n-type polycrystalline silicon thin film transistors under DC bias stress
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Hongyu He; Xueren Zheng
Year: 2010
Experimental research on Sn99.0/Ag0.3/Cu0.7 lead-free soldering paste and its board-level packaging joint reliability
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Lei Yongping; Lin Jian; Fu Hanguang; Wu Zhongwei; Wang Yong; Li Ke; Liao Gaobing
Year: 2010
Optimal design and fatigue life prediction for QFN solder joints by BP Artificial Neural Networks and Genetic Algorithm
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Wu Zhaohua
Year: 2010
Preparation of packaging cap with binary glass microlenses for wafer level packaging of Focal Plane Arrays (FPAs)
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Chao Xu; Jintang Shang; Di Zhang; Boyin Chen; Junwen Liu
Year: 2010
Evaluation of GaN-based blue light emitting diodes based on temperature/humidity accelerated tests
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Shengjun Zhou; Qin Zhang; Bin Cao; Sheng Liu
Year: 2010
Dielectric properties of Ag@SiO2/epoxy composite for embedded capacitor applications
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Xianwen Liang; Shuhui Yu; Suibin Luo; Zhiqiang Zhuang; Sun Rong
Year: 2010
A novel wafer level hermetic packaging for MEMS devices using micro glass cavities fabricated by a hot forming process
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Di Zhang; Jintang Shang; Boyin Chen; Chao Xu; Junwen Liu; Hui Yu; Xinhu Luo; Jingdong Liu
Year: 2010
Optimizing the process window of Bond Line Thickness for Printable Die Attach Adhesive in DDR DRAM packaging
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Chien-Hui Lu; Wei-Fu Chang
Year: 2010
A novel approach to fabricate glass micro-objects for MEMS application
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Boyin Chen; Jintang Shang; Di Zhang; Chao Xu; Junwen Liu; Xinhu Luo; Hui Yu; Jingdong Liu
Year: 2010
CAD/CAM software framework design for the laser micromachining device driven by two stages
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Fanhui Meng; Hongzhi Wang
Year: 2010
The design and fabrication of LTCC chip inductors for high frequency applications based on barium ferrites
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Yuanxun Li; Yingli Liu; Shengjun Yuan; Huaiwu Zhang; Hai Nie; Jianhong Kang
Year: 2010
Optimization design of a 64-Lead Low-Profile Quad Flat Package for RFIC applications
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Haiyan Sun; Jianhui Wu; Ling Sun; Weiping Jing
Year: 2010
Dynamic current characteristic of ultrasonic transducer for wire bonding
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Changhui Zou; Fuliang Wang; Jiaping Qiao
Year: 2010
Stress analysis of Cu pad/solder interfaces
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Wang Zhuoru; Qin Fei; Xia Guofeng
Year: 2010
Mechanical properties of intermetallic compounds in solder joints
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Weixu Zhong; Fei Qin; Tong An; Tao Wang
Year: 2010
Wafer level package for the X-band microwave power sensor
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:De-bo Wang; Xiao-ping Liao
Year: 2010
Modeling and analyzing power integrity using GTLE and FDFD
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Yunyan Zhou; Lixi Wan; Liqiang Cao
Year: 2010
Effects of crosstalk and simultaneous switching noise on high performance digital system packages
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Kumar, S.S.; Chandramohan, G.; van Driel, W.; Zhang, G.Q.
Year: 2010
Thermal stress analysis of PBGA using a fluid-solid coupling method under steady convective heat transfer
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Zhimin Wan; Xiaobing Luo; Sheng Liu
Year: 2010
A capacitive pressure sensor using hybrid silicon-glass structure for hermetic wafer level packaging
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Meng Nie; Qing-An Huang; Ming Qin; Wei-Hua Li
Year: 2010
Design of a capacitive pressure sensor based on flip-chip packaging technology
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Meng Nie; Qing-An Huang; Ming Qin; Wei-Hua Li
Year: 2010
Electrical design of high density low cost package for a switch ASIC
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Jun Li; Liqiang Cao; Shuhua Liu; Jing Zhou; Qidong Wang; Guidotti, D.; Lixi Wan; Cheng Liao
Year: 2010
Dynamics analysis of bistable inductive micro-switch
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Wenchao Tian; Xuemei Li
Year: 2010
Ductile-to-brittle transition of flip-chip solder joints influenced by electromigration
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Yu-Dong Lu; Yun-Fei En; Xiao-Qi He; Gang Niu; Pecht, M.; Xin Wang
Year: 2010
Study of signal integrity for PCB level
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Jiang Jing; Kong Lingwen
Year: 2010
Study on process of embedded passives based on FR4 substrate series
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Weiyang Qiu; Kailin Pan; Dongmei li; Jing Liu
Year: 2010
Coreless substrate for high performance flip chip packaging
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Wang, J.; Ding, Y.C.; Lia Liao; Yang, P.; Yi-shao Lai; Tseng, A.
Year: 2010
Novel solder-on-pad (SoP) technology for fine-pitch flip chip bonding
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Kwang-Seong Choi; Sun-Woo Choo; Jong-Jin Lee; Ki-Jun Sung; Hyun-Chel Bae; Byeong-Ok Lim; Jong-Tae Moon; Yong-Sung Eom
Year: 2010
Modeling and characterization of the bonding-wire interconnection for microwave MCM
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Liang Ying; Huang ChunYue; Wang Wangang
Year: 2010
A study to performance of electroplating solder bump in assembly
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Mu-Chun Wang; Kuo-Shu Huang; Zhen-Ying Hsieh; Hsin-Chia Yang; Chuan-Hsi Liu; Chii-Ruey Lin
Year: 2010
Test and assessment of the heating system of reflow ovens
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Wang Yuming; Cui Zengwei; Wang Beibei
Year: 2010
Development of Sn-Zn-Cu lead free solder
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Yang Min; Liu Xiuzhong; Liu Xinghong; Dai Jiahui
Year: 2010
Microstructure and property of Sn-Zn-Cu-Bi lead free solder
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Liu Xiuzhong; Yang Min; Liu Xinghong; Dai Jiahui
Year: 2010
Thermal aging of molding compounds
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Jansen, K.M.B.; de Vreugd, J.; Ernst, L.J.; Bohm, C.
Year: 2010
Electrical simulation research for IC package gold bonding wire
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Cao Yusheng; Du Shuan; Yao Quanbin; Zhao Yuanfu
Year: 2010
Design of band-pass filter on different materials in LTCC/LTCF technology
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Bing Bai; Yintang Yang; Yuejin Li
Year: 2010
Design of electronic circuits of nanosecond impulser based on avalanche transistor
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Qingping Wu; Wenchao Tian
Year: 2010
Board level WLCSP 3D thermal stress analysis by submodeling of FEA
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:RongHua Hong; Jun Wang
Year: 2010
Electrical performance analysis of compliant wafer level package (CWLP) with embedded air-gaps
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Jing Liu; Kai-lin Pan; Jiao-pin Wang; Jing Huang
Year: 2010
Study on heat dissipation in Package-on-Package (POP)
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Xiang Qiu; Jun Wang
Year: 2010
Multi-scale modeling of moisture transfer in electronic packaging
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Fan, H.B.; Yuen, M.M.F.
Year: 2010
Reliability of package on package (PoP) subjected to thermal and power loadings
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Jun Cheng; Yudong Lu; Guoyuan Li
Year: 2010
The research and application of the method of life consumption monitoring based on physics of failure
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Fan Li; Pecht, M.; Lau, D.; Gang Niu
Year: 2010
Optimization of the Microwave Induced Plasma system for failure analysis in integrated circuit packaging
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Tang, J.; Schelen, J.B.J.; Beenakker, C.I.M.
Year: 2010
Pad finish related board-level solder joint reliability research
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Chen Zhengrong; Zhou Jianwei; Fu Xingming; Lee Jaisung
Year: 2010
System level drop reliability method research for netbook memory module
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Minyi Lou; Jianwei Zhou; Long Wen; Weiwei Feng; Jaisung Lee
Year: 2010
The reliability evaluation of Cu wire Bonding by using focus ion beam system
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Zhang XiaoWen; Lin XiaoLing; Chen Yuan
Year: 2010
The methodology of life prediction and validation of electronic products based on accelerated degradation testing
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Mengmeng Liu; Zhanyong Ren; Yun Fu; Dandan Liu; Zhaoyang Zeng
Year: 2010
Effects of combining hygro-thermal stress on reliability of plastic QFN package
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Hailong Liu; Shaohua Yang; Guoyuan Li
Year: 2010
The relationship of life prediction between cyclic bending and thermal cycle testing on CSP package
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Chang, G.C.-C.; Chi-Ko Yu; Shao, T.; Chen, C.; Lee, J.
Year: 2010
Investigation of recrystallization in BGA package to evaluate the low Ag solder with different dopants after board level test
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Chi-Ko Yu; Chang, G.; Shao, T.; Chen, C.; Lee, J.
Year: 2010
Elasto-plastic analysis of popcorn failure caused by cavitition unstable growth in plastic IC packaging material
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Li Zhigang; Yuan Guozheng; Shu Xuefeng
Year: 2010
Mechanical characterization of the IMC layer by using Nano-indentation tests
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Yuan Guozheng; Li Zhigang; Shu Xuefeng
Year: 2010
Moisture diffusivity analysis of polycarbonate for LED lens
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Zhangming Mao; Xiaobing Luo; Janghui Yang; Sheng Liu
Year: 2010
Methodology of testability design of electronic components based on the boundary-scan method?
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Zhanyong Ren; Dandan Liu; Zhaoyang Zeng
Year: 2010
The study of flip-chip Cu stud bump's reliability based on PCA-BP neural networks
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Zhang Shan-shan; Zhang Chang-ying; Zhang Jing; Mu Wei
Year: 2010
η-η transformation of interfacial Cu6Sn5 in solder joints
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Zhongbing Luo; Jie Zhao; Qinqin Fu; Lai Wang
Year: 2010
Reliability study on high density LED packaging with Chip On Board structures
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Yang Hai; Yang, D.; BoWei Li; Zhi You; YaHui Ma; DoingJing Liu
Year: 2010
Design for reliability - a Reliability Engineering Framework
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Caers, J.F.J.M.; Zhao, X.J.; Mooren, J.; Stulens, L.; Eggink, E.
Year: 2010
Thermal stress analysis and optimization for a power controller SiP module
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Li Zhibo; Chu Huabin; Chen Supeng; Li Guoyuan
Year: 2010
The influence of standoff height and pad size on the Shear fracture behavior of BGA structured Cu/Sn3.0Ag0.5Cu/Cu interconnects
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Li Xun-Ping; Xia Jian-Min; Zhou Min-Bo; Ma Xiao; Zhang Xin-Ping
Year: 2010
Finite element analysis of electromigration reliability in copper chip interconnect
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Yanhong Tian; Bo Long; Chunqing Wang
Year: 2010
Experimental study on the effect of reflow soldering temperature profile on the solder joint shape
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Bo Wang; Xuexia Yang; Yu Zhang; Xuefeng Shu
Year: 2010
Electromigration of 300 µm diameter Sn-3.0Ag-0.5Cu lead-free bumps in flip chip package
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Song Ye; Mingliang Huang; Leida Chen; Xiaoying Liu
Year: 2010
Research on reliability of board level package-on-package in drop test
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Yao Xiaohu; Fan Zerui; Yuan Miaomiao; Zhang Xiaoqing; Li Zhiqiang; Han Qiang
Year: 2010
Lifetime prediction and impact factors analysis of ball grid array solder joint based on FEA
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Chen Ying; Hou Zebing; Kang Rui
Year: 2010
Analysis on the abilities of solder joints to resist thermal fatigue and service life prediction
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Xuexia Yang; Bo Wang; Yu Zhang; Xuefeng Shu
Year: 2010
Effects of Zn, Ge doping on electrochemical migration, oxidation characteristics and corrosion behavior of lead-free Sn-3.0Ag-0.5Cu solder for electronic packaging
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Hua, L.; Hou, H.N.; Zhang, H.Q.; Wu, T.; Deng, Y.H.
Year: 2010
Failure analysis and test for high speed packaging, HDMI packaging and QSFP packaging
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Authors:Haifei Xiang; Jian Song; Fengman liu; Wei Gao; Baoxia Li; Lixi Wan
Year: 2010


Advertisement