IEEE - Institute of Electrical and Electronics Engineers, Inc. - Polyimide materials evaluation
1975 EIC 12th Electrical/Electronics Insulation Conference
|Publisher:||IEEE - Institute of Electrical and Electronics Engineers, Inc.|
|Publication Date:||1 November 1975|
|Conference Location:||Boston MA, USA, USA|
|Conference Date:||11 November 1975|
|Page(s):||7 - 10|
Addition cure polyimide materials made from Kerimid 601 resin are easily fabricated into multilayer boards using processes and equipment normally intended for epoxy boards.