IEEE - Institute of Electrical and Electronics Engineers, Inc. - Polyimide materials evaluation

1975 EIC 12th Electrical/Electronics Insulation Conference

Author(s): Paul Bednar
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 November 1975
Conference Location: Boston MA, USA, USA
Conference Date: 11 November 1975
Page(s): 7 - 10
ISBN (Paper): 978-1-5090-3111-5
DOI: 10.1109/EIC.1975.7458478
Regular:

Addition cure polyimide materials made from Kerimid 601 resin are easily fabricated into multilayer boards using processes and equipment normally intended for epoxy boards.

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