IEEE - Institute of Electrical and Electronics Engineers, Inc. - A Bonding-Wire Failure Mode in Plastic Encapsulated Integrated Circuits

Author(s): Adams, Clark N.
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 April 1973
Conference Location: Las Vegas, NV, USA, USA
Conference Date: 3 April 1973
Page(s): 41 - 44
ISSN (Paper): 0735-0791
DOI: 10.1109/IRPS.1973.362565
Regular:

Dual-in-line plastic packages (DIPs) from several different suppliers have been found to have open or intermittent open leads after routine thermal cycling tests. The failure mode has been... View More

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