IEEE - Institute of Electrical and Electronics Engineers, Inc. - Studies of bondable magnet wire

1971 10th Electrical Insulation Conference (EIC)

Author(s): R. J. Flaherty
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 September 1971
Conference Location: Chicago, IL, USA
Conference Date: 20 September 1971
Page(s): 337 - 341
ISBN (Paper): 978-1-5090-3116-0
DOI: 10.1109/EIC.1971.7460854
Regular:

The thermosetting adhesive appears to reduce the thermal life by about 10 to 15°C, However, the thermal life on the basis of 40,000 hours, which the Navy uses for thermal rating varnished samples... View More

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